Professional Documents
Culture Documents
Mil HDBK 2164a
Mil HDBK 2164a
MIL-HDBK-2164A
19 June 1996
I SUPERSEDING
MIL-HDBK-2164(SH)
16 January 1996
1
DEPARTMENT OF DEFENSE
I
I
HANDBOOK
MIL-HDBK-2164A
FOREWORD
. .
ii
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MIL-HDBK-2164A
cONTENTS
EAGE
~ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
1. 1
1.1 Purpose .. ....... .... .... ... ...... ...... ...... ...... 1
1.2 Application to products ... ........ ...... ..... ...... 1
1.2.1 Large, heavy items .... ... ..... ......... ..... ...... . 2
1 .2.2 Contractual responsibility considerations. ... ...... 2
2. 3
2.1 General ... ....... ..... ... ..... ....... ....... ...... . 3
2.2 Government documents .... ..... ....... ...... ...... ... 3
2 .2.1 Specif icat ions, standarda, and handbooks ... ..... .... 3
2.2.2 Other Government documents, drawings, and
publications . ...... .... ... ...... ....... ...... .... .. 4
2.3 Non-Governm6nt publications .. ......... ..... ..... ... 4
2.4 Order of precedence . ... ..... ...... ...... .. .... ..... 4
3. 4
3.1 De finitions .... ..... ... ...... ...... ....... ..... .... 4
3.2 Acronyms used in this handbook. ..... ....... .... .... 6
4. -7
4.1 General .. ....... ..... ... ..... ...... ....... .... .... . 7
4.2 Screening conditions ... .... ....... ...... ..... ..... . 7’
4 .2.1 General environmental guidelines. . ....... ..... ..... 9
4 .2.1.1 Standard ambient ... .... ... ...... ....... ...... ..... . 9
4.2. 1.2 Controlled ambient ... ... ..... ........ ...... ..... ... 9
4.2.1.3 Thermal screening tolerances .. ........ ..... ..... ... 9
..
4.2 .1.4 Vibration screening tolerances. ........ ..... ..... .. 10
4 .2.1.5 Time ..... ..... ..... .... ... ...... ..... ..... ...... ... 10
4 .2.2 Accuracy of screening instrumentation calibration. . 10
4.3 Screening facilities . ... ..... ...... ....... ..... ... . 10
4 .3.1 Screening chamber .... ... ..... ...... ....... ..... .... 10
4.3.2 Vibration apparatus ... .. ...... ........ ..... ..... ... 11
4 .3.3 Quality of air for supplementary cooled equipment. . 11
4.4 General instrumentation guidelines. ....... ..... .... 11
4.5 Vibration screening guidelines. ... ...... ..... .... 12
4.5.1 Screening fixture . .... ... ..... ....... ....... ..... .. 12
4 .5.1.1 .Fixture checkout .... .... .... ....... ...... ...... .... 13
4 .5.2 Control excitation . .... ... ..... ....... ....”...... ... 13
iii
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MIL-HDBK-2164A
CONTENTS
PAGE
4.6 Performance monitoring guidelines. ....... .... ..... 13
4.7 Failure reporting, analysis, and correction action
system (FRACAS ) . ........ ...... ........ ...... ..... .. 13
4 .7.1 Failure during pre defect-free screening. ... .... .. 13
4 .7.2 Failures during defect-free screening. . ..... .... .. 13
4 .7.3 Rescreening ... ....... ..... ......... ....... .... .... 14
4.8 Sampling ....... ....... ... ......... ........ .... .... 14
5. 14
5.1 Environmental stresses. .. ........ ........ .... ..... 14
5.1.1 Random vibration spectrum. .... ........ ...... .... .. 14
5. 1.1.1 Applied axis detemination. .... ....... ...... ..... . 14
5. 1.2 Temperature cycling ..... ......... ....... .... ...... 15
5. 1.2.1 Thermal survey .. ...... .... ... ........ ...... .... ... 17
5. 1.2.1.1 Procedure for ambient-cooled equipment. ..... .... .. 17
5 .1.2.1.2 Procedure for supplementally cooled equipment. .. ... 18
5.1.2.2 Thermal screening .... .... .......... ....... .... ...... 19
5. 1.2.2.1 Ambient cooled equipment.. .......... ...... .... .... 19
5.1.2 .2.2 Supplementally cooled equipment. .... ....... .... ... 19
