02

Epotec® Epoxy Systems

Electrical and Electronic
Epoxy Division
Aditya Birla Chemicals (Thailand) Limited

®
Electrical and Electronic Electrical and Electronic ®

Epotec Epoxy Systems

®
Epotec® Epoxy Systems

www.epotec.info
www.adityabirlachemicals.com

Bangkok Office
888/160-161, 16th Floor, Mahatun Plaza Building,
Ploenchit Road, Bangkok 10330, Thailand.
Tel. (66 2) 253 5031-3
Fax. (66 2) 253 5030
Email. info@epotec.info

Rayong Plant
Map Tha Phut Industrial Estate, No. 2, I-5 Road,
A. Muang, Rayong 21150, Thailand.
Tel. (66 38) 685 233-4
Fax. (66 38) 683 982

The Company endeavors to ensure all information is correct at the time of printing.
Information in this document ‘Epotec® Epoxy Systems - Electrical and Electronic’ is subject
to change without notice.

© Copyright 2010. Aditya Birla Chemicals (Thailand) Limited. Epotec® is a registered

trademark of Aditya Birla Chemicals (Thailand) Limited. All trademarks, trade names, service
marks and logos referenced herein belong to their respective companies. All rights reserved.

02-0410
 Transcending the conventional barriers of business
to send out a message that “We Care”

The Aditya Birla Group

A US $29.2 billion corporation, the Aditya Birla Among the world’s top 15 BPO companies and
Group is in the League of Fortune 500. It is among India’s top 4.
anchored by an extraordinary force of 130,000 Among the best energy efficient fertilizer plants.
employees, belonging to 30 different nationalities.
In India, the Group has been adjudged “The Best In India
Employer in India and among the top 20 in Asia” by A premier branded garments player.
the Hewitt-Economic Times and Wall Street Journal
The 2nd largest player in viscose filament yarn.
Study 2007. Over 60 per cent of its revenues flow
The 2nd largest in the Chlor-alkali sector.
from its overseas operations.
Among the top 5 mobile telephony companies.
The Group operates in 25 countries - India, UK, A leading player in Life Insurance and Asset
Germany, Hungary, Brazil, Italy, France, Management.
Luxembourg, Switzerland, Australia, USA, Canada, Among the top 3 super-market chains in the Retail
Egypt, China, Thailand, Laos, Indonesia, business.
Philippines, Dubai, Singapore, Myanmar,
Bangladesh, Vietnam, Malaysia and Korea.
Beyond Business
A Global Perspective The Aditya Birla Group is working in 3,700 villages,
reaching out to 7 million people annually through
A metals powerhouse, among the world’s most
the Aditya Birla Centre for Community Initiatives and
cost-efficient aluminium and copper producers.
Rural Development, spearheaded by Mrs.
Hindalco-Novelis is the largest aluminium rolling
Rajashree Birla. The Group’s functions span 42
company. It is one of the 3 biggest producers of
schools and 18 hospitals, furthering its focus on
primary aluminium in Asia, with the largest single
health care, education, sustainable livelihood,
location copper smelter.
infrastructure and social causes.
No. 1 in viscose staple fibre.
The 4th largest producer of insulators. For more information visit www.adityabirla.com
The 4th largest producer of carbon black.
The 11th largest cement producer globally, the 7th
largest in Asia and the 2nd largest in India.

2 Epotec® Epoxy Systems | Electrical and Electronic

Our Company acts as a solution provider, formulating specialized
Epoxy systems for your specific performance needs.

