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    Heat Transfer

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    akshit patidar

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    Subject VI Heat Transfer 1 Introduction Heat transfer is transfer of energy due to temperature difference in a medium or between two or more media. + Heat transfer rate and heat flux: Q=qA where Q = heat transfer rate (W) q = heat flux (W/m?) A = heat transfer area (m?) + Heat is always transferred in the direction of decreasing temperature. + Temperature is a scalar, but heat flux is a vector quantity. + Difference between thermodynamics and heat transfer: Thermodynamics tells us: — how much heat is transferred (Q). — how much work is done (W’). — final state of the system. Heat transfer tells us: — how (with what modes) Q is transferred. — at what rate Q is transferred. ~— temperature distribution inside the body. + Different types / modes of heat transfer processes: — Conduction—heat transfer is due to a temperature gradient in a stationary medium ny bulk motion of matter. — Convection heat transfer occurs due to temperature difference between a surface and a moving fluid. — Radiation—heat transfer occurs due to emission of energy in the form of electro- magnetic waves by all bodies above absolute zero temperature. Net radiation heat transfer occurs when there exists a temperature difference between two or more surfaces emitting radiation energy. Radiation does not need matter. 1 EE EESSE'”~ 3-2 GATE wat to Chemical Engineering, (Vol-3) m subbu / k nagarajay 3-2_GATI v/ van 1.1. Conduction Conduction is the transfer of energy due to either random molecular motion or due motion of free clectrons. to the + In different phases of matter, the modes of conduction are slightly different: Gases conduction is due to collisions of randomly moving molecules. Liquids similar to gases, but with a much smaller “mean free path”. ~ Solids conduction is due to lattice vibrations and/or motion of “free" clectrons, + Insolid bodies, conduction is the significant heat transfer mechanis flows in the process, With flowing fluids, conduction dominat to the solid boundary, Ww is no eddy motion. nm because no material in the region very close allel to the surface where there re the flow is laminar and pa Fourier’s Law area x temperature difference thickn Rate of heat conduction o ie, dT la Q=-kA (1) Fourier’s law is a phenomenological law developed from observed phenomena rather than being derived from first principles. Heat transfer rate in x direction is proportional to the temperature gradient, dT /dx. The proportionality constant k is a transport property known as ‘thermal conductivity’ and is a characteristic of the material. The minus sign is a consequence of the fact that heat is transferred in the direction of decreasing temperature. 1.2 Convection Convection refers to transfer of thermal energy by motion of a medium, ‘The rate equation or the convective heat transfer (regardless of particular nature) between a surface and all adjacent fluid is prescribed by Newton’s law of cooling. Q=RA(T, = Too) (2) where A = area exposed to heat transfer (m?) T, = surface temperature of solid (°C) Tx, = fluid temperature (°C), and h = feat transfer coefficient (W/m?.°C) h = f(geometry, fluid motion, fluid properties, AT) + There are two types of convection: HT 1, INTRODUCTION Forced convection — refers to the case when the fluid is made to flow by some ex- ternal agent, using a pump, fan, stirrer, ete Free or natural convection — refers to fluid motion which naturally occurs from the heat transfer itself, due to buoyaney differences (“hot air rises and cold air sinks: ”) + Typical values of heat transfer coefficient: (W/m?.K) Free convection Forced convection liquids: 50: 20,000_ 2500- 100,000 “Boiling Condes 1.3 Radiation Radiation heat transfer involves the transfer of heat