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https://doi.org/10.1038/s41560-021-00778-w

Rate capability and Ragone plots for phase change


thermal energy storage
Jason Woods    ✉, Allison Mahvi   , Anurag Goyal   , Eric Kozubal   , Adewale Odukomaiya    and
Roderick Jackson

Phase change materials can improve the efficiency of energy systems by time shifting or reducing peak thermal loads. The value
of a phase change material is defined by its energy and power density—the total available storage capacity and the speed at
which it can be accessed. These are influenced by material properties but cannot be defined with these properties alone. Here
we show the close link between energy and power density by developing thermal rate capability and Ragone plots, a frame-
work widely used to describe the trade-off between energy and power in electrochemical storage systems (that is, batteries).
Our results elucidate how material properties, geometry and operating conditions influence the performance of phase change
thermal storage. This research sets a clear framework for comparing thermal storage materials and devices and can be used by
researchers and designers to increase clean energy use with storage.

T
hermal energy storage can shift electric load for building which is lost when focused solely on material properties. Second,
space conditioning1–4, extend the capacity of solar-thermal these figures of merit cannot be determined experimentally on the
power plants5,6, enable pumped-heat grid electrical storage7–10 device level because they are simply a combination of indepen-
and manage thermal loads from electronic equipment11–13. Phase dently measured material properties. Finally, the previously pro-
change materials (PCMs) are a promising thermal storage medium posed figures of merit cannot distinguish between two materials
because they can absorb and release their latent heat as they tran- where one has a higher power figure of merit and the other a higher
sition phases, usually between solid and liquid. Because phase energy figure of merit. Determining the preferred material requires
change occurs at a nearly constant temperature, useful energy can an understanding of how each material and design parameter influ-
be provided or stored for a longer period at a steady temperature. ences performance. A better method for comparing the behaviour
Researchers have explored many PCMs for thermal storage, such as of thermal storage devices is needed to quantify this interconnected
paraffin waxes and salt hydrates for space cooling14,15 and inorganic relationship between power and energy.
salts, metal alloys and silicon for power generation9,16–18. Here we seek to clarify this relationship by developing thermal
The key attributes of any storage device are its energy and power rate capability and Ragone plots, which together quantify the energy
characteristics19. These attributes are often compared on Ragone and power performance of an energy storage device. Our methods
plots in electrochemical storage research20–24, which plot the specific mimic the characterization approaches used in electrochemical
power (W kg−1) against the accessible specific energy (W h kg−1). energy storage. We show how phase change storage, which acts as a
Researchers have developed figures of merit12,25,26 to try to quantify temperature source, is analogous to electrochemical batteries, which
the trade-off between the energy and power capabilities for ther- act as a voltage source. Our results illustrate how geometry, material
mal storage materials, and these figures of merit have been used to properties and operating conditions all contribute to the energy and
construct approximations of thermal Ragone plots27. In addition to power trade-off of a phase change thermal storage device. This ther-
the work by Yazawa et al., Christen developed what he referred to as mal storage Ragone framework enables a clear comparison method
‘Ragone plots’ for thermal storage, but approached it from a simpli- between different thermal storage materials and designs.
fied thermodynamic perspective that cannot evaluate specific mate-
rials or designs of thermal storage devices28. Rate capability and Ragone plots
The thermal storage figures of merit point towards the need for Our analysis leverages the extensive research on electrochemical
improved material properties for PCMs. For example, PCMs often storage by using analogies between thermal and electrical transport.
suffer from low power density (how quickly energy can be trans- For example, conduction heat transfer is driven by a temperature
ferred to and from the thermal storage device) because of their low potential difference and hindered by a thermal resistance in the
thermal conductivity. Materials research has focused on increasing same way that electric current is driven by a voltage potential dif-
this conductivity12,29–34, which is often accomplished by adding ther- ference and hindered by an electrical resistance. Although this anal-
mally conductive fillers to the PCM or using matrices to contain it. ogy is imperfect35 (Supplementary Note 1), it allows us to examine
Although these composites have higher power densities, they have similarities between solid–liquid phase change and electrochemical
lower storage capacities because the filler or matrix displaces some energy storage (Fig. 1).
of the PCM. We focus our analysis on the PCM heat exchanger in Fig. 1b,
Using these figures of merit to quantify the energy and power which is used for cooling a thermal load (for example, building
capabilities of a thermal storage material leads to three key limita- air conditioning). Here, a solid PCM defines the charged state,
tions. First, the true power and energy density of a device are also which is achieved by removing energy from the device. During dis-
affected by the application, device design and operating conditions, charge, a warm fluid is pumped through the heat exchanger channels