Aditya Birla Chemicals, Epoxy Division

Thai Epoxy and Allied Products Company Limited
(Thai Epoxy), has recently been transformed to the
Epoxy Division of Aditya Birla Chemicals (Thailand)
Limited. It is part of the Aditya Birla Group of
Companies. Being the pioneer manufacturer of
epoxy resins in the ASEAN region, the Company
constitutes its success on its Specialized Epoxy
Systems and its complete in-house Research and
Application Development Center. Sustainability has
also been achieved through its group-wide unique
World Class Manufacturing (WCM) strategy for
enterprise excellence.
Located within the prestigious Map Tha Phut
Industrial Estate at Rayong Province in Thailand, the
Company started commercial production in 1992
with technology from Tohto Kasei Company Limited,
Japan’s largest producer of epoxy resins. The
Company is currently accredited and certified with
ISO 9001:2000 and ISO 14001 in recognition of its
quality and environment management systems.
The Company offers a wide range of epoxies and
modifiers that vary in chemical structure, molecular
weight, viscosity and functionality. All products are
marketed under the trade name of Epotec®,
including liquid, solid, solutions, blends and other
multifunctional epoxy resins. Epoxy Resin, a
performance polymer, is a versatile resin which
finds application in adhesives, civil engineering,
composites, casting and encapsulation of electrical
components, and coatings including protective,
marine, floor, powder, can and coil.
The Company stretches its business arms in all six
continents of the globe.

Certified ISO 9001:2000 by Certified ISO 14001 by

008 008

Epotec® Epoxy Systems | Electrical and Electronic

3
 ®

Electrical and Electronic

From the beginning of the electrical and electronic

industry, critical circuit components have been
coated, buried or otherwise encased in dielectric
materials to isolate them from adverse
environmental and operational effects such as
oxygen, moisture, temperature, electrical flashers,
current leakage, salt spay, radiation, solvent,
chemicals, micro-organisms, mechanical shock
This booklet highlights the Epotec® range and vibrations. The first materials used for this
of Epoxy Systems for Electrical and purpose were waxes and asphalted polymer.
Electronic Applications. These systems Although these substances are still used to some
find end-use in the following components: extent, synthetic polymers, such as epoxy resins,
are now most widely used in electrical
Electrical Components encapsulation.
Current Transformer
Power Transformer The benefits and importance of epoxy resins have
been recognized after World War II by the electrical
Instrument Transformer
and electronic industries as a self-supporting
Switchgear Component
insulating material. Our Company, since its
Insulators inception, has given prime importance to this
Bushing segment. As a result of intensive development work
in close cooperation with our customers, our
Company has compiled its present broad range of
Electronic Components
resins, curing agents and resin systems available to
Power Semi-conductor
meet the wide variety of requirements stipulated in
Capacitors national and international standards.
Inductive Components
Ignition Coils Our goal is to continue our focus on quality and
Filter Circuits innovation thereby partnering the electrical and
Proximity Switches electronic industry in their technical progress. It is
Modules part of our philosophy not only to safeguard high
Relays and consistent product quality, but also to support
our customers with information and technical
Connectors
service when using our products. This intent is
Sensors
borne out of our activities including, our willingness
Switch Mode Transformers
to supply processing information literature and
other solutions to technical problems. Development
of tailored systems for specific customer
requirements is also part of our philosophy.

Up-to-date Research & Development facility and

the services of an Application Development Center
are available for product development and technical
support to our customers.

