ANSYS Multiphysics For

Electronic and Electrical

Simulation

Ankit Adhiya
Lead Engineer
(ankit.adhiya@ansys.com)
1 © 2011 ANSYS, Inc. June 26, 2014
 Content

• Multiscale Single Physics Simulation

• Why Industry needs Multiphysics Solutions

• ANSYS Multiphysics Solutions

• Summary

2 © 2011 ANSYS, Inc. June 26, 2014

 Content

• Multiscale Single Physics Simulation

• Why Industry needs Multiphysics Solutions

• ANSYS Multiphysics Solutions

• Summary

3 © 2011 ANSYS, Inc. June 26, 2014

 Multiscale Single Physics Simulations Electromagnetics

Fluid Flow + Thermal

Electromagnetics
Number of sub components

System Reliability

Structural Mechanics PCB Reliability

Thermal IGBT Reliability

Solder Reliability

Chip Level Analysis

4
nm
© 2011 ANSYS, Inc. June 26, 2014
μm mm cm m
 Agenda

• Multiscale Single Physics Simulation

• Why Industry needs Multi-physics Solutions

• ANSYS Multiphysics Solutions

• Summary

5 © 2011 ANSYS, Inc. June 26, 2014

 Product Development Trends:
Driving The Need For Multiphysics

Increasing Power Density Advanced Materials

Need an image

Miniaturization Environmental Sustainability

6 © 2011 ANSYS, Inc. June 26, 2014
 Multiphysics for Electronic Design

• Real-world multiphysics
environments impact
– Proper operation of components
– Integrity and life of components
– Overall product reliability
• Product reliability of high
performance electronic devices
requires
– Multiphysics approach
incorporating electromagnetic,
thermal and mechanical simulation
to simulate real world Fusing of an electronic trace on a
environments printed circuit board from a current
overload

7 © 2011 ANSYS, Inc. June 26, 2014

 Multiphysics Simulation
• Multiphysics simulation delivers a deeper understanding of product
performance by considering the interaction of multiple engineering
disciplines.

Structural-
Mechanics
Systems and
Electromagnetics Embedded Software
Fluid Dynamics

8 © 2011 ANSYS, Inc. June 26, 2014

 Agenda

• Multi-scale Simulation

• Why Industry needs Multiphysics Solutions

• ANSYS Multiphysics Solutions

• Summary

9 © 2011 ANSYS, Inc. June 26, 2014

 Multiscale Multiphysics Simulations
Structural Mechanics

Fluid + Thermal

Electromagnetics
Number of sub components

System Reliability
Structural Mechanics
Electromagnetics

Fluid + Thermal PCB Reliability

Fluid + Thermal
Fluid + Thermal Electromagnetics
Structural Mechanics
Electromagnetics IGBT Reliability Fluid + Thermal

Structural Mechanics

Solder Reliability

Chip Level Analysis

10
nm
© 2011 ANSYS, Inc. June 26, 2014
μm mm cm m
 Chip Package System Analysis

11 © 2011 ANSYS, Inc. June 26, 2014

 3D IC Industry Trends and Challenges
Trends
• Accommodates dies with mixed
process technologies/ gate sizes
• Various formats of multiple
semiconductor dies and 3D-ICs
• Gate sizes keep decreasing
3D IC stacked dies
Challenges
• Increases interdependence between
heat dissipation and temperature
fields
– Actual operating environment should
be taken into account
– The system temperature can affect die
power due to change in leakage power Flipchip dies on single
• Thermal run-away problems Interposer die with TSVs
12 © 2011 ANSYS, Inc. June 26, 2014
 ANSYS Multiphysics Solution for 3D IC
Industry
Electromagnetics Fluid Dynamics

RedHawk, Totem Sentinel-TI Icepak

Package System
IC DESIGN
Design Design
Converged PCB/Pkg
Power Power Map Temperature
Library
IC Thermal System
CTM Thermal
CTM Analysis
Generation Tools
System
Temperature thermal
BC

3D IC Power 3D IC Thermal System level Thermal

Budgeting Management Management
13 © 2011 ANSYS, Inc. June 26, 2014
 Case Study : 3D IC Simulation
Sentinel-TI Icepak

