Professional Documents
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Generic Telecommunications Bonding
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and Grounding (Earthing) for Customer
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Premises
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endorsement by TIA or this committee of the products or services of the company.
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(From Standards Proposal No. ANSI/TIA-PN-607-C-D1, formulated under the cognizance of the TIA
TR-42 Telecommunications Cabling Systems, TR-42.16 Subcommittee on Premises
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Telecommunications Bonding & Grounding (607).
Published by
TELECOMMUNICATIONS INDUSTRY ASSOCIATION
Technology and Standards Department
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Table of Contents
FOREWORD ............................................................................................................................................... vii
1 SCOPE .................................................................................................................................................. 1
2 NORMATIVE REFERENCES ............................................................................................................... 1
3 DEFINITIONS, ACRONYMS AND ABBREVIATIONS, UNITS OF MEASURE .................................. 2
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3.3 Acronyms and abbreviations ........................................................................................ 6
3.4 Units of measure .......................................................................................................... 8
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4 REGULATORY ..................................................................................................................................... 9
4.1 National requirements .................................................................................................. 9
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4.2 Local code requirements .............................................................................................. 9
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5 OVERVIEW OF TELECOMMUNICATIONS BONDING AND GROUNDING SYSTEMS .................. 10
5.1 General .......................................................................................................................10
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5.2 Overview of the telecommunications bonding infrastructure........................................10
5.2.1 General ................................................................................................................10
5.2.2 Primary bonding busbar (PBB) ............................................................................12
5.2.3 Telecommunications bonding conductor (TBC)....................................................12
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7.1.2 Distributor rooms .................................................................................................18
7.1.3 Computer rooms ..................................................................................................19
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7.1.4 Cabinets and racks ..............................................................................................19
7.1.5 Metallic pathways ................................................................................................20
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7.1.6 Structural metal....................................................................................................20
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7.2 Primary bonding busbar (PBB)....................................................................................21
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7.2.1 General ................................................................................................................21
7.2.2 Bonds to the PBB ................................................................................................21
7.2.3 Connections to the PBB .......................................................................................22
7.3 Secondary bonding busbar (SBB) ...............................................................................22
7.3.1 General ................................................................................................................22
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7.8.2 Mesh-IBN.............................................................................................................31
7.8.3 Bonding conductor for connections to the supplementary bonding network .........32
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7.9 Administration .............................................................................................................32
8 EXTERNAL GROUNDING ................................................................................................................. 33
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8.1 Grounding resistance ..................................................................................................33
8.1.1 Minimum requirements ........................................................................................33
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8.1.2 Enhanced requirements .......................................................................................33
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8.2 Grounding electrode system design ............................................................................33
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8.2.1 General ................................................................................................................33
8.2.2 Soil resistivity testing............................................................................................33
8.2.3 Low resistance .....................................................................................................33
8.2.4 Potential equalization ...........................................................................................34
8.2.5 Design configuration ............................................................................................34
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C.1 General .......................................................................................................................48
C.2 Grounding electrode system .......................................................................................48
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C.2.1 External grounding ...............................................................................................48
C.2.2 Bonding busbars ..................................................................................................48
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C.2.3 Grounding systems ..............................................................................................49
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C.2.3.1 Type 1 sites ..................................................................................................49
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C.2.3.2 Type 2 sites ..................................................................................................50
C.2.4 Tower grounding ..................................................................................................50
C.2.4.1 Guyed metallic towers...................................................................................51
C.2.4.2 Self-supporting metallic towers .....................................................................53
C.2.4.3 Wooden structures (poles) ............................................................................54
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List of Figures
Figure 1 – Relationship between relevant TIA standards ........................................................... ix
Figure 2 – Elements of generic cabling topology ........................................................................ 3
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Figure 5 – Illustrative example of a smaller building ..................................................................12
Figure 6 – Example PBB ...........................................................................................................14
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Figure 7 – Example SBB ...........................................................................................................15
Figure 8 – Label for bonding and grounding conductors............................................................17
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Figure 9 – Example of three methods to bond equipment and racks .........................................20
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Figure 10 – Illustration of bend radius and included angle .........................................................24
Figure 11 – Bonding to the service equipment (power) ground .................................................24
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Figure 16 – A mesh-BN with equipment cabinets, frames, racks and CBN bonded together ....30
Figure 17 – A mesh-IBN having a single point of connection.....................................................32
Figure 18 – Illustration of test instrument connections ...............................................................37
Figure 19 – Four-point method ..................................................................................................39
Figure 20 – Example of multiple test locations ..........................................................................40
Figure 21 – Recommended resistivity table layout ....................................................................41
Figure 22 – Illustrative views of typical ground rods ..................................................................43
Figure 23 – Illustrations of a vertical and horizontal electrolytic ground rod ...............................44
Figure 24 – Illustrative view of a concrete-encased electrode ...................................................45
Figure 25 – Illustrative view of a ground radial electrode ...........................................................46
Figure 26 – Illustrative example of ground enhancement materials surrounding a grounding
conductor and a ground rods ....................................................................................................47
Figure 27 – Illustrative example view of a site grounding electrode system ...............................48
Figure 28 – Illustration of a parallel ground rod installation ........................................................50
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Figure 36 – Illustrative view of side-mounted antenna grounding using copper strap down
conductor ..................................................................................................................................60
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Figure 37 – Illustration of a fence bonding example ..................................................................62
Figure 38 – Illustrative view of a fence fabric and deterrent wiring bonding example .................63
Figure 39 – Illustrative view of a generator grounding example .................................................64
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Figure 40 – Electrical protection for operator-type equipment positions ....................................68
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List of Tables
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Table 1 – TBB/BCC conductor size vs length ............................................................................16
Table 2 – Stake distance...........................................................................................................36
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FOREWORD
(This foreword is not considered part of this Standard)
This Standard was developed by TIA Subcommittee TR-42.16.
Contributing organizations
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More than 60 organizations within the telecommunications industry (including manufacturers,
consultants, end users, and other organizations) contributed their expertise to the development
of this Standard.
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Documents superseded
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This Standard supersedes ANSI/TIA-607-B dated September, 2011, and its addenda.
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Significant technical changes from the previous edition
Significant changes from the previous edition include:
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Annexes
There are six annexes to this Standard. Annexes A through F are informative and not consid-
ered a part of this Standard.
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Residential Telecommunications Infrastructure Standard (ANSI/TIA-570-C)
Administration Standard for Telecommunications Infrastructure (ANSI/TIA-606-B)
Customer-Owned Outside Plant Telecommunications Infrastructure Standard
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(ANSI/TIA-758-B)
Structured Cabling Infrastructure Standard for Intelligent Building Systems
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(ANSI/TIA-862-B)
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Telecommunications Infrastructure Standard for Data Centers (ANSI/TIA-942-A)
Telecommunications Infrastructure Standard for Industrial Premises (ANSI/TIA-1005-A)
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Healthcare Facility Telecommunications Infrastructure Standard (ANSI/TIA-1179)
Telecommunications Infrastructure Standard for Educational Facilities (ANSI/TIA-4966)
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ANSI/TIA-606 ANSI/TIA-942 ANSI/TIA-568.4
(Administration) (Data centers) (Broadband
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coaxial)
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ANSI/TIA-607 ANSI/TIA-1005
(Bonding and (Industrial)
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grounding
[earthing])
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ANSI/TIA-758 ANSI/TIA-1179
(Outside plant) (Healthcare)
ANSI/TIA-862 ANSI/TIA-4966
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(Intelligent (Educational)
building
systems)
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NOTE – The North American term “grounding” that is used in this Standard is
equivalent to the international term “earthing.”
The bonding and grounding approach in this Standard is intended to work in concert with prem-
ises cabling, equipment, spaces and pathways specified within the TIA Engineering Committee
TR-42. The requirements specified in this Standard in conjunction with a basic understanding of
bonding and grounding concepts and methodologies will aid in achieving a reliable solution
when applied to telecommunications installations.
Several sources of bonding and grounding information exist within the telecommunications in-
dustry. For example, the NEC specifies requirements regarding the safety aspects of bonding
and grounding of equipment and systems. Yet another example is that of ATIS 0600318, Elec-
trical Protection Applied to Telecommunications Network Plant at Entrances to Customer Struc-
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tures or Buildings, which provides information on bonding and grounding to support electrical
protection considerations.
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Purpose
The purpose of this Standard is to enable and encourage the planning, design, and installation
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of generic telecommunications bonding and grounding systems within premises with or without
prior knowledge of the telecommunications systems that will subsequently be installed. While
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primarily intended to provide direction for the design of new buildings, this Standard may be
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used for existing building renovations or retrofit treatment. Design requirements and choices are
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provided to enable the designer to make informed design decisions.
