Professional Documents
Culture Documents
Features Description: SBOS391 - DECEMBER 2007
Features Description: SBOS391 - DECEMBER 2007
OPA454
SBOS391 – DECEMBER 2007
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerPAD is a trademark of Texas Instruments, Inc.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas Copyright © 2007, Texas Instruments Incorporated
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OPA454
www.ti.com
SBOS391 – DECEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Available Q2, 2008.
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground.
PIN ASSIGNMENTS
DDA PACKAGE DWD PACKAGE(1)
SO-8 PowerPAD HSOP-20 PowerPAD
(TOP VIEW) (TOP VIEW)
have low power dissipation. E/D Com (Enable/Disable Common) 9 12 E/D (Enable/Disable)
V- 10 11 V-
www.ti.com
SBOS391 – DECEMBER 2007
(1) TP is the temperature of the leadframe die pad (exposed thermal pad) of the PowerPAD package.
(2) See typical characteristic curve, Offset Voltage Drift Production Distribution (Figure 14).
(3) Typical range is (V–) + 1.5V to (V+) – 1.5V.
(4) Measured using low-frequency (<10Hz) ±49V square wave. See typical characteristic curve, Current Limit vs Temperature (Figure 24).
www.ti.com
SBOS391 – DECEMBER 2007
www.ti.com
SBOS391 – DECEMBER 2007
+50V
E/D
VOUT
RL
50kW
100VPP
E/D Com
10kHz
-50V
www.ti.com
SBOS391 – DECEMBER 2007
TYPICAL CHARACTERISTICS
At TP = +25°C, VS = ±50V, and RL = 4.8kΩ connected to GND, unless otherwise noted.
VCM = 0V
65
140 VCM = +45V
120
3.6
100k
3.4
Bandwidth (MHz)
3.2 10k
VCM = 0V
3.0
1k
2.8
VCM = 45V
2.6 100
VCM = -45V
2.4
10
2.2
CL = 30pF. 100pF, and 200pF
2.0 1
-75 -50 -25 0 25 50 75 100 125 1 10 100 1k 10k 100k 1M 10M
Exposed Thermal Pad Temperature (°C) Frequency (Hz)
Figure 4. Figure 5.
130 130
VS = ±50V
120 120
110
110 RLOAD = 48kW
AOL (dB)
AOL (dB)
www.ti.com
SBOS391 – DECEMBER 2007
80
VCM = -45V 60
100kHz, CMRR
60
40
40 1.3MHz, CMRR
VCM = +45V
20 20 VCM = +45V
VCM = -45V
0 0
0.001 0.01 0.1 1 10 100 1k 10k -75 -50 -25 0 25 50 75 100 125
Frequency (Hz) Exposed Thermal Pad Temperature (°C)
Figure 8. Figure 9.
100 48
PSRR (dB)
VOUT (V)
80 47
+125°C +85°C +25°C
60 -47
40 -48
20 -49
-55°C
0 -50
1 10 100 1k 10k 100k 1M 0 10 20 30 40 50
Frequency (Hz) IOUT (mA)
Figure 10. Figure 11.
80
Population
60
40
20
0
0 50 100 150 200 250 300 -4000 -3000 -2000 -1000 0 1000 2000 3000 4000
Frequency (kHz) Offset Voltage (mV)
Figure 12. Figure 13.
www.ti.com
SBOS391 – DECEMBER 2007
Population
-0.8
-0.4
-2.0
0
-1.6
-1.2
0.8
1.2
1.6
2.0
0.4
0 1 2 3 4 5 6 7 8 9 10
Offset Voltage Drift (mV/°C) Output Voltage Shift (mV/°C)
Figure 14. Figure 15.