SiI
PLL
Compact
power Map
Mem Logic

Dies assembly

System
Thermal BC

MCM Flipchip : Full Package

Scenario Heat Blower Logic Die Max

Sink Temperature in
Sentinel TI
1 Yes Yes
99.3⁰ C
2 Yes No
112.3⁰ C
Sentinel TI Results: 3 No Yes
Scenario1 101.8⁰ C
14 © 2011 ANSYS, Inc. June 26, 2014 4 No No 124.3⁰ C
 Multiphysics Benefits for 3D IC Design

• Countermeasures for possible failure modes

• Improve Battery Life

• Reduced product development cycle significantly by

optimizing IC, Package, and System performance,

15 © 2011 ANSYS, Inc. June 26, 2014

 Solder Reliability in Reflow Process

16 © 2011 ANSYS, Inc. June 26, 2014

 Solder Joint Reliability in Reflow Process

• Joint made of components having

different material properties

• In Reflow Process the electronic

assembly is subjected to
controlled heat

• Solder joint reliability issues in

Reflow process
– Thermal stress developed due to
abrupt temperature change

17 © 2011 ANSYS, Inc. June 26, 2014

 ANSYS Solution for Reflow Analysis

Fluid Dynamics Structural Mechanics

Icepak/Fluent Mechanical

Package and
Solder Reliability
System
Design
Design

Temperature
Thermal
Analysis Stress and Deformations

18 © 2011 ANSYS, Inc. June 26, 2014

 Case Study : Reflow Analysis
Radiant Heat
Source
Air
Inlet

Controlled
Temperature
Profile

package

Outlet

Temperature

Convection and Radiative Heat transfer inside Equivalent Plastic Strain on Solder Ball
19
oven © 2011 ANSYS, Inc. June 26, 2014
 Multiphysics Benefit for Solder Reliability
in Reflow
• Get and better insight of Reflow process

• Optimizing reflow oven settings to enhanced

performance, yield and reliability

• Reduce test matrix, cost and time

20 © 2011 ANSYS, Inc. June 26, 2014

 IGBT Reliability

21 © 2011 ANSYS, Inc. June 26, 2014

 IGBT Reliability
Trends
• Higher Switching Frequency
• Higher Current withstand Capability
• Higher power density
Challenges
• Reduce Switching Losses
• Increase system reliability
– Increased thermal stresses
– Higher Lorentz forces
• Better Performance at elevated
temperature

22 © 2011 ANSYS, Inc. June 26, 2014

 ANSYS Solution for Multiphysics IGBT
Reliability Simulation
Electromagnetics Fluid Dynamics Structural Mechanics

Maxwell Mechanical
Simplorer

Solve IGBT Magnetostatics

Circuit Thermal Structural

Ohmic Loss Lorrentz Stress

Terminal Current Electromagnetic Forces and
Current
Simulation Deformation

Switching Loss
Loss Temperature
Switching Loss
Calculation
Temperature

23 © 2011 ANSYS, Inc. June 26, 2014

 Case Study : IGBT Reliability Simulation

Current Density in Temperature Distribution Stress Distribution with

Maxwell inside IGBT enlarged deformation scale
24 © 2011 ANSYS, Inc. June 26, 2014
 Multiphysics Benefit for IGBT Reliability

• Predict the reliability of bond wires

• Robust design of the electric drive

• Optimize the performance of the system, reducing

maintenance costs and increasing the life cycle of the
inverter

25 © 2011 ANSYS, Inc. June 26, 2014

 PCB Reliability

26 © 2011 ANSYS, Inc. June 26, 2014

 PCB Reliability

Trends
• Electronic components with
smaller footprint and higher
power requirement

Challenges
• Increase in current density leads
to Trace/Joule heating
• Joule heating further affects the
electric performance of PCB

Fusing of an electronic trace on a printed

circuit board from a current overload
27 © 2011 ANSYS, Inc. June 26, 2014
 ANSYS Solution

Electromagnetics Fluid Dynamics Structural Mechanics

SIwave Icepak Mechanical

Board Level
Board Level Board Level Analysis
Analysis
Analysis

Power Loss
Temperature
DC-IR Drop Thermal Thermal
Convergence Analysis Stress and Deformations

Temperature

28 © 2011 ANSYS, Inc. June 26, 2014

 Case Study : Power Supply Board
• Objective: Use Multi-physics to model realistic conditions that improve PCB reliability
1. SIwave was used to obtain DC solution and resistive losses (Joule heating).
2. Icepak was used to compute full CFD solution.
3. Mechanical was used for thermal-stress analysis.

