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LM7321/LM7322 Rail-to-Rail Input/Output, ±15V, High Output Current and Unlimited Capacitive
May 28, 2008
20205749
20205736
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LM7321/LM7322
Symbol Parameter Condition Min Typ Max Units
(Note 7) (Note 6) (Note 7)
IOUT Output Current Sourcing 30 48
VID = 200 mV, VOUT = 0V (Note 3) 20
mA
Sinking 40 65
VID = −200 mV, VOUT = 2.7V (Note 3) 30
IS Supply Current LM7321 0.95 1.3
1.9
mA
LM7322 2.0 2.5
3.8
SR Slew Rate (Note 10) AV = +1, VI = 2V Step 8.5 V/µs
fu Unity Gain Frequency RL = 2 kΩ, CL = 20 pF 7.5 MHz
GBW Gain Bandwidth f = 50 kHz 16 MHz
en Input Referred Voltage Noise Density f = 2 kHz 11.9 nV/
in Input Referred Current Noise Density f = 2 kHz 0.5 pA/
THD+N Total Harmonic Distortion + Noise V+ = 1.9V, V− = −0.8V −77 dB
f = 1 kHz, RL = 100 kΩ, AV = +2
VOUT = 210 mVPP
CT Rej. Crosstalk Rejection f = 100 kHz, Driver RL = 10 kΩ 60 dB
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LM7321/LM7322 Symbol Parameter Condition Min Typ Max Units
(Note 7) (Note 6) (Note 7)
VOUT Output Voltage Swing RL = 10 kΩ to 0V 100 250
High VID = 100 mV 280
RL = 2 kΩ to 0V 160 350
VID = 100 mV 450 mV from
Output Voltage Swing RL = 10 kΩ to 0V 35 200 either rail
Low VID = −100 mV 250
RL = 2 kΩ to 0V 80 200
VID = −100 mV 250
IOUT Output Current Sourcing 35 70
VID = 200 mV, VOUT = −5V (Note 3) 20
mA
Sinking 50 85
VID = −200 mV, VOUT = 5V (Note 3) 30
IS Supply Current VCM = −4.5V LM7321 1.0 1.3
2
mA
LM7322 2.3 2.8
3.8
SR Slew Rate (Note 10) AV = +1, VI = 8V Step 12.3 V/µs
fu Unity Gain Frequency RL = 2 kΩ, CL = 20 pF 9 MHz
GBW Gain Bandwidth f = 50 kHz 16 MHz
en Input Referred Voltage Noise Density f = 2 kHz 14.3 nV/
in Input Referred Current Noise Density f = 2 kHz 1.35 pA/
THD+N Total Harmonic Distortion + Noise f = 1 kHz, RL = 100 kΩ, AV = +2 −79 dB
VOUT = 8 VPP
CT Rej. Crosstalk Rejection f = 100 kHz, Driver RL = 10 kΩ 60 dB
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LM7321/LM7322
Min Typ Max
Symbol Parameter Condition Units
(Note 7) (Note 6) (Note 7)
AVOL Open Loop Voltage Gain −13V ≤ VO ≤ 13V 75 85
RL = 10 kΩ to 0V 70
dB
−13V ≤ VO ≤ 13V 70 78
RL = 2 kΩ to 0V 65
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ 6V at room temperature
and below. For VS > 6V, allowable short circuit duration is 1.5 ms.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX)) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
Note 5: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ >
TA.
Note 6: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 7: All limits are guaranteed by testing or statistical analysis.
Note 8: Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
Note 9: Positive current corresponds to current flowing into the device.
Note 10: Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower.
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LM7321/LM7322
Connection Diagrams
20205705
20205703 20205706
Top View Top View Top View
Ordering Information
Package Part Number Package Media Transport NSC Drawing
Marking
LM7321MF 1k Units Tape and Reel
5-Pin SOT-23 LM7321MFE AU4A 250 Units Tape and Reel MF05A
LM7321MFX 3k Units Tape and Reel
LM7322MM 1k Units Tape and Reel
8-Pin MSOP LM7322MME AZ4A 250 Units Tape and Reel MUA08A
LM7322MMX 3.5k Units Tape and Reel
LM7321MA 95 Units/Rail
LM7321MA
LM7321MAX 2.5k Units Tape and Reel
8-Pin SOIC M08A
LM7322MA LM7322MA 95 Units/Rail
LM7322MAX 2.5k Units Tape and Reel
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LM7321/LM7322
Typical Performance Characteristics Unless otherwise specified: TA = 25°C.
