12/98

Application Report
BRANCH: Manufacturers of fittings

TASK: Testing of soldered socket joints

in pressure fittings

Fittings and hose connections on tubing systems under pres-

sure are composed of different elements which are mechani-
cally connected by one or several soldered joints.
A nondestructive test method is required for testing the solder
wetting which is decisively responsible for the operational reli-
ability of these joints.

Hose or
SOLUTION:
fitting connection
The total soldered joint is
tested by rotating the compo- Soldered joint

nent through 360° using the

test arrangement shown in the Probe
drawing.
Water delay path
The amplitude height of the
boundary layer or internal in-
Copper tube bend
terface echo from the transi-
tion point of soldering layer
and tube connection is evalu-
ated. If the solder wetting de-
creases, the indication in- Fig. 1: Test arrangement

creases.
12/98 Application Report / Page 2

Geometrical conditions permitting, the amplitude of the backwall echo

from the total thickness can be monitored as an alternative.
defective wetting: flaw-free wetting:

Interface echo
Backwall echo
total thickness
1st boundary layer
echo

Fig: 2: Typical A-scans

defective wetting between 100° and 280°:

flaw-free wetting over the entire circumference:

Fig. 3: Typical boundary layer echo amplitude characteristics

over the component circumference

SUITABLE EQUIPMENT:

Ultrasonic flaw detectors: USD 15X, USIP 20GP 1

Probes: H 10 ML 15, H 5 K

Accessories: Rotating device

Software: UltraMAP