VS = ±50V
Population
50
PowerPAD Attached
0 9in ´ 12in 0.062
Layer Metal PCB FR10
-50
-100
-150
-200
-400
-200
-1000
400
600
800
1000
-800
-600
200
100s/div
3.20
3.15
Population
3.10
IQ (mA)
3.05
3.00
2.95
2.90
3.0
3.1
3.5
3.2
3.8
2.5
2.6
2.7
2.8
2.9
3.4
3.9
3.3
3.6
3.7
www.ti.com
SBOS391 – DECEMBER 2007
3.0
2.8 140
2.6
2.4 120
2.2
2.0 100
-75 -50 -25 0 25 50 75 100 125 -75 -50 -25 0 25 50 75 100 125
Exposed Thermal Pad Temperature (°C) Exposed Thermal Pad Temperature (°C)
Figure 20. Figure 21.
15
10
10
5
IB (pA)
IB (pA)
-5
1 Common-Mode Voltage Range
-10
-15
0.1 -20
-75 -50 -25 0 25 50 75 100 125 -50 -40 -30 -20 -10 0 10 20 30 40 50
Exposed Thermal Pad Temperature (°C) VCM (V)
Figure 22. Figure 23.
7
180 RP = 20kW, IP = 5mA
6
Sourcing
5
VFLAG to V-
ILIMIT (mA)
160
4
RP = 50kW, IP = 2mA
140 3
RP = 100kW, IP = 100mA
2
120 RP = 200kW, IP = 50mA
1
Sinking
100 0
-75 -50 -25 0 25 50 75 100 125 -75 -50 -25 0 25 50 75 100 125
Exposed Thermal Pad Temperature (°C) Exposed Thermal Pad Temperature (°C)
Figure 24. Figure 25.
www.ti.com
SBOS391 – DECEMBER 2007
1.5 14
13
1.0 12
INPUT VOLTAGE NOISE SPECTRAL DENSITY 0.01Hz TO 10Hz INPUT VOLTAGE NOISE
1000
Voltage Noise (nV/ÖHz)
100
5mV/div
10
1
10 100 1k 10k 100k 20s/div
Frequency (Hz)
Figure 28. Figure 29.
0.030 0.0020
THD + N (%)
THD + N (%)
0.025 0.0015
VS = +40.6,
VS = -55, +55 -39.6
0.020 0.0010
VS = -49, +50
0.015 0.0005
0.010 0
10 100 1k 10k 100k 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
Figure 30. Figure 31.
www.ti.com
SBOS391 – DECEMBER 2007
G = +1 G = +1
TC = +60°C TC = +105°C
CLOAD = 50pF CLOAD = 50pF
500mV/div
500mV/div
VCM = +30V VCM = +30V
RF = 10kW RF = 10kW
VOUT VOUT
TC = +25°C
VOUT (400mV/div)
VIN (200mV/div)
TC = -55°C
50mV
G = +2
TC = +100°C G = +1
CLOAD = 100pF CLOAD = 100pF
VIN
VCM = +40V VCM = 0V
VOUT RF = 10kW RF = 0W
TC = +85°C
VOUT (V)
100
0 TC = +125°C
80
-0.5
60
-1.0
RF = 10kW 40
-1.5 CLOAD = 100pF, 125°C 20
VCM = +40V
-2.0 0
1ms/div 0 100 200 300 400 500
CLOAD (pF)
Figure 36. Figure 37.
www.ti.com
SBOS391 – DECEMBER 2007
Gain (dB)
15
TC = +125°C 2
10
0
5
-2
0 RF = 10kW, CF = 50pF
-4
RF = 0W
CL = 50pF
-5 -6
0 100 200 300 400 500 10k 100k 1M 10M
CLOAD (pF) Frequency (Hz)
Figure 38. Figure 39.
4 5 0.02
Gain (dB)
V2 (Noninverting)
VIN (V)
CL = 50pF
2 0 0
0 -5 -0.02
-10 -0.04
-2 CF = 0pF VIN
CF = 2.5pF -15 -0.06
-4
CF = 5pF
-20 -0.08
-6
Time (1ms/div)
10k 100k 1M 10M
Frequency (Hz)
Figure 40. Figure 41.
www.ti.com
SBOS391 – DECEMBER 2007
15 0.06
VIN
4mV/div
VIN (V)
0 0
V2 (Noninverting) Status Flag
-5 -0.02
-10 -0.04
V1 (Inverting)
Enable
-15 -0.06
-20 -0.08
Time (1ms/div) Time (1ms/div)
Figure 42. Figure 43.
