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Data Sheet
Revision 1.1, 2012-09-13
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BFP650
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1 Product Brief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 General AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Frequency Dependent AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Characteristic DC Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.5 Characteristic AC Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6 Simulation Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7 Package Information SOT343 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
List of Figures
List of Figures
List of Tables
List of Tables
Product Brief
1 Product Brief
The BFP650 is a high linearity wideband NPN bipolar RF transistor. The device is based on Infineon’s reliable high
volume silicon germanium carbon (SiGe:C) heterojunction bipolar technology. The collector design supports
voltages up to VCEO = 4 V and currents up to IC = 150 mA. With its high linearity at currents as low as 30 mA the
device supports energy efficient designs. The typical transition frequency is approximately 42 GHz, hence the
device offers high power gain at frequencies up to 5 GHz in amplifier applications. the device is housed in an easy
to use plastic package with visible leads.
Features
2 Features
Application Examples
Driver amplifier
• ISM bands 434 and 868 MHz
• 1.9 GHz cordless phones
• CATV LNA
Transmitter driver amplifier
• 2.4 GHz WLAN / Bluetooth, 2.4 / 3.5 GHz WiMAX
Output stage LNA for active antennas
• TV, GPS, SDARS
• 2.4 / 5 GHz WLAN
• 2.4 / 3.5 / 5 GHz WiMAX, etc
Suitable for 5 - 10.5 GHz oscillators
Maximum Ratings
3 Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Thermal Characteristics
4 Thermal Characteristics
600
500
400
[mW]
300
tot
P
200
100
0
0 25 50 75 100 125 150
TS [°C]
Electrical Characteristics
5 Electrical Characteristics
5.1 DC Characteristics
Electrical Characteristics
VC
Top View
Bias -T
OUT
E C
VB
B E
Bias-T (Pin 1)
IN
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Notes
1. AC parameter limits verified by random sampling.
2. In order to get the NFmin values stated in this chapter the test fixture losses have been subtracted from all
measured result.
3. OIP3 value depends on termination of all intermodulation frequency components. Termination used for this
measurement is 50 Ω from 0.2 MHz to 12 GHz.
Electrical Characteristics
160
140
940µA
120 810µA
690µA
100
575µA
IC [mA]
80 460µA
350µA
60
260µA
40
160µA
20 80µA
18µA
0
0 1 2 3 4 5
VCE [V]
Figure 5-2 Collector Current vs. Collector Emitter Voltage IC = f (VCE), IB = Parameter in μA
120
110
100
90
hFE
80
70
60
50
0.1 1 10 100 1000
IC [mA]
Electrical Characteristics
1000
100
10
IC [mA]
0.1
0.01
0.6 0.65 0.7 0.75 0.8 0.85 0.9
VBE [V]
Figure 5-4 Collector Current vs. Base Emitter Voltage IC = f (VBE), VCE = 2 V
10
0.1
IB [mA]
0.01
0.001
0.0001
0.6 0.65 0.7 0.75 0.8 0.85 0.9
VBE [V]
Figure 5-5 Base Current vs. Base Emitter Forward Voltage IB = f (VBE), VCE = 2 V
Electrical Characteristics
1.E-05
1.E-06
IB [A]
1.E-07
1.E-08
1.E-09
0.8 1 1.2 1.4 1.6 1.8 2
VEB [V]
Figure 5-6 Base Current vs. Base Emitter Reverse Voltage IB = f (VEB), VCE = 2 V
Electrical Characteristics
45
4.00V
40
35
30 3.00V
fT [GHz]
25
2.50V
20
15
2.00V
10
5 1.00V
0
0 20 40 60 80 100 120 140 160 180
IC [mA]
32
30
