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1 18-03-2011 STM © by SEMIKRON

RECTIFIER,DIODE,THYRISTOR,MODULE

Fig. 1L Power dissipation per thyristor vs. on-state current Fig. 1R Power dissipation per thyristor vs. ambient temp.

Fig. 2L Power dissipation per module vs. rms current Fig. 2R Power dissipation per module vs. case temp.

Fig. 3L Power dissipation of two modules vs. direct current Fig. 3R Power dissipation of two modules vs. case temp.

2 18-03-2011 STM © by SEMIKRON

SKKT 330, SKKH 330 THYRISTOR BRIDGE,SCR,BRIDGE

Fig. 4L Power dissipation of three modules vs. direct and rms current Fig. 4R Power dissipation of three modules vs. case temp.

Fig. 5 Recovered charge vs. current decrease Fig. 6 Transient thermal impedance vs. time

Fig. 7 On-state characteristics Fig. 8 Surge overload current vs. time

3 18-03-2011 STM © by SEMIKRON

RECTIFIER,DIODE,THYRISTOR,MODULE

Fig. 9 Gate trigger characteristics

Dimensions in mm

' 4 <" ,::

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* The specifications of our components may not be considered as an assurance of component characteristics.
Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON

4 18-03-2011 STM © by SEMIKRON

SKKT 330, SKKH 330 THYRISTOR BRIDGE,SCR,BRIDGE
products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We
therefore strongly recommend prior consultation of our staff.

5 18-03-2011 STM © by SEMIKRON