Xeon Phi Processor x200 Product Family Design Guide Unlocked

Intel® Xeon Phi™ Processor x200
Product Family
Thermal/Mechanical Specification and Design Guide (TMSDG)
June 2017
Revision 002
Order Number: 334785-002

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Intel® Xeon Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
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Contents
1 Introduction ..............................................................................................................8
1.1 Objective ........................................................................................................... 8
1.2 Scope ................................................................................................................ 8
1.3 References ......................................................................................................... 9
1.4 Terminology ..................................................................................................... 10
2 Processor Mechanical Design................................................................................... 12
2.1 Processor Package Mechanical Specifications ......................................................... 12
2.2 Processor Package Description ............................................................................ 12
2.3 Package Mechanical Dimensions .......................................................................... 14
2.3.1 Package Critical-to-Function Attributes ...................................................... 15
2.3.2 Other Processor Package Specific Design Attributes..................................... 15
2.4 Processor Mass ................................................................................................. 16
2.5 Processor Material ............................................................................................. 16
2.6 Processor Markings............................................................................................ 16
2.7 Processor Mechanical Load Specification ............................................................... 17
2.8 Processor Insertion Specification ......................................................................... 17
2.9 Processor Handling Guidelines............................................................................. 17
3 Socket Mechanical Design........................................................................................ 19
3.1 LGA3647-1 Socket Overview............................................................................... 19
3.1.1 Socket Features ..................................................................................... 20
3.1.2 Socket Mechanical Requirements .............................................................. 21
3.2 Socket Critical-to-Function Interfaces................................................................... 22
3.3 Socket Components........................................................................................... 23
3.3.1 Socket Housing ...................................................................................... 23
3.3.2 Markings ............................................................................................... 25
3.3.3 Socket-Package Contact Characteristics..................................................... 26
3.3.4 Solder Ball Characteristics ....................................................................... 29
3.4 Socket Size ...................................................................................................... 30
3.5 Actuation and Insertion Requirements .................................................................. 30
3.5.1 Package Translation................................................................................ 30
3.5.2 Insertion/Removal/Actuation Forces.......................................................... 30
3.6 Orientation in Packaging, Shipping, and Handling .................................................. 31
3.7 Pick-and-Place and Dust Cover............................................................................ 31
3.7.1 Socket and Pick-and-Place Cover Durability ............................................... 31
3.8 Keep-In/Keep-Out Zone ..................................................................................... 31
4 Retention Assembly Mechanical Design ................................................................... 32
4.1 Mechanical Retention Assembly ........................................................................... 32
4.1.1 Backplate .............................................................................................. 32
4.1.2 Bolster Plate with Spring ......................................................................... 33
4.1.3 Processor Package Carrier ....................................................................... 34
4.1.4 Heatsink ............................................................................................... 36
4.2 Mechanical Load Specifications ............................................................................ 36
4.3 Heatsink Mechanical Requirements ...................................................................... 38
5 Board and System Design Guidelines ....................................................................... 39
5.1 Mechanical Design Considerations........................................................................ 39
5.1.1 Components Volumetric .......................................................................... 39
5.1.2 Components Mass .................................................................................. 39
5.1.3 Package/Socket Stack-up Height .............................................................. 40
5.2 Printed Circuit Board (PCB) Design Considerations ................................................. 40
5.2.1 Allowable Board Thickness....................................................................... 40
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5.2.2 Reference Board Layout...........................................................................40

5.2.3 Board Keep-outs.....................................................................................40
5.2.4 Suggested Silkscreen Marking for Socket Identification ................................40
5.2.5 Board Deflection .....................................................................................41
5.3 Fabric Cable Assembly Design Guidance................................................................41
6 Thermal Specifications and Design Guidelines..........................................................42
6.1 Thermal Specification Overview ...........................................................................42
6.1.1 Thermal Design Power (TDP) and TCASE Specifications ................................42
6.1.2 Case Temperature Geometry and Influence Factors .....................................44
6.1.3 Socket Maximum Temperature .................................................................47
6.1.4 Storage Conditions Specifications..............................................................48
6.1.5 Reference Design Thermal Interface Material (TIM) .....................................48
6.1.6 Reference Thermal Solution Performance Targets........................................49
6.2 Thermal Design and Management Guidelines .........................................................49
6.2.1 System Thermal Environmental Conditions .................................................49
6.2.2 Thermal Solution Performance Characterization ..........................................50
6.2.3 Thermal Test Vehicle (TTV) Correction Factors ............................................51
6.2.4 Thermal Management Guidelines ..............................................................51
A Quality and Reliability Requirements .......................................................................53
A.1 Thermal/Mechanical Solution Stress Test ..............................................................53
A.1.1 Customer Environmental Reliability Testing ................................................54
A.1.2 Socket Durability Test .............................................................................54
A.1.3 Intel Reference Component Validation .......................................................54
A.2 Ecological Requirement.......................................................................................55
B Supplier Listing ........................................................................................................57
B.1 Intel Enabled Supplier Information .......................................................................57
C Processor Package Mechanical Drawings .................................................................61
D LGA3647-1 Socket-P1 Mechanical Drawings.............................................................66
E Retention Assembly Mechanical Drawings................................................................71
F Mechanical KOZs .................................................................................................... 111
F.1 Main Board Mechanical KOZs ............................................................................. 111
Figures
1-1 Processor Mechanical Assembly................................................................................ 8
2-1 Processor Package Assembly Sketch ........................................................................13
2-2 Processor with Fabric Package Assembly Sketch ........................................................13
2-3 Processor with the Integrated Heat Spreader ............................................................14
2-4 Processor with Fabric Package Features and Design Attributes.....................................15
2-5 Processor Top and Bottom View ..............................................................................16
2-6 Processor with Fabric Top and Bottom View ..............................................................17
3-1 LGA3647-1 Socket Assembly with PnP Covers ...........................................................20
3-2 Hexagonal Array in LGA3647 Socket BGA Ball Footprint..............................................21
3-3 Socket-P1 and Bolster Plate Assembly Alignment Features ..........................................24
3-4 Socket-P1, Mechanical Retention Assembly and PHM Alignment ...................................24
3-5 LGA3647-1 Socket Contact Orientation ....................................................................26
3-6 Offset between LGA Land Center and Solder Ball Center .............................................27
3-7 Offset between LGA Land Center and Solder Ball Center .............................................28
3-8 Contact Force Versus Contact Deflection Range .........................................................29
3-9 Wetting Angle and Wetting Height ...........................................................................30
4-1 Backplate and Insulator with Mounting Screws ..........................................................32
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4-2 Bolster Plate and Spring ........................................................................................ 34

4-3 Processor Package Carrier...................................................................................... 35
4-4 Processor with Fabric Package Carrier...................................................................... 35
4-5 Processor Mechanical Assembly .............................................................................. 36
6-1 Processor Package Thermocouple Locations, Top view ............................................... 45
6-2 Processor with Fabric TCASE Measurement Locations. ................................................. 46
6-3 Psi Curves for the Reference Thermal Solution (Mean+3 Sigma).................................. 47
6-4 Reference Heatsink Pressure Drop Curve ................................................................. 50
C-1 Processor PMD (Sheet 1 of 2) ................................................................................. 62
C-2 Processor PMD (Sheet 2 of 2) ................................................................................. 63
C-3 Processor with Fabric PMD (Sheet 1 of 2) ................................................................. 64
C-4 Processor with Fabric PMD (Sheet 2 of 2) ................................................................. 65
D-1 Socket Mechanical Drawing (Sheet 1 of 4)................................................................ 67
E-1 Backplate Assembly, 1/3........................................................................................ 73
E-4 Bolster Plate Assembly and Dust Cover .................................................................... 76
E-5 Bolster Plate Assembly, 1/2.................................................................................... 77
E-6 Bolster Plate Assembly, 2/2.................................................................................... 78
E-7 Heatsink Module Clip (non-Fabric), 1/2 .................................................................... 79
E-8 Heatsink Module Clip (non-Fabric), 2/2 .................................................................... 80
E-9 Heatsink Module Clip (Fabric), 1/2 .......................................................................... 81
E-10 Heatsink Module Clip (Fabric), 2/2 .......................................................................... 82
E-11 Backplate ............................................................................................................ 83
E-12 Backplate Insulator ............................................................................................... 84
E-13 Back Plate, M3 Stud .............................................................................................. 85
E-14 Bolster Plate, 1/2.................................................................................................. 86
E-15 Bolster Plate, 2/2.................................................................................................. 87
E-16 Bolster Plate, Insulator .......................................................................................... 88
E-17 Bolster Plate, Small Guide Post ............................................................................... 89
E-18 Bolster Plate, Large Guide Post ............................................................................... 90
E-19 Bolster Plate, LEC Guide Pin ................................................................................... 91
E-20 Bolster Plate, Corner Standoff ................................................................................ 92
E-21 Bolster Plate, Spring Assembly ............................................................................... 93
E-22 Bolster Plate, Spring ............................................................................................. 94
E-23 Bolster Plate, Spring Stud, M4 ................................................................................ 95
E-24 Bolster Plate, Spring Rivet ..................................................................................... 96
E-25 Bolster Plate, M3 Captive Nut ................................................................................. 97
E-26 Bolster Plate, M3 Captive Nut Collar ........................................................................ 98
E-27 Socket-P, Dust Cover, 1/2 ..................................................................................... 99
E-28 Socket-P, Dust Cover, 2/2 ................................................................................... 100
E-29 1U Heatsink Assembly, 1/2 (Reference Only).......................................................... 101
E-30 1U Heatsink Assembly, 2/2 (Reference Only).......................................................... 102
E-31 1U Heatsink, 1/2 (Reference Only) ........................................................................ 103
E-32 1U Heatsink, 2/2 (Reference Only) ........................................................................ 104
E-33 1U Heatsink, Label (Reference Only) ..................................................................... 105
E-34 1U Heatsink, PCM45F TIM (Reference Only)............................................................ 106
E-35 1U Heatsink, Nut, M4, 1/2 (Reference Only) ........................................................... 107
E-36 1U Heatsink, Nut, M4, 2/2 (Reference Only) ........................................................... 108
E-37 1U Heatsink, Nut Collar (Reference Only) ............................................................... 109
E-38 1U Heatsink, Delrin* Washer (Reference Only) ....................................................... 110
F-1 Processor Heatsink Module Topside Keep-Out Zone ................................................. 112
F-2 Processor Heatsink Module Mounting Holes Keep-Out Zone....................................... 113
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F-3 Processor Heatsink Module Backplate Keep-Out Zone ............................................... 114
Tables
1-1 Related Documents ................................................................................................ 9
1-2 Terms and Terminology .........................................................................................10
2-1 Processor Materials................................................................................................16
3-1 LGA3647-1 Socket Attributes ..................................................................................20
3-2 Socket Loading and Deflection Specifications ............................................................22
3-3 PnP Cover Ergonomics Requirements .......................................................................30
4-1 Bolster Plate Mechanical Load Specifications .............................................................37
4-2 Back Plate Design Criteria ......................................................................................37
4-3 Bolster Plate Design Criteria ...................................................................................37
4-4 Heatsink Mechanical Attributes................................................................................38
5-1 LGA3647-1 Socket and Retention Component Mass ...................................................39
6-1 TDP and TCASE Specifications - 215W/230W SKUs ......................................................42
6-2 TDP and TCASE Specifications - 245W/260W SKUs ......................................................43
6-3 Processor TCASE Influence Parameters ......................................................................45
6-4 Storage Condition Ratings ......................................................................................48
6-5 TIM Specification...................................................................................................48
6-6 Reference Heatsink Boundary Conditions and Performance Targets ..............................49
6-7 Thermal Solution Performance Design Targets and Environment ..................................49
A-1 Example Thermal Stress Test: Use Condition Environment Definitions ..........................53
A-2 Example Mechanical Stress Test: Use Condition Environment Definitions.......................54
B-1 Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information..........58
C-1 Processor Package Drawing List ..............................................................................61
D-1 Socket Drawing List...............................................................................................66
E-1 Mechanical Drawing List .........................................................................................71
F-1 Mechanical Keep-Out Zone Drawing List ................................................................. 111
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Revision History
Document Revision
Description Revision Date
Number Number
334785 001 Initial release. August 2016

• Section 3.3.3 - Updated contact area plating information.
• Section 4.1.2 - Updated note regarding Nut Durability Spec.
334785 002 • Appendix B - Updated Intel and vendor P/Ns. June 2017
• Appendix E - Updated assembly mechanical drawings.
• Appendix F - Updated Topside KOZ Drawing.
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Introduction
1 Introduction
1.1 Objective
This document provides processor thermal/mechanical specifications and design
guidelines for development of thermal and mechanical solutions for the Intel® Xeon
Phi™ Processor x200 Product Family. This second generation Intel Xeon Phi product
family now offers a line of socketed processors in addition to a line of PCIe* card-based
coprocessors; but the coprocessor offerings are not discussed in this document.
Throughout this document, unless specified otherwise, the term “processor” represents
any member of the Intel Xeon Phi Processor x200 Product Family; where distinction is
necessary, the term “processor with fabric” will represent the Intel Xeon Phi™
processor with integrated Intel® Omni-Path Fabric (Intel® OP Fabric).
1.2 Scope
Figure 1-1 provides a conceptual illustration of the processor mechanical assembly.
Explicit hardware design and assembly details are provided in Section 2 through
Section 5 of this document.
Figure 1-1. Processor Mechanical Assembly
Heatsink
Assembly
Processor
Package Heatsink
Carrier Loading
Module
TIM (PHLM)
(PCM45F)
Processor
Bolster Plate
Assembly
Socket-P1
Main Board
Back Plate
Assembly
The components and information described in this document include:

• Processor package mechanical design specifications and integration guidelines.
• Processor socket mechanical design specifications and integration guidelines.
• Processor and heatsink mechanical retention assembly design specifications and
system design and integration guidelines.
— Back and bolster plate assembly design details, including loading targets.
Intel® Xeon® Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
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Introduction
— Reference designs for the Processor Heatsink Module (PHM).

• Board and system integration and design guidance.
• Processor thermal specifications and design guidance, reference board and
reference air-cooled thermal solution (which includes the reference heatsink).
Thermal and mechanical design aspects which directly impinge on the processor
package and the socket (by extension) must be treated as design specifications.
Consideration of mechanical retention assembly loading targets and physical design
attributes as specification or recommendation depends on the degree to which the user
adopts the reference design.
The purpose of this specification and design guide is to describe and document these
design requirements, as well as the mechanical retention approach and the reference
thermal solution from Intel, for the processor. Guidelines for designing a thermal
solution that meets product lifetime requirements will also be discussed.
This document is intended for use by:

• Board and system thermal and mechanical designers.
• Designers and suppliers of processor thermal solutions.
The guidelines recommended in this document are based on experience and simulation,
and preliminary work done at Intel while developing the processor. This work is ongoing
and the recommendations and specifications are subject to change.
1.3 References
Table 1-1 lists additional resources to assist with processor mechanical and thermal
design solutions. For a complete list of documentation, contact your local Intel
representative or go to www.intel.com.
Table 1-1. Related Documents

Document
Document Notes
Number
Intel® Xeon Phi™ Processor x200 Product Family Datasheet, Volume One: Electrical 334710 1
Intel® IA64 IA32 Architecture Software Developers Manual 325462 2
European Blue Angel Recycling Standards 3
Environmental Product Content Specification for Suppliers and Outsourced

18-1201 4
Manufacturers
Notes:
1. Available at http://www.intel.com/content/www/us/en/processors/xeon/xeon-phi-processor-x200-product-
family-datasheet.html
2. Available at http://www.intel.com/content/dam/www/public/us/en/documents/manuals/64-ia-32-
architectures-software-developer-manual-325462.pdf
3. Available at https://www.blauer-engel.de/
4. Available at https://supplier.intel.com/static/EHS/Environmental_Product_Content_Specification.pdf
Order Number: 334785-002 Intel® Xeon® Phi™ Processor x200 Product Family TMSDG
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Introduction
1.4 Terminology
Table 1-2 provides a list of common terms used in this document, along with a brief
description.
Table 1-2. Terms and Terminology (Sheet 1 of 2)
Terms Terminology
BOL Beginning of Life, initial time period relevant to product quality and reliability testing
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For
this example, it can be expressed as a dimension away from the outside dimension of the fins
to the nearest adjacent surface.
DTS Digital Thermal Sensor: On-die circuit used for estimating local die temperature which is then
converted to a digital value.
EOL End of Life, final time period relevant to product quality and reliability testing
FSC Fan Speed Control, algorithms developed to optimize cooling vs air flow vs acoustics, etc.
IFP Cable Intel® Fabric Passive (IFP) internal cable assembly enables high speed, low loss data
connections between the Intel processor and chassis connections to an external fabric
interface.
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
KOZ Component Keep-Out Zone usually provided for a board or system to avoid mechanical
interference or performance problems.
LEC54A Linear Edge Connector 54 pin, high speed, low loss, edge connector designed specifically for
Intel Xeon® Phi processors with integrated fabric interconnects.
LGA Land Grid Array processor package and socket interface
MCDRAM Multi-Channel Dynamic Random Access Memory
PECI Platform Environment Control Interface, standard for thermal management using DTS, is a
one-wire interface that provides a communication channel between Intel processor and
chipset components and external monitors.
PHM Processor - Heatsink - Module
CA Case-to-ambient thermal resistance, a thermal performance characterization parameter

(Psi_CA). A measure of thermal solution performance using total package power.
Defined as (TCASE – TLA) / (Total Package Power).
TCASE is the IHS temperature at a specific location and TLA is the local ambient air
temperature. The heat source should always be specified for  measurements. The unit is
°C/W.
CS Case-to-sink thermal resistance, a thermal performance characterization parameter. A
measure of thermal interface material performance using total package power.
Defined as (TCASE – TSINK) / (Total Package Power).
SA Sink-to-ambient thermal resistance, a thermal performance characterization parameter. A

measure of heatsink thermal performance using total package power.
Defined as (TSINK – TLA) / (Total Package Power).
SKU A processor Stock Keeping Unit (SKU) to be installed in either server or workstation platforms.
For the Intel® Xeon Phi™ Processor x200 Product Family, different SKUs will be distinguished
by different marketing names and offer e.g., different numbers of cores, clock frequencies,
etc.
SMT Surface Mount Technology
SRO Solder Resist Opening.
TCASE The case temperature of the processor measured at specific locations on the topside of the
IHS, this is typically above the geometric center of a particular die (but may not coincide with
the geometric center of the IHS).
TCONTROL TCONTROL is a static temperature setting used as a trigger point for fan speed control.
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Introduction
Table 1-2. Terms and Terminology (Sheet 2 of 2)
Terms Terminology
TDP Thermal Design Power: The power envelope in which the design is expected to operate
normally without the need for throttling or other performance reduction operational modes.
The thermal solution should be designed to dissipate this target power level. TDP is not the
maximum power that the processor can dissipate.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink and
the processor IHS. This material fills the air gaps and voids, and enhances the transfer of the
heat from the processor IHS to the heatsink.
TLA The local ambient air temperature near the inlet of the thermal solution. This temperature is
usually measured at the upstream air of the heatsink.
TSA The system ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals
3.50 in, and so forth.
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Processor Mechanical Design
2 Processor Mechanical Design
2.1 Processor Package Mechanical Specifications

This section provides an overview of the processor package mechanical design and
integration. The package serves as the primary interface between the processor silicon
die and the rest of the system. The package provides electrical signaling and power
delivery as well as thermal transmission, mechanical physical attach, dimensional scale
translation and structural strength and stiffness. A solid understanding of the processor
design targets provides the necessary foundation to identify and establish thermal and
mechanical design requirements for the main board and the system.
To ensure compatibility with the processor and the Intel Xeon Phi Processor x200
Product Family-based platform, the mechanical processor retention and thermal
solution must meet the requirements and keep-out zones of both the processor and the
LGA3647-1 socket. This section provides specific package-related thermal and
mechanical design guidance.
2.2 Processor Package Description

The processor is a multi-chip package consisting of the processor silicon die and eight
MCDRAM chips, all housed in a Flip Chip (FC) Land Grid Array (LGA) package that
interfaces with the main board via an LGA3647-1 socket. The package incorporates an
Integrated Heat Spreader (IHS) attached to the top surface of the package substrate.
The processor die and MCDRAMs are mounted on the substrate beneath the IHS and
are thermally connected to the IHS via Thermal Interface Material (TIM).
The package IHS serves as the mating surface (interface) for the processor thermal
cooling solution, such as a heatsink or cold plate. The IHS transfers the non-uniform
heat from the die surface to the TIM on the base of the heatsink or cold plate, resulting
in a heat flux that is more uniform and spread over a larger surface area (though not
the entire IHS area). This allows more efficient heat transfer out of the package to an
attached cooling device.
The bottom side of the package has 3647 lands arranged in a hexagonal pad array
which interfaces with the LGA3647-1 socket. Figure 2-1 and Figure 2-2 show cross-
sectional sketches of the processor package components and how they are assembled.
The package components include the following:

• Processor die
• MCDRAMs
• Fabric die (processor with fabric only)
• Package substrate
• Thermal Interface Material (TIM)
• Integrated Heat Spreader (IHS)
• LGA lands (LGA3647-1 socket interface)
• Discrete components (top side)
• Discrete components (bottom side)
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Figure 2-1. Processor Package Assembly Sketch
Figure 2-2. Processor with Fabric Package Assembly Sketch
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These conceptual figures are not drawn to scale, and important design details may
have changed (e.g., keying). The Pin 1 fiducial can be seen in the lower-right corner of
these figures. Refer to Appendix C for the latest details on package dimensions and
features.
2.3 Package Mechanical Dimensions

The processor package is 76 x 60.5 mm (outside dimensions) and approximately 4.3
mm thick (bottom side of substrate to top of IHS, not including the Land Side
Capacitors [LSCs]). The processor with fabric package is similar in size, but includes a
25 mm wide extension centered on one edge; the extension protrudes out roughly 21
mm and provides gold-finger contacts for fabric cable connection.
Figure 2-3 shows a photograph of the IHS on a processor.
Figure 2-3. Processor with the Integrated Heat Spreader
Notes:
1. The hole in the IHS above allows for outgassing during TIM material curing. A second hole is added to the
processor with fabric IHS to assist with substrate alignment.
2. The Pin 1 fiducial is shown in the lower-right corner of this figure.
The processor package mechanical drawings are provided in Appendix C. These

processor package mechanical drawings include dimensions necessary to design a
thermal solution for the processor, including:
• Package dimensions and tolerances (height, length, width, etc.)
• IHS dimensions and tolerances
• IHS parallelism, flatness, and tilt
• Land dimensions
• Fabric package extension dimensions (processor with fabric only)
• Reference datum
The processor connects to the main board through a surface-mount-type LGA socket. A
description of the socket can be found in Section 3 and socket drawings are provided in
Appendix D.
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2.3.1 Package Critical-to-Function Attributes

The processor package land dimension details, base material, plating material and
plating thickness are provided in Appendix C. The following is a list of package Critical-
to-Function (CTF) attributes. CTF values are detailed on the processor package
drawings in Appendix C:
• Package Alignment Length
• Package Alignment Width
• Package Substrate Thickness
• Land Length
• Land Width
• Land True Position (Pattern Relating)
• Land Co-planarity
• Substrate Flatness
2.3.2 Other Processor Package Specific Design Attributes

Refer to Table C-1 for additional information on package markings, KOZs, tolerances,
parallelism, and tilt. Key package features and design attributes are enumerated below
in Figure 2-4, these include:
• Package Product ID socket keying notch
• Package PHM alignment keying notch
• Package Pin 1 Indicator (shown in Figure 2-5 and Figure 2-6)
Figure 2-4. Processor with Fabric Package Features and Design Attributes
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2.4 Processor Mass

The processor mass is 88.8 g, and the processor with fabric mass is 91.4 g. This
includes the mass of all components integrated on the processor package.
2.5 Processor Material

The table below lists some of the package components and associated materials.
Table 2-1. Processor Materials

Component Material
Integrated Heat Spreader Nickel Plated Copper
Substrate Halogen Free, Fiber Reinforced Resin
Package Lands Gold Plated Copper
Fabric Edge Connector Fingers Gold Plated Copper
2.6 Processor Markings

Refer to Table C-1 for detailed information on package surface mark and enabling mark
zones.
Figure 2-5. Processor Top and Bottom View
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Figure 2-6. Processor with Fabric Top and Bottom View
2.7 Processor Mechanical Load Specification

Refer to Section 3 and Section 4 for the mechanical loading specifications.
2.8 Processor Insertion Specification

Socket Insertion Cycling:
• The processor can be inserted into and removed from an LGA3647-1 socket 30
times.
IFP Cable Attachment Cycling (processor with fabric only):

• Mating and unmating of the processor package and the Linear Edge Connector
(LEC54A) on the Intel Fabric Passive (IFP) cable limit is 15 cycles.
2.9 Processor Handling Guidelines

The processor package may contain components on the top or bottom side of the
package substrate. To remove the processor from its shipping container or the tray,
grab and hold the processor along its long edges.
Avoid contacting the processor bottom side lands and/or gold fingers, and always use
Electrostatic Discharge (ESD) protective procedures and equipment.
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When installing the processor into the socket, care should be taken to ensure that the
processor is properly oriented, that is, the processor pin-1 is in the same direction as
the socket pin-1, and that there are no contaminations or foreign material on the land
pads or gold fingers.
In cases where the processor is not installed into the socket, it should be placed or
stored in the appropriate tray or container in order to avoid damaging the package
substrate or its bottom side components.
18

Socket Mechanical Design
3 Socket Mechanical Design
3.1 LGA3647-1 Socket Overview

This section describes the Surface Mount (SMT) Land Grid Array (LGA) socket for the
processor. The socket contains 3647 pins and provides I/O, power, and ground
connections from the main board to the processor package.
Socket definitions listed in this section are provided for design guidance only. Contact
vendors for explicit and detailed design guidance. Socket vendor contact information is
provided in Appendix B.
The socket has four main components, the two halves comprising the socket body and
the Pick-and-Place (PnP) covers for each half. The socket set is delivered by the
supplier with PnP covers attached to each appropriate half of the socket body. The main
body of the socket, which is made of electrically insulated material with resistance to
high temperature, houses the socket contacts. Key components of the socket are the
main body of the socket, socket contacts, surface mount features, and the protective
covers.
Due to the large size of the socket, it is made of two C-shaped halves. The two halves
are not interchangeable and are distinguishable from one another by the keying colors
and by the pin A1 indicator: The left half keying insert (can be molded) is the same
color as the body; the right half keying insert is white; and the right half also has a
molded chamfer for pin A1. Figure 3-1 illustrates the socket features. Keying features
(wall protrusions) within the contact array area and raised edges of the socket body
help align the package with respect to the socket contacts.
19

Figure 3-1. LGA3647-1 Socket Assembly with PnP Covers
3.1.1 Socket Features

LGA3647-1 socket attributes are listed in Table 3-1. The socket incorporates a roughly
rectangular pin grid with a hexagonal depopulation region in the center of the array and
selective depopulation elsewhere; see Appendix D. The pin field geometry is a
hexagonal array as shown in Figure 3-2 below. The tips of the socket pin contacts
extend above the surface of the socket to make contact with the pads located at the
bottom of the processor package.
Solder balls enable the socket to be surface-mounted to the main board. Each contact
has a corresponding solder ball. Solder ball position may be at an offset with respect to
the contact tip and base. Socket BGA ball hexagonal array ball-out pattern shown in
Figure 3-2 increases contact density by 12% while maintaining 39 mil minimum via
pitch requirements.
Table 3-1. LGA3647-1 Socket Attributes