by electromagnetic radiation that arises due to the temperature of the body. Any body above absolute zero temperature (0 K ) emits radiation. Radiation does not need matter. + Emissive power per unit surface area, is given by Stefan-Boltzmann law, as below: ol (3) where o = Stefan-Boltzmann constant = 5.67 x 10-8 W/m?.K4 « = emissivity, which is a surface property (¢ = 1 for black body) T = absolute temperature of the surface (K) The above equation describes a gross heat emission rather than heat transfer. + The rate of radiation heat exchange between a small surface of area A at T; and a large surrounding at T> is given by the following expression: Q = ce A(T} — T3) ) (4) * Surfaces with emissivities nearly unity are good absorbers and hence poor reflectors of jucident radiation. Most highly polished, unoxidized metal surfaces are good reflectors of thermal radiations with emissivities less than 0.1. A roughened or an oxidizes has correspondingly higher cmissivities. ‘This can be verified trom tle ‘Tablet, d surface values given in 3-4 GATEwit to Chemical Engineering, (Vol: Table 1: Emissivities Material “Carbon 3) m subbu / k nagarajan of Typi Emis (dimensionless) 0.85 0.95 | Materials Aluminum or | Brass (oxidized) 0.61 Brass (unoxidized) | 0.030 Copper (oxidized) | 0.60 Copper (unoxidized) | 0.020 Black gloss paint 0.90 Gold (polis 0.020 Fire brick 0.75 2 Conduction 2.1 One Dimensional Heat Conduction Equation Insulated surface Heat Heat. flow in — — flow out. (Ag|, ¢ (ADlepax i i rt+Ar Let us consider a volume element of thickness Az and having an area A normal to the coor- dinate axis r, as shown in the figure. The energy balance equation for this volume element is given by: Net rate of rate of rate of heat gain by | + energy = increase of (5) conduction generation internal energy I i Il The net rate of heat gain by the element by conduction is given by 1=(Agl, -(ADlesae The rate of energy generation in the element having a volume AAc is given by I= Adzg where g = g(,t) is the rate of energy generation per unit volume; t is time. ‘The rate of increase of internal energy of the volume element resulting from the change of temperature is given by I = Ade pCp 2 Baa) (Note: Internal energy change is mCy AT; but for liquids and solids, Cp © Cy). Substituting for the quantities in Eqn.(5), and rearranging, we get 1 (Gdlea2- 401,) ne A Ag +9 = Cea, (6) Ar +0, (Mlevae- ADL.) a ———Ar = G49) (from the definition of derivative) i or And from Fourier’s law: q = —k5™. Hence, eqn.(6) becomes, 16 (,,ar aT (x.t) [ Tae (A¥Ge) +9= CeO @ This is the general equation for one dimensional heat conduction. « Rectangular Coordinates: Here, the area A does not vary with x. Hence, Eqn.(7) becomes, 8,87), aa.) ig (BGp) #9 0CP at + Cylindrical Coordinates: Here, x =r, the radius of cylinder; and area, A = 27rH, where H is height of the cylinder. For heat transfer in the radial direction, A x r. Hence, Eqn.(7) becomes, 1a (Gea) po ae : or ror ot Spherical Coordinates: Here too, x =r. Area, A= 4ar?. ie., Axr?. Hence, Eqn.(7) becomes, 1 oO (7, oF = OT(r,t) 3.8 (sm22) +9= sorbed Compact Equation: The above equations (rectangular / cylindrical / spherical coordinates) can be written in a compact form, as below: ela ar 19 (png =o ™ Or ( 0) oe or (8) where n= 1 for cylindrical coordinates 0 for rectangular coordinates 2 for spherical coordinates In the rectangular coordinates, it is customary to use the variable « in place of r. 36 _GATEvat: to Chemical Engincering (Vol 3) m subbu / k_nagarajan + Special Cases: — For constant thermal conductivity k, Eqn.(8) reduces to, 18 (,n9P) rar \" or = thermal diffusivity of material, m?/s where k pCp ~ For steady state heat conduction with energy sources within the medium, Eqn.