Title – Global Interposer and Fan-Out WLP Market By Product (TSV, Interposer, Fan-Out WLP), By

Application (Communication, Industrial, The Car, Military, Aerospace, Smart Technology, Consumer
Electronics), By Geographic Scope & Forecast.

Global Interposer and Fan-Out WLP Market Size and Forecast

The rise in usage of wearable and connected devices, which needs the compact structure of FOWLP,
drive the interposer and fan-out WLP market. Furthermore, innovations in data storage devices like flash
drives and hybrid memory cubes are increasing the appetite for interposer and fan-out WLP market
which will develop high-performing compact memory solutions. This will foster market growth of the
global interposer and fan-out WLP market.

Global Interposer and Fan-Out WLP Market Definition

An interposer is an electrical interface whose purpose is to reroute a connection to a special connection.

Fan-out WLP (FOWLP) is a complicated version of the quality wafer-level packages and is developed to
satisfy the demand for higher-level integration and a greater number of external contacts by electrical
devices. It facilitates increased speed, better electrical and thermal performance, an increased number
of interconnections. Moreover, the FOWLP technology is predominantly used for cost-effective
electronics products.

FOWLP gives electrical connections to semiconductor IC chips providing reliable routing of circuit traces
for connection outside the die. The number of connections required exceeds the world on the chip for
area array formation and hence, a mold material is employed to supply a bigger area around the chip for
extra redistribution layer routing in FOWLP. FOWLP consists of one flipped chip encompassed by a mold
material to supply a greater area for routing. A vertical combination of varied devices and packages is
feasible with the assistance of FOWLP. Consumer electronics, predominantly mobiles, require chips that
provide maximum performance and better power efficiency alongside smaller physical size. FOWLP
makes way for thinner and cost-effective packages, and it allows to vertically stack the dies without the
necessity to revamp the chips.

Global Interposer and Fan-Out WLP Market Overview

The growing trend of miniaturization of electronic devices such as mobile phones, tablets, and gaming
devices is said to be a major factor driving the interposer and fan-out WLP market. Furthermore, the
usage of advanced wafer-level packaging technologies in MEMEs and sensors is witnessing an upward
trend. Moreover, the rise in usage of wearable and connected devices, which require the compact
structure of FOWLP, is anticipated to rise soon. Moreover, innovations in data storage devices such as
flash drives and hybrid memory cubes are increasing the appetite for interposer and fan-out WLP to
develop high-performing compact memory solutions. These factors have positively anticipated in
propelling the growth of the global interposer and Fan-Out WLP market.

There are certain constraints and obstacles faced that will hinder the overall market growth. The factors
such as the utilization of FOWLP in electronic products require redesigning of the electrical chips and
also leads to complex testing procedures. This is making the adoption of the technology expensive. This
is estimated to sluggish growth of the global interposer and Fan-Out WLP market during the forecast
period. Nevertheless, the advancements in technologies, expansion of the consumer electronics
industry, the demand for complex architectures in smartphones for better performance at optimum
cost, and untapped potential in emerging markets offer beneficial growth opportunities.

Global Interposer and Fan-Out WLP Market by Product

 TSV
 Interposer
 Fan-Out WLP

Based on Product, the market is bifurcated into TSV, Interposer, Fan-Out WLP. The TSV segment is
estimated to witness the highest CAGR during the forecast period. The factors that can be attributed to
high interconnect density and space efficiencies. Also, the compact structure of TSVs has led to the
increase in its demand for use in various smart technologies, including wearable and connected device
are accelerating the demand for this segment.

Global Interposer and Fan-Out WLP Market by Application

 Communication
 Industrial
 The Car
 Military, Aerospace
 Smart Technology
 Consumer Electronics

Based on Application, the market is bifurcated into Communication, Industrial, The Car, Military,
Aerospace, Smart Technology, Consumer Electronics. The consumer electronics segment holds the
largest market share during the forecast period. The factors that can be attributed to the increasing
demand for smartphones, tablets, and other portable computing devices, which can be developed using
advanced packaging to provide small form factors and improved performance at relatively lower cost
are fueling the demand for this segment.

Global Interposer and Fan-Out WLP Market by Geography

On the basis of regional analysis, the Global Interposer and Fan-Out WLP Market is classified into North
America, Europe, Asia Pacific, and Rest of the world. Asia-Pacific holds the largest market share. The
presence of major semiconductor foundries, proximity to major downstream electronics manufacturing
operations; government-sponsored infrastructure support, and ongoing projects will boost the market
in the APAC region.