28
OIP3 [dBm]
26 3V, 2.4GHz
4V, 2.4GHz
3V, 3.5GHz
24 4V, 3.5GHz
22
20
18
0 20 40 60 80 100 120 140 160 180
IC [mA]
Figure 5-8 3rd Order Intercept Point OIP3 = f (IC), ZS = ZL= 50 Ω, VCE, f = Parameters
Electrical Characteristics
0.6
0.5
0.4
CCB [pF]
0.3
0.2
0.1
0
0 0.5 1 1.5 2 2.5 3 3.5 4
VCB [V]
42
39
36
33 Gms
30
27
24
G [dB]
21 Gma
18
15
12
|S |2
21
9
6
3
0
0 1 2 3 4 5 6 7 8 9 10
f [GHz]
Electrical Characteristics
42
39 0.15GHz
36
33
0.45GHz
30
27
0.90GHz
24
G [dB]
21 1.50GHz
18 1.90GHz
2.40GHz
15
3.50GHz
12
9 5.50GHz
6 10.00GHz
3
0
0 20 40 60 80 100 120 140 160 180
IC [mA]
Figure 5-11 Maximum Power Gain Gmax = f (IC), VCE = 3 V, f = Parameter in GHz
42
39
0.15GHz
36
33
0.45GHz
30
27 0.90GHz
24
G [dB]
1.50GHz
21
1.90GHz
18 2.40GHz
15 3.50GHz
12
5.50GHz
9
6 10.00GHz
3
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
VCE [V]
Figure 5-12 Maximum Power Gain Gmax = f (VCE), IC = 70 mA, f = Parameter in GHz
Electrical Characteristics
1
1.5
0.5 7
8 9 10 2
6
0.4 5
3
0.3 4
4
0.2 3 5
0.03 to 10 GHz
2
0.1 10
−0.1 −10
−0.2 −5
−4
−0.3
−3
−0.4
−0.5 −2
−1.5 70 mA
−1 30 mA
1
1.5
0.5 2
0.4
3
0.3
4
0.2 5
0.1 0.45GHz 10
Figure 5-14 Source Impedance for Minimum Noise Figure opt = f (f), VCE = 3 V, IC = 30 / 70 mA
Electrical Characteristics
1
1.5
0.5 2
0.4 10
9
8 3
0.3 7
6
4
5
0.2 5
4
0.03 to 10 GHz
3
0.1 10
2
0.1 0.2 0.3 0.4 0.5 1 1.5 2 3 4 5
0
1
−0.1 −10
−0.2 −5
−4
−0.3
−3
−0.4
−0.5 −2
−1.5 70 mA
−1 30 mA
1.8
1.6
1.4
1.2
NFmin [dB]
1
IC = 70mA
0.8 IC = 30mA
0.6
0.4
0.2
0
0 0.5 1 1.5 2 2.5 3 3.5 4
f [GHz]
Electrical Characteristics
1.8
1.6
1.4
1.2
NFmin [dB]
1
f = 3.5GHz
0.8 f = 2.4GHz
f = 1.9GHz
0.6
f = 0.9GHz
0.4 f = 0.45GHz
0.2
0
0 20 40 60 80 100
Ic [mA]
Figure 5-17 Noise Figure NFmin = f (IC), VCE = 3 V, ZS = Zopt= Parameter in GHz
3
2.8
2.6
2.4
2.2
2
NF50 [dB]
1.8
1.6
f = 3.5GHz
1.4
f = 2.4GHz
1.2
f = 1.9GHz
1
f = 0.9GHz
0.8
0.6 f = 0.45GHz
0.4
0 20 40 60 80 100
I [mA]
c
Electrical Characteristics
3
2.8
2.6
2.4
2.2
2
NF [dB]
1.8
1.6
1.4
1.2
1
ZS = 50Ω
0.8 ZS = ZSopt
0.6
0.4
0 20 40 60 80 100
Ic [mA]
Figure 5-19 Comparison Noise Figure NF50 / NFmin= f (IC), VCE = 3 V, f = 2.4 GHz
Note: The curves shown in this chapter have been generated using typical devices but shall not be considered as
a guarantee that all devices have identical characteristic curves. TA = 25 °C.
Simulation Data
6 Simulation Data
For the SPICE Gummel Poon (GP) model as well as for the S-parameters (including noise parameters) please
refer to our internet website: www.infineon.com/rf.models. Please consult our website and download the latest
versions before actually starting your design.
You find the BFP650 SPICE GP model in the internet in MWO- and ADS-format, which you can import into these
circuit simulation tools very quickly and conveniently. The model already contains the package parasitic and is
ready to use for DC- and high frequency simulations. The terminals of the model circuit correspond to the pin
configuration of the device.
The model parameters have been extracted and verified up to 10 GHz using typical devices. The BFP650 SPICE
GP model reflects the typical DC- and RF-performance within the limitations which are given by the SPICE GP
model itself.
0.9 ±0.1
2 ±0.2
0.1 MAX.
1.3
0.1
A
4 3
1.25 ±0.1
2.1 ±0.1
0.1 MIN.
0.15
1 2
0.3 +0.1
-0.05
+0.1
0.15 -0.05
+0.1
4x 0.6 -0.05
0.1 M 0.2 M A
SOT343-PO V08
0.6
0.8
1.6
1.15
0.9
SOT343-FP V08
Type code
Manufacturer
2005, June
Pin 1
4 0.2
8
2.3