OUT
OUT
4mV/div
4mV/div
Enable Enable
0.95
0
0.90
Threshold (V)
-40°C
IENABLE (mA)
-10 0.85
+25°C
+85°C 0.80
-20
0.75
-30 0.70
0 1 2 3 4 5 -75 -50 -25 0 25 50 75 100 125
VENABLE (V) Temperature (°C)
Figure 46. Figure 47.
www.ti.com
SBOS391 – DECEMBER 2007
40 100 40 50
IOUT
VFLAG (V)
VFLAG (V)
IOUT (mA)
IOUT (mA)
30 50 30 0
20 0 20 -50
IOUT
10 -50 10 -100
0 -100 0 -150
RP = 100kW RP = 100kW
-10 -150 -10 -200
10ms/div 10ms/div
Figure 48. Figure 49.
40 50 2ms Pulse
IOUT (mA)
Relay
VOUT (V)
30 0 0.8
20 -50 0.6
0.4
10 -100
0.2
0 -150
RP = 100kW 0
-10 -200 -0.2
10ms/div 10ms/div
Figure 50. Figure 51.
0 0
-0.2 -0.2
-0.4 -0.4
VOUT (V)
VOUT (V)
-0.6 -0.6
-0.8 -0.8
0.988VPP +50V 0.988VPP +50V
-1.0 0.01Hz -1.0 0.01Hz
+125°C +125°C
- -
OPA454 OPA454
-1.2 +85°C + 2Hz
2ms Pulse
-1.2 + 2Hz
2ms Pulse
+85°C
+25°C -50V Mercury -50V Mercury +25°C
-1.4 Wetted -1.4 Wetted
-55°C Relay Relay -55°C
-1.6 -1.6
10ms/div 10ms/div
Figure 52. Figure 53.
(9) The OPA454 was connected to sufficient heatsinking to prevent thermal shutdown.
(10) The OPA454 was connected to sufficient heatsinking to prevent thermal shutdown.
(11) The OPA454 was connected to sufficient heatsinking to prevent thermal shutdown.
www.ti.com
SBOS391 – DECEMBER 2007
REMOVE LOAD
(25mA Source Response) POWER ON
1.6
+125°C RL = 1.8kW V+
1.4 +85°C
+25°C VOUT
1.2
-55°C
1.0 0.988VPP +50V
0.01Hz
- Flag
20V/div
VOUT (V)
OPA454
0.8 + 2Hz
2ms Pulse 0
0.6 -50V Mercury
Wetted
Relay
0.4
Delay in V- is due to
0.2 V-
test equipment.
Power supplies may be
0
applied in any sequence.
-0.2
10ms/div 20ms/div
Figure 54. Figure 55.
POWER OFF
V+ RL = 1.8kW
VOUT
Flag
20V/div
V-
20ms/div
Figure 56.
www.ti.com
SBOS391 – DECEMBER 2007
APPLICATIONS INFORMATION
POWER SUPPLIES
Figure 57 shows the OPA454 connected as a basic
noninverting amplifier. The OPA454 can be used in The OPA454 may be operated from power supplies
virtually any ±5V to ±50V op amp configuration. It is up to ±50V or a total of 100V with excellent
especially useful for supply voltages greater than performance. Most behavior remains unchanged
36V. throughout the full operating voltage range.
Parameters that vary significantly with operating
Power-supply terminals should be bypassed with voltage are shown in the Typical Characteristics.
0.1µF (or greater) capacitors, located near the
power-supply pins. Be sure that the capacitors are Some applications do not require equal positive and
appropriately rated for the power-supply voltage negative output voltage swing. Power-supply voltages
used. do not need to be equal. The OPA454 can operate
with as little as 10V between the supplies and with up
V+ to 100V between the supplies. For example, the
0.1mF IP positive supply could be set to 90V with the negative
V+ supply at –10V, or vice-versa (as long as the total is
less than or equal to 100V).
