AIM Tech-Sheet

Solder Paste Handling Guidelines

Introduction
A surprising amount of SMT defects occur before the solder paste is taken out of its
packaging. Many of the problems encountered while using solder paste may be attributed to
the methods by which the paste is transported, received, stored and applied.

Solder paste is a combination of pre-alloyed spherical metal powder and flux medium.
Solder paste formulations are designed with specific characteristics of tack time, stencil life,
and rheology (flow characteristics). As solder paste ages and is used in production, these
characteristics will change. Handling solder paste properly will preserve the original
characteristics of the solder paste longer, resulting in less paste waste, better process yield,
and lower defect rates.

Environmental Effects on Solder Paste

Solder paste is sensitive to heat and moisture. If exposed to these elements, the life and
performance of the solder paste may be reduced dramatically. Below is a discussion of how
each of these elements may detrimentally affect the life and performance of solder paste.

Excessive Heat
Because solder paste is made of two ingredients with very different densities, it is normal in
some formulations for a bit of flux to separate out of the paste and rise to the top of the
material. If a solder paste is exposed to excessive heat for a prolonged period of time,
however, the separation of the flux medium from the body of the paste may increase
dramatically. This is recognizable when opening a jar of solder paste or viewing the contents
of a container; although it is natural and acceptable for some flux to appear on the surface of
the solder paste, if the paste has become heat damaged a thick deposit of flux will be floating
on top of the paste. If this separation occurs, it will alter the rheological properties of the
paste, very likely resulting in printing defects.

Moisture
Moisture is a contaminant, and is perhaps the most detrimental element that solder paste can
be exposed to. Moisture can cause and increase powder oxidation, which in turn requires
more of the activator to expend itself on cleaning the solder powder and less for cleaning the
components and substrate. This may result in poor or non-wetting. Moisture also causes
slumping that can lead to bridging, may result in solder balling when the paste is reflowed,
can result in flux/solder spatter, and can reduce tack time.

Because all solder pastes are somewhat hygroscopic (having the tendency to absorb
moisture), care should be taken to avoid introducing solder paste to moist environments.
This is especially true of water soluble solder pastes, but also can pertain to no-clean and
RMA type materials.
Transporting Solder Paste
In order to minimize its exposure to the environment and the aforementioned elements,
solder paste transit times should be as short as possible. A next day delivery is common
shipping practice for solder paste. Solder paste should never be allowed to remain in a
warehouse for prolonged periods of time if extreme conditions are to be encountered;
therefore, paste should only be shipped on a Friday if a Saturday delivery can be arranged.

As a protector against excessive heat, solder paste may be shipped in ice packs, dry ice, gel
packs, or other insulating material when hot climates are to be encountered. This normally is
performed at the discretion of the solder paste supplier.

Solder Paste Storage

It is critical that solder paste be received in and stored as soon as it arrives to its final
destination. Solder paste should not remain on the receiving dock where it could be exposed
to excessive heat, humidity, or cold.

It is generally recommended to store solder paste in refrigeration at 40°F/4°C (the typical

temperature for a food-grade refrigerator). In most case, refrigeration doubles the shelf life
of the material as compared to storing it at room temperature. Refrigeration also acts as an
additional protector against unforeseen environmental changes. For example, while it is
acceptable to store solder paste in a room that is climate controlled at 70°F, if the climate
controlled is turned off over the weekend the paste could be exposed to extreme temperatures
and possibly be degraded.

If solder paste is to be stored at room temperature, it is vital that the temperature and
humidity be maintained at an appropriate level. Temperature should not exceed 78°F, with a
relative humidity of less than 80 percent.

Solder Paste Inventory Control

Water soluble solder pastes generally have a refrigerated shelf life of three to six months.
Most no-clean solder pastes have a refrigerated shelf life of six months to one year. Using
these pastes within their respective shelf lives is vital to proper paste performance. If the
paste is used after its shelf life has expired, printing or other process problems as a result of
viscosity changes can occur.

Due to the possibility of solder paste expiration, the use of FIFO (First In, First Out)
inventory management is recommended. The oldest material in stock always should be used
first.

Preparing Solder Paste: Warming

Before solder paste is used, it should be removed from refrigeration and allowed to warm
naturally to ambient temperature. Do not remove any seal, open, or attempt to mix solder
paste until it has warmed completely to room temperature. The typical warming or
stabilization time for solder paste is four to six hours. Though containers may feel warm to
the touch after a period of time, the core temperature of the solder may not be completely
ambient. Do not force warm solder paste, as this may cause flux separation and/or
rheological problems. A simple way to accomplish proper warming is to remove the solder
paste from refrigeration the shift or the night before it will be used.

