11/99

Application Report
BRANCH: Tube and wire production

TASK: Testing of soldered joints between drawing

die and casing in a multi-line drawing tool
for wire rope manufacture

To ensure the undisturbed functioning of the multiple tool for

wire making in the production process, nondestructive testing of
the single drawing dies (tungsten carbide) reveals direct infor-
mation on the condition of the joint.

SOLUTION:
To evaluate the soldered joint, two test methods are recom-
mended:

• Manual scanning in direct contact mode using the probe

G 15 MN.
This enables to obtain integral information about the entire
soldered surface.

Typical CRT screen displays

good soldered joint: insufficiently soldered joint:

Internal interface echo

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11/99 Application Report / Page 2

• Immersion testing by means of the probe H 10 MP 15:

H10MP15

~15

Soldered joint Drawing die

Reference: Single drawing die

Internal interface echo ampli-

tude in % screen height:

This enables to obtain detailed information about the bond

distribution in the single drawing dies.

SUITABLE EQUIPMENT:

G Ultrasonic flaw detector: USD 15X

G Probe (manual scanning): G 15 MN

G Probe (immersion testing): H 10 MP 15

G Software for the C-scan: UltraMAP