LGA3647-1 Socket Attributes
Socket Wall Exterior Dimension 82 mm (L) x 62 mm (W)
Socket Wall Interior Dimension (Package Size) 76.16 mm (L) x 56.6 mm (W)
Pitch (hexagonal pattern) 0.8585 mm (X) x 0.9906 mm (Y)
Ball Count 3647
20

Figure 3-2. Hexagonal Array in LGA3647 Socket BGA Ball Footprint
33.8
mil
39
mil
The socket cover is intended to be reusable and recyclable. It enables socket pick-and-
place during main board assembly. the socket cover also protects the socket contacts
from contamination and damage during board assembly and handling.
Features of the socket include:

• Contact housing
• Processor package keying
• Package seating plane
• Side walls for package alignment
• Center cavity for the processor secondary side and main board primary side
components
3.1.2 Socket Mechanical Requirements

3.1.2.1 Attachment
The socket is designed for Surface Mounted Technology (SMT) assembly onto the main
board. The board assembly process and sequence may be different from one design to
another and may require multiple assembly steps. The socket will be attached to the
main board solely via its 3647 solder balls. There are no additional external methods
(screws, extra solder, adhesive, etc.) to attach the socket.
The socket is tested against mechanical shock and vibration requirements such as
those listed in Appendix A under the expected use conditions with all assembly
components under the loading conditions outlined in Section 3.1.2.2. Customer
dynamic loading should not exceed these levels.
3.1.2.2 Socket Loading and Deflection Specifications

Table 3-2 provides loading and board deflection specifications for the LGA3647-1
socket. These mechanical load limits should not be exceeded during component
assembly, mechanical stress testing, or standard drop and shipping conditions. All
dynamic requirements are under room temperature conditions while all static
requirements are under 125 °C conditions.
21

Table 3-2. Socket Loading and Deflection Specifications

Parameter SI Units
Notes
Min. Max. Unit
Static Compressive Load per Contact 10 25 gf 1
Static Compressive Load, Total (BOL) 180 300 lbf 2, 5
Static Compressive Load, Total (EOL) 138 300 lbf 2
Dynamic Compressive Load N/A 132 lbf 3
Board Transient Bend Strain - 62 mil board N/A 480  4
Notes:
1. The compressive load applied by the package on each LGA contact for required electrical performance.
2. The total compressive load applied by the heatsink onto the socket through the processor package.
3. The quasi-static equivalent compressive load applied during the mechanical shock. Dynamic compressive
limit has been calculated using the assumption of 2X dynamic amplification factor at CPU location using a
600g heat sink and a 50G table input. The product application can have flexibility in specific values, but the
ultimate product of mass times acceleration times corresponding amplification factor should not exceed this
dynamic compressive load limit.
4. Maximum allowable strain below socket BGA corners during transient loading events (i.e., slow
displacement events) which might occur during board manufacturing, assembly or testing. See the
LGA3647-1 Board Flexure Initiative (BFI) Strain Guidance Sheet. Contact your Manufacturer Certified
Quality Engineer (CQE) representative for this datasheet.
5. The Min. Total Static Compressive Load (BOL) specification only applies to the processor with fabric. (The
processor without fabric only requires that the Min. Total Static Compressive Load (EOL) be met over its
lifetime.)
The minimum static total compressive load ensures socket reliability over the life of the
product and that the contact resistance between the processor and the socket contacts
meets the specified values.
3.2 Socket Critical-to-Function Interfaces

The following is a list of Critical-to-function (CTF) attributes for the main board layout
and assembled components’ interface to the socket. All sockets manufactured meet
these specified CTF attributes.
• Socket Package Alignment Cavity Length and Width, and Datum Profile1
• Fine Alignment (Datum) Guiding Feature Chamfer Dimension
• Socket Body Length and Width, and Intermediate Alignment Profile
• Intermediate Alignment Guiding Feature Chamfer Dimension
• Socket Height (from Package Seating Plane to MB after SMT)1
• Seating Plane Co-planarity1
• Through Cavity Length and Width, and X and Y-Position
• Stand-Off Gap (Solder Ball Seating Plane to Stand-Off)
• Solder Ball Feature Relating True Position
• Solder Ball Co-planarity before SMT
• Contact Height Above Seating Plane1
• Contact True Position1
1. Dimensions are to be measured at pre and post SMT.
22

• Contact Co-planarity1
• PnP Cap Keep-in-zone Flatness1
3.3 Socket Components

3.3.1 Socket Housing
The socket housing material should be thermoplastic or equivalent, UL 94 V-0 flame
rating, temperature rating and design capable of maintaining structural integrity
following a temperature of 260 C for 40 seconds, which is typical of a reflow/rework
profile for solder material used on the socket. The material will have a thermal
coefficient of expansion in the XY plane capable of passing reliability tests rated for an
expected high operating temperature, mounted on low loss, low/High Tg FR4-type main
board material. The creep properties of the material will be such that the mechanical
integrity of the socket is maintained for the stress conditions outlined in Appendix A.
3.3.1.1 Housing Color

The color of the socket housing will be dark as compared to the solder balls to provide
the contrast needed for OEM’s pick-and-place vision systems. Components of the
socket may be different colors, as long as they meet the above requirement.
3.3.1.2 Socket Insertable Alignment Keys

The alignment keys for the package-to-socket alignment, and to ensure that the
correct package is inserted into the socket, should be insertable keys with the option of
a molded key for the left socket half only.
3.3.1.3 Package Installation/Removal Access

Access will be provided to facilitate the manual insertion and removal of the package.
No tool should be required to install or remove the package from the socket.
3.3.1.4 Package Alignment/Orientation

A means of providing fixed alignment and proper orientation with the pin A1 corner of
the processor package will be provided. There are three different levels of package
alignment:
• The first level is called gross alignment, which occurs due to the Bolster Plate posts
and corresponding PHLM holes.
• The second level is called intermediate alignment, which utilizes the socket exterior
corner walls with a 1.25 mm by 1.75 mm chamfer at the guiding portion.
• The third level is called fine alignment, which relies on the socket corner inner
surfaces (datum walls) with a 0.75 mm by 1.00 mm chamfer at the guiding portion.
23

Figure 3-3. Socket-P1 and Bolster Plate Assembly Alignment Features
Bolster Plate
Heatsink Leveling Stud
Bolster Plate
Small Coarse (Gross) Socket Wall
Alignment Post Bolster Plate
Alignment Features Large Coarse (Gross)
Alignment Post
Socket-P1 Key
Pin A1
The socket also has two orientation posts or protrusions (keys) placed on opposite
sides of the socket as noted in Appendix D. The package substrate will have keying
notches at the corresponding locations. When package keying notches align with socket
orientation posts, it prevents the package from being mistakenly installed with a 180°
in-plane rotation (also refer to Appendix C). The package sits flush on the socket
contacts when aligned.
Figure 3-4. Socket-P1, Mechanical Retention Assembly and PHM Alignment
24

3.3.1.5 Socket Seating Plane for Package

The socket seating plane for the package defines the minimum package height from
the main board. See Section 2 for details on package and IHS height above the main
board. The datum is defined by the top surfaces of seating plane standoffs which cause
a hard stop of package over the socket when the package and socket are loaded. There
are primary socket seating planes and secondary socket seating planes.
• Primary seating planes are located at areas where contacts are depopulated and
around socket cavity and center split locations as illustrated in Figure 3-1 and
Appendix D.
• Secondary seating planes are interstitial seating planes, which are small islands
within a pitch range and around each core pin except for manufacturing keep-outs.
Refer to Appendix D for more details.
Both primary and secondary seating plane areas and numbers of the seating planes are
maximized to avoid significant creep of the housing material when being loaded.
However, the seating plane standoffs should not touch the LGA lands on the bottom of
the package. Intel recommends that the nominal height of interstitial seating planes be
the same as the nominal height of primary seating planes, but the highest points of
interstitial seating planes will be no higher than the highest points of primary socket
seating planes. The seating plane co-planarity needs to meet the specification after the
socket has been mounted (soldered) to the board. Refer to Appendix D for details.
3.3.1.6 Strength of Socket Housing Material

The material of the socket housing is required to have a minimum yield strength of
35 MPa at 90 °C to minimize the risk of seating plane deformation.
3.3.1.7 Socket Standoffs

Standoffs will be provided on the solder ball side of the socket base to ensure the
minimum socket height after solder reflow and to prevent socket housing over
deflection after being loaded. It is required that wherever there is a top side primary
socket seating plane for a package, there should be a corresponding standoff on the
bottom side. A gap between the solder-ball seating plane and the standoff prior to
reflow is required to assure sufficient ball collapse during the surface mount process.
3.3.2 Markings
All markings required in this section can withstand a temperature of 260 C for
40 seconds, which is typical of a reflow/rework profile for solder material used on the
socket, as well as any environmental test procedure outlined in Appendix A, without
degrading. Socket marks are visible after it is mounted on the main board. Each socket
body half is marked with the following:
• Socket Name: LGA3647-1 (preferred font type is Helvetica Bold [min. 4 pt, or
1.5 mm]).
This mark is stamped or laser-marked as shown in the drawings.
• Manufacturer’s Insignia (font size at supplier’s discretion).
This mark is molded or laser-marked into side wall of the socket.
Both marks are visible after the socket has been surface-mounted to the main board,
with bolster plate assembly and pick-and-place cap installed.
• Lot Traceability - Each socket body half is marked with a lot identification code to
allow traceability of all components, date of manufacture (year and week), and
25

assembly location. The mark is placed on a surface that is visible after the socket
has been mounted on the main board, with bolster plate assembly and pick-and-
place cap installed. In addition, this identification code is marked on the exterior of
the box in which the unit is shipped. The preferred font type is Helvetica Bold [min
4 pt, or 1.5 mm].
This mark may be laser-marked.
• Visual Aids - The socket will have Pin A1 and package/socket alignment keys.
3.3.3 Socket-Package Contact Characteristics

• Contact Count - The total number of top-side contacts is 3647.
• Layout - The contacts are laid out in two “C” shaped regions opposing each other as
shown in Figure 3-5. The arrows in the figure indicate the wiping orientation of the
contacts in the two regions to be 60° about the horizontal axis. There are 1823 and
1824 contacts in the right and left halves of the socket, respectively.
Figure 3-5. LGA3647-1 Socket Contact Orientation
• Contact Base Material - High-strength copper alloy.

• Contact Area Plating - For the area on the socket contacts where the processor
lands will mate, there are two SKUs: One with 0.381 m [15 inches] and one with
0.762 m [30 inches] minimum gold plating thickness, both versions are over a
1.27 m [50 inches] minimum nickel under-plating in critical contact areas (area
on socket contacts where processor lands will mate) is required. No contamination
by solder in the contact area is allowed during solder reflow.
• Paddle - If a paddle is used, the paddle area should be nickel plated to a minimum
nickel thickness of 1.27 m [50 inches]. The paddle should have sufficient
compliance to assure the solder joint reliability under the load conditions in
Table 3-2.
26

• Lubricants - For the final assembled product, no lubricant is permitted on the

socket contacts. If lubricants are used elsewhere within the socket assembly, these
lubricants must not be able to migrate to the socket contacts.
• Co-Planarity - The co-planarity profile requirement for all contacts on the top side
of the socket is defined in Appendix D.
• True Position - The contact pattern has a true position requirement with respect to
applicable datum in order to mate with the package land pattern. Refer to
Appendix D for more details.
• Stroke/Load - The maximum vertical height of the contact above the package
seating plane is defined in Appendix D. The vertical stroke of the contact will, under
all tolerance and warpage conditions, generate a normal force load to ensure
compliance with all electrical requirements of the socket. The cumulative normal
force load of all contacts must not exceed the load limits defined in Table 3-2.
3.3.3.1 Contact/Pad Mating Location

The offset between processor package LGA land center and solder ball center is defined
in Figure 3-6. All socket contacts should be designed such that the contact tip does not
damage solder resist defining the LGA land during actuation and remains within the
substrate pad boundary as illustrated in Figure 3-7. All sockets will also not interfere
with solder resist at minimum static compressive load per contact as stated in Table 3-2
and at final installation after actuation load is applied. This requirement includes all the
X-Y tolerances such as socket size, substrate size, and pad true positional tolerance, as
defined in Appendix D. Also Intel recommends that the contact tip remains within the
substrate pad before any actuation load is applied.
Figure 3-6. Offset between LGA Land Center and Solder Ball Center
Note: All dimensions are in mm.
27

Figure 3-7. Offset between LGA Land Center and Solder Ball Center
3.3.3.2 Contact Load-Deflection Curve

The contact should be designed with appropriate spring rate and deflection range, as
illustrated by the blue curve in Figure 3-8 to ensure adequate contact normal force in
order to meet BOL (upper boundary) and EOL (lower boundary) performance targets at
all contact locations. Minimum contact normal force should make the contact meet the
electrical requirements. The maximum contact normal force should meet the
specification in Table 3-2. The LGA contact working range is defined as the difference of
contact deflection at the minimum contact load and the nominal contact deflection.
28

Figure 3-8. Contact Force Versus Contact Deflection Range
3.3.4 Solder Ball Characteristics

• Solder Ball Count - The total number of solder balls is 3647.
• Layout - The solder balls are laid out in two “C” shaped regions, as shown in
Appendix D.
• Material - Lead free SAC (SnAgCu) solder alloy with a silver content between 3%
and 4%, with a melting temperature of approximately 217 °C will be used. The
alloy will be compatible with standard Lead free processing such as immersion
silver and Organic Solderability Preservatives (OSP) main board Surface Mount
Technology (SMT) applications as well as a SAC alloy solder paste.
• Co-Planarity - The co-planarity (profile) requirement for all solder balls on the
underside of the socket is defined in Appendix D. The specification is applicable to
all temperature ranges when surface mounting the socket onto the main board.
• True Position - The solder ball pattern has a true position requirement with respect
to applicable datum in order to mate with the main board land pattern. Refer to
Appendix D for details.
3.3.4.1 Solder Ball Wetting Angle for Paddle Design

To minimize the risk associated with shock, vibration, and transient bend stresses, the
solder ball wetting angle must be controlled via ball attach process optimization such
that the post SMT wetting angle defined in Figure 3-9 is less than or equal to 90
degrees. In the event that a correlation can be identified between wetting height (also
defined in Figure 3-9) and wetting angle, the wetting height may also be used as a
measurable success criterion.
29

Figure 3-9. Wetting Angle and Wetting Height
3.4 Socket Size

The socket size will meet the dimensions as shown in Appendix D, allowing full insertion
of the package into the socket without interference. This information should be used in
conjunction with the reference main board keep-out drawings provided in Appendix F to
ensure compatibility with the reference thermal mechanical components.
3.5 Actuation and Insertion Requirements

3.5.1 Package Translation
The socket should be built so that the post-actuated seating plane of the package is
flush with the seating plane of the socket. Movement will be along the axis normal to
the seating plane.
3.5.2 Insertion/Removal/Actuation Forces

Any actuation will meet or exceed SEMI S8-95 Safety Guidelines for
Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment,
example Table R2-7 (Maximum Grip Forces), available at http://www.semi.org/.
The socket is designed so that no force is required to insert the package into the
socket, and no tool is required to insert or remove the package
.
Table 3-3. PnP Cover Ergonomics Requirements

Direction Description Min. Max. Comments
Vertical Closed position at 260 °C 0.75 lbf - While holding at reflow temp.
Closed position at room 3 lbf 22 lbf Pull off force for cap removal.
temperature.
In and Shock 0.8 lbf - During shipping.

Out of
Plane
In-Plane Removal - 1.7 lbf Will meet Ergonomic requirements.
PnP Cap - - +/- 3.5 mils placement accuracy; in-plane

slack.
30

3.6 Orientation in Packaging, Shipping, and Handling

Packaging media supports high-volume manufacturing. Media design will be such that
no component of the socket (solder balls, contacts, housing, and so on) is damaged
during shipping and handling. Each part number will be shipped from suppliers in
separate Joint Electron Device Engineering Council (JEDEC) trays; for example, all left
halves of the socket in one tray and all right halves in another. Tray height could be
taller than standard.
3.7 Pick-and-Place and Dust Cover

The pick-and-place cover retention will be sufficient to support the socket weight during
lifting, translation, and placement. The pick-and-place cover removal force should not
exceed 1.7 lbf in the horizontal direction, during manual operation. The pick-and-place
cover ergonomics requirements are listed in Table 3-3.
The pick-and-place cover will have openings so that the Pin A1 and keying inserts are
visible. To facilitate high-volume manufacturing, the socket should have a detachable
cover to support the vacuum type pick-and-place system. The cover will remain on the
socket during reflow to help prevent contamination. The cover can withstand 260 °C for
40 seconds (typical reflow/rework profile) without degrading.
The cover design should allow use of a tool to remove the cover. The force required for
removing of the cover should comply with the applicable requirements of SEMI S8-
0999 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor
Manufacturing Equipment. The removal of the cover should not cause any damage to
the socket body nor to the cover itself.
A separate socket dust cover, a single part covering both halves of the socket, is
provided for use after socket and main board integration for use as a protective device
to prevent damage to the contact field during handling. See Appendix E-27 and
Appendix E-28.
3.7.1 Socket and Pick-and-Place Cover Durability

The socket will withstand 30 cycles of processor insertion and removal. The maximum
part average and single pin resistances must be met when mated in the 1st through
30th cycles.
The socket pick-and-place cover will withstand 15 cycles of insertion and removal.
3.8 Keep-In/Keep-Out Zone

Socket keep-in and keep-out zones are identified on the main board to ensure that
sufficient space is available for socket placement and to prevent interference between
the socket and other components on the main board. These areas are illustrated in
Appendix F. It is the responsibility of the socket supplier to identify any required
deviation from design guidance identified here.
31

Retention Assembly Mechanical Design
4 Retention Assembly Mechanical

Design
4.1 Mechanical Retention Assembly

Unlike previous Intel processors that use an integrated loading mechanism or ILM, the
processor is designed to work with a spring-loading mechanism to provide retention to
the main board and the heatsink. Refer to Appendix E for specific mechanical design
details.
The main components of the socket stack for the processor are:
• Backplate
• Bolster plate with spring
• Processor package clip or carrier
• Heatsink
4.1.1 Backplate
The backplate provides structural rigidity to the entire heatsink and processor package
retention on the topside of the main board, and helps ensure long-term solder joint
reliability. It is 2.2 mm thick and made of carbon-steel material. There are cutouts for
component placements on the backside of the main board or socket. The backplate has
a total of seven holes for threaded bolts to attach it to the bolster plate on the opposite
side of the main board. The number and location of the holes is determined through
structural analysis. Between the metal backplate and the main board lies an insulator
to isolate the backplate from the routing and vias on the backside of the main board.
The total thickness of the backplate and insulator is 2.5 mm.
Figure 4-1. Backplate and Insulator with Mounting Screws
Insulator
Back Plate
Pin A1
Alignment
Mark 7 Bolts
32

4.1.2 Bolster Plate with Spring

The bolster plate is an integrated subassembly that includes two corner guiding posts
placed at opposite corners, nuts to mate with the back plate, and two springs that
attach to the heatsink via captive screws. The corner posts guide the Processor
Heatsink Module (PHM) as it is lowered over the socket. The corner posts act as coarse
position constraints in the X-Y direction to prevent the PHM from moving and potentially
damaging the processor package or socket. The springs on either side of the bolster
plate are attached via small rivets. The springs attach to the heatsink via screws. The
bolster plate screws tighten in nuts on the center of the heatsink. The springs are
pulled upward as the heatsink is lowered and tightened in place, creating a
compressive force between socket and heatsink. The resulting socket-to-processor
contact force ensures maximum contact areas between socket pins and processor
package lands, as well as between package and heatsink. The springs provide 180-250
lbf. The springs include stoppers on their outer edges, to prevent movement of the
heatsink in the Z-direction due to forces parallel to the main board. The entire bolster
plate and spring assembly with nuts and bolts is expected to be supplied as a single
unit by vendors.
Note: The PHLM heatsink nuts and bolster plate studs are rated to a durability specification of
12 installation and removal cycles, when using the reference designs with lubrication.
Lubrication is required on the bolster plate threaded studs and heatsink nut threads.
This is based on the visual inspection criteria of no observed dust/shavings greater
than 0.5 mm in length as seen from the naked eye from 24 inches away with direct
overhead lighting under cool white fluorescent light conditions [60-120 Ft-Candle (645-
1293 LUX)] or equivalent, and a viewing time of one visual pass of 5-7 seconds for
each surface. Refer to Appendix E, “Retention Assembly Mechanical Drawings” for
details on the hardware.
33

Figure 4-2. Bolster Plate and Spring
Heatsink
Small Coarse
Alignment Post
Bolster Plate
Assembly Leaf Spring
Assembly
Heatsink
Large Coarse
Alignment Post
Pin A1 Mark
Spring
Assembly
Bolster Plate Bolster Plate

Assembly
4.1.3 Processor Package Carrier

The carrier is an integral part of the Processor Heatsink Module (PHM). The processor
package is inserted into the carrier, then the Thermal Interface Material (TIM) and
heatsink are attached. The carrier design will grab onto the package, and keying
features will match cutouts on package. Hook-like features on the four corners of the
carrier will grab onto the heatsink. The carrier design changes depending on whether
the processor package does or does not integrate fabric.
34

Figure 4-3. Processor Package Carrier
Heatsink
Alignment
And Attach
Clips
Package
Clip
Pin A1
Alignment Package
Mark Alignment
Feature
Figure 4-4. Processor with Fabric Package Carrier
Heatsink
Alignment
And Attach
Clips
Package
Fabric End
Alignment Clip
Pin A1
Alignment Package
Mark Alignment
Feature
The keying features on the carrier ensure the processor package snaps into the carrier
in only one way, and the carrier itself can be attached to the heatsink in only one
orientation.
35

4.1.4 Heatsink
Intel’s heatsink solution requires a maximum volume of 83 mm x 110 mm x 27 mm. It
is made of a copper base with aluminum fins. There are 50 fins in total, each 0.3 mm
thick. The heatsink is integrated into the PHM which is attached to the bolster plate
springs via two captive nuts (T-30 Torx bit) on either side of the heatsink. The bolster
plate is held in place around the socket by the back plate.
.
Figure 4-5. Processor Mechanical Assembly
Heatsink
Assembly
Processor
Package Heatsink
Carrier Loading
Module
TIM (PHLM)
(PCM45F)
Processor
Bolster Plate
Assembly
Socket-P1
Main Board
Back Plate
Assembly
4.2 Mechanical Load Specifications

The bolster and the back plates are defined to meet the socket loading requirement and
to support the mass of the PHM in the socket during shock and vibration. PHM retention
mechanism has three critical functions:
• Deliver the force to seat the processor into the socket contacts.
• Distribute the resulting load evenly through the socket solder balls.
• Ensure electrical integrity/performance of the socket and package.
Mechanical specifications for the retention mechanism are defined to meet the
requirements stated above.
36

Table 4-1. Bolster Plate Mechanical Load Specifications

Parameter Min. Max. Notes
Total Heatsink Static Compressive Load 138 lbf (EOL) 300 lbf (BOL) 1, 3
Dynamic Load (with heatsink installed) N/A 132 lbf 1, 2
TIM Activation Pressure 20 psi N/A
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. Dynamic loading is defined as heatsink mass (0.6 kg) x 50 g load superimposed for an 11 ms duration
average on the static load requirement.
3. Bolster plate designs for the processor with fabric must meet an additional criteria (min. total static
compressive load, BOL), as given in Table 3-2. To achieve this, additional factors such as loading module
tolerances, package stack tolerances, load degradation, etc. must be considered.
Table 4-2. Back Plate Design Criteria

Parameter Value Note
Material thickness 2.2 mm To meet the PCB secondary side

clearance requirement.
Does not include insulator thickness.
Insulator thickness 0.178 mm
Tensile yield strength 250 MPa
Flatness within 0.2 mm Measured in unconstrained state, see

drawing notes in Appendix E-1.
PEM* Insert Pull-out Force 667 N Self-clinching backplate studs
PEM Insert Torque Out 2.25 N-m Self-clinching backplate studs
Outside perimeter 81.6 x 108.6 mm Customizing beyond this perimeter of

back plate should meet the reliability
objectives.
Cavity (7 total cutouts) See back plate mechanical drawings for

details.
Table 4-3. Bolster Plate Design Criteria

Parameter Value Note
Material thickness 1.5 mm To meet the PCB primary side clearance

requirement
Insulator thickness 0.178 mm
Tensile yield strength 758 - 930 MPa
Flatness 1.0 mm Measured in unconstrained state, see

drawing notes in Appendix E-4.
37

4.3 Heatsink Mechanical Requirements

The mass of the heatsink (HS) should not exceed 600 g. The heatsink mass limit and
the use of a back plate have eliminated the need for Direct Chassis Attach retention in
some implementations. Direct contact between back plate and chassis pan will help
minimize board deflection during shock. Table 4-4 lists heatsink mechanical attributes.
Table 4-4. Heatsink Mechanical Attributes

Attribute Target Comments
Stiffness 1 > 600 lbf/mm Short span point load

> 1250 lbf/mm Long span
> 1400 lbf/mm Short span distributed load
Flatness 0.077 mm (manifesting) Processor local flatness zone in drawing
Base Thickness > 4.5 mm w/ Cu HS base Requires new PHM clip for thickness > 4.5 mm
(reference HS base = 4.5 mm)
Static Load (Max) < 300 lbf Thermal validation at 200 lbf shown
Dynamic Load (Max) < 132 lbf Based on 600 g HS. Current HS mass = 424 g
Notes:
1. Heatsinks that do not meet or exceed these stiffness specifications will not be capable of providing the long
term loading that the LGA3647 socket requires. These stiffness specifications are related to socket
reliability; any potential thermal impact due to heatsink base deflection at lower stiffness levels needs to be
determined separately.
38
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Board and System Design Guidelines
5 Board and System Design

Guidelines
5.1 Mechanical Design Considerations

The processor mechanical retention assembly design and reference thermal solution
provided are appropriate for a Intel Xeon Phi Processor x200 Product Family-based
platform reference board integrated into a half-width 1U air-cooled server rack
enclosure. Any use of these components in a platform or configuration different from
the Intel reference platform requires a complete thermal and mechanical design and
validation in accordance with the customer design criteria. Also, if customer thermal
and mechanical validation criteria differ from the Intel criteria, the reference solution
should be validated against the customers design criteria. In all cases, customers must
validate their thermal and mechanical solution in accordance with their design and
environmental validation criteria, and should not rely solely on these design guidelines.
5.1.1 Components Volumetric

The baseboard Keep-Out Zones (KOZs) on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in Appendix F.
The overall volumetric keep-in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling assembly.
5.1.2 Components Mass

The Static Compressive Load should also be considered in dynamic assessments.
Direct contact between back plate and chassis pan will usually help minimize board
deflection during shock.
Table 5-1. LGA3647-1 Socket and Retention Component Mass

Component Mass1
LGA3647-1 Socket Body, Contacts and PnP Cover 42 g (21 g per half)
Backplate Assembly 134.8 g
Bolster Plate Assembly 62.1 g
Processor Package Processor: 88.8 g

Processor with Fabric: 91.4 g
Carrier Processor: 6.8 g

Processor with Fabric: 6.2 g
Heatsink < 600 g2
Notes:
1. May vary from supplier to supplier.
2. The reference heatsink mass is 424 g.
39