Output Swing vs. Sourcing Current Output Swing vs. Sinking Current
20205734 20205731
Output Swing vs. Sourcing Current Output Swing vs. Sinking Current
20205735 20205732
Output Swing vs. Sourcing Current Output Swing vs. Sinking Current
20205736 20205733
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LM7321/LM7322
VOS Distribution VOS vs. VCM (Unit 1)
20205730 20205707
20205708
20205709
20205710 20205711
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LM7321/LM7322
VOS vs. VCM (Unit 2) VOS vs. VCM (Unit 1)
20205713
20205712
20205714 20205715
20205750 20205751
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LM7321/LM7322
VOS vs. VS (Unit 3) VOS vs. VS (Unit 1)
20205752 20205753
20205754 20205755
20205723 20205724
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LM7321/LM7322
IBIAS vs. VCM IBIAS vs. VS
20205725 20205722
20205721 20205718
20205775 20205719
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LM7321/LM7322
IS vs. VCM (LM7322) IS vs. VCM (LM7321)
20205776 20205720
20205777 20205717
20205779 20205716
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LM7321/LM7322
IS vs. VS (LM7322) Positive Output Swing vs. Supply Voltage
20205778 20205727
Positive Output Swing vs. Supply Voltage Negative Output Swing vs. Supply Voltage
20205726 20205728
Negative Output Swing vs. Supply Voltage Open Loop Frequency Response with Various Capacitive
Load
20205729
20205782
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LM7321/LM7322
Open Loop Frequency Response with Various Resistive Open Loop Frequency Response with Various Supply
Load Voltage
20205783 20205784
20205739
20205738
20205740 20205741
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LM7321/LM7322
Small Signal Step Response Large Signal Step Response
20205737 20205749
Input Referred Noise Density vs. Frequency Input Referred Noise Density vs. Frequency
20205742 20205743
20205744 20205745
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LM7321/LM7322
THD+N vs. Output Amplitude THD+N vs. Output Amplitude
20205746 20205747
20205768
20205748
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LM7321/LM7322
Application Information
DRIVING CAPACITIVE LOADS
The LM7321/LM7322 are specifically designed to drive un-
limited capacitive loads without oscillations as shown in
Figure 1.
20205771
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LM7321/LM7322
20205774
20205773
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LM7321/LM7322
20205759
FIGURE 8. Output Sinking Characteristics with Load OUTPUT SHORT CIRCUIT CURRENT AND DISSIPATION
Lines
ISSUES
The LM7321/LM7322 output stage is designed for maximum
SETTLING TIME WITH LARGE CAPACITIVE LOADS
output current capability. Even though momentary output
Figure 9 below, shows a typical application where the shorts to ground and either supply can be tolerated at all op-
LM7321/LM7322 is used as a buffer amplifier for the VCOM erating voltages, longer lasting short conditions can cause the
signal employed in a TFT LCD flat panel: junction temperature to rise beyond the absolute maximum
rating of the device, especially at higher supply voltage con-
ditions. Below supply voltage of 6V, the output short circuit
condition can be tolerated indefinitely.
With the op amp tied to a load, the device power dissipation
consists of the quiescent power due to the supply current flow
into the device, in addition to power dissipation due to the load
current. The load portion of the power itself could include an
average value (due to a DC load current) and an AC compo-
nent. DC load current would flow if there is an output voltage
offset, or the output AC average current is non-zero, or if the
op amp operates in a single supply application where the out-
20205758
put is maintained somewhere in the range of linear operation.
FIGURE 9. VCOM Driver Application Schematic Therefore:
PTOTAL = PQ + PDC + PAC
Figure 10 shows the time domain response of the amplifier PQ = IS · VS Op Amp Quiescent Power
when used as a VCOM buffer/driver with VREF at ground. In this
Dissipation
application, the op amp loop will try and maintain its output
voltage based on the voltage on its non-inverting input PDC = IO · (Vr - Vo) DC Load Power
(VREF) despite the current injected into the TFT simulated PAC = See Table 1 below AC Load Power
load. As long as this load current is within the range tolerable
by the LM7321/LM7322 (45 mA sourcing and 65 mA sinking where:
for ±5V supplies), the output will settle to its final value within IS: Supply Current
less than 2 μs. VS: Total Supply Voltage (V+ − V−)
VO: Average Output Voltage
Vr: V+ for sourcing and V− for sinking current
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LM7321/LM7322 Table 1 below shows the maximum AC component of the load
power dissipated by the op amp for standard Sinusoidal, Tri-
angular, and Square Waveforms:
The maximum power dissipation allowed at a certain temper- FIGURE 11. Power Capability vs. Temperature
ature is a function of maximum die junction temperature (TJ
(MAX)) allowed, ambient temperature TA, and package thermal When high power is required and ambient temperature can't
resistance from junction to ambient, θJA.
be reduced, providing air flow is an effective approach to re-
duce thermal resistance therefore to improve power capabil-
ity.
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LM7321/LM7322
Physical Dimensions inches (millimeters) unless otherwise noted
5-Pin SOT-23
NS Package Number MF05A
8-Pin MSOP
NS Package Number MUA08A
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LM7321/LM7322
8-Pin SOIC
NS Package Number M08A
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LM7321/LM7322
Notes
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LM7321/LM7322 Rail-to-Rail Input/Output, ±15V, High Output Current and Unlimited Capacitive
Load Operational Amplifier
Notes
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