Laptop Motherboard Repair

Machine Translated by Google Qbonk Media Group
Dissecting laptop motherboard

Reference :Beginner-Secondary
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FOREWORD
2
Dissecting Laptop Motherboards. Laptop Motherboard Repair is
terrible thing for a group of people. And it deserves to be acknowledged
that it is very rare for a technician who repairs a PC to get to the point
disassemble the permanent components on the motherboard. Most beginner tennis
medium when the damage leads to the Motherboard, it is immediately recommended
just replace the motherboard. If so then it is means buy
new computer in terms of price.
If so why don't we try fixing this Motherboard? One of
the problem is because the electronic components on the motherboard are very smooth
and requires sophisticated equipment to do it.
Another obstacle is that replacing can be easy once you find
damage, but the problem is how do we know which component on
This delicate motherboard that's broken? It's very rare nowadays to make ebooks
about this. Seeing this is armed with computer experience and ever so
radio and tv repairman, I try to analyze, learn and practice and
Finally, this ebook was born as an addition to the previous ebook.
Send regards for success
Qbonk Media Group
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Reference : Beginner-Secondary
Copyright © 2013 by Qbonk Media Group
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copyright so that no part of this ebook may be reproduced or
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Agus Sale S.Pd as the manager of Qbonk Media Group who created and sold this ebook
has the right to use legal procedures for the protection of intellectual property
including the content, ideas, and expressions contained in this ebook.
Legal Statement
Readers are expressly warned to consider and do
all safety precautions indicated by the activities in this ebook for the sake of
to avoid all potential hazards. This e-book is for informational purposes only and
The author does not accept any liability resulting from the use of this information.
Although every effort has been made to verify the accuracy of the information provided
here, the author is not responsible for any loss, injury, error,
inaccuracies, omissions or inconvenience to anyone resulting from the information
this. Most of the tips and secrets given should only be done by personnel
qualified electronics as per engineer/technician. Please be careful because all electrical equipment
is potentially dangerous when disassembled.
To anyone who finds any indication of a violation of this statement, please contact us via
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FOREWORD
4
TABLE OF CONTENTS
CHAPTER 1 INTRODUCTION ABOUT THE LAPTOP MOTHERBOARD

1. Sekilas Tentang Motherboard Laptop 2. Single-
Board PCB 3. Daughter Board Based PCB
CHAPTER 2 ELECTRONICS COMPONENTS ON MOTHERBOARD

1. Surface-Mount Technology (SMT)
2. List of Electronic Component Symbols 3. Resistor
Components 4. Capacitor/Condenser Components
5. Inductor/Coil/Choke Components 6. Switch
Components 7. Recognize Crystal Oscillator
Components 8. Diode Electronic Components 9.
Transistor Components 10. Transformers 11.
Integrated Circuit (Ic) Components
12. Opportunity to Measure Components Directly on the Motherboard
CHAPTER 3 READING MOTHERBOARD DIAGRAM AND SCHEMATICS
1. Explanation of 6 Dominant Chips on Laptop Motherboards 2. Reading

Motherboard Diagrams 3. Common Symbols on Motherboard Schematics
4. How to Read Motherboard Schematics
CHAPTER 4 LOOKING FOR VOLTAGE MEASUREMENT POINTS ON MOTHERBOARD
1. Multimeter and its Functions and How to Use 2. Finding the

Voltage Measurement Point on the Motherboard Based on Schematics
CHAPTER 5 Analysis of the Distribution of Resources on Laptop Motherboards
1. Main Voltage Source Distribution Process 2.

Generation and Distribution Process of 3V and 5V Voltage 3. Types of
Circuit diagrams for RAM resources, South Bridge, North Bridge
CHAPTER 6 LOOKING FOR MOTHERBOARD DAMAGE WITH SCHEMATICS AND
VOLTAGE MEASUREMENT
1. Laptop No Power Or Totally Dead
2. There is power but the laptop doesn't start
3. Laptop Starts Then Turns Off In A Few Seconds
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4. Laptop Turns On But No Display

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5. Motherboard Not Recognizing Hard Disk
6. RAM Memory Not Working
7. The Battery Can't Be Charged
8. Keyboard-Touchpad Not Working
9. USB Port Not Working
CHAPTER 7 LEARN TO REPLACE MOTHERBOARD COMPONENTS
1. Reflow-Reball Chipset
2. Replacing the Motherboard Conventional Electronic Components
3. Replacing Surface Mount Technology (SMT) Components
CLOSING
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CHAPTER 1 6
INTRODUCTION ABOUT LAPTOP MOTHERBOARD
1. Laptop Motherboards at a Glance

A system board also known as a motherboard or mainboard is a
main circtuit board in every laptop. Unlike desktop PC system boards, boards
Laptop systems come to market in thousands of shapes and sizes. Motherboard
laptops are always adapted to the specifications of the model. In other words, you don't
can remove the motherboard from the Toshiba laptop and plug into the laptop
Dell.

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All parts of the laptop are connected to the system board, either directly
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through the connectors installed on the system board or via cables. In a
ordinary laptop ports and components are permanently attached to the system board and
cannot be easily replaced without soldering, for example:
1) Hard drive connector (HDD).
2) CD / DVD drive connector.
3) Memory (RAM) slot.
4) Battery connector.
5) Keyboard connector.
6) Audio (headphone and microphone) jack.
7) Roda Volume Control.
8) Port USB.
9) Eithernet (RJ45 alias jaringan) port.
10) IEEE 1394 (Fire Wire) port.
11) Video chip and some other components and ports.
The system board, processor (CPU) and LCD screen are the most expensive parts in any
laptops. In some cases, when one of the three parts fails, it is cheaper
to buy a brand new laptop instead of replacing this broken part. But
every case is different so you have to do some judgment.
2. Single-Board PCB
Single-board computer (SBC) is a complete laptop board built on a circuit board
single, with a microprocessor, memory, input / output (I / O) and other features that
needed from a functional computer, for example on a laptop. Many types of computers
a home or portable computer integrated all of its functions (on board) onto a single board
single circuit or PCB. Unlike desktop personal computers, Single-board computers
often do not rely on expansion slots for peripheral or expansion functions. A number of

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Single-board computers are built by plugging into the backplane for system expansion. Single
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Board computers have been built using various microprocessors. Design
simple, like using static RAM and a cheap 8 or 16 bit processor. other types,
like a blade server, includes all the memory and processor performance of the server computer
in a space-saving or space-saving format.
Single-board computers were made possible because of the increasing density of integrated circuits.
A single-board configuration reduces overall system costs, by reducing
the number of circuit boards required, and by eliminating connectors and circuits
bus driver who should be able to use. By placing all functions in one
PCB, a smaller overall system can be obtained, for example, as in
notebook computers. Connectors are a source of reliability problems, so a single .system
board eliminates this problem. Single-board computers are now commonly defined in
two different architectures: no slots and no Slot support.
Single-board computers are most often used in industrial situations where they
used in rackmount format for process control or embedded in
other devices to provide control and interfacing. Due to the high degree of integration
very high, reducing the number of components and reducing the number of connectors, SBC often
smaller, lighter, more power efficient and comparable or even more reliable than
multi-board computer.
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An example of a single-board-computer on a laptop in which all equipment is add-on or integrated.
3. Daughter Board Based PCB
Daughterboard, daughtercard, mezzanine board or piggyback board is a circuit board
which is intended to be an extension or “daughter” of the motherboard (or
'mainboard'), or sometimes from an add-on card or card addon. In particular,
daughterboards often have plugs, sockets, pins, connectors, or attachments
another for other circuit boards, which can be distinguished from standard expansion boards such as
PCI or ISA, which are usually called expansion cards. Besides, daughterboards usually
have an internal only connection in a computer or other electronic device without
external, and usually accesses the motherboard directly via the bus.
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Daughterboards are sometimes used in computers or laptops for

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allows expansion cards to fit as needed either in a stand-up formation,
or parallel to the motherboard, usually maintaining a small or form factor
slim. Daughterboards are also sometimes used to extend basic functionality
from an electronic device, such as when certain models have features added to the
in it and released as a new or separate model. Instead of redesigning the model
first fully, daughterboard that can be added via a dedicated port or
connector on the motherboard or mainboard. It usually fits in inline format
with the main board, separated by spacers or standoffs, and therefore sometimes
They are called mezzanine cards because they are stacked like theatrical mezzanines. Wavetable Card
often installed on sound cards in this way.
Below we provide a number of laptop motherboard manufacturers that we offer

know well;
• IBM
• Asustek Computer (Asus)

• Abit
• Chaintech

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• Dfi
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• Epox
• Giga-Byte
• Intel
• MSI
• PC Chip
• Soyo
• Tyan

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CHAPTER 2 12
ELECTRONIC COMPONENTS ON MOTHERBOARD
Electronic components are basic physical devices or entities in a system
electronics used to influence electrons or related fields.
Electronic components by most of the production industry, available in single form
and not to be confused with the electrical element, which is a conceptual abstraction
represents an ideal electronic component.
Electronic components have two or more electrical terminals (or leads). this terminal
used to connect, usually soldered to a Printed Circuit Board (PCB), to
create an electronic circuit (discrete circuit) with a specific function (eg
amplifier, radio receiver, or oscillator).
1. Surface-Mount Technology (SMT)
Surface-mount technology (SMT) is a method for fabricating electronic circuits
where components are mounted or placed directly onto the surface of the circuit board
print (PCB) an electronic device thus making is called a Surface device
Mount Device (SMD) for the respective device. In the industry this invention has
replace the through-hole construction technology method where the component wire
leads to holes in the circuit board. Both technologies can be used on boards that are
same but for some components not suitable for SMT surface mount like
transformers and hot power semiconductors. SMT components are usually smaller
than its old counterpart through the hole and because SMD has a small tip then
almost or no clues at all.

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In the motherboard you will very often find the type of device that
using this model. Unlike PC motherboards, laptop motherboards have:
much smaller components.
Opening and replacing equipment like this is much more difficult and requires
very high accuracy.

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1. List of Electronic Component Symbols
Before starting to get to know electronic components, I will introduce them first
the meaning of a symbol in an electronic network.
Table of Electrical Symbols
Symbol Component name Meaning
Wire Symbols
Electrical Wire Conductor of electrical current
Connected Wires Connected crossing
Not Connected Wires Wires are not connected
Switch Symbols and Relay Symbols
SPST Toggle Switch Disconnects current when open
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SPDT Toggle Switch Selects between two connections
Pushbutton Switch (N.O) Momentary switch - normally open
Pushbutton Switch (N.C) Momentary switch - normally closed
DIP switch is used for onboard

DIP Switch
configuration
SPST Relay
Relay open / close connection by an
electromagnet
SPDT Relay
Close connection by jumper insertion on pins.

Jumper
Solder Bridge Solder to close connection
Ground Symbols
Used for zero potential reference and electrical

Earth Ground
shock protection.
Chassis Ground Connected to the chassis of the circuit
Digital / Common Ground
Resistor Symbols
Resistor (IEEE)
Resistor reduces the current flow.
Resistor (IEC)
Potentiometer (IEEE) Adjustable resistor - has 3 terminals.
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Potentiometer (IEC)
Variable Resistor / Rheostat

(IEEE)
Adjustable resistor - has 2 terminals.
Variable Resistor / Rheostat
(IEC)
Trimmer Resistor Preset resistor
Thermal resistor - change resistance when temperature

Thermistor
changes
Photoresistor / Light dependent Photo-resistor - change resistance with resistor

(LDR) light intensity change
Capacitor Symbols
Capacitor
Capacitor is used to store electric charge.
It acts as short circuit with AC and open circuit
with DC.
Capacitor
Polarized Capacitor Electrolytic capacitor
Polarized Capacitor Electrolytic capacitor
Variable Capacitor Adjustable capacitance
Inductor / Coil Symbols
Coil / solenoid that generates magnetic field

Inductor
Iron Core Inductor Includes iron
Variable Inductor
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Power Supply Symbols
Voltage Source Generates constant voltage
Current Source Generates constant current.
AC Voltage Source AC voltage source
Electrical voltage is generated by

Generator
mechanical rotation of the generator
Battery Cell Generates constant voltage
Battery Generates constant voltage
Generates voltage as a function of voltage or current

Controlled Voltage Source
of other circuit element.
Generates current as a function of voltage or current

Controlled Current Source
of other circuit element.
Meter Symbols
Measures voltage. Has very high

Voltmeter
resistance. Connected in parallel.
Measures electric current. Has near zero resistance.

Ammeter
Connected serially.
Ohmmeter Measures resistance
Wattmeter Measures electric power
Lamp / Light Bulb Symbols
Lamp / light bulb

Generates light when current flows through
Lamp / light bulb
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Lamp / light bulb
Diode / LED Symbols
Diode allows current flow in one direction only (left to

Diode
right).
Allows current flow in one direction, but also can

Zener Diode flow in the reverse direction when above breakdown
voltage
Schottky diode is a diode with low voltage drop

Schottky Diode
Varactor / Varicap Diode Variable capacitance diode
Tunnel Diode
LED emits light when current flows through

Light Emitting Diode (LED)
Photodiode allows current flow when exposed

Photodiode
to light
Transistor Symbols
Allows current flow when high potential at base

NPN Bipolar Transistor
(middle)
Allows current flow when low potential at base

PNP Bipolar Transistor
(middle)
Made from 2 bipolar transistors. Has total gain of the

Darlington Transistor
product of each gain.
JFET-N Transistor N-channel field effect transistor
JFET-P Transistor P-channel field effect transistor
NMOS Transistor N-channel MOSFET transistor
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PMOS Transistor P-channel MOSFET transistor
Misc. Symbols
Motor Electric motor
Change AC voltage from high to low or low to high.

Transformer
Electric bell Rings when activated
Buzzer Produce buzzing sound
Fuse
The fuse disconnects when current above
threshold. Used to protect circuit from high currents.
Fuse
Bus
Contains several wires. Usually for data / address.

Bus
Bus
Optocoupler isolates onnection to other board

Optocoupler / Opto-isolator
Loudspeaker Converts electrical signal to sound waves
Microphone Converts sound waves to electrical signal
Operational Amplifier Amplify input signal
Schmitt Trigger Operates with hysteresis to reduce noise.
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Analog-to-digital converter 20
Converts analog signal to digital numbers
(ADC)
Digital-to-Analog converter
Converts digital numbers to analog signal
(DAC)
Used to generate precise frequency clock signal

Crystal Oscillator
Antenna Symbols
Antenna / aerial
Transmits & receives radio waves
Antenna / aerial
Dipole Antenna Two wires simple antenna
Logic Gates Symbols
NOT Gate (Inverter) Outputs 1 when input is 0
AND Gate Outputs 1 when both inputs are 1.
Outputs 0 when both inputs are 1. (NOT + AND)

NAND Gate
OR Gate Outputs 1 when any input is 1.
NOR Gate Outputs 0 when any input is 1. (NOT + OR)
Outputs 1 when inputs are different.

XOR Gate
(Exclusive OR)
D Flip-Flop Stores one bit of data
Connects the output to selected input line.

Multiplexer / Mux 2 to 1
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Multiplexer / Mux 4 to 1
Connects selected output to the input line.