4 Epotec® Epoxy Systems | Electrical and Electronic

 ®

Electrical and Electronic

From the beginning of the electrical and electronic

industry, critical circuit components have been
coated, buried or otherwise encased in dielectric
materials to isolate them from adverse
environmental and operational effects such as
oxygen, moisture, temperature, electrical flashers,
current leakage, salt spay, radiation, solvent,
chemicals, micro-organisms, mechanical shock
This booklet highlights the Epotec® range and vibrations. The first materials used for this
of Epoxy Systems for Electrical and purpose were waxes and asphalted polymer.
Electronic Applications. These systems Although these substances are still used to some
find end-use in the following components: extent, synthetic polymers, such as epoxy resins,
are now most widely used in electrical
Electrical Components encapsulation.
Current Transformer
The benefits and importance of epoxy resins have
Power Transformer
been recognized after World War II by the electrical
Instrument Transformer
and electronic industries as a self-supporting
Switchgear Component
insulating material. Our Company, since its
Insulators inception, has given prime importance to this
Bushing segment. As a result of intensive development work
in close cooperation with our customers, our
Company has compiled its present broad range of
Electronic Components
resins, curing agents and resin systems available to
Power Semi-conductor
meet the wide variety of requirements stipulated in
Capacitors national and international standards.
Inductive Components
Ignition Coils Our goal is to continue our focus on quality and
Filter Circuits innovation thereby partnering the electrical and
Proximity Switches electronic industry in their technical progress. It is
Modules part of our philosophy not only to safeguard high
and consistent product quality, but also to support
Relays
our customers with information and technical
Connectors
service when using our products. This intent is
Sensors
borne out of our activities including, our willingness
Switch Mode Transformers
to supply processing information literature and
other solutions to technical problems. Development
of tailored systems for specific customer
requirements is also part of our philosophy.
Formulation
Epotec® Epoxy Systems offer ready to use
formulated products, however, users may select
appropriate filler, diluents, plasticizers, modifiers,
and pigments according to their choice.
Fillers are an important part of the formulation and
mixed about 2 to 3 times of epoxy resin. Due to
high loading, fillers become an important
component for electrical and electronic
manufacturers.
Several common fillers are used to achieve the
desired end properties. Single or combinations of
fillers can be used with or without treatment. Fillers
treated by silanes provide excellent wetting, low mix
viscosity, strong bonding with matrix, and prevent
sedimentation during long storage.
Selection of Fillers
Silica quartz
Alumina trihydrate (ATH)
Alumina
Mica
Calcium carbonate
Hollow glass sphere
Carbon black
Metallic powder
Fillers modify the properties of the mix resulting
in the following benefits:
Reduced cost.
Increased abrasion resistance.
Increased rigidity and impact strength.
Reduced shrinkage and water absorption.
Increased heat deflection temperature.
Modified electrical and thermal properties.
Reduced flammability.
Reduced flexural and tensile strength.
Common Properties
High electrical properties.
Fire retardant applications.
Excellent abrasion resistance.
High thermal resistance
Common filler, high surface area and resin absorption.
Light weight and good surface finish.
High thermal stability and semi-conducting properties.
Modification of electrical and thermal properties.

Up-to-date Research & Development facility and

the services of an Application Development Center
are available for product development and technical
support to our customers.

4 Epotec® Epoxy Systems | Electrical and Electronic Epotec® Epoxy Systems | Electrical and Electronic
5

® components are demolded and post curing is
Processes & Applications
Epotec® Epoxy Systems are best known for casting
into molds, cavities, cores and patterns. They are
also extensively used for encapsulation
(encapsulation and embedment are frequently used
inter-changeably), impregnation and protection of
electrical and electronic assemblies and
components. Usually low-pressure-reacted resins
are utilized and curing is performed at room
temperature to elevated temperature, up to 200°C.
Room temperature curing Epotec® Systems are
preferred for low voltage, small components, while
heat-cured Epotec® Systems offer extremely high
physical, thermal and chemical resistance. As such,
heat-cured Epotec® Systems are used for medium
and high voltage applications.
There are few common process techniques for use
of Epotec® Epoxy Resins in electrical and electronic
components.
Pottings
Potting is a variation of casting in which the
prefabricated mold, a thin shell of metal or plastic,
becomes an integral part of the finished product.
The resin is fluid enough to flow around the
components being embedded and fills all voids,
including the container. Potting is used frequently to
reduce weight, avoid breakdown and prevent failure
due to moisture and vibration in components.
6 Epotec® Epoxy Systems | Electrical and Electronic
Castings
In this technique, a mold is prepared to give the proper dimensions to the finished part. The molds are designed
to provide minimum internal stresses as the resin shrinks during curing. The resin, curing agent and fillers are
mixed and poured slowly into the mold, preferably in a vacuum to avoid air entrapment. The entire assembly is
then cured either at room temperature, by its own exothermic heat or in an oven. The part is then released from
the mold. Castings technique is divided into the following subcategories:
Vacuum Casting
In this process, epoxy compound, including resin,
7 curing agent and filler, are poured under gravity into
steel molds under vacuum. Partially cured
4 5 6
performed in oven.
3 3 3
7 1 Autoclave
2 Static Mixer / Buffer Tank
2
3 Dosing Pump
4 Resin Tank
5 Flexibilizer / Accelerator Tank
1
Encapsulation 8 6 Curing Agent Tank
Encapsulation is a method of providing a protective 7 Vacuum Plant
coating on the inside of coils, closed-packed 8 Control Panel
electronic assemblies and wire bundles. For
saturation of components it is essential to select
Epotec® Resins of high flow and high wetting
properties. The components finally are surrounded Automation Pressure Gelation (APG) or Liquid
by a thin film of resin. Components encapsulated in Injection Molding (LIM)
this manner maintain high electrical insulation, In this process, the liquid epoxy compound,
excellent environmental protection against heat, premixed with fillers and additives, is directly
moisture and chemicals, and also protect 6 pumped into a split mold which is v-mounted on a
microelectronic assemblies with their fine inter- clamping machine. Only gelling step is allowed in
connection. 4 5 the mold and final curing of component is
6 performed in separate oven. This method allows to
Impregnation compensate for chemical shrinkage and is used
Encapsulation is more of a coating process which extensively for mass production of insulating
allows minimum penetration of resin into compact components for electrical industries.
3 3
assemblies, whereas impregnation is a process
specifically designed to ensure that the liquid resin 1 APG Clamping Unit
has completely entered into interstices of assembly 2 Static Mixer
2 2
prior to curing. Some transformer and electronic
3 Dosing Unit
equipment manufacture requires both encapsulation
7 1 1 4 Resin Mixing Tank
and impregnation.
5 Curing Agent Mixing Tank
6 Vacuum Plant
7 Control Panel
NOTE: The above diagrams only demonstrate a simple representation
of the associated processes. This is only for a purpose of reference,
and may not be accurate in terms of details and scaling.
Epotec® Epoxy Systems | Electrical and Electronic
7