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Stewardship
Telecommunications infrastructure affects raw material consumption. The infrastructure design
and installation methods also influence product life and sustainability of electronic equipment life
cycling. These aspects of telecommunications infrastructure impact our environment. Since
building life cycles are typically planned for decades, technological electronic equipment up-
grades are necessary. The telecommunications infrastructure design and installation process
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magnifies the need for sustainable infrastructures with respect to building life, electronic equip-
ment life cycling and considerations of effects on environmental waste. Telecommunications
designers are encouraged to research local building practices for a sustainable environment
and conservation of fossil fuels as part of the design process.
Specification of criteria
Two categories of criteria are specified; mandatory and advisory. The mandatory requirements
are designated by the word "shall;" advisory requirements are designated by the words "should,”
"may," or "desirable," which are used interchangeably in this Standard.
Mandatory criteria generally apply to protection, performance, administration and compatibility;
they specify the minimally-compliant requirements. Advisory or desirable criteria are presented
when their attainment will enhance the general performance of the cabling system in all its con-
templated applications.
A note in the text, table, or figure is used for emphasis or offering informative suggestions, or
providing additional information.
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1 SCOPE
This Standard specifies requirements for a generic telecommunications bonding and grounding
infrastructure and its interconnection to electrical systems and telecommunications systems.
This Standard may also be used as a guide for the renovation or retrofit of existing systems.
2 NORMATIVE REFERENCES
The following standards contain provisions which, through reference in this text, constitute pro-
visions of this Standard. At the time of publication, the editions indicated were valid. All stand-
ards are subject to revision, and parties to agreements based on this Standard are encouraged
to investigate the possibility of applying the most recent editions of the standards indicated be-
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low. ANSI and TIA maintain registers of currently valid national standards published by them.
ANSI/NECA/BICSI 607-2011, Standard for Telecommunications Bonding and Grounding
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Planning and Installation Methods for Commercial Buildings
ANSI/TIA-606-B, 2012, Administration Standard for Telecommunications Infrastructure
ATIS 0600313-2013, Electrical Protection for Telecommunications Central Offices and
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Similar Type Facilities
ATIS 0600318-2010, Electrical Protection Applied to Telecommunications Network Plant
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at Entrances to Customer Structures or Buildings
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ATIS 0600321-2010, Telecommunications – Electrical Protection For Network Operator-
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Type Equipment Positions
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ATIS 0600333-2013, Grounding And Bonding Of Telecommunications Equipment
ATIS 0600334-2013, Electrical Protection Of Communications Towers And Associated
Structures
IEEE C2-2012, National Electrical Safety Code® (NESC®)
IEEE 1100-2005, Recommended Practice for Powering and Grounding Electronic
Equipment
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ANSI/TIA-607-C
3.1 General
For the purposes of this Standard, the following definitions, acronyms, abbreviations and units
of measure apply.
3.2 Definitions
access floor: A system consisting of completely removable and interchangeable floor panels
that are supported on adjustable pedestals or stringers (or both) to allow access to the area be-
neath.
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access provider: The operator of any facility that is used to convey telecommunications sig-
nals to and from a customer premises.
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administration: The method for labeling, identification, documentation and usage needed for
installation, moves, additions and changes of the telecommunications infrastructure.
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backbone: A facility (e.g., pathway, cable or bonding conductor) for Cabling Subsystem 2 and
Cabling Subsystem 3.
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backbone bonding conductor: A telecommunication bonding connection which interconnects
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telecommunications bonding backbones (formerly known as the grounding equalizer).
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bonding: The joining of metallic parts to form an electrically conductive path.
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bonding conductor: A conductor that joins metallic parts to form an electrically conductive
path.
bonding network (telecommunications): A set of interconnected conductive structures that
provides a low impedance path for the associated telecommunications infrastructure.
building backbone: 1) Pathways or cabling between telecommunications service entrance
rooms, equipment rooms, telecommunications rooms, or telecommunications enclosures within
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DB DB
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1
DA DA DA
1
1 1 1 1
1 1
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1 1
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EO EO EO EO EO EO EO EO EO EO
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Legend:
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DA Distributor A Cabling
1 Subsystem 1
DB Distributor B cable
DC Distributor C Cabling
2 Subsystem 2
EO
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computer room: An architectural space whose primary function is to accommodate data pro-
cessing equipment.
conduit: 1) A raceway of circular cross-section. 2) A structure containing one or more ducts.
connecting hardware: A device providing mechanical cable terminations.
consolidation point: A connection facility within Cabling Subsystem 1 for interconnection of
cables extending from building pathways to the equipment outlet.
cord: 1) An assembly of cord cable with a plug on one or both ends. 2) An assembly of optical
fiber cable with a connector on each end.
cord cable: A cable used to construct patch, work area, and equipment cords .
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customer premises: Building(s), grounds and appurtenances (belongings) under the control of
the customer.
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Distributor A: Optional connection facility in a hierarchical star topology that is cabled between
the equipment outlet and Distributor B or Distributor C.
Distributor B: Optional intermediate connection facility in a hierarchical star topology that is ca-
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bled to Distributor C.
Distributor C: Central connection facility in a hierarchical star topology.
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distributor room: An enclosed architectural space designed to contain Distributor A, Distributor
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B or Distributor C.
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earth: See ground.
earthing: See grounding.
electromagnetic interference: Radiated or conducted electromagnetic energy that has an un-
desirable effect on electronic equipment or signal transmissions.
entrance facility (telecommunications): An entrance to a building for both public and private
network service cables (including wireless) including the entrance point of the building and con-
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within a building or campus.
listed: Equipment included in a list published by an organization, acceptable to the authority
having jurisdiction, that maintains periodic inspection of production of listed equipment, and
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whose listing states either that the equipment or material meets appropriate standards or has
been tested and found suitable for use in a specified manner.
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mechanical connection: A reversible means of connecting a conductor to a connector through
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the use of a set screw or other bolt and nut device.
mesh bonding network: A bonding network to which all associated equipment (e.g., cabinets,
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frames, racks, trays, pathways) are connected using a bonding grid, which is connected to
multiple points on the common bonding network.
mesh isolated bonding network: A mesh bonding network that has a single point of connec-
tion to either the common bonding network or another isolated bonding network.
patch cord: A cord used to establish connections on a patch panel.
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patch panel: A connecting hardware system that facilitates cable termination and cabling ad-
ministration using patch cords.
pathway: A facility for the placement of telecommunications cable.
primary bonding busbar: A busbar placed in a convenient and accessible location and bond-
ed, by means of the telecommunications bonding conductor, to the buildings service equipment
(power) ground (formerly known as the telecommunications main grounding busbar).
primary protector: The protector located at the building telecommunications entrance point.
primary protector grounding conductor: The conductor connecting the primary protector to
ground.
protector: A device consisting of one or more protector units and associated mounting assem-
blies intended to limit abnormal voltages or currents on metallic telecommunications circuits.
rack: Supporting frame equipped with side mounting rails to which equipment and hardware
are mounted.
rack bonding busbar: A busbar within a cabinet, frame or rack.
rack bonding conductor: Bonding conductor from the rack or rack bonding busbar to the tele-
communications equipment bonding conductor.
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cables.
soil resistivity: The measure of a soil's ability to retard the conduction of an electric current.
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space (telecommunications): An area used for housing the installation and termination of tel-
ecommunications equipment and cable.
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splice: A joining of conductors, meant to be permanent.
supplementary bonding grid: A set of conductors or conductive elements formed into a grid or
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provided as a conductive plate that is part of a bonding network.
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star topology: A topology in which telecommunications cables are distributed from a central
point.
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telecommunications: Any transmission, emission, or reception of signs, signals, writings, im-
ages, and sounds, that is, information of any nature by cable, radio, optical, or other electro-
magnetic systems.
telecommunications bonding backbone: A conductor that interconnects the primary bonding
busbar to the secondary bonding busbar.
telecommunication bonding conductor: A conductor that interconnects the telecommunica-
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tions bonding infrastructure to the building's service equipment (power) ground (formerly known
as the bonding conductor for telecommunications).
telecommunications equipment bonding conductor: A conductor that connects the primary
bonding busbar or secondary bonding busbar to equipment racks or cabinets.
telecommunications infrastructure: See infrastructure (telecommunications).
unit bonding conductor: A bonding conductor from equipment or a patch panel to a rack
bonding conductor or a rack bonding busbar.
wire: An individually insulated solid or stranded metallic conductor.
work area cord: See cord.