5.1.3 Package/Socket Stack-up Height

The integrated stack-up height (from the top of the board to the top of the IHS) of a
processor package and LGA3647-1 socket with the processor fully seated in the socket
is 6.99 ± 0.352 mm.
1. This data is provided for information only, and should be derived from:
a. The height of the socket seating plane above the main board after reflow, given
in Appendix D.
b. The height of the package, from the package seating plane to the top of the
IHS, and accounting for its nominal variation and tolerances that are given in
Appendix C.
2. This value is derived from a 3 Root-Sum-Square (RSS) calculation.
5.2 Printed Circuit Board (PCB) Design Considerations

5.2.1 Allowable Board Thickness
The components described in this document (namely back plate, bolster plate and
heatsink assemblies) support nominal board thicknesses in the range of 1.575 - 2.362
mm (0.062" - 0.093"). (The overall range including tolerances is given in
Appendix E-1.) Boards outside this range may require modifications to the back plate
and heatsink retention.
5.2.2 Reference Board Layout

The processor reference board is a single node PCB 173 x 360 mm (6.8 x 14.2 inches)
intended for a 1U rack (half width). In principle two boards could be arranged side-by-
side in a 1U rack, allowing 2 nodes per 1U in a full width rack. Denser configurations
may be possible, but are not considered in this document.
5.2.3 Board Keep-outs

Each of the components described in this document may require an area beyond its
physical size to accommodate component movement. In identifying the board keep-
outs one should also consider board and system assembly processes and tools. As a
reference, recommended board keep-out drawings (PCB top and bottom side) for the
LGA3647-1 socket, bolster plate, back plate and heatsink are made available in
Appendix F. PCB keep-outs include attach hole locations and sizes, component height
limits in the vicinity of the socket, and recommended areas to allow access to the
socket for processor installation.
5.2.4 Suggested Silkscreen Marking for Socket Identification

Intel is recommending that the socket name be silkscreened adjacent to the socket
such that it is visible after the bolster plate is installed.
40
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5.2.5 Board Deflection

Exceeding the maximum Board Deflection called out in Table 3-2 may result in socket
solder joint failure. Board deflection under the LGA3647-1 socket will be kept to an
acceptable level by adhering to the following conditions:
1. Following the design objectives of the Intel reference heatsink and back plate
2. Maintaining compliance to maximum static compressive load values
Placement of board-to-chassis mounting holes also impacts board deflection and

resultant socket solder ball stress. Customers should explore the impact of mechanical
shock for their designs as their heatsink retention, heatsink mass and chassis mounting
holes may vary.
5.3 Fabric Cable Assembly Design Guidance

This section applies only to designs supporting the processor with fabric.
• CPU Package Mechanical Design: Refer to Section 2 and Appendix C for the
processor with fabric package design details.
• Socket-P1 (LGA3647-1): The same socket supports both the processor and the
processor with fabric. There are no additional socket design issues to consider.
• Mechanical Retention Assembly Design: Refer to Section 4 and Appendix E for the
processor with fabric mechanical retention assembly design details. Note that only
the carrier differs for the two variations of the processor package (with and without
fabric).
In addition to the processor with fabric package and carrier differences noted above,
the designer also should consider how the fabric interface is connected in the platform.
This connection is accomplished using the Intel Fabric Passive (IFP) cable. Additional
IFP cable-specific design information may be included in a future revision of this design
guide.
41
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Thermal Specifications and Design Guidelines
6 Thermal Specifications and

Design Guidelines
6.1 Thermal Specification Overview

The processor is a Multi-Chip Package (MCP), meaning it has integrated multiple silicon
devices onto the processor substrate. These devices include the processor (CPU) die,
eight Multi-Chip DRAMs (MCDRAMs) and, in some configurations, a networking (or
fabric) controller die. See Figure 2-1 and Figure 2-2. Although there are multiple
components on the processor package, there will be a single Integrated Heat Spreader
(IHS) on the MCP which serves as an interface to the system thermal solution.
The MCP requires the thermal solution to maintain die temperatures within the
specified operating limits for all devices in the MCP. Any attempt to operate the
processor or other die outside these limits may result in permanent damage to the
processor and potentially other components within the system. Maintaining the proper
thermal environment is key to optimal and reliable, long-term processor and system
operation.
A complete thermal solution includes both component- and system-level thermal

management features. Component-level thermal solutions can include active or passive
heatsinks attached to the processors’ IHS. Typical system-level thermal solutions may
consist of system fans combined with ducting and venting.
6.1.1 Thermal Design Power (TDP) and TCASE Specifications

Table 6-1 and Table 6-2 list the Thermal Design Power (TDP) and TCASE values for the
different processor SKUs, under both CPU- and memory-centric workloads.
.
Table 6-1. TDP and TCASE Specifications - 215W/230W SKUs

Processor Processor with Fabric
Workload CPU Centric Memory Centric CPU Centric Memory Centric
CPU Power 185W 147W 185W 147W
Memory Power 30W 68W 30W 68W
IOP Fabric Die Power N/A 15W
Total Power 215W 230W
CPU Die Maximum TCASE 82 °C N/A 1 84 °C N/A 1
MCDRAM Die Maximum TCASE N/A2 72 °C N/A2 75 °C
Fabric Die Maximum TCASE N/A N/A3
Minimum TCASE4 5 °C
Notes:
1. Memory-centric workloads: CPU TCASE is expected to be lower than the maximum CPU TCASE target.
2. CPU-centric workloads: Memory TCASE is expected to be lower than the maximum memory TCASE target.
3. Fabric die TCASE targets: The fabric die is expected to remain below it’s maximum allowable temperature for
all workloads, as long as the thermal solution provides adequate cooling to the CPU and MCDRAM die.
4. ASHRAE thermal envelopes allow scenarios where the data center ambient temperature may drop below 
5 °C, down to 0 °C. However, the processor silicon temperatures are expected to quickly rise above 5 °C
once operational. Contact your Intel representative if you believe your data center implementation
warrants further consideration of minimum operational temperatures down to 0 °C.
42
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Table 6-2. TDP and TCASE Specifications - 245W/260W SKUs

Processor Processor with Fabric
Workload CPU Centric Memory Centric CPU Centric Memory Centric
CPU Power 215W 177W 215W 177W
Memory Power 30W 68W 30W 68W
IOP Fabric Die Power N/A 15W
Total Power 245W 260W
CPU Die Maximum TCASE 72 °C N/A1 74 °C N/A1
MCDRAM Die Maximum TCASE N/A2 N/A1 N/A2 N/A1
Fabric Die Maximum TCASE N/A N/A3
Minimum TCASE4 5 °C
Notes:
1. Memory-centric workloads: CPU TCASE is expected to be lower than the maximum CPU TCASE target. The
MCDRAM die are expected to remain below their maximum allowable temperature, as long as the thermal
solution provides adequate cooling to the CPU die.
2. CPU-centric workloads: Memory TCASE is expected to be lower than the maximum memory TCASE target.
3. Fabric die TCASE targets: The fabric die is expected to remain below it’s maximum allowable temperature for
all workloads, as long as the thermal solution provides adequate cooling to the CPU and MCDRAM die.
4. ASHRAE thermal envelopes allow scenarios where the data center ambient temperature may drop below 
5 °C, down to 0 °C. However, the processor silicon temperatures are expected to quickly rise above 5 °C
once operational. Contact your Intel representative if you believe your data center implementation
warrants further consideration of minimum operational temperatures down to 0 °C.
CPU-centric workloads are those applications that are heavily compute-intensive and
are able to concentrate the code and data within the processor’s on-die cache. These
applications would be expected to maximize the power consumption of the CPU silicon
and reduce the MCDRAM power. As an example, applications that make extensive use
of the Intel® Advanced Vector Extensions (Intel® AVX) instructions would be
considered CPU-centric.
Memory-centric workloads would typically be working with data sets that require
significant transfers between the processor silicon and the on-package MCDRAMs, or
perhaps even the off-package DDR4 system memory. These applications would be
expected to maximize the power consumption of the MCDRAM silicon and reduce the
CPU die power consumption.
Thermal Design Power (TDP) of the processor is not the same as the absolute
maximum possible power draw. TDP is the maximum continuous power dissipation that
has been measured when running commercially-available benchmarks and
applications. Applications often have very short duration power spikes (10s to 100s of
micro-seconds) above TDP. These short power spikes are not thermally significant, but
they do require the power delivery system to be designed appropriately.
What happens in the unlikely event that an application is developed that continuously
draws more power than TDP? The answer depends on a variety of factors, but one of
the key factors is the system ambient temperature. If the ambient temperature is
below the maximum specified for the chassis, the thermal solution may have enough
headroom to keep the processor within its defined temperature range. If the ambient
temperature is close to maximum, the processor may reach, or exceed, its maximum
permissible operating temperature. In this situation, the system and processor will
pursue multiple actions to ensure staying below temperature targets.
43

Thermal validation considerations: Due to the challenges involved with measuring real-
time power on operational processors, Intel recommends using a Thermal Test Vehicle
(TTV) to validate the platform thermal solution. The TTV enables precise control of the
CPU, MCDRAM and Fabric die power dissipation, and ensures accurate, precise and
repeatable TCASE temperature measurements.
6.1.2 Case Temperature Geometry and Influence Factors

The processor MCP requires careful monitoring and control of temperatures on multiple
silicon die inside the package. The case temperature is defined as the temperature
measured at various locations on the surface of the Integrated Heat Spreader (IHS)
above these component die hot spots. The IHS maximum case temperature (TCASE)
specifications for the processor and MCDRAM die are listed in Table 6-1. No case
temperature is required for the fabric die.
Three case temperature (TCASE) locations are defined for the processor MCPs: one for
the processor die and two options for the MCDRAM die. See Figure 6-1 and Figure 6-2
for the TCASE locations.
Which MCDRAM TCASE location to measure depends upon the direction of airflow
through the heatsink. Use the location that is downstream from the processor die
(meaning the air moving over the MCDRAM has been preheated by the processor die)
as this will ensure the worst case MCDRAM conditions are evaluated. The thermocouple
location for the MCDRAMs is chosen to reflect the worst case hot spot on the hottest
memory silicon die. The hottest MCDRAM die is expected to be either interior
downstream device; the upper middle device is chosen in Figure 6-1 and Figure 6-2.
Design and validation of a thermal solution which properly cools all the components in a
MCP drives the need to measure the IHS case temperate above the worst-case location
for each different type of device.
The processor will generally exhibit higher temperatures on the IHS at the locations
coinciding with the processor and MCDRAM die. The IHS has a heat spreading effect.
The temperature delta between silicon die hot spots and the IHS geometric center vary
depending on the total dissipated power and the power distribution between the
processor and MCDRAM die.
44

Figure 6-1. Processor Package Thermocouple Locations, Top view
The processor and MCDRAM TCASE value will be influenced by the other powered
devices integrated on the MCP. This relationship is described in the following equations:
TCASE_CPU = TLA + CC * PCPU + CM * PMCDRAM + CF * PFabric
TCASE_MCDRAM = TLA + MC * PCPU + MM * PMCDRAM + MF * PFabric
Table 6-3. Processor TCASE Influence Parameters

Reference Solution
Parameter Description
Expected Value
Tcase_CPU Temperature on the IHS surface above the processor hot spot Calculated
Tcase_MCDRAM Temperature on the IHS surface above the MCDRAM hot spot Calculated
TLA Temperature of the local ambient air at the heatsink inlet < 40 °C
PCPU Power dissipated by the processor Workload Dependent1
PMCDRAM Power dissipated by MCDRAMs Workload Dependent1
PFABRIC Power dissipated by the fabric controller (processor with fabric only) Workload Dependent1
CC Thermal resistance: IHS processor hot spot due to its own power 0.212 °C/W
CM Thermal resistance: IHS processor hot spot due to MCDRAM power 0.134 °C/W
CF Thermal resistance: IHS processor hot spot due to fabric power 0.140 °C/W
MC Thermal resistance: IHS MCDRAM hot spot due to processor power 0.147 °C/W
MM Thermal resistance: IHS MCDRAM hot spot due to its own power 0.177 °C/W
MF Thermal resistance: IHS MCDRAM hot spot due to fabric power 0.196 °C/W
Note: 1. Though the constituent device powers may vary with workload, the combined powers must add up to
be less than or equal to the Thermal Design Power (TDP).
45

The processor and MCDRAM power varies dramatically by workload and they do not
achieve their maximum allowable values concurrently. Thus, a processor-centric
workload maximizes processor power while typically drawing lower MCDRAM power.
Conversely, a memory centric workload maximizes MCDRAM power while requiring
concurrently a processor power lower than that of the processor centric workload. This
is very important to consider when analyzing, designing and testing TCASE thermal
solutions.
A couple of processor with fabric examples are provided to illustrate these

relationships, with values representing the Intel reference thermal solution:
Example 1: Processor TCASE based on a hypothetical processor centric type workload.
TCASE_CPU = TLA + CC * PCPU + CM * PMCDRAM + CF * PFabric
= 40 + (0.212) * (185) + (0.134) * (30) + (0.140) * (15) = 85 °C
Example 2: MCDRAM TCASE based on a hypothetical memory centric type workload.
TCASE_MCDRAM = TLA + MC * PCPU + MM * PMCDRAM + MF * PFabric
= 40 + (0.147) * (147) + (0.177) * (68) + (0.196) * (15) = 75 °C
Figure 6-2. Processor with Fabric TCASE Measurement Locations.
Notice, the processor with fabric is not symmetric with respect to the airflow direction.
In the previous figure the Fabric die is downstream from the processor and MCDRAM
die and thus preheated by the air flowing across these die. The orientation of the
package impacts the processor thermal performance.
Finally, it is well known that thermal resistance has a strong dependence on system
thermal design parameters such as volumetric airflow. The reference design thermal
resistivity dependence on volumetric airflow is illustrated in Figure 6-3.
46

Figure 6-3. Psi Curves for the Reference Thermal Solution (Mean+3 Sigma)
Psi-cc = 0.1031+0.8235*cfm-0.6752 Psi-mm = 0.0603+0.8778*cfm-0.6724

Psi-cm = 0.0277+0.8159*cfm-0.6806 Psi-mc = 0.0349+0.9174*cfm-0.7015
Psi-cf = 0.0294+1.0777*cfm-0.7596 Psi-mf = 0.0674+0.8705*cfm-0.6375
6.1.3 Socket Maximum Temperature

The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the main board. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket must be <95 °C.
• The specific via used for temperature measurement is located on the bottom of the
motherboard between pins BN6 and BJ6.
• The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions must be met
to limit power and thermal dissipation through the socket.
To measure via temperature:
• Drill a hole through the back plate corresponding to the location of pins BN6 and
BJ6.
• Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the
specific measurement via on the underside of the motherboard.
• Once the glue dries, reinstall the back plate and measure the temperature.
47

6.1.4 Storage Conditions Specifications

Environmental storage condition limits define the temperature and relative humidity
limits to which the device is exposed while being stored in a moisture barrier bag. the
specified storage conditions are for component level prior to board installation.
Table 6-4 specifies absolute maximum and minimum storage temperature limits which
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. At conditions outside sustained
limits, but within absolute maximum and minimum ratings, quality, and reliability may
be affected.
Table 6-4. Storage Condition Ratings

Symbol Parameter Min. Max. Unit
Timesustained storage A prolonged or extended period of time; typically

associated with sustained storage conditions.
0 30 months
Unopened bag, includes 6 months storage time by
customer.
Timeshort term storage A short period of time (in shipping media). 0 72 hours
Tabsolute storage The minimum/maximum device storage temperature

beyond which damage (latent or otherwise) may -25 125 °C
occur when subjected to for any length of time.
Tsustained storage The minimum/maximum device storage temperature

-5 40 °C
for a sustained period of time.
Tshort term storage The ambient storage temperature (in shipping media)
-20 85 °C
for a short period of time.
RHsustained storage The maximum device storage relative humidity for a

60% @ 24 °C
sustained period of time.
6.1.5 Reference Design Thermal Interface Material (TIM)

Applying thermal interface material between the processor IHS and the heatsink base
will improve the heat transfer between the IHS and the heatsink. Honeywell* PCM45F
material is selected for use with the Intel reference heatsink design.
The recommended size ensures adequate coverage at the interface between the
processor IHS and heatsink pedestal.
Table 6-5. TIM Specification

Parameter Value Unit Notes
TIM Size 47 x 70 x 0.25 mm Dimensions apply to Honeywell* PCM45F p/n: H38442
PCM45F Activation Load 340 N Load required to meet min. TIM pressure (15 psi)
Refer to the TIM manufacturer’s guidelines for specifications and handling instructions.
48

6.1.6 Reference Thermal Solution Performance Targets

Table 6-6 provides thermal boundary conditions and performance targets for the
processor. These values serve as guidance for designing a processor compatible
thermal solution. Heatsink design compliance can be determined with thermocouples
and TTVs.
Table 6-6. Reference Heatsink Boundary Conditions and Performance Targets

Parameter Processor Processor with Fabric Notes
TDP 215W 230W
TLA (max) 40 °C 1
System height (form 1U 2

factor)
Heatsink volumetric Overall: 80 x 107 x 27 mm (W x L x H) 3
Heatsink Technology Cu base with Al fins
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Reference system configuration. 1U = 1.75 inches.
3. Dimensions of reference heatsink do not include socket, processor, or other retention assembly
components.
6.2 Thermal Design and Management Guidelines

6.2.1 System Thermal Environmental Conditions
6.2.1.1 Ambient Temperature
The temperature of the inlet air entering the processor heatsink module is referenced in
this document as the local ambient temperature (TLA). This is not a system
requirement, rather simply the local ambient temperature upstream from the
processor. It is measured from the air upstream and in close vicinity to the processor
heatsink module. For other cooling systems, the ambient temperature is measured
from the inlet air to the cooling device.
6.2.1.2 Airflow
Airflow should be provided by a system fan or blower in order to cool the processor
package. See the recommended airflow rate for the reference heatsink in Table 6-7.
Table 6-7. Thermal Solution Performance Design Targets and Environment

Parameter Maximum Unit Notes
TLA 40 °C This is the temperature at the processor cooling devices
Pressure Drop 137 (0.55) Pa (inch H2O) Total pressure drop across the processor cooling devices
Altitude Sea-level Thermal solution optimized for performance at sea-level.

De-rate at higher altitudes.
Airflow 9.44 (20) l/s (CFM) Airflow through the heatsink fins
Note: Thermal boundary conditions are applied in establishing the processor heatsink cooling solution.
49
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6.2.1.3 Pressure Drop

Figure 6-4 illustrates the relationship of pressure drop to volumetric air flow for the
reference thermal solution. Table 6-7 provides the expected value for the pressure drop
at the recommended airflow through a reference heatsink. This ensures cooling
requirements for the system components downstream from the processor are met
while ensuring the processor thermal targets are met.
.
Figure 6-4. Reference Heatsink Pressure Drop Curve
6.2.2 Thermal Solution Performance Characterization

The following equations can be used to calculate the thermal resistances. Refer to
Table 6-3 for definitions.
Power only the CPU, no power to the MCDRAMs or fabric:
cc = (Tcase_CPU – TLA) / PCPU
mc = (Tcase_MCDRAM – TLA) / PCPU
Power only the MCDRAMs, no power to the CPU or fabric:
cm = (Tcase_CPU – TLA) / PMCDRAM
mm = (Tcase_MCDRAM – TLA) / PMCDRAM
Power only the fabric, no power to the CPU or MCDRAMs:
cf = (Tcase_CPU – TLA) / PFabric
mf = (Tcase_MCDRAM – TLA) / PFabric
50

6.2.3 Thermal Test Vehicle (TTV) Correction Factors

Intel offers thermal test vehicles to assist engineers developing and testing
thermal/mechanical solutions for LGA3647-1 socket-compatible systems. TTVs are
designed to mimic the thermal load of the actual die on the MCP under various work
usage scenarios. The TTV can be used for platforms with and without fabric by simply
turning the fabric die heater on or off.
Correction factors are provided for the processors to correlate the TTV heaters to the
silicon die when analyzing heatsink characterization data.
TCase_CPU_Product = TCase_CPU_TTV + CFCPU * (PCPU + PMCDRAM + PFabric)
TCase_MCDRAM_Product = TCase_MCDRAM_TTV + CFMCDRAM * (PCPU + PMCDRAM + PFabric)
TTV to Product Correction Factors
CFCPU CFMCDRAM
0.0006 C/W -0.004 C/W
Processor correction factors are subject to change over time. Contact your Intel Xeon
Phi thermal representative if you have questions.
6.2.4 Thermal Management Guidelines

Processor thermal solution, heatsink and/or cold-plate, design must comply with TCASE
targets. Thermal solution design compliance can be determined with thermocouple and
TTV as with previous processors.
Systems that do not monitor the processor temperature by monitoring the DTS (Digital
Thermal Sensor) output must ensure processor cooling solution is capable of meeting
the processor based TCASE specifications. In some situations, implementation of DTS-
based thermal solutions can reduce average fan power and improve acoustics as
compared to the TCASE based targets alone.
When all cores are active, a properly design thermal solution will be able to meet the
processor thermal specification. When all cores are not active or when Intel® Turbo
Boost Technology is active, attempting to comply with the DTS based thermal
specification may drive system fans to increased speed. In such situations, the TCASE
temperature will be below the TCASE based thermal profile by design.
6.2.4.1 Processor Absolute Temperatures

Intel does not test any third-party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the Thermal Control Circuit (TCC)
activation temperature, use of software that reports absolute temperature can be
misleading.
6.2.4.2 Fan Speed Control

Fan Speed Control (FSC) methods are commonly used to reduce system-level acoustic
noise in server designs. Fan speed is one of the key parameters that determines the
amount of airflow provided to the thermal solution. Additionally, airflow is proportional
to a thermal solution’s performance, which consequently determines the TCASE of the
processor at a given power level. Because the TCASE of a processor is an important
parameter in determining the long-term reliability of a processor, the FSC implemented
51
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in a system directly correlates to the processor’s ability to meet thermal targets. For
this purpose, the parameter called TCONTROL, is to be used in FSC designs to ensure
that the long-term reliability of the processor is met while keeping the system-level
acoustic noise down.
When DTS values are less than TCONTROL, the thermal target can be ignored. The DTS
value is a relative temperature to PROCHOT which is the maximum allowable
temperature before the thermal control circuit is activated. In this region, the DTS
value can be utilized to not only ensure specification compliance but also to optimize
FSC resulting in the lowest possible fan power and acoustics under any operating
condition. When DTS goes above TCONTROL, fan speed must increase to bring the sensor
temperature below TCONTROL or to ensure compliance with the TCASE profile.
The PECI temperature reading from the processor can be compared to this TCONTROL
value. An FSC scheme can be implemented without compromising the long-term
reliability of the processor. The PECI command for DTS is GetTemp(). Through use of a
sign bit, the value returned from PECI is negative. The PECI command for TCONTROL is
RdPkgConfig(), Temperature Target Read, 15:8. The value returned from PECI, while
unsigned (positive), is negative by definition.
There are many different ways of implementing FSC; including methods based on
processor ambient temperature, processor DTS, or a combination of the two. If FSC is
based only on the processor ambient temperature, low acoustic targets can be
achieved under low ambient temperature conditions. However, the acoustics cannot be
optimized based on the behavior of the processor temperature. If FSC is based only on
the DTS, sustained temperatures above TCONTROL drive fans to maximum RPM. If FSC is
based both on the ambient and DTS, then ambient temperature can be used to scale
the fan RPM controlled by the DTS logic. This would result in an optimal acoustic
performance. Regardless of which scheme is employed, system designers must ensure
the TCASE specification is met under all operational conditions.
6.2.4.3 Tcontrol Relief

Intel may choose to provide TCONTROL relief near product launch, TCONTROL values closer
to 0, as compared to the factory configured TCONTROL values. However, there are no
such plans at this time.
6.2.4.4 Thermal Excursion Power

Under fan failure or other anomalous thermal excursions, processor temperature
(either TCASE or DTS) may exceed the thermal target for a duration totaling less than
360 hours per year without affecting long term reliability (life) of the processor. For
more typical thermal excursions, the thermal monitor is expected to control the
processor temperature by reducing the processor power level. These conditions should
not allow the processor to exceed the temperature at which the Thermal Control Circuit
(TCC) activation initially occurred.
Under more severe anomalous thermal excursions when the processor temperature
cannot be controlled at or below thermal profile by TCC activation, then data integrity is
not assured. At some higher thresholds, THERMTRIP_N will enable a shut down in an
attempt to prevent permanent damage to the processor.
Thermal test vehicles (TTVs) may be used to check anomalous thermal excursion
compliance. TTVs can be used to test and ensure the processor TCASE value does not
exceed TCASE_MAX at the anomalous power level for the condition of interest, such as
fan failure.
52
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Quality and Reliability Requirements
A Quality and Reliability

Requirements
A.1 Thermal/Mechanical Solution Stress Test

Intel evaluates reliability performance based on the use conditions (operating
environment) of the end product by using acceleration models.
The use condition environment definitions provided in the tables below are based on
speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can vary
and needs to be comprehended for reliability assessment.
Table A-1. Example Thermal Stress Test: Use Condition Environment Definitions
Speculative Example Example Purpose/
Example
Use Environment Stress 7 yr. Stress 10 yr. Stress Failure
Use Condition
Condition Equivalent Equivalent Mechanism
Slow small internal gradient changes Temperature DT = 35 - 44 °C 550-930 cycles 780-1345 cycles Solder joint
due to external ambient Cycle (solder joint) Temp Cycle Temp Cycle fatigue, via
(temperature cycle or externally barrel cracking,
(-25 °C to 100 (-25 °C to 100
heated) and Thermal
°C) °C)
Fast, large gradient on/off to max Interface
operating temperature (power cycle Material (TIM)
or internally heated including power separation/
save features) disbond under
thermal
mechanical
stresses
High ambient moisture during low- THB/HAST T = 25 - 30 °C 110-220 hrs 145-240 hrs Corrosion and
power state (operating voltage) 85% RH at 110 °C and at 110 °C and material
migration
(ambient) 85% RH 85% RH
induced by
moisture/
temperature
High Operating temperature and Bake T = 95 - 105 °C 700 - 2500 hrs 800 - 3300 hrs Creep-induced
short duration high temperature (contact) at 125 °C at 125 °C failure
exposures mechanisms,
for example
contact
relaxation,
solder ball
creep, and
thermal TIM
degradation
Material used will not have deformation or degradation in a temperature life test.
53

Table A-2. Example Mechanical Stress Test: Use Condition Environment Definitions
Use Purpose/Failure
Speculative Stress Condition
Environment Mechanism
Shipping and Mechanical Shock 12 drops total Mechanical-induced

Handling • System-level • 2 drops per each of brittle solder joint
3 perpendicular axes failures and TIM
• Unpackaged test
separation/disbond
• Trapezoidal waveform • + and - directions
• 25 g
• velocity change is based on packaged weight.
• Change in velocity is based upon a 0.5 coefficient of
restitution.
Product Weight (lbs) Non-palletized Product

< 20 lbs Velocity Change (in/sec)
20 to > 40 250
40 to > 80 225
80 to < 100 205
100 to < 120 175
≥120 145
125
Random Vibration per system total Example mechanisms

• System-level • 10 min/axis include cyclic
mechanical fatigue
• Unpackaged test • 3 axes
stress and TIM
• 5 Hz to 500 Hz separation/disbond
— 0.001 g2/Hz @ 5Hz,
— ramping to 0.01 g2/Hz @20 Hz;
— constant value of 0.01 g2/Hz from 20 to 500 Hz
• Random control limit tolerance is ± 3 dB
• Power Spectral Density (PSD) Profile: 2.20 g RMS
Note: Need to pass customer visual, thermal, mechanical, and electrical requirements.
A.1.1 Customer Environmental Reliability Testing

The conditions of the tests outlined here may differ from the customers’ system
requirements. Board/system level requirements are to be identified and performed by
customers planning on using the Intel reference thermal/mechanical solution.
A.1.2 Socket Durability Test

The socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09.
Measure contact resistance when mated in 1st and 30th cycles. The package must be
removed at the end of each de-actuation cycle and reinserted into the socket.
A.1.3 Intel Reference Component Validation

Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.
While component validation shows a reference design is tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
54

A.2 Ecological Requirement

General requirements: Materials used in this product comply with Intel’s Environmental
Product Content Specification for Suppliers and Outsourced Manufacturers.
Materials should be resistant to fungal growth. Examples of non-resistant materials

include cellulose materials, animal- and vegetable-based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (for example, polyester and some polyethers), plastics
which contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.
Cadmium should not be used in the painting or plating of the socket. CFCs and HFCs
should not be used in manufacturing the socket.
Any plastic component exceeding 25 grams must be recyclable per the European Blue
Angel recycling standards.
Supplier is responsible for complying with industry standards regarding environmental

care as well as with the specific standards required per supplier's region. More
specifically, supplier is responsible for compliance with the European regulations related
to restrictions on the use of Lead and Bromine containing flame-retardants. Legislation
varies by geography, European Union (RoHS/WEEE), China, California, and so forth.
The following definitions apply to the use of the terms lead-free, Pb-free, and
Restriction of Hazardous Substances (RoHS) compliant.
Halogen flame retardant free (HFR-Free) PCB: Current guidance for the socket
pad layout supports FR4 and HFR-Free designs. In future revisions of this document,
Intel may provide guidance on the mechanical impact to using a HFR-free laminate in
the PCB. This will be limited to workstations.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either (1)
below all applicable substance thresholds as proposed by the EU or (2) an approved/
pending exemption applies.
Note: RoHS implementation details are not fully defined and may change.
Additional requirements: Cadmium should not be used in painting or plating. No

Quaternary salt electrolytic capacitors should be used. Examples of prohibited caps are:
United Chemi-Con* type: LXF, LXY, LXZ. No brominated plastics should be used. Also,
plastics heavier than 25 g must be labeled per ISO 10469 and may not contain
halogenated flame retardant compounds.
Chemical Restrictions:
The components must be “halogen-free,” that is, they are assembled without the
intentional use of halogen in the raw materials and these elements are not intentionally
present in the end product.
• IEC 61249-2-21
— 900 ppm maximum chlorine
— 900 ppm maximum bromine
— 1500 ppm maximum total halogens
55

• IPC-4101B
— 900 ppm maximum chlorine
— 900 ppm maximum bromine
— 1500 ppm maximum total halogens
It is required that the production version of the socket, the Processor Heatsink Module
(PHM) including the Thermal Interface Material (TIM) and the processor mechanical
retention assembly be RoHS compliant, by using 100% lead-free technology. RoHS
reference source is http://ec.europa.eu/environment/waste/rohs_eee/
events_rohs3_en.htm.
56

Supplier Listing
B Supplier Listing
Third-party suppliers are enabled to ensure that reference thermal and mechanical
components are available.
B.1 Intel Enabled Supplier Information

This chapter contains supplier details including contact information for the socket,
heatsink, TIM and other retention components in future revisions.
• Supplier content is provided by Intel as a convenience to its customers. Intel does
not make any representations or warranties whatsoever regarding the quality,
reliability, functionality, or compatibility of these devices.
• All Part Numbers (P/N) listed are in prototype phase and have not been verified to
meet performance targets or quality and reliability requirements and are subject to
change.
• Supplier information provided in the table was deemed accurate when this
document was released.
• Customers planning on using the Intel reference design should contact the
suppliers for the latest information on their product(s).
• Customers must evaluate performance against their own product requirements.
57

Supplier Listing
Table B-1. Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part
Information
Component Description Supplier P/N Supplier Contact Info
Heatsink 1U Heatsink Assembly; Cu - Delta* DELTA ELECTRONICS, INC.