® components are demolded and post curing is
Processes & Applications
Epotec® Epoxy Systems are best known for casting
into molds, cavities, cores and patterns. They are
also extensively used for encapsulation
(encapsulation and embedment are frequently used
inter-changeably), impregnation and protection of
electrical and electronic assemblies and
components. Usually low-pressure-reacted resins
are utilized and curing is performed at room
temperature to elevated temperature, up to 200°C.
Room temperature curing Epotec® Systems are
preferred for low voltage, small components, while
heat-cured Epotec® Systems offer extremely high
physical, thermal and chemical resistance. As such,
heat-cured Epotec® Systems are used for medium
and high voltage applications.
There are few common process techniques for use
of Epotec® Epoxy Resins in electrical and electronic
components.
Pottings
Potting is a variation of casting in which the
prefabricated mold, a thin shell of metal or plastic,
becomes an integral part of the finished product.
The resin is fluid enough to flow around the
components being embedded and fills all voids,
including the container. Potting is used frequently to
reduce weight, avoid breakdown and prevent failure
due to moisture and vibration in components.
6 Epotec® Epoxy Systems | Electrical and Electronic
Castings
In this technique, a mold is prepared to give the proper dimensions to the finished part. The molds are designed
to provide minimum internal stresses as the resin shrinks during curing. The resin, curing agent and fillers are
mixed and poured slowly into the mold, preferably in a vacuum to avoid air entrapment. The entire assembly is
then cured either at room temperature, by its own exothermic heat or in an oven. The part is then released from
the mold. Castings technique is divided into the following subcategories:
Vacuum Casting
In this process, epoxy compound, including resin,
7 curing agent and filler, are poured under gravity into
steel molds under vacuum. Partially cured
4 5 6
performed in oven.
3 3 3
7 1 Autoclave
2 Static Mixer / Buffer Tank
2
3 Dosing Pump
4 Resin Tank
5 Flexibilizer / Accelerator Tank
1
Encapsulation 8 6 Curing Agent Tank
Encapsulation is a method of providing a protective 7 Vacuum Plant
coating on the inside of coils, closed-packed 8 Control Panel
electronic assemblies and wire bundles. For
saturation of components it is essential to select
Epotec® Resins of high flow and high wetting
properties. The components finally are surrounded Automation Pressure Gelation (APG) or Liquid
by a thin film of resin. Components encapsulated in Injection Molding (LIM)
this manner maintain high electrical insulation, In this process, the liquid epoxy compound,
excellent environmental protection against heat, premixed with fillers and additives, is directly
moisture and chemicals, and also protect 6 pumped into a split mold which is v-mounted on a
microelectronic assemblies with their fine inter- clamping machine. Only gelling step is allowed in
connection. 4 5 the mold and final curing of component is
6 performed in separate oven. This method allows to
Impregnation compensate for chemical shrinkage and is used
Encapsulation is more of a coating process which extensively for mass production of insulating
allows minimum penetration of resin into compact components for electrical industries.
3 3
assemblies, whereas impregnation is a process
specifically designed to ensure that the liquid resin 1 APG Clamping Unit
has completely entered into interstices of assembly 2 Static Mixer
2 2
prior to curing. Some transformer and electronic
3 Dosing Unit
equipment manufacture requires both encapsulation
7 1 1 4 Resin Mixing Tank
and impregnation.
5 Curing Agent Mixing Tank
6 Vacuum Plant
7 Control Panel
NOTE: The above diagrams only demonstrate a simple representation
of the associated processes. This is only for a purpose of reference,
and may not be accurate in terms of details and scaling.
Epotec® Epoxy Systems | Electrical and Electronic
7
 ®