6
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C ed
EO equipment outlet
ESD electrostatic discharge
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FCC Federal Communications Commission
HVAC heating, ventilation and air conditioning
t
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IACS International Annealed Copper Standard
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IBN isolated bonding network
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IEC International Electrotechnical Commission
ISO International Organization for Standards
ITE information technology equipment
ITU-T International Telecommunication Union - Telecommunication sector
mesh-BN mesh bonding network
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cm centimeter
C ed
ft feet, foot
in inch
kcmil thousand circular mils
y
km t kilometer
m meter
mm
op millimeter
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ohms-cm ohms-centimeter
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V volt
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4 REGULATORY
exceptions to the code that are adopted by the governing authority (the AHJ). If no code has
been adopted locally, consult with the fire marshal’s office to determine what agency is respon-
C ed
sible for code enforcement in that geographic area.
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5.1 General
The basic principles, components, and design of telecommunications bonding and grounding
infrastructure specified in this Standard shall be followed amongst buildings of differing designs
and structures.
NOTE – The requirements in this Standard differ from utility service provider re-
quirements, which are specified in ATIS 0600313. ATIS 0600313 specifications
support a robust level of service appropriate to a service provider. Users of this
Standard are encouraged to refer to ATIS 0600313 where robust service re-
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quirements exist.
Bonding and grounding systems within a building are intended to have one electrical potential.
C ed
This is achieved to a large extent by following the requirements and guidelines in clauses 6 and
7 of this standard. For an enhanced bonding infrastructure that facilitates a greater degree of
equipotential bonding, the supplementary bonding infrastructure specifications in clause 7.8
should be used.
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While the bonding and grounding of the electrical service entrance is outside the scope of this
t
Standard, coordination between electrical and telecommunications bonding and grounding sys-
op
tems is essential for the proper application of this Standard. For example, electrical room and
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associated electrical panelboard(s) are not part of the telecommunications infrastructure, but
they are depicted in this Standard because they are integral to the telecommunications bonding
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and grounding system. See 7.2.1, 7.2.2, 7.3.1 and 7.3.2 for more information regarding bonding
to electrical panelboards.
When installed, the lightning protection system should meet the requirements of the authority
having jurisdiction (AHJ).
Where a tower or antenna is installed, the installation shall meet the bonding and grounding re-
quirements of ATIS 0600334. See annex B for information regarding bonding and grounding of
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5.2.1 General
Within a building (see illustrative examples figure 3, figure 4 and figure 5), the generic telecom-
munications bonding infrastructure originates at the electrical entrance facility ground and ex-
tends throughout the building. It includes the following major components:
a) primary bonding busbar (PBB);
b) telecommunications bonding conductor (TBC);
and may also include the following:
c) telecommunications bonding backbone (TBB);
d) secondary bonding busbar (SBB); and,
e) backbone bonding conductor (BBC).
These telecommunications bonding components are intended to work with a building’s tele-
communications pathways and spaces, installed cabling, and administration system.
10
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Distributor Distributor
room room
Backbone
bonding
Equipment conductor Equipment
SBB (BBC) SBB
Pathways
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C ed
Distributor Distributor
room room
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Equipment
t SBB
Equipment
SBB
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Telecommunications
U im
bonding backbone (TBB)
Electrical
entrance
facility Telecommunications Distributor
entrance facility (TEF) room
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Equipment
Equipment
Busbar
Building spaces
11
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Telecommunications
bonding conductor
(TBC)
Electrical
entrance Primary bonding busbar (PBB) Secondary bonding busbar (SBB)
facility
Equipment Equipment
Telecommunications Distributor
entrance facility (TEF) room
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C ed
Telecommunications
bonding backbone (TBB)
LEGEND
Pathways Panelboard
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Busbar Building spaces
t Bonding conductor
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Service equipment as labeled
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Figure 4 – Illustrative example of a single story large building
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Electrical LEGEND
entrance
facility Telecommunications
entrance facility (TEF) Structural metal
Equipment Busbar
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C ed
ed busbars, either on the same floor in a multi-story building or in the same general area of a
single story building. See 6.3.4 and 7.5.5.
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6.1 General
This clause specifies components of the telecommunications bonding infrastructure. Where the
word “listed” is used as a requirement for a component, the component shall be listed to the ap-
plicable standard(s) through a nationally recognized testing laboratory (NRTL).
6.2 Busbars
C ed
b) be made of copper, or copper alloys having a minimum of 95% conductivity when an-
nealed as specified by the International Annealed Copper Standard (IACS);
c) have minimum dimensions of 6.35 mm (0.25 in) thick x 100 mm (4 in) wide and variable
y
in length; and,
d) be listed.
t
See 7.2.1 for installation requirements.
op
se i
Figure 6 illustrates an example of a PBB. Hole spacing, size and pattern may vary.
16 mm 8 mm
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(5/8 in) (5/16 in) 13 mm 11 mm dia. (7/16 in), typ
typ typ dia (½ in) 25 mm (1 in)
100 mm
(4 in)
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Min.
29 mm 50 mm 11 mm dia 29 mm
(1-1/8 in) (2 in) (7/16 in) (1-1/8 in)
typ Mounting holes, typ typ
14
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Figure 7 illustrates an example of a SBB. Hole spacing, size and pattern may vary.
8 mm 11 mm 13 mm
16 mm (5/16 in) (7/16 in) (½ in)
(5/8 in) dia 11 mm
(7/16 in) dia.
25 mm
50 mm (1 in)
(2 in)
mounting holes
29 mm
(1-1/8 in)
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C ed
6.2.3 Rack bonding busbar (RBB)
The RBB shall:
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a) have a minimum cross-sectional area equal to a 6 AWG wire; and,
b) be listed.
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See 7.4.1 for installation requirements.
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See figure 9 for examples of the use of rack bonding busbars.
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6.3 Conductors
6.3.1 General
All bonding conductors shall be copper and may be insulated. When conductors are insulated,
they shall be listed for the application. The bonding conductors shall not decrease in size as the
bonding path moves closer to the termination point of the grounding electrode system.
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C ed
16 – 20 (53 – 66) 2/0
20 – 26 (67 – 84) 3/0
26 – 32 (85 – 105) 4/0
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32 – 38 (106 – 125) 250 kcmil
38 – 46 (126 – 150) 300 kcmil
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46 – 53 (151 – 175) 350 kcmil
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53 – 76 (176 – 250) 500 kcmil
76 – 91 (251 – 300) 600 kcmil
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Greater than 91 (301) 750 kcmil
6.3.5.1 General
When structural metal is bonded to the building’s grounding electrode system it may be used in
place of a TBB, a BBC or both. Before utilizing structural metal in place of a TBB or a BBC,
building plans (including as-builts as applicable) and specifications shall be reviewed to ensure
the structural metal is electrically continuous or can be made so. Additionally, the two point con-
tinuity test as described in 9.1, or equivalent, should be performed on the structural metal to ver-
ify electrical continuity and acceptable resistance along the paths used as bonding conductors.
Concrete reinforcing steel shall not be used as a TBB or a BBC.
16
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cessible. Bonds to the PBB or SBB shall be made as specified in 7.2.2 and 7.3.2, respectively.
Components to be connected to the PBB or SBB shall be as specified in 6.2.1 and 6.2.2, re-
spectively.
6.4 Connectors
All bonding connectors shall be listed for the application.
NOTE – Connectors are listed for the application (e.g., above ground, direct bur-
ied).
The surface of all bonding connectors used on a PBB and an SBB shall be of a material that
provides an electro-chemical potential of <300 mV between connector and bonding busbar.
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6.5 Identification
C ed
6.5.1 Conductors
Where insulated, the TBC and each TBB, BBC, TEBC, RBC and UBC, shall be green, green
with yellow stripe, or marked with a distinctive green color.
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6.5.2 Labels
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Labels shall include the information depicted in figure 8.
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IF THIS CONNECTOR OR CABLE IS
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LOOSE OR MUST BE REMOVED,
PLEASE CALL THE BUILDING
TELECOMMUNICATIONS
MANAGER
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17
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ANSI/TIA-607-C
7 DESIGN REQUIREMENTS
7.1 General
Metallic sheaths of outside plant cables entering a facility shall be bonded to ground as close as
practical to the point of entrance according to manufacturer’s instructions.
Where the building backbone telecommunications cabling incorporates a shield or metallic
member, this shield or metallic member shall be bonded to the primary bonding busbar (PBB) or
the secondary bonding busbar (SBB) where the cables are terminated or where pairs are “bro-
ken out” from the cable sheath.
When secondary protection is provided, the secondary protector grounding conductor (or termi-
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nal) shall be connected to the nearest PBB or SBB using the shortest practical path.
Grounding through the equipment alternating current (ac) power cord does not meet the intent
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of this Standard. It is intended that the information technology equipment (ITE) be provided a
supplementary and specific ground path for the equipment over and above the required ac or
direct current (dc) power ground path. While the ac or dc powered equipment typically has a
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power cord that contains a grounding/bonding wire, the integrity of this path to ground cannot be
easily verified. Rather than relying wholly on the ac or dc power cord grounding/bonding wire, it
is desirable that equipment be grounded in a verifiable “supplementary” manner as described in
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this Standard.
