IXD_614

14-Ampere Low-Side
INTEGRATED CIRCUITS DIVISION Ultrafast MOSFET Drivers

Features Description
• 14A Peak Source/Sink Drive Current The IXDD614 / IXDI614 / IXDN614 high-speed gate
• Wide Operating Voltage Range: 4.5V to 35V drivers are especially well suited for driving the latest
• -40°C to +125°C Extended Operating Temperature IXYS MOSFETs and IGBTs. Each output can source
Range and sink 14A of peak current while producing voltage
• Logic Input Withstands Negative Swing of up to 5V rise and fall times of less than 30ns. Internal circuitry
• Low Propagation Delay Time eliminates cross-conduction and current
• Low, 10A Supply Current "shoot-through," making the driver virtually immune to
• Low Output Impedance latch up. Low propagation delay with fast rise and fall
times make the IXD_614 family ideal for
Applications high-frequency and high-power applications.
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies The IXDD614 is configured as a non-inverting driver
• Motor Controls with an enable. The IXDN614 is configured as a
• DC to DC Converters non-inverting driver, and the IXDI614 is configured as
• Class-D Switching Amplifiers an inverting driver.
• Pulse Transformer Driver
The IXD_614 family is available in an 8-pin DIP (PI),
an 8-pin Power SOIC with an exposed metal back (SI),
a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package.

Ordering Information

Logic Packing
Part Number Package Type Quantity
Configuration Method
IXDD614PI 8-Pin DIP Tube 50
IXDD614SI IN OUT 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD614SITR EN
8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD614CI 5-Pin TO-220 Tube 50
IXDD614YI 5-Pin TO-263 Tube 50
IXDI614PI 8-Pin DIP Tube 50
IXDI614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI614SITR IN OUT 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI614CI 5-Pin TO-220 Tube 50
IXDI614YI 5-Pin TO-263 Tube 50
IXDN614PI 8-Pin DIP Tube 50
IXDN614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN614SITR IN OUT 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN614CI 5-Pin TO-220 Tube 50
IXDN614YI 5-Pin TO-263 Tube 50

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INTEGRATED CIRCUITS DIVISION IXD_614

1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.5.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.5.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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INTEGRATED CIRCUITS DIVISION IXD_614

1 Specifications

1.1 Pin Configurations 1.2 Pin Definitions

IXDD614 PI / SI IXDD614 CI / YI
Pin Name Description
VCC 1 8 VCC VCC 1

OUT 2
IN Logic Input
IN 2 7 OUT
GND 3
Output Enable - Drive pin low to disable output,
EN 3 6 OUT EN
IN 4
and force output to a high impedance state
GND 4 5 GND EN 5
Output - Sources or sinks current to turn-on or
OUT
turn-off a discrete MOSFET or IGBT
IXDI614 PI / SI IXDI614 CI / YI
Inverted Output - Sources or sinks current to
OUT
VCC 1 8 VCC VCC 1 turn-on or turn-off a discrete MOSFET or IGBT
OUT 2
IN 2 7 OUT VCC Supply Voltage - Provides power to the device
GND 3
NC 3 6 OUT
IN 4 Ground - Common ground reference for the
GND
GND 4 5 GND NC 5 device
NC Not connected
IXDN614 PI / SI IXDN614 CI / YI
Note: IXYS Integrated Circuits Division recommends
VCC 1 8 VCC VCC 1
that the exposed metal pad on the back of the “SI”
OUT 2
IN 2 7 OUT package be connected to GND. The pad is not
GND 3
NC 3 6 OUT suitable for carrying current.
IN 4

GND 4 5 GND NC 5

1.3 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Units

Supply Voltage VCC -0.3 40 V
Input Voltage VIN , VEN -5 VCC+0.3 V
Output Current IOUT - ±14 A
Junction Temperature TJ -55 +150 °C
Storage Temperature TSTG -65 +150 °C

Unless stated otherwise, absolute maximum electrical ratings are at 25°C

Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.

1.4 Recommended Operating Conditions

Parameter Symbol Range Units

Supply Voltage VCC 4.5 to 35 V
Operating Temperature Range TA -40 to +125 °C

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1.5 Electrical Characteristics: TA = 25°C

Test Conditions: 4.5V < VCC < 35V (unless otherwise noted).