(8) reduces to, and for the case of conduction with constant k, ee mdr \" ar) 7 RI — For steady state conduction, with no energy sources, and for constant k, a a rag i) 79 + During steady one-dimensional heat conduction the rate of heat transfer (Q) remains constant, but the heat flux (q) changes according to the heat transfer area (A). + For flat surfaces, A is constant in the direction of flow. Hence, the heat transfer flux (q = Q/A) is also constant. For curved surfaces, heat transfer area (A) varies along the direction of flow. For example, for flow through concentric cylinder heat transfer area increases with increase in radius. Hence heat flux (Q/A) decreases with increase in radius. Thermal Conductivity + Denoted by k. Unit: W/(m.K). + Thermal conductivity increases in the order: gases —> water > ice > bricks — alloy steels + low-carbon steels + aluminium copper. + Pure crystals and metals have the highest thermal conductivities, and gases and insu- lating materials the lowest. «© Thermal conductivities of solids at room temperature vary from 0.1 W/(m.K) for good insulators (e.g.: asbestos) up to 400 W/(m.K) for good conductors (e.g.: silver). 2. CONDUCTION | Set + The conductivity changes mildly with temperature except at very low temperatures where it can acquire very large values. For instance, pure copper at. 10 K has a conduc- tivity of about 20,000 W/(m.K) « Thermal conducti 0.025 W/(m.K) ity of water at 25°C: 0.611 W/(m.K); and, that of air at | atm, 25°C Thermal Diffusivity + Thermal diffusivity (a) where a = k/(pCp) is a convenient collection of physical prop- erties for transient solutions of the heat equation. + Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature. + The larger the value of a, the faster will the heat diffuse through the material and its temperature will change with time. This will result either due to a high value of conductivity k or a low value of p,Cp. Material Thermal Diffusivity (cm?/s) at 300 K Copper 115 Aluminum 0.97 Stainless steel (304) 0.042 Silicon dioxide (polycrystalline) | 0.0083 ‘Water 0.0014 Polyvinyl chloride (PVC) 0.0008 Alcohol 0.0007 Air 0.19 + Metals and gases have relatively high value of thermal diffusivity and their response to temperature changes is quite rapid. + The non metallic solids and liquids respond slowly to temperature changes because of their relatively small value of thermal diffusivity. 2.2 One Dimensional Steady State Heat Conduction In the following sections, we derive equations for one dimensional heat conduction under the conditions of constant. thermal conductivity and no heat generation / consumption. 3-8 GATEway to Chemical Engineering (Vol-3) m subbu / k nagarajan Conduction through Flat Plate L Consider the sy tem shown above. The top, bottom, front and back of the cube are insulated, so that heat can be conducted through the cube only in the « direction. In this special case, heat flow is one dimensional. If sides were not insulated, heat flow could be two or three dimensional. For one dimensional steady heat conduction, Zz 2) S dz \ dz) ~ T=T at r=0 T=T) at 2=L (9) Boundary conditions: Integrating Eqn.(9) , we get dT “= 10 de CQ (10) Integrating further, we get T=C\r+Co (1) Using the boundary condition at x = 0 gives Q=T And, from the boundary condition at x = L gives, h=QL+T = (=2 Substituting for C, in Eqn.(10), we get aT _h-t idee L From the definition of heat flux (as given by Fourier’s law) HT 2, CONDUCTION _3-9 2 Therefore, qT a, (12) Q=qA=kA where R= 55 Ris called as the thermal resistance. Conduction through Cylindrical Surface 9 —— + Boundary conditions: T=T, at r=a T=T, at r=b One dimensional heat conduction equation is given as: d (aT ar (S) =a Integrating, we get : rt Lo, drt ie, aT dr (a3) Integrating further, we get T=Cilnr+Cy (14) Using the boundary condition at r = a,b gives T, =Cilna+Cy (15) Ty = CyInb + Cy (16) Eqn.(16) — Eqn.(15) => T, —T; = C,(Inb— Ina) Ty —T2 a In@/a) (7) 3-10 GATEwat to Chemical Engineering (Vol-3) um subbu / k_nagarajan Using Eqn.(17) in Eqn.