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NOTE – Many types of equipment do not require individual bonding conductors
and as such do not have an attachment point for bonding conductors. Equipment
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that does not have attachment points for bonding conductors may be bonded ei-
ther through the equipment rail or the power cord. Refer to the manufacturer’s
documentation for guidelines.
Metallic pathways under 1 m (3 ft) in length (e.g., wall and floor sleeves, J-hooks) are not re-
quired to be bonded. Additionally, this Standard does not require bonding of the steel bars of a
reinforced concrete building.
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tions system bonding (minimizing practical lengths and number of bends of bonding conductors
to the SBB).
room’s PBB or SBB. The BN may also provide for electromagnetic shielding in varying degrees
based upon its design and installation.
C ed
A recommended augmentation to a BN (especially a mesh-BN) is a supplementary bonding grid
(SBG). Upon installation and connection of the SBG to the BN (primary components are cabi-
nets, racks and frames), the SBG becomes part of the overall BN. The SBG typically covers the
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entire computer room or a local area within a room.
The minimum density of the bonding grid shall be 3 m (10 ft) centers or one that corresponds to
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the computer room cold-or-hot aisles and the aisles running perpendicular to the cold-and-hot
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aisles. For better high-frequency performance or lower impedance a minimum spacing of 0.6 m
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(2 ft) is recommended.
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7.1.4 Cabinets and racks
Metallic enclosures, including telecommunications cabinets and racks, shall be bonded to the
mesh-BN, SBB, or PBB using a minimum sized conductor of 6 AWG.
Cabinets, racks, and other enclosures shall not be bonded serially; each shall have their own
dedicated bonding conductor to the mesh-BN, SBB, PBB or TEBC.
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Equipment containing metallic parts and patch panels for shielded cabling in cabinets and racks
shall be bonded to the telecommunications bonding system in accordance with the manufactur-
er instructions. Where instructions are not given, all bonding conductors that connect these in-
stalled products shall be a minimum sized conductor of 12 AWG. Rack bonding busbars (RBBs)
are recommended for cabinets and racks that need to support multiple unit bonding conductors.
There are three methods to bond the equipment located in the equipment rack or cabinet to the
telecommunications bonding system, see figure 9.
When an RBB is used as the bonding means within a rack or cabinet, the rack or cabinet shall
be bonded to the RBB. When there is no RBB, and the equipment is bonded through individual
unit bonding conductors to an RBC, the rack or cabinet shall be bonded to the RBC.
Rack isolation pads should be provided when racks are installed on conductive surfaces (e.g.,
steel-reinforced concrete slabs).
Cabinets and racks with DC powered equipment may require that the RBB be isolated from the
cabinet. In this case, the cabinet/rack and RBB would each have their own 6 AWG or larger
bonding conductor to the mesh-BN, SBB, or PBB.
19
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ANSI/TIA-607-C
Rack bonding
conductors – All
conductors routed
to PBB/SBB
Unit bonding
conductors
2U
4U 4U
4U
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Unit bonding
Individual equipment
conductors
bonding conductors
from each piece of 2U 2U
equipment and rack to
C ed
the rack bonding
conductor 2U 2U 2U
Vertically-
mounted RBB
2U 2U 2U
2U 2U 2U
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2U 2U
Individual
equipment
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Rack bonding
conductor extended to
grounding terminal
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(typical each piece
bottom of rack to
of equipment)
accommodate future
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growth
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Rack isolation
pads (if
applicable)
Example A Example B Example C
In order to limit the potential difference between telecommunications pathways or between tele-
communications pathways and power pathways, all metallic telecommunications pathways shall
be bonded to the PBB or SBB. Additionally, to achieve the objectives of potential equalization,
cable tray sections shall be bonded together and shall be bonded to the PBB or SBB.
20
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7.2.1 General
The length of the PBB is not specified within this Standard. It is desirable that the busbar be
electrotin-plated for reduced contact resistance. The busbar shall be cleaned and an anti-
oxidant should be applied prior to fastening connectors to the busbar.
The desirable location of the PBB is in the telecommunications entrance room or space. Typi-
cally, there should be a single PBB per building.
NOTE – For buildings with more than one electrical service entrance, each of
which serves telecommunications equipment, the user is urged to consult with a
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C ed
installed to maintain clearances required by applicable electrical codes. A practical location for
the PBB is to the side of the panelboard (where provided). The vertical location of the PBB
should be determined by considering whether the bonding conductors are routed in an access
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floor or overhead cable support. Its placement should provide for the shortest and straightest
practical routing of the telecommunications bonding conductor (TBC) and the primary protector
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grounding conductor (see annex C for more information on telecommunications electrical pro-
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tection – primary protector grounding). Additionally, the PBB shall be insulated from its support
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using an insulator that is listed for the purpose by a nationally recognized testing laboratory
(NRTL). A minimum of 50 mm (2 in) separation from the wall is recommended to allow access
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to the rear of the busbar.
When a panelboard for telecommunications equipment is not installed in the telecommunica-
tions entrance room or space, the PBB should be located near the backbone cabling and asso-
ciated terminations. In addition, the PBB should be located so that the TBC is as short and
straight as practical.
The PBB should serve telecommunications equipment that is located within the same room or
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space. The PBB serves as the central bonding busbar for the telecommunications bonding in-
frastructure. It also serves as the bonding busbar for equipment located in the telecommunica-
tions entrance room or space.
21
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ductors where the pathway is bonded to the bonding conductor, no additional bond to the PBB
is required.
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7.3.1 General
The length of the SBB is not specified within this Standard. It is desirable that the busbar be
electrotin-plated for reduced contact resistance. The busbar shall be cleaned and an anti-
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oxidant should be applied prior to fastening connectors to the busbar.
The SBB shall be as close as practical to the panelboard and shall be installed to maintain
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clearances required by applicable electrical codes. A practical location for the SBB is to the side
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of the panelboard (where provided). The vertical location of the SBB should be determined by
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considering whether the bonding conductors are routed in an access floor or overhead cable
support. Additionally, the SBB shall be insulated from its support using an insulator that is listed
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for the purpose by a NRTL. A minimum of 50mm (2 in) separation from the wall is recommend-
ed to allow access to the rear of the busbar.
When a panelboard for telecommunications equipment is not installed in the same room or
space as the SBB, that SBB should be located near the backbone cabling and associated ter-
minations.
The bonding conductor between a TBB and an SBB shall be continuous and routed in the
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7.4.1 General
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The length of the RBB is not specified in this Standard. The busbar shall be cleaned and a
compatible anti-oxidant should be applied prior to fastening connectors to the busbar. The RBB
shall be installed horizontally or vertically on the rack using insulators which provide a minimum
C ed
of 19 mm (0.75 in) separation.
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The RBB shall be bonded to either the rack bonding conductor or to the telecommunications
equipment bonding conductor and to the rack.
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7.4.3 Connections to the RBB
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The connection of the rack bonding conductor or the telecommunications equipment bonding
conductor to the rack shall utilize exothermic welding, listed compression two-hole lugs, or listed
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exothermic two-hole lugs.
The unit bonding conductor should be connected to the RBB using a listed compression con-
nector and to the grounding post of the telecommunications equipment if provided.
7.5 Conductors
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7.5.1 General
Bonding conductors for telecommunications should not be placed in ferrous metallic conduit. If it
is necessary to place bonding conductors in ferrous metallic conduit the conductors shall be
bonded to each end of the conduit using a grounding bushing or using a minimum sized con-
ductor of 6 AWG at both ends of the conduit.
23
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ANSI/TIA-607-C
Bend
radius
90° minimum
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C ed
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Figure 10 – Illustration of bend radius and included angle
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7.5.3 Telecommunications bonding conductor (TBC)
The TBC shall bond the PBB to the service equipment (power) ground. Figure 11 schematically
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depicts this connection to the service equipment (power) ground.
Electrical entrance Telecommunications
facility entrance facility
TBB
Service
equipment
L
N
Equipment
G PBB
Telecommunications
Grounding bonding conductor
electrode (TBC)
system Outside the scope of this Standard
24
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d) be continuous from the PBB to the furthest SBB to which it is connected (i.e., not be dai-
sy-chained from busbar to busbar); and,
e) minimize, to the extent practical, the lengths of the TBB(s).
TBB conductors shall be protected from physical and mechanical damage. The TBB conductors
should be installed without splices, however, where splices are necessary, the number of splic-
es should be minimized. Splices shall be accessible and be located in telecommunications
spaces. Joined segments of a TBB shall be joined by means of a listed exothermic weld, listed
irreversible compression-type connectors, or equivalent. All joints shall be adequately supported
and protected from damage.