Parameter Conditions Symbol Minimum Typical Maximum Units

Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - -
V
Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8
Input Current 0V < VIN < VCC IIN - - ±10 A
EN Input Voltage, High IXDD614 only VENH 2/3VCC - -
V
EN Input Voltage, Low IXDD614 only VENL - - 1/3VCC
Output Voltage, High - VOH VCC-0.025 - -
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 0.4 0.8

Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.3 0.6
Limited by package power
Output Current, Continuous IDC - - ±4 A
dissipation
Rise Time CLOAD=15nF, VCC=18V tR - 25 35
Fall Time CLOAD=15nF, VCC=18V tF - 18 25
On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY - 50 70
ns
Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY - 50 70
Enable to Output-High Delay Time IXDD614 only tENOH - 31 60
Disable to High Impedance State Delay Time IXDD614 only tDOLD - 44 70
Enable Pull-Up Resistor IXDD614 only REN - 200 - k
VCC=18V, VIN=3.5V - 1 2 mA
Power Supply Current VCC=18V, VIN=0V ICC - <1 10
A
VCC=18V, VIN=VCC - <1 10

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1.6 Electrical Characteristics: TA = - 40°C to +125°C

Test Conditions: 4.5V < VCC < 35V.

Parameter Conditions Symbol Minimum Maximum Units

Input Voltage, High 4.5V < VCC < 18V VIH 3.3 -
V
Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65
Input Current 0V < VIN < VCC IIN - ±10 A
Output Voltage, High - VOH VCC-0.025 -
V
Output Voltage, Low - VOL - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 1.5

Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 1.2
Limited by package power
Output Current, Continuous IDC - ±1 A
dissipation
Rise Time CLOAD=15nF, VCC=18V tR - 50
Fall Time CLOAD=15nF, VCC=18V tF - 40
On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY - 90
ns
Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY - 90
Enable to Output-High Delay Time IXDD614 only tENOH - 75
Disable to High Impedance State Delay Time IXDD614 only tDOLD - 85
VCC=18V, VIN=3.5V - 3 mA
Power Supply Current VCC=18V, VIN=0V ICC - 150
A
VCC=18V, VIN=VCC - 150

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INTEGRATED CIRCUITS DIVISION IXD_614

1.7 Thermal Characteristics

Package Parameter Symbol Rating Units
CI (5-Pin TO-220) 36
PI (8-Pin DIP) 125
Thermal Impedance, Junction-to-Ambient JA °C/W
SI (8-Pin Power SOIC) 85
YI (5-Pin TO-263) 46
CI (5-Pin TO-220) 3
SI (8-Pin Power SOIC) Thermal Impedance, Junction-to-Case JC 10 °C/W
YI (5-Pin TO-263) 2

2 Performance

2.1 Timing Diagrams

VIH VIH

IN IN
VIL VIL

tONDELAY tOFFDELAY tOFFDELAY tONDELAY

90%
90%
OUT OUT
10%
10%
tR tF tF tR

2.2 Characteristics Test Diagram

+
IN VCC OUT
VCC
0.1μF 10μF - VCC

Tektronix
EN
VIN GND Current Probe
CLOAD 6302

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INTEGRATED CIRCUITS DIVISION IXD_614

3 Block Diagrams & Truth Tables

3.1 IXDD614 3.3 IXDN614

VCC VCC

IN

OUT
IN OUT

EN GND

GND

IN EN OUT IN OUT
0 1 or open 0 0 0
1 1 or open 1 1 1
x 0 Z

3.2 IXDI614
VCC

IN OUT

GND

IN OUT
0 1
1 0

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4 Typical Performance Characteristics

Rise Time vs. Supply Voltage Fall Time vs. Supply Voltage Rise & Fall Time vs. Temperature
(VIN=0-5V, f=10kHz, TA=25ºC) (VIN=0V-5V, f=10kHz, TA=25ºC) (VIN=0-5V, f=10kHz, CL=3.6nF, VCC=18V)
80 60 15
70 14
50 13
60 CL=15nF CL=15nF tR
Rise Time (ns)

12

Fall Time (ns)

