SVKM’s NMIMS MUKESH PATEL SCHOOL OF TECHNOLOGY MANAGEMENT & ENGINEERING Programme: B. Tech (MECHATRONICS) » . . Year:IV ~ Semester: VII Academic Year: 2017-2018 Subject: Microelectromechanical Systems ,- 6 Rag Marks: 60 _wsitt® y Date: 30 November 2017 + ‘Time: 10.00 am. ae {00 pm WY, Durations: 3 (his STB VE No. of Pages: ¥ Gf Final-Examination n ae Instructions: Candidates should read carefully the instructions printed on aT, the cover of the Answer Book, which is provided for their use. 1) Question No. O1 is compulsory 2) Out of remaining questions, attempt any 04 questions. 3) In all 05 questions to be attempted. 4) All questions carry equal marks. 5) Answer to each new question to be started on a fresh page. 6) Figures in brackets on the right hand side indicate full marks. 7) Assume Suitable data if necessary. QD) Solve any Twos a) Explain elements of smart sensor with the help of neat block diagram 'b) What is meartby wafer bonding, explain Anodic Bonding process ©) Explain applications of MEMS in following; Q2 Automobile Medical Aerospace Defense Chemical Electronies a. What is meartby Miniaturization and explain related issue. b. Distinguish between bulk and surface micromachining. per and on [2*6] 106) (03) c. A cylindrical silicon rod is pulled on both ends with a force of 10mN. The rod is Imm [03] Jong and 100 um in diameter. Find the stress and strain in the longitudinal direction of the rod. Yea2.6) it Explain steps involve in lithography Explain chemical sensor with the help of block diagram, What is meartby term scaling, explain law of scaling of Geometry Explain top down nanofabrication & bottom up nanofabrication How MEMS transforming biomedical field explain in detail Explain Key issue in MEMS packaging Short note on (any 3) Microfluidics Micro-valves DNA addressing with microelectrodes Shape Memory alloy Thermal management of electronic packaging Residual stresses in 3D printing of microstructure ios), (06 106) [06] {06} [06] [12] tfoa