National Renewable Energy Laboratory, Golden, CO, USA. ✉e-mail: Jason.Woods@nrel.gov

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a b High-temperature
fluid inlet
Electric load Thermal load


+ –
+
+ + –
+ +
+ + +
+ + +
+ + +
+ +
+ +
Cathode + +
Liquid PCM
Separator
Tf,in Tf,out
Anode
Solid PCM Low-temperature
fluid outlet

Fig. 1 | Schematics of electrochemical and thermal energy storage devices, showing analogous inputs and outputs. a, Electrochemical battery during
discharge. b, PCM storage device for cooling during discharge. The PCM device consists of a stack of flat channels surrounded by a form-stable PCM
(pictured in black). Heat from the warm fluid melts the PCM as it passes through the device (discharging the cold storage), allowing the fluid to cool the
thermal load. During this process, the initially solid PCM begins to melt and the phase front (interface between the liquid-orange and solid-purple phases,
see inset) moves away from the fluid channel.

rejecting heat to, and melting, the PCM. The cooled fluid then also shows how the cutoff voltage influences the Ragone curves.
absorbs heat from a thermal load before returning to the storage Electrochemical Ragone plots have been used extensively to char-
device at a warmer temperature. This direction of charge/discharge acterize and compare battery chemistries and for battery selection.
is the same as electronics cooling (where the load is the heat gen- PCM storage is analogous to electrochemical storage (Table 1),
erated by the electronics) but the opposite of solar-thermal or where the PCM sets the system capacity through its latent heat of
pumped-heat electricity storage. While our selected use case nar- fusion and specific heat. The capacity in this case is the total amount
rows the analysis to a specific example, the trends and insights of heat that can be stored in (for hot storage) or gained by (for cold
gained are relevant to the other heating and cooling applications storage) a device in watt-hours. The PCM also dictates the ideal
mentioned above, and for different device geometries. More infor- potential, in this case, the transition temperature. The actual sup-
mation about the baseline model geometry and design appears in ply temperature deviates from the transition temperature because
Supplementary Note 2. of thermal resistances in the device, as described in the next sec-
The baseline analysis is for an organic PCM (n-tetradecane) tion. The point where the fluid outlet temperature crosses the cutoff
embedded in a thermally conductive graphite matrix36, and this temperature defines the useful discharge energy. For example, the
is used for the results below unless noted otherwise. Here, we use cutoff for electronics cooling would be the chip’s maximum allow-
the term PCM storage for materials that absorb or release heat able temperature or for building cooling the temperature that is too
on a phase transition, including composites. Thermophysical warm to maintain occupant comfort.
properties of the materials we considered are summarized in Thermal rate capability curves can be generated for different heat
Supplementary Note 6. transfer rates (analogous to electric current), again defined using the
Before describing thermal Ragone plots, let us first consider C-rate. For thermal storage, the C-rate is the applied heat transfer
how to create rate capability and Ragone plots for batteries. A bat- rate divided by the maximum thermal energy capacity. Thermal rate
tery converts stored chemical energy into electrical energy through capability curves show the outlet fluid temperature versus the SOC.
oxidation–reduction reactions. The properties of the anode and Figure 2c shows examples of these thermal rate capability curves for
cathode define the capacity (ampere-hours) or the total electric the cooling device in Fig. 1b. We generated these with a transient
charge that can be withdrawn from a fully charged cell, and the finite-difference numerical model of a fluid channel surrounded
open-circuit voltage or the maximum voltage that can be deliv- by PCM, which is initially subcooled at 0 °C (Methods). The fluid
ered by the device. Under an electrical load, the supply voltage is temperature difference between the inlet and outlet is held constant
lower than the open-circuit voltage due to internal polarization and to ensure constant power. The shapes of the rate capability curves
electrical resistances (IRe losses)37. As the battery is discharged, the were confirmed with experiments on a PCM storage device, which
supplied voltage eventually drops below the cutoff voltage, at which is described in Supplementary Note 4. Although not the focus here,
point all remaining energy in the battery is no longer useful. rate capability and Ragone plots can also be generated for sensible
The rate capability curve of a cell is the supplied voltage during thermal storage devices, where the rate capability curve will be
discharge versus the state of charge (SOC), or the fraction of energy approximately linear throughout the discharge process (similar to
that remains in the battery. Representative rate capability curves for the voltage response of an electrical capacitor).
a lithium-ion battery are shown in Fig. 2a, where the C-rate is the The fluid outlet temperature from the PCM storage rises as it is
applied current normalized to the maximum capacity of the cell. For discharged, like when the voltage drops during discharge in a bat-
example, discharging a 10-Ah battery at 20 A will deplete the battery tery. Also, like batteries, the rate of temperature rise is faster as the
in half an hour, corresponding to a C-rate of 2. Increasing the C-rate C-rate increases. This intrinsic trade-off between energy and power
causes the voltage to drop below the cutoff at higher states of charge, is clearly shown in the corresponding thermal Ragone plot (Fig. 2d)
leaving more unused energy in the battery. that quantifies the total amount of energy extracted from the device
This trade-off between discharge power and the useful discharge before the outlet temperature exceeds the cutoff at different C-rates.
energy is shown in the Ragone plot in Fig. 2b. Each of the rate capa- The rate capability curve (Fig. 2c) shows how power affects the
bility curves becomes a single point on the Ragone plot—the power outlet temperature. For 16 C and 12 C, nearly all the energy stored
comes from the specific C-rate, and the energy is the cumulative in the PCM can be extracted I before
I the fluid outlet temperature
energy discharged before reaching the cutoff voltage. Figure 2b exceeds the 12 °C cutoff. This results in a vertical line on the Ragone

