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Phase leg
Part number
MCC132-14io1
Backside: isolated
3 1 2
6 7 5 4
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IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20191209c
Thyristor Ratings
Symbol Definition Conditions min. typ. max. Unit
VRSM/DSM max. non-repetitive reverse/forward blocking voltage TVJ = 25°C 1500 V
VRRM/DRM max. repetitive reverse/forward blocking voltage TVJ = 25°C 1400 V
I R/D reverse current, drain current VR/D = 1400 V TVJ = 25°C 200 µA
VR/D = 1400 V TVJ = 125°C 10 mA
VT forward voltage drop I T = 150 A TVJ = 25°C 1.14 V
I T = 300 A 1.36 V
I T = 150 A TVJ = 125 °C 1.08 V
I T = 300 A 1.36 V
I TAV average forward current TC = 85 °C T VJ = 125 °C 130 A
I T(RMS) RMS forward current 180° sine 300 A
VT0 threshold voltage TVJ = 125 °C 0.80 V
for power loss calculation only
rT slope resistance 1.5 mΩ
R thJC thermal resistance junction to case 0.23 K/W
RthCH thermal resistance case to heatsink 0.1 K/W
Ptot total power dissipation TC = 25°C 435 W
I TSM max. forward surge current t = 10 ms; (50 Hz), sine TVJ = 45°C 4.75 kA
t = 8,3 ms; (60 Hz), sine VR = 0 V 5.13 kA
t = 10 ms; (50 Hz), sine TVJ = 125 °C 4.04 kA
t = 8,3 ms; (60 Hz), sine VR = 0 V 4.36 kA
I²t value for fusing t = 10 ms; (50 Hz), sine TVJ = 45°C 112.8 kA²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 109.5 kA²s
t = 10 ms; (50 Hz), sine TVJ = 125 °C 81.6 kA²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 79.1 kA²s
CJ junction capacitance VR = 400 V f = 1 MHz TVJ = 25°C 211 pF
PGM max. gate power dissipation t P = 30 µs T C = 125 °C 120 W
t P = 500 µs 60 W
PGAV average gate power dissipation 8 W
(di/dt) cr critical rate of rise of current TVJ = 125 °C; f = 50 Hz repetitive, IT = 500 A 150 A/µs
t P = 200 µs; di G /dt = 0.5 A/µs;
IG = 0.5 A; V = ⅔ VDRM non-repet., I T = 160 A 500 A/µs
(dv/dt)cr critical rate of rise of voltage V = ⅔ VDRM TVJ = 125°C 1000 V/µs
R GK = ∞; method 1 (linear voltage rise)
VGT gate trigger voltage VD = 6 V TVJ = 25 °C 2.5 V
TVJ = -40 °C 2.6 V
I GT gate trigger current VD = 6 V TVJ = 25 °C 150 mA
TVJ = -40 °C 200 mA
VGD gate non-trigger voltage VD = ⅔ VDRM TVJ = 125°C 0.2 V
I GD gate non-trigger current 10 mA
IL latching current tp = 30 µs TVJ = 25 °C 300 mA
IG = 0.5 A; di G /dt = 0.5 A/µs
IH holding current VD = 6 V R GK = ∞ TVJ = 25 °C 200 mA
t gd gate controlled delay time VD = ½ VDRM TVJ = 25 °C 2 µs
IG = 0.5 A; di G /dt = 0.5 A/µs
tq turn-off time VR = 100 V; I T = 160A; V = ⅔ VDRM TVJ =100 °C 150 µs
di/dt = 10 A/µs dv/dt = 20 V/µs t p = 200 µs
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20191209c
Package Y4 Ratings
Symbol Definition Conditions min. typ. max. Unit
I RMS RMS current per terminal 300 A
TVJ virtual junction temperature -40 125 °C
T op operation temperature -40 100 °C
Tstg storage temperature -40 125 °C
Weight 150 g
MD mounting torque 2.25 2.75 Nm
MT terminal torque 4.5 5.5 Nm
d Spp/App terminal to terminal 14.0 10.0 mm
creepage distance on surface | striking distance through air
d Spb/Apb terminal to backside 16.0 16.0 mm
VISOL isolation voltage t = 1 second 3600 V
50/60 Hz, RMS; IISOL ≤ 1 mA
t = 1 minute 3000 V
Ordering Ordering Number Marking on Product Delivery Mode Quantity Code No.