(13), we get aT dr r From the definition of heat flux, q = ¢ And from Q = qA = q(27rH), we get N-h _T%-Te : _ In(b/a) in@/a) Bete where R= onkH (18) Q =2nkH Conduction through Spherical Surface Boundary conditions: T=T at T=T at 1 One dimensional heat conduction equation is given as: d (9dT 4 (247) _9 ar G dr Integrating, we get Po, dr av Gs a a9) Integrating further, we get aS a + C2 (20) Using the boundary condition at r = a, b gives Cc; Ti=-2+Ce (21) Ci ) h= > +Co (22) HT 2. CONDUCTION 3-11 Eqn.(21) — Eqn.(22) => 1-7%=-0 __b-a 6 ab — Oo 1 (=r) (23) Using this in Eqn.(19), and from the definition of heat flux, q= Zz, we get ip kab ce Pb-a™ a) Since Q = qA = q(4nr?) Arkab T, -T: b-a => = ey elie a Q =a)" ~™) R where R= 77> (24) Heat Transfer Resistances—Generalization by _i-h kn with A 2 ie kAn where Ax thickness of surface through which heat is getting transferred; and, Am = mean heat transfer area. Aam An 4 Ala Agm = arithmetic mean, for flat plate logarithmic mean, for cylinder = geometric mean, for sphere For flat surface, Aj+A2 _ A+A = = =t*=a Am = Aam . "i For cylindrical surface, A, — Ag _ 2naH —2nbH _ 2nH(b—a) _ 2nHAx ay ta Inb/a) ~ Tn(b/a) A 2nbH For spherical surface, Am = Agm = VArAa = Vara?) (At?) = drab The above equations can be verified from Eqns.(12), (18), and (24). Rate of heat conduction through any sort of surface, from surface 1 to surface 2 can be given 312 GATEwat to Chemica Sngincering, (Vol-3) m subbn / k_nagarajan Temperature Profile for One Dimensional Heat Flow Temperature profile for one dimensional steady state conduction, for systems with constant thermal conductivity are obtained as below: (here, T; > Tz and b> a) Flat plate: T(x) = (To - We +T, T(r) = Tr _ In@r/a) Cylinder: ToT, = inlbja) a b- bo r-a 7 ee 2 Ty Sphere: Tr) =o + py aT + For flow across flat surfaces: T vs. x is linear; —— = constant. In gee + For flow across cylindrical surfaces: T vs. Inr is linear; ae cars ar + For flow across spherical surfaces: Tvs. 1/r is linear; Fo => Heat Conduction with Multiple Resistances ‘The concept of thermal resistance (simply called as resistance here) is based on the observation that many diverse physical phenomena can be described by a general rate equation, stated as driving force resistance Flow rate = The idea of thermal resistance is a useful tool for analyzing conduction through composite members, for steady state systems with no heat generation and constant thermal conductivi- ties. ‘The idea of resistance was already introduced and discussed for conduction. By the same way, for convective heat transfer, resistance is given by, (Ts = Too. Q=hA(Ts - Too) (i— Tes) where R= a And for radiation, Q =e Ai(T? — Th) = oe Ai (T? + T3)(T? — T3) = ve, Ar (TP + T3)(Ti + T2)(Ti — Ta) _ (T1=Te) eee Composite Plane Wall Refer to Fig.(1-a). rate of heat rate of heat rate of heat rate of heat convection. = conduction = conduction = convection, into the wall | through wall 1 through wall 2 from wall 2 _HT ae : 2. CONDUCTION _3-13 kK Ly —+— Lo (a) Flat Surface (b) Curved Surface Figure 1: Heat Transfer through Multiple Resistances in Series — Treo Tre _ Tis —To _ Ts2 — Tao ge Dente _ Tak _ = lant _ Ri Ro Ry where i 1 pices facie geese aa 2 BA SRA 4 hl Adding the numerators and denominators separately, we get Qo ae ~ Ry +Ro+R3 + Re Composite Curved Surfaces Refer to Fig.(1-b) - ga — Tix Pie ~ Ry + Ra + Ry + Ra Cylindrical Surface: 7 In(rio/ru) SCL Ar) aye = Toa > Oak 9 DakyH 1 ara Hl Spherical Surface: 1 ceed cee a Fu er dekiritin 0 Atharairan 1 adr, 3-14 GATEwat to Chemical Engineering (Vol-3) m subbu /k nagarajan ky Ag T,| ke Aa 1 ky Aa 3 ky Ts h ky Ay ky Ai As OTTO Te k#-— Ar ——-A bk. Ax ———4 (a) Parallel Resistances (b) Resistances in Series-Parallel Combination Figure 2: Heat Transfer Resistances in Various Combinations Resistances in Parallel Refer to Fig.(2-a) Ta -Ty | Ta~ Te -Th_y We =Q+ = — + Re = (Ta = Ri Ra Ry Q= 1 +Q2+Q= HE Rt Ry ™) (F + mt R) ee oe eee R RoR" Ry” Rs Resistances in Series-Parallel Combination Refer to Fig.