5.2 Total ESS program ... ..... ....... ........ .... ..... . 20
5.2.1 Documentation ....... ..... ....... .............. .... 20
5.2.2 Individual tests .... ..... ........ ........ .... ..... 20
5.2 .2.1 Examination of product. ...... ....... .. ...... ... .. 20
5.2 .2.2 Initial operational test ..... ....... ....... ..... .. 21
5.2.3 Environmental Screening. ..... ......... ...... ..... . 21
5.2.3.1 Fixed duration pre defect-free (PDF) screening. ... 21
5.2 .3.1.1 Vibration ....... ...... ..... .......... ..... .... .... 21
5.2 .3.1.2 Thermal cycling . ....... .... ........ ...... .... ..... 21
5.2 .3.2 Defect-free (DF) screening ..... ......... ...... .... 22
5.3 Final functional operational tefit........ .... ..... 22
6. ~ 22
6.1 Intended use ....... ..... ...... ......... ..... .... .. 22
6.2 Subject term (keyword) listing .... ...... .... ..... 22
iv
MIL-HDBK-2164A .
CONTE~S
PAGE
v
..—.— —___
MIL-HDBK-2164A
1. SCOPE
1
.- .— .-. . . . ..-— -— ——.
MIL-HDBK-2164A “
FEEDBACK
START r I
I t I
@li=l-i=l-@’l
B&
REBUILD OR RUN SCREEN INCREASE
NEW MULTIPLE SCREEN
PRODUCT TIMES SEVERITY
1.2.2 Navy-approved
detailed screening procedures are used to verify contractual requirements
2
.. . ..
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MIL-HDBK-2164A
2. APPLICABLE DOCUNSNTS
2.1 General. The documents listed below are not necessarily all of
the documents referenced hexein, but are the ones needed in order to fully
understand the informat ion provided by this handbook.
STANDARD
DEPARTMENT OF DEFENSE
HANDBOOK
DEPARTMENT OF DEFBNSE
3
MIL-HDBK-2164A
(ADDlication
. . for couies should be addressed to the Institute of
Environmental Sciences, 940 East Northwest Highway, Mt. Prospect, IL 60056-
3444)
4
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MIL-HDBK-2164A
Nfyr.E: In the event that several component parts of the same type fail
during the screening, each one sliould be considered a separate ESS failure,
unless it can be shown that one failure caused one or more of the others.
,!
MIL-HDBK-2164A .
3.2
. .
a. ARI Acquisition Reform Initiatives
b. BIT Built In Test
c. COTS Commercial-Off -The-Shelf
d. ESS Environmental Stress Screening
e. FAR Federal Acquisition Regulations
f. FRACAS Failure Reporting and Corrective Action System
9. IRIG Inter-Range Instrument Group
h. LRu Line Replaceable Unit
1. MTBF Mean Time Between Failure
j. NDI Nondevelopmental Item
k. PDF Pre Defect-Free
1. SPC Statistical Process Control
6
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MIL-HDBK-2164A
4. GENERAL GUIDELINES
-1
-— .- . ..- -, .--— —- .. . . . . . .. . . . ——— . . .
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MIL-HOBK-2164A
FfNN.
INDIVIDUAL
TESTS ENVIRONMENTALSTRESSSCREENS OPERATIONAL
lTiSTS
(-’ 5.2.2.2)
Dercd-Fme
(p=’) (p=’) ‘~?!g%~) m. (pF’)
Ikmninalio. Mid Rondo. Themal Tlmmml REndom Find
ofF70d”ct op@iOn@J
Pm
vibration cycling Cydiig Vibmdon Opcmliomd
Oefti-Fme Oefed-Fmz
II
~ 40Hours
-1
~
‘rhR’mnlcycling
Fmm 40Hounto80How
––––––-
& 40Houm A
II / I------===l
9
.—
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MI L-HDBK-2164A
w
CU3.1010CJ ,0-.-.!
w,
where
20 to 200 Hz 25 HZ
200 to 1000 Hz 50 Hz
1000 to 2000 Hz 100 Hz
4 .2.2 The
accuracy of instruments and screening equipment used to control or monitor
the screening parameters should be calibrated in predetermined intervals .
and then verified prior to and following each screening. Xi 1 instruments
and screening equipment used in conducting the screenings specified herein
should be calibrated to national standards, such as ANSI/NCSL Z540-1.