Al Reference Heatsink,
washers, nuts and collars.
Stephanie Liu
Thermal Management Product BU
(FMBG)
Stephanie.Liu@Delta.com.tw
+886-3-359-1968 #2086
Delta Products Corp

Jason Tsai, Portland, Oregon
jason.fs.tsai@deltaww.com
+1-971-205-7074
Intel P/N H37264-009

Vendor P/N DHS-B10780-15
Thermal Thermal Interface Material Honeywell* Honeywell International, Inc.

Interface PCM45F 70x47x0.25
Material
Connie Smiriglio (Account Manager)
Connie.smiriglio@honeywell.com
+1-845-627-2750
Hyo Xi (Technical)
Hyo.xi@honeywell.com
430 Li Bing Rd,Zhangjiang Hi-Tech
Park,Pudong,SH
Shanghai, 31, 201203, China
+86-21-28943106

Vendor P/N 099079
Processor Heatsink Loading Module (PHLM) Foxconn* Foxconn Interconnect Technology Inc.
1347 N Alma School Rd Ste 230
Vendor Contact Information for Chandler, Arizona USA 85224-5947
• Processor Carriers
• Bolster Plate Assemblies Albert Terhune
• Back Plate Assemblies al.terhune@fit-foxconn.com
• Socket-P Dust Covers +1-480-963-3392
Lotes* Lotes Guangzhou Co., Ltd.

No. 526 North of Jinling Road
Nansha Economic & Technological
Development Zone, Guangzhou, 511458
China.
Cathy Yang
cathy@lotes.com.cn
+86-20-84686519
Processor Plastic processor carrier.

Carrier
Lotes P/N AZIF0079-P002C*
Foxconn P/N WNMEL00-82N01-EH
Processor with Plastic processor carrier.

Fabric Carrier
58

Supplier Listing
Information
Bolster Plate Bolster plate, posts, leaf

Assembly spring assembly and
insulator.

Back Plate Back plate, threaded posts

Assembly and insulator

Lotes P/N AHSK0009-P002C*
Foxconn P/N PT44P12-4801
Dust Cover Skt-P plastic handling cover

Bolster Plate Bolster plate, posts, leaf

with Dust Cover spring assembly and
Assembly insulator, Skt-P plastic
handling cover

Foxconn P/N PT44L12-4811
Bolster Plate, Bolster plate, posts, leaf

Back Plate and spring assembly and
Dust Cover insulator, back plate,
Assembly threaded posts, insulator and
Skt-P plastic handling cover
Intel P/N NA
Foxconn P/N WNMEA66-81N02-EH
59

Supplier Listing
Information
Socket-P1 3647 Processor Socket Foxconn* Foxconn Interconnect Technologies (FIT)

LGA3647-1 Foxconn NWInG, Oregon
(Intel CAD Number J36228)
Eric Ling
eric.ling@fit-foxconn.com
+1-971-506-6441
30 μ-inch Gold Contacts

Right Side P/N Intel: J34315-001; Foxconn: PE36473-11NK3-1H
Left Side P/N Intel: J34315-002; Foxconn: PE36473-11NK4-1H

Right Side P/N Intel: H37600-202; Foxconn: PE36473-11NK1-1H
Left Side P/N Intel: H37600-203; Foxconn: PE36473-11NK2-1H
Tyco* Tyco Electronics (TE) Connectivity
Ellen Liang
ellen.yh.liang@te.com
+886-2-2171-5261

Right Side P/N Intel: J34319-001; Tyco: 2-2129710-8
Left Side P/N Intel: J34319-002; Tyco: 2-2129710-7

Right Side P/N Intel: J65188-001; Tyco: 2-2129710-4
Left Side P/N Intel: J65188-002; Tyco: 2-2129710-3
60

Processor Package Mechanical Drawings
C Processor Package
Mechanical Drawings
Table C-1 lists the processor Package Mechanical Drawings (PMD) included in this
appendix.
Table C-1. Processor Package Drawing List

Drawing Description Figure Number
Processor PMD (Sheet 1 of 2) Figure C-1
Processor PMD (Sheet 2 of 2) Figure C-2
Processor with Fabric PMD (Sheet 1 of 2) Figure C-3
Processor with Fabric PMD (Sheet 2 of 2) Figure C-4
61

62
':*12 6+ 5(9

+
127(6
Figure C-1.
$//72/(5$1&(6$5(566
+ 685)$&(0$5.=21(12&20321(176$//2:(' +
120,1$/3$&.$*(0$66 7%'*5$06$&78$/+(,*+70$<9$5<'8(720$18)$&785,1*352&(66
(1$%/,1*0$5..2=12&20321(176$//2:('
&20321(17.,=12722/,1*$//2:('(;$&7&20321(17/2&$7,21,61276+2:1,17+,6'5$:,1*
% $
* & *
& % $
),'8&,$/
%
.

),'8&,$/ %
) )
$ $
& ;% %
& %
Intel® Xeon® Phi™ Processor x200 Product Family TMSDG

( (
Processor PMD (Sheet 1 of 2)
' '

),'8&,$/
7239,(: 3,1
&

$ % 0$;$//2:$%/(
&20321(17
& +(,*+7 &
0,//,0(7(56
& 6<0%2/ &200(176
120 72/
%
6(&7,21$$ %

$///*$/$1'6
%
%
&

% &
%
)
)
)
'(6,*1('%< '$7( '(3$570(17
0,66,21&2//(*(%/9'
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) ',0(16,216$5(,10,//,0(7(56 '5$:1%< '$7(
,17(535(7',0(16,216$1'72/(5$1&(6 7,7/(
3(5$60(<0
&+(&.('%< '$7( 3$&.$*(0(&+$1,&$/

'(7$,/$
6&$/( 0$7(5,$/ '5$:,1*
$ $33529('%< '$7(
$
'(7$,/%
6&$/(
),1,6+ 7+,5'$1*/(352-(&7,21 6,=( '5$:,1*180%(5 5(9
$ +
6&$/( '21276&$/('5$:,1* 6+((72)



':*12 6+ 5(9

+
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Figure C-2.
+ ;&
+
' + .
(
;& %
7
-
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)
* - *
+
7 9
& ' %
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- .
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;&
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Processor PMD (Sheet 2 of 2)
1
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& ( % -
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' 0$; '
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& % $ & . $
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& 0,//,0(7(56 ;50
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'(7$,/+ 0
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5 0
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5 0 0
+
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+
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+
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+
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$ - & . $ $
'(7$,/-
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63

64
':*12 6+ 5(9

+
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$//72/(5$1&(6$5(566

Figure C-3.
62/'(55(6,6723(1,1* 62/'(55(6,6723(1,1*
+ 685)$&(0$5.=21(12&20321(176$//2:(' & % $ +
& % $
120,1$/3$&.$*(0$66 7%'*5$06$&78$/+(,*+70$<9$5<'8(720$18)$&785,1*352&(66
72/(5$1&(,635(/,0,1$5<$1'68%-(&772&+$1*(8321$9$,/$%,/,7<2))857+(5'$7$
(1$%/,1*0$5.=21(12&20321(176$//2:('
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%
685)$&(+$1'/,1*=21(
%
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0$; '(7$,/(
* ; ' '6&+(,*+7 68%675$7($/,*10(17),'8&,$/6$) *
6&$/(
% ;
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* ( 68%675$7($/,*10(17),'8&,$/6$)
6&$/(
-
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$ $
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& % $ &
' %
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( % (
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%
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; ' & % $
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'
& .
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& % $
7239,(: & * ) '
; '
'
' 1$

;'
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& ' 1$
$ % ' ;'
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& * )
& ' 1$
'(7$,/8
6&$/( '
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6(&7,21$$
0$; '
&20321(17+(,*+7 0$;
$///*$/$1'6 &20321(17+(,*+7 '
'

% '
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) 6&$/(
) )
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0,66,21&2//(*(%/9'
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',0(16,216$5(,10,//,0(7(56 '5$:1%< '$7(
) ,17(535(7',0(16,216$1'72/(5$1&(6 7,7/(
3(5$60(<
&+(&.('%< '$7( 3$&.$*(0(&+$1,&$/

0$7(5,$/ '5$:,1*
$ $33529('%< '$7(
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'(7$,/%
6&$/(
'(7$,/& '(7$,/$ ),1,6+ 7+,5'$1*/(352-(&7,21 6,=( '5$:,1*180%(5 5(9
6&$/( 6&$/(
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
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+
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& % $
$ & . $
; %' 0
Figure C-4.
( * ;0
. ' ;&
+ - % ;0 +
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7
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;0
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'(7$,/9
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; & . $ 120 72/
& %' 1$
&
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5 0,//,0(7(56 &200(176
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5 4 120 72/ %'
& 1$
0,//,0(7(56 &200(176 & 1$ %' 1$
6<0%2/
120 72/ & 1$ %' 1$
5 1$ & 1$
5 4 : %' 1$
5 1$ & 1$ '(7$,/$-
'(7$,// 0,//,0(7(56
% 6&$/( 5 1$ ('*(&211(&725),'8&,$/ %
& 1$ 6<0%2/ &200(176 6&$/( %' 1$
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5 1$ & 1$
0 %'
7 1$ & 1$
2 3 7 1$ + 1$ 0 %' 1$

<
7 1$ + 1$ 0
%'
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0
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65

LGA3647-1 Socket-P1 Mechanical Drawings
D LGA3647-1 Socket-P1
Mechanical Drawings
Table D-1 lists the socket drawings included in this appendix.
Table D-1. Socket Drawing List

Drawing Description Figure Number
Socket Mechanical Drawing (Sheet 1 of 4) Figure D-1
66


':*12 6+ 5(9

-
5(9,6,21+,6725<
=21( 5(9 '(6&5,37,21 '$7( $33529('
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7+(385326(2)7+,6'5$:,1*,672(67$%/,6+7+(0(&+$1,&$/)250)$&7252)7+(62&.(7
7+,6'5$:,1*,6127,17(1'('726+2:,17(51$/'(7$,/2)7+(62&.(7:+,&+0$<9$5<
) )5206833/,(5 )
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),1,6+121(

3,1$&+$0)(5
( (
' '
& /()76,'(
&
Figure D-1. Socket Mechanical Drawing (Sheet 1 of 4)
5,*+76,'(
% %
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81/(6627+(5:,6(63(&,),(' 0,66,21&2//(*(%/9'
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6&$/( '21276&$/('5$:,1* 6+((72)

67

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
Retention Assembly Mechanical Drawings
E Retention Assembly
Mechanical Drawings
Table E-1 lists the mechanical drawings included in this appendix.
Table E-1. Mechanical Drawing List (Sheet 1 of 2)

Description Figure
Backplate Assembly, 1/3 Figure E-1
Bolster Plate Assembly and Dust Cover Figure E-4
Bolster Plate Assembly, 1/2 Figure E-5
Bolster Plate Assembly, 2/2 Figure E-6
Heatsink Module Clip (non-Fabric), 1/2 Figure E-7
Heatsink Module Clip (non-Fabric), 2/2 Figure E-8
Heatsink Module Clip (Fabric), 1/2 Figure E-9
Heatsink Module Clip (Fabric), 2/2 Figure E-10
Backplate Figure E-11
Backplate Insulator Figure E-12
Back Plate, M3 Stud Figure E-13
Bolster Plate, 1/2 Figure E-14
Bolster Plate, 2/2 Figure E-15
Bolster Plate, Insulator Figure E-16
Bolster Plate, Small Guide Post Figure E-17
Bolster Plate, Large Guide Post Figure E-18
Bolster Plate, LEC Guide Pin Figure E-19
Bolster Plate, Corner Standoff Figure E-20
Bolster Plate, Spring Assembly Figure E-21
Bolster Plate, Spring Figure E-22
Bolster Plate, Spring Stud, M4 Figure E-23
Bolster Plate, Spring Rivet Figure E-24
Bolster Plate, M3 Captive Nut Figure E-25
Bolster Plate, M3 Captive Nut Collar Figure E-26
Socket-P, Dust Cover, 1/2 Figure E-27
Socket-P, Dust Cover, 2/2 Figure E-28
1U Heatsink Assembly, 1/2 (Reference Only) Figure E-29
1U Heatsink Assembly, 2/2 (Reference Only) Figure E-30
1U Heatsink, 1/2 (Reference Only) Figure E-31
1U Heatsink, 2/2 (Reference Only) Figure E-32
1U Heatsink, Label (Reference Only) Figure E-33
71

Table E-1. Mechanical Drawing List (Sheet 2 of 2)

1U Heatsink, PCM45F TIM (Reference Only) Figure E-34
1U Heatsink, Nut, M4, 1/2 (Reference Only) Figure E-35
1U Heatsink, Nut, M4, 2/2 (Reference Only) Figure E-36
1U Heatsink, Nut Collar (Reference Only) Figure E-37
1U Heatsink, Delrin* Washer (Reference Only) Figure E-38
72

DWG. NO SHT. REV

8 7 6 5 4 3 H77469 1 09 1
REVISION HISTORY
Figure E-1.
ZONE REV DESCRIPTION DATE APPR
- 01 TOOLING RELEASE 03/26/15
NOTES; UNLESS OTHERWISE SPECIFIED: PG2 7-C 1. ADDED DATUM B

02 4/1/15
PG2 6-A 2. FIXED GD & T DIMENSION CALL OUT
1. UPDATED REV ON PART TO MATCH DRAWING.
1. REFERENCE DOCUMENTS 03 2. ADDED SHEET 4 FOR BOLSTER PLATE AND MATERIAL CALLOUT. 4/15/15
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES 3. ADDED NOTE 9.
D 1. ADDED NOTE 9 TO CALL OUT CRITICAL TO FUNCTION DIMENSIONS. D

164997 - INTEL MARKING STANDARD 04 2. REINSTATED DRAWING G93719 AND REMOVED SHEET 4. 5/7/15
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY PG2 7A 3. CHANGED DIMENSION TOLERANCE RANGE.
1. REMOVED PLATE THICKNESS CRITICAL TO FUNCTION CALLOUT,

3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED: PG2 6A 05
SHOWN ON BOLSTER PLATE DRAWING.
6/29/15
(BASIC DIMENSION FROM 3D CAD MODEL):
1. UPDATED NOTE 4 TO LOWER THE PULLOUT FORCE FROM 1110N TO 267N.
PG1 7C 06 9/1/15
.24 A 2. ADDED NOTE 10 AND 11.
PG2 A3 1. CHANGED TRUE POSITION TOLERANCE FROM 0.1 TO 0.15

3 MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER PG2 B2 2. REMOVED THE PROFILE TOLERANCE DIMENSION. USE NOTE 2.
07 10/20/15
PG1 B8 3. ADDED NOTE 12
INTEL MARKING STANDARD (G14577) WITH ADDITIONAL PG1 C7 4. REMOVED NOTE 5 WORDING.
INFORMATION:
1. OVERALL STUD DIMENSION CHANGED FROM 6.334 TO 6.80
A) ASSEMBLY VENDOR ID PG2 B6 08 2/11/16
2. ROLLED PART NUMBER FROM H77469-001 TO H77469-002.
B) DATE CODE
PG1 A3 1. REMOVED DATUM B AND UPDATED NOTE 2 TO REFLECT THE CHANGE.
C) INTEL PART NUMBER PG2 A3 2. REMOVED CTF DIMENSION
PG3 D6 3. ADDED CTF DIMENSION
4 ATTACH STUDS: 09 7/18/16
PG3 B3 4. REMOVED THE WORD "PRODUCTION" FROM THE ASSEMBLY
- PULL OUT FORCE > 667N (150 LBF) PG1 A3 5. UPDATED PART NUMBER TABLE FOR THE STUD FROM -003 TO -004.
PG1 C7 6. MODIFIED NOTE 3C TO REMOVE THE PART NUMBER REVISION.
- TORQUE OUT > 2.25N-m (20 IN-LBF)
- FAILURE MODES: STUDS (7) MUST NOT SHEAR, DEFORM,
STRIP, CRACK, OR TORQUE-OUT BELOW TORQUE LIMIT. USE PIN 1 CHAMFER FOR ORIENTATION OF INSULATOR TO BACK PLATE
5. NOT USED
6. CLEAN AND DEGREASE BACKPLATE ASSEMBLY BEFORE ATTACHING
INSULATION.
7. AFTER APPLICATION THE INSULATOR MUST BE FREE OF BUBBLES,
C POCKETS, CREASES, AND ANY OTHER DEFORMATIONS. C
8. FINAL ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.
Backplate Assembly, 1/3
9. DIMENSIONS MARKED C
ARE CRITICAL TO FUNCTION
3
DIMENSIONS (CTF).
10 INSTALL ALL STUDS FLUSH TO THIS SURFACE, NOT PROTRUDING
BEYOND BACKPLATE SURFACE.
11 BACKPLATE ASSEMBLY TO BOLSTER PLATE ASSEMBLY (H77470)

STUD/NUT MUST BE ABLE TO ENGAGE WITH MOTHERBOARD THICKNESS'
IN THE RANGE OF 1.42MM-2.69MM (0.056"-0.106").
12 FLATNESS MUST BE MEASURED IN THE UNCONSTRAINED STATE. ALL

OTHER CTF MEASUREMENTS CAN BE MEASURED IN THE CONSTRAINED
STATE.
1
B B
4 2
7X
1 3 G93724-002 KNL BACK PLATE INSULATOR

7 2 H12853-004 KNL BACK PLATE STUD
1 1 G93719-002 KNL BACK PLATE
TOP H77469-002 KNL BACK PLATE ASSEMBLY
QTY ITEM NO PART NUMBER DESCRIPTION
PARTS LIST
DIMENSIONS ARE IN MILLIMETERS DESIGNED BY DATE DEPARTMENT R
2200 MISSION COLLEGE BLVD.
A 08/14/13 P.O. BOX 58119 A
DRAWN BY DATE SANTA CLARA, CA 95052-8119
08/14/13 TITLE
CHECKED BY DATE
08/14/13
THIRD ANGLE PROJECTION KNL BACKPLATE ASSY
APPROVED BY DATE
SIZE DRAWING NUMBER REV
-
MATERIAL FINISH D H77469 09
SEE NOTES SEE NOTES SCALE: 2:1 DO NOT SCALE DRAWING SHEET 1 OF 3
8 7 6 5 4 3 2 1
73

74
DWG. NO SHT. REV
8 7 6 5 4 3 H77469 2 09 1
Figure E-2.
D 81.6 D
35 35
2x 26
C 2x 44 108.6 C

2x 32
B 13 44 B
2X 70
7X (3.59)
7X 11
.15 A
SEE DETAIL A
7X 6.8 0.2
A 7X 10 0.2 DETAIL A A
SCALE 6:1
12
DEPARTMENT SIZE DRAWING NUMBER REV

R
P.O. BOX 58119 D H77469 09
SANTA CLARA, CA 95052-8119
SCALE: 2:1 DO NOT SCALE DRAWING SHEET 2 OF 3
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H77469 3 09 1
Figure E-3.
D D
NO METAL CAN BE EXPOSED. OVERHANG OF INSULATOR ON INNER

AND OUTER EDGES OF THE BACKPLATE IS ACCEPTABLE.
C
PIN 1 MARKING 3
(0.25)
PART MARKING ZONE 3
C C
B B
BOTTOM SIDE (NON-INSULATOR SIDE)
A A

R
P.O. BOX 58119 D H77469 09
8 7 6 5 4 3 2 1
75

76
DWG. NO SHT. REV
8 7 6 5 4 3 H78747 1 08 1
REVISION HISTORY
Figure E-4.

1. ROLLED ASSEMBLY NUMBER TO -002 BASED ON ROLLING BOLSTER
02 4/16/15
PLATE ASSEMBLY TO A -002.
1. PART AND REV CHANGED ON BOLSTER PLATE ASSEMBLY SO
6B 03 5/6/15
COSMETIC PART MARKING CHANGED IN VIEW.
04 1. PART AND REV CHANGED ON BOLSTER PLATE ASSEMBLY. 6/11/15
1. ROLLED ASSY PART NUMBER FROM H78747-004 TO H78747-005
05 8/28/15
BASED ON BOLSTER PLATE, LEC GUIDE PIN CHANGES.
D 06 10/20/15 D
BASED ON NEW DUST COVER DASH NUMBER
07 12/15/15
BASED ON NEW SPRING ASSEMBLY (SHORTER STUD)
08 BASED ON NEW DUST COVER (H77975-005) AND BOLSTER 6/3/16
PLATE ASSEMBLY (H77470-008).
C C

DUST COVER MUST SNAP INTO BOLSTER
PLATE ASSEMBLY BEFORE SHIPPING
1
Bolster Plate Assembly and Dust Cover
B B
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES
164997 - INTEL MARKING STANDARD
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE.
3. CLEAN AND DEGREASE BACKPLATE ASSEMBLY BEFORE ATTACHING DUST COVER.
4. FINAL ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.
1 2 H77975-005 LGA3647 NRW DUST-COVER

1 1 H77470-008 KNL BOLSTER PLATE ASSEMBLY
TOP H78747-008
PARTS LIST
A P.O. BOX 58119 A
9/3/14 TITLE
CHECKED BY DATE
9/11/15
THIRD ANGLE PROJECTION KNL BOLSTER PLATE & DUST COVER ASSY
-
APPROVED BY DATE
9/11/15
SEE NOTES SEE NOTES SCALE: 2 DO NOT SCALE DRAWING SHEET 1 OF 1
8 7 6 5 4 3 2 1


DWG. NO SHT. REV
8 7 6 5 4 3 H77470 1 12 1
REVISION HISTORY
Figure E-5.