(1) R2
R1 RP R2 G = 1+
R1 INPUT PROTECTION
V+
Status The OPA454 has increased protection against
-IN Flag damage caused by excessive voltage between op
VOUT
OPA454 VOUT amp input pins or input pin voltages that exceed the
+IN E/D
VIN power supplies; external series resistance is not
E/D Com RL
V-
needed for protection. Internal series JFETs limit
0.1mF input overload current to a non-destructive 4mA, even
with an input differential voltage as large as 120V.
Additionally, the OPA454 has dielectric isolation
V- V- between devices and the substrate. Therefore, the
amplifier is free from the limitations of junction
(1) Pull-up resistor with at least 10µA (choose isolation common to many IC fabrication processes.
RP = 1MΩ with V+ = 50V for IP = 50µA).
Figure 57. Basic Noninverting Amplifier LOWERING OFFSET VOLTAGE AND DRIFT
Configuration The OPA454 can be used with an OPA735 zero-drift
series op amp to create a high-voltage op amp circuit
that has very low input offset temperature drift. This
circuit is shown in Figure 58.
V+
V+ 2nd Stage, +50V
1st Stage, +5V
VOUT 2nd Stage
VOUT 1st Stage
OPA454
OPA735 A2, 2nd Stage RLOAD
A1, 1st Stage 10kW
V-
VG = ±1V VOUT 1st Stage ±4.9V, Max 2nd Stage, -50V
V-
1st Stage, -5V VOUT 2nd Stage ±46V (92VPP), Max
VINPUT = ±1VPP
Figure 58. Two-Stage, High-Voltage Op Amp Circuit With Very Low Input Offset Temperature Drift
www.ti.com
SBOS391 – DECEMBER 2007
R1 R2
+50V
NPN
TIP29C, MJL21194,
MJE15003, MJL3281
CF
R4
(1) 0.2W
-IN V+ R3
(2) 20W
VOUT
(3)
OPA454 VO = VOUT - ILRL
+IN
VIN
V- R5
RL IL
0.2W
PNP
TIP30C, MJL21193,
MJE15004, MJL1302A
-50V
(1) Provides current limit for OPA454 and allows the amplifier to drive the load when the output is between +0.7V and –0.7V.
(2) Op amp VOUT swings from +47V to –48V.
(3) VO swings from +44.1V to –45.1V at IL = 1A.
Figure 60. External Output Transistors Boost Output Current Greater Than 1A
www.ti.com
SBOS391 – DECEMBER 2007
Voltage (V)
VOUT
input swings to within 0V of the rail, using the circuit -48.0
RS = 50kW
shown in Figure 64. Figure 63 shows the behavior -48.5
with an input signal that swings beyond the specified -49.0
input range to within 1V of the rail, also using the VIN VOUT
circuit in Figure 64. Notice that the beginning of the
-49.5
f = 1kHz RS = 0W
phase reversal effect may be reduced by inserting -50.0
V-
series resistance (RS) in the connection to the -50.5
positive input. Note that VOUT does not swing all the 0 20 40 60 80 100
way to the opposite rail. Time (ms)
49.0 10kW
48.5 V+ = +50V
48.0
VOUT RS OPA454 VOUT
47.5
R S = 0W RL
4.8kW
47.0 V- = -50V
VIN
0 20 40 60 80 100
Time (ms)
-46.0
OUTPUT RANGE
TA = +25°C
-46.5 The OPA454 is specified to swing to within 1V of
-47.0
VOUT either supply rail with a 49kΩ load while maintaining
RS = 0W excellent linearity. Swing to the rail decreases with
-47.5
increasing output current. The OPA454 can swing to
Voltage (V)
VOUT
-48.0
RS = 50kW
within 2V of the negative rail and 3V of the positive
-48.5 rail with a 1.88kΩ load. The typical characteristic
-49.0
curve, Output Voltage Swing vs Output Current
VIN (Figure 11), shows this behavior in detail.