Metallic cable shield(s) or any metal pathway for cable (e.g., conduit) shall not be used as a
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C ed
Whenever two or more TBBs are used within a multistory building, the TBBs shall be bonded
together with a BBC at the top floor and at a minimum of every third floor in between to the low-
est floor level (see figure 3). Whenever two or more TBBs are used within a large single-story
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building, the TBBs shall be bonded together with a BBC at the location farthest from the PBB
and at a maximum distance of every 10 m (33 ft) back to the PBB.
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7.5.6 Coupled bonding conductor (CBC)
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CBCs provide protection against electromagnetic interference (EMI) through close proximity and
may be integral to the cabling system. The CBC:
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a) may be part of a cable’s shield;
b) may be separate conductors that are tie wrapped to communication cables; and,
c) are typically sized at 10 AWG, although 6 AWG is recommended.
25
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j) where placed in ferrous metallic conduit that is greater than 0.9 m (3 ft), be bonded to
each end of the conduit using a grounding bushing or with a minimum sized conductor
of 6 AWG.
7.5.8.1 General
The TEBC connects the PBB/SBB to equipment racks/cabinets. More than one TEBC may be
installed from the PBB/TBG (e.g., a separate TEBC per rack). The TEBC shall be a continuous
copper conductor that is sized not less than a 6 AWG or as the largest size equipment ground-
ing conductor in the ac branch power circuit(s) serving the racks/cabinet lineup.
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NOTE – Cable shields, metal conduit, cable runway or ladder, or any other me-
tallic cable pathway do not satisfy the requirements for a TEBC.
C ed
Connections to the TEBC shall be made with listed irreversible compression connectors, suita-
ble for multiple conductors, and with the rack bonding conductors (RBCs) routed toward the
PBB/SBB, see figure 12.
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The TEBCs may be routed within cable trays, on the outside of ladder rack, tray supported at no
greater than 0.9 m (3 ft) intervals, or along equipment platforms, see figure 13. Examples of ac-
t
ceptable means of supporting the TEBCs include the use of lay-in lugs, cable brackets, and
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other brackets designed for this purpose.
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An alternative method to running TEBCs overhead is to route them under an access floor. All
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requirements set forth for running the bonding conductors specified in this Standard shall apply.
Irreversible compression
connection
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TEBC (Telecommunications
equipment bonding
conductor)
Rack bonding
conductor
26
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Telecommunications To PBB/SBB
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equipment bonding
Irreversible
conductor (TEBC)
crimp connector
C ed
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Figure 13 – Example of a TEBC routed on cable tray
7.5.8.2 Separation
TEBCs shall be separated a minimum of 50.8 mm (2 in) from conductors of other cable groups
such as power or telecommunications cables. For example, TEBC’s may be suspended 50 mm
(2 in) under or off the side of a cable tray. An exception may be when conductors are grouped
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together to enter or exit a cabinet or enclosure. Grouping only at this point is acceptable, pro-
vided the conductors are suitably separated on either side of the opening.
TEBCs shall be separated from ferrous material by a distance of at least 50 mm (2 in) where
achievable, or be effectively bonded to the ferrous material.
27
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tFigure 14 – Illustration of connection point to a rack from a TEBC
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7.7 Structural bonding of equipment cabinets/equipment racks
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For a welded cabinet/equipment rack, the welded construction serves as the method of bonding
the structural members of the cabinet/rack together.
For a bolted cabinet/equipment rack, bonding continuity cannot be assumed through the use of
normal frame bolts used to build or stabilize equipment cabinets and racks. Bonding hardware,
such as bolts, washers, nuts and screws, specifically designed to accomplish integral bonding of
the cabinet and rack assembly, frame and support, and tested to meet applicable NRTL re-
quirements are an acceptable bonding means. However, if bolts, nuts and screws for cabinet
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and rack assembly and support are not specifically designed for bonding purposes, the paint
shall be removed from all bonding contact areas. In any case, removal of the paint from all
bonding contact areas is recommended.
All detachable, metallic parts of equipment cabinets (e.g. frame, door, side panel, top panel)
shall be bonded, either directly by means of bonding jumpers or through the cabinet frame, to
the connection point on the cabinet where the cabinet bonding conductor connects to the cabi-
net.
When a detachable, metallic part of an equipment cabinet is connected by a bonding jumper,
the jumper shall be a minimum sized conductor of 12 AWG stranded, high strand count, insulat-
ed copper conductor with green or green with yellow stripe jacket. Also, the bonding jumper
should have an easily visible quick connect to facilitate detaching and attaching the panel or
door. See Figure 15.
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Figure 15 – Illustration of a bond connection from a cabinet to the cabinet door
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7.8 Supplementary bonding networks
The supplementary bonding network is in addition to the infrastructure bonding network speci-
fied in clause 6. The supplementary bonding network provides for a greater degree of equipo-
tential bonding to that provided by the required bonding conductors. Supplementary bonding
networks are always bonded to the CBN within the building. Equipotential bonding may help mit-
igate issues caused by steady-state and transient voltages and currents generated by lightning,
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lightning) from flowing within the CBN and then entering and traversing through the IBN.
This topology is especially robust to transients occurring in the CBN.
c) Star IBN – An IBN deployed into a star network instead of a mesh network.
7.8.1 Mesh-BN
A mesh-BN is a bonding network to which all associated equipment cabinets, frames and racks
and cabling pathways are bonded together as well as at multiple points to the CBN (see figure
16).
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Figure 16 – A mesh-BN with equipment cabinets, frames, racks and CBN bonded
together
If the mesh-BN is constructed from flat conductors, the mesh-BN should be prefabricated of
minimum 0.4 mm (0.0159 in; 26 gauge) x 50 mm (2 in) wide copper strips with all crossings and
joined sections properly welded.
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Where the mesh-BN is constructed from bare round wire, the conductors shall be a minimum
sized conductor of 6 AWG copper conductors joined together via exothermic welding, brazing,
listed compression connectors, or listed grounding clamps at each of the crossing points.
If the mesh-BN is constructed using the access-floor pedestals, the flooring system shall be
electrically continuous. The mesh-BN shall be bonded together no further than every 3.7 m (12
ft) (approximately 6 pedestals) in each direction using a minimum sized conductor of 6 AWG
copper and listed pedestal grounding clamps. Bonding is recommended at least every 2.4 m (8
ft) (approximately 4 pedestals) in every direction.
The mesh-BN shall have the following connections:
a) 6 AWG or larger bonding conductor to the PBB or SBB in the computer room:
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b) 6 AWG or larger bonding conductor to each ITE cabinet and rack – cabinets and racks
shall not be bonded serially;
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c) A bonding conductor to the ground bus for each power distribution unit (PDU) or panel
board serving the room, sized per NEC 250.122 and per manufacturers’ recommenda-
tions;
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d) 6 AWG or larger bonding conductor to heating, ventilating, and air-conditioning (HVAC)
equipment – Each piece of HVAC equipment shall be bonded individually to the mesh-
BN;
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e) 6 AWG or larger bonding conductor to each structural metal column in the computer
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room;
f) 6 AWG or larger bonding conductor to each metallic cable tray and cable runway in the
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room – they may be bonded in series;
g) 6 AWG or larger bonding conductor to each metallic conduit, water pipe, metallic air duct
in the room – they may be bonded in series;
h) 6 AWG or larger bonding conductor to every 4 to 6 access floor pedestal in each direc-
tion.
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7.8.2 Mesh-IBN
A mesh-IBN is a mesh-topology bonding network that has a SPC to either the CBN or another
IBN (see figure 17). The mesh-IBN is typically limited to a restricted area within a building such
as in a computer room. The mesh-IBN is not typical (but can be utilized) for a commercial envi-
ronment or computer room but is recognized and sometimes utilized in the access provider cen-
tral office and computer room. The primary benefit of the IBN is the blocking of building currents,
such as lightning and power faults, from entering into the IBN.
NOTE – Other topological versions of IBNs (such as “star” and “sparse-mesh”)
are described in ITU-T K.27 and IEEE 1100.
The mesh-IBN components such as associated equipment cabinets, frames, racks and cabling
pathways are insulated from the CBN except for one controlled SPC location to the CBN. The
SPC location applies to all bonding conductors (including power circuits) entering or exiting the
mesh-IBN. Due to isolation from the CBN, except at the controlled SPC, the mesh-IBN is said to
be “isolated” from the CBN.
For a mesh-IBN, an under-access-floor, the SBG is typically only directly connected to the serv-
ing PBB or SBB in order to not violate the isolation requirements for the mesh-IBN. An above
cabinet/rack SBG can be more easily incorporated where desirable into the mesh-IBN by means
of insulating devices between the bonding grid and any nearby CBN components.
