Issue : U3 Short Soldering

Model : MK10-M
Qty Incm. : 350 ea Analyse Report :
Define

Sample qty : 50 ea
Defect qty : 2 ea • Lack of solder on pad J1 will cause FW download to failed
Issue : Short soldering / Splash soldering on IC U3

• During Incoming inspection has found issue regarding Short soldering

and splashing solder on IC U3
• The defect found at visual inspection
Detail

.
Poor Soldering

• Unstable / uneven soldering, the FW Download Pins Jig’s Position

✓ Soldering J1 from SMT not maximal, some time has poor
soldering on J1 download can move and have the potential to be bent and causes
the FW download process to fail
✓ After Manual insert process,
Root cause of problem

operator has touch-up soldering J1

to improvement soldering pad

Improvement

✓ there is a residual solder tin that fell on the IC U3 after touch up

✓ Change Metal Mask with coving Hole J1 to Eliminate proses touch up HMJ
J1 to prevent the firmware download from failing (less soldering Jul’21
on J1) J1
EMI
✓ Modify Firmware download’s pin Jig Jul’21
Change Metal Mask

to prevent short soldering caused by splash soldering when touch up J1, we make repairs by closing the hole in the metal
mask for the J1 location

Before After

✓ Metal Mask hole for J1 still open ✓ Closing hole metal Mask (Temp: Using Clear tape)

✓ After SMT Process, Operator need do resoldering ✓ Not Need do resoldering for J1

to improve soldering pad

Modify FW Download JIG’s

By changing the PAD J1 hole (without solder), the PIN on the downloaded JIG firmware is changed as below :

Before After

Pin Lebih Besar

Pin Kecil

✓ The Pin Jig position will be fixed on the PCBA pad

✓ Pin Jig position is not fixed and easy to shift
✓ The diameter of the JIG pin is made bigger at the
✓ The pin will be bent and not touch the pad
top so that the PIN will touch the PAD hole when
the JIG moves down