-49.5
f = 1kHz
-50.0
V-
-50.5
0 20 40 60 80 100
Time (ms)
www.ti.com
SBOS391 – DECEMBER 2007
RL = 900W, 2mV/div 74dB 89dB voltage at V2 shows the small-signal settling time that
is centered on zero. This test circuit can be used for
incoming inspection, real-time measurement, or in
designing compensation circuits in system
applications.
RL = 4.87kW, 200mV/div 106dB
Inverting Response
Measured Here, V1
R2
R1 10kW
R4 Combination of Both
R3 10kW Inverting and R7 R8
Noninverting Responses, V2
R5 R6
-IN 10kW 10kW -IN
VOUT VOUT
OPA454 OPA454
+IN +IN
A1 A2
VIN
www.ti.com
SBOS391 – DECEMBER 2007
40 140
V+
20 120
-IN E/D 5V Logic VOUT
OPA454 VOUT 0 100
VFLAG (V)
VOUT (V)
V-
-40 60
-60 40
-80 20
VFLAG
V- -100 0
(Negative Op Amp Supply)
-120 -20
0 200 400 600 800 1000
Figure 67. ENABLE and E/D Com (ms)
10kW 100kW
CURRENT LIMIT
+50V
Figure 24 and Figure 48 to Figure 50 show the +2.5V
10Hz Square Wave
current limit behavior of the OPA454. Current limiting
RP
is accomplished by internally limiting the drive to the 1MW
output transistors. The output can supply the limited VFLAG
current continuously, unless the die temperature rises -IN V+ Flag
to +150°C, which initiates thermal shutdown. With VOUT
VOUT
adequate heat-sinking, and use of the lowest possible +IN OPA454
E/D Com
supply voltage, the OPA454 can remain in current V- 625W
limit continuously without entering thermal shutdown. -50V
Although qualification studies have shown minimal
parametric shifts induced by 400 hours of thermal
shutdown cycling, this mode of operation should be Figure 68. Thermal Shutdown
20 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated
www.ti.com
SBOS391 – DECEMBER 2007
R1 R2 50
100kW 10kW
V1
40
+50V
-IN V+ 30
VOUT
OPA454 20
+IN
V- R5
R3 R4
100W 10
100kW -50V 9.9kW
V2
0
0 0.5 1.0 1.5 2.0 2.5 3.0
2
IL RL Copper Area (inches ), 2 oz
IL = [(V2 - V1)/R5] (R2/R1)
= (V2 - V1)/1kW Figure 70. Thermal Resistance versus Circuit
Compliance Voltage Range = +47V, -48V Board Copper Area
www.ti.com
SBOS391 – DECEMBER 2007
Power Transistor
www.ti.com
SBOS391 – DECEMBER 2007
www.ti.com
SBOS391 – DECEMBER 2007
TYPICAL APPLICATIONS
Figure 72 and Figure 73 illustrate the OPA454 in a programmable voltage source and a bridge circuit,
respectively.
+95V
0.1mF
45.3kW
0-2mA V+
DAC8811 -IN
or
DAC7811 OPA454
+IN VOUT = 0V to +91V
Protects DAC
During Slewing V- RL
0.1mF
-5V
R1 R2 R3
1kW 9kW 10kW
R4
10kW
+50V +50V
Up To
-IN V+ 195V V+ -IN
VOUT VOUT
MASTER OPA454 OPA454 SLAVE
VIN +IN A1 A2 +IN
(1)
±4V V- Piezo V-
Crystal
-50V -50V
(1) For transducers with large capacitance, stabilization may become an issue. Be certain that the Master amplifier is stable before stabilizing
the Slave amplifier.
Figure 73. Bridge Circuit Doubles Voltage for Exciting Piezo Crystals
www.ti.com
SBOS391 – DECEMBER 2007
(1) The linear input range is limited by the output swing on the
input amplifiers, A1 and A2.
