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Technology Map From FAB-9 Company Profile 2014
Technology Map From FAB-9 Company Profile 2014
Line / Space .004 /.004 .0025 / .0025 .002 /.002 Warpage, per inch .007 .005 .003
Copper Foil Oz., min / max ½/1 ½/3 ¼/4 Mat: GF/Fr4, GIN, Getek, BT Nelco, Arlon, GE Hybrids
Pad Size, int. (dia over drill) .010 .008 .006 Mat: Low Loss / High Speed, Low Rogers, GIL, Hybrids
DK and RF Arlon
Pad Size, ext. (dia over drill) .008 .006 .004
Mat: Flex and RigidFlex . Dupont
Drill-To-Metal .007 .005 .004
Drill Size, min (thru & buried via) .010 .006 .004 SMT Center-to center, min .014 .010 .008
Drill Size, min (blind via) .006 .004 ==== SolderMask Colors in Stock Green, Red, Blue, ==== ====
Slot Size, min .060 .025 .020 Clear, Black
Aspect (thick/drill) Ratio 10:1 18:1 28:1 SolderMask Dam, min .005 .0035 .003
(thru & buried) (black 0.13 min)
Hole Location Tolerance (TP) +/- .008 +/- .006 +/- .005 Legend Line, min .005 .004 .003
Layers, number max 30 40 44 Fill Hole: Surface Planarity +/- .001/.003 +/- .0005/.002 +/- .000/.001
Dielectric, min .004 .002 .0015 HDI: Construction 1+N+1 2+N+2 3+N+3
*’Note: Some Emerging products are being produced under engineering environment. Send details to sales@fab-9.com or Skype barucan1 about your project.