(2-b). Q= where 1 _F =p + +z) Rit Rs 2.3 Thickness of Insulation We know that by adding more insulation to a flat wall always decreases heat transfer, becat of the added resistance. The thicker the insulation, the lower the heat transfer rate and hence the heat loss. This is expected, since the heat transfer area A remains constant, and adding insulation always increases the total resistance for heat transfer. Adding insulation to a cylindrical piece or a spherical shell, however, is a different mat- ter. The additional insulation increases the conduction resistance of the insulation layer but decreases the convection resistance of the surface because of the increase in the outer surface area for convection. The heat transfer from the pipe may increase or decrease, depending on which effect dominates. aaaansaci i 2. CONDUCTION 3-15 Consider the heat transfer from the cylindrical pipe of ontside radius r,, which is insulated up tor (r > 7), with an insulating material of thermal conductivity &. ‘The heat. transfer coefficient of ambient air ish. The heat. transfer resistance for unit length of cylinder, for this condition is given by R= Riosutation + Rambient ie. 1 R 2arh It can be seen from the above formula, that with increase in r, resistance due to insulation increases, and resistance to the ambient decreases. Therefore, R goes through a minimum; and heat loss goes through a maximum, ‘The value of r at which R is minimum is obtained by using the equation dR/dr = 0. This radius (roc) is called the critical radius of insulation. an Ena dr Ink mre 9 WH = Toe) Solving the above, we get Tae = k/h. Similarly, for the spherical surface, it can be shown that Toc = 2k/h. + The critical thickness of insulation (= rye — r;) corresponds to the condition when the sum of conduction and convection resistances is a minimum. + For a given temperature difference, critical thickness results in a maximum heat transfer rate, and the critical radius roe is given by for eylinder: re = * (25) for sphere: Toi a (26) where k is the thermal conductivity of the insulation and h is the convective heat transfer coefficient of the fluid outside the insulation. (roe = ri) ‘Thickness of insulation If the insulating material is chosen in such a way that ro. < rj, then any addition of insulation leads to decrease in heat loss. 3-16 _GATEwa¥ to Chemical Engineering (Vol-3) = m ubbu /k_nagarajy ‘Typical materials: 1 Polyurethane foam (k = 0.025 W/tn.K) 2 — Glass wool (k = 0.035 W/m.K) Q Toct Ti = ocd To Figure 3: Effect of Thermal Conductivity on Critical Radius of Insulation Significance of Critical Radius of Insulation For most cylinders, roc < rj and the critical radius is of no concern. When cooling smaller diameter cylinders, such as electrical wiring, the critical radius must be considered, but one need not worry about it in the design of most large process equipment. If the radius (for cylindrical and spherical surfaces) is greater than the critical radius, any addition of insulation on the tube surface decreases the heat loss. But if the radius is less than the critical radius, as in small-diameter tubes, cables, or wires, the heat loss will increase continuously with the addition of insulation until the radius of the outer surface of the insulation equals the critical radius. The heat loss becomes maximum at the critical thickness of insulation and begins to decrease with the addition of insulation beyond the critical thickness. We can choose a insulating material in such a way that, it’s roc is less than or equal to that of bare pipe pipe radius (r,). By this way, any addition of insulation to the pipe will reduce the heat loss. Refer to Fig.