RSHUNT
V+
Plus V1 Load
VSUPPLY or
Minus
OPA454
(1)
A1
R4 R5
V-
R2 V+
OPA454 VOUT
R1 (2)
A3
R2
V-
R6 R7
V+
OPA454
(1)
A2
V2 VOUT = (1 + 2R2/R1) (V2 - V1)
V-
(1) To increase the linear input voltage range, configure A1 and A2 as unity-gain followers.
(2) The linear input range is limited by the output swing on the input amplifiers, A1 and A2.
www.ti.com
SBOS391 – DECEMBER 2007
+100V +100V
10kW 10kW
+100V +100V
100kW 100kW
V+ V+
V01 V04
OPA454 OPA454
A1 A4
V- V-
10kW 190kW 10kW 200kW
100kW 100kW
10kW 10kW
100kW 100kW
V02 V+ V05 V+
OPA454 OPA454
A2 A5
V- V-
100kW 100kW
-100V -100V
-100V -100V
Figure 76. Output Voltage Boost With +97V, –98V (195VPP) Across Load Connected to Ground (3 Op Amp
Output Stage, see Figure 77 and Figure 78)
100
100 6
75
V01 80
VOUT 4
50 60
VLOAD VIN
40
25 2
Voltage (V)
20
VOUT (V)
VIN (V)
0 0 0
-25 -20
V02 -2
-40
-50
-60
-4
-75 -80
-100 -100 -6
Time (20ms/div) Time (10ms/div)
Figure 77. 195VPP On 3.75kΩ Load to Ground Figure 78. 3.75kΩ Load to Ground
20kHz, Uses 3 OPA454s, 100V Supplies G = +20, 3 OPA454s, 100V Supplies
(Note SR of 18V/µs, which is slightly higher than
the specified 13V/µs due to tracking of the
power-supply voltage)
www.ti.com
SBOS391 – DECEMBER 2007
+100V +100V
10kW 10kW
+120V +120V
100kW 100kW
V+ V+
OPA454 OPA454
A1 A4
V- V-
10kW 190kW 200kW 10kW
100kW 100kW
V+ RLOAD V+
(+97V, -98V) 7.5kW (-98V, +97V)
OPA454 OPA454
A3 A6
VLOAD
V- (±195V, 390VPP) V-
10kW 10kW
VIN
100kW 100kW
V+ V+
OPA454 OPA454
A2 A5
V- V-
100kW 100kW
-100V -100V
-100V -100V
Figure 79. Output Voltage Boost With ±195V (390VPP) Across Bridge-Tied Load (6 Op Amps, see
Figure 80 and Figure 81)
200
VLOAD 200 6
150
150
VIN VOUT 4
100
100
50 2
50
VOUT (V)
VOUT (V)
VIN (V)
0 0 0
-50 -50
-2
-100 -100
-4
-150 -150
-200 -6
-200
Time (10ms/div)
Time (20ms/div)
www.ti.com
SBOS391 – DECEMBER 2007
12
VOUT
10
VOUT (1V/div)
Figure 82. High-Voltage Difference Amplifier 8
VLED (V)
6
4
HIGH-COMPLIANCE VOLTAGE CURRENT VLED
SOURCES 0V 2
OPA454
A1
25kW 25kW R
V2 OPA454
A2
Load IO
IO = (V2 - V1)/R
www.ti.com
SBOS391 – DECEMBER 2007
R7 R1
10kW 90kW
+100V
+100V
R2 R4
V+
V+ 1kW 100kW
OPA454
OPA454 A2
A1 V- +100V
V- VOUT = 100 ´ RSENSE ´ ID
V+
APD
Figure 85. APD Gain Adjustment Using the OPA454, High-Voltage Op Amp
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
OPA454AIDDA ACTIVE SO DDA 8 75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
Power no Sb/Br)
PAD
OPA454AIDDAR ACTIVE SO DDA 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
Power no Sb/Br)
PAD
OPA454AIDWD PREVIEW HSOP DWD 20 75 TBD Call TI Call TI
OPA454AIDWDR PREVIEW HSOP DWD 20 2000 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Telephony www.ti.com/telephony
RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated