3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

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UGRD-ECE6342-2123T /
Week 9 /
Midterm Quiz 2

Started on Thursday, 10 March 2022, 7:09 PM

State Finished
Completed on Thursday, 10 March 2022, 7:13 PM
Time taken 4 mins 22 secs
Marks 18.00/20.00
Grade 90.00 out of 100.00

Question 1
Correct

Mark 1.00 out of 1.00

Ceramic DIPs are processed individually while plastic DIPs are processed in quantities of __________ (in chain fashion).

Select one:
a. two or more


b. four or more

c. five or more

d. three or more

Your answer is correct.

Question 2
Correct

Mark 1.00 out of 1.00

At present, _________ are the most common of the two package types to be found in Navy microelectronic systems.

Select one:
a. aluminum DIP

b. nickel DIP

c. plastic DIP

d. ceramic DIP


Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 3

Correct

Mark 1.00 out of 1.00

A promising packaging technique is the ________ mounting method by which conductive patterns are evaporated inside the package before
the die is attached.

Select one:
a. face down


b. face right

c. face up

d. side ways

Your answer is correct.

Question 4
Correct

Mark 1.00 out of 1.00

It is a process developed to batch-fabricate (fabricate many at once) semiconductor circuit elements and integrated circuits with electrodes
extended beyond the edges of the 1-25 wafer.

Select one:
a. Wire Bonding Technique

b. Chip Bonding Technique

c. Electrodes Technique

d. Beam Lead Technique



Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 5

Correct

Mark 1.00 out of 1.00

General purpose DIPs have from 4 to ____ pins.

Select one:
a. 20

b. 12

c. 16


d. 8

Your answer is correct.

Question 6
Correct

Mark 1.00 out of 1.00

Because of lsi and vlsi, manufacturers are producing DIPs with up to ____ pins

Select one:
a. 24

b. 52

c. 64


d. 82

Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 7

Correct

Mark 1.00 out of 1.00

The entire IC assembly is placed in an oven at______ degrees Celsius.

Select one:
a. 330

b. 170

c. 270

d. 450


Your answer is correct.

Question 8
Correct

Mark 1.00 out of 1.00

This type of  package was developed from early experience with transistors. It was a reliable package that only required increasing the
number of leads to make it useful for ICs.

Select one:
a. TO Package


b. DIP

c. Flat Pack

d. Hybrid

Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 9

Correct

Mark 1.00 out of 1.00

Once the IC has been produced, it requires a _______ that will protect it from damage.

Select one:
a. housing


b. radiation

c. connection

d. handling

Your answer is correct.

Question 10
Incorrect

Mark 0.00 out of 1.00

Each of the ceramic elements is coated with _____ which has a low melting temperature for subsequent joining and sealing.

Select one:
a. glass


b. ceramic

c. lead

d. plastic

Your answer is incorrect.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 11

Correct

Mark 1.00 out of 1.00

The lead and the metalized area in the bottom of the package are plated with ____.

Select one:
a. copper

b. silver

c.  gold


d. aluminum

Your answer is correct.

Question 12
Incorrect

Mark 0.00 out of 1.00

Whenever an IC is designed manufacturers use a..........

Select one:
a. Specific type number

b. Specific code and manufacturer’s name



c. Specific code and specific type number

d. Specific code and specific value

Your answer is incorrect.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 13

Correct

Mark 1.00 out of 1.00

Low volume production methods are best suited to hybrid IC technology because

Select one:
a. It require several steps to fabricate a circuit


b. It require large components to fabricate a circuit

c. It require various designers to fabricate a circuit

d. It require stipulated temperature to fabricate a circuit

Your answer is correct.

Question 14
Correct

Mark 1.00 out of 1.00

Which package type is chosen for military purposes?

Select one:
a. Metal can pack

b. Flat pack

c. Plastic DIP

d. Ceramic DIP


Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 15

Correct

Mark 1.00 out of 1.00

 Which type of DIP IC dissipates more heat?

Select one:
a. Metal DIP

b. Ceramic DIP

c. Plastic DIP


d. Aluminum DIP

Your answer is correct.

Question 16
Correct

Mark 1.00 out of 1.00

Choose the type of package used for Airborne application?

Select one:
a. Flat pack


b. Metal can package

c. DIP package

d. Transistor pack

Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 17

Correct

Mark 1.00 out of 1.00

How a choice is made, if all three package types are available?

Select one:
a. Based on Experimentation usage

b. Based on fabrication

c. Based on cost

d. Based on Cost, fabrication and Experimentation Usage



Your answer is correct.

Question 18
Correct

Mark 1.00 out of 1.00

Find the types of temperature range used for an IC, which can be used only up to 75 degrees?

Select one:
a. Military temperature range

b. Industrial temperature range

c. Private temperature range

d. Commercial temperature range



Your answer is correct.

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3/18/22, 10:31 PM Midterm Quiz 2: Attempt review

Question 19

Correct

Mark 1.00 out of 1.00

 Which grade device is selected for superior quality performance?

Select one:
a. Private grade IC

b. Industrial grade IC

c. Commercial grade IC

d. Military grade IC


Your answer is correct.

Question 20
Correct

Mark 1.00 out of 1.00

In ordering an IC, the device type is represented as.....

Select one:
a. Alphanumeric characters


b. Numbers

c. Alphabets

d. Symbols

Your answer is correct.

◄ W9 Module 8 Recent Developments in Packaging_ppt

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