Demultiplexer / Demux 1 to 4
2. Explanation of Electronic Components, Forms and Functions
In the following explanation I will give a number of common electronic components
used on electronic networks. Not everything you will find inside
laptop motherboard but baiklan will be additional knowledge for you.
1. Resistor
1) Conventional Resistor (Carbon Film)
Why do I call it a conventional resistor? Because these resistors are very common
used in various electronic devices. Resistor (in the old language called
resistance) is a component that is widely used in electronic circuits.
Its main function is to limit the flow of electric current. Other functions as
Resistor (R) voltage divider (voltage divider), which produces a forward bias voltage
(forward bias) and reverse bias voltage , as potential generators
output (vo), and input potential (vi). The ability of the resistor to limit the flow of current
determined by the size of the unit value Ohm (W) which is owned by a resistor. In
below is the electronic symbol of the resistor.
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Referring to Ohm's law: I = V/R, the greater the value of resistance (R), the smaller
current (I) that can flow. The size of the value of the unit Ohm owned by the resistor
can be calculated by looking at the color bands on the resistor body.
Following figure 10, if the first ribbon is yellow, the second ribbon is purple, ribbon
the third is brown, the fourth band is gold, the Ohm unit value of the resistor
it is 47 x 101 = 470 with a tolerance of 5%. Please remember, yellow color
indicates the number 4, the purple color indicates the number 7, the brown color indicates the
number 1, thus the multiplier = 101 , if the third band is red, the multiplier =
102 , so on. Below I show the various common resistors.
Another way to find out the Ohm value of a resistor is to measure it
with multimeter. Look at figure 12. The measuring range switch is at position W, measuring limit
(range) is in position x1, x10 or kW.
2) Variable Resistor

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What is a Variable Resistor? A variable resistor is a resistor that
the resistance value can be changed according to our needs in a circuit
electronic. This Variable Resistor can be used in three terminals or two terminals.
Most Variable resistors are used as three-terminal devices.
As shown in the diagram below, the variable resistor consists of tracks that are
provide a path of resistance. Two pins or device terminals connect the two
end of the track. The third terminal is connected as a value variable that determines track motion.
The movement of the variables through the track helps increase and decrease obstacles.
3) Ohmic Resistor
On the motherboard, many components are used to make circuit functions such as
which are desired. Among the components in the motherboard this resistor is found in
several types. Ohmic resistors are resistors that obey Ohm's Law. Device
in addition to resistors also obey Ohm's law and can also be called ohmic.
An ohmic resistor is made ohmic because its function follows Ohm's law. Ohm's Law
basically saying that current is equal to voltage divided by resistance.
Moreover, resistance is equal to voltage divided by current, and voltage is
is equal to resistance times current. Therefore, in a circuit, if the resistance
a resistor is equal to the voltage divided by the current, the resistor is ohmic.

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The function of the ohmic resistor on the motherboard
The function of the ohm resistor is to decrease the current in a circuit. Ohmic
resistors are generally resistant to the effects of temperature, whereas non-ohmic resistors
can function entirely based on the temperature or light around the circuit.
Ohmic resistors are mostly used in cases where a standard resistor
required in the circuit. For example, if you want the power of a one-ampere LED
in a circuit running at two amperes, you would use an ohmic resistor.
4) Metal Film Resistors
Metal Film Resistors are a common type of axial resistor currently referred to as
Metal Film Resistors. Metal electrode leadless face (MELF) resistors often use the
same technology, but they are cylindrical in design
for Surface Mounts. Note that other types of resistors (e.g., composite
carbon) is also available in the MELF package.
Metal Film Resistors are usually coated with nickel chromium (NiCr), but may also be coated
with one of the metal ceramic materials listed above to
thin film resistors. The tolerance of this resistor is (0.5%, 1%, or 2%) and the coefficient
temperature is generally between 50 and 100 ppm/K. Metal film resistors have
good sound characteristics and low non-linearity due to their low voltage coefficient. Also
advantageous in component efficient tolerance, temperature coefficient and stability.
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5) Power Resistors
This resistor is characteristically similar to ohmic resistors with low resistance.
It is said to be power maybe because it is often used in the power section,
either the power supply or the power amplifier.
6) Resistor Arrays and Networks
A resistor network refers to the number of resistors configured into a pattern
certain. Most often, this resistor network uses end-connected resistors
to-end in series, however a number of variations exist where the resistors are connected
parallel or series-parallel sequence resembling a ladder. In all cases, the resistor
This network acts as a voltage divider, dividing the voltage across
supplied to the circuit in smaller amounts. Practical, resistor network
used to provide fractional supply voltages in various circuits or
to perform digital-to-analog and analog-to-digital conversion functions.
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7) Surface Mount Technology – Resistor SMD
As I explained earlier that in the Motherboard
Computers almost entirely use Surface Mount Technology. Component
based on Surface Mount Technology came to be known as
Surface Mount Device. So in the following I will give examples of resistors

SMD.
continuation of ohmic resistors, one of which we will discuss is
Surface Mount Resistor. Surface Mount Resistor (SMR) juga disebut resistor chip,
constructed by depositing a thick carbon film on a ceramic base. Score
The exact resistance is determined by the composition of the carbon itself, as well as by
the amount of pruning made on carbon deposits. Resistance may vary
from a fraction of one ohm to more than a million ohms.
Power dissipation ratings are typically 1/8 to 1/4W of electricity. Connection to resistive elements
made through two solder terminal end electrodes. End of electrode
C-shaped. The physical dimensions of the chip resistor are 1/8-W: 0.125inc long
0.063inc and about 0.028inc wide. This is how many times smaller than the resistor
conventional. Surface Mount Resistor chip is very stable even at low temperatures
very extreme. The end of the electrode is soldered directly to the copper on
circuit board, hence the surface hence the name Surface-mount.

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8) Chip Resistor Coding
Because the surface of the resistor is so small, there is not enough room for the code bands
color. The sign used to give the resistor value consists of 3 or 4 letters or
numbers that may be easier to read with a magnifying glass. Read code created
more complicated because there are a number of different codes used. Most common is code 3
numbers that work in a similar way to the color coded bands on resistors
conventional wire.

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The first two numbers give the first two digits of the resistor value while the third digit
gives the number of zeros (or multiplier). For example: A resistor marked 332
or 3300 then the value is 3K3 (3.3 kilohms where K replaces the decimal point).
A resistor marked 475 is 4,700,000 or 4M7 (4.7 megom - M replaces dot
decimal). For resistors less than 100 ohms, the last digit will be 0 NOT indicating
zero. Therefore 33 ohms will be marked 330 (i.e. thirty three and no zeros)
although some resistors may be marked 33R (to avoid confusion!).
A 330 ohm resistor would be marked as 331 (thirty three followed by one zero).
What if the value is even lower than 4.7ohms for example? Then the dot
the decimal is replaced with the letter R to give 4R7. There is also a 4-digit code in
use for resistors with a low tolerance of +/-1% or less giving 3
digits of the value and use the fourth digit for the number of zeros (the multiplier). Use
this code 10 ohm resistor will be marked 10R0, 100 ohm is marked 1000, and 1K ohm is
1001 dll
EIA-96 Coding Scheme
In addition to the 3- and 4-digit codes, the new EIA-96 code uses two numbers to refer to
any of the 96 standard values in the table. See Table 1 below. Description in code
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resistors are used to find the multiplier from Table 2. Sample code used
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shown in Table 3.
Table 1. Use of 2 digit numbers for the E96 range of 1% tolerance resistors
code ohms code ohms code ohms code ohms code ohms code ohms
01 100 17 147 33 215 49 316 65 464 81 681
02 102 18 150 34 221 50 324 66 475 82 698
03 105 19 154 35 226 51 332 67 487 83 715
04 107 20 158 36 232 52 340 68 499 84 732
05 110 21 162 37 237 53 348 69 511 85 750
06 113 22 165 38 243 54 357 70 523 86 768
07 115 23 169 39 249 55 365 71 536 87 787
08 118 24 174 40 255 56 374 72 549 88 806
09 121 25 178 41 261 57 383 73 562 89 825
10 124 26 182 42 267 58 392 74 576 90 845
11 127 27 187 43 274 59 402 75 590 91 866
12 130 28 191 44 280 60 412 76 604 92 887
13 133 29 196 45 287 61 422 77 619 93 909
14 137 30 200 46 294 62 432 78 634 94 931
15 140 31 205 47 301 63 442 79 649 95 953
16 143 32 210 48 309 64 453 80 665 96 976
Table 2 Two digits of the code followed by a letter to indicate the multiplier.
Letter Meaning
S or Y Multiply the value (ohms) by 0.01
R or X Multiply the value (ohms) by 0.1
A Add no zeros to value
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B Add 1 zero to value