Typical Properties of Epotec® Epoxy Systems for Electrical and Electronic Applications

TABLE 1.0 Electrical and Electronic Applications

EPOTEC® SYSTEMS UNIT

Resin 100 pbw1 YDC 6001 YDC 6002 YDC 6004 YDC 6015 YDC 6003 YDC 6003 YDC 6030 YDC 6006 YDH 184 YDH 184 YDH 184M1 YDC 6020i YDC 6029 YDC 6018
Curing Agent pbw1 TH 7656 / 30 TH 7656 / 30 TH 7657 / 100 TH 7652 P1 / 80 TH 7658 / 80 TH 7662 / 80 TH 7670 / 82 TH 7269 / 9 - 10 TH 7351 / 90 TH 7356 / 90 TH 7356P / 80 TH 7652i / 32 TH 7668 / 30 TH 8251 / 18
Accelerator pbw1 - - TA 7852 / 1 - - - TA 7854 / 0.5 - 2 - TA 7851 / 0.5 - 3 TA 7851 / 0.5 - 2 - TA 7851 / 1.5 - -
Flexibilizer pbw1 - - TP 01 / 10 TP 01 / 0 - 8 - - - - - - - - - -
Filler (silica flour 300 mesh) pbw1 200 200 400 320 - 350 270 270 270 150 300 270 270 Prefilled Prefilled Prefilled
Filler loading (pbw1 filler) % 61 61 65 65 60 60 60 58 61 61 61 - - -
Curing condition Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Ambient Cure Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Ambient Cure
Processing technique CVC CVC CVC CVC, PG, APG CVC, PG, APG CVC, PG, APG CVC, APG CVC CVC, PG, APG CVC, PG, APG CVC, PG, APG CVC CVC CVC
Processing temperature ˚C 120 - 140 120 - 140 Ambient - 80 Ambient - 80 Ambient - 80 Ambient - 80 60 - 80 Ambient 40 - 80 40 - 80 40 - 80 60 - 80 60 - 80 RT
Initial viscosity of mix mPa s/˚C 1,900 / 120 4,000 / 120 1,500 / 80 10,000 / 60 40,000 / 40 70,000 / 40 1,700 / 60 8,500 / 25 1,000 / 80 100 / 80 6,400 / 25 700 - 900 / 25 2,500 - 3,500 / 25 -
500 / 140 2,500 / 140 - 1,500 / 80 1,000 / 80 1,500 / 80 - - - - 3,000 / 40 - - -
- - - - - - - - - - 700 / 60 - - -
- - - - - - - - - - - - - -
Pot life of mix (< 5kg) h/˚C 6 / 120 1 / 120 14 / 40 24 - 48 / 25 15 / 40 15 / 40 24 - 48 / 25 0.5 / 25 1 / 80 4 / 60 4 / 60 24 - 36 / 25 24 - 36 / 25 0.5 / 25
- 0.5 / 140 1.5 / 80 - 2 / 80 2 / 80 - (100g mix) - 1 / 80 1 / 80 - - -
Gel time min/˚C 780 / 110 160 / 120 100 / 80 20 / 120 285 / 80 270 / 80 80 - 90 / 120 - 4 / 140 4 / 140 11 / 120 40 / 80 115 - 150 / 80 -
330 / 130 60 / 140 35 / 100 - 14 / 120 15 / 120 25 - 30 / 140 - 3 / 150 3 / 150 5 / 140 4 / 120 30 - 40 / 100 -
150 / 150 - 15 / 120 - 8 / 140 8 / 140 - - 2 / 160 2 / 160 - - - -
Minimum cure time h/˚C 16 / 140 14 / 140 3 / 120 10 / 140 6 / 80 + 10 / 130 6 / 80 + 10 / 130 6 / 80 + 10 / 130 6 / 80 6 / 80 + 10 / 140 6 / 80 + 10 / 140 6 / 80 + 10 / 140 4 / 80 + 2 / 130 4 / 80 + 2 / 130 24 / RT