- 01
- -TOOLING RELEASE 4/8/15
-
1.UPDATED NOTE #8 TO LOWER PULLOUT FORCE FROM 225 LBF TO 60 LBF
02 4/15/15
2. ROLLED ASSEMBLY PART NUMBER FROM -001 TO -002.
1. MODIFIED NOTE 4 CALL-OUT SYMBOL FOR CRITICAL TO

FUNCTION DIMENSIONS.
03 2. ROLLED ASSEMBLY PART NUMBER FROM -002 TO -003, 5/6/15
BASED ON UPDATED SPRING, COLLAR AND M4 STUD CHANGES.
PG2 B6 3. DIMENSION CHANGED FROM 72.7MM TO 72MM
PG2 A7 04 1. REMOVED DIMENSION. 5/12/15
PG2 5C 05 1. MOVED CTF CALLOUT TO FEATURE CONTROL FRAME. 5/22/15
D 1. CHANGED STUD PART NUMBER IN SPRING. D
06 2. CHANGED BOLSTER HOLE DIAMETER UNDER SPRINGS.
6/9/15
1. CHANGED DATUM B REFERENCE FROM NUT TO SMALL GUIDE POST

PG2 D5 2. ROLLED THE PART DASH NUMBER FROM H77470-004 TO H77470-005
07 8/28/15

3. UPDATED NOTE 8 TO REMOVE PUSHOUT FORCE REQUIREMENT
4. ADDED NOTE 14
1. ROLLED DASH NUMBER FROM H77470-005 TO H77470-006 BASED ON
PG1 B3 08 INSULATOR HOLE DIAMETER CHANGE 10/20/15
2. ADDED NOTE 15 AND 16
PG2 C6 3. CHANGED POSITION TOLERANCE FROM 0.1 TO 0.25.
1. ROLLED DASH NUMBER FROM H77470-006 TO H77470-007 BASED ON
PG1 B3 NEW SPRING ASSEMBLY (DECREASED SPRING STUD LENGTH) AND
09 12/7/15
PG2 B3 PRECONDITIONING NOTE 17.
PG2 A1 10 1. REMOVED CTF DIMENSION AND CHANGED TO A REFERENCE DIMENSION. 2/11/16
1. CHANGED DATUM B TO THE CORNER STANDOFFS. MEASUREMENTS TAKEN
FROM THE CENTER OF THE PART.
PG2 D7 2. CHANGED PRE-CONDITIONING PUSH DISTANCE FROM 2.8 TO 3.1.
3. CHANGED NOTE #8 FROM PULLOUT FORCE FROM 60 LBF TO 100 LBF.
11 4. REMOVED COSMETIC REVISION OFF THE PART. 6/3/16
PG2 B3 5. INCREASED TRUE POSITION TOLERANCES FOR GUIDE POSTS, CORNER
PG1 C2 STANDOFFS AND SPRING STUDS.
6. ROLLED ASSY DASH NUMBER FROM H77470-007 TO H77470-008 BASED ON NEW
SPRING ASSEMBLY NUMBER (ADDED HARDNESS REQUIREMENT ON SPRING STUD).
PG2 D7 1. CHANGED LOCATION OF CTF SYMBOL FROM GUIDE POSTS TO CORNER STANDOFFS.
PG2 C5 2. ADDED BACK CTF SYMBOL ON THE CENTER STUD DIMENSION.
PG2 A4 12 3. REMOVED CTF SYMBOL ON THE SPRING STUD TO BOLSTER FRAME GAP DIMENSION. 7/18/16
PG2 B3 4. REMOVED COSMETIC TEXT "PRE-PRODUCTION" FROM ASSEMBLY.
FOR FEATURES NOT EXPLICITLY TOLERANCED:
0.2 A B
(BASIC DIMENSIONS FROM THE 3D CAD DATABASE)
3 MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER INTEL MARKING STANDARD
(164997) WITH ADDITIONAL INFORMATION:
A) ASSEMBLY VENDOR ID
B) DATE CODE
C) DISPLAYED TEXT
D) DISPLAYED PIN-1 MARKING
C 4 DIMENSIONS MARKED ARE
C CRITICAL TO FUNCTION DIMENSION (CTF). FOR PRODUCTION QUALIFICATION C
2 INDICATED DIMENSION REQUIRES CP/CPK STUDY BASED ON A RANDOM 30 PART SAMPLE OF A 300 PART MINIMUM
LOT PER CQC.
5 ALL STUDS/RIVETS/POSTS/WELDS TO BE FLUSH TO THIS SURFACE, +0.00 / -0.25 C

6 SPRING RIVETS (INDIVIDUAL):
- PULLOUT FORCE > 500N (112LBF)
C
- FAILURE MODES: MUST NOT SHEAR, DEFORM, STRIP, OR CRACK BELOW FORCE LIMIT.
Bolster Plate Assembly, 1/2
- LIMITS BASED ON 3 SIGMA DISTRIBUTION

6 - RIVET HEAD SOLID HEIGHT MUST BE GREATER THAN OR EQUAL TO SPRING TOP SURFACE.
7 NUT/COLLAR SEPARATION FORCE
- PUSHOUT FORCE > 222N (50LBF) C
- LIMITS BASED ON 3 SIGMA DISTRIBUTION
8 CORNER STANDOFF SEPARATION FORCE
-PULLOUT FORCE > 445N (100LBF)
-TORQUE OUT > 2.25 N-m (20IN-LBF) C
9. CLEAN AND DEGREASE BACKPLATE ASSEMBLY BEFORE ATTACHING INSULATION.
10. AFTER APPLICATION THE INSULATOR MUST BE FREE OF BUBBLES, POCKETS, CREASES, AND
ANY OTHER DEFORMATIONS.
3 11. FINAL ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.
12 PRESS FIT BOLSTER-LEC GUIDE PIN (H78231) INTO BOLSTER PLATE ASSEMBLY. MUST HAVE PIN FLUSH
WITH BOLSTER FLANGE.
7 2X
13 POST SEPARATION FORCE (INDIVIDUAL):
- PUSHOUT FORCE > 89N (20LBF)
3X 10 - FAILURE MODES: MUST NOT SHEAR, DEFORM, STRIP, OR CRACK BELOW FORCE LIMIT.
14 BACKPLATE ASSEMBLY (H77469) TO BOLSTER PLATE ASSEMBLY STUD/NUT MUST BE ABLE TO
ENGAGE WITH MOTHERBOARD THICKNESS' IN THE RANGE OF 1.42MM-2.59MM (0.056"-0.102").
15 FLATNESS MUST BE MEASURED IN THE UNCONSTRAINED STATE. ALL OTHER CTF MEASUREMENTS
CAN BE MEASURED IN A CONSTRAINED STATE.
16 WHEN INSTALLING BOLSTER PLATE TO BACKPLATE (H77469) THERE MUST BE NO THREAD SHAVINGS WHEN
B 2X 1 ASSEMBLING 2 CYCLES IN ANY SEQUENCE, OR 6 CYCLES WHEN SEQUENCING IS IMPLEMENTED. SEQUENCING B
SHOWN ON PAGE 2. NO DEBRIS (ANYTHING GREATER THAN 0.5MM DIAMETER OR LENGTH) IS MEASURED WITH
NAKED EYE AT 2 FEET AWAY, WITH DIRECT OVERHEAD LIGHTING UNDER COOL WHITE FLOURESCENT LIGHT
CONDITIONS (60-120 FT-CANDLES (645-1293 LUX) OR EQUIVALENT). VIEWING TIME SHALL BE ONE VISUAL
PASS OF 5-7 SECONDS FOR EACH SURFACE.
4 17 SEE PRE-CONDITIONING REQUIREMENT DETAILS ON PAGE 2 ZONE B-3.
7X 9 3 10 H19329-003 SOCKET P M3 BOLSTER CAPTIVE NUT COLLAR

7 9 H19328-002 SOCKET P M3 BOLSTER CAPTIVE NUT
4 8 H19325-001 SKT-P-KNL, SPRING RIVET
2 7 H37308-009 KNL SPRING ASSEMBLY
1 6 G93935-003 KNL BOLSTER SMALL GUIDE POST
1 5 G93729-002 KNL BOLSTER PLATE INSULATOR
1 4 G93727-005 KNL BOLSTER PLATE
2 3 H78231-004 KNL BOLSTER LEC GUIDE PIN
1 2 G94443-003 KNL BOLSTER LARGE GUIDE POST
2 1 H77926-005 KNL BOLSTER CORNER STANDOFF
TOP H77470-008 KNL BOLSTER PLATE ASSEMBLY
5 PARTS LIST
A 8/16/13 P.O. BOX 58119 A
8/16/13 TITLE
CHECKED BY DATE
9/18/15
THIRD ANGLE PROJECTION KNL BOLSTER PLATE ASSEMBLY
-
8 4X APPROVED BY DATE

8 7 6 5 4 3 2 1
77

78
DWG. NO SHT. REV
8 7 6 5 4 3 H77470 2 12 1
Figure E-6.
NUT ASSEMBLY SEQUENCE FOR 6 CYCLES:

1
16 ASSEMBLE AND THE REMAINING NUTS IN ANY ORDER.
DISSASSEMBLE IN REVERSE ORDER OF ASSEMBLE.
D 68 D
3X 7
22.3±0.3
2X ( 5.5)
0.43 A
( 3.5)
C
B
0.5 A B
4X BOLSTER INSTALLATION HOLES,

LOCATION MUST ALLOW T-20 DRIVER TO
TIGHTEN H19328 NUTS IN ASSEMBLED STATE,
ADJUST HOLE LOCATIONS IN H37309 AS NEEDED
C C
( 4) M4 MAJOR DIAMETER
2X 0.43 A B
95 C

Bolster Plate Assembly, 2/2
14 7X
4X 6
NO METAL CAN BE EXPOSED. C

OVERHANG OF INSULATOR ON INNER
B AND OUTER EDGES OF THE
B
( 5.5) BOLSTER-PLATE IS ACCEPTABLE.
PRE-CONDITION THE SPRING BY EITHER PULLING
1
0.5 A B
3 (ON THE SPRING STUD) OR PUSHING UP
(ON THE CENTER OF THE STUD HEAD) IN THE 17
2X 8 DIRECTION OF THE ARROW BY 3.1 0.1MM.
72
12
4X BULGING OF RIVET HEAD ON THIS (0.60+0.25/-0.05)SPRING STUD TO BOLSTER

SIDE IS ACCEPTABLE. NOT TO FRAME GAP (AFTER PRE-CONDITIONING)
EXCEED 2.5MM
0.5 A
A 2X 0.45 0.2 A
A 5 A
0 0.25 2X LASER WELD OR RIVET POST ONTO BOLSTER PLATE.

1.0 NO MATERIAL TO PROTRUDE BELOW BOTTOM SURFACE 5
SPRING STUD TO BOLSTER FRAME
GAP (BEFORE PRE-CONDITIONING) OF BOLSTER PLATE ASSEMBLY
15 13

R
P.O. BOX 58119 D H77470 12
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H53249 1 10 1
REVISION HISTORY
Figure E-7.

ADDED DRAFT TO THE PART. ROLLED THE PART # TO -002
02 3/31/15
AND REVED THE DRAWING TO REV 02
PG2 7-C 1. CHANGE PRODUCTION TO PRE-PRODUCTION
NOTES; UNLESS OTHERWISE SPECIFIED: PG1 8-C 03 2. ADDED NOTE 8 FOR SYMBOL CALL OUT. 4/2/15
PG2 7-C 3. UPDATED NOTE 5 CALL OUT TO NOTE 4 CALLOUT ON SHEET 2 VIEW
1. ADDED NOTE 9 TO CALL OUT CRITICAL TO FUNCTION DIMENSIONS.
04 4/23/15
1. REFERENCE DOCUMENTS 2. ADDED POSTION TOLERANC TO DIAMETER OF HOLES.
PG1 B2
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES 05 1. REMOVED CTF CALLOUTS ON BASIC HOLE TO HOLE DIMENSIONS. 5/21/15
PG1 C3
UL 94 - UL FLAMABILITY TESTING PG2 C6 06 1. ADDED CTF CALLOUTS TO MID ALIGNMENT FEATURES. 6/29/15
D PG2 B7 1. UPDATED COSMETIC REV ON PART TO MATCH DRAWING REV D
164997 - INTEL MARKING STANDARD PG1 B1 07 2. UPDATED HOLES TRUE POSTION TOLERANCE FROM 0.1 TO 0.25 10/20/15
ISO-11469 - MATERIAL MARKING STANDARD PG1 B2 3. UPDATED PROFILE FROM .125 TO 0.2
1. CHANGED PROFILE CALLOUT TO TRUE POSITION AND TOLERANCE FROM

BS-MTN-0001-INTEL ENVIRONMENTAL PRODUCT SPECIFICATION PG1 C1
08 0.1 TO 0.3. 2/11/16
INTEL COLOR MATCHING SPECIFICATION (610204) PG2 B5
2. REMOVED PROFILE DIMENSION.
PG1 D7 1. REMOVED NOTE #4F TO ELIMINATE THE REVISION OFF THE PART.
PG2 B7 2. ADDED A LARGE VISIBLE SCREWDRIVER SYMBOL FOR TIM BREAKER.
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD 3. ADDED BIGGER ROUNDS TO LATCH FEATURES.
PG2 A4
FOR FEATURES NOT EXPLICITLY TOLERANCED: PG2 B5 4. ADDED NOTE 11.
0.2 A B C 09 6/3/16
PG1 C2 5. CHANGED COSMETIC TEXT FROM PUSH TO LATCH.
(BASIC DIMENSIONS FROM 3D CAD MODEL). 6. REMOVED CTF SYMBOLS FROM GUIDE POSTS.
PG1 C1
PG1 C3 7. INCREASED SIZE OF PIN 1 TRIANGLE HOLE.
8. ROLLING PART NUMBER FROM H53249-002 TO H53249-003.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
A) TYPE: PC-ABS PG1 A2 1. REMOVED FIVE CTF DIMENSIONS ON PAGE 1 AND TWO ON PAGE 2.
10 7/16/16
PG2 B7 2. REMOVED COSMETIC TEXT "PRE-PRODUCTION"
B) COLOR: BLACK
C) MINIMUM UL FLAMMABILITY RATING 94-V0 A
D) 15% REGRIND ALLOWED.
E) MUST WITHSTAND 120 C WITHOUT DEFORMING
5 0.1
4 MARK PART APPROXIMATELY WHERE SHOWN PER INTEL MARKING
0.25 A
STANDARD (164997) WITH THE FOLLOWING INFORMATION.
B
MARKING SHOULD BE ENGRAVED INTO PART USING AN INSERT IN THE TOOL SO THAT
INFORMATION CAN BE EASILY CHANGED.

OTHERWISE, BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) SUPPLIER PART NUMBER
B) INTEL PART NUMBER
C C) CAVITY NUMBER (IF APPLICABLE) C
D) DATE CODE
2X 0.75
5. DEGATE: FLUSH TO -0.25 MM [-.010"]. 10 2X 2 0.1
0.3 A B C
6. EJECTOR MARKS: FLUSH TO MINUS 0.0 MM/-0.125 MM [.000 IN/-.005 IN]. 2X 1.5
2X 2.35 0.1
7. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS,
UNLESS OTHERWISE SPECIFIED.
8 MARK SYMBOL APPROXIMATELY WHERE SHOWN PER INTEL MARKING 107±0.1 2X 95 76

MARKING SHOULD BE ENGRAVED INTO PART USING AN INSERT IN THE TOOL.
9.DIMENSIONS MARKED CARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
10 MEASURE IN RESTRAINED XHATCHING LOCATIONS WITH 2-5 NEWTONS.
11 MARK SYMBOL APPROXIMATELY WHERE SHOWN PER INTEL PART MARKING STANDARD
(164997) OPTIONAL.
Heatsink Module Clip (non-Fabric), 1/2
B 9.5 B
SECTION A-A A
2X 8.2 0.1
7 0.1 2X 68
PIN 1 INDICATOR 0.25 A B C
0.25 A B 80±0.1
C
0.2
2X 4.75 0.1 A 2X 4.75 0.1
2X 6.5 0.1 8X 6 0.1
TOP H53249-003 KNL CPU CARRIER (NON-HFI)

PARTS LIST
A 08/15/13 P.O. BOX 58119 A
3/4/14 TITLE
CHECKED BY DATE
3/4/14
THIRD ANGLE PROJECTION KNL CPU CARRIER (NON-HFI)
APPROVED BY DATE
- -
8 7 6 5 4 3 2 1
79

80
DWG. NO SHT. REV
8 7 6 5 4 3 H53249 2 10 1
Figure E-8.
D D
C C

82.5
8
Heatsink Module Clip (non-Fabric), 2/2
B B
62.5
9.97±0.1
R0.5
R0.5 11
A 7.97±0.1
A A

R
P.O. BOX 58119 D H53249 10
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H53248 1 09 1
REVISION HISTORY
Figure E-9.

1. REMOVED XHATCHING ON PART.
PG1 7-A 2. CHANGED PRODUCTION TO PRE-PRODUCTION.
PG2 7-C 3. ADDED NOTE 8 FOR SYMBOL CALL OUT.
02 4/1/15
PG1 8-C 4. ADDED NOTE 4 CALLOUT TO BOTTOM VIEW.
NOTES; UNLESS OTHERWISE SPECIFIED: PG2 8-C 5. ADDED DRAFT
6. ROLLED PART NUMBER FROM -001 TO -002.
1. ADDED NOTE 9 TO CALL OUT CRITICAL TO FUNCTION DIMENSION.
03 4/23/15
1. REFERENCE DOCUMENTS 2. ADDED POSITION TOLERANCE TO DIAMETER HOLES.
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES 04 1. REMOVED CTF CALLOUT TO BASIC DIMENSIONS. 5/21/15
D UL 94 - UL FLAMABILITY TESTING 05 1. ADDED CTF TO WIDTH AND LENGTH PROFILE 6/29/15 D
PG2 B-7 1. UDPATED COSTMETIC REV ON PART TO MATCH DRAWING REV
164997 - INTEL MARKING STANDARD PG1 B-1 06 2. UPDATED HOLES TRUE POSTION TOLERANCE FROM 0.1 TO 0.25 10/20/15
ISO-11469 - MATERIAL MARKING STANDARD PG1 B-2 3. UPDATED PROFILE FROM .125 TO 0.2

BS-MTN-0001-INTEL ENVIRONMENTAL PRODUCT SPECIFICATION PG1 C-1 1. CHANGED TRUE POSITION TOLERANCE FROM 0.1 TO 0.3
07 2/11/16
PG2 C-6 2. REMOVED PROFILE DIMENSION.
PG1 D-7 1. REMOVED NOTE #4F TO ELIMINATE THE REVISION OFF THE PART.
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD PG2 B-7 2. ADDED A LARGE VISIBLE SCREWDRIVER SYMBOL FOR TIM BREAKER.
PG2 A-4 3. ADDED ROUNDS TO LATCH FEATURES.
FOR FEATURES NOT EXPLICITLY TOLERANCED: 0.2 A B C 4. ADDED NOTE #11.
PG2 B-5 08 6/3/16
(BASIC DIMENSIONS FROM 3D CAD MODEL). PG1 C-2 5. CHANGED COSMETIC TEXT FROM PUSH TO LATCH ALONG WITH ARROWS.
PG1 C-1 6. REMOVED CTF SYMBOLS FROM GUIDE POST HOLES.
PG1 C-3 7. INCREASED SIZE OF PIN 1 TRIANGLE HOLE.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. 8. ROLLING PART NUMBER FROM H53248-002 TO H53248-003.
A) TYPE: PC-ABS PG1 A2 1. REMOVED TWO CTF DIMENSIONS ON PAGES 1 AND 2.
09 7/18/16
PG2 B7 2. REMOVED COSMETIC TEXT "PRE-PRODUCTION".
B) COLOR: BLACK PER INTEL COLOR MATCHING SPECIFICATION (610204).
C) MINIMUM UL FLAMMABILITY RATING 94-V0
D) MUST BE UL RECOGNIZED MATERIAL.
E) 15% REGRIND ALLOWED.
F) MUST WITHSTAND 120 C WITHOUT DEFORMING 5 0.1
B 0.25 A
4 MARK PART APPROXIMATELY WHERE SHOWN PER INTEL MARKING
MARKING SHOULD BE ENGRAVED INTO PART USING AN INSERT IN THE TOOL SO THAT
INFORMATION CAN BE EASILY CHANGED.
OTHERWISE, BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) SUPPLIER PART NUMBER
C B) INTEL PART NUMBER: H53248-003 C
C) CAVITY NUMBER (IF APPLICABLE) 2X 2.35 0.1
D) DATE CODE
5. DEGATE: FLUSH TO -0.25 MM [-.010"].
6. EJECTOR MARKS: FLUSH TO MINUS 0.0 MM/-0.125 MM [.000 IN/-.005 IN].

10
7. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS,
UNLESS OTHERWISE SPECIFIED. 107±0.1 2X 95
8 MARK SYMBOL APPROXIMATELY WHERE SHOWN PER INTEL MARKING

MARKING SHOULD BE ENGRAVED INTO PART USING AN INSERT IN THE TOOL.
3X 2 0.1
Heatsink Module Clip (Fabric), 1/2
ARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
0.3 A B C
10 MEASURE IN RESTRAINED XHATCH LOCATIONS WITH 2-5 NEWTONS.
11 MARK SYMBOL APPROXIMATELY WHERE SHOWN PER INTEL MARKING

STANDARD (164997) OPTIONAL. C
9.5
B B
2X 68
7 0.1 2X 8.2 0.1
80±0.1 0.25 A B C
0.25 A B
PIN 1 INDICATOR C
0.2
2X 4.75 0.1 A 2X 4.75 0.1
8X 6 0.1
3X 6.5 0.1
TOP H53248-003 KNL CPU CARRIER (NON-HFI)

PARTS LIST
A 08/15/13 P.O. BOX 58119 A
3/4/14 TITLE
CHECKED BY DATE
3/4/14
THIRD ANGLE PROJECTION KNL CPU CARRIER (HFI)
APPROVED BY DATE
-
8 7 6 5 4 3 2 1
81

82
DWG. NO SHT. REV
8 7 6 5 4 3 H53248 2 09 1
D D
C C
82.5

8
Figure E-10. Heatsink Module Clip (Fabric), 2/2
B 62.5
B
9.97±0.1
11 R0.5
R0.5
A
7.97±0.1
A A

R
P.O. BOX 58119 D H53248 09
8 7 6 5 4 3 2 1


DWG. NO SHT. REV
8 7 6 5 4 3 G93719 1 07 1
REVISION HISTORY
CHANGED OUTER PERIMETER , CENTER AND FOUR SQUARE

02 09/12/14
OPENING DIMENSIONS. NEW -002 PART NUMBER.
B5 1. REMOVED UNNECESSARY DIMENSIONS.
03 12/11/14
C2 2. UPDATED NOTE 2.
1. REMOVED DIMENSIONS.
04 4/27/15
2. UPDATED NOTE 2 AND NOTE 4
TOP SIDE (INSULATOR SIDE) BOTTOM SIDE C7 05
1. FIXED DIMENSION WITNESS LINES
9/15/15
D 2. REMOVED CTF CALLOUT ON 81.6 AND 108.6 BASIC DIMENSION D
C1 1. CHANGED PROFILE TOLERANCE IN NOTE 2 FROM 0.2 TO 0.4
81.6 A7 2. REMOVED FLATNESS CALLOUT.
06 10/29/15
3. ADDED NOTE 9 TO STATE FLATNESS IS CALLED OUT ON

B4 THE BACKPLATE ASSEMBLY DRAWING H77469.
D7 1. ADDED TWO CTF DIMENSIONS
07 7/11/16
19.9 A7 2. REMOVED THICKNESS CTF DIMENSION
C
Figure E-11. Backplate
UL1439 - UL SHARP EDGE TESTING
7X HOLE DRIVEN 164997 - INTEL MARKING STANDARD
PRESS FIT STUD PER ASSEMBLY A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL
DRAWING H77469 5 C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL
0.1 A
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY
2X 26 3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED.
(BASIC DIMENSION FROM 3D CAD MODEL):
.4 A B
B

A) TYPE:SHEET STEEL, SK7, 1065, S50C, OR CHSP60PC-
2.2MM+/-0.05 THK
B) CRITICAL MECHANICAL PROPERTIES:

HEAT TREATED TO 250 MPa MINIMUM YIELD
TENSILE YIELD STRENGTH (ASTM D638) >= 250 MPa
ULTIMATE TENSILE STRENGTH (ASTM D638) >= 300 MPa
C) -PLATING: 2 MICROMETER MIN ELECTROLYTIC NICKEL PLATING
-PROCESS TEST: 168 HRS 85 C / 85% HUMIDITY WITH NO
C VISIBLE CORROSION C
108.6 26.5 2X 44 4 DIMENSIONS MARKED C
ARE CRITICAL TO FUNCTION DIMENSIONS
(CTF).
C
5 FINAL DIAMETER, LOCATION AND ORIENTATION OF PRESS FIT STUD
IN ASSY DRAWING H77469 MUST BE MET AND TAKES PRECEDENCE OVER
THIS DRAWING
6. PART SHALL BE FREE OF OIL AND DEBRIS.
7. BURR HEIGHTS SHALL NOT EXCEED 0.1 MM.
8. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM MAX.
9. FLATNESS TO BE CONTROLLED ON THE BACKPLATE ASSEMBLY

DRAWING H77469.
2X 32
B 44 B
2X 70
TOP G93719-002 KNL BACK PLATE

2.2 0.05 THICK
A QTY ITEM NO PART NUMBER DESCRIPTION
PARTS LIST
A 08/14/13 P.O. BOX 58119 A
08/14/13 TITLE
CHECKED BY DATE
09/15/15
THIRD ANGLE PROJECTION KNL BACK PLATE
APPROVED BY DATE
-
MATERIAL FINISH D G93719 07
8 7 6 5 4 3 2 1
83

84
DWG. NO SHT. REV
8 7 6 5 4 3 G93724 1 07 1
REVISION HISTORY
CHANGED OUTER PERIMETER, CENTER, AND FOUR SQUARE OPENING

02 9/12/14
DIMENSIONS. NEW PART NUMBER -002.
UPDATED DRAWING FOR COMPLIANCE WITH GD&T STANDARD,
03 3/26/15
1. REFERENCE DOCUMENTS SPECIFIED ADHESIVE
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES 1. ADDED NOTE 4 TO CALL OUT CRITICAL TO FUNCTION DIMENSIONS
04 5/7/15
2. UPDATED PROFILE TOLERANCE.
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED PG1 B2 1. REMOVED CTF CALLOUT SYMBOL TO OUTER BASIC DIMENSIONS.
D 05 5/21/15 D
TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE PG1 C4 2. INCREASED DIAMETER TOLERANCE FROM .12 TO .25.
0.24 A B
1. REMOVED DIMENSIONS.
3 MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS. 06 9/8/15
2. INCREASED PROFILE TOLERANCE IN NOTE 2 FROM 0.2 TO 0.24
CRITICAL MECHANICAL PROPERTIES:
PG1 C4 07 1. REMOVED CTF DIMENSION. 7/11/16
A) HALOGEN FREE POLYCARBONATE SHEET PC-1860B (CHENGDU
KANGLONGXIN PLASTICS CO,.LTD.)
0.127MM NOMINAL THICKNESS, ONE SIDE ADHESIVE (NIKTO 8905)
APPLIED; TOTAL THICKNESS= 0.18MM. TOP SIDE BOTTOM SIDE (ADHESIVE SIDE)
B) FLAMMABILITY: UL 94-V0 OR VTM-0 RATING.
4. DIMENSIONS MARKED CARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
82.1
35 35
A
Figure E-12. Backplate Insulator
7X 4.5 0.25
0.1 A
2X 26
B
C C

2X 44 109.1
2X 32
B B
13 44
+0.05
0.18 THICK
-0.02
2X 70 WITH ADHESIVE APPLIED 3
TOP G93724-002 KNL BACKPLATE INSULATOR

PARTS LIST
A 08/14/13 P.O. BOX 58119 A
08/14/13 TITLE
CHECKED BY DATE
9/3/15
THIRD ANGLE PROJECTION KNL BACKPLATE INSULATOR
APPROVED BY DATE
-
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H12853 1 07 1
REVISION HISTORY
1. INCREASE STUD LENGTH TO 7MM.

02 12/1/14
2. ADDED CTF FOR THREADS TO BE ROLLED NOT CUT.
1. DECREASED STUD LENGTH FROM 7MM TO 6.334MM.

