Harman Mi ic Group Engineering Change Notice Date: Project # Project Engineer: Robert Boatright / Ray Larsen ECN# 272 Products Drive Rack Reason For Chang ‘sy. Name: PA [Ad solder mask vss solder sie bord ‘sg. Number: 80.1790 Revsion Do Tar E ‘Ad solder mask to vias on solder side of board fr PCB 80-1790 Up atthe following 08 and elated assembliggo match new board revision, 05-1790 dbx PA Update all 0603 parts on the PCB to remove the silkscr cen outline OTC ye EC item Desens Lr —— item [From [To | Teason for Change] Remon] EteentyPriaty —[ Prong] Sgnarores Tae Continuous Improvement MC After Depletion of Current QQ) ADC | Enginesring Manage Cost Reduction GCR | Next Job Release Mr [Sef / — gz-| Manengchange MC | Rework ans ede, Manufacurine Release MR | ‘On order R00 Omission or Error QOE In Stock Oris Product Enhancement PE | In Process ante Requlioy Regurement RR | tnFinghed Goods ARIE Software Update Qsu Other:E*Plain QOoTH Specification Change asc (EBT Otter Gorn ; Soe AanchodIngusSher_COStA. pra ECN Distribution |//5//¢2 TECNHApsi 21, 1998 Dist: STD; Engineering Files, Materials, Mana’ Eng, Manufacturing, Stockroom, Sale\Customer Servic, Techical Service, Product Developmen, Proj. Engineer