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a Rate capability curves b Ragone plots
4.4 500
Open circuit voltage
400
2C
4.1 300

Specific power (W kg–1)


Cell voltage (V) 3.8 200 1C
1
5
C 150
1
3.5 2
C 120
1C 1
C
Cutoff voltage 2C 90 2

3.2
60 Vcutoff = 2.9 V
2.9 Vcutoff = 3.2 V
1
Vcutoff = 3.5 V 5
C

2.6 30
100 80 60 40 20 0 40 60 80 100 150 200 240

c 16 d 160
120
14
Fluid outlet temperaure (°C)

Cutoff temperature 80 2C

Specific power (W kg–1)


12 3
C
2C 2

10 3
C 1C
2 40
8 1C
1
1
C 2
C
6 2 1 20
6
C
4 Tcutoff = 15 °C
Phase change
2 temperature range 10 Tcutoff = 12 °C
1
Tcutoff = 9 °C 6
C
0 6
100 80 60 40 20 0 10 20 30 40 50 60
State of charge (%) Specific energy (W h kg–1)

Fig. 2 | Rate capability and Ragone plots for electrochemical and thermal energy storage. a, Electrochemical energy storage rate capability curves for a
LiCoO2/graphite lithium-ion battery at C-rates of 0.2, 0.5, 1 and 2 (data taken from Thomas and Linden37). b, Corresponding gravimetric Ragone plot when
the cutoff voltage is 2.9, 3.2 and 3.5 V. c, Analogous thermal rate capability curves for a cooling application when the PCM is a n-tetradecane/graphite
composite discharged at C-rates between 1/6 and 3. d, Corresponding gravimetric Ragone plot when the cutoff temperature is 9, 12 and 15 °C. The dashed
lines in b and d are shown as guides for the eye between the evaluated C-rates. The PCM is 3.5 cm thick for all cases shown.

exceeds the cutoff at 27% SOC, meaning that 27% of the stored
Table 1 | Properties and definitions for electrochemical and energy cannot be accessed at this power.
thermal storage Figure 2d also shows the impact of the cutoff temperature, which
is specified to meet the requirements of the application. If the dif-
Electrochemical Phase change thermal
ference between the transition and cutoff temperature is small, the
storage storage
power is severely limited. At 32 C, decreasing the cutoff temperature
Ideal outputs Open-circuit voltage Transition temperature from 12 to 9 °C results in a 51%I reduction in the accessible energy.
(V) (K) When designing PCM storage, the cutoff temperature is a key
Maximum capacity Ce,max = nF (Ah) Cth,max = MPCMΔhc−d parameter for material selection and dictates the range of applicable
(Wh) transition temperatures for a target power rate.
Discharge current or I = ΔV/Re(A) q_ ¼ ΔT=Rth ðWÞ
power I Deviation of rate capability curves from ideal temperature
The transport equation for PCM storage helps elucidate why the
Internal resistance Re,int = Rion + d/σmat A Rth,int = d/kPCM A (K/W)
fluid outlet temperature deviates from the ideal transition tempera-
(V/A)
ture. The temperature difference between the PCM and the fluid
C-rate Crate = I/Ce,max (h−1) _ th;max ðh�1 Þ
Crate ¼ q=C is dictated by the required power and the resistance: ΔT ¼ qR _ th.
R I R
SOC SOC ¼ Idt=Ce;max ð%Þ SOC ¼ qdt=C
_ th;max ð%Þ Increasing power (C-rate) or resistance will increase theI required
I
A more detailed version of this table is provided in Supplementary Table 1. n is the number of
I ΔT. For cooling applications, this higher fluid temperature comes
electrons in the reaction (typically around 30% of the ideal number for Li ion because using more from the load (for example, electronic components get hotter).
would make it irreversible), F is Faraday’s constant, Δhc−d the enthalpy change between the charged These qR_ th temperature ‘losses’ are analogous to IRe voltage losses
and discharged states (latent + sensible heat), MPCM the PCM mass, Rion the ionic resistance
of the electrolyte, d the effective length, A the effective cross sectional area, σmat the electrical
for electrochemical
I storage—they cause a deviation from the ideal
conductivity of the battery materials (electrodes, current collectors and so on) and kPCM the thermal temperature or voltage. However, there is no loss of thermal energy
conductivity of the PCM. to ambient, as there is in batteries when electrical energy is con-
verted to waste heat.
In the rate capability plots, the different C-rate lines show how
ΔT is affected by power and the slope of the rate capability curves
plot (Fig. 2d) for specific powers below 12 C (roughly 28 W kg−1). shows how ΔT increases as a cold PCM storage is discharged.
As the C-rate increases, the rate capabilityI curves deviate further The internal resistance (R00th;int) is the key driver to the changes ΔT
from the transition temperature and reach the cutoff sooner. This during discharge. The internal
I conductive resistance is due to a
reduces how long the storage lasts and the amount of heat that can liquid layer that develops between the fluid channel wall and the
be rejected to the PCM. For example, at 32 C the outlet temperature melt front, which is at the transition temperature (for hot storage,
I
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a b
×10–3 SOC = 10%
6 3.5
100
Active area ratio 3

y position (cm)
2.5
5
2 Inactive
Thermal resistance (K m2 W–1)

80 1.5 area
1

Active area ratio (%)


4
0.5
60 0
3 Internal 0 5 10 15 20 25 30 35 40
T (°C)
resistance c 14
40 3
12

y position (cm)
2
2.5
Contact resistance 2 10
1 20 1.5 8
Fluid resistance 1
6
0.5
0 0 4
100 80 60 40 20 0 5 10 15 20 25 30 35 40
State of charge (%) x position (cm)

Fig. 3 | Thermal resistances and their relationship to temperature profiles in the PCM. a, Thermal resistances and active area ratio (defined as ratio
between the active and total heat exchanger area) during the discharge process at 1 C. The internal resistance is estimated as the average distance
between the channel wall and melt front in the active area of the device, divided by the liquid-phase PCM conductivity. The resistance through the channel
wall is also shown but is negligible compared to the other resistances and was therefore dropped from equation (1). The contact resistance could have
some dependence on the SOC due to thermal expansion, but it was not considered in this model. b, Phase distribution in the PCM at 10% SOC, where the
liquid is shown in yellow and the region undergoing phase change is shown in green. The channel wall that transfers heat into the PCM is at y = 0. A liquid
layer builds up between the fluid channel and the phase change region, which results in an internal thermal resistance. The inactive area is the fully liquid
region that sensibly heats and cannot accept a large amount of energy from the fluid stream. c, Temperature distribution in the PCM at 10% SOC.

it would be a solid layer). This layer increases in thickness during increase in the temperature, where the inflection point at 23% SOC
discharge, increasing the internal resistance (Fig. 3a) and therefore aligns with the steep drop in the active area in Fig. 3a. The prema-
the ΔT maintains the same power. ture loss in the active area can be minimized by increasing the fluid
The internal resistance is just one mechanism lowering the use- flow rate, which reduces the fluid temperature change, or by using a
ful energy capacity. The fluid outlet temperature can be approxi- boiling heat transfer fluid, which exchanges heat at a near-constant
mated with (Supplementary Note 3): temperature. The Supplementary Information includes videos
2 3 showing the progression of the phase front, temperature gradients,
 7 active area and surface heat fluxes in the device (Supplementary
6 q_ Videos 1 and 2).
Tf ;out  26  00 00 00
4T t þ Aact Rth;int þ Rth;f þ Rth;cont 5 � Tf ;in
7 ð1Þ
|fflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflffl{zfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflfflffl}
key resistances Effects of phase change properties
The proposed framework provides a method to directly compare the
where Tf,in and T t are the fluid inlet and average (midpoint) PCM power and energy densities of thermal storage devices. The internal
transition temperatures,
I Aact the active area and R00th the area-specific resistance is a function of the thermal conductivity, or how well a
thermal resistances (R00th ¼ Rth ´ A). Although this I is not an exact material transports heat, and the PCM thickness, which affects the
analysis and differs from I the finite-difference model used to create distance between the channel wall and the melt front. This resistance
the results, it highlights the main mechanisms causing the tempera- influences the shape of the rate capability curve and the relationship
ture to deviate from the transition temperature in PCM storage. between power and useful energy. This section quantifies how the
The second resistance in equation (1) is the fluid-side convec- internal resistance affects the Ragone curve and lends insight into
tive resistance (R00th;f ), which increases the temperature difference the trade-off between the conductivity and thickness.
between the bulkIfluid and the fluid–wall interface, further increas- If a low thermal-conductivity liquid layer develops between the
ing the outlet temperature. This resistance can be modified by melt front and the channel wall, large temperature gradients develop
changing the fluid channel design or the fluid flow rate, but these in the PCM (Fig. 4a), which then require higher fluid temperatures
factors must be weighed against parasitic pumping losses, which to maintain the desired C-rate (Fig. 4c). This limits the accessible
increase the required energy input. The contact thermal resis- storage capacity to that close to the channel surface, leaving much
tance (R00th;cont) arises due to imperfect contact between the channel of the energy unused. Increasing the thermal conductivity reduces
wall andI the PCM, which imparts a temperature drop across this the thermal resistance and flattens the rate capability curve. This
interface. The reduction in temperature potential due to these two increases the specific energy but has diminishing returns because it
resistances increases linearly with C-rate but is not directly affected is only lowering one of the resistances (R00th;int) in equation (1). High
by the SOC. thermal conductivity also results in a sloped
I phase front (Fig. 4b),
The active area (Aact) is the projected area of the melt front which reaches the insulated boundary opposite to the heated chan-
to the PCM-channel interface. Because the fluid is hottest at the nel wall at higher states of charge, reducing the active area sooner.
inlet, the PCM there melts first (Fig. 3b,c). This non-uniform heat In Fig. 4c, the inflection point due to a loss in the active area occurs
flux lowers the active area once this inlet section of the PCM fully near 40% SOC for 40 W m−1 K−1, but the inflection point shifts to
melts, resulting in an inactive heat transfer area within the device 23% and 10% SOC for 10 and 5 W m−1 K−1, respectively.
(Fig. 3b). This reduction in the active area must be balanced by an Each line in the 1C rate capability plot (Fig. 4c) becomes a single
increase in the driving temperature potential to maintain a con- point on a Ragone plot; additional rate capability curves at different
stant power. The 1C rate capability curve in Fig. 2c illustrates this C-rates complete the Ragone plot shown in Fig. 4d. This plot shows

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a b T (°C)
SOC = 50% k = 1 W m–1 K–1 SOC = 50% k = 10 W m–1 K–1
24
3 3
20
y position (cm)

y position (cm)
2.5 2.5
2 2 16
1.5 1.5 12
1 1
8
0.5 0.5
4
5 10 15 20 25 30 35 40 5 10 15 20 25 30 35 40
x position (cm) x position (cm)
c 1C d
16 200
–1 –1
160 40 W m–1 K–1
1Wm K
14
120
Cutoff temperature
12 80
Fluid outlet temperature (°C)

Specific power (W kg–1)


1C
10

40
8
1 W m–1 K–1
40 W m–1 K–1
6
20
1
4
C
4 –1 –1 –1 –1
1Wm K 10 W m K 1Wm –1 –1
K 10 W m –1
K–1

2 2.5 W m–1 K–1 20 W m–1 K–1 10 2.5 W m–1 K–1 20 W m–1 K–1
–1 –1 –1 –1
5Wm K 40 W m K 5Wm –1 –1
K 40 W m–1 K–1
0 6
100 80 60 40 20 0 10 20 30 40 50 60
State of charge (%) Specific energy (W h kg–1)

Fig. 4 | Effect of thermal conductivity on device performance for PCM thickness of 3.5 cm. a,b, The local PCM temperature at 50% SOC and a C-rate
of 1 are shown for thermal conductivity of 1 W m−1 K−1 (a) and 10 W m−1 K−1 (b). c, fluid outlet temperatures at 1 C. d, Ragone plot for a range of C-rates.
The lines in d are shown as guides for the eye between the evaluated C-rates. Differences in the available energy are primarily related to the PCM surface
temperatures, which increase as the thermal conductivity increases.

