VIETNAM HI-TECH INDUSTRY BOOMING PROJECTS
(According to MOU between USAID Link SME-AED-Grace Grand INC)
LONG FLY INTERNATIONAL CO., LTD
(Authorized by Grace Grand INC)
IcT professional training courses
\ eee
| i ty
! | .A.Course outline:
1. Physical chip design engineer (basic 300 hours, advanced 200 hours)
Course Modules Course Description
1. Basic Electronics
Elementary Course | 9’ Basic semiconductor manufacturing process and components
T. General introduction fo the physical design of integrated circuits
2. Fin FET components and physical design
3. Back-end design of analog integrated circuit
4, Digital integrated: cirquit design
5. Introduction to VLSI Design |
6. Layout project planning course
Main course
1. Layout Tool
2. Command File: i
3. Circuit layout design |
4. Cell-Based Layout Design
5. Layout aid programming
Hands-on course 6. Analog/RF basic layout
7. Memory principle and layout implementation
8. Feature production
9. Sign Off afterwards
10. Layout verification
11. UNIX/Linux operating system2. Embedded software engineer (300 hours for basic class, 210 hours
for advanced class, 500 hours for elite class)
Course Modules Course Description
1 Embedded Operating System
2. Embedded software design
3. Introduction to Electroni¢ Circuit Fundamentals
4, Embedded system communication foundation
5. Digital signal processing,
6, Introduction to Big Data Analysis
1. C/C++ programming _,
2. Data structure and algorithm 1
3. Embedded! hardware platform system architecture
4. Embedded real-time operating system
5. Embedded operating system core architecture
6. Computer Organization and Assembly Language
7. Introduction to Embedded System
8.Computer Structure |
9. Deep learning architecture
10. Design Verification
11. Software and hardware collaborative design
12. Embedded system security
1. Introduction to SoC Design
2. DSP programming |
3. Graphical interface programming
Hands-on course 5. Embedded, application software design
6.1/0 device and driver design
7. Software and hardware system integration design
Foundation Course
Main course
8, Embedded Software Engineering3. Al and deep learning application engineer (600 hours)
Course Modules
Course Description
Foundation Course
1. Introduction to Artificial
| Intelligence
2. Introduction to Machine Learning
3. Probability Statistics and Linear Algebra
4, Fundamentals of Partial
Differential Equations
5. Deep leaming mathematical model
6. Data mining1. Graphic recognition
2. Digital signal processing:
3. Digital i image processing
4. Voice recognition |
5. Natural language processing
6. FPGA Verilog digital circuit design
7. Sensor application and cjreuit design
8.GPU design practice and) CUDA development practice
9. Object-oriented programming
10. Deep learning architecture
11. Machine learning i in lot data processing and application
12. Data & system Security)
13. Alacceleration circuit design
14. Data collection and pre-processing
15. Emerging ‘Computing Architecture
| 16. A IoT terminal device design
Main course
1. Sensor Fusion Technology
[Hands-on course
2. Data Fusion Technology |4. Process/Process Integration Engineer (600 hours)
Course Modules
Course Description
Foundation Course
. Introduction to semiconductor and optoelectronic processes and equipment
Semiconductor and optoelectronic materials and component physics
Technical English
Main course
Rw NPIWN PF
au
7.
8.
9.
implementation
Semiconductor physic
monitoring equipment
. Introduction to Design
. WAT electrical analysis, electrical parameter (SPC) control
. Introduction to defect
analysis tools, fault detection classification
|
|
. Process monitoring equipment, data IoT
| properties, chemical properties analysis, factor
Poh y
Rule
. Semiconductor component measurement practice and analysis practice, virtual
measurement full inspection
Semiconductor process integration
Optoelectronic Process
Introduction to Reliabil
ty
10. Statistical Process Control (SPC)11. Semiconductor Industry Security
12. Introduction to Image Processing
13, Excel Macro Analysis, SharePoint, JMP, Tableau
5. Equipment engineer (300 hours)
Course Modules
|
i
| | Course Description
Foundation Course
1. Introduction to semiconductor and optoelectronic processes and equipment
(including industry introduction)
2. Semiconductor vacum system
3.Automatic control | |
4, Electronic circuit and digital logic analysis
5. Semiconductor wl equipment safety system and protection
6. Equipment repair and maintenance practices
7. Communication skills and conflict management
8. Technical English
Main course
1 Introduction to Semiconductor Analysis Equipment
2.Introduction to Measuring Equipment
3. Process monitoring equipment and intelligence
4. Excel macro analysis, share point, JMP, Tableau
5. Compilation and reading of equipment manual6. Factory Engineer (300 hours)
Course Modules
Course Description
Foundation Course
L Introduction to Semicomductor Factory System
2.
3,
Environmental protecti
. Introduction and Introd
Introduction to Mechat
Semiconductor Industr
Failure Mode and Effect
Report writing and pres;
Communication skills a
Technical English
n
juction to Green Factory
‘onics Integration
Security.
Analysis (FMEA)
tation skills
\d conflict management
Main course
4.
5.
6.
ot
8.
9.
L
2.
3.
4.
5.
6.
7.
8.
Equipment maintenance and management
Industrial Power Distribution
Central monitoring equ
Factory safety protectio}
pment project
equipment
Mechanical and automatic control
Electric power compan:
Comprehensive equip
business rules and electric shock emergency law
ent maintenance
Environmental regulations9. Water Treatment Engineering
10. Drainage works |
11. Water treatment chemical technology
12. Cooling water system engineering
13. Piping and planning engineering
14. Chemical pipeline engineering
15. Air conditioning pipeline engineering
16. Vacuum pipeline engineering
17. Chemical Supply Systerh
18. Exhaust gas treatment system
19. Power signal wiring | i
20. Lighting Engineering | i
21. Environmental Toxicology and Management Related Laws
22. Toxic chemical substance reduction and hazardous characteristics assessment
23. Toxicant hazard prevention management and accident response preparation
24. Fire emergency response7. Intelligent manufacturing engineer (300 hours)
Course Modules
Course Description
Foundation Course
1. Virtual Reality ae System (CPPS)
2. Introduction to Artifici
| Intelligence and Process Application
3. Smart Manufacturing ee
4. Process control and sm:
5. Internet of Things Trends
6. Cloud Computing
7. Mass analysis and intel
rt diagnosis
ligent production
Main course
1. Manufacturing schedul
2. Device monitoring inte!
3. Machine vision technol;
ing strategy and management
Hace and application
gy and sensor applicationsB. To factories consultation diagnosis and technical supported services
This plan will form an electronic industry technical upgrade service team that including 3 expert consultants.
Member include the consultants, systematic (facilities and processes) experts and scholars.
Each diagnosis takes few days up to a week. Normally, we go to Vietnam on Sunday evening; from Monday
morning to Friday afternoon, we conduct on-siteconsultation diagnosis, and come back to Taiwan on Friday
evening.
n