Minimum postcure time h/˚C - - - - 6 / 140 6 / 140 - - - - - - - -

NOTE: CVC - Conventional Vacuum Casting, PG - Pressure Gelation, APG - Automatic Pressure Gelation
1 Part by weight (pbw)

PROPERTIES OF CASTING METHOD UNIT

Tensile strength ISO 527 N/mm2 85 - 95 80 - 100 70 - 80 75 - 85 70 - 80 75 - 85 75 - 85 35 - 45 90 - 100 90 - 100 70 - 90 40 - 60 30 - 50 5 - 10

Elongation at break ISO 527 % 1.1 - 1.5 1.0 - 1.5 0.8 - 1.2 1.1 - 1.3 1.0 - 1.5 1-2 1-2 2-4 1.7 - 1.9 1.7 - 1.9 1.3 - 1.5 - - 1.5
Flexural strength ISO 178 N/mm2 135 - 145 130 - 150 115 - 125 135 - 155 110 - 130 110 - 120 110 - 140 90 - 100 150 - 165 150 - 165 150 - 170 70 - 90 70 - 90 15 - 20
Impact strength ISO / R 179 kJ/mm2 15 - 22 15 - 22 10 - 15 - 7 - 10 11 - 13 10 - 15 7 - 10 8-9 8-9 - 8 - 11 8-11 -
Elastic modulus in tension ISO / R 527 N/mm2 10,000 - 11,000 12,000 - 14,000 12,000 - 14,000 - 9,000 - 11,000 9,000 - 11,000 10,000 - 12,000 15,500 - 16,000 10,000 - 11,000 10,000 - 11,000 10,500 - 12,000 - - 1400 - 1800
Deflection temperature (HDT) ISO / R 75 ˚C 110 - 120 110 - 120 80 - 90 100 - 110 105 - 120 95 - 105 80 - 90 65 - 70 95 - 105 95 - 110 72 - 80 75 - 85 85 - 95 55 - 65
Glass transition point DSC ˚C 115 115 90 - 100 100 - 110 110 - 125 100 - 110 85 - 95 55 - 65 100 - 110 100 - 110 75 - 80 75 - 90 90 - 105 60 - 70
Water absorption1 (23˚C / 10 days) ISO / R 62 % w/w 0.15 - 0.25 0.15 - 0.25 0.1 - 0.2 - 0.10 - 0.15 0.1 - 0.2 0.1 - 0.2 0.4 0.1 - 0.2 0.1 - 0.2 0.1 - 0.2 < 0.15 < 0.15 0.2 - 0.4 (24 hrs)
Tan d at 50 Hz (23˚C) IEC 60250 % 1.5 2-3 2-3 2-3 2.5 3 2-3 0.32 - 0.37 2 2 2 2-3 2-3 1-2
Arc resistance ASTM D-495 sec 180 - 190 185 - 190 185 - 195 180 - 190 182 - 186 182 - 186 180 - 190 180 185 - 190 185 - 190 185 - 190 180 - 190 180 - 190 -
Tracking resistance (CTI) IEC 60112 V > 400 > 400 > 600 > 600 > 600 > 600 > 600 400 > 600 > 600 > 600 > 600 > 600 > 600
Electrical strength2 (23˚C / 50 Hz) IEC 60243 - 1 kV/mm 22 - 24 22 - 25 18 - 22 17 - 21 18 - 20 18 - 20 18 - 22 18 - 22 19 - 21 19 - 22 6 - 10 17 - 20 > 20 6-8
1 60 x 10 x 4 mm test specimens, 2 20 seconds value for 2 mm sheet