03 3/26/15
2. UPDATED NOTES.
D D
04 1. CHANGED NOTE 4 CRITICAL TO FUNCTION SYMBOL. 4/23/15

05 1. UPDATED NOTES. 9/11/15
1. CHANGED THE HEIGHT FROM 6.334 TO 6.72

B8 06 2/11/16
2. PART NUMBER ROLLED FROM H12853-003 TO H12583-004.
A7 07 1. REMOVED CTF DIMENSIONS. 7/11/16
NOTES:
ASME Y14.5-2009-STANDARD DIMENSION AND TOLERANCES
UL 1439 - UL SHARP EDGE TESTING
2. FEATURES NOT SPECIFIED ON DRAWING WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE. FOR
FEATURES NOT EXPLICITLY TOLERANCED: (BASIC DIMENSIONS
FROM THE 3D CAD MODEL): 0.24 A B
3. MATERIAL:
- SUS 416
Figure E-13. Back Plate, M3 Stud
- CRITICAL MECHANICAL PROPERTIES: 400 MPa MIN

- PROCESS TEST: 168 HRS 85 C / 85% HUMIDITY WITH NO
VISIBLE CORROSION
4. DIMENSIONS MARKED ARE C CRITICAL TO FUNCTION
C DIMENSIONS (CTF). C
5 FEATURE DETAIL PER VENDOR SPECIFICATION
MUST MEET DURABILITY SPECIFICATIONS DEFINED IN
ASSEMBLY DRAWING
6. REFERENCE AND NON-DIMENSIONED FEATURES MAY BE MODIFIED
PER INTEL APPROVAL
M3x0.5 CLASS 6g EXTERNAL"ROLLED"

THREAD C
B B
CHAMFER 0.31 x 45 ALL AROUND
6.72±0.127 C
3.59±0.05
0
3.6
-0.2
2.2 MAX
5 FEATURE DEFINED BY PRESS FIT

IN ASSEMBLY.
A TOP H12853-004 SKT P M3 BACKPLATE STUD, SHORT
PARTS LIST
A 08/14/13 P.O. BOX 58119 A
08/14/13 TITLE
CHECKED BY DATE
09/11/15
THIRD ANGLE PROJECTION SKT P M3 BACKPLATE STUD, SHORT
APPROVED BY DATE
-
8 7 6 5 4 3 2 1
85

86
DWG. NO SHT. REV
8 7 6 5 4 3 G93727 1 15 1
REVISION HISTORY
MODIFIED BOLSTER PLATE OUTER PERIMETER DIMENSIONS.
02 9/12/14
CREATED NEW -002 PART NUMBER
SHT 2 1. UPDATED GTOL DIMENSIONING SCHEME.
2. UPDATED NOTE 2.
03 12/08/14
3. CHANGED LOCATION OF DATUM B.
4. ELIMINATED DATUM C.
ALL 04 UPDATED: DRAWING, PART-NUMBER TO -003, AND FLANGE GEOMETRY 3/26/15
PG2-C2 05 UPDATED: FLANGE GEOMETRY, PART NUMBER TO -004 04/06/15
81.2
D PG2-B2 06 UPDATED FLANGE HOLE CALLOUT 4/16/15 D
1. MODIFIED NOTE 4 TO HAVE SYMBOL TO CALL-OUT CRITICAL TO
07 5/7/15
FUNCTION DIMENSIONS
2X 68 PG1-A6 08 1. INCREASED ANGLE AND FLATNESS TOLERANCE. 5/11/15
PG1-C5
09 1. MADE BASIC DIMENSIONS ON SOME CTF CALLOUTS. 5/21/15
PG1-D7
61.5 C 7 PG1 C6 1. CHANGED THE 4 CENTER HOLE DIAMETERS FROM 6.1 TO 4.9MM.
9 10 6/9/15
PG2 C2 2. ADDED CTF DIMENSIONS TO SHEET 2.
PG1 A2 1.UPDATED TEXT ON NOTE 7 AND ADDED NOTES 8 AND 9

PG1 D7 2. CHANGED CALLOUT SYMBOLS 8 AND 9 TO DRAWING.
11 3. REMOVED CTF CALLOUT ON 81.2 AND 108.2 BASIC DIMENSION. 8/28/15
PG1 C4
PG2 B3 4. REMOVED CTF PROFILE CALOUT ON THE FLANGE
PG2 A5 1. CHANGED FEATURE LOCATION DIMENSION FROM 40.75 TO 40.57.
PG1 A7 2. REMOVED FLATNESS AND RADIUS CALLOUT
PG2 C5 3. CHANGED TRUE POSITON FLANGE WIDTH TOLERANCE FROM 0.1 TO 0.2
12 10/20/15
PG1 B2 4. CHANGED NOTE 2 PROFILE TOLERANCE FROM 0.2 TO 0.4
PG1 A2 5. ADDED NOTE 10
2X 26 PG2 C3 6. CHANGED .18 BASIC DIMENSION TO A DIMENSION WITH TOLERANCE
1. ADDED NOTE 11 TO CALL OUT OPTIONAL TOOLING HOLES IN THE
PG2 D6 13 BOLSTER PLATE FOR HVM PRE-CONDITONING AND MAX HOLE 12/14/15
DIAMETER 5.0MM.
+0.2
Figure E-14. Bolster Plate, 1/2
1. ADDED DATUM C AND TIED ALL 7 HOLES AS A PATTERN BY

4X (1.8) PG1 B5 14 2/11/16
-0.1 INCLUDING B-C IN THE FEATURE CONTROL FRAMES.
PG1 B5 1. REMOVED THREE CTF DIMENSIONS ON PAGE 1.

PG2 B4 15 2. REMOVED FIVE CTF DIMENSIONS ON PAGE 2. 7/11/16
PG1 B2 3. ADDED DATUM C TO THE FEATURE CONTROL FRAME ON NOTE 2.
2X 95
C C
2X 44 2X 88 C 2X 108.2

4X 4.9 0.1
0.1 A B C
B
NOTES; UNLESS OTHERWISE SPECIFIED: SCALE 1:1
2X 32 ASME Y14.5M-2009 - DIMENSIONING AND TOLERANCING
A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE CONTROLLED
BY 3D CAD DATABASE, AND SHALL CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).
FOR FEATURES NOT EXPLICITLY TOLERANCED :
0.4 A B C
(BASIC DIMENSIONS FROM THE 3D CAD MODEL).

A) TYPE: 301 SS HALF HARD
8 B) CRITICAL MECHANICAL PROPERTIES:
B +0.2 9 TENSILE YIELD STRENGTH (ASTM D638) = 758-930 MPa B
2X 2.05 MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa
-0.1 C) PLATING: NONE.
D) HEAT TREATING: NONE
44 4 DIMENSIONS MARKED ARE
C CRITICAL TO FUNCTION DIMENSIONS (CTF).
3X 6.1 0.1
5. BURR HEIGHTS SHALL NOT EXCEED 0.1MM.
2X 70 0.1 A B C
6. SHARP CORNERS MUST BE CHAMFERED OR ROUNDED TO 0.25MM RADIUS MAX.
C 7 REFER TO LARGE GUIDE POST DRAWING G94443 FOR HOLE REQUIREMENTS.
8 REFER TO SMALL GUIDE POST DRAWING G93935 FOR HOLE REQUIREMENTS.
9 REFER TO CORNER STANDOFF DRAWING H77926 FOR HOLE REQUIREMENTS.
10 FLATNESS TO BE CONTROLLED ON THE BOLSTER PLATE ASSEMBLY DRAWING H77470.
11 OPTIONAL TOOLING HOLES FOR HVM PRE-CONDITIONING REQUIREMENT. MAX 5.0MM HOLE DIAMETER.
2X 90 1.5
TOP G93727-005 KNL BOLSTER PLATE

PARTS LIST
DIMENSIONS ARE IN MILLIMETERS. DESIGNED BY DATE DEPARTMENT R
A A 06/04/13 P.O. BOX 58119 A
06/04/13 TITLE
1.5±0.08
CHECKED BY DATE
9/18/15
THIRD ANGLE PROJECTION KNL BOLSTER PLATE
APPROVED BY DATE
-
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 G93727 2 15 1
D D

22.45
Figure E-15. Bolster Plate, 2/2
11 25.1±0.2 C
0.2 A B
(3.5)
C C
2X 0.18 0.1
2X 7.2
2X 5.75 0.15
2X ( 2.6)
0.4 A B C 2X 3.65
B B
47.8 A
DETAIL B
2X 44.25 SCALE 10:1
2X 40.57 0.15
SEE DETAIL B
A
A A

R
P.O. BOX 58119 D G93727 15
8 7 6 5 4 3 2 1
87

88
DWG. NO SHT. REV
8 7 6 5 4 3 G93729 1 09 1
REVISION HISTORY
02 MODIFIED OUTER PERIMETER DIMENSION. CREATED NEW -002 PART. 09/12/14
1. CHANGED LOCATION OF DATUM B AND ELIMINATED DATUM C.
03 12/08/14
2. UPDATED NOTE 2.
04 UPDATED NOTES AND GD & T DIMENSIONING. 3/27/15

81.7
05 ADDED CALL OUT FOR CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
D PG1 C5 D
06 1. REMOVED THE CTF SYMBOL OFF DIMENSIONS BUT THE HOLE DIAMETER. 5/21/15
61 PG1 C7
1. CHANGED THE FOUR CENTER HOLE DIAMETERS FROM 5.0MM TO 3.8MM.
C6 07 10/7/15
2. ROLLED THE PART NUMBER FROM G93729-002 TO G93729-003.
35 1. CHANGED THE CENTER HOLE DIAMTERS BACK TO 5.0MM SO
08 SUPPLIERS WOULDN'T HAVE TO MODIFY THE TOOLING. 10/15/15
2. WILL REVERT BACK TO THE PREVIOUS PART NUMBER, G93729-002.
C6 09 1. REMOVED CTF DIMENSION. 7/11/16
2X 26
4
Figure E-16. Bolster Plate, Insulator
C 2X 44 2X 87.5 2X 108.7 C
4X 5 0.25
.1 A

B
2X 32
3X 5 0.25
.1 A B NOTES, UNLESS OTHERWISE SPECIFIED:
B C 13 44 B
1. REFERENCE DOCUMENTS:
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE CONTROLLED
BY 3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
2X 70 (BASIC DIMENSIONS FROM THE 3D CAD MODEL) .24 A B
3 MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS.
A) TYPE: HALOGEN FREE POLYCARBONATE SHEET PC-1860B (CHENGDU KANGLONGXIN PLASTICS CO,.LTD.)
0.127MM NOMINAL THICKNESS, ONE SIDE ADHESIVE APPLIED (NIKTO 8905); TOTAL THICKNESS= 0.18MM.
-FLAMMABILITY: UL 94-V0 OR VTM-0 RATING.
4 APPLY ADHESIVE TO THE TOP SIDE
5. DIMENSIONS MARKED ARE

+0.05
0.18
-0.02
TOP G93729-002 KNL BOLSTER PLATE INSULATOR
WITH ADHESIVE APPLIED 3
PARTS LIST
A 8/16/13 P.O. BOX 58119 A
A DRAWN BY DATE SANTA CLARA, CA 95052-8119
8/16/13 TITLE
CHECKED BY DATE
2/20/14
THIRD ANGLE PROJECTION KNL BOLSTER PLATE INSULATOR
APPROVED BY DATE
-
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 G93935 1 08 1
REVISION HISTORY
1. ADDED TAPER TO POST. ROLLED PART NUMBER TO -002.

2. CHANGED POST DIAMETER FROM 4.5MM TO 3.5MM.
7A 02 12/10/14
3. CHANGED POST BOTTOM INTERFACE DIAMETER FROM 3MM TO 2.5MM
4. UPDATED NOTE 2 AND ADDED NOTE 7.
A3 1. REVISED PART NUMBER TO -003.
ALL 03 2. REMOVED BASE TAPER. 03/25/15
B3 3. REMOVED NOTE 4 AND 6.
1. REMOVED 8MM AND 2.17MM DIMENSIONS.

04 04/15/15
D 2. INCREASED TOLERANCE FROM .1 TO .25MM ON 20MM DIMENSION D
3-B 05 1. ADD NOTE 6 TO CALL OUT CRITICAL TO DIMENSIONS. 4/23/15

1. CHANGED DIMENSION TO STATE MAX 3.0 AND CALLOUT #7 SYMBOL
6-A
06 2. ADDED NOTE 7 TO CALLOUT REQUIRED PUSH OUT FORCE. 8/28/15
2-B
3. ADDED GD & T FEATURE CONTROL FRAMES
B-6 07 1. ADDED OPTIONAL CHAMFER/RADIUS TO AID IN ASSEMBLY OF PART. 10/01/15
1. CHANGED FEATURE CONTROL FRAME DIMENSION FROM 0 TO 0.1.
C-7
08 2. CHANGED FEATURE CONTROL FRAME SYMBOL FROM TRUE POSTION TO 10/15/15
C-7
PERPENDICULARITY
3.5 0.1 B
C
.1 A
C C
20±0.25
Figure E-17. Bolster Plate, Small Guide Post
CHAMFER TO CORNER (MAX 1.0 HEIGHT) OR 1.0MM

RADIUS MAX CAN BE ADDED AS AND OPTION NOTES: UNLESS OTHERWISE SPECIFIED:
FOR STRUCTURAL INTEGRITY DURING ASSEMBLY
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE

SHALL BE CONTROLLED BY 3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
B .2 A B B
3. DIMENSIONS ARE IN MILLIMETERS
A 4. MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304; OR EQUIVALENT
5. PROCESS TEST: 168 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION.
7 SUPPLIER DEFINED DIAMETER TO MEET PRESS FIT SEPARATION FORCE REQUIREMENT.

3.0 MAX 7 SEE APPLICABLE BOLSTER PLATE ASSEMBLY DRAWING.
- PUSHOUT FORCE > 89N (20LBF)
.05 B A
TOP G93935-003 KNL BOLSTER SMALL GUIDE POST

PARTS LIST
A 8/16/13 P.O. BOX 58119 A
8/16/13 TITLE
CHECKED BY DATE
9/11/15
THIRD ANGLE PROJECTION KNL BOLSTER SMALL GUIDE POST
APPROVED BY DATE
-
8 7 6 5 4 3 2 1
89

90
DWG. NO SHT. REV
8 7 6 5 4 3 G94443 1 08 1
REVISION HISTORY
1. ADDED TAPER TO POST. ROLLED THE PART NUMBER TO -002.
7A 02 2. CHANGED POST INTERFACE DIAMETER FROM 2.5MM TO 3.0MM. 12/10/14
3. UPDATED NOTE 2 AND ADDED NOTE 7.
A3 1. REVISED PART NUMBER TO -003.
ALL 03 2. REMOVED BASE TAPER. 03/25/15
B3 3. REMOVED NOTE 4 AND 6.
1. REMOVED 8MM AND 3.26MM DIMENSIONS

7-C 04 04/15/15
2. INCREASED TOLERANCE FROM .1MM TO .25MM ON 20MM DIMENSION.
D D
3-B 05 1. ADD NOTE 6 TO CALL OUT CRITICAL TO DIMENSIONS. 4/23/15
1. CHANGED DIMENSION TO STATE MAX 3.0 AND CALLOUT #7 SYMBOL

6-A
06 2. ADDED NOTE 7 TO CALLOUT REQUIRED PUSH OUT FORCE. 8/28/15
2-B
3. ADDED GD&T FEATURE CONTROL FRAMES.
B-6 07 1. ADDED OPTIONAL CHAMFER/RADIUS TO AID IN ASSEMBLY OF PART. 10/01/15
C-7 08 1. CHANGED FEATURE CONTROL FRAME DIMENSION FROM 0 TO 0.1 10/15/15
5.5 0.1 B
C
.1 A
C C

20±0.25
Figure E-18. Bolster Plate, Large Guide Post
CHAMFER TO CORNER (MAX 1.0 HEIGHT) OR 1.0MM

RADIUS MAX CAN BE ADDED AS AND OPTION
FOR STRUCTURAL INTEGRITY DURING ASSEMBLY
NOTES: UNLESS OTHERWISE SPECIFIED:
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE

SHALL BE CONTROLLED BY 3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
B A
(BASIC DIMENSIONS FROM THE 3D CAD MODEL). .2 A B B
3. DIMENSIONS ARE IN MILLIMETERS
4. MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304; OR EQUIVALENT
5. PROCESS TEST: 168 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION.
3 MAX 7 7 SUPPLIER DEFINED DIAMETER TO MEET PRESS FIT SEPARATION FORCE REQUIREMENT.
SEE APPLICABLE BOLSTER PLATE ASSEMBLY DRAWING.
.05 B A - PUSHOUT FORCE > 89N (20LBF)
TOP G94443-003 KNL BOLSTER LARGE GUIDE POST

PARTS LIST
A 8/16/13 P.O. BOX 58119 A
8/16/13 TITLE
CHECKED BY DATE
9/11/15
THIRD ANGLE PROJECTION KNL BOLSTER LARGE GUIDE POST
APPROVED BY DATE
-
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H78231 1 06 1
REVISION HISTORY
B6 02 ADDED STEP IN SHAFT, CHANGED DIAMETER, PART NUMBER TO -002 4/6/15
A7 03 ADDED RECESS IN HEAD FOR ASSEMBLY, PART NUMBER TO -003 4/16/15
UPDATED NOTE 4 SYMBOL CALL-OUT FOR CRITICAL
04 4/23/15
TO FUNCTION DIMENSIONS.
6-A 1. REMOVED THE PIN HEAD
05 8/28/15
2. ROLLED THE DASH PART NUMBER FROM H78231-003 TO H78231-004
A5 06 1. REMOVED CTF DIMENSION. 7/11/16

D D

A A
C C
Figure E-19. Bolster Plate, LEC Guide Pin
NOTES; UNLESS OTHERWISE SPECIFIED

ASME Y14.5M-2009 - DIMENSIONING AND TOLERANCING
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE

CONTROLLED BY 3D CAD DATABASE
2.66 0.03 B
0.2 A B
2.5 0.03 3. CRITICAL MATERIAL PROPERTIES:
R0.2 0.1 C - MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305;
B JIS SUS304 OR EQUIVALENT B
VISIBLE CORROSION
4.DIMENSIONS MARKED WITH C

CRITICAL TO FUNCTION
DIMENSIONS (CTF).
5. SHARP CORNERS MUST BE CHAMFERED OR ROUNDED TO 0.25MM

RADIUS MAX. EDGES AROUND PERIMETER OF PART ARE
2.9±0.05 SUBJECT TO HANDLING AND ARE REQUIRED TO MEET UL1439 TEST.
TOP H78231-004 KNL BOLSTER LEC GUIDE PIN

A
PARTS LIST
A 3/25/15 P.O. BOX 58119 A
3/25/15 TITLE
CHECKED BY DATE
SECTION A-A 9/11/15
THIRD ANGLE PROJECTION KNL BOLSTER LEC GUIDE PIN
-
APPROVED BY DATE

8 7 6 5 4 3 2 1
91

92
DWG. NO SHT. REV
8 7 6 5 4 3 H77926 1 09 1
REVISION HISTORY
7-D 1. CHANGED THE STANDOFF HEIGHT FROM 7.8MM TO 6.3MM. THE OVERALL
STANDOFF HEIGHT CHANGED FROM 11.3MM TO 9.8MM.
02 4/1/15
2. ROLLED THE PART NUMBER FROM -001 TO -002.
NOTES; UNLESS OTHERWISE SPECIFIED: 3. REVED THE DRAWNG FROM REV01 TO REV 02.
1. DECREASED BOTTOM POST DIAMETER.

1. REFERENCE DOCUMENTS 03 4/1/5/15
04 1. ADDED NOTE 9 TO CALL-OUT CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
D D
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE
1. REMOVED DRY FILM LUBRICANT AND UPDATED NOTE 8 TO CALLOUT
CONTROLLED BY 3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED: 8-C
PULLOUT, TORQUE OUT AND PUSHOUT FORCE.
0.2 A B 6-A
(BASIC DIMENSIONS FROM 3D CAD MODEL) 2. CHANGED DIMENSION TO STATE 4.1 MAX AND CALLOUT #8 SYMBOL
6-C 05 9/10/15
3. CHANGED CTF DIMENSION FROM 3.5 TO 3.2.
4. ROLLED THE DASH PART NUMBER FROM H77926-003 TO H77926-004
3-C
3. DIMENSIONS ARE IN MILLIMETERS 5. ADDED NOTE FOR OPTIONAL CHAMFER OR ROUND.
C-8 1. REMOVE PUSHOUT FORCE IN NOTE 8
C-7 2. CHANGED PERPENDICULARITY TOL FROM 0 TO 0.1 AND REMOVED MMC
4. MATERIAL: SUS416; ALL THREADS REQUIRE APPROVED LUBRICANT BY INTEL. CONTACT INTEL A-6
06
3. CHANGED MAX FROM 4.1MM TO 4.6MM.
10/28/15
FOR THE LIST OF APPROVED LUBRICANTS. D-8 4. MODIFIED NOTE 4 TO INCLUDE LUBRICANT OR MATERIAL CHANGE
TO SUS416.
5. PROCESS TEST: 168 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION. D-8 07
1. UPDATED NOTE 4 TO REQUIRE THE MATERIAL TO BE SUS 416 AND
12/10/15
LUBRICANT REQURED.
6 MIN 0.2MM RADIUS FOR DUST COVER INTERFACE. C-6 08 1. CHANGED TOLERANCE FROM 0.1 TO 0.25 AND REMOVED CTF 2/11/16
DIMENSION.
D-7 1. UPDATED NOTE 4 TO REMOVE CHAIN SAVER LUBRICANT REFERENCE.
7 ROLLED THREADS. C-7 2. UPDATED NOTE 8 CHANGING PULLOUT FORCE FROM 267N (60LBF)
09 7/11/16
TO 445N (100LBF).
B-7 3. REMOVED FOUR CTF DIMENSIONS.
8 SUPPLIER DEFINED DIAMETER TO MEET PRESS FIT SEPARATION FORCE REQUIREMENT
SEE APPLICABLE BOLSTER PLATE ASSEMBLY DRAWING.
-TORQUE OUT > 2.25 N-m (20 IN-LBF)
CHAMFER TO CORNER (.25 X 1.0MM MAX HEIGHT)
9. DIMENSIONS MARKED WITH C
CRITICAL TO FUNCTION DIMENSIONS (CTF). OR 1.0MM ROUND MAX CAN BE ADDED AS AN OPTION
FOR EASE OF DUST COVER ASSEMBLY
C C
5.5 0.1 B
.1 A
M4 X 0.7-6g THREADS

7
Figure E-20. Bolster Plate, Corner Standoff
3.2 0.25
135°
(9.8)
6.6±0.05 0.9±0.1
A C
SEE DETAIL A 1.5±0.05
2.9±0.1
A
B B
5.5 0.05
7.5 0.05
C
DETAIL A
SCALE 16:1
4.6 MAX 8
.05 B A
TOP H77926-005 KNL BOLSTER CORNER STANDOFF

PARTS LIST
A 03/25/15 P.O. BOX 58119 A
03/25/15 TITLE
CHECKED BY DATE
9/11/15
THIRD ANGLE PROJECTION KNL BOLSTER CORNER STANDOFF
APPROVED BY DATE
-
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H37308 1 13 1
REVISION HISTORY
1. UPDATED SPRING ASSEMBLY PART NUMBER TO -002 BASED ON
02 NEW SPRING STUD TO A -002 W/TEETH. 12/11/14
2. UPDATED BOM TABLE TO REFLECT -002 FOR SPRING STUD.
03 1. UPDATED THE REFRENCE CTF DIMENSION FROM 1.3MM TO 0.9MM. 1/7/15
04 1. REMOVED CTF CALLOUT ON REFERENCE DIMENSION 2/4/15
D 1. ADDED NEW M4 STUD D

2. CHANGED STUD TO SPRING INTERFACE FROM PRESS
05 4/8/15
RIVET TO WELD.
1. ADDED DIMENSION AND NOTE 4 TO DRAWING

06 2. ROLLED THE ASSY NUMBER -004 BASED ON NEW 4/16/15
M4 STUD (H7925-003)
1. ADDED NOTE 6 TO CALL-OUT CRITICAL TO FUNCTION DIMENSIONS.

B4 07 5/6/15
2. INCREASED TOLERANCE FROM .1MM TO .2MM
B6
A3 1. CHANGED THE M4 STUD FROM PART NUMBER H77925-004
1 08 TO H78186-003. 6/9/15
B6 2. THE CTF DIMENSION CHANGED FROM 4.67 TO 5.45.
1. ROLLED THE DASH ASSY PART NUMBER FROM H37308-006 TO
09 H37308-007. THE M4 STUD CHANGED PART NUMBER FROM 8/28/15
H78186-003 TO H95019-002 TO SHARE SAME STUD WITH SKX
1. CHANGED NOTE 5 TO SAY MINIMIZE DISCOLORATION
B2
10 2. CHANGED NOTE 3 TOLERANCE FROM 0+/-.05 TO 0+/-0.10 10/15/15
A3
3. ADDED NOTE 7 TO CALLOUT OPTIONAL LUBRICANT.
1. ROLLED DASH NUMBER FOR SPRING ASSEMBLY FROM H37308-007
11 TO H37308-008 BASED ON NEW M4 STUD (J14344-001). 12/7/15
B6 2. CTF DIMENSION CHANGED FROM 5.525 TO 5.35
1. MODIFIED NOTE 7.
12 2. ROLLED THE DASH ASSY NUMBER FROM H37308-008 TO 6/3/16

H37309-009 BASED ON THE NEW M4 STUD (J14344-002).
2 A4 13 1. ADDED NOTE TO CTF DIMENSION. 7/11/16
C C
Figure E-21. Bolster Plate, Spring Assembly
5
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD MODEL DATABASE.
0.2 A
(BASIC DIMENSIONS FROM THE 3D CAD MODEL)
7 4 PULLOUT FORCE DIRECTION
B 3 INSTALL M4 MALE STUD FLUSH TO SPRING BOTTOM SURFACE +0/-0.10MM. B
4 M4 MALE ATTACH STUD:
5.35±0.2 C
- TORQUE OUT > 2.25N-m (20IN-LBF)
- FAILURE MODES: STUDS MUST NOT SHEAR, DEFORM, STRIP, CRACK,
OR TORQUE OUT BELOW TORQUE LIMIT.
- LIMITS BASED ON 3 SIGMA DISTRIBUTION.
0 0.2 C
5 MINIMIZE COLOR DISCOLORATION ON THIS SURFACE AND NO WELD ON THREADED SIDE OF SPRING
DIMENSION APPLIES TO
3
DATUM A TO STUD HEAD 6. DIMENSIONS MARKED C
A
2 SURFACES 7 ALL STUD THREADS REQUIRE APPROVED LUBRICANT BY INTEL. CONTACT INTEL FOR THE LIST
OF APPROVED LUBRICANTS.
1 2 J14344-002 SKT-P, SPRING STUD, M4

1 1 H37309-003 KNL SPRING
( 8) WELD STUD TO SPRING TOP H37308-009 KNL SPRING ASSEMBLY
PARTS LIST
A 5/9/14 P.O. BOX 58119 A
5/9/14 TITLE
CHECKED BY DATE
9/11/15
THIRD ANGLE PROJECTION KNL SPRING ASSEMBLY
-
APPROVED BY DATE

8 7 6 5 4 3 2 1
93

94
DWG. NO SHT. REV
8 7 6 5 4 3 H37309 1 09 1
REVISION HISTORY
- 01 TOOING RELEASE 9/5/14
1. UPDATING DIMENSIONING SCHEME.
02 2. ADDED DATUMS A & B. 12/08/14
3. UPDATED NOTE 2 TO ADD PROFILE TOLERANCE.
03 1. CHANGED CTF DIMENSION FROM 0.1MM TO 0.3MM 1/7/15
1. ADDED NOTE 7 TO ALLOW THE SUPPLIER TO MODIFY THE

LOAD SPRING CENTER HEIGHT DIMENSION AT THEIR
D DRISCRESION TO MEET LOAD REQUIREMENTS. D
04 2/4/15
2. REMOVED CTF DIMENSION ON LOAD SPRING HEIGHT
DIMENSION AND MADE IT A REFERENCE DIMENSION.
3. CHANGED THE LOCATION OF DATUM A
8-C 1. CHANGED SPRING WIDTH FROM 10.75MM TO 10.1MM.
2. ROLLED THE PART NUMBER FROM A -001 TO A -002.
4-A 05 4/8/15
3. CHANGED SPRING ARM HEIGHT FROM 0.3MM TO 1MM
4. UPDATED NOTES.
1. UPDATED NOTE 3 TO REMOVE REFERENCE TO 3/4 OR FULL

