Motorola One

Trouble Shooting Guild

LENOVO

1
 Contents
1. Assembly and disassembly guide...............................................................................................3
1.1 Disassembly guide.......................................................................................................3
1.2 Assembly guide.............................................................................................................17
2. PCBA layout.............................................................................................................................17
2.1 TOP...............................................................................................................................17
2.2..............................................................................................................................................18
3. analysis and elimination of common failures of flow........................................................19
3.1 no power on...................................................................................................................20
3.2 CTP problem.................................................................................................................21
3.3 No display....................................................................................................................24
3.4 dead...............................................................................................................................26
3.5 NO key..........................................................................................................................27
3.6 Bad display screen........................................................................................................28
3.7 NO SPK.........................................................................................................................29
3.8 small bell.......................................................................................................................29
3.9 No charge......................................................................................................................31
3.10 Can't take pictures.........................................................................................................32
3.11 Automatic shutdown.....................................................................................................32
3.12 The board leakage.........................................................................................................34

2
Assembly and disassembly guide

.1 Disassembly guide

Tools：Retrieve card pin, cross screwdriver , tweezers, Plastic sheet, sucker

1) Remove SIM card tray.

Retrieve card pin

3
 SIM and TF
card tray

2) Remove battery cover

2.1 Heat the battery cover in red box area with the hot air gun.

2.2 Draw a battery cover from the bottom of the cell with a sucker. To open the
battery cover a gap, and then disassemble the battery cover open scribing.

4
 sucker

Note: when the battery cover is dismantled, you need to press the fingerprint module
with the top of the finger to separate the lid from the battery cover and then
disassemble the battery cover. The following diagram

Press the fingerprint

module on the belly of the
finger and separate it from
the battery cover

5
 The fingerprint
module has been
separated from
the battery cover

Battery cover

3) Remove screws, fingerprint module and rear cover

6
3.1 Remove 1 black screws of the fixe connector compaction steel sheet, and
remove the connector compaction steel sheet. Then disassembly the fingerprint
reader connector.

Press steel sheet

fingerprint module

3.2 the screws of the rear shell and the antenna support are disassembled with the
cross screwdriver.

7
3.3 Disassembly the rear cover cooling film from battery.

3.4 Remove the rear cover, Then disconnect the battery connector.

8
 Rear cover

4) Remove PCBA.
4.1 Remove the key FPC connector Mylar.

Key connector Mylar

9
4.2 The LCD and the TP interface, the main FPC interface, the key FPC interface
and the RF cable interface are disassembled, and then the 2 main board screws are
removed.

LCD&TP conn.

Main FPC conn.

RF cable conn. Key FPC conn.

2 screws

10
4.3 Remove the main board from three in one.

11
 PCBA (main board)

5) Remove the earphone jack rubber sleeve.

6) Remove the RGB led and light sensor rubber sleeve.

7) Remove the rear camera and front camera from the main PCBA.

Note: After disconnecting the front camera connector, be careful to remove the copper foil
from the front camera and prevent damage.

12
8) Remove the receiver and flash light rubber sleeve from the front cover.

9) Remove the 6 black screws,then remove the speaker box.

13
10) Disassemble the main FPC connector and RF cable connector. Then disassembly the
sub PCBA from the upper left part of sub PCBA and remove the sub PCBA from the
front cover.

11) Remove the vibrator.

14
12) Remove the main MIC rubber sleeve.

13) Remove the residual glue of battery cover. Then remove the RF cable.

15
14) Pull out the easy to pull glue of the fixed battery. Then remove the battery.
Note: Be very careful when remove the battery. To prevent damage to the battery.

15) Remove the main FPC.

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16) Remove receiver ,light senser cap and Maim MIC cap

17
.2 Assembly guide

The handset is installed in reverse order to removal.

。

1. PCBA layout
.3 TOP

18
.4 Bottom

SUB PCBA TOP

19
SUB PCBA bottom

2. analysis and elimination of common failures of flow

Requirement description:
Fault a fault is a customer call top10;
Fault diagnosis from the changing parts repair into the componentrepair;
To determine which device damage caused
The need to provide quick check method of the device is damaged

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.5 no power on

No power on

Check whether the power Y Such as

button FPC assembly is the replacement of
good? Change theboot key the FPCB OK, is
FPC? FPCB bad 。
N

Y The motherboard is
Single board with the power to
damaged, replace the
the mobile phone power
on whether there is a large motherboard,faul
current? t plate gradually
N

Connected to the Re download 。

Y
computer through the
USB line, check
the computer device
manager if there
N
are equipment pops up
Check the 32KHz crystal is N
normal? Whether the Re welding
32KHzsignal?
Y
N
Check the 19.2MHz crystal is Re welding
normal?

Y
N
Check the Re welding
battery connector welding
 normal?
Y

Check the PMIC main power supply is normal or N

Re welding or
not?
replace PMIC

Replace memory

Y
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 Replace CPU

.6 CTP problem

CTP problem

The CTP Y Replace the

test is normal? CTP

The replacement of a CTP have

a look is a touch Replace CTP
screen or motherboard
problem?
N

Y
CTP connectors, welding of EMI filter is Welding conne
a problem? ctor or EMI
filters
N

Using the oscilloscope observation, I2C

control line CTP IF signal is given.