31
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To PBB or SBB
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Figure 17 – A mesh-IBN having a single point of connection
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Bonding conductors used to bond components to the supplementary bonding network shall:
a) be copper conductors;
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b) be neatly routed in as straight a line as practical and be no longer than required to bond
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the component to the supplementary bonding network;
c) be secured at no greater than 0.9 m (3 ft) intervals;
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d) not be routed so as to create a tripping hazard or impair access to equipment;
e) not be attached with any method that could damage the conductors;
f) be listed as suitable for bonding/grounding applications;
g) as available for use in space in which they will be placed, have a green jacket or green
jacket with yellow stripe, or where bare conductors are deployed, they shall be support-
ed by standoff insulators at intervals no greater than 0.6 m (2 ft) or be contained in elec-
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trical non-metallic tubing (ENT). Bare bonding conductors shall not be in contact with
metallic surfaces that are not part of the telecommunications bonding system;
h) be installed using low-emission listed exothermic welds, where exothermic welds are
specified and within a room with electronics; and,
i) where placed in ferrous metallic conduit that is greater than 0.9 m (3 ft), be bonded to
each end of the conduit using a grounding bushing or with a minimum 6 AWG conductor.
7.9 Administration
Each telecommunications bonding conductor shall be labeled at its points of termination. Labels
shall be located on conductors as close as practical to their points of termination in a readable
position. Refer to ANSI/TIA-606-B for additional labeling requirements.
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8 EXTERNAL GROUNDING
one additional grounding electrode. One should take into account the soil resistance due to
seasonal fluctuations. It is recommended to use two grounding electrodes as the minimum in-
stallation, even if 25 ohms is achieved with a single grounding electrode.
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8.1.2 Enhanced requirements
The grounding electrode system for sites that are critical in nature (e.g., public safety facilities,
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military installations, data centers, web hosting facilities, central offices) shall be designed to
have a resistance of 10 ohms or less, preferably 5 ohms or less. The grounding electrode sys-
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tem design should take into account seasonal fluctuations such as moisture and temperature.
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8.2 Grounding electrode system design
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8.2.1 General
A telecommunications grounding electrode system is supplemental and connected to the struc-
ture’s electrical grounding electrode system. Whereas the primary purpose of the electrical
grounding electrode system is safety, the telecommunication’s grounding electrode system is
intended to provide enhanced equipment protection and system performance.
Adequate design measures should be taken to obtain a low resistance grounding electrode sys-
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tem. Poor soil conditions or limited space may make this difficult to achieve. Potential equaliza-
tion is of greater importance than low resistance. Proper design methods should focus on estab-
lishing an equal potential ground plane, which has the lowest practicable ground resistance.
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most common means of designing grounding electrode systems due to their ability to model soil
conditions in detail.
c) located at least 1 m (3 ft) from the building wall, preferably beyond the drip line; and
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d) located no more than 2 m (6 ft) from the building wall.
Ground rods used in conjunction with the building perimeter ground loop shall be listed, at least
3 m (10 ft) in length, and at least 16 mm (0.625 in) nominal in diameter. Ground rod spacing be-
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tween any two ground rods should be at least the sum of their driven lengths.
The ground loop shall be connected to steel columns around the perimeter of the structure at
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intervals averaging not more than 18 m (60 ft).
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Where separately derived electrical systems are present, they should be bonded to the same
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ground ring electrode.
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Test wells should be provided to give access to the ground loop for future ground testing pur-
poses.
and area will be the determining factor when choosing the configuration. Ground rods are the
most common form of electrode because they can be driven into the earth with limited excava-
tion and backfilling. However, there are also different types of electrodes that can lower the re-
sistivity of the grounding electrode system such as electrolytic ground rods and low resistance
backfill material. It is common to combine these different options, depending upon the soil con-
ditions, in an electrode system installation. See Annex B for details related to the different types
of electrodes available. Annex C provides grounding details specific to towers and antennas.
Regardless of the grounding design configuration, all grounding electrodes for a given facility
shall be bonded into a single grounding electrode system. In addition, underground metallic pip-
ing within 2 m (6 ft) of the building perimeter shall be bonded to the grounding electrode system.
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milliammeter.
Prior to two-point ground testing, a visual inspection shall be performed to verify that the bond-
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ing system is installed according to the guidelines in this Standard. Due to the possibilities of
ground faults traveling through the telecommunications bonding system, a voltage test should
be performed prior to conducting the two-point continuity test and verified with the test equip-
ment manufacturer’s instructions. Consult with other contractors to ensure other electrical work
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does not interfere with this test.
The test is typically performed by connecting one test lead to the nearest building’s electrical
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grounding electrode and the other test lead to a specific point on the telecommunications bond-
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ing system such as the PBB. This same test can also verify continuity between any two points of
the telecommunications bonding system such as between the PBB and a SBB.
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It is recommended that this test be performed in the following areas:
a) PBB/SBB to the electrical ground in Distributors
b) PBB/SBB to the structural metal (if present)
c) PBB to SBB
d) Structural metal (if present) to the electrical ground.
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In order for this test to be valid it should be done before the telecommunications equipment is
installed otherwise parallel paths may invalidate test results.
The recommended maximum value for resistance between any point in the telecommunications
bonding system and the building’s electrical grounding electrode system is 100 milliohms. In the
case of long TBB and BBC conductor runs, the resistance of the conductor shall be factored into
the total resistance. For example 1 km of a 3/0 AWG conductor has a resistance of
0.2028 ohms. (0.06180 ohms per 1000 ft).
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ground) until the measured values remain fairly constant when repositioning the inner stake
(probe).
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Table 2 – Stake distance
Depth of ground electrode Distance to inner stake Distance to the outer stake
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2m 15 m 25 m
t 3m 20 m 30 m
6m 25 m 40 m
op 10 m 30 m 50 m
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b) to measure soil resistivity (electrical conductivity properties of the soil); this requires the
use of a four-terminal tester (see 9.3.2);
c) to test any complex ground system where a metallic loop exists; test current will return
through metal and not be forced into the soil. These include systems such as ring
grounds, counterpoise, substation grounds, and various other multiple interconnected
ground systems; and
d) to perform any test where a client or third party require conformance to a reference
standard; the clamp-on test method has not been incorporated into any independent
standard.
Before taking a clamp-on ground resistance measurement, ensure that the meter is calibrated.
Once calibrated, attach the clamp to the electrode to be measured and read the ground re-
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9.3 Soil resistivity testing
9.3.1 General
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Soil resistivity testing measures a volume of soil to determine its conductivity. The soil composi-
tion, moisture content, and temperature affect soil resistivity. Additionally, the resistivity of the
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soil will vary geographically, and at different soil depths.
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There are several testing methods that can be utilized to measure soil resistivity from taking soil
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samples for lab testing to a number of different methods that provide the best indication of con-
ditions at the site. The most common method utilized for measuring soil resistivity is the four-
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point method using the equally spaced Wenner arrangement.
9.3.2.1 General
The manufacturer’s instructions shall be followed when using the four-point test instrument
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when making a soil resistivity measurement. The test instrument uses four terminals to make
this measurement. Four stakes are driven into the earth, all at depth B and spaced (in a straight
line) at equal distance intervals A. The test current I is passed between the two outer stakes (C1
and C2), and the potential V is measured between the two inner stakes (P1 and P2). The re-
sistance can then be calculated using Ohm’s law. Figure 19 shows an example of the four-point
method.
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Second location
Fifth location
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Fourth location
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Figure 20 – Example of multiple test locations
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be used to produce welded connections of copper to copper and copper to steel. The advantage
of exothermic connections over compression and mechanical connections is that exothermic
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connections produce a molecular bond with all the strands of the conductors, while compression
or mechanical connectors do not. All underground connections are made following manufacturer
recommendations with the exothermic welding process that use the proper mold and weld metal
materials.
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A listed irreversible compression connection is made by using specific fittings and a high ton-
nage compression tool. These connections are considered maintenance free; however they
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may not be when used underground. When making a listed irreversible compression connec-
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tion, all surfaces should be properly cleaned and the components properly sized for the conduc-
tors being bonded.
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Mechanical connections are only to be used above ground and in areas where it is impractical
to use either an exothermic or irreversible high compression connection. When making a me-
chanical connection, all surfaces should be properly cleaned and the components tightened to
the correct torque rating of the hardware. Additionally, the correct material is used so as not to
form a galvanic couple.
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B.1 General
Grounding electrodes connect electrical systems and equipment to earth. Grounding electrodes
may be ground rods, metal plates, concrete encased electrodes, ground rings, electrolytic
ground rods, the metal frame of the building or structure, and metal underground water pipes.
Metallic underground gas piping is not used as a grounding electrode, but is bonded on the cus-
tomer side of the meter (see NFPA-70 [NEC] and NFPA-780).
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Ground rods should be constructed from copper clad steel, solid copper, hot-dipped galvanized
steel or stainless steel and be listed by a nationally recognized testing laboratory (NRTL). The
rods should be a minimum of 2.4 m (8 ft) in length and 12.7 mm (0.5 in) in diameter. For areas
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highly prone to lightning, a minimum rod length of 3 m (10 ft) should be used. Ground rods
should not have a non-conductive coating. Typical ground rods are illustrated in figure 22.