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C Add 2 zeros to value
D Add 3 zeros to value
AND Add 4 zeros to value
F Add 5 zeros to value
Table 3 How the EIA–96 codes work.
Code Value
51S = 51Y 3.32 ohms or 3R32
12R = 12X 13 ohms or 13R
09A 121 ohms = 121R
24B 1740 ohms = 1K74
63C 44200 = 44K2
20D 158000 = 158K
31E 2050000 = 2M05
74 57.6 million = 57M6
2. Capacitor/Condenser Component
A capacitor (originally known as a condenser or condenser) is a component
Passive two-terminal electricity is used to store energy in an electric field. Form
Practical capacitors vary in shape, but all contain at least two conductors
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electricity is separated by a dielectric (insulator), for example, one common construction consists of
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metal foils separated by a thin layer of insulating film. Capacitors are widely used
as part of the electrical circuit in many common electrical devices is no exception to
laptop.
1 Farad (F) = 1.000.000 mikro Farad (F)
1 mikro Farad (F) = 1.000 nano Farad (nF)
1 nano Farad (nF) = 1.000 piko Farad (pF)
The nature of the capacitor is that it can receive electric current and store it in time
relative. The types of capacitors based on the insulator are as follows:
following :
a. Electrolytic Condenser / ELCO (condenser having polarity, + and pins)
feet -)
b. Capacitor ceramic
c. Mylar capacitor
d. Capacitor Mika
e. Paper Condenser
Use of capacitors in the network:
• As a flow rater
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• As a store of electric current

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The symbol for the capacitor in the circuit is "C" and the symbol for the image is
is :
How to Read Elco
For example, on the body of the ELCO it says 10uF/16v which means the ELCO
has a size of 10 micro farads and a maximum working voltage of 16v. If
the applied voltage is greater than the working voltage, the ELCO will
damaged. The ELCO side with the arrow indicates the leg on the side
it is the negative leg.
How to Read Ceramic / Mica / Mylar Capacitors
For example, on the body of the capacitor is written 103 which means:
Number I: symbolizes the number
Number II: symbolizes the number
Number III: symbolizes the number of zeros & their size in pico
Farad.
So the value of the capacitor is 10,000 pF = 10 nF = 0.01uF.
1) Electrolytic Capacitors

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Also known as Radial capacitors, Electrolytic Capacitors or ELCO for short.

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Radial capacitors have two sticks sticking out of the base
capacitors are commonly called capacitor legs. Twice this has a configuration
different for axial capacitors and usually the positive (+) leg is longer than
negative leg (-).
Since polymer capacitors came into use, a term was needed for
distinguish between older technologies using liquid electrolytes and those
more recently using polymer crystals. A typical reference for capacitors
with liquid electrolytes can call it wet electrolytics.
2) Polymer Capacitors

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Polymer capacitors do not contain electrolytes, but have a similar function
with electrolytic capacitors. Wet electrolytic capacitors contain foil
between the anode and cathode immersed in a liquid electrolyte. polymer capacitor
using paper impregnated with organic semiconductor crystals. Photo on
below shows the Sanyo OS-CON polymer capacitor on the server HP DL380G4
2006.
There are also polymer capacitors with silver color as below;

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Still in the polymer capacitor family, we also know Multilayer Capacitors

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Polymer Film Capacitors are surface mounting capacitors (SMCs) with several
metal-deposited polymer laminated together by deposition
metal on the polymer film.
3) Ceramic Capacitors
A ceramic capacitor is a fixed value capacitor with a ceramic material
which acts as a dielectric. These capacitors are constructed of two or more
an alternating ceramic layer and a metallic layer acting as electrodes.
The composition of the ceramic material defines the electrical behavior and therefore
application of capacitors, which are divided into two stability classes:
• Class 1 ceramic capacitor with high stability and loss
low for resonant network applications.
• Class 2 high efficiency volumetric ceramic capacitors for
buffer, by-pass and coupling applications.
4) SD Ceramic SMT Capacitors or MLCCs
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Ceramic SMT Capacitors are very small, these caps are usually brown or cream color
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with metal ends. This type is commonly found in equipment
computer. If you see at a glance, these capacitors are similar to surface mounts
resistor, but what distinguishes it is the writing of the symbol C which is near
this capacitor, see the picture below;
5) Film Capacitors
Film capacitors, plastic film capacitors, film dielectric capacitors, atau polymer
film capacitors are generally referred to as "Film caps" greeting like film capacitors
power, is an electric capacitor with an insulating plastic film as a dielectric,
sometimes combined with paper as an electrode carrier. Movie-movie
The dielectric, depending on the desired dielectric strength, is made in
special process for very thin thickness, and then equipped
with electrodes. The electrode of the film capacitor can be metallized aluminum
or zinc is attached directly to the surface of the plastic film, or metal foil
separated. Film Capacitors, together with ceramic capacitors and capacitors

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electrolytic, is the most common type of capacitor used in equipment

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electronics, and is used in many AC and DC microelectronics and circuits
electronic.
6) Memory Backup Capacitors
One of the uses of capacitors is as a backup source of energy if
case of a power outage, for example, the memory system, where the total
power loss may result in loss of important data. Memory Backup
Capacitors operate at low voltages but generally have
very high capacitance.

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7) Mica Capacitors
Mica capacitors are high-precision capacitors, these capacitors are very
stable and reliable. Mica capacitors are available in small values, and
mostly used at high frequencies and in cases where
low loss (high Q) required and possible change in value of
low capacitor over time as desired.
8) Variable Capacitors
A variable capacitor is a capacitor whose capacitance can be changed
change. This change in value may be intentional and be done mechanically or
electronic. Frequently used variable capacitors in L/C . circuits
to set the resonant frequency, for example to tune a radio (therefore
they are sometimes called tuning capacitors), or as variable reactance,
eg for impedance matching in tuner antennas.
9) Tantalum SMT Capacitors
Tantalum capacitors have a dielectric Tantalum oxide which is an element
rare earths mined in developing countries. Due to the scarcity of soil types

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these tantalum capacitors are more expensive than electrolytics although superior but
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it's better. The tantalum market has become very vulnerable to problems
supply and shortage with increasing demand from producers
electronics and thus result in too high a price. This causes
designers switch and make designs used for tantalum capacitors
and instead use ceramic and electrolytic caps. On the other hand
Ceramic capacitors have superior characteristics than tantalum at high frequencies.
3. Fuse Components
In electronics and electrical engineering, fuse or fuser from French, Italian fuso,
is a type of low resistance resistor that acts as a circuit breaker
to provide protection in the circuit from overload. This important component
made of metal wire or strip which can melt when too much current is applied, which

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interrupt the circuit. Short circuit, overloading, overload or failure

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device is the main reason why the current is often excessive.
A fuse is usually constructed using a thin metal strip or a wrapped filament
in glass with a transparent protective or plastic cover. Each end of this metal strip
connected to a separate terminal on the outside of the fuse, and this external terminal on
turn is connected to the protected circuit. All electric current flowing through
the circuit passes through this single strip of metal.

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4. Inductor/ Coil/Choke Component
Coil is an electromagnetic short coil, this conductor wire coil is
like copper in a cylindrical shape around an iron core creating an inductor
or electromagnet to store magnetic energy. This coil is often used
to eliminate power surges and dips from the electric current.
1) Air Core Inductor

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The term Air Core Inductor describes an inductor that does not use a core
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magnet made of ferromagnetic material. This term “Water” refers to the core of the scroll
other materials such as plastics, ceramics, or other forms that are non-magnetic, or not
there is content in the core of the roll. Air Core Inductor has lower inductance than core coil
ferromagnetic, but are often used at high frequencies because they are free of
energy losses called core losses that occur in ferromagnetic nuclei, which
increases with frequency. However, a side effect that can occur in
This type of coil is known as 'microphony': the mechanical vibration of the coil can
cause variations in inductance.
2) Ferrite-Core Inductor
For higher frequencies, inductors are made with ferrite cores. Ferrite is a material
Ferrimagnetic ceramics are nonconductive, so no current can flow in them.
The formula for ferrite is xxFe2O4 where xx represents various metals. For inductor cores with ferrite
soft, has low coercivity and thus low hysteresis loss. This material
like iron powder glued together with a binder.
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3) Toroidal core inductor
In a ferrite core inductor, the magnetic field lines emerging from one end of the core must be
through the air to reenter the core at the other end. This reduces the quality, because
many magnetic field paths in the air is higher than the permeability core material. A
higher magnetic field and inductance can be achieved by forming a core
closed magnetic circuit. The magnetic field lines form a closed loop in the nucleus
without leaving the core material. The most commonly used form is the thyroid ferrite nucleus or
donut shape. Due to their symmetry, toroidal cores allow magnetic flux not to be
out of the core (called flux leakage), or electromagnetic interference. The core toroidal coil which
manufactured from a variety of materials, mainly ferrite, iron powder and laminated core.