that an appropriate thermal conductivity for a device depends on the Ragone plots can be used to compare the performance between
target specific power or C-rate (Table 1 row 5). As an example, shift- different PCMs in a thermal storage device. Figure 6 shows the
ing the electric load for building air conditioning may require a 4-h relationship between the achievable energy and power densities for
discharge to align with the peak period for many electric utility rate PCMs with transition temperatures between 0 and 12 °C.
structures38. Since the baseline PCM storage device has a maximum These results are based on a specific design, including thickness,
capacity of 50.4 W h kg−1, this corresponds to 50.4/4 = 12.6 W kg−1 flow rates and flow channel dimensions, and are not meant to be
power density in Fig. 4d. At this power, a thermal conductivity of exhaustive. One important parameter is the PCM thickness, which
2.5 W m−1 K−1 is high enough to use nearly all of the capacity; how- affects the tube spacing and therefore the power density. For the
ever, if heat needs to be rejected to the PCM at 1 C (50.4 W kg−1), results in Fig. 6, we scaled the thickness to keep the total capacity
a minimum thermal conductivity of 20 W m−1 K−1 is required to constant and, therefore, PCMs with a higher volumetric latent heat
access the full storage capacity. are thinner. This comparison ensures that each device has the same
Another way to address high internal thermal resistance is number of channels and same total maximum capacity.
to reduce the PCM thickness. This reduces the capacity, mean- Although some materials are shown as pure without a conductive
ing a larger number of stacked, single-channel unit cells would matrix, the model excludes natural convection that may occur for
be needed to maintain total capacity. This leads to heavier and pure materials. Natural convection would increase the power density
more expensive devices because of the larger number of channels of these pure materials but is excluded to show trends more clearly.
and joints. A well-designed system needs to consider both the The PCM latent heat sets the maximum specific energy (verti-
power requirements and the additional costs associated with adding cal asymptote in Fig. 6a), while in Fig. 6b the asymptote is set by
more channels. the product of density and latent heat. Although water has a higher
The Ragone plots in Fig. 5 show a trade-off between thermal latent heat than the Department of Energy (DOE) target material,
conductivity and material thickness, where the thickness is half the they approach the same vertical asymptote in Fig. 6b because the
distance between adjacent tubes in the full module (treated as an DOE target material has a higher density (Supplementary Note 5).
adiabatic boundary due to symmetry). For 1 W m−1 K−1 (Fig. 5a), As the power increases, thermal transport affects the shapes of
the thickness of the storage material is extremely limited, especially the Ragone curves. For low thermal-conductivity materials such as
at high power. Pure organic or salt hydrate PCMs typically have n-tetradecane, the accessible energy is less than
 the
 maximum spe-
thermal conductivities below 1 W m−1 K−1, so enhanced materials cific energy, even when discharged over 8 h 18 C . Adding graphite
will be needed for most low-temperature applications. Embedding to tetradecane increases the thermal conductivity
I to 10 W m−1 K−1,
the material in a high thermal-conductivity matrix allows for which improves the specific power at high C-rates. Higher latent
higher power and larger channel spacings, but the matrix dis- heat materials can also improve rate capability because a high latent
places the PCM and therefore comes at the cost of latent heat. This heat allows for thinner PCM layers. The overall effect on the energy
lower latent heat means a lower maximum possible energy density density will depend on the magnitude of the PCM internal resis-
(Supplementary Fig. 6). tances, the total capacity and the desired discharge rate.

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a k = 1 W m–1 K–1
a 200
200
160
160 th = 1.75 cm th = 4.38 cm
th = 2.63 cm th = 5.25 cm 120
120 DOE PCM Tetradecane–graphite
th = 3.50 cm th = 7.00 cm target composite
80
80

Specific power (W kg–1)


Specific power (W kg–1)

1.75 cm
40
40
TBAB hydrate
Water

20
20 Tetradecane

10
10
7.00 cm
6
6 6 10 20 40 60 80 120
10 20 30 40 50 60
Specific energy (W h kg–1)
Specific energy (W h kg–1)

b b 200
k = 10 W m–1 K–1
200 160
160 1.75 cm
120 DOE PCM target
120 Tetradecane–
Power density (kW m–3)
80 graphite composite
80
Specific power (W kg–1)