(3) Critical radius of insulation is a property of the insulating material and outside convec- tion heat transfer coefficient. It is having significance only for radii smaller than about few cm. On windy days, the external convection heat transfer coefficient is greater compared to calm days. fore critical radius of insulation will be greater on calm days (note: Toc & 1/h). om If the insulation of a steam pipe is wetted, the thermal conductivity of the insulation increases, which in turn increases the critical radius. Then it is possible that with the resulting critical radius the heat loss from the pipe will become larger with wet insulation than with no insulation. The value of the critical radius roc will be the largest when k is large and h is small. HT : 2. CONDUCTION _3-17 Total cost (A + B) oe ' Cost of insulation (A) Cost Gost of lost heat (B) Thickness of Insulation Figure 4: Optimum Thickness of Insulation + Noting that the lowest value of h encountered in practice is about 5 W/(m?.K) for the case of natural convection of gases, and that the thermal conductivity of common insulating material: 0.05 W/(m.K), the largest value of the critical radius we are likely to encounter is 4. = k/h = 0.05/5 = 0.01 m = 10 mm. This value would be even smaller when the radiation effects are considered. The critical radius would be much less in forced convection, often less than 1 mm, because of much larger values ass ted with forced convection. Therefore, we can insulate hot water or steam pipes Treely without worrying about the possibility of increasing the heat transfer by insulating the pipes. + The radius of electric wires may be smaller than the critical radius. Therefore, the plastic electrical insulation may actually enhance the heat transfer from electric wires and thus keep their steady operating temperatures at lower and thus safer levels. Optimum Thickness of Insulation (from Economic Perspective) The economic thickness of insulation depends on the first cost (insulating cost) and mainte- hance cost of insulation and annual value of heat loss, which depends on the cost of producing the steam and thermal conductivity of the lagging. Generally thicker insulation will represent higher owing costs and lower heat loss costs. Refer to Fig.(4) 2.4 Heat Conduction with Uniform Heat Sources Applications: current carrying conductor, chemically reacting systems, nuclear reactors In most application, we are interested in maximum temperature Tmax and surface temper- ature temperature T, of solids which are involved with heat generation. Surface Temperature for Systems with Uniform Heat Generation (both the sides at the same temperature): Consider a solid medium of surface area A, volume V, and constant thermal conductivity k, where heat is generated at a constant rate of g per unit volume. Heat is transferred from the i 3-18 GATEway to Chemical Engincering (Vol-3) m subbu / k hagaraj A - jan uurface at T, to the surrounding medium at Tc. Under steady conditions, a, + the solid with i energy balance for the solid can be expressed as: rate of heat transfer rate of heat generation from the solid within the solid Q=iv For the heat transfer at the surface, A(T, = Too) = gV iow rawr, hA Using the above relationship, the surface temperature can be calculated for a plane wal] of thickness 2L, a long cylinder of radius ry and a sphere of radius r, as follows: L Ts, plane wail =~ + Toe fe T,, hinder = $2 + Too Go Ts, sphere = gp + Too V/A for Simple Geometries (i) Plane Wall: For a plane wall of thickness 2L, width W, and height H for one dimensional heat flow across the plane WH, the heat transfer area on one side is WH; and since heat is flowing from both the front and rear faces to the ambient, the total heat transfer area is 2WH. Volume of the plane wall is (2L) WH. Therefore, V/A = L. (ii) Cylinder: For heat flow through cylindrical surface (with insulated flat ends) Vi _ aH _ 1 A 2H 2 (iii) Sphere: V _ (4/3)nr§ _ ro A” 4nr2 3 Maximum Temperature for Systems with Uniform Heat Generation (both the sides at the same temperature): Using