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4) SMD Inductors/choke
Still part of the Coil, an SMD Inductors or choke coil is the part that
used in electrical circuits to allow DC current to flow while blocking
AC current trying to pass at the same time. These SMD Inductors are used in
a number of electrical devices, including laptop motherboards. SMD Inductors are used in
higher-frequency circuits use a different core material than the
used in lower frequency networks.

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5. Switch Component
In electrical engineering, a switch is an electrical component that can disconnect and connect
re-flow of electricity in a circuit or it can also switch from one conductor to another
another. The most familiar form of a switch is an electromechanically operated device
manually with one or more sets of electrical contacts, which are connected to an external circuit.
On a laptop, a switch in a much smaller size is also used, for example the
used on the power button.

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6. Know the Crystal oscillator Components
A crystal oscillator is an electronic oscillator circuit that uses resonance
The mechanical vibration of the crystal vibrates with the piezoelectric material to generate an electrical signal
with a very precise frequency. This frequency is usually used to track time
(as in quartz watches), to provide a stable clock signal to the IC and
to stabilize the frequency of radio transmitters and receivers. Most common type
of the piezoelectric resonator used is a quartz crystal, so the circuit
oscillators combine them into a crystal oscillator, but other piezoelectric materials
including polycrystalline ceramics used in the same circuit.

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Due to the inherent characteristics of quartz crystal crystal oscillators can be held to
extreme accuracy frequency stability. Temperature compensation can be applied to crystal oscillator
to increase the thermal stability of the crystal oscillator. Crystal oscillator usually
is a fixed frequency oscillator where stability and accuracy are considerations
main. For example it is almost impossible to design a stable and accurate LC oscillator for HF
up and higher frequencies without having to use some sort of control crystal.
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7. Diode Electronic Components

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1) Conventional Diode
Diodes are electrical components that transmit electric current in only one direction or
functions as a one-way valve. Diodes are usually made of semiconductor materials such as
silicon, germanium or selenium and use as voltage regulators, rectifiers
signal, oscillator signal and modulator/demodulator. Although this tool is not as much
its use with resistors but every motherboard must have diodes in it.
In computer equipment, diodes are usually used to emit light with a
pass current, as in a light-emitting diode (LED). 0.6
A diode has two electrodes called an anode and a cathode. Most diodes are made
with a semiconductor material such as silicon, germanium, or selenium. Multiple diodes
consisting of metal electrodes in an evacuation chamber or filled with pure elemental gas
at low pressure. A fundamental property of a diode is its tendency to
conducts electric current in one direction. When the cathode is negatively charged relative to
anode at a voltage greater than a certain minimum is called the forward breakover,
then current flows through the diode. This is a simplistic view, but appropriate for
operating diodes such as rectifiers, switches, and limiters. Silicon diodes work on voltage
six tenths of a volt (0.6 V) for silicon devices, 0.3 V for germanium devices,
and 1 V for selenium devices.
Contoh dioda : IN 4148, IN4002, IN 4003, dll.

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The symbol for the diode is D, the symbol for the picture is:
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Diode properties:
• If given a forward direction (positive voltage => anode and negative voltage => cathode)
will conduct current and vice versa.
• If given the reverse direction (positive voltage => cathode and negative voltage => anode)
will not conduct current.
Diode Function:
• As a rectifier
• As a safety circuit from the possibility of reverse polarity
2) Zener diode
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Made of silicone material. Usually used in power supply circuits where

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Its function is as a current stabilizer. Even though the AC current converted to DC changes
change, will have no effect if there is this zener diode.
The characteristics are as follows:
• The maximum voltage achieved is an average of 0.7 to 12 volts
• Only withstands small currents, maximum 1 to 50 mA
• Almost no voltage is lost when it passes through the zener diode.
Examples of zener diodes: 6 volt zener, 12 volt zener, etc
Measurement of whether or not a zener diode is the same as measuring a regular diode.
3) SMD Diode (Surface Mounted Diode)
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4) Light-Emitting Diode (LED)
Light-emitting diodes, commonly called LEDs, are the real unsung heroes in
electronic world. They do dozens of different jobs and are found in
all kinds of devices including computer Motherboards. Among other things, they form
digits on the digital clock, transmits information from the remote controller, lights up on the clock
hand and notify you when your equipment is activated. If grouped together
Similarly, they can form an image on a jumbo television screen or illuminate a lamp
traffic.
Basically, LEDs are just small light bulbs that fit and are easy to insert
in the electrical circuit. But unlike ordinary incandescent bulbs, they don't have a filament that is
will radiate out, and they do not give rise to high heat. They just
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illuminate by the movement of electrons in the semiconductor material, and they persist
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lives the same as a standard transistor. The life span of the LED can exceed the lamp life
incandescent. Small LEDs have replaced the tube that lights up on the LCD HDTV to make
telly is dramatically thinner.
How to measure it is very easy, stick the feet on each leg of the multimeter
(1 Ohm position) and see if the needle moves if not switch legs and see again.
If the needle still doesn't move it means the LED is faulty. The LED display on the Motherboard can be
seen in the picture below;
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8. Transistor
A transistor is a semiconductor device used for amplification, switch
electronic signal, and electric power. Transistors are made of semiconductor materials with
at least three terminals for connection to external circuits. A voltage or current
current flows through a pair of transistor terminals into a current through a pair of terminals. Because
controlled, then the power (output) can be higher than the input, it means the transistor can
amplify the signal. Currently, some transistors are packaged individually, but more
many more are found embedded in integrated circuits.
Transistors are the basic circuit blocks of modern electronic devices, and are ubiquitous
in modern electronic systems. After its development in the early 1950s, the transistor
revolutionized electronics, and paved the way for radios, calculators, and
computer.
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1) Transistor Bipolar Junction Transistor (BJT)
Bipolar transistors are so named because they conduct with
using both majority and minority carriers. Bipolar junction
transistor, which was the first type of transistor to be mass-produced, was
a combination of two junction diodes, and is formed from one thin layer of semiconductor
p-type is sandwiched between two n-type semiconductors (npn transistors), or thin layers
an n-type semiconductor is sandwiched between two p-type semiconductors (pnp transistors).
This construction results in two pn junctions: the base-emitter junction and the layer
base-collector, separated by a thin region of semiconductor known as
base area. We can only distinguish these two types by looking at the data or
know certain codes.
2) Field-Effect Transistor (Transistor FET)
A Field-Effect Transistor (FET) is a transistor that uses an electric field to
controlling the shape and hence the channel conductivity of one type of charge carrier
in semiconductor materials. The FET is a unipolar transistor because it involves a single
carrier-type operation. The FET concept predates the Bipolar Junction Transistor (BJT), but
however, it was not physically implemented until after the BJT was even more developed
because of the limitations of semiconductor materials and the relative ease of manufacturing BJT
compared to FETs at the time.