CL=7.5nF 40 CL=7.5nF
50

Time (ns)
CL=3.6nF CL=3.6nF 11
40 30 10
tF
30 9
20 8
20
10 7
10 6
0 0 5
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40 -40 -20 0 20 40 60 80 100 120 140
Supply Voltage (V) Supply Voltage (V) Temperature (ºC)

Rise Time vs. Load Capacitance Fall Time vs. Load Capacitance
50 50
VCC=4.5V VCC=4.5V
45 VCC=8V 45 VCC=8V
40 VCC=12V 40 VCC=12V
Rise Time (ns)

VCC=18V VCC=18V
Fall Time (ns)

35 35
VCC=25V VCC=25V
30 VCC=30V 30 VCC=30V
25 VCC=35V 25 VCC=35V
20 20
15 15
10 10
5 5
2 4 6 8 10 12 14 16 2 4 6 8 10 12 14 16
Load Capacitance (nF) Load Capacitance (nF)

Propogation Delay
Propagation Delay vs. Supply Voltage Propagation Delay vs. Input Voltage vs. Junction Temperature
(VIN=0-5V, f=1kHz, CL=15nF) (VIN=0-5V, f=1kHz, CL=15nF, VCC=12V) (VIN=0-5V, f=1kHz, CL=15nF, VCC=18V)
250 160 70
tOFFDLY
Propagation Delay (ns)
Propagation Delay (ns)

Propagation Delay (ns)

200 140 65
tOFFDLY
120 60
150 tONDLY
100 55
tONDLY
100
80 50
tOFFDLY
50 60 45
tONDLY
0 40 40
0 5 10 15 20 25 30 35 40 2 4 6 8 10 12 14 -40 -20 0 20 40 60 80 100 120 140
Supply Voltage (V) Input Voltage (V) Temperature (ºC)

Input Threshold
vs. Temperature Input Threshold Enable Threshold
(CL=3.6nF, VCC=18V) vs. Supply Voltage vs. Supply Voltage
3.5 3.5 25
Enable Threshold (V)
Input Threshold (V)

20
Input Threshold (V)

3.0 3.0
Min VENH
Min VIH Min VIH 15
2.5 2.5 Max VENL
Max VIL 10
Max VIL
2.0 2.0
5

1.5 1.5 0
-40 -20 0 20 40 60 80 100 120 140 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
Temperature (ºC) Supply Voltage (V) Supply Voltage (V)

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Supply Current vs. Load Capacitance Supply Current vs. Load Capacitance Supply Current vs. Load Capacitance
(VCC=35V) (VCC=18V) (VCC=12V)
1000 1000 1000
f=2MHz f=2MHz f=2MHz
f=1MHz f=1MHz f=1MHz

Supply Current (mA)

Supply Current (mA)
Supply Current (mA)

f=500kHz f=500kHz
100 100 f=500kHz
100 f=100kHz
f=100kHz f=50kHz f=100kHz
f=50kHz 10 10 f=50kHz
f=10kHz
10 f=10kHz f=10kHz
1 f=1kHz 1
f=1kHz
f=1kHz
1 0.1 0.1
2 4 6 8 10 12 14 16 18 2 4 6 8 10 12 14 16 18 2 4 6 8 10 12 14 16 18
Load Capacitance (nF) Load Capacitance (nF) Load Capacitance (nF)

Supply Current vs. Load Capacitance Supply Current vs. Frequency Supply Current vs. Frequency
(VCC=8V) (VCC=35V) (VCC=18V)
1000 1000 1000
f=2MHz CL=15nF CL=15nF
f=1MHz

Supply Current (mA)

Supply Current (mA)

CL=7.5nF
Supply Current (mA)

100 CL=7.5nF
f=500kHz 100 C =3.6nF 100 CL=3.6nF
L
f=100kHz
10 f=50kHz
10 10
1 f=10kHz

f=1kHz 1 1
0.1

0.01 0.1 0.1

2 4 6 8 10 12 14 16 18 1 10 100 1000 10000 1 10 100 1000 10000
Load Capacitance (nF) Frequency (kHz) Frequency (kHz)

Supply Current vs. Frequency Supply Current vs. Frequency Quiescent Supply Current
(VCC=12V) (VCC=8V) vs. Temperature
1000 1000 2.0
CL=15nF 3.5V
CL=15nF
CL=7.5nF 5V
Supply Current (mA)