the Fourier’s law, we can derive the relationship for the center (maximum) temperature of a long cylinder of radius ro. The maximum temperature Tmax in a sol a location furthest away from the outer surfaces when the outer surface is maintain' lid with uniform heat generation will occur at ed at # constant temperature of T,. aT ~kA,S = ov, HT _______—-2. ~CONDUCTION __3-19 Here, A, = 2nrH and V, = rH Integrating with the limits of T = 7, at r =0; and T = 7, at r = To} we get 4k For sphere of radius 74, are ‘ok For flat plate, r = 2, and V,/A, = x. Hence, we get gl? Plane Wall with Uniform Heat Generation (surfaces at maintained at different temperatures): From one dimensional heat conduction equation, for a flat wall we have, ag dt ik Integrating, we get aT gx aE +Qy Integrating further, we get i gar’ T=-F+ Cr+ (27) Boundary conditions: T=] T=h From B.C. 1 and 2, (28) 2 Tr=-S- +L + Cr (29) Adding Eqns.(28) and (29), we get a Ty + Tp =- 9-242 gL? T2+T; an (30) aeere. 3-20 GATE) ¥ to Chemical Engincering (Vol-3) mm subbu / k nagarajay Eqn.(29) — Eqn.(28) => _h-T 2b (31) C1 Using Eqns.(30) and (31) in Eqn.(27), we get ie., For T; = Tr TR ) : 2.5 Fins Heat transfer from a solid surface to the ambient (or any fluid) takes place by convection. The rate of heat transfer by convection is given by Q=hA(T, — Tx) This convective heat transfer from a surface at T, can be increased by two methods: + increasing the convective heat transfer coefficient, h + increasing the surface area, A Increasing the convective heat transfer coefficient may not be practical and/or adequate it certain cases. An increase in surface area by attaching extended surfaces, as thin strips of metal, called as fins to the surface is more convenient. «© When heat transfer takes place by convection from both interior and exterior surfaces of a tube or a plate, generally fins are used on the surface where the heat transfer coefficient is low. + Examples of fin: — Thin rods on condenser in back of refrigerator — Honeycomb surface of a car radiator — Corrugated surface of a motorcycle engine Typical shapes of fins are given in Fig.(5) HT_ Se : _____2 CONDUCTION _3.21 Figure 6: Steady Heat Transfer in Fin One Dimensional Fin Equation In the analysis of fins, we consider steady operation with no heat generation in the fin. We also assume that the convection heat transfer coefficient, h to be constant and uniform over the entire surface of the fin. Refer to Fig.(6). Heat in by conduction — Heat loss by convection = Heat out by conduction (Aq)|z — hPAa(T — To.) = (AQ) [24x Rearranging, (Ag)|2 — (Ag)|z+ax = hPA2(T - Teo) (32) where A is area for conductive heat transfer; and, PAs is the area for convective heat transfer; P is the perimeter. Dividing Eqn.(32) throughout by Az, and, from the definition of derivative, (for Ar + 0) ((Ag)letax —(AM|e) _ _ d(Ag) An i ide us . Therefore, dr dag) _ 4 PT eden erase From Fourier’s law of conduction, q = 3-22 GATE wat to Chemical Engineering (Vol-3) _msubbu /k_nagarajan Using this in Eqn.(32), we get &T AkTy = MP(T ~ Too) ie, @T hP ss - wT -Tx) =0 de? Ak! ) or, @’o 2_ bP PO ap nen seals =(T-Tx qa me =0 where m? = F- and = 6 =(T ) (33) The above equation is a linear homogeneous, second-order ordinary differential equation. So. lution to the above (T vs. x) can be obtained by assuming suitable boundary conditions. The simplest boundary conditions are applicable for ‘long fin’. Long Fin Long fin is one for which the temperature of the fin tip is assumed to be T.. @=Cie"™ + Coe™ (34) Boundary Conditions (BC): 0 = % = (To — Tx) at «=0 6=0 at rT 00 Application of BC-2 to Eqn.