Model 601.

07000
Cross Section Kit
 Cross Section Kit

Kit simplifies preparation of TEM cross-sections

SPECIMEN PREPARATION

10 Parts 1 Part
by by
Weight Weight

FEBRUARY
2003 2
 Preparing Cross-Sectional Specimens

STEP 1 STEP 2
SPECIMEN PREPARATION

TEFLON
4x5mm
Mold
RECTANGULAR
CUTTING TOOL
SPECIMEN
SPECIMEN
SLICE
GLASS
SLIDE COAT WAFERS
WITH
G1 EPOXY
1
2
3 4
DUMMY 5 6
WAFERS
DUMMY
WAFERS

Cut rectangular wafers from

bulk material using Coat all wafers with a thin layer
ultrasonic disc cutter of G-1 & load into Teflon™ mold
FEBRUARY
2003 3
 Preparing Cross-Sectional Specimens

STEP 3 STEP 4
SPECIMEN PREPARATION

TEFLON MOLD
SPECIMEN
2.3mm
STACK
SLOTTED CUTTING
SPRING CLAMP SPECIMEN TOOL
MOUNT

SPECIMEN
CENTERING
STACK
RING

SPECIMEN VISE

CURE ON HOT PLATE AT

130°C FOR 10 MINUTES

Cure glued stack under

pressure to form a strong Cut cylinder from stack using
bond between wafers. ultrasonic disc cutter
FEBRUARY
2003 4
 Preparing Cross-Sectional TEM Discs

STEP 5 STEP 6
SPECIMEN PREPARATION

DIAMOND
SPECIMEN COAT TUBE
SAW
CYLINDER WITH
G1 EPOXY

METAL RING
METAL
TEFLON
TUBE
MOLD

CROSS-SECTION
INTERFACE

Glue cylinder inside metal tube. Sliced specimen discs ready for
Cure on hot plate. disc grinding and dimpling.
FEBRUARY
2003 5
 PIPS Cross-Section Application
SPECIMEN PREPARATION

Cross-Section of a semi-processed IC device.

Note, well aligned features for both wafers.

FEBRUARY
2003 6
 Metals/Hard Materials Cross-Sections

STEP 1 STEP 2
SPECIMEN PREPARATION

2.3mm
CUTTING
DIAMOND Tool
SAW
2.3mm
CUT

3.0 mm
SILICONE
STACK
4.0 mm
METAL TOP VIEW
4.0 mm
5.0 mm METAL
< 2.3 mm
SILICONE
STACK

Cut stack using diamond saw to Cut cylinder from stack using
form 2 stacks 2.3mm wide ultrasonic disc cutter

FEBRUARY
Repeat Steps 5 & 6 from previous slide
2003 7
 Precision Cross-Sections

STEP 1 STEP 2
SPECIMEN PREPARATION

RECTANGULAR
AREA OF
CUTTING TOOL INTEREST
TEFLON
JAW
SPECIMEN
SLICE AREA OF
200µm
INTEREST
RECTANGULAR
WAFER
COAT WAFERS
WITH
G1 EPOXY
1
2
GLASS 3 4
DUMMY 5
SLIDE WAFERS
6
GLASS
DUMMY
WAFERS
X-Y TABLE

Cut rectangular section parallel Coat all wafers with a thin layer
to slice and < 200um from edge. of G-1 & load into Teflon™ mold

FEBRUARY Repeat Steps 3-4-5-6 from previous slide

2003 8
 Preparing Powders and Fibers

Step 1 Step 2 FIBERS RUN

VERTICALLY
SPECIMEN PREPARATION

FIBER POWDER
BRASS
G-1 Epoxy
TUBE

Teflon Cup Teflon Cup

Mix G-1 epoxy with fibers or powder Cure epoxy on hot plate for
transfer mixture to a brass tube 10 minutes at 130°C

Step 3 DIAMOND Step 4

SAW FIBER POWDER

Cut brass tube into disc’s Disc grind, dimple grind and
for grinding to required thickness ion mill to perforation
FEBRUARY
2003 9
 Preparing Powders (Method 2)

Step 1 Step 2
POWDER
SIX SILICON DUMMY WAFERS
SPECIMEN PREPARATION

G-1 EPOXY
1
2
POWDER 3
+G1 EPOXY 4
Teflon Cup
5
6

Mix G1 epoxy with powders

Transfer mixture to gap between Coat wafers with epoxy and
wafers 3 and 4 cure glued stack under pressure

2.3mm
Step 3 CUTTING Step 4
TOOL
SLOTTED
METAL RING
SPECIMEN SPECIMEN
MOUNT STACK
Mixture of powder
CENTERING
RING
and G1 epoxy

Cut cylinder from stack and glue Cut reinforced specimen discs for
inside metal tube. Cure on hot plate disc grinding and dimpling
FEBRUARY
2003 10