06 HARD MATERIAL. 4/16/15
2. REMOVED SEVERAL ANGLED DIMENSIONS.
1. ADDED NOTE 6 AND 7.

2. IN NOTE 3 CHANGED THE INCREASED YIELD STRENGTH
07 FROM 900MPa-1100MPa TO 900MPa-1275MPa 4/23/15
3. ROLLED PART NUMBER TO -003, DUE TO RIVET HOLE DIMENSION
CHANGED FROM 4.4MM TO 4.05MM AND ACCESS HOLE LOCATIONS.
8-C 1. ADDED DIMENSION AND TOLERANCE.
5-C 2. UPDATED NOTE CALLOUT FOR STUD DWG FROM H77925 TO H78186.
70.3±0.2 2-B 3. CHANGED NOTE 3 TO INCREASE SPRING THICKNESS TOLERANCE
08 8/28/15
FROM .035 TO .05
4. CHANGE NOTE 3 YIELD STRENGTH TO MINIMUM 965MPa
5. REMOVE HEAT TREAT COMMENT ON NOTE 4.
64±0.1 C4
+0.4 09 1. REMOVED TWO CTF DIMENSIONS. 7/11/16
2X 1.5 2X 4.05 0.1 A4
-0.1
Figure E-22. Bolster Plate, Spring
C 1±0.1 C
10.1 0.1
C

2X 4.5 0.05 NOTES: UNLESS OTHERWISE SPECIFIED
PLACEMENT DETERMINED BY
1. REFERENCE DOCUMENTS:
ASSEMBLY DRAWING H77470
ASME Y14.5-2009 - STANDARD DIMENSIONS AND TOLERANCES.
2X DETERMINED BY RIVET DRAWING 7 DETERMINED BY STUD DRAWING H78186 AND UL1439 SHARP EDGE TESTING
H19325 AND ASSEMBLY DRAWING 7 SPRING ASSEMBLY DRAWING H37308 A29419 INTEL STANDARD FOR SHEETMETAL
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED

B TOLERANCE SHALL BE CONTROLLED BY 3D CAD MODEL DATABASE.
0.2 A B
(BASIC DIMENSIONS FROM THE 3D CAD MODEL)

ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE SUS301, 1.2MM .05 THK. C
B YIELD STRENGTH MINIMUM 965 MPa C B
C) PLATING: NONE.
7 SEE BOLSTER PLATE ASSEMBLY DRAWING H77470 FOR FIT REQUIREMENTS.
8. OPTIONAL STRESS RELIEF ALLOWED IF MINIMUM LOAD REQUIREMENT IS NOT

4.65±0.1 C MET. SEE LOAD TEST PROCEDURE, DOCUMENT # H95020. LOAD VALUE WILL NEED
TO BE CHECKED FOR EVERY NEW MATERIAL LOT.
2 SURFACES TOP H37309-003 KNL SPRING

2X1 0.1 QTY ITEM NO PART NUMBER DESCRIPTION
PARTS LIST
A 02/10/14 P.O. BOX 58119 A
(1.2) THK 02/10/14 TITLE
CHECKED BY DATE
2/20/14
THIRD ANGLE PROJECTION KNL SPRING
-
APPROVED BY DATE

8 7 6 5 4 3 2 1


8 7 6 5 4 3 2 DWG. NO SHT. REV

J14344 1 03
REVISION HISTORY
TOOLING RELEASE, PREVIOUSLY H95019-002. TWO CTF
DIMENSIONS CHANGED:
F7 01 12/7/15
H 1. FROM 7.825 TO 7.65 AND H
2. FROM 6.725 TO 6.55
1. MODIFIED NOTE #3 TO CALLOUT THE SURFACE HARDNESS OF THE
MATERIAL.
D3
02 2. ADDED MINIMUM THREAD LEAD-IN 0.25. 6/3/16
E6
3. REMOVED CTF SYMBOL FROM THE 8.0MM AND 7.65MM DIMENSION.
4. ROLLING PART NUMBER J14344-001 TO J14344-002.
G7 03 1. REMOVED TWO CTF DIMENSIONS. 7/11/16
1±0.05

G G
1.2±0.05
6.55±0.12
F 7.65±0.12 F
M4X0.7-6g 5
MINIMUM THREAD LEAD-IN 0.25
NOTES:
E E
Figure E-23. Bolster Plate, Spring Stud, M4
8 0.1 ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES

2.25 0.15 UL1439 - UL SHARP EDGE TESTING
B B 2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY
3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
(BASIC DIMENSIONS FROM THE 3D CAD MODEL) 0.2 A
3. MATERIAL: SUS416
D - MINIMUM SURFACE HARDNESS EQUIVALENT TO BRINELL HARDNESS (HB) 342 OR D
C
VICKERS HARDNESS (HV) 360.
- CRITICAL MATERIAL PROPERTIES: 400 MPA MIN YIELD STRENGTH
VISIBLE CORROSION
PER INTEL APPROVAL
5 ROLLED THREADS
C C
6 GEOMETRY ON VENDOR DISCRETION, UPON INTEL APPROVAL.
0.2±0.05 7. DIMENSIONS MARKED WITH ARE
6
A 0.2±0.05
B 0.5±0.05
B
TOP J14344-002 SKT-P, SPRING STUD, M4
DETAIL A
PARTS LIST
SCALE 40 DEPARTMENT R
DIMENSIONS ARE IN MILLIMETERS DESIGNED BY DATE 2200 MISSION COLLEGE BLVD.
5/9/14 P.O. BOX 58119
SEE DETAIL A DRAWN BY DATE
TITLE
5/9/14
A CHECKED BY DATE
9/30/15 KNL SPRING STUD, M4
THIRD ANGLE PROJECTION -
A APPROVED BY DATE A
-
SECTION B-B MATERIAL FINISH A1 J14344 03
8 7 6 5 4 3 2 1
95

96
DWG. NO SHT. REV
8 7 6 5 4 3 H19325 1 04 1
REVISION HISTORY
02 UPDATED NOTES 3/27/15
NOTES: 03 MODIFIED SQUARE ON NOTE 4 TO A TRIANGLE. 4/23/15

04 UPDATED NOTE 2 AND ADDED DATUM. 9/15/15
D 2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY D
3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED: 0.2 A
(BASIC DIMENSIONS FROM THE 3D CAD DATABASE)
3. CRITICAL MATERIAL PROPERTIES:
- RIVET FAILURE LOAD > 500N (112LBF).
- RIVET MUST NOT SHEAR, DEFORM, OR CRACK BELOW LOAD LIMIT.
- SEE ASSEMBLY DRAWING H77470/H77929/H78203/H78902 FOR DETAILS
FINISH:
VISIBLE CORROSION
4 RIVET LENGTH DETERMINED BY ASSEMBLY DRAWING H77470/H77929/H78203/H78902
PER INTEL APPROVAL
C C
Figure E-24. Bolster Plate, Spring Rivet

3.175 0.05
B B
(3) 4
TOP H19325-001 SKT-P-KNL, SPRING RIVET

PARTS LIST
A 8/13/13 P.O. BOX 58119 A
120° 8/15/13 TITLE
CHECKED BY DATE
2/20/14
THIRD ANGLE PROJECTION SKT-P-KNL, SPRING RIVET
-
APPROVED BY DATE

8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H19328 1 11 1
REVISION HISTORY
02 UPDATED NOTE 2 AND 6. 12/10/14
03 REMOVED NOTE REGARDING DIMENSIONS ARE CRITICAL TO FUNCTION. 3/26/15
1. ROLLED PART NUMBER FROM -001 TO -002.

04 4/15/15
2. CHANGED GEOMETRY.
05 1. ADDED NOTE 8 TO CALL OUT CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
D 6 POINT T-20 DRIVE FEATURE 1.5 0.25 D

06 1. THREAD CALLOUT ON BOTTOM VIEW ADDED. 5/1/15

PG1 8B 07 1. REMOVED CTF CALLOUT FOR INTERNAL THREAD NOTE. 5/21/15
B-3 08 1. UPDATED NOTE 5 TO CALLOUT -004 COLLAR 8/28/15

A A
B6 1. REMOVED FLATNESS CALLOUT
C6 09 2. REMOVED FEATURE CONTROL FRAME 10/15/15
B7 3. DELETED DUPLICATE DIMENSIONING
B8 1. INCREASED TOLERANCE RANGE FROM 0.04 TO 0.08.

10 2/11/16
C6 2. INCREASED TOELRANCE RANGE FROM +/-0.1 TO +0.2/-0.1
B6 11 1. REMOVED TWO CTF DIMENSIONS. 7/11/16

+0.2
CLEARANCE HOLE 3.1 2.0 0.25 7
-0.1
4.32+0/-0.25 X120
C C
NOTES UNLESS OTHERWISE SPECIFIED
B 8 0.12 ASME Y14.5M - 2009 - STANDARD DIMENSION AND TOLERANCES
Figure E-25. Bolster Plate, M3 Captive Nut
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY

3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
(BASIC DIMENSIONS FROM THE 3D CAD MODEL). .2 A B
3. MATERIAL:
2.69±0.08 -LOW CARBON STEEL 1144, HARDEN AND TEMPER
-CRITICAL MECHANICAL PROPERTIES: 345 MPa MIN YIELD STRENGTH
0.5±0.05 -MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
4. FINISH:
1.51±0.08 -2 MICROMETER MIN ELECTROLYTIC NICKEL PLATING
A
-PROCESS TEST 168 HRS 85 DEGREE C / 85% HUMIDITY WITH NO
VISIBLE CORROSION
B M3 X 0.5 CLASS 6H B
5 INTERFERENCE FIT WITH PART H19329-003.
INTERNAL THREAD THRU ALL 4.5 0.05 MINIMUM 50LBF SEPARATION FORCE WITH PRESS FIT COLLAR
.2 A
5 6. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.1MM
RADIUS MAX
6 0.05
7 DRILL CLEARANCE HOLE TO CLEAN UP CHIP/BURRS FROM TAPPING
& FORMING OPERATIONS, SHOULD ALLOW M3 STUD TO PASS THROUGH
SECTION A-A WITHOUT INTERFERENCE
8. DIMENSIONS MARKED CARE CRITICAL TO FUNCTION

DIMENSIONS (CTF).
TOP H19328-002 SOCKET P M3 BOLSTER CAPTIVE NUT

PARTS LIST
A 8/8/2013 P.O. BOX 58119 A
9/10/2013 TITLE
CHECKED BY DATE
9/10/2013
THIRD ANGLE PROJECTION SOCKET P M3 BOLSTER CAPTIVE NUT
-
APPROVED BY DATE
- -
8 7 6 5 4 3 2 1
97
.

98
DWG. NO SHT. REV
8 7 6 5 4 3 H19329 1 07 1
REVISION HISTORY
02 UPDATED NOTES 3/27/15
NOTES UNLESS OTHERWISE SPECIFIED 1. ROLLED THE PART NUMBER FROM -001 TO -002.
03 4/1/5/15
2. CHANGED GEOMETRY
1. REFERENCE DOCUMENTS 04 1. ADDED NOTE 7 TO CALL-OUT CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
ASME Y14.5M - 2009 - STANDARD DIMENSION AND TOLERANCES 1. ADDED DATUMS A AND B AND FEATURE CONTROL FRAME TO DIMENSION.
2. CHANGED INNER DIAMETER FROM 4.42MM TO A REFERENCE
05 5/6/15
UL1439 - UL SHARP EDGE TESTING DIMENSION 4.38MM.
D 3. ROLLED PART NUMBER FROM -002 TO -003. D
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE. 06 1. UPDATED DIMENSIONING SCHEME 9/11/15
FOR FEATURES NOT EXPLICITLY TOLERANCED: B6 1. ADDED CTF DIMENSION TO COLLAR DIAMETER.
.2 A B 07 7/11/16
(BASIC DIMENSIONS FROM THE 3D CAD MODEL) D7 2. ADDED DATUMS A AND B TO THE FEATURE CONTROL FRAME IN NOTE 2.
3. MATERIAL:
-ANSI 1215 CARBON STEEL OR EQUIVALENT
-CRITICAL MECHANICAL PROPERTIES: 415 MPa MIN YIELD STRENGTH
-MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
4. FINISH:
-2 MICROMETER MIN ELECTROLYTIC NICKEL PLATING
-PROCESS TEST 168 HRS 85 DEGREES C / 85% HUMIDITY WITH NO VISIBLE
CORROSION, AFTER MATING WITH PRESS FIT NUT INTERFACE
5 FEATURE DEFINED BY VENDOR - FOR INTERFERENCE FIT WITH PART H19328-002

FEATURE MAY BE MODIFIED WITH INTEL ENGINEERING APPROVAL, IN ORDER TO MEET
MINIMUM 50LBF SEPARATION FORCE FOR NUT/COLLAR PRESS FIT INTERFACE
C C
6. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.1MM RADIUS MAX.

A A
Figure E-26. Bolster Plate, M3 Captive Nut Collar
B B
5.7 0.05 C
.2 B
(4.38) B
A
TOP H19329-003 SOCKET P M3 BOLSTER CAPTIVE NUT COLLAR
1.9±0.05 C
PARTS LIST
0.4±0.03 DIMENSIONS ARE IN MILLIMETERS DESIGNED BY DATE DEPARTMENT R
A 8/8/2013 P.O. BOX 58119 A
6.5 0.05 9/10/2013 TITLE
.2 B CHECKED BY DATE
9/11/15 SOCKET P
THIRD ANGLE PROJECTION
- M3 BOLSTER CAPTIVE NUT COLLAR
SECTION A-A APPROVED BY DATE
-
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H77975 1 08 1
REVISION HISTORY
02 ADDED NOTE 6 TO CALL-OUT CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
PG1 B6 1. REMOVED PIN 1 MARKING ON 3D CAD MODEL, RESULTING IN
ROLLING THE DASH NUMBER FROM H77975-001 TO H77975-002.
03 10/20/15
PG1 A6 2. CHANGED TRUE POSITION (TP) FROM 0.1 TO 0.25.
NOTES: UNLESS OTHERWISE SPECIFIED: C PG2 A1 3. CHANGED TRUE POSITION (TP) FROM 0.1 TO 0.30.
1. ADDED STIFFENER PROTRUSION IN THE FOUR CORNER HOLES.
3X 78 PG2 B2 2. CHANGED FOUR CORNER HOLES TO OVAL SHAPE.
1. REFERENCE DOCUMENTS: PG2 A7 3. INCREASED LATCH FOOT THICKNESS.
04 4/12/16
D ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES PG1 B3 4. CHANGED DATUM B LOCATION D
PG1 C5 5. ADDED DATUM C
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 2X 68 C 6. ROLLING THE DASH NUMBER FROM H77975-002 TO H77975-003.
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR 1. INCREASED RIB STIFFENER PROTRUSION BY 0.5MM.

SUPPLIERS & OUTSOURCED MANUFACTURERS DIMENSION FROM RIB TO INSIDE LATCH CHANGED FROM 7.9MM
PG2 A7 05 5/11/16
58.4 TO 7.4MM CHANGED AND TESTED FOR KNL CORNER STANDOFFS.
(WEBSITE - https://supplier.intel.com/static/EHS/) 2. DASH PART NUMBER ROLLED FROM H77975-003 TO H77975-004.
1. RIB STIFFENER PROTRUSION UPDATED FOR SKYLAKE CORNER

2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT STANDOFFS.
50 PG1 A4 06 5/25/16
SPECIFIED TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE 2. DECREASED OVAL OPENING FROM 7.6MM TO 7.4MM.
3. DASH PART NUMBER ROLLED FROM H77975-004 TO H77975-005.
0.2 A B C
PG1 C5 1. REMOVED CTF DIMENSION.
07 7/11/16
PG2 A5 2. REMOVED TWO CTF DIMENSIONS.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PG1 A4
08 1. CHANGED FLATNESS FROM 0.1MM TO 0.4MM 2/14/17
PG2 B3
PRODUCT
SPECIFICATION (BS-MTN-0001).
A) PC-ABS (V0 FLAME RATING AND MUST PASS 100 C BAKE TEST)
B) COLOR: BLACK
4. FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C

REQUIREMENTS.
PART SHALL BE FREE OF OIL AND DEBRIS.

DEBURR ALL SHARP EDGES.
5 USE "LGA Socket/ILM/Backplate Marking Guideline"

C INTEL DOCUMENT NUMBER G14577 TO MARK PART IN AREA SHOWN. C
6. DIMENSIONS MARKED ARE C CRITICAL TO FUNCTION DIMENSIONS (CTF).
A
A
Figure E-27. Socket-P, Dust Cover, 1/2
73 78 2X 95
C
B B
2X R14.5
5 4X 7.4 0.1
A TOP H77975-005 LGA3647 NRW DUST-COVER

4 0.4 QTY ITEM NO PART NUMBER DESCRIPTION
PARTS LIST
UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R
INTERPRET DIMENSIONS AND TOLERANCES
A IN ACCORDANCE WITH ASME Y14.5M-1994 2/14/17 P.O. BOX 58119 A
DIMENSIONS ARE IN MM SANTA CLARA, CA 95052-8119
DRAWN BY DATE
2/14/17 TITLE
SECTION A-A CHECKED BY DATE

2/14/17
THIRD ANGLE PROJECTION LGA3647 NRW DUST-COVER
-
4X 5.5 APPROVED BY DATE
SCALE 1.5

8 7 6 5 4 3 2 1
99

100
DWG. NO SHT. REV
8 7 6 5 4 3 H77975 2 08 1
72
2X 63
D 55.4
D
2X 14
C C
Figure E-28. Socket-P, Dust Cover, 2/2
2X 83

2X 73.8
2X 47.5
B B
B
HATCHED AREA
0.4
4X 9 0.1
0.3 A
SECTION B-B 4X 4 0.05
0.8±0.05
C
SEE
DETAIL C
A 7.4±0.05 4.01±0.05 A
C
120°
4X DETAIL
C
SCALE 10
0.85±0.05
R
P.O. BOX 58119 D H77975 08
SCALE: 3 DO NOT SCALE DRAWING SHEET 2 OF 2
8 7 6 5 4 3 2 1


DWG. NO SHT. REV
8 7 6 5 4 3 H37264 1 L 1
REVISION HISTORY
- A PRELIMINARY ASSEMBLY RELEASE 2/14/14
- B UPDATED; NUT, WASHER, AND HEATSINK. ASM REV TO -002 3/5/14
C UPDATED HEATSINK G97766 TO -004, ASM H37264 TO -003 3/20/14
D UPDATED HEATSINK G97766 TO -005, ASM H37264 TO -004 05/09/14
E UPDATED M4 NUT -004 AND IS REFLECTED IN BOM TABLE 05/16/14
F UPDATED VIEW TO SHOW NOTCH DEPTH 05/23/14
1. ADDED TWO ADDITIONAL NUTS, COLLARS, AND WASHERS
D 2. ADDED LABEL PART NUMBER TO BOM D
G 3. UPDATED NOTES 3/31/15
5. NUT CHANGED FROM -004 TO -006.

1. REPLACED H19326-005 M4 NUT TO A NEW T-30 TORX NUT
H94876-002
2. CHANGED HEATSINK DELRIN WASHER INNER DIAMETER TO
H H37265-004 10/5/15
3. REPLACED HS COLLAR H19327-001 WITH NEW DELRIN COLLAR
H94875-001
4. ROLLED H37264-005 TO H37264-006
1. REPLACED DELRIN HS COLLAR H94875-001 WITH NYLON HS
J COLLAR H94875-002. 12/21/15
2. ROLLED H37264-006 TO H37264-007
1. NEW LABEL PART NUMBER FROM H79111-001 TO H79111-002.
4 2. NEW NUT PART NUMBER FROM H94876-002 TO H94876-003.
3. ROLLED ASSEMBLY PART NUMBER FROM H37264-007 TO
K 10/24/16
H37264-008.
4. UPDATED NOTE 5 TO REMOVE THE TORQUE SPEC MARKING, NOW
ON LABEL.
1.COLLAR DESIGN UPDATED TO H94875-004

L 3/10/17
2.ITEM IDENTIFICATION UPDATED TO H37264-009
C C
5
1
NOTES:
6 ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES
2. FEATURES NOT SPECIFIED ON THE DRAWING SHALL BE CONTROLLED BY THE 3D DATABASE.

5 FOR FEATURES NOT EXPLICITLY TOLERANCED: 0.24
(BASIC DIMENSION FROM 3D CAD MODEL).
3. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR SOLVENTS AFTER FINAL ASSEMBLY.
B 4 MINIMUM PUSH OUT FORCE = 10 LBF PER COLLAR/NUT.
B
5 PLACE INTEL PART NUMBER AND SUPPLIER DATE CODE. DISPLAY TEXT IN ALLOWABLE AREA
Figure E-29. 1U Heatsink Assembly, 1/2 (Reference Only)
ON EITHER SIDE OF PART. THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK
OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X MAGNIFICATION.
4 6 H94876-003 SKT-P-KNL, HEATSINK NUT, M4

4 5 H94875-004 SKT -P HEATSINK COLLAR
1 4 H79111-002 KNL HS LABEL
1 3 H38442-001 TIM PCM45F, 47X70MM
4 2 H37265-004 SKT-P DELRIN HEATSINK WASHER
1 1 G97766-007 KNL 1U HEAT SINK
TOP H37264-009 KNL 1U HEATSINK ASSEMBLY
PARTS LIST
A 3/10/17 P.O. BOX 58119 A
3 DRAWN BY DATE SANTA CLARA, CA 95052-8119
3/10/17 TITLE
CHECKED BY DATE
3/10/17
THIRD ANGLE PROJECTION KNL 1U HEATSINK ASSEMBLY
APPROVED BY DATE
MATERIAL FINISH D H37264 L

8 7 6 5 4 3 2 1
101

102
DWG. NO SHT. REV
8 7 6 5 4 3 H37264 2 L 1
D D
A A
A A A
C 5 C
4X 4

(70)
TIM APPLICATION AREA

TIM TO BE CENTERED ON HEATSINK BASE
B B
(47)
Figure E-30. 1U Heatsink Assembly, 2/2 (Reference Only)
A A

R
P.O. BOX 58119 D H37264 L
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 G97766 1 N 1
REVISION HISTORY
- A RELEASE FOR PROTOTYPES 05/22/13
- B UPDATED HOLES, CREATED ASM DRAWING H37264, PART REV TO -002 2/14/14
2-B6 C ADDED HOLE AND UPDATED CORNER HOLE SIZES, PART REV TO -003 3/5/14
8-C D INCREASED FIN OPENING FROM 10MM TO 15MM FOR NUT HARDWARE 3/20/14
ADDED TWO GROOVES IN THE HEATSINK BASE AND A RECTANGULAR NOTCH.
8-A E 05/12/14
ROLLED PART REV -005.
CHANGED NOTCH SIZE FROM 10MM TO 11MM AND ADDED 2MM RADIUS
0 C-6 F 05/17/14
80 IN NOTCH CORNERS
D 6X 11.56 0.5 -0.25 6-C 1. ADDED DEPTH NOTCH .2MM DEEP
D
3±0.25 6-D G 2. CHANGED DIM SCHEME FOR PIN 1 NOTCH CORNER 05/23/14
C 7-D 3. REMOVED 2 HEATSINK HOLES

3±0.25 7-D 1. UPDATED TOLERANCES
H 06/11/14
4-A 2. UPDATED TOLERANCES IN DETAIL B
1. CHANGED TO A REFERENCE DIMENSION
PAGE 2
J 2. ADDED 3RD CORNER HOLE FOR ALIGNMENT 10/12/14
4-D
3. REMOVED BOTTOMSIDE ALIGNMENT HOLE
4X 12 0.5 49X 1.62 PG1 6-D 1. CHANGED 3 HOLES TO 4 OBLONGS HOLES
PG2 6-B 2. REMOVED BOTTOMSIDE ALIGNMENT HOLE
FIN PITCH PG1 6-D 3. SHORTENED OUTER FINS
K 2/27/15
PG2 1-D 3. ADDED TOP AND BOTTOM CHAMFER ON TWO CENTER HOLES
49X 1.32 PG2 1-B 4. INCREASED COUTERBORE DIAMETER FROM 7.4MM TO 8.5MM
FIN GAP 1. CHANGED TWO OBLONG HOLES TO HOLES.
PG1 8-D
2. ADDED COUNTERBORE TO TWO CORNER HOLES
PG2 7-B
L 3. CHANGED BASE NOTCH WIDTH FROM 10MM TO 10.5MM. 3/31/15
PG2 3-D
50X 0.3 4. ROLLED THE PART NUMBER FROM -006 TO -007.
PG1 2-B
5. CHANGED TOLERANCE IN NOTE 2 FROM .1MM TO .24MM.
FIN THICKNESS PG2 7-C M 1. CHANGED 6.261 TO 6.2 4/29/15
PG1 2-B 1. ADDED NOTE 4 CRITICAL TO FUNCTION DIMENSION.

N 5/4/15
PG2 4-A 2. REMOVED DIMENSIONS ON DRAWING.
PG2 6-A
0 7
2X 15 0.3 107 C
-0.25
C C
DETAIL A
SCALE 6:1
Figure E-31. 1U Heatsink, 1/2 (Reference Only)
SCALE 1:1
NOTES:
B B
2. FEATURES NOT SPECIFIED ON THE DRAWING SHALL BE CONTROLLED BY THE 3D DATABASE.
.24 A B C
3. BASE: COPPER, K=380 W/M-K MINIMUM
FINS: QTY 50 0.3 MM THICK, ALUMINUM, K=220 W/M-K MINIMUM
SEE DETAIL A
+1.00 4 DIMENSIONS MARKED CARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
0.25 6
-0.25 5. LOCAL FLATNESS ZONE .077MM CENTERED ON HEAT SINK BASE.
FIN ASSY CAN'T EXCEED
COPPER BASE 6 CENTER FIN ARRAY ON HEAT SINK BASE
7 MECHANICAL STITCHING OR CONNECTION REQUIRED ON TOP SURFACE OF HEAT SINK TO

INCREASE FIN ARRAY STRUCTURAL INTEGRITY. OVERALL FIN HEIGHT AND HEAT SINK HEIGHT MUST
27±0.3 C BE MAINTAINED PER THIS DWG.
TOP G97766-007 KNL 1U HEAT SINK

A QTY ITEM NO PART NUMBER DESCRIPTION
C 4.5±0.12 SEE DETAIL B DETAIL B
A SCALE 6:1 PARTS LIST
A 2X 1 0.25 2X 10.5 0.3 05/22/13 P.O. BOX 58119 A
2/20/14 TITLE
CHECKED BY DATE
2/20/14
THIRD ANGLE PROJECTION KNL 1U HEATSINK
2/20/14
APPROVED BY DATE
-
MATERIAL FINISH D G97766 N
8 7 6 5 4 3 2 1
103

104
DWG. NO SHT. REV
8 7 6 5 4 3 G97766 2 N 1
D CHAMFER ALL FINS D

3 SEE DETAIL C
1.01±0.3
3 7°
7°
DETAIL F
A SCALE 4:1
10.5
A
2X (3.0) 2X (2.5)
A
SEE DETAIL F
DETAIL C
SCALE 4:1 SECTION A-A
A
C THE NOTCH WOULD BE 0.2MM MAX DEEPER

C
THAN OUTBOARD GROOVE SURFACE
23.5±0.12 11±0.12
2X 6.2 0.1 C
SEE DETAIL G
2X 6.2 0.1

C 4X R2 0.3 8.2 1.5 6.2
8.2 2.0 6.2
2X
0.12 A B C
0.12 A B C 0.12 A
7±0.12 8.1 10.1

Figure E-32. 1U Heatsink, 2/2 (Reference Only)
1.5±0.12
0.077 LOCAL FLATNESS ZONE,

8.2
SEE NOTE 5 C 8.2
2X DETAIL D
SCALE 4:1 2X DETAIL E
SCALE 4:1
72 68 C 47
B B
C
9.5
7.5
2X R3.75
2X R2.75
1 B C
5.5 7.5
SEE DETAIL H
SEE DETAIL E
2X
SEE DETAIL D DETAIL H
0.12 A B SCALE 4:1
C 70 DETAIL G
SCALE4:1
A A
95

R
P.O. BOX 58119 D G97766 N
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H79111 1 C 1
REVISION HISTORY
- A TOOLING RELEASE 3/31/15
LABEL CONTENT UPDATED; NOTES UPDATED WITH MATERIAL, ADHESIVE,
ALL B DURABILITY AND QUALITY REQUIREMENTS; LABEL THICKNESS AND X-Y 8/16/2016
TOLERANCES UPDATED
A2 C INTEL PART NUMBER UPDATED TO H79111-002 10/06/2016
D D

C C
50±1
3. LABEL MATERIAL: PET, APPROXIMATELY 0.15MM THICK, WHITE.