Replace the CPU

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.6.1 Charging anomaly

.6.2 The charger is plugged in, without charging display

The charger is plugged

in, no charge indicator

Y
Replace the
charger or the data Replace charger
line is the normal
charge?
N
Y
Replace the battery is Replace the
normal? Measure the battery
batteryvoltage is
less than 3V
N

Check the OVP IC USB Y

connector and OK
peripheral devices, whet
her the welding is
good? After re
welding is normal
N
Y

Replace the OK
PMIC

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.6.3 Insert the USB line, the port was not found in thecomputer

24
 Insert the
USB line, the
port was not
found in
thecompute the
Replace
Y
r
charger or the data Replace charger
line is the normal
charge?
N
Y
Replace the battery is Replace battery
normal? Measure the
batteryvoltage is
less than 3V
N

Check
OVP, USB connector Y
and peripheral device OK
is the welding is
good? After re
welding is normal
N
Y
Replace PMIC OK

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.7 No display

.7.1 No display

White or black screen no
display, backlight light

Check the Y
LCD FPC connection is OK
good, re assembly of
FPC mobile phone is normal
N

Replacing LCD, display is Y
normal ， OK

Check the Y
OK
motherboard EMI device
LCD pathway
of welding and weldingpower
supply is normal, EMI filter 。

Check the LCD other Y

peripheral devices are weld, c Welding 
heck whether LCDconnector. weld devi
ce

Replace CPU

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.7.2 LCD NO back light

LCD No backlight

Check the LCD module FPC

Y
with connector on the OK
motherboardconnection
well, reconnect whether norm
al
N

Replacing the LCD again to Y

verify LCD backlight is on. OK

N
Y
Inspection should be light in Backlight circuit is
the case of LCD amount normal, LCD
of backlight driveoutput problem
voltage pin pin to whether a
voltage exceeding 20V

N
Y
Check the backlight driver and OK
peripheral device welding

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.8 dead

dead

Connected to the
Y Re-download
computer through the
USB line, check
the computer device
manager if N there
are equipment pops up
Check the 32KHz crystal is N Welding
normal? Whether the and try
32KHzsignal? again
Y

Check the 19.2MHz crystal is N Welding

normal? Whether the and try
32KHz signal?
Y
Welding relate
Power supply memery and CPU to N
d circuit
check whether the normal.
device an
d PMIC
Y

The relevant circuit, check Y
the memery to replace the Ok
memery, to see whether the
normal?
N
Replace CPU

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.9 NO key

No key

Y
Assembly check OK
button FPC or welding, weldi
ng or reinstall again
N
N Replace
Press the button, the
detection signal line to ground short key
circuit.

Replace CPU

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.10 Bad display screen

Bad display screen

Check the Y
LCD FPC connection is OK
good, re assembly of
FPC mobile phone is normal,
N

Replacing LCD, display is Y
normal ， LCD problem

Check the Y
OK
motherboard EMI device
LCD pathway
of welding and welding power
supply is normal, EMI filter.

Check the LCD other Y

peripheral devices are weld, c Welding 
heck whether LCDconnector. weld devi
ce

Replace CPU

30
.11 NO SPK

NO SPK

N The
Test the speaker has a
speaker impedance is 8 problem, repl
ohms or 4 ohm acing
the speak
Y
Check whether er
OK
the speaker spring contact point
and good contact. Reassembly test to
see whether the normal 。 N

Check Y
the receiver circuit bead wel OK
ding is normal. Re
welding test
N

To change the
audio codec chip

.12 small bell

31
 small bell

Re burning Y
software, see audio OK
parameter is
missing or
replacement
N
N The speaker has a
Test the problem, replacing
speaker impedance is 8 the speaker
ohms or 4 ohm
Y
Y
Check whether OK
the speaker spring contact point
and good contact. Reassembly test to
see whether the normal.
N

Check the Y
speaker circuit bead welding OK
 is normal. Re welding test

To change the
audio codec chip

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.13 No charge

The charger
is plugged
in, can
not
charge
Replace the
Y
charger or the data Replace
line is the normal the battery
charge? charger
N
Y
Replace the battery is Replace battery
normal? Measure the
batteryvoltage is
N
less than 3V

Check the OVP IC USB Y

connector and OK
peripheral devices, whet
her the welding is
good? After re
welding is normal
N

Replace OK
PMIC

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.14 Can't take pictures

Can't take
pictures

Y
Teardown check whether
OK
Camera module from
the module, reinstall OK
N
Y
Replace the
OK
Camera
module is OK

Check the Y
Camera module connector OK
is good
welding, welding connector
is OK?
N

N
Check the EMI device is Welding
complete, good welding ？ and try
again

Y
N
Check the
main chip welding normal? Welding or
replacement

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.15 Automatic shutdown

Automati
c shutdown

Y To charge the
Check the battery has battery, replace
power, battery temperature the connector
detection pin,connector
is good
N
Y
With the power on, to Check whether
see whether the electric the device has been
current is normal damaged
N
N
Y
To Download program, to According
see whether to Download Tool, poor
the Download positioning components
completed N

Check whether Y The modem chip is good

the software version, SN, I
MEI information can
be read out
N
Check the
The charge is normal Y charging chip is good

Check if CPU
is good

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.16 The board leakage

36
 The board
leakage

Y Can determine
Plus electric will not the electric leakage 
boot, observe whether there in the direct power
is a large leakagecurrent supply batteryVBAT
appears N

Boot machine apart after
power on, all parts of the PCB
Y Backlight
board by handtouch, whether
the device temperature seriou module of direct
sly, to determine a power Vbat
preliminary rough location lea driver, PA screening, 
The temperature or
kage device
N rise device power directly off,determine
supply screening lar the leakage module
Gradually remove vario ger, determining the
us peripherals, each short circuit power
having a connector is supply network
connected or connected Y
by
FPC LCD, camera, look
at N
the electric leakageon The periph
the motherboard eral
Power supply using
module le
a multimeter
akage, rep
to screening of
lacement
various modules of
theresistance to
ground, screening
out the power supply
network resistances
mall
Replace the
Y The
relevant module
module of
IC and a power
leakage, 
supply filter
OK
capacitor,leakage 
N
has disappeared

Replace
PMIC

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