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Field-Effect Transistor, using either electrons (in the n-channel FET) or holes (in p
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FET channel) for conduction. The four terminals of the FET are named source, gate, drain, and
body (substrate). In most FETs, the body is connected to the source in the transistor package.
3) SMD Transistor
A transistor surface mount device (SMD) is a type of soldered transistor
directly onto the surface of the computer component board. Even though the transistor is installed
in this way can be more easily broken, boards that utilize transistors
SMD is cheaper than others. An alternative to SMD transistors is
through-hole transistors, which are attached to the board by a metal sleeve that
inserted into the holes drilled in the board. Drilling this hole makes
the technology becomes more expensive and time consuming than SMD technology.
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4) MOSFET (Transistor MOSFET)
Metal–Oxide–Semiconductor Field-Effect Transistor or field-effect transistor (MOSFET,
MOS-FET, or MOS FET) is a transistor used to amplify or
electronic signal switching. Although the MOSFET is a four-terminal device with
source (S), gate (G), drain (D), and body (B), terminal (B) or body or substrate of
MOSFETs are often connected to the source terminal, making it a three-terminal device
like other field-effect transistors. Because the two terminals are usually connected internally
each other (short circuit), only three terminals appear in the electrical diagram. MOSFET

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is the most commonly used transistor in digital and analog circuits, although
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Bipolar junction transistor at one time ago was much more common.

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9. Transformator SMD
This is a transformer (transformer) on a small scale. Its function is transformer function
in general. Signal Transformers introduce a new series of high efficiency. high school
This electrical inductor transformer is intended for an industry standard package for convenience
design.
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10. Komponen Integrated Circuit (Ic)
1) Functions and How It Works
Integrated circuits (ICs), sometimes called chips

or microchip, is device
semiconductor where thousands or millions
small resistors, capacitors and embedded transistors
in it. That is why it is named
integrated circuits. An IC can work
as amplifier, oscillator, timer, counter,
computer memory, or microprocessor. A
Certain ICs are categorized as linear (analog) or digital, depending on the application being used
desired.
The linear IC has a continuously variable output (theoretically capable of reaching a number of states
infinity) depending on the input signal level. As an applied term, signal level
The output is a linear function of the input signal level. Ideally, when instantaneous output
described as instantaneous input, the plot appears as a straight line. linear IC
used as audio-frequency (AF) and radio-frequency (RF) amplifiers. amplifier
operational devices (op amps) are common devices in this application.
Digital ICs operate at slightly higher levels than the signal amplitude range
continuous. This tool is used in computers, computer networks, modems, and counters
frequency. The basic circuit block of a digital IC is a logic gate, which works by
binary data, which is a signal that has only two distinct states, which is called low (logic 0)
and high (logic 1).
In computers, this IC is the most widely used and the most dominant, call it CMOS,
EEPROMS, Northbridge, Southbridge, GPU and CPU are the most common examples of IC chips

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popular. And because we have discussed about the CPU and chipset, the discussion
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about this IC is less than the other components. Functions of this IC
is depending on which part of the computer we will use for example like already
mentioned above. This IC is a combination of several components put together. For
determine whether the IC is good or not can not be measured with a multitester but immediately tried to
Suite. IC has certain series. ICs have 3 pins, 8 pins, 16 pins, and
etc. Pin no 1 is usually marked with a small circle near the pin. Examples of ICs:
LM 7812, UC 3842, TDA 1175, TDA 9302, dll.
2) Types of ICs Often Found On Motherboards
Below I give examples of various ICs that are often found in motherboards
computers and other devices;
NAMA IC PICTURE
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SMT CMOS IC Motorola
Voltage Reference IC Analog Devices
CMOS IC Flash Memory Intel
Intel Flash Memory EEPROM PLCC IC
Timer 8 Pin DIP IC
Digital Converter IC Analog Devices
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Ethernet Media Access Controller IC

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AMD
Peripheral Controller IC PLCC OPTi
Power Switching Regulator IC
Central Processing Unit (CPU)
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2. Opportunity to Measure Components Directly On Motherboard 65
Is it possible to measure the components directly on the motherboard? The answer is yes
but the measurement results can hardly be accounted for at all. Why
thereby?
1) The components on the motherboard are almost entirely on the same physical size scale
very small, hard to see directly without a magnifying glass
2) Ideally one of the component legs should be disconnected from the connection
with other components then can be measured. This is due to the relationship
which can be parallel between the two components that affect the magnitude
resistance especially if measuring the resistance of a resistor.
3) Determination of the legs of certain components such as diodes and transistors is possible
still can but the accuracy of the components is very doubtful if you
draw conclusions.
4) Measuring components without reading the circuit schematic properly can
misleading given that the motherboard PCB is multisided which means
soldering and signal line connection not only on one side but both sides.
Thus I do not recommend measuring components directly on
motherboard except the measurement of voltage and electric current through a component
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CHAPTER 3
READING MOTHERBOARD DIAGRAMS AND SCHEMATICS
In this chapter we will discuss how to read and understand diagrams
motherboard, motherboard schematics and terms often used in
motherboard and other related matters.
1. Explanation of the 6 Dominant Chips on Laptop Motherboards
In dissecting laptop motherboards, some very important chips on
motherboards. Of the many components, there are 6 of them that are very
important as a laptop performance controller. Let's look at the laptop diagram below
(Aser Aspire 5583 Quanta);

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1. Central Processor Unit or CPU
A processor or also known as CPU (Central Processing Unit) is the brain of the computer
a laptop. The processor is one of the main components in a laptop. laptop processor

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currently made mainly by Intel and AMD. The processor is directly connected to the system board
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through the processor socket or CPU socket as shown in the image below.
Central processing unit (CPU) Laptops are now advanced and have power-saving features
and generates less heat than desktop processors, but not the same
strength. There are a variety of CPUs designed for laptops available from Intel (Pentium
M, Celeron M, Intel Core and Core 2 Duo), AMD (Athlon, Turion 64, and Sempron), VIA
Technologies, Transmeta and others. Some laptops have a removable CPU,
although support by the motherboard is limited to certain models. In laptop
else the CPU is soldered on the motherboard and cannot be replaced.
Broadly speaking, the processor consists of three main parts, namely:
• CU (Control Unit)
This section is in charge of regulating and controlling all equipment
is on a laptop computer system. This unit manages data traffic from
main memory to be executed and the result is sent back to memory
main, to be displayed on the monitor screen or other output devices.
• ALU ( Arithmatic and Logical Unit ).
This section is in charge of performing all arithmetic calculations
(mathematics). His other job is to make decisions from a
Logical operations according to program commands. If we are running a
application program and something is not right, then this is the part
decides that an error has occurred. This information
forwarded to main memory so that an “EROR” announcement is made on
monitor screen.
• Register.
Is a small storage medium but very fast access
tall. This is where the data is executed/processed while the other data
still queuing waiting in main memory.
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Example of a laptop's CPU
Although each microprocessor has its own internal design, all microprocessors
have the same basic concepts that I will explain in this tutorial. We will
take a look inside the generic CPU architecture, so you will be able to understand more
about Intel and AMD products and the difference between them.
How to process the data will depend on the program. This program can be:
spreadsheets, word processors or games: for the CPU it makes no difference, because it
actually do not understand what this program does but the CPU is only limited to doing
order. The CPU only follows the commands (called commands or instructions) contained
in the program. This command can be either adding two numbers or sending a chunk
data to a video card, for example.
When you double-click on an icon to run a program, this is what happens:
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1. Programs, which are stored on the hard disk, are transferred to RAM memory.
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A program is a series of instructions to the CPU.
2. The CPU, using a circuit called a memory controller, loads the data
programs from RAM memory.
3. The data, now in the CPU, will be processed immediately.
4. What happens next will depend on the program. CPU can continue
to load and run a program or be able to do something with
process data, such as displaying something on the screen.
How the data is stored is transferred to the CPU.
In the past, the CPU controlled the transfer of data between the hard disk drive and RAM memory. Because
hard disk drive is slower than RAM memory, then the system slows down, because the CPU will
busy until all data is transferred from the hard disk drive to RAM memory. This method is called
PIO, Processor I/O or Programmed I/O. Currently the data transfer between the hard disk drive and
RAM memory is loaded without using the CPU, thus making the system faster.
This method is called bus mastering or DMA (Direct Memory Access). In order to
simplifying our drawing, we do not place the north bridge chip between the hard
disk drive and RAM memory in Figure 1, but they actually exist.
Understanding CPU Clock
What exactly is a clock? Clock is a signal used for synchronizing things on
in the laptop. See Figure 2, where a typical clock signal is shown: that is
the square wave changes from "0" to "1" at a fixed rate. At this number you
can see three full clock cycles ("ticks"). The start of each cycle is when the clock signal
go from "0" to "1"; we mark this with arrows. The clock signal is measured in units that are
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called Hertz (Hz), which is the number of clock cycles per second. A clock of 100 MHz
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means that in one second there are 100 million clock cycles.
Figure 2: Clock signal.
In the realm of laptop motherboards, all timings are measured in clock cycles. As an example,
RAM memory with a latency of "5" means that it will delay a full five clock cycles
to start providing data. Inside the CPU, all instructions delay a certain number of cycles
clock will do. For example, a given instruction can delay seven
clock cycle until it is fully executed.
Regarding the CPU, the interesting thing is that the CPU knows how many clock cycles each
instructions will be fetched, because it has a table containing this information. So if
has two instructions to execute it knows that the first will delay
seven clock cycles to be executed, it will automatically start execution from
next instruction at 8 clock. Of course this is a generic explanation for CPU
with only one execution unit, modern processors have multiple execution units that
work in parallel and can execute both instructions at the same time with
the first, in parallel.
This is called superscalar architecture and we will talk more about this later.
So, what does the clock have to do in performance? To think that the clock and performance
is the same thing, this is the most common misconception about processors. If
You are comparing two completely identical CPUs, running at clock rates
higher will be faster. In this case, with a higher clock rate, the time
between each clock cycle will be shorter, so work will be done in
time is short and the performance will be higher. But when you compare the two processors
different, this is not always true.