Courtesy: Toshiba Corporation,

ANSYS Advantage
29 © 2011 ANSYS, Inc. June 26, 2014
 Case Study : Power Supply Board
• Difference between Icepak / SIwave + Icepak coupling
Hotspot off by
Hotspot off by 2.3 C vs
10.3 C vs experiments
experiments

Icepak SIwave + Icepak

• Difference between Icepak + Mechanical / SIwave + Icepak + Mechanical coupling

Shift of max stress

quantity and location

Icepak + Mechanical Siwave + Icepak + Mechanical Courtesy: Toshiba Corporation,

30 © 2011 ANSYS, Inc. June 26, 2014 ANSYS Advantage
 Multiphysics Benefit for PCB Reliability

• Deeper insight into the effect Joule heating on PCB and

package design.

• Predict accurate temperature and electrical

performance

• Improve reliability and reduce warranty period

31 © 2011 ANSYS, Inc. June 26, 2014

 System (Electric Drive) Reliability

32 © 2011 ANSYS, Inc. June 26, 2014

 Electric Drive Reliability

Trends
• Reduce machine size and weight
• Increase machine efficiency

Challenges
• Maintain efficiency and durability
over a wide range of operating
conditions
• Reduce machine noise
• Increase PM Reliability

33 © 2011 ANSYS, Inc. June 26, 2014

 Case Study
Electromagnetics Fluid Dynamics Structural Mechanics

Torque 2D_cooling_inside

Maxwell Mechanical
Fluent
213.75
Curve Info avg
Moving1.Torque
156.4067
Setup1 : Transient
Moving1.Torque_22_deg
181.9289
Imported
200.00 Moving1.Torque_2eme_it_52deg
157.3518

16% drop in
Imported
Moving1.Torque_3eme_it_53deg
156.4067
Imported

180.00
predicted
Torque (N)
Y1 [NewtonMeter]

performance
160.00

140.00

Single physics simulation, assuming a magnet

123.75
2.00 3.00 4.00 5.00 6.00
Time [ms]
7.00 8.00 9.00 temperature of 22C
10.00

Time (ms)
3-way Multiphysics simulation shows that the
actual magnet temperature: 53C
34 © 2011 ANSYS, Inc. June 26, 2014
 Multiphysics Benefit: Provide Accurate
Performance Predictions
When predicting the performance (torque) of an electric motor,
multiphysics simulation captures the strongly coupled interactions
between the hot electromagnetic material and surrounding cooling fluid.

Single Physics Simulation Performance

Assumption
Torque: 186 N
Motor Performance Metal Temperature

Multiphysics Simulation Performance

Heat Generation Coolant Temperature
Torque: 158 N
Motor Performance Metal Temperature

ANSYS Maxwell ANSYS Fluent

Single-physics simulation
over-predicts system performance by 18%
35 © 2011 ANSYS, Inc. June 26, 2014
 Summary

36 © 2011 ANSYS, Inc. June 26, 2014

 Summary

• Multiphysics Simulation helps to

– Optimize performance considering all physical phenomena

– Ensure product performance across and beyond performance

envelope

– Early insight to failure mode due to different physics interaction

– Accelerate the design process and increase design accuracy

37 © 2011 ANSYS, Inc. June 26, 2014

 ANSYS Advantage

38 © 2011 ANSYS, Inc. June 26, 2014

 Multiphysics Setup In Workbench

Now, let’s add a Structural

Select Static Structural
There are multiple “drop targets”
simulation with loads transferred
with
Draga preview
it from of the result.
into your
CFD.project

39 © 2011 ANSYS, Inc. June 26, 2014

 ANSYS Advantage

• Multiphysics Made Easy

– Automated setup and workflows
FLUID
• Flexible & Open Solutions DYNAMICS
– 1-way coupling
– 2-way coupling
– Single solve solutions STRUCTURAL
– Combine ANSYS with 3rd party tools MECHANICS

• Performance & Advanced Modeling

– Best-in-class physics modeling
ELECTRO-
– Highly scalable parallel processing
MAGNETICS

SYSTEMS &
MULTIPHYSICS

40 © 2011 ANSYS, Inc. June 26, 2014