Standard MCC132-14io1 MCC132-14io1 Box 6 430560
I V0 R0 Thyristor
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20191209c
Outlines Y4
7
o 1 2 3 C C k 33.4 34.0 1.315 1.339
l 16.7 17.3 0.657 0.681
m 22.7 23.3 0.894 0.917
4
9
8
DCB e
n d
3 1 2
6 7 5 4
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20191209c
Thyristor
4000 106 320
DC
280
180° sin
120°
3000 50 Hz 240 60°
80% VRRM 30°
40
0 104 0
0.001 0.01 0.1 1 1 10 0 25 50 75 100 125 150
t [s] t [ms] TC [°C]
Fig. 1 Surge overload current ITSM, 2
Fig. 2 I t versus time (1-10 ms) Fig. 3 Max. forward current
IFSM: Crest value, t: duration at case temperature
400 100
RthKA K/W
360 tp = 30 µs
0.3
0.4 tp = 500 µs
320
0.5 PGM = 120 W
280 0.6 60 W
0.8 10 P = 8 W
GAV
1.0
Ptot 240 1.4 VG
200 1.8
DC
[W] [V]
160 180° sin
120°
1
120 60°
30°
IGT (TVJ = -40°C)
25°C
125°C
80
IGT (TVJ = 0°C)
40 IGT (TVJ = 25°C)
IGD
0 0.1
0 50 100 150 200 250 0 25 50 75 100 125 150 0.01 0.1 1 10
ITAVM [A] Ta [°C] IG [A]
Fig. 4 Power dissipation vs. on-state current & ambient temperature Fig. 5 Gate trigger characteristics
(per thyristor or diode)
100
1400 RthKA K/W TVJ = 25°C
0.03
1200 0.04
Circuit 0.06
B6 0.08
1000 0.1 10
3xMCC132 or
Ptot 3x MCD132
0.15
800 0.2 tgd
0.3
[W]
600 [μs] limit
1
typ.
400
200
0 0.1
0 100 200 300 400 500 0 25 50 75 100 125 150 0.01 0.1 1 10
IdAVM [A] T a [°C] IG [A]
Fig. 6 Three phase rectifier bridge: Power dissipation versus direct Fig. 7 Gate trigger delay time
output current and ambient temperature
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20191209c
Thyristor
1600
Circuit RthKA K/W
W3 0.03
3xMCC132 or 0.04
1200 3xMCD132 0.06
0.08
0.1
0.15
Ptot 800 0.2
0.3
[W]
400
0
0 100 200 300 400 0 25 50 75 100 125 150
IRMS [A] Ta [°C]
Fig. 8 Three phase AC-controller: Power dissipation versus
RMS output current and ambient temperature
0.4
RthJC for various conduction angles d:
d RthJC [K/W]
0.3
DC 0.230
ZthJC 180° 0.244
120° 0.255
0.2 30° 60° 0.283
60° 30° 0.321
[K/W] 120°
180°
DC
Constants for ZthJC calculation:
0.1
i Rthi [K/W] ti [s]
1 0.0095 0.001
2 0.0175 0.065
0.0 3 0.2030 0.400
10-3 10-2 10-1 100 101 102
t [s]
Fig. 9 Transient thermal impedance junction to case (per thyristor/diode)
0.5
RthJK for various conduction angles d:
d RthJK [K/W]
0.4
DC 0.330
180° 0.344
120° 0.355
0.3
60° 0.383
30° 0.421
ZthJK
30°
0.2 60° Constants for ZthJK calculation:
120°
[K/W] i Rthi [K/W] ti [s]
180°
0.1 DC
1 0.0095 0.001
2 0.0175 0.065
3 0.2030 0.400
0.0 4 0.1000 1.290
10-3 10-2 10-1 100 101 102 103
t [s]
Fig. 10 Transient thermal impedance junction to heatsink (per thyristor/diode)
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20191209c