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If you find two processors with different architectures for example Intel and
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AMD, the things above, in these two CPUs are completely different. As has been
As mentioned, each instruction takes a certain number of clock cycles to execute. Let us
says that processor "A" takes seven clock cycles to execute an instruction
given, and processor "B" takes five clock cycles to perform
the same instructions. If they run at the same clock rate, processor "B" will
faster, because it can process these instructions in less time.
For modern CPUs there is much more in terms of performance, CPUs have a large amount
different from the execution unit, different cache size, different way to
transfer data inside the CPU, different ways of processing unit instructions
execution, different clock rates, etc.
When the processor clock signal becomes very high, a problem arises. Motherboard in
where the processor is installed cannot work using the same clock signal. If
you look at the motherboard, you will see several tracks or paths. This track is
the cable that connects some of the laptop's motherboard circuits. The problem is
that with a higher clock rate, this cable starts to work as an antenna,
so that the signal, instead of arriving at the other end of the wire, will disappear and be transmitted
as radio waves.

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Figure 3: Very fine wiring path on papa Board.
External Clock CPU
So CPU manufacturers started using a new concept, called clock multiplication, which
starting with a 486DX2 processor. Below is the schematic used in all CPUs
Currently, the CPU has an external clock, which is used when transferring data to and from the
RAM memory (using the north bridge chip), and a higher internal clock. For
to give a concrete example, on a Pentium 4 3.4 GHz, "3.4 GHz" refers to the CPU clock
internal, which is obtained multiplying by 17 200 MHz external clock. We are illustrated
This example is in Figure 4.
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Figure 4: Internal and external clocks on a Pentium 4 3.4 GHz.

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The big difference between the internal and external clocks on modern CPUs is one
The main obstacle to overcome in order to improve laptop performance. Continuation of
the example above, a Pentium 4 3.4 GHz, should reduce the speed by 17x when it has
to read data from RAM memory! During this process, it works as if it were a
CPU 200 MHz!
Several techniques are used to minimize the impact of clock differences. Wrong
one is the use of cache memory in the CPU. Another one is transfer more
of one piece of data per clock cycle. Processors from AMD and Intel use this feature,
but AMD CPUs transfer two data per clock cycle, Intel CPUs transfer four data per clock cycle
clock cycle.
Figure 5: Transfer a lot of data per clock.
Because of this, AMD CPUs are known to have twice their real external clock.
For example, an AMD CPU with an external 200 MHz clock is actually known as 400
MHz. The same thing happens with Intel CPUs: Intel CPUs with an external 200 MHz clock
listed as having an external 800 MHz clock. Two data transfer techniques per clock cycle
called DDR (Dual Data Rate), while the technique transfers four data per clock cycle
disebut QDR (Quad Data Rate).
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Block Diagram of a CPU

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In Figure 6, you can see the basic block diagram for a modern CPU. There are many
difference between AMD and Intel architecture. We think that understanding the block diagram
the foundation of a modern CPU is the first step to understanding how CPU
from Intel and AMD work and the difference between them.
Figure 6: CPU basic block diagram.
The dotted line in Figure 6 represents the CPU body, and the RAM memory is located on the outside
CPUs. The datapath between RAM memory and CPU is usually 64-bit wide (or 128-bit if
dual memory configuration channel is used), running at memory clock or external CPU
clock, where one of them is lower. The number of bits used and the clock rate can be
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combined in a unit called the transfer rate, measured in MB/s. For

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calculate the transfer rate, the formula is the number of bits x clock/8. For systems that
uses DDR400 memory in a single channel (64 bit) transfer rate configuration
memory is 3,200 MB/s, while the same system uses dual memory
channel (128 bit) will have a memory transfer rate of 6,400 MB/s.
Understanding Cache Memory How It Works
Cache memory is a kind of high-performance memory, also called static memory. Type
This memory is used in laptop RAM memory which is called dynamic memory. memory
static consumes more power, is more expensive and physically larger than memory
dynamic, but much faster. This memory can work at the same clock on the CPU,
but dynamic memory is not capable of.
When enter the "external world" to retrieve data, make the CPU work at clock
lower rates, cache memory is the technique used. When CPU loads data
from a certain memory position, a circuit called the controller memory cache (not drawn
in Figure 6 for the sake of simplicity) the entire data load is loaded in the memory cache in the
the bottom of the block the current position in the CPU just loaded. Because controller
cache memory already contains a lot of data below the memory position it was first read
by the CPU, the next data will be in the memory cache, so the CPU does not need to
outside to retrieve data: it is already loaded in the memory cache embedded in the CPU, which
can access the internal clock rate.
The cache controller always observes the position of the memory that is loading and loading data
from some memory position after the memory position has just been read. To give
real example, if the CPU loads the data stored at address 1000, the controller cache will
load data from address "n" after address 1000. This "n" number is called page, if
the processor works with 4 KB pages (which is a typical value), that means it will load
data from 4096 addresses under the memory position currently being loaded. By the way, 1 KB

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equivalent to 1,024 bytes, that's why 4 KB is 4,096 and 4,000. In Figure 7

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we illustrate this example.
Figure 7: How the memory cache controller works.
The larger the cache memory, the higher the possible data required by the CPU
provided and this is very good, so that the CPU directly accesses the RAM memory is not very
frequently, thereby increasing system performance. We call it a "hit" when the CPU loads data
required from the cache, and we call "miss" if the required data is not present and
CPU and needed to access the system RAM memory again.
"
L1 and L2 mean "Level 1" and Level 2", refers to their distance from the CPU core (unit
execution). One that is commonly doubted is why it has three Cache memory
separated (L1 data cache, L1 instruction cache and L2 cache). Look at Figure 6 and
You will notice that the L1 instruction cache works as an "input cache", while
L1 data cache works as "output cache". L1 instruction cache is usually smaller than
L2 cache is very efficient when the program is run to repeat a small part of the loop,
because the required instructions will be closer to the pick-up unit.