40
7.00 cm TBAB hydrate
40

Water
20
20

Tetradecane
10
th = 1.75 cm th = 4.38 cm
10
th = 2.63 cm th = 5.25 cm
th = 3.50 cm th = 7.00 cm 6
6 10 20 40 60 80 120
6
10 20 30 40 50 60 Energy density (kW h m–3)
Specific energy (W h kg–1)
Fig. 6 | Effect of material properties on gravimetric and volumetric
Fig. 5 | Effect of PCM thickness on Ragone curves for two thermal Ragone plots for building cooling energy storage. a,b, The gravimetric
conductivities. Specific power and energy are shown for thicknesses (a) and volumetric (b) Ragone plots are shown for organic and inorganic
(th) between 1.75 and 7 cm. a, 1 W m−1 K−1. b, 10 W m−1 K−1. All other materials with a phase transition temperature between 0 and 12 °C. For
thermophysical properties, including the latent heat, are kept the same. all cases, the temperature difference between the fully discharged and
The lines are shown as guides for the eye between the evaluated C-rates. charged states is 10 °C and the cutoff temperature difference ( Tcutoff  Tt)
To access the full capacity of the system, the thickness of the PCM is is 7.4 °C. For simplicity, any effects from natural convection wereI ignored.
limited at high power rates and low thermal conductivities. The DOE PCM target uses material properties that meet the targets
set by DOE’s Building Technologies Office in the 2019 BENEFIT funding
opportunity44. The DOE targets were based on the volumetric energy
Discussion density, and we assumed a latent heat of 250 kJ kg−1 and a density
PCMs are a promising thermal storage medium for many applica- of 1,330 kg m−3 to generate the gravimetric Ragone plot. All material
tions, but their low thermal conductivity often limits the achievable properties used to generate the data are included in Supplementary Table
power. Several recent publications discuss improving the thermal 2. The lines are shown as guides for the eye between the evaluated C-rates.
conductivity of these materials12,29–31, but few focus on the relation-
ship between power and energy. Our research leverages analogies
between electrical transport in batteries and thermal transport in selection and design of a thermal storage device, as illustrated by
PCMs to clearly describe the trade-off between energy and power two examples.
using thermal Ragone plots. We also show how the rate capability First, consider water and graphite–tetradecane. The latter has a
and Ragone curves for thermal storage are affected by the PCM power density figure of merit that is three times higher than that of
properties, specifically the thermal conductivity, latent heat of water, but a latent heat that is half that of water. But it is unclear how
fusion, density and thickness of the material. to weigh the relative importance of the power figure of merit and
Previous work has attempted to quantify the performance of the latent heat. The proposed framework can directly  compare
 these
different materials using figures of merit. A common example is to two materials, and shows that for higher powers 32 C , the graph-
represent power density as the square root of the product of thermal ite–tetradecane design achieves twice the energy density
I to that of
conductivity, latent heat and density12,25,26, and energy density as the water, but for lower power 14 C , water achieves twice the energy
latent heat. However, these metrics are not sufficient for material density to that of graphite–tetradecane.
I
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Second, the proposed framework can be used to select the All thermodynamic properties of the fluid are based on a 10% mixture of
appropriate level of thermal-conductivity enhancement for a PCM propylene glycol-water by volume42. The PCM enthalpy and the fluid temperature
are numerically integrated to calculate the thermodynamic properties in the next
in the device in Fig. 1b. One option is to use a low-enhancement time step using the Euler approach39. Finally, the PCM phase and temperature are
(1 W m−1 K−1) and use thin PCM layers with close spacing of the fluid calculated using material-specific enthalpy-temperature relations.
channels. Another option is to use high enhancement (10 W m−1 K−1) In this study, the thermal storage device was discharged at a constant heat
and thicker PCM layers with larger spacings. The spacings could transfer rate to generate Ragone plots, which  was set bymonitoring the heat
transfer out of the fluid stream, q_ f ¼ mc_ p Tf ;in � Tf ;out . A constant heat transfer
be selected to give equivalent performance on the Ragone plot,
rate can be achieved in several ways, I but in this study, we kept the fluid temperature
and the appropriate design will then depend on the relative cost of difference ðTf ;in � Tf ;out Þ constant throughout the simulation by adjusting the inlet
the additional tubes compared to the cost of thermal-conductivity temperatureI as the outlet temperature increased with the internal resistances. The
enhancement. Thus, the proposed framework is a starting point for fluid temperature difference was set to 4.5 °C for the cases shown. The mass flow
cost optimization for thermal storage materials and devices that rate ( m
_ ) was set to achieve the desired C-rate and changed only slightly during each
run to account for changes in the specific heat (cp) with temperature. The required
can maximize economic and environmental benefits. However, the heat transfer into the PCM is related to the total capacity, which is a function of the
focus of the thermal Ragone plots presented here, as in the Ragone difference between the enthalpy when the device is fully charged and discharged
plots used for battery research, is not on cost-based optimization, (Δhc−d) and the mass of the PCM (ρthPCMAcs):
but rather on the performance trade-off between energy and power. Δhc�d ρthPCM Crate Acs
This framework sets a clear objective: push the Ragone curve up q_ f ¼
3; 600
ð4Þ
(higher power) and to the right (higher energy). This allows for easy
comparisons between different thermal storage material or device Several parameters were tracked through time during the simulation, including
the fluid outlet temperature and the SOC, defined using the average enthalpy of the
designs, whether it is used as an experimental characterization tech- PCM ( h) at a given time step:
nique or to show potential improvements through modelling. This  

