48 4 18 981 W RR, Had Schmidt's approach boon used fr fn eeieny, m= JIRTIB = 2074"? r4= 002-0025 m 2 [(Dyy(OD) ~1} [1 + 03$ ineDy(OD3]~ 1.248 nz) ne the same a given by Figures Contact Resistance. Fins can be extruded from the prime sur- face (e.g, short fins on tubes in looded evaporators or water-cooled condensers) or can be fabricated separately, sometimes of w dffer- ent material, and bonded othe prime surface. Metallurgical bonds are achieved by furmace-brazing,dip-brazing, or soldering; nonme- tallic bonding materials, such’ as epoxy resin, are also used Mechanical bonds are obtained by tension-winding fins around tubes (spiral fis) or expanding the tubes into the fins (plate fi). Meuliurgical bonding, properly done, leaves negligible thermal resistance at the joint but is not always economical. Contact resi tance of a mechanical bond may or may not be negligible, depend ing on the application, quality of manufacture, materials, and temperatures involved. Tesis of plate-fin coils with expanded tubes indicate that substantial losses in performance can oceur with fins thst have cracked collars, but negligible contact resistence was ound in coils with continuous collars and properly expanded wes (Dar 1959) ‘Conaet resistance at an interface between wo solids is largely a fanetion of the surface properties ard characteristics of the solids, ‘contact pressure, and fluid in the imerface, if any, Eckels (1977), ‘modeled the influence of fin density fin thickness, and tube diameter ‘on contact pressure and compared it to data for wet and dry coil Shlykov (1964) showed thatthe range of attainable contact resis ‘tances is lage. Sonokama (1964) presented data on the effects of ‘contet pressure, surface roughness, hardness, void material, andthe pressure ofthe gas inthe voids, Lewis and Sauer (1965) showed the Tesistanee of adhesive bonds, end Clausing (1964) and Kaspareck (1964) gave data on the contact resistance in a vacuum environment. ‘Transient Conduction (Often, het transfer and temperature distribution under transient (Ge, varying with time) conditions must be known. Examples are (1) eold’storage temperature variations on starting or stopping @ refrigeration unit, 2) variation of external air temperature and solar ieradiation afecting the heat load of celd-storage room of wall temperatures, (3) the time required to freeze a given material under ceritin conditions in a storage room, (4) quick-freezing objects by slirect immersion in brines, and (5) sudden heating or cooling of ue ids and solids from one temperature to another, Lumped Mass Analysis. Often, the temperature within a mass ‘of material ean be assumed to vary with ime but Be uniform within the mass, Examples include a wel-sired fui in a thin-walled con~ tainer, or a thin metal plate with high thermal conductivity. In both ‘cases, ifthe mass is heated or cooled a its surface, the temperature ‘ean be assumed to bea function of time only and net location within, the body. Such an approximation is valid if YA) Bi where BL Biot number 21> sure hoa wansor coecient V = materia’ volume 2009 ASHRAE Handbook—Fundamentals (SI) 4, ~ surface area expos to converive andlor radiative heat reser ~ maerlals thermal conductivity ‘The temperature is given by a Me, 2) where 1M = body mass p= specific heat ‘ge = ieraal bot generation dha ~ et het irate rte to substance (into substance is poiive, {td tof substance is nest) Equation (12) applies to liquids and solids. Ifthe material is a gas ‘being heeted oF cooled at constant volume, replace ¢, with the constantvolume specific heat c,. The term daa May include heat transfer by conduction, convection, or radiation andis the difference ‘between the het transfer rates into and out of the body. The term ‘en May include a chemical reaction (eg. curing concrete) or heat _Seneration ftom a current passing through a metal Fort luriped mass initially a uniform temperature f thats suddenly exposed fo an environment at a different temperature i, the time taken forthe temperature ofthe mass to change to is given by the solution of Equation (12) as a3) where 1M ~ mass of solid p= specific heat of solid A> Satie sea oF sold T= sorfce beat ane coeficient ‘c= tne gute for temperaure change Ij Sn soi temperate (> iia uniform soli temperate 12 ~ soroundig fui temperature [Example 4. A copper sphere with diameter d= | mm is t0 be used a8 & ‘setsing element fora hermosa Is nly at uniform temperature lofi" 21°C. Iris then exposed tothe surounding at at fg" 20°C. The ‘ontbined best ransfereoeficien sh 60 W/m"). Detarmine the Sime taken for the temperature of the sensing eleiem 9 reach ip= 205°C. The popes of copper awe ° 85.1(k8-K) Solution: Bi = A(42) ~ 6035(0.001/2)401 = 7.5 x 10°, which is ‘ch es than 1. Therefore, humped analysis vali (42993) = 4.677 «104 kg Arado 3.142% 10m 933 kon = 401 Wilek) ‘Using Eguason (13,1 = 6.6 Nonlumped Analysis. When the Bio: number is greater than 0.1, variation of temperature wth location within the mass i significant. ‘One example is the cooling ime of meats ina refrigerated space: the ‘meat's size and conductivity do not allow ito be treated asa lumped, ‘mass that cools uniformly. Nonlumped problems require solving ‘multidimensional paril differential equations, Many common cases have been solved and presented in graphical forms (J2ko® 1949, 1957; Myers 1971; Schneider 1964). In other cases, numeri- cal methods (Croft and Lilley 1977; Patankar 1980) mast be used. Estimating Cooling Times for One-Dimensional Geometries ‘When a slab of thickness 21 or solid eylinder or solid sphere with ‘outer radius ry is iitlly at uniform temperature, ands surface is suddenly heated or cooled by convection witha fluid at‘, amath- ‘ematical solution is available for the temperature ra a function of