Supply Current (mA)

Supply Current (mA)

C =7.5nF 100 1.5

100 CL=3.6nF CL=3.6nF 10V
L
0V & 18V
10 1.0
10
1 0.5

1
0.1 0.0

0.1 0.01 -0.5

1 10 100 1000 10000 1 10 100 1000 10000 -40 -20 0 20 40 60 80 100 120 140
Frequency (kHz) Frequency (kHz) Temperature (ºC)

Dynamic Supply Current Output Source Current Output Sink Current

vs. Temperature vs. Supply Voltage vs. Supply Voltage
(VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V) (CL=330nF) (CL=330nF)
1.4 -35 45
Output Source Current (A)

40
Output Sink Current (A)

1.2 -30
Supply Current (mA)

35
1.0 -25
30
0.8 -20 25
0.6 -15 20
15
0.4 -10
10
0.2 -5 5
0.0 0 0
-40 -20 0 20 40 60 80 100 120 140 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
Temperature (ºC) Supply Voltage (V) Supply Voltage (V)

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Output Source Current Output Sink Current

vs. Temperature vs. Temperature
(CL=330nF, VCC=18V) (CL=330nF, VCC=18V)
-22 24
Output Source Current (A)

23

Output Sink Current (A)

-20
22
-18
21
-16 20
19
-14
18
-12
17
-10 16
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (ºC) Temperature (ºC)

High-State Output Resistance @ -10mA Low-State Output Resistance @ +10mA

vs. Supply Voltage vs. Supply Voltage
1.0 0.7

0.9
Output Resistance (Ω)
Output Resistance (Ω)

0.6
0.8
0.5
0.7
0.4
0.6
0.3
0.5

0.4 0.2

0.3 0.1
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
Supply Voltage (V) Supply Voltage (V)

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5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classification

IXD_614SI / IXD_614PI /IXD_614CI MSL 1
IXD_614YI MSL 3

5.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

5.3 Soldering Profile

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.

Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles
IXD_614CI 245°C 30 seconds 1
IXD_614YI 245°C 30 seconds 3
IXD_614PI 250°C 30 seconds 3
IXD_614SI 260°C 30 seconds 3

5.4 Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature
and duration necessary to remove the moisture trapped within the package is the responsibility of the user
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

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5.5 Mechanical Dimensions

5.5.1 SI (8-Pin Power SOIC with Exposed Metal Back)

0.31 / 0.51 PCB Land Pattern
(0.012 / 0.020)
8x 0.60
TOP VIEW BOTTOM VIEW (0.024)
1.55
(0.061)

5.80 / 6.20 5
2.05 / 2.41
(0.228 / 0.244) 3.80 / 4.00 (0.081 / 0.095)
(0.150 / 0.157) 3.85 2.23
(0.152) (0.088)

PIN #1 1.27 3.31 / 3.81

0.05 (0.130 / 0.150)
1.25 MIN 6x
(0.049 MIN) 3.56
(0.140)
4 0.10 / 0.25
1.70 MAX 4.80 / 5.00 A (0.004 / 0.010)
(0.067 MAX) (0.189 / 0.197) 0.25
(0.010)
A
GAUGE PLANE
SEATING PLANE Dimensions
0.10 0.40 / 1.27 MIN / MAX
(0.004) 8°- 0° (0.016 / 0.050)
0 / 0.15
(0 / 0.006) Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current.
7. Lead thickness includes plating.

5.5.2 SI Package Tape & Reel Information

330.2 DIA.
(13.00 DIA.)

Top Cover W=12.00

Tape Thickness B0=5.30 (0.472)
0.102 MAX.
(0.004 MAX.) (0.209)

K0= 2.10 A0=6.50 P1=8.00

(0.083) (0.256) (0.315)

Dimensions
User Direction of Feed mm
Embossed Carrier
(inches)

Embossment NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

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5.5.3 YI (5-Pin TO-263)