10
MIL-HDBK-2164A
The chamber is cycled between -54°C and +71oC for moat electronic
equipment. As the chamber is programmed to fall below room ambient
(approximately +25”C) , the probability of reaching the dew point of
unconditioned, room ambient air is very high. This condition is not
acceptable as it represents a non-identifiable damage potential which
provides no benefits in terms of detecting workmanship defects.
11
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MIL-HOBK-2164A .
12
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MIL-HDBK-2164A
4.7 ~ and~
J.UQCAQ. A closed loop system that collects data on, analyses, and
records timely corrective action is recommended for all failures that occur
during ESS. The FRACAS should cover all screening items, interfaces
between items, instrumentation, facilities, screening procedures, screening
personnel, and operating instructions. ESS is an essential tie to the
design and manufacturing processes during development and to statistical
process control (SPC) of the manufacturing processes during production and
depot repair.
13
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MIL-HDBK-2164A
5. DETAILED ENVIRONMENTS
14
MIL-HDBK-2164A
gw~ = 6.06
I o.04gvH2
(
,
( I
,
, ,
(
(
(
I
I ,
,
(
0
f ,
I 1.
, ,
I
, I
I
I (
,
I
, , I
,
,
I
20 80 350 2000
FrequencyHz
Notes:
(1)Random Vibration- Appliedinone 5-minuteperiodpriortothermalcycling.
(2)Random Vibration-Appliedforthe consecutivedefect-flee
minutesina 15-minute
window subsequenttothedefect-freethermalcycling.
. .
FIGURE 3. Random V]brationSpcc~
15
MIL-HDBK-2164A
* ‘“’’c’’”+ *WI
High Temp
SetPoint
@
~
i? ,
$ ,
Room !
& Ambient ,
!
,
\
,
\
,
Low Temp ,
SetPoint l+Wll !
Time _
A. AmbientCooledEquipment
— CoolantPmtik
,_ .-_. ---- Chamber AirProfile ~— . . .
K@ TunPW Pd. ,
G TtitickHi@ \
~ Tcmp@cra!in8
limit
E
: want H@ Ttmp —
& Golan!
l.aw
TanP
b TmP Scl
Poiot
W
B, Supplementally
CooledEquipment
Note Itnte
ofChange ofTemperatureis10“C/minute,
minimum
16
MIL-HDBK-2164A
c. After turning the equipment power back on, set the chamber
temperature to the equipment high temperature limit (high set point - see
paragraph 5. 1.2) , and allow the chamber air temperature to increase to the
high ‘set point at an average rate of 10°C per minute, minimum. If the
chamber cannot provide the rate of temperature change required, auxiliary
heating mesns should be employed. The average rate should be computed for
the total chamber temperature excursion.
d. TUM off the equipment power when the chamber air reaches the
high temperature operating limit, and continue heating the chamber air
until the high temperature set point is reached. If the operating limit is
the same as the high set point, leave the equipment power on.
e. Maintain the chamber temperature at the high set point until 2/3
of the thermocouples reach within 10”C of the maximum operating
temperature. Record the time between the chamber reaching tbe high
operating temperature set point and 2/3 of the thermocouples reaching
within 100C of the msximum operating temperature (high temperature dwel 1
time) .
9. Set the chamber to the equipment low temperature limit (low set
point) (see 5.1. 2) and reduce the chamber temperature at an average rate of
10°C per minute. If the chamber is not capable of an average rate of 10°C
per minute, minimum, auxiliary cooling means should be employed. The
average rate should be computed for the total chamber temperature
excursion.