provides a fundamental basis for defining material property targets SOC ¼ 100 ´ 1 �
hðt Þ � hcharged
ð5Þ
and can be a critical design and optimization tool for researchers hdischarged � hcharged
and practitioners developing thermal storage materials and devices. where hcharged and hdischarged are the enthalpy at the fully charged and fully discharged
temperatures, respectively. This information was used to construct the rate
Methods capability curves shown in Figs. 2c and 4c. The gravimetric energy and power
Numerical model description. We developed a two-dimensional transient densities (often called the specific energy and specific power, respectively) are then
numerical model using the finite-difference approach39 to model the progression calculated during postprocessing. First, the cutoff time (tcutoff ), defined when the
of phase change during the discharge process and its effects on the outlet fluid outlet fluid temperature exceeded the cutoff temperature, is recorded. The specific
temperature. This model was used to generate rate capability curves for a power is calculated by dividing the heat transferred to the PCM by the total PCM
representative cold storage device. The storage device consists of flat fluid channels mass, and the specific energy is calculated by integrating the specific power from
surrounded by PCM, as shown in Fig. 1b. For the baseline conditions shown in t = 0 to t = tcutoff. This information was used to construct the Ragone plots presented
Fig. 2c,d, the channels are 45.7 cm long (LHX), 25.4 cm wide (WHX) and the distance throughout the paper.
between adjacent channels is 7 cm (2thPCM). The model takes advantage of symmetry
and includes half of a fluid channel and the PCM between the channel surface and Model validation. First, the model was modified to simulate freezing of a
the midplane between adjacent channels. The symmetry condition dictates adiabatic semi-infinite PCM with a constant temperature boundary condition. The results
boundary conditions. In this work, the PCM thickness is defined as half the distance were compared to the classical Neumann’s solution for two-phase solidification43.
between adjacent channel walls, or the distance between the channel wall and the To allow for direct comparison, the numerical model was terminated when the
line of symmetry in the model. The PCM is discretized into 800 subvolumes, and boundary condition started to affect the temperature at the insulated boundary
the fluid stream was divided into 40 subvolumes in the axial direction. The number opposite from the cooled surface and pure water was used as the PCM because its
of nodes were chosen so that doubling them in any direction resulted in less than a phase transition occurs at a single temperature. The results from the numerical
2% change in the specific energy. The heat transfer between adjacent PCM cells is model match the analytical solution well where most of the local temperatures
calculated with a discretized version of Fourier’s law40, accounting for directional fall within 0.05% of the analytical solution. The largest deviations occurred at
differences in the thermal conductivity for some materials (k|| and k⊥), and the the location closest to the melt front. With 24 nodes in the heat flow direction,
enthalpy change (dh) with time is calculated using an energy balance: the average error is 0.02% (ΔTlocal = 0.06 K) and the maximum error is 0.62%
  (ΔTlocal = 1.66 K). With 72 nodes in the heat flow direction, the average and
dhi;j WHX kk dy   k? dx   maximum errors are 0.01 and 0.21%, respectively.
¼ Ti;j�1 þ Ti;jþ1 � 2Ti;j þ Ti�1;j þ Tiþ1;j � 2Ti;j ð2Þ
dt Mi;j dx dy The full model was also validated experimentally using a microchannel heat
exchanger. A description of the experiments and a comparison between the model
where i and j represent the node location, M is the node mass, T is the node and experimental results is provided in the Supplementary Note 4.
temperature, dx is the length of the node in the fluid flow direction and dy is
the length of the node in the direction perpendicular to fluid flow. This analysis Data availability
assumes that the PCM is static and that conduction is the only mode of heat All data generated or analysed during this study are included in the published
transfer in the PCM material. Buoyancy-induced liquid motion is possible, article, its Supplementary Information and Source Data files
particularly in pure materials, which would help mix the liquid layer and reduce
fluid outlet temperatures. More work is needed to quantify the effects of buoyancy
on the rate capability curves of non-composite PCM materials. However, this
Code availability
The numerical model developed for this work was generated in MATLAB R2019b.
analysis primarily focuses on high thermal conductivity PCMs (>1 W m−1 K−1),
Unrestricted access to the source code is available at https://github.com/NREL/
which usually contain a matrix structure. This high thermal-conductivity structure
ThermalRagone.
will limit buoyancy-induced fluid motion and result in primarily conductive heat
transfer throughout the material.
Heat transfer between the fluid stream and the PCM ( q_ f ) is calculated by Received: 17 June 2020; Accepted: 5 January 2021;
considering all relevant resistances, including fluid convection, I conduction Published: xx xx xxxx
through the channel wall, contact and conduction through the PCM in the node
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