E MM INCH
(Note 2) SYMBOL
MIN MAX MIN MAX
E1 A 4.064 4.826 0.160 0.190 Recommended PCB Pattern
E3 A1 0.000 0.254 0.000 0.010
b 0.508 0.991 0.020 0.039 10.75
L1 (0.423)
D2 b1 0.508 0.889 0.020 0.035
c 0.381 0.737 0.015 0.029
D1 c1 0.381 0.584 0.015 0.023
D c2 1.143 1.651 0.045 0.065 2.20
(Note 2) (0.087)
D 8.382 9.652 0.330 0.380
8.40
H D1 6.858 7.700 0.270 0.303 (0.331)
D2 1.358 1.562 0.053 0.062
* E 9.652 10.668 0.380 0.420 8.05
Pin 1 E1 6.223 8.000 0.245 0.315 (0.317) 10.50
Indicator C C 3.80 (0.413)
E3 5.092 6.869 0.200 0.270
e 1.702 BSC 0.067 BSC (0.150)
e ~4x b ~5x H 14.605 15.875 0.575 0.625
L 1.778 2.794 0.070 0.110
L1 1.000 1.676 0.039 0.066
* Circular feature will be L3 0.254 BSC 0.010 BSC 1.05 1.702
present on devices (0.041) (0.067)
A with the R 0.460 TYP 0.018 TYP
Optional Tip Lead Form. R1 0.506 TYP 0.02 TYP Dimensions
c2 θ - 8º - 8º mm
(inches)

SECTION: C-C
PLATING
JEDEC TO-263 (Note 3) b1
Optional Tip Lead Form
c BASE METAL c1
A1 A1
b NOTES:
R1 L L 1. Reference JEDEC TO-263 Type “BA”.
R1 R
R 2. Dimension does not include mold flash; mold flash
L3 L3 shall not exceed 0.127mm (0.005 inch) per side.
θ θ 3. Minimum plating: 1000 microinches.
4. Controlling dimension: millimeters.

5.5.4 CI (5-Pin TO-220)

A 3.810 - 3.860 B
(0.150 - 0.152)
9.652 - 10.668 3.556 - 4.826
0.127 BSC (0.380 - 0.420) (0.140 - 0.190) 9.652 - 10.668
0.355 M B A M (0.380 - 0.420)
(0.005 BSC) 0.508 - 1.397
(0.020 - 0.055)
2.540 - 3.048
(0.100 - 0.120)
5.842 - 6.858 5.842 - 6.858
(0.230 - 0.270) (0.230 - 0.270) 7.550 - 8.100
4.826 - 5.334 (0.297 - 0.319)
(0.190 - 0.210)

14.224 - 16.510
(0.560 - 0.650)
12.192 - 12.878
8.382 - 9.017 6.300 - 6.700 (0.480 - 0.507)
(0.330 - 0.355) (0.248 - 0.264)

THERMAL PAD 6.858 - 8.890

(0.270 - 0.350)

2.032 - 2.921
(0.080 - 0.115)

C C
12.700 - 14.732 0.356 - 0.610
(0.500 - 0.580) (0.014 - 0.024)

0.381 - 1.016 5x
1.702 4x BSC (0.015 - 0.040 5x) SECTION C-C
(0.067 4x BSC)
PLATING 0.381 - 1.016 BASE METAL
0.381 M B A M (0.015 - 0.040)
Dimensions
mm
(inches)
0.356 - 0.610 0.356 - 0.559
(0.014 - 0.024) (0.014 - 0.022)
LEAD TIP

0.381 - 0.965
(0.015 - 0.038)

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5.5.5 PI (8-Pin DIP)

9.652 ± 0.381 7.620 ± 0.254 PCB Hole Pattern

2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010)
(0.100 ± 0.005) 8-0.800 DIA. 2.540 ± 0.127
(8-0.031 DIA.) (0.100 ± 0.005)
9.144 ± 0.508
6.350 ± 0.127 (0.360 ± 0.020)
(0.250 ± 0.005)

Pin 1 3.302 ± 0.051

0.457 ± 0.076 (0.130 ± 0.002)
(0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127
(0.285) (0.300 ± 0.005)
7.620 ± 0.127
4.064 TYP (0.300 ± 0.005)
(0.160) 0.254 ± 0.0127
(0.010 ± 0.0005)

Dimensions
0.813 ± 0.102 mm
(0.032 ± 0.004) (inches)

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IXD_614-R08
©Copyright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2017

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