17
MIL-HDBK-2164A
h. Maintain the chamber air at the low set point until 2/3 of the
thermocouples reach within 10o C of the low set point. Record the low
temperature dwell time.
]. Turn off the equipment power if on, and lower the chamber air
temperature to room ambient Allow the equipment to stabilize at room
ambient temperature.
18
1“
MIL-HDBK-2164A
e. At the end of the high temperature dwell period, reduce both the
chamber ambient air and the coolant temperatures at 10” C per minute,
minimum. Continue to reduce the chamber ambient and equipment coolant
temperatures before turning on the equipment power.
19
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MIL-HDBK-2164A
provide at least 12 thermal cycles during each pre defect-free and defect-
free screenings using the results obtained from the thermal survey, (see
paragraph 5.1.2 .1.2) determine the duration of the high temperature
operating dwell. First, subtract the total of the up and down excursion
times and the high and low temperature dwell times from the overall cycle
time. During the remaining time, the equipment should be operated for 10
minutes maximum at the equipment coolant low temperature plateau and the
remainder of the time at the equipment coolant high temperature plateau.
● Screen identification
program name
item name screening section
tape recorder
I tape speed
engineer/persOn administering screening
- date/time
excitation system
. Charnel information
accelerometer identification
accelerometer serial number
accelerometer sensitivity
charge amplifier gain
charge amplifier serial number
20
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MIL-HDBK-2164A
5.2.3.1 ~ Each
eWiPment should be exposed to random vibration and” thermal cycling periods
as depicted in figure 2. Since the purpose of this screening is to
eliminate latent manufacturing defects, all defects detected during this
screening should be recorded and repaired, but should not count against the
acceptance of the equipment.
80-350 Hz at 0.04g2/Hz
The thermal limits (high and low temperature extremes of chamber air)
for cycling, are those values of temperature defined by the equipment
specifications.
21
---.-—--- -— .-. . . .—. — —. .. -—.-. —.. . .~. ..-. —— ------- ... u ----- -.
I
MIL-HDBK-2164A “
I 6. NOTES
6.2
Random vibration
Temperature cycling
Thermal cycling
Thermal survey
Vibration screening
Review activities:
Air Force - 84
DESC - AS
DLA - ES
22
I
MIL-RDBK-2164A
APPENDIX A
I A.1 sCOPE
ESS DURATION, REDUCED SCREENING AND SAMPLING
A .2 APPLICABLE DOCUMENTS
A.2.1 G!2m?al. The documents listed below are not necessarily all
of the documents referenced herein, but are tbe ones needed in order to
fully understand the information provided by this handbook.
STANDARD
DEPARTMENT OF DEFENSE
DEPARTMENT OF DEFENSE
23
..- .- .—
~
MIL-HDBK-2164A
APPSNDIX A
A. 3 ASSDNPTIONS
A.4 ANALYSIS
24
MIL-HDBK-2164A
APPENDIX A
Minimum Acceptable
AM
~
I
2 I
3 I
q
,
I
I T[meon
PDF DF %creening (t)
I
I
4 -4 b
TFWF TDF
Tm~ + TD~ b
4
. .
Figure A-1 E&S Chamteasha cu~e
These parameters and the qrowth rate function of the curve can
be expressed by the lcgietics &ne form:
25
.—. —,
MIL-HDBK-2164A
APPENDIX A
?&e”” + ~ (1)
t . time on screening.
PA=[5)(,+*);W.2TDF (2)
(3)
The most important facets of these relationships are that the initial
screening durations (TmF and TD=) can be derived independent of historical
data and, by means of statistical sampling and quality monitoring
techniques, results can be verified against lot acceptance criteria based
on an allowable percent defective (a) and probability of acceptance (PA)
Solving (1) in terms of TmF and TDP provides the proportionality
TDFln~
T,D, = — a (4)
In (f30/a)
26
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MIL-HDBK-2164A
APPEWDIX A
10 (5)
a
(6)
(7)
,,
A.4.4 ~.
I
27
..
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MIL-HDBK-2164A
APPEWDIX A
,“, ‘l&
of Due to
ea of es.
E?
