SonKen SANKEN ELECTRIG COMPANY, LTD. M2 tt RF SPECIFICATIONS 4 % DEVICE TYPE NAME PNRM IRM y avy — hav ERR MN2488 SANKEN MOLD TYPE SILICON POWER TRANSISTOR MN2488 1. S80 Scope COMM, BUR ILM YY ay 7 bD y Y RB MN2AB8 OTH So ‘The present specifications shall apply to Sanken silicon power transistor type MIN2488. 2. ME + BBE ‘Appearance and outline drawings 2-1 Ht ‘Appearance AUkit, PHN, HL, AGC RIMS ST Le ‘The body shall be clean and shall not bear any stain, rust or flaw. 2-2 WE Se Outline drawings MloL eb etSs Refer to Fig. 23 OR Marking AICHE. wy MBSE AR ICH AWE 5 ACHES ST Lo ‘The type number and lot mumber shall be clearly marked in white, Bvt mosssng Nov. / 18 / 1998 21 A 1S 2 HG EH fe ea LF lige ater I eon neues se Mum van YAree Dow vehi SSE-21317 : 61036-02SanKen SANKEN ELECTRIC COMPANY, LTD. . FE HS Racings 3-1 MEK A EH (MERI 250) ‘Absolute Maximum Ratings (Tae25¢ ) H 5 ms z & a ‘Characteristic: Symbol Rating Unit aUD R.A REE Collector Base_Voltage Yeso 160 v a a Re Rok rE Corlcreaivet Vousge” *”_™ Vero 150 v tp Rk. eH ; Frntter Bice Volage 5 a aoe of F & me 10 a Collector_Current fags euro eee eee 1 A a f & 7 Collector Power Dissipation Pe 150 (Te=25C) Ww e ¢ 8 & ; Junction Temperature Tj 150 ke Bonge Tent = © | tse =55~4150 c 3-2 EO EH (IERIE 25°C) Electrical Characteristics (Ta=25 ) a tI RS x 3G _ 8 Limits _| pyr Characteristic Symbol ‘Test Conditions _| MIN | TYP |MAX | unit BKav ee ew | Collector Cutoff Current cBo | Veg=160 V, Ip= 0A 100 |HA BRE * BE ee TBO | Vap=5VeIc 0A 100 | HA BU7R+ aioe ME ly Collector-Emitter Voltage ‘CEO | Ig= 30 mA 150 v kt 2 ek MH a DC Current Transfer Ratio bre | Vog=4V.Io=7A [5000 0000) Lee ns ye mmBE fy - - 25 CotleciorEmiuer Saturation Voltage | CP6%| Fo= 7 As Ia 7mA ¥ scarey smmme ly Base-Emitter Saturation Voltage Baise] Io= 7 A, Ip= 7mA Bay: x of Bw & Cutoff Frequency fr | Vogel? V, Ip= -2A 55 /MEz| zo PRE R & Ven=10 V, I= 0A, Output Capacitance Cob} 6a Mie 95 pr * hen x? 1 $000~12000(0), 6500~20000(P), 15000~30000(¥) SSE-21317 217 61039SonKen SANKEN ELECTRIC COMPANY, LTD. MICA-14 (MT100) gas® BH: etn Material “MICA +0.045 ma: 0.06' -0.005 ‘Thickness Dimensions in mm DWG No. : 4A-E01560 SSE-21317 3/7 61039ScnKen SANKEN ELECTRIC, COMPANY, LTD. AICTE LFLOO Outline Drawings of Lead Forming No.100 — is6 4 | aes oda || Zfy% = ee 44 a [avr wD 4 MN2488, b ic h L i -! a on™ ICE BEES TH st Teter ‘The last digit of year BIE A 2nd letter == Month 1~9A TIETRE 108 :O ASN 128 :D (to 9 for Jan. to Sept., ©. REED » > (0 for Oct. N'for Nov. D for Dec.) FE rank SA Equivalent Circuit ‘ y= Fe cu NA ORR y 7am 2 Lead termina [Ni plating solder dip treatment en hyy? Nite + R: 700 Typ Heat sink Cu _|Ni plating ‘i 2 Hw ee i Description Material Specification fies GED KEISER, I — KATO ART. Pas a 3 shows the dimensions measured at the botiom of lead. 4B-E01138 SSE-21317 AIT 61039SconKen SANKEN ELECTRIG COMPANY, LTO. A\ 8H OB CAUTION / WARNING PERM, HERRLOND Ru pik LochSMRe Res BHe rd esoc, ERHRCHRENET KS SRMOORLET. Since reliability can be affected adversely by improper storage environment and handling methods during Characteristic tests, please observe the following cautions. Rt LozeeR Cautions for Storage @ REMI, FAS~35C), HW(4O~75%) BEL , MMS CMMTLOAE & BPE CCE ‘Ensure that storage conditions comply with the standard temperature (5 to 35) and the standard relative humidity (around 40 to 75%) and avoid storage locations that experience extreme changes in temperature or humidity. @ BRN AON ASE Le UROD A ALT CA IER BETC < TER 0 ‘Avoid locations where dust or harmful gases are present and avoid direct sunlight. © RHREL ALO, BRANCH Hee 9 — FORE ICO CHHRL T <7 Og Reinspect for rush in leads and solderbility that have been stored for a long time. (2) HER, Behe bore aa Cautions for Characteristic Tests and Handling O@LAMHACHEMRETS BAR, MER LOF- TREO, MFMY a — be BURRS ICT CER K HE oo EREML LOM (EE ro ‘When characteristic tests are carried out during inspection testing and other standard tests periods, protect the Power Transistors from surge of power from the testing device, shorts. between the Power Transistors and the heatsink Q)yJa-yv7I—AzKcowe Silicone Grease OKT DH CCHMIC SEH, A FI VRE LRRMOMORMEHE DE < FERDIC. AI N IY PAR ORME LURLOMMICY I 2-7 7) 2M AHI BRL CHEM. vay 7) —AOMMICE