Preparing Solder Paste: Stirring

Once it has warmed adequately, mix the solder paste lightly and thoroughly in one direction
for one to three minutes by means of a spatula for jars or the self-contained mixing device for
cartridges. This will ensure an even distribution of any separated material throughout the
paste. However, care should be taken not to over-mix the solder paste by stirring it too
vigorously or for too long. This can result in overly shear-thinning the solder paste, which
can result in slumping and/or bridging.

Printer Area Conditions

As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area
should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition,
no air (cool or warm) should blow directly on the top or bottom of the stencil, as this can
cause paste dry-out. It should be noted that some screen printers that run external
environmental controllers might circulate air across the stencil surface. Through simple
modification this air movement across the stencil can be dramatically reduced or eliminated,
which can have a significant impact on the stencil life of the solder paste in use.

Applying Solder Paste to the Stencil

The initial application of solder paste onto the stencil typically is two to three times greater
than applications made during the print cycle. The initial bead of solder paste should be the
full length of the printable pattern on the stencil, in a diameter of approximately 1/2 to 5/8
inch.

During the first few print strokes, the squeegee blades will “load up” with solder paste and
the solder paste will flow out across the length of the squeegee blades, seeking its own level.
After the first three or four boards have been printed, re-check the amount of paste on the
stencil surface and add paste if necessary.

Controlling the level of solder paste on the stencil surface is vital to proper printing. It is
better to add a smaller amount of paste more frequently than to add a large amount of paste
less often. This method of control will ensure a more frequent turnover of paste, while
keeping the freshest possible paste on the stencil. Contrarily, if one was to put a large
amount of solder paste on the stencil in the hopes that it would print all day with no operator
intervention, it is probable that this paste could degrade due to its exposure to the
environment and the printing process and therefore not perform as well as it did initially.

Storing Opened Solder Paste Containers

Once a jar or cartridge has been opened it should not be re-refrigerated. If solder paste
remains in a container that has been opened, simply re-seal the jar or cartridge and leave it
out at room temperature until it is ready to be used again. Re-refrigerating the paste can
cause any moisture that has been absorbed into the paste to condense, which can then result
in the aforementioned moisture-related problems.
 Re-Storing & Re-Using “Used” Solder Paste
Though not a recommended practice, used solder paste from the stencil may be stored in a
container for re-use. This used paste should be applied back onto the stencil along with an
equal amount of fresh paste in order to revitalize the older material. The ratio of fresh-to-
used solder paste will vary in order to achieve a good printing consistency. It is
recommended that small amounts of used paste be added to the stencil throughout the shift or
entire day to minimize any degradation it may cause, and to ensure that all used paste is
consumed prior to cleaning the stencil off for the last time at the close of shift or day. It
should be noted, however, that many companies choose to discard used paste in order to
avoid potential problems; remember, discarding old paste is much less expensive that
unnecessary rework or a field failure.

Do not store used and unused paste in the same container. This can add moisture and/or
other contaminants to the new paste resulting in degraded performance.

Stencil Cleaning
Stencil cleaning cycles depend upon process, material, stencil and environmental conditions.
Some applications may require stencil cleaning one per board, while other may require one
cleaning per day. Basically, however, stencils should be cleaned frequently enough to ensure
total removal of any bottom-side residues and to not allow these residues to dry or cake on.

Although it may clean well, the use of IPA as a stencil cleaner can cause problems. When
IPA contacts the paste to be printed, a foreign substance is introduced into the paste. One
relatively common result of this interaction is solder paste dry-out. The solder paste supplier
should be contacted in order to determine which stencil cleaners are safe to use with their
particular products. Regardless of what is in use, however, use all stencil cleaners in
moderation and be sure to remove any excess cleaner from the stencil, as some cleaners may
leave an oily residue that can inhibit the proper rolling of solder paste during the printing
process.

Exposure to Solder Paste

As a final note, remember that care should be taken to avoid the ingestion of solder paste. It
is always a good idea to wear gloves and gowns while using solder paste, and hands should
be washed in warm, soapy water afterwards.

AIM
Manufacturing and Distribution Worldwide
Americas +1-401-463-5605 • Europe +44-1737-222-258 • Asia-Pacific +852-2649-7183 • info@aimsolder.com • www.aimsolder.com
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is
expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.