<25 >50%
50 20%
200 2%
500 0.3%
>1000 0%
28
MIL-HDBK-2164A
APPENDIX A
29
..- ----- . ..— — . .. . . -—
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MIL-HDBK-2164
APPENOIX B
B .1 SCOPE
B .2 APPLICABLE OOCU14ENTS
30
l-”
MIL-HDBK-2164
APPEW221X B
B.3.2.4 ~. Unlike
thermal cycling, the maximum time that a
unit can be exposed to the specified spectmm of random vibration, without
significantly affecting it useful life, is severely limited. With the unit
operational and its performance monitored, it should be exposed to the
specified spectrum of random vibration at the lowest gW level which will
cause the noted failure to reappear and allow identification of its origin.
In the event that the failure camot be duplicated at reduced levels, tbe
criticality of the failure should be examined and a judgment made as to the
advisability of continuing the effort, considering the risk of fatigue
damage associated with the application of reasonably high vibration levels
for extended periods of time.
(“”};AW) ‘z
Where EQUIV is the equivalent g2/Hz level and T is the allowable time
in minutes.
6.0 0.04 20
5.2 0.03 4-I
4.24 0.02 160
3.0 0.01 1280
EXAMPLE:
31
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MIL-HDBK-2164A -
APPENDIX C
c .1 SCOPE
C .2 APPLICABLE DOCDTIENTS
C.2..1 @n!?zal. The documents listed below are not necessarily all
of the documents referenced herein, but are the ones that are needed in
I
order to fully understand the information provided by this handbook.
.
C.2.2 9tlLPT GOV~ The
fol lowing other Government documents form a part of this appendix to the
extent specified herein.
32
MIL-HDBK-2164A
APPENDIX C
33
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MIL-HDBK-2164A
I APPENDIX C
C .5 PLANNING CONSIDERATIONS
C .6 MANAGEMENT ISSUES
The fol lowing ESS management issues and guidance should be considered
to increase the probability of implementing a viable ESS program:
● How critical are the items proposed fOr Ess ad what level of
quality is required? Criticality would be high if a failure of
the item results in high probability of loss of life or an
inability to complete a mission, high life cycle cOst, Or high
cost of failure.
34
. . . .. .. . . . ------- . ..—. . . .. . .. . .
MIL-HOBK-2164A “
APPSTW31X C
TAELE C-1.
~ ~
35
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MIL-HDBK-2164A
APP~IX C
36
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MIL-HDBK-2164A
APPENDIX C
I
When a contractor volunteers to participate in the
single process initiative and proposes an ESS process
change, the Navy program manager with the highest dollar
value contract should designate an individual as the
Department of the Navy ESS expert team member to support the
Navy team leader.
. .APPIY ESS JUSt prior to the start of the TAAP program, “bile
continuing to strive for an optimum screen.
37
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MIL-HDBK-2164A
APPENOIX C
The profiles should not change unless the manufacturing processes are
changed, the system is redesigned, parts are chsnged, or a different type
of screen is found to be more effective.
3s
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MIL-HDBK-2164A
APPENDIX C
C .8 GUIDANCE SUNMARY
39
L
,,. .
7hepreparing
acdvily
mustcomplete
blocks 1.2, 3.and8.Inbl.xk 1. Lmti the comment.Umba andrevision
Ietfer
should bw ghmn.
The preparing acfirity must pmvido a repiy tifhin 30 days from receipt of tfds form.
NOTE This form may not be .SE4 to request cmples of documenfs, nor to request wafwers, or clarification of requirements on current contrads.
Commenfs submitted on fhis form do not cnnslifule or impiy authorization to waive any potion of the referenced document(s) or to amend cnnfracfua!
requirements.
I RECOMMEND A CHANGE: 1.DOCUMENT NUMBER 2. DOCUMENT DATE (WMMDD)
MIL-HDBK-2164A 960619
00CUMENF nTLE
!NWRONMENTAL STRESS SCREENING PROCESS FOR ELECTRONIC EQUIPMENT
NATUSE OF CHANGE (identity pnragmph numtir md include propxcd re+rbr.. ifpassibk. Att@ exma sheets as needed.)
i, SUBMITTSR