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25 000 ohms-cm), areas with limited space or areas where the grounding electrode system is
covered by non-porous materials such as concrete or asphalt. In all cases, manufacturer rec-
ommendations should be followed when installing electrolytic ground rods.
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Breather holes
Covered
Finished test well Exothermic connection
grade
t Finished
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Breather grade 2 AWG minimum
copper conductor
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holes
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12.7 mm (0.5 in)
steel reinforcing bar
(typical)
t 6 m (20 ft)
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minimum
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Side view End view
such as 1/0 AWG or larger should be considered. Stranded conductors should be used with
these larger sizes; tinned conductors are recommended.
Ground ring electrodes may also incorporate the use of driven ground rods.
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9 m (30 ft) mimimum
between tower and
t building (preferred)
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Figure 26 – Illustrative example of ground enhancement materials surrounding a ground-
ing conductor and a ground rods
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B.10 Grounding conductors
Grounding conductors are used to connect equipment or the grounded circuit of a wiring system
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to a grounding electrode or a grounding electrode system. These conductors should connect
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grounding electrodes together, form buried ground rings and connect objects to the grounding
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electrode system. Grounding conductors may be solid, stranded, tinned, or un-tinned and may
be bare or insulated. Above ground conductors should be jacketed with green or green with yel-
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low striping insulation.
Unless otherwise stated, all below-ground ground electrode conductors should be a bare solid
copper conductor not smaller than 2 AWG. Bare stranded copper conductor not smaller than
1/0 AWG, tinned conductors is recommended.
When installing grounding electrode conductors, they should be installed in one continuous
length without splices unless using listed exothermic connections or listed irreversible compres-
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sion-type connectors. The conductor runs should be as short and straight as practical. Bends in
the conductor should be made toward the ground location. See 7.5.2 for information on mini-
mum bend radii and included angles.
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C.1 General
This clause describes specific electrical protection considerations for antenna support structures
(towers).
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Figure 27 illustrates an example view of a tower and antenna site grounding electrode system.
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other telecommunications cables enter the building or shelter. It is connected directly to the
grounding electrode system using 2 AWG or larger bare, solid or stranded, tinned or un-tinned
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copper conductor. This conductor is installed in a direct manner with no sharp bends or narrow
loops. Larger conductor sizes such as 4/0 AWG are recommended in high lightning prone are-
as. Connection of the grounding electrode conductor to the external bonding busbar is by a
listed exothermic connection or listed irreversible compression connection.
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The tower bonding busbar is installed below the transmission line ground kits, near the area of
the tower at the point where the antenna transmission lines extend from the tower to the build-
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ing or shelter. It is connected to the tower grounding electrode system with a 2 AWG or larger
bare, solid tinned copper conductor. For reduced impedance to earth, the tower bonding busbar
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is directly bonded to the tower, thereby utilizing the tower as the down conductor. Care is also
taken to select the proper materials so as to prevent a dissimilar metal reaction. To maintain
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equal potential between the transmission lines and the tower, busbars are installed at the top
and bottom of the tower, providing termination points for bonding the transmission lines cable
shields to the tower. If the tower is greater than 60 m (200 ft) in height, busbars are installed
every 15 m (50 ft), they are bonded to the tower and to the transmission line cable shields.
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Figure 28 – Illustration of a parallel ground rod installation
Type 2 sites may have a tower on the site, may have a telecommunications dispatch center,
may have a base station/repeater site, and may be critical to public safety or on a military instal-
lation. Type 2 sites should have a grounding system resistance of 5 ohms or less.
NOTE – Equal-potential bonding and grounding is the most important considera-
tion when designing a grounding electrode system to protect against lightning
events.
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These are free-standing structures with upright support members (legs) mounted on a
foundation or pier that need no other supporting elements.
c) Wooden structures (poles)
These are either free-standing or guyed structures either mounted on a foundation or
partially buried.
The tower ground ring conductor should be a bare tinned or untinned copper conductors, mini-
mum 2 AWG, that is buried to a depth at least 0.75 m (2.5 ft) or 150 mm (6 in) below the frost
line, whichever is deeper. It should be installed at least 0.6 m (2 ft) away from the tower base or
footing using at least two ground rods, 2.4 m (8 ft) minimum length and 16 mm (0.625 in) diame-
ter, driven to a depth of not less than 3 m (10 ft) below the depth of the tower ground ring and
attached to the ground ring using a listed exothermic weld. The ground rods should be made
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from copper, copper clad steel, stainless steel or galvanized steel and be listed for the purpose.
The ground rods should be located at opposite ends of the ground ring. The tower ground ring
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should bonded to the equipment building/cabinet ground ring in at least two points using the
same size conductor and buried to the same depth as the tower and equipment building/cabinet
ground ring. The tower’s support piers (concrete footings) should have the reinforcing steel elec-
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trically connected to the tower holding bolts.
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A ground rod should be installed at each anchor point and connected to each guy wire using
materials that help prevent the formation of a galvanic couple (See figure 30).
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the tower ground ring. These conductors should be installed to be as short and straight as prac-
tical. The connections to the tower should be made with listed exothermic connections unless
specifically directed otherwise by the tower manufacturer. The connections to the ground ring
should be made with listed exothermic connections or listed irreversible high compression con-
nectors (see figure 31).
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2 AWG minimum
bare copper wire
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Ground kits
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Ground
rods
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b) The conduit from the weatherhead to the power meter should be at least 6 m (20 ft) long.
This aids the operation of the power arrester at the weatherhead (poles).
at least 0.9 m (3 ft) away from the building. Ground rods, 2.4 m (8 ft) minimum length and
16 mm (0.625 in) diameter should be driven to a depth of not less than 3 m (10 ft) below the
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depth of the ground ring and attached using listed exothermic connections or listed irreversible
compression connections. These ground rods should be constructed per B.2. There should be a
minimum of four grounding rods located at each corner of the building/shelter or outdoor cabi-
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net. The building/shelter and outdoor cabinet ground ring should be bonded to the tower ground
ring in at least two points using the same size conductor and buried to the same depth as the
tower and equipment building/cabinet ground ring. Also, the building’s foundation (concrete foot-
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ings) should have the reinforcing steel electrically connected to the building ground ring.
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d) connect:
1) antenna metal members to the tower or antenna support structure;
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2) antenna support structure to ring;
3) lightning protection system perimeter conductors;
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4) ring to any other metallic object on the roof within flashover range.
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NOTE – Coordinate the lightning protection system of the building and the
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grounding system for the tower.
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See figure 34, figure 35, and figure 36 for examples of rooftop site grounding systems
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To PBB
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Electrical service
Ground rods
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Electrical
service
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2 AWG minimum bare Ground rods
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Copper conductor
50 mm (2 in) strap
recommended
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conductor. Once inside the building, the waveguide or coaxial cable shield should be bonded to
the building’s interior grounding electrode system, using a minimum. 2 AWG conductor, as close
as practical to the entrance.
If there is a metallic waveguide or coaxial cable entrance plate, the entrance plate should be
bonded to both the exterior and interior grounding system with a minimum 2 AWG conductor.
The waveguide or coaxial cable shield should be bonded to the metallic entrance plate on both
the outside and inside of the building with a minimum 2 AWG conductor.
The coaxial cable should be protected by a lightning surge arrester, which is bonded to the exte-
rior grounding electrode system with the proper size grounding conductor specified by the man-
ufacturer.
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If the tower is lighted, the conduit for the lighting power conductors should be bonded to ground
as described for waveguide and coaxial cable shields.
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C.2.8 Ancillary objects requiring bonding and grounding
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If there is a metal fence within 1.8 m (6 ft) of the building, the building ground ring should be
bonded to the fence with a minimum 2 AWG solid bare copper conductor. Similar rules apply for
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bonding a monopole or satellite-mounting ground ring to the equipment building ground ring or
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fence (see figure 37 and figure 38).
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Bonded at
Tower ground all corner
ring fence posts
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Tower
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Metallic Bonding
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Communication External
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site ground
ring
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Fence fabric bonding clamp
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Soft drawn tinned solid
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copper conductor bonding
fence fabric to ground
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Figure 38 – Illustrative view of a fence fabric and deterrent wiring bonding example
C.2.8.2 Generators
Generators installed outside and within 1.8 m (6 ft) of the structure should be bonded to the
nearest point on the building's grounding electrode system using a minimum 6 AWG copper
conductor, see figure 39. If this conductor is placed underground, then the minimum conductor
size shall be 2 AWG or larger.