8 Epotec® Epoxy Systems | Electrical and Electronic Epotec® Epoxy Systems | Electrical and Electronic
10
Important Considerations for Epotec® Resins
The epoxy casting resins, generally, are liquids at processing temperature when combined with the curing
agents. The mixture is cured at room or elevated temperature to the thermoset state. There are a number of
common considerations involved in achieving good, solid, crack-free, bubble-free castings. These include:
Exotherm
Exotherm is the increase in temperature of
compound above the cure temperature due to
energies released as the epoxy group reacts. For
fast resins it is quite possible for the center of a
casting to generate bubbling due to vapor pressure,
and which lead to char and explodes in extreme
conditions.
Reactivity
Reactivity of epoxy resins while curing ideally obeys
Arrhenius’ law which in effect states “For every 10°C
rise in temperature, the reaction rate doubles”.
Hence, if a compound will gel in 30 minutes at room
temperature of 25°C then if warmed to 35°C, it will
gel in approximately 15 minutes; at 45°C, in 7½
minutes. Thus when heat is used as a means of
achieving low viscosity, reactivity becomes an
opposing factor.
Shrinkage
Shrinkage is the reduction in volume or in linear
dimensions observed during cure. Shrinkage
induces stresses which can damage pressure
sensitive inserts or which can lead to crack under
thermal cycling.
Thermal Expansion
Thermal expansion characteristics are the function
of epoxy resin, curing agent, modifiers, and fillers
present in formulation. In general, the more highly
flexibilized the compound, the higher the expansion
rate; the more highly filled the lower the expansion
rate. Ideally the expansion rate of the resin should
be matched to those of the inserts present or should
provide an intermediate value in the case of different
expansion rate of the inserts.
Thermal Shock
Thermal shock is a severe problem with rigid epoxy
resin system. The problem is magnified when higher
temperature operation is required, in so far as many
flexible systems are inherently unsuited for
this service because of relatively poor thermal
stability. To obtain satisfactory thermal shock
resistance for severe thermal cycling, sophistication
in the formulation is required. Initial stresses caused
by shrinkage and cure temperature should be
minimized. Reversible stresses caused by the
expansion characteristics of the compound should
be reduced to the level of practical.
Thermal Stability
Thermal stability indicates the ability of the resin to
serve at elevated temperature and maintain
minimum specified properties. With elevated
temperature aging there is generally a progressive
loss of strength and an overall reduction in
properties. Often there is progressive embrittlement
because of loss of volatile fragments and increased
cross-linking. As temperature is further increased
surface charing will occur, followed by cracking and
decomposition.
Vapor Pressure
The temperature at which the vapor pressure
equals the surrounding or atmospheric pressure,
the boundary between the gas and liquid
disappears and the substance boils. If epoxy
compound becomes too hot, this may lead to
generation of gas bubbles trapped in the cured
structure.
Viscosity
The viscosity of resin controls the quantity of filler
and determines the viscosity of formulated
compound. In order to assist removal of air bubbles
from compound and to obtain a desired, void-free
structure, it is often desirable to have low viscosity
at processing temperature.
Epotec® Epoxy Systems | Electrical and Electronic
11
 Glossary
Arc Resistance
The ability of a material to resist the
action of high voltage electricals are
usually stated in terms of the time
required to render the material
electrically conductive. Failure of the
specimen may be caused by
heating to incandescence, burning,
tracking or carbonization of the
surface.
Coefficient of Thermal Expansion
The fractional change in length (or
sometimes in volume, when
specified) of a material for a unit
change in temperature.
Deflection Temperature under
Load
The temperature at which a simple
beam has deflected a given amount
under load (formerly called heat
distortion temperature). This is the
temperature at which a specimen
deflects 0.010 inches at a load of 66
or 264 psi.
Dielectric Constant (Permittivity)
That property of a dielectric which
determines the electrostatic energy
stored per unit volume for unit
potential.
The ratio of the capacity of
condenser having a diele.ctric
material between the plates to that
of the same condenser when the
dielectric is replaced by vacuum.
Also known as specific inductive
capacity, it is expressed as:
Cp Q
E = =
Co CoV
Dissipation Factor
The ratio of the power loss in a
dielectric material to the total power
transmitted through the dielectric.
Glass Transition Temperature (Tg)
The temperature at which the
amorphous polymer changes from a
glass-like brittle state to rubbery
state.
12 Epotec® Epoxy Systems | Electrical and Electronic
Partial Discharge (PD)
Partial discharge is a phenomenon
which occurs on or inside the test
body when an alternative voltage of
a critical level is set up or
exceeded. It can be explained by
the gaseous gaps (very fine pores,
irregularities). The effect of internal
partial discharges are particularity
damaging and may shorten the
service life of the insulation.
Thermal Conductivity
The measure of the ability of a
material to conduct heat. For a
homogenous material it is the ideal
rate of heat flow, under steady
conditions, through unit area, per
unit temperature gradient in the
direction perpendicular to the area.
Thermal Shock
The stress-producing phenomenon
resulting from a sudden
temperature drop.
Thermal Stability
The resistance to permanent
change in properties caused solely
by heat.
Tracking Resistance
Resistance of solid insulation
materials against combined effect
of electrical stress and electrolytic
contamination. This is also known
as comparative tracking index.
 ®