oCHAA AAD AIICES L. MLO EL EF EABCEREDEFOT, Y) 3-7 7 — AOE DAMIBEET OTC HEE 0 When using a heatsink, please coat the back surface of the Power Transistors and both surfaces of the insulating plate with a thin layer of silicone grease to improve heat transfer between the Power Transistors and the heatsink. ‘There are types of silicone grease of which oil ingredients may permeate the inside of products. Since there is a possibility that it may shorten the lifetime of the products, please pay sufficient attention to the choice of the silicone grease. HRY Yay 7IR—Z Recommended Silicone grease © G146 (tEAM (HR) Shin-Etsu Chemical Co., Ltd.] © YG6260 (HZ v3 3— » (HK) Toshiba Silicone Co., Ltd.) © sci02 DRE yaa yey) ay (i) Dow Coming Toray Siticone Co., L.] SSE-21317 S/T 61039SonKen SANKEN ELECTRIG COMPANY, LTD. (4) KAO RD AD ARIConT Mounting Method of Heatsink @ nvomvny haz icowc ‘Torque when Tighening Screws Mounting MPOALT FA 7 DNR Ve EAMETAA SRD, BALD LET. HALO be 7 as ABW" SL, DULHUMRY, MARERWS TLD, EAMGAZV—ACBH BEC, MHTSCERSVEFOC, MROWRICED, Table] OMA bA7 EHEROR LET. ‘Thermal resistance increases when tightening torque is small, and radiation effects are decreased. ‘When the torque is too high, the screw can cut, the heatsink can be deformed, and/or distortion ccan arise in the product’s frame, To avoid these problems, Table 1. show the recommended tightening torques for each product type. Table 1. Screw Tightening Torques Package Screw Tightening Torques M25 _FM20_(TO-220 & Full Mold) | 0.490 to 0.685 N+ m (6 to 7 kgf cm) MT100_FM100 (TO-3P & Full Mold) | 0.686 to 0.822 N+ m_(7 to 9 kgf+ cm) MT200_(TO-3P Wide 2Screw Type) | 0.686 to 0.822 N+ m_(7 to 9 kgf+ cm) 2GR_(6Pin SIP) 0.688 to 0.822 N+ m_(7 to 9 kgf om) SLA__(10Pin SIP) 0.588 to 0.784 N= m_(6 to 8 kgf> cm) @ KMRORKE : 4mmoF Diameter of hole of heatsink : Less than 4mm REBOOT VAREBOX LEE, MOAT FIC MEMO 7 I > ORME S REO, EHF STL. {As the slack of press mold for making the hote will be the cause of resin crack at the mounting, please pay special attention for that. (5) FEIT HE ICO oe Soldering Temperature WANT ORL, FRR ADATCHIIES ED IDRTIICIRET 5 £5. CHEEK HER 0 ‘When soldering the products, please be sure to minimize the working time, within the following conditions @260C 10sec. (V7 H—-RRFH-YAKY YT) Reflow or flow soldering ©3500 — 35sec, CHET) ‘Soldering iron (at a distance of 1.5mm from the main body of Power Transistors) SSE-21317 6/7 61039ScanKen SANKEN ELECTRIG_ COMPANY, LTD. (6) Ofte Others SKA CHM ro SHIRDI, BALOBSE LCRLAVOT. THOICEA, PSMthb L< RRSHOT RDA, MUNDANE, t OOMAO RSM Ion cat BIBEE® Pn EEA ‘Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsiblity for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. @APR CME NCE MRETRAOBS A, CHOOMRLE AME OM AAdHICOVT SAROMECK A CHR - HITE OTP Mo When using the products herein, the applicability and suitability of such products for the intended purpose object shall be reviewed at the users responsibitity OSHAAA, (PROM ECHOCHETH, AMARA, DOT CORM, MO FUL NETL. BHOMMIC KORE LC. AFM, ARM, HRMS BETES, SHHORECKOT, BBS AFH ECTHARSEMR URE FOTFE Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. OAS cHMS nce s BAe, MSTA RBM, We RARE. ETRE RENCGATNSCEEBMLCHD ET, CRORE, MAHEEIC ESL EOL CHAE BRU LET. Bi AMIRLEATDR & tS SEHR (WG AE CX OBOE, FSH SHOE, BHM + BATU, PRR E)AO IDE CRM OBRIC ti, ET MAIER OS CARR TE IC BARGMIOL, CHEM LET. MD Ci BEER S th 6 ERNE RR, FH, AEM OO ERR RENCE OSH ICL SAMA WED ALAC PE re ‘Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Please return to us this document with your signature(s) or seal(6) prior to the use of the products herein. ‘When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment, and its control systems, traffic signal control systems or equipment, firefcrime alarm systems, various safety devices, etc), please contact your nearest Sanken sales representative to discuss, and then return to us this document with your signature(s) or seal(s) prior to the use of the products he ‘The use of Sanken products without the written consent of Sanken in the applications where extremely hhigh reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. OAM AMET LCD ELL. ‘Anti radioactive ray design is not considered for the products listed herein. SSE-21317 WT 61039