Generators installed more than 1.8 m (6 ft) away from the structure shall have a ground rod
driven near the generator and bonded to the generator and to the building's grounding electrode
system using a 2 AWG or larger bare, solid, tinned or un-tinned copper conductor
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Figure 39 – Illustrative view of a generator grounding example
C.2.9.1 Components
C.2.9.2 Installation
Radio equipment buildings with nonmetallic walls should have an interior ground ring consisting
of a minimum 2 AWG conductor mounted, with nonmetallic connections, to the interior wall with-
in 0.3 m (1 ft) of the ceiling.
Radio equipment buildings with metallic walls should have an interior ground ring consisting of a
minimum 2 AWG conductor mounted directly to the interior wall within 0.3 m (1 ft) of the ceiling.
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persons and property from the effects of these disturbances, primary telecommunications elec-
trical protection is placed at the telecommunications entrance to the building or structure by the
network telecommunications utility access provider. The National Electrical Code (NEC) speci-
fies the minimum primary protection requirements, and states that “the primary protector shall
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be located in, on or immediately adjacent to the structure or building served and as close as
practical to the point at which the exposed conductors enter or attach.” The network telecom-
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munications utilities, in addition to conforming to the NEC requirements, also provide primary
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telecommunications electrical protection where they deem their network plant potentially ex-
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posed to lightning or commercial ac power disturbances. An exception to this may be in urban
areas where tall, steel-framed buildings may provide shielding from lightning, the large mass of
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underground metallic structures dissipates lightning energy, and power conductors are placed
underground in conduit separate from telecommunications conductors. In such areas, primary
telecommunications electrical protection is generally not necessary as there may be limited
lightning or power exposure.
A critical consideration when placing the primary protector is the length of the primary protector
grounding conductor. The primary protector grounding conductor provides the grounding path
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between the primary protector ground terminal and the building or structure power grounding
electrode system. During a lightning event to the network telecommunications plant, substantial
voltages can be developed in the primary protector grounding conductor. The magnitude of the
voltage is dependent both on the waveshape of the disturbance and the impedance of the
grounding conductor which is directly proportional to conductor length. For this reason, network
telecommunications utility practices recommend:
a) locating the telecommunications entrance as close as practicable to the power entrance
to minimize the length of the primary protector grounding conductor. The NEC empha-
sizes this by requiring a means for intersystem bonding between power and other sys-
tems, such as telecommunications systems.
b) placing the primary protector to allow for the shortest and most direct routing of the pri-
mary protector grounding conductor.
While the telecommunications network is only one means by which lightning voltages can be
introduced into a building or structure (power phase conductors, the power neutral conductor,
and a strike to the building itself are others), consideration should also be given to providing
surge protection devices at the electrical entrance and direct strike lightning protection to the
facility. The requirements for and the need to provide this broader protection is contained in
NFPA-780.
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Maximum effort should be made to keep the primary protector grounding conductor as short as
practical. This may be accomplished by locating the primary protector in close proximity to the
power service entrance at the building or structure. In addition to the primary protector ground-
ing conductor, the overall conductor path between the primary protector and the power service
ground should be kept as short as practical. This path may include the telecommunications
bonding conductor (TBC) as illustrated in figure 3 and figure 5 of this Standard. The length of
the TBC may be minimized by locating the primary bonding busbar (PBB) as close as practica-
ble to the electrical entrance facility.
Requirements for telecommunications electrical protection, bonding and grounding at building or
structure entrances are contained in the NEC, Chapter 8. Additional detailed electrical protec-
tion, bonding and grounding considerations and criteria are contained in ATIS 0600318. The
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reader is directed to these documents for guidance regarding the primary protector, and the
placement, routing, and length of the primary protector grounding conductor.
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Consideration should be given to installing secondary protectors and data and fire alarm protec-
tors.
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interface equipment, other electronic equipment such as a computer keyboard and video display
terminal, and the work station furniture. Frequently, workstations are arranged in clusters con-
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sisting of several positions. These positions are typically used at reservation bureaus, telemar-
keting agencies, and such.
Operator-type equipment positions (workstations) should be bonded to ground in accordance
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with ATIS 0600321.
Electrical disturbances may appear at operator-type equipment positions arising either from
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electrostatic discharge (ESD), or from sources that are internal or external to the building such
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as lightning or alternating current (ac) power disturbances.
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ATIS 0600321 covers new installations of network operator-type equipment positions in which
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personnel are required to access a computer terminal keyboard while continually wearing a
headset. This standard presents measures that are intended to help control ESD in the network
operator-type environment. ATIS 0600321 also presents additional measures that are intended
to help minimize the effects of lightning, surges from commercial alternating current (ac) power
lines, and power switching operations, both at the facility (building) level and at the network op-
erator-type equipment position. These measures provide for equipotential bonding and ground-
ing at the telecommunications entrance facility (TEF) and the power entrance facility, as well as
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for equipotential bonding and grounding, where necessary, and electrical protection at the net-
work operator-type equipment positions. Although ATIS 0600321 deals specifically with network
locations, the measures outlined in the standard are applicable to non-network installations, as
well as at existing installations.
The electrical protection measures included in ATIS 0600321 are intended to minimize potential
differences at the network operator-type equipment position (work station) but are not intended
to guarantee against damage or injury that may result from ESD or other similar occurrences.
Refer to figure 40.
General electrical safety and protection requirements that may be applied to work areas are
contained in the NEC.
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Position
bonding
terminal
Processor/controller
Distributor
room
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Equipment
Headset intergace
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SBB
Telecommunications
bonding backbone (TBB) External secondary
protector
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Electrical
entrance
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facility entrance facility (TEF)
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Bond to structural metal
Equipment
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Bond to furniture
Primary bonding
busbar (PBB)
Grounding
Electrode
Conductor
Telecommunications LEGEND
bonding conductor
Grounding (TBC) Structural
Panelboard
electrode metal
system
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building principal ground (BPG)
CO GRD Bus
COG
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facility ground
main earthing terminal (MET)
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master ground bar (MGB)
primary bonding busbar (PBB)
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OPGPB
PGP bus
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principal ground point (PGP)
reference point 0 (RP0)
telecommunications main grounding busbar (TMGB)1
zero potential reference point
rack bonding busbar rack grounding busbar1
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The organizations listed below can be contacted to obtain referenced information:
ANSI
American National Standards Institute
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25 W 43rd St, 4th Floor
New York, NY 10036
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USA
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(212) 642-4900
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www.ansi.org
ATIS
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Alliance for Telecommunications Industry Solutions
1200 G Street, NW
Suite 500
Washington, DC 20005
USA
(202) 628-6380
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www.atis.org
BICSI
BICSI
8610 Hidden River Pkwy
Tampa, FL 33637
USA
(813) 979-1991
www.bicsi.org
FIPS
Federal Information Processing Standards Publications
National Institute of Standards and Technology (NIST)
Information Technology Laboratory
100 Bureau Dr, M/S 8900
Gaithersburg, MD 20899-8900
USA
(301) 975-2900
http://www.itl.nist.gov/fipspubs/
70
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IEC
International Electrotechnical Commission
3, rue de Varembe
PO Box 131
1211 Geneva 20
Switzerland
+41 22 919 02 11
www.iec.ch
IEEE
IEEE
445 Hoes Ln
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Piscataway, NJ 08854-4141
USA
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(732) 981-0060
www.ieee.org
ISO
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International Organization for Standards
1, ch. de la Voie-Creuse
CP 56
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CH-1211 Geneva 20
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Switzerland
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+41 22 749 01 11
www.iso.org
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ITU
International Telecommunication Union
Place des Nations
1211 Geneva 20
Switzerland
+41 22 730 5111
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www.itu.int
MIL
Department of Defense
Defense Standardization Program
8725 John J Kingman Rd
Stop 5100
Fort Belvoir, VA 22060-6220
USA
(703) 767-6888
www.dsp.dla.mil
NECA
National Electrical Contractors Association
3 Bethesda Metro Center
Suite 1100
Bethesda, MD 20814
USA
(301) 657-3110
www.necanet.org
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NFPA
National Fire Protection Association
1 Batterymarch Park
Quincy, MA 02169-7471
USA
(617) 770-3000
www.nfpa.org
TIA
Telecommunications Industry Association
1320 N Courthouse Rd
Suite 200
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Arlington, VA 22201
USA
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(703) 907-7700
www.tiaonline.org
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THE TELECOMMUNICATIONS INDUSTRY ASSOCIATION
TIA represents the global information and communications technology (ICT)
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industry through standards development, advocacy, tradeshows, business
opportunities, market intelligence and world-wide environmental
regulatory analysis. Since 1924, TIA has been enhancing the
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business environment for broadband, wireless, information
technology, cable, satellite, and unified communications.
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TIA members’ products and services empower communications
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in every industry and market, including healthcare, education,
security, public safety, transportation, government, the utilities.
TIA is accredited by the American National Standards Institute (ANSI).
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