Disclaimer
This brochure is designed to provide you with information to the Epotec® range of Products referred to, and should be read in
conjunction with the latest Technical Data Sheets (TDS) and Material Safety Data Sheets (MSDS), and may not be construed
as legally binding. Nothing contained herein constitutes an offer for the sale of any product. The Company makes no
warranties, either expressed or implied, with respect to its product or the results of its use, or with respect to any information
provided by the Company.

Because of changes in conditions and circumstances the Company reserves the right, subject to all applicable laws, at any
time, at its discretion, and without notice, to discontinue or change the specifications and the prices of their products, and to
either permanently or temporarily withdraw any such products from the market without incurring any liability to any prospective
purchaser or purchaser. It is the sole responsibility of the user to test our products for suitability in the intended use. Always
consult an authorized Epotec® representative for the latest information with respect to specifications, prices, and availability.

Material Safety, Handling and Storage Conditions

Due to variety of materials used in epoxy systems, please consult Epotec® Technical Data Sheets (TDS) and Material Safety
Data Sheets (MSDS). TDS and MSDS are available for all Epotec® products upon request. Alternatively, visit www.epotec.info
for detailed material safety, handling, and storage conditions.
 02

Epotec® Epoxy Systems

Electrical and Electronic
Epoxy Division
Aditya Birla Chemicals (Thailand) Limited

®
Electrical and Electronic Electrical and Electronic ®

Epotec Epoxy Systems

®
Epotec® Epoxy Systems

www.epotec.info
www.adityabirlachemicals.com

Bangkok Office
888/160-161, 16th Floor, Mahatun Plaza Building,
Ploenchit Road, Bangkok 10330, Thailand.
Tel. (66 2) 253 5031-3
Fax. (66 2) 253 5030
Email. info@epotec.info

Rayong Plant
Map Tha Phut Industrial Estate, No. 2, I-5 Road,
A. Muang, Rayong 21150, Thailand.
Tel. (66 38) 685 233-4
Fax. (66 38) 683 982

The Company endeavors to ensure all information is correct at the time of printing.
Information in this document ‘Epotec® Epoxy Systems - Electrical and Electronic’ is subject
to change without notice.

© Copyright 2010. Aditya Birla Chemicals (Thailand) Limited. Epotec® is a registered

trademark of Aditya Birla Chemicals (Thailand) Limited. All trademarks, trade names, service
marks and logos referenced herein belong to their respective companies. All rights reserved.

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