(34) gives 0 =Cye"™™ + Coe =0+ Crem = G=0 And, from BC-1, we get bate" => Moh Hence, 0 =8,e-™* => a 9 ie, Osun Teac = =e 8 ~ Ty Too Heat flow through the fin (Q) is given by L Q= [ hPOdx (based on convection over the fin surface) 7=0 or, Q = -Ak — ? a (based on conduction into the fin) r=0 HT _ 2. CONDUCTION 3-23 3 Temperature sy 8 0 Distance from base Figure 7: Variation of Fin Temperature From any of the above two equations, we get Q = AkOom => Q=6oVPhkA Pin Fin: It is a cylindrical extended surface. Here, A = (7/4)D?, and P= xD. Fin Efficiency Temperature of a fin gradually drops along the length. Typical variation is given in Fig.(7). In the limiting case of zero thermal resistance (k —+ 00), the temperature of the fin will be uniform at the base value of Ty. The heat transfer from the fin will be maximized in this case: Qain,max = hAgn(To — Too) Fin efficiency (jn) can be defined as: Qin actual heat transfer rate from the fin Qain,max ideal heat transfer rate from the fin (if the entire fin were at base temperature) Tin = Fin efficiency decreases with increasing fin length because of decrease in fin temperature with length. For the ‘long-fin’ Qin _ VPRRA(Ty- Tx) _ VPRRA _ 1 Qhin.max hAgn(To — Tx) APD 2b Nin = Fin Effectiveness The performance of fins is judged on the basis of the enhancement in heat transfer relative to the no-fin case, and expressed in terms of the fin effectiveness: Qsn _ heat transfer rate from the fin Qno fn heat transfer rate without fin = 3:24 GATEvat to Chemical Engineering (Vol-3) msubbu / k nagarajgy <1 fin act as insulation £fn = 4 =1 fin does not affect heat transfer > 1. fin enhances heat transfer For the long-fin Qin _ VPAKA(T,— Too) _ VPhRA __ [kP oe 2 eS vy = and, fin _ PL Tin =A Effectiveness of a fin must be greater than 2; otherwise it is not recommended to use that fin. Fins - Requirements + Fins are generally used where convective heat transfer coefficient (h) values are relatively low. i.e., when air or gas is the medium and heat transfer is by natural convection. + Fin material should be of highly conductive materials. + Lateral surface area of the fin should be as high as possible. + The efficiency of most fins used in practice is above 90%. * Note: min<1 but en > 1 2.6 One Dimensional Unsteady Heat Conduction Lumped Parameter Formulation A lumped parameter formulation is an approximation which facilitates the solution of heat transfer problems. The key assumption is the neglect of temperature gradients (dT’/dz) inside the body of volume V and surface area A, so that its temperature is only a fu However, this assumption clearly amounts to the ne; inside the material and should be used with caution. This approximation is valid if ction of time. glect of the heat conduction process where L=V/A = Bone 2. CONDUCTION 3-25 Let us consider the cooling of solid (ini If the only mechanisin for ene bounding surface, ally at 7) by immersing in a infinite fluid at pe Ke with the surroundings is convection through the 1 cnergy balance equation becomes ergy exchan, the differential therma 0-hAIT ~ Ty) = pCpv 2 dt This is a first order ordinary differential equation (ODE) which can be solved easily. Re: ranging the above, aA @ py T=) 0 aT 4 hA a tml -Tx)=0 where m= ron de aT Let @=T—T.. Then, & = = Therefore, 0 qe md =0 Solution of the above ODE is given by _ Integrating. In@ = —mt+C; Initial condition: At t = 0, @ = 6 = To — Toc. Substituting this in the above, we get Inob=C, Hence, In@ = —mt + In&% => ee ee To — Te nA. m= oy Biot Number ance to external heat How Whenever the Biot number is sinall, the internal temperature gradients are also small and a transient problem can be treated by the"lumped thermal capaetty” approach. The lumped Serie 3-26 GATEwat’ to Chemical Engincering (Vol-3) m subbu /k_nagarajy capacity a perature. mption implies that the object for analysis is considered to have a single tem, L/(kA) _ internal resistance to. HT _ AL Ts —To 1/(hA) — external resistance to H.T Rint < Rext: the Biot number is smal] and we can conclude Bi Ty -Ts «Ts — Too and in the limit Ty ~ Ts Rext < Rint: the Biot number is large and we can conclude Ts —Tn

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