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Out-Of-Order Execution (OOO)

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Remember that modern CPUs have multiple execution units working in parallel?
We also said that there are different types of execution units, such as ALUs, which
is a generic execution unit, and FPU, which is a math execution unit.
Just as a generic example to understand the problem, let's say that
a given CPU has six execution engines, four "generic" and two FPUs.
The program has the following instruction stream at any given moment:
1. generic instruction
7. math instruction
10. math instruction
What will happen? The schedule/dispatch unit will send four instructions
first for four ALUS but then on the fifth instruction, CPU need to wait
for one of their ALUS to be free to continue processing, because
all four generic execution units are busy. This is not good, because we still have two
mathematical units (FPU) available, and they are idle. So, CPU with out
of-order execution (all modern CPUs have this feature) will see the instructions
next to see if it can be sent to any of the idle units.
The out-of-order engine did a search and found that the seventh instruction
are mathematical instructions that can be executed on any of the available FPUs.
Since the other FPU will still be available, it will go down looking for program instructions
mathematics another.
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So, in our example, the processing execution units, performed at the same time, are
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first, second, third, fourth, seventh and tenth instructions.
The name out-of-order comes from the fact that the CPU doesn't have to wait, but rather
can pull instructions from the program and be processed before instructions on it
processed. Of course an out-of-order machine can't always look for instructions otherwise
can find one. Out-of-order machines of all CPUs have a depth limit.
2. Understanding the North Bridge Chipset
The north bridge chip, also called MCH (Memory Controller Hub) connects directly to the CPU
and has the following basic functions:
• Memory controller (*)
• AGP bus controller (if available)
• PCI Express x16 Controller (if available)
• Interface for data transfer with south bridge
(*) Except for CPU socket 754, socket 939 and socket 940 (CPU from AMD such as
Athlon 64), because on this CPU the memory controller is located on the CPU itself, not on the CPU
north bridge.
Some north bridge chips also control PCI Express x1 lanes. On PCI . chipsets
Another express south bridge that controls PCI Express x1 lanes. In this explanation,
we will assume that the south bridge is the component in charge
control PCI Express x1 lanes, but keep in mind that this may vary
according to the chipset model. In Figure 3, you can see the diagram that
explain the role of the North bridge on a laptop.
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North bridge.
As you can see, the CPU does not directly access the RAM memory or the card
video, what does that is the north bridge. Therefore, the north bridge chip has a role
major in laptop performance. If the north bridge chip has more memory controller
good, then the performance of the entire laptop will be better. That's one explanation why
You can have two motherboards with the same processor class but reach
different performance.
As already mentioned, the Athlon 64 CPU memory controller is embedded in the CPU and
which is why there is almost no performance difference between motherboards for this platform.
Because the memory controller is on the north bridge, it is this chip that limits the type and size of the memory controller
the maximum amount of memory you can have in the system (on the Athlon 64, the CPU that
set those limits). Connection between north bridge and south bridge is done

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by bus. Initially the PCI bus was used, but then it was replaced by a bus
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special.
3. Understanding the South Bridge
The south bridge chip, also called ICH (I/O Controller Hub) is connected to the north bridge and
responsible for essentially controlling I/O equipment and on-board devices,
like:
• Hard disk drive ports (Parallel and Serial ATA ports)
• USB ports
• On-board audio (*)
• On-board LAN (**)

• PCI bus
• PCI Express lanes (if available)
• Real time clock (RTC)
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• CMOS memory
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• Legacy devices like interrupt controller and DMA controller
(*) If the south bridge has a built-in audio controller, it will require a
an external chip called a codec (short for coder/decoder) to operate.
(**) If the south bridge has a built-in network controller, it will require a
external chip called phy (short for physical) to operate.
The south bridge also connects to two other chips available on the motherboard: the ROM chip,
better known as BIOS, and Super I/O chip, which is in charge of controlling legacy devices
such as serial ports, parallel ports and floppy disk drives.
In Figure 4, you can see a diagram explaining the role of the South bridge in
laptop:
As you can see, the south bridge can have an influence on hard disk performance,
this component is not so critical as north bridge performance. Actually, south bridge
has more to do with motherboard features than compared to performance.
South bridge which regulates the number and speed of USB ports, number and type (ATA
regular or Serial ATA) from your motherboard's hard disk drive port.

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4. Keyboard Controller (KBC)
The keyboard controller is a fairly important device in a personal computer
notebooks. Usually, it is in this keypad scanning charges, there is an encoding code
keys, PS/2 keyboard/mouse data input, and data/command intercommunication with
system BIOS. The function is very basic but quite important as a device
human and laptop interface.
In notebook computers, the keyboard controller can be more powerful in add-in functions
advanced power management and user defined functions
users like us usually design using a microcontroller. Keyboard controller
can accept a variety of data entry from humans with mobile keypad input or
external keyboard/mouse. That means the keyboard controller is also in a good position
to control system resources and other power dissipation. This allows
for add-in power management functions, such as monitoring SMBus, smart battery status

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monitoring, smart selector battery charger using only the device

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keyboard controllers. That's why if the keyboard doesn't work, then the laptop automatically
won't boot.
In some other motherboards this chip is known as the I/O controller which runs the
KBC function as well as SUPER I/O CHIP on Low Pin bus Count or LPC bus,
used to connect low-bandwidth devices to the CPU, such as boot ROMs and
"legacy" I/O devices (behind super I/O chips). Typical I/O "legacy" devices
includes serial and parallel ports, PS/2 keyboard, PS/2 mouse, floppy disk controller and
newer-Trusted Platform Module (TPM). This physical path of the LPC bus is usually connected to the chip
southbridge on laptop motherboard, which contains such programmable interrupt
controllers, programmable interval timer, dan ISA DMA controllers
Smsc Super I/ O chip on IBM motherboard
5. Clock generator Chip

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A clock generator chip is a chip or circuit that produces a timing signal

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(known as clock signal) for use in synchronizing the operation of a circuit.
Signals can range from simple symmetrical square waves to
to the more complex. A basic understanding of all clock generators is a
resonant circuits and amplifiers.
In electronics and especially digital synchronization circuits, the clock signal is of a certain type
of a signal that oscillates between high and low states and is used like
metronome to coordinate circuit actions. Although the word signal has
a number of other meanings, the term here is intended for "transmitted energy that can carry
information" or energy transmission that can carry information.
The resonant circuit of the clock generator chip is usually a quartz piezo-electric oscillator,
although simple resonant circuits and even resistor–capacitor (RC) circuits can
used. Amplifier circuit usually inverts a portion of the signal from
oscillator and feeds back to the oscillator to maintain the oscillation.
A clock generator laptop r, based on the Silego . chip

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The clock generator on the motherboard is often used to control CPU speed,
FSB, GPU and RAM. Usually the clock generator is programmed and set by the BIOS when
boot at the selected value, although some systems have a frequency setting
dynamically, which is often the re-programming of the clock generator.
6. What is a video card and how it works
A video card, display card, graphics card, or graphics adapter is an expansion card
which produces an output image for display. Most video cards offer
various functions such as accelerated rendering of 3D scenes and 2D graphics, MPEG-2/MPEG-4
decoding, TV output, or the ability to connect multiple monitors (multi
monitor).
Video hardware is often integrated into the motherboard, but all
modern motherboards provide expansion ports for video cards that can be
added addons. In this configuration it is sometimes referred to as a video controller
or graphics controllers. Modern low-end to mid-range motherboards are included
graphics chipset produced by Northbridge developers (i.e. nForce chipset with
Nvidia graphics or Intel chipset with Intel graphics) on the motherboard.
Graphics chips usually have a small amount of embedded memory and take some
Main RAM thereby reducing the total available RAM. This is usually called a graphic
integrated or on-board graphics, low performance and undesirable for those who
want to run a 3D application. A dedicated graphics card on the other hand has RAM
itself and a dedicated Processor for video image processing, and thus
These offloads work from the CPU and system RAM. Almost all of these motherboards
allows disabling of the integrated graphics chip in the BIOS, and has an AGP slot,
PCI, or PCI Express to add a higher performance graphics card.

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a. Graphics Processing Unit- GPU
A GPU is a special processor that is optimized to accelerate graphics. Processor
it is specially designed to perform floating-point calculations, which are fundamental to
rendering of 3D graphics and 2D images. The main attributes of the GPU core clock frequency, usually
range from 250 MHz to 4 GHz and the number of pipes (vertex and fragment shaders), which
translates 3D images marked with vertices and lines into 2D images that
formed by pixels. Modern GPUs are fully programmed massively in parallel.
Their computing power is many times higher than the CPU. As a consequence,
they challenge CPUs in high performance computing, and drive manufacturers
leading on the processor.
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b. Video BIOS
The video BIOS or firmware contains the basic, usually hidden, program that manages
video card operations and provide instructions that enable laptops and devices
software to interact with the card. It may contain information about memory time,
operating speed and