Figure E-33. 1U Heatsink, Label (Reference Only)
4. LABEL CONTENT: BLACK

2
50±1 5. ADHESIVE: PERMANENT ACRYLIC ADHESIVE, 20 +/-4 G/M
6. RELIABILITY REQUIREMENTS:
B PRINT RESISTIVITY- MUST SUPPORT THERMAL TRANSFER PRINT DURABILITY/RESISTIVITY B
AGAINST CHEMICAL DEGRADATION - ALL TESTING IN ACCORDANCE WITH MIL STD 883/2015.13
DURABILITY-MUST DEMONSTRATE DURABILITY IN PRESENCE OF ENVIRONMENTAL
CONDITIONS, HUMIDITY (32 C/90%RH FOR 7 DAYS), TEMP CYCLE (-7 C TO 50 C FOR 7 DAYS)
SHELF LIFE-1 YEAR (BEFORE APPLICATION) WITHOUT DETRIMENT TO ADHESION OR
CONSTRUCTION, IF STORED IN PROPER ENVIRONMENT- 10 -25 C, 40%-60% RH, NO SUN EXPOSURE.
7. QUALITY REQUIREMENTS:
IMAGE FLOAT - 0.75MM IN ANY DIMENSION (X OR Y)
LABEL ALIGNMENT - DEFINED IN APPLICABLE HEATSINK DRAWING
LABEL PEELING - LESS THAN OR EQUAL TO 1MM
SCRATCHES- SCRATCHES/SCUFFING MUST BE LESS THAN OR EQUAL TO 0.03MM ALONG DEPTH
AND WIDTH, AND LESS THAN OR EQUAL TO 1.27MM ALONG THE LENGTH.
1 1 H79111-002 KNL HEATSINK LABEL

0.15±0.1 QTY ITEM NO PART NUMBER DESCRIPTION
PARTS LIST
DIMENSIONS ARE IN MILLIMETERS
08/05/16 TITLE
CHECKED BY DATE
08/16/16
THIRD ANGLE PROJECTION KNL HEATSINK LABEL
-
APPROVED BY DATE
-
MATERIAL FINISH D H79111 C
8 7 6 5 4 3 2 1
105

106
DWG. NO SHT. REV
6 5 4 3 2 H38442 1 A
REVISION HISTORY
- A PRELIMINARY RELEASE 2/24/14
F F
70±2
E E
47±2
D D

C C
NOTES, UNLESS OTHERWISE SPECIFIED:
Figure E-34. 1U Heatsink, PCM45F TIM (Reference Only)

0.25 0.075 THK
3. MATERIAL: PCM45F
4 DIMENSIONS ARE CRITICAL TO FUNCTION DIMENSIONS.
B B
TOP H38442-001 TIM PCM45F, 47X70MM
PARTS LIST
UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD.
INTERPRET DIMENSIONS AND TOLERANCES P.O. BOX 58119
IN ACCORDANCE WITH ASME Y14.5M-1994
2/24/14
DIMENSIONS ARE IN MILLIMETERS DRAWN BY DATE
TITLE
2/24/14
CHECKED BY DATE
2/24/14 TIM PCM45F, 45X70MM
THIRD ANGLE PROJECTION 2/24/14
A A
APPROVED BY DATE
-
MATERIAL FINISH A2 H38442 A
6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H94876 1 F 1
REVISION HISTORY
- A INITIAL RELEASE 8/28/15
C8 1. ADDED RADIUS TO NUT.
B3 2. CHANGED NOTE 7 FROM DIE/TAP PROCESS TO FULLY FORM THREADS.
A2 B 10/5/15
3. REMOVED NOTE 5 - TBD, AND UPDATED NOTE 9 TO 8
4. CHANGED DASH NUMBER FROM H94876-001 TO H94876-002.
B2 C 1. UPDATED NOTE 7 TO INCLUDE THE THREAD GRADE AND POSITION. 3/9/16

6 POINT T30 DRIVER
9 D7 Ed1. ADDED 6.09 AND 4.24 DIMENSIONS AND TOLERANCES FOR
FEATURE 2.1 .25 T30 CLARIFICATION.
D D5 2. REMOVED 120° ANGLE DIMENSION. D
D6 3. ADDED SYMBOL 9 TO T30 DRIVER RELEATED DIMENSIONS.
D7 4. CHANGED TOLERANCE FROM 8.3 0.12 TO 8.3 0.20.
C4 5. CHANGED TOLERANCE FROM 4.24 +0/-0.34 TO 4.24 +0/-0.2.
D 8/16/16

B4 6. CHANGED TOLERANCE FROM 3.5 0.05 TO 3.5 +0.5/-0.
( 6.09) MAX C3 7. MODIFIED NOTES: ADDITIONAL INFORMATION TO NOTE 1 AND 3.
B3 8. NOTE 6 IS BOXED AND ADDED LEADER ARROWS W/ 6 CALLED OUT IN
T30 DRIVER LEAD-IN SECTION A-A.
9. ADDED NOTE 9.
0 9 B4
6.09 9 10
-0.5 A3 E 1. ADDED NOTE 10 TO CALL-OUT FUMIO LUBRICANT APPLIED TO THE NUT. 10/20/16
PG2 F ADDED SUPPLEMENTAL DESIGN THAT IS AN ALTERNATIVE 3/27/17
8.3 0.2
0
4.24
-0.2 0
4.24
9 -0.2 NOTES; UNLESS OTHERWISE SPECIFIED:
A
C 1. REFERENCE DOCUMENTS C
ISO 10664:2014 (E) THIRD EDITION 2014-10-01
(5)
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE. FOR FEATURES NOT EXPLICITY TOLERANCED:
0.2 A
R0.25 3. MATERIAL: SUS 316 ANNEALED

1.57±0.1 MINIMUM TENSILE YIELD STRENGTH: 240 MPa.
A MINIMUM SURFACE HARDNESS EQUIVALENT TO BRINELL HARDNESS (HB)
0.05 OR VICKERS HARDNESS (HV) OF 149.
5.07±0.1 +0.5
3.5
-0.0 4. ALL DIMENSIONS ARE CRITICAL TO FUNCTION DIMENSIONS.
(5 FULL THREADS
MINIMUM) 5. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM RADIUS MAX.
B A 6 0.5MM THREAD MAXIMUM LEAD-IN. B

5.2±0.05
Figure E-35. 1U Heatsink, Nut, M4, 1/2 (Reference Only)
0.5MM MAXIMUM 7 FULLY FORM THREADS.TOLERANCE GRADE AND POSITION: 6H

5.85±0.05 LEAD-IN 6
8 CLEAN AND DEBURR ALL THREADS. MUST BE 100% FREE OF METAL DEBRIS.
5.5±0.05
SECTION A-A 9 T30 HEXALOBULAR INTERNAL DRIVING FEATURE FORMATION TO BE

CHECKED WITH GO GAUGE FROM ISO 10664 2014(E). NO-GO GAUGE
NOT REQUIRED DUE TO RELAXED TOELRANCES AND TOOL WEAR DIRECTION.
10 NUT TO BE FULLY SOAKED IN FUMIO FCN-5987 LUBRICANT PER FUMIO

M4X0.7 INTERNAL THREAD 7 8 APPLICATION INSTRUCTIONS.
TOP H94876-003 SKT-P-KNL, HEATSINK NUT, M4

PARTS LIST
A 3/27/17 P.O. BOX 58119 A
3/27/17 TITLE
CHECKED BY DATE
THIRD ANGLE PROJECTION SKT-P-KNL, HEATSINK NUT, M4

3/27/17
APPROVED BY DATE
3/27/17
MATERIAL FINISH D H94876 F
8 7 6 5 4 3 2 1
107

108
DWG. NO SHT. REV
8 7 6 5 4 3 H94876 2 F 1
D D
SUPPLEMENTAL DESIGN THAT IS AN ALTERNATIVE

4.05±0.15
C C

5.8±0.2
+0.35
4.05
-0.05
(5 FULL THREADS
MINIMUM)
SECTION A-A
B B
Figure E-36. 1U Heatsink, Nut, M4, 2/2 (Reference Only)
A A

R
P.O. BOX 58119 D H94876 F
8 7 6 5 4 3 2 1


DWG. NO SHT. REV

8 7 6 5 4 3 H94875 1 D 1
REVISION HISTORY
1.CHANGED THE MATERIAL FROM DELRIN TO NY66 A205F.
2.ADDED CTF DIMENSION TO INNER DIAMETER
B4 B 12/15/15
3. UPDATED NOTES 3 AND 5.
4. ROLLED DASH NUMBER FROM H94875-001 TO H94875-002.
1. DIMENSIONS CHANGED
D5 2. ADDED RUNOUT AND CTF TO O.D 8MM
C5 C 3. ADDED DATUM B TO 1.D 5.2MM 02/06/17
B4 4. ROLLED DASH NUMBER FROM H94875-002 TO H94875-003
5. MATERIAL SPEC CHANGED TO BLUE COLOR.
D D
1. O.D HAS CHANGED FROM 8MM TO 7.8
D5
2.THICKNESS HAS CHANGED FROM 0.5MM TO 0.7MM
B5 D 03/08/17

3.MATERIAL SPEC CHANGED TO COLOR: NOT SPECIFIED, HOWEVER
B3
BLACK NOT SUGGESTED
7.8 0.05
.05 B
A A
C C

5.2 0.05
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS
& OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
6 ASME Y14.5-2009 - STANDARD DIMENSION AND TOLERANCES
A
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE. FOR
FEATURES NOT EXPLICITLY TOLERANCED: (BASIC DIMENSIONS FROM THE 3D CAD MODEL): 0.2 A
Figure E-37. 1U Heatsink, Nut Collar (Reference Only)

ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT
B D SPECIFICATION (BS-MTN-0001).
B
SECTION A-A A) NY66 A205F.
0.7±0.05
B) PIGMENT: N/A
C) COLOR: NOT SPECIFIED, HOWEVER BLACK NOT SUGGESTED
4 CRITICAL TO FUNCTION DIMENSION (CTF).
5. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).

PART SHALL BE FREE OF OIL AND DEBRIS.
FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
6 NO GATING ALLOWED ON THIS COMPONENT MATING SURFACE.
TOP H94875-004 SKT-P, HEATSINK NUT COLLAR (BOTTOMSIDE)

PARTS LIST
A 3/8/17 P.O. BOX 58119 A
3/8/17 TITLE
CHECKED BY DATE
3/8/17
THIRD ANGLE PROJECTION SKT-P, HEATSINK COLLAR
-
APPROVED BY DATE
MATERIAL FINISH D H94875 D

8 7 6 5 4 3 2 1
109

110
4 3 2 1
REVISION HISTORY
B3 B INCREASED THICKNESS TO 1MM 3/5/14
1. INCREASED INNER DIAMETER FROM 5.65MM TO 6.0MM
C3 C 9/24/15
C3 1. INCREASED THE INNER DIAMETER AND TOLERANCE FROM
6.0+/-.05 TO 6.1+/-0.10
D 9/30/15
2. ROLLED THE PART NUMBER FROM H37265-003 TO
D H37265-004.
D
6.10 .10
8.30 .10
C C

99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED
MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
DWG. NO
1.00 .05 4
2. INTERPRET DIMENSIONS PER ASME Y14.5M-2009.FEATURES NOT SPECIFIED ON DRAWING SHALL BE
CONTROLLED BY 3D CAD DATABASE.

ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001).
A) DELRIN ACETAL RESIN. 500P NC010.
B B) PIGMENT: EAGLE 7058 (1%)
C) COLOR: BLACK.
Figure E-38. 1U Heatsink, Delrin* Washer (Reference Only)
4 CRITICAL TO FUNCTION DIMENSION (CTF).

H37265
6 5. PART SHALL BE FREE OF OIL AND DEBRIS.

FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
SHT.
1
6 NO GATING ALLOWED ON THESE COMPONENT MATING SURFACES.

REV
D
TOP H37265-004 SKT-P DELRIN HEATSINK WASHER

PARTS LIST
2/11/14 P.O. BOX 58119
A 2/11/14 TITLE A
CHECKED BY DATE
2/20/14
THIRD ANGLE PROJECTION SKT-P DELRIN HEATSINK WASHER
APPROVED BY DATE
MATERIAL FINISH C H37265 D

SEE NOTES SEE NOTES SCALE: 8.000 DO NOT SCALE DRAWING SHEET 1 OF 1
4 3 2 1


Mechanical KOZs
F Mechanical KOZs
F.1 Main Board Mechanical KOZs

Processor Heatsink Module (PHM) Keep-Out Zones are included in this appendix.
Table F-1 lists the mechanical drawings included in this appendix.
Table F-1. Mechanical Keep-Out Zone Drawing List

Description Figure
Processor Heatsink Module Topside Keep-Out Zone Figure F-1
Processor Heatsink Module Mounting Holes Keep-Out Zone Figure F-2
Processor Heatsink Module Backplate Keep-Out Zone Figure F-3
111

112
DWG. NO SHT. REV
8 7 6 5 4 3 KOZ_H17714_KNL-PHM-TOPSIDE 1 06 1
REVISION HISTORY
- 01 UPDATED G93734 TO SEPERATE KOZ'S: TOPSIDE, BACKPLATE, HOLES 7/19/13
Figure F-1.
A4, B7 02 UPDATED SOCKET CAVITY AND ADDED 3.5MM HFI ZONES 2/18/14
C6,C7 03 UPDATED KOZ WIDTH TO 87MM 3/10/14
A6-A7 04 ADDED CABLE EGRESS KOZ PROPOSAL 5/14/15
3.425
C2, C4 05 ADDED HFI LATCH AREA KEEPOUT. UPDATED DETAIL B 9/15/15
[87]
D7 06 CHANGED THE BOLSTER KOZ DIMENSION FROM 79.61MM TO 82.7MM 03/24/17
3.346
D [85] D
3.26 KOZ LEGEND
[82.7] 6
PIN 1 LOCATION BOLSTER PLATE ZONE,
SOCKET CENTERLINE NO OTHER COMPONENT PLACEMENT ALLOWED,
FOR REFERENCE ONLY 0.0 MM HEIGHT RESTRICTION
(SKT )
SOCKET CAVITY TO SOCKET ZONE,
NO COMPONENT PLACEMENT ALLOWED,
0.0 MM HEIGHT RESTRICTION
SOCKET CAVITY,
SOCKET AND PNP OUTLINE FOR REFERENCE ONLY 1.222 MM HEIGHT RESTRICTION 4
REFER TO DRAWING H37602 FOR SOCKET DETAILS
KOZ TO EXTEND TO SOCKET SOCKET PICK AND PLACE SKIRT ZONE,
CARRIER OCCUPIES THIS ZONE AFTER CAP IS REMOVED,
NO COMPONENT PLACEMENT BETWEEN BOLSTER AND SOCKET NO OTHER COMPONENT PLACEMENT ALLOWED
HFI CONNECTOR AND CABLE ROUTING ZONE
.079 HFI CONNECTOR ROUTING ZONE

[2] 3.5 MM HEIGHT RESTRICTION 4
SEE DETAIL A
.157 CABLE EGRESS ZONE,
[4] 1MM HEIGHT RESTRICTION 4
C C
SOCKET CENTERLINE SPRING CLEARANCE ZONE
4.331 .256 1.3MM HEIGHT RESTRICTION 4
(SKT ) [6.5]
[110]
PHM CLEARANCE ZONE
4.5MM HEIGHT RESTRICTION 4

.138
.039 [3.5]
[1] WIRE BALE CONNECTOR ZONE
7.2MM HEIGHT RESTRICTION 4
DETAIL B
SCALE 4:1
7X MOTHERBOARD THROUGH HOLES
FOR REFERENCE ONLY,
FOR DETAILS SEE DOCUMENT
KOZ_H17715_KNL-PHM-MTG-HOLES
NOTES, UNLESS OTHERWISE SPECIFIED;
1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES
ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. CENTERLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE PHM HOLE PATTERN FOR PROPER PHM AND
SOCKET FUNCTION.
SOCKET OUTLINE DIMENSIONS SHOWN FOR REFERENCE ONLY. PLEASE REFER TO THE SOCKET DRAWINGS FOR
B EXACT DIMENSIONS AND TOLERANCES. B
.197 3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE SURFACE OF THE
.728 MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT DEFINED BY THAT ZONE AFTER REFLOW.
[5]
1.358 [18.5]
UNLESS OTHERWISE NOTED ALL VIEW DIMENSIONS ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE MAXIMUMS.
[34.5] ZONES ARE NOT DRIVEN BY SPECIFIC OR IMPLIED TOLERANCES.
.433
[11] A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD AS THE MAXIMUM
.315 HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
1.870 [8]
SEE DETAIL B SEE 4 FOR ADDITIONAL DETAILS.
[47.5]
Processor Heatsink Module Topside Keep-Out Zone
4 ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE. CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE
MUST INCLUDE:
- COMPONENT NOMINAL HEIGHT
- COMPONENT TOLERANCES
- COMPONENT PLACEMENT TILT
- SOLDER RELOW THICKNESS
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THE SPECIFIED MAXIMUM HEIGHT.
.374 KOZ MUST CONTINUE, AND

.988 .496
[9.5] ALLOW CABLE ROUTING
[25.1] [12.6] TOP KOZ_H17714_KNL-PHM-TOPSIDE LGA-3647 KOZ, KNL PHM TOPSIDE
FOR SPECIFIC CHASIS LAYOUT
.622 QTY ITEM NO PART NUMBER DESCRIPTION
[15.8] PARTS LIST

A 1.260 IN ACCORDANCE WITH ASME Y14.5M-2009 3/24/17 P.O. BOX 58119 A
DIMENSIONS ARE IN INCHES [MM] SANTA CLARA, CA 95052-8119
[32] DRAWN BY DATE
3/24/17 TITLE
2.244 CHECKED BY DATE

[57] 3/24/17
THIRD ANGLE PROJECTION LGA-3647 KOZ, KNL PHM TOPSIDE
DETAIL A -
SCALE 4:1 APPROVED BY DATE
-
MATERIAL FINISH D KOZ_H17714_KNL-PHM-TOPSIDE 06
8 7 6 5 4 3 2 1
Mechanical KOZs


DWG. NO SHT. REV

8 7 6 5 4 3 KOZ_H17715_KNL-PHM-MTG-HOLES 1 01 1
REVISION HISTORY
Figure F-2.

Mechanical KOZs
PIN 1 LOCATION
D FOR REFERENCE ONLY D

SOCKET OUTLINE
FOR REFERENCE ONLY
FOR KOZ DETAILS SEE DOCUMENT
KOZ_H17714_KNL-PHM-TOPSIDE
SEE DETAIL A
1.890
[48]
C C
(.866)
[22]
KOZ LEGEND
ZONE1:
1.732 NO ROUTE ZONE, THROUGH ALL LAYERS
[44]
ZONE 2:
NO ROUTE ZONE, TOP LAYER
(.866)
[22]
NOTES:
1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2.126 2. CENTERLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE PHM HOLE PATTER FOR PROPER
[54] PHM AND SOCKET FUNCTION.
B 3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE B
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT
DEFINED BY THAT ZONE AFTER REFLOW.
UNLESS OTHERWISE NOTED ALL VIEW DIMENSIONS ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE
.276 MAXIMUMS. ZONES ARE NOT DRIVEN BY SPECIFIC OR IMPLIED TOLERANCES.
[7.01]
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD
ROUTE KEEPOUT, TOP LAYER ONLY AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
SEE 4 FOR ADDITIONAL DETAILS.

.180
[4.57] 4 ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE.
THROUGH ALL ROUTE KEEPOUT CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
.150 NPTH - COMPONENT PLACEMENT TILT
1.732 [3.8] DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THE SPECIFIED MAXIMUM HEIGHT.
[44]
2.756 TOP KOZ_H17715_KNL-PHM-MTG-HOLES LGA-3647 KOZ, KNL PHM HOLES

[70] QTY ITEM NO PART NUMBER DESCRIPTION
Processor Heatsink Module Mounting Holes Keep-Out Zone
PARTS LIST
DIMENSIONS ARE IN INCHES [MM] SANTA CLARA, CA 95052-8119
DRAWN BY DATE
7/19/13 TITLE
CHECKED BY DATE
7X TOP SIDE HOLE DETAIL A
-
SCALE 15:1 THIRD ANGLE PROJECTION LGA-3647 KOZ, KNL PHM HOLES
-
APPROVED BY DATE
-
MATERIAL FINISH D KOZ_H17715_KNL-PHM-MTG-HOLES 01
8 7 6 5 4 3 2 1
113

114
DWG. NO SHT. REV
8 7 6 5 4 3 KOZ_H17716_KNL-PHM-BACKPLATE 1 01 1
REVISION HISTORY
Figure F-3.

.724
[18.4]
D D
.417
[10.6]
SECONDARY SIDE OF MOTHERBOARD

AS VIEWED FROM THE SECONDARY SIDE
1.220
[31]
.477 .988
[12.12] [25.1]
1.011
[25.67]
2X .512
[13] .951
C 2X .197 [24.15] C
[5] 4X R.039
[1]
KOZ LEGEND

BACKPLATE ZONE,
DETAIL A NO OTHER COMPONENT PLACEMENT ALLOWED,
SCALE 5:1 0.0 MM HEIGHT RESTRICTION
SECONDARY SIDE SOCKET CAVITY
AND COMPONENT ZONES,
1.8 MM MAX COMPONENT HEIGHT 4
7X MOTHERBOARD THROUGH HOLES

NOTES:
FOR REFERENCE ONLY,
FOR DETAILS SEE DOCUMENT 1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
KOZ_H17715_KNL-PHM-MTG-HOLES
2. CENTERLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE PHM HOLE PATTERN FOR PROPER
PHM AND SOCKET FUNCTION.
SEE DETAIL A 3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT
B DEFINED BY THAT ZONE AFTER REFLOW. B
4.331 3.176 2.145
[110] [80.68] [54.48] UNLESS OTHERWISE NOTED ALL VIEW DIMENSIONS ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE
MAXIMUMS. ZONES ARE NOT DRIVEN BY SPECIFIC OR IMPLIED TOLERANCES.
2X ASSUMED COMPONENT PLACEMENT
WINDOWS FOR PRELIMINARY KNL STUDIES A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD
FINAL REQUIREMENTS TBD. AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
SEE 4 FOR ADDITIONAL DETAILS.
4 ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE.

CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
- COMPONENT PLACEMENT TILT
Processor Heatsink Module Backplate Keep-Out Zone
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THE SPECIFIED MAXIMUM HEIGHT.
2X .197
[5]
4X .300 TOP KOZ_H17716_KNL-PHM-BACKPLATE LGA-3647 KOZ, KNL PHM BACKPLATE

[7.62] QTY ITEM NO PART NUMBER DESCRIPTION
PARTS LIST
4X .360 UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R
A [9.14] IN ACCORDANCE WITH ASME Y14.5M-1994 7/11/13 P.O. BOX 58119 A
32X R.039 PIN 1 LOCATION DIMENSIONS ARE IN INCHES [MM] SANTA CLARA, CA 95052-8119
DRAWN BY DATE
[1] FOR REFERENCE ONLY 7/19/13 TITLE
(ALL INTERNAL CORNERS) 3.268 CHECKED BY DATE
[83] -
THIRD ANGLE PROJECTION LGA-3647 KOZ, KNL PHM BACKPLATE
-
APPROVED BY DATE
-
MATERIAL FINISH D KOZ_H17716_KNL-PHM-BACKPLATE 01
8 7 6 5 4 3 2 1
Mechanical KOZs

Xeon Phi Processor x200 Product Family Design Guide Unlocked

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Intel® Xeon Phi™ Processor x200

Order Number: 334785-002

5.2.2 Reference Board Layout...........................................................................40

4-2 Bolster Plate and Spring ........................................................................................ 34

F-3 Processor Heatsink Module Backplate Keep-Out Zone ............................................... 114

334785 001 Initial release. August 2016

Figure 1-1. Processor Mechanical Assembly

The components and information described in this document include:

— Reference designs for the Processor Heatsink Module (PHM).

This document is intended for use by:

Table 1-1. Related Documents

Intel® IA64 IA32 Architecture Software Developers Manual 325462 2

European Blue Angel Recycling Standards 3

Environmental Product Content Specification for Suppliers and Outsourced

Table 1-2. Terms and Terminology (Sheet 1 of 2)

LGA Land Grid Array processor package and socket interface

MCDRAM Multi-Channel Dynamic Random Access Memory

PHM Processor - Heatsink - Module

CA Case-to-ambient thermal resistance, a thermal performance characterization parameter

SA Sink-to-ambient thermal resistance, a thermal performance characterization parameter. A

SMT Surface Mount Technology

SRO Solder Resist Opening.

Table 1-2. Terms and Terminology (Sheet 2 of 2)

2 Processor Mechanical Design

2.1 Processor Package Mechanical Specifications

2.2 Processor Package Description

The package components include the following:

Figure 2-1. Processor Package Assembly Sketch

Figure 2-2. Processor with Fabric Package Assembly Sketch

2.3 Package Mechanical Dimensions

Figure 2-3 shows a photograph of the IHS on a processor.

Figure 2-3. Processor with the Integrated Heat Spreader

The processor package mechanical drawings are provided in Appendix C. These

2.3.1 Package Critical-to-Function Attributes

2.3.2 Other Processor Package Specific Design Attributes

2.4 Processor Mass

2.5 Processor Material

Table 2-1. Processor Materials

Integrated Heat Spreader Nickel Plated Copper

Substrate Halogen Free, Fiber Reinforced Resin

Package Lands Gold Plated Copper

Fabric Edge Connector Fingers Gold Plated Copper

2.6 Processor Markings

Figure 2-5. Processor Top and Bottom View

Figure 2-6. Processor with Fabric Top and Bottom View

2.7 Processor Mechanical Load Specification

2.8 Processor Insertion Specification

IFP Cable Attachment Cycling (processor with fabric only):

2.9 Processor Handling Guidelines

3 Socket Mechanical Design

3.1 LGA3647-1 Socket Overview

Figure 3-1. LGA3647-1 Socket Assembly with PnP Covers

3.1.1 Socket Features

Table 3-1. LGA3647-1 Socket Attributes

Socket Wall Exterior Dimension 82 mm (L) x 62 mm (W)

Pitch (hexagonal pattern) 0.8585 mm (X) x 0.9906 mm (Y)

Ball Count 3647

Figure 3-2. Hexagonal Array in LGA3647 Socket BGA Ball Footprint

Features of the socket include:

3.1.2 Socket Mechanical Requirements

3.1.2.2 Socket Loading and Deflection Specifications

Table 3-2. Socket Loading and Deflection Specifications

Static Compressive Load per Contact 10 25 gf 1

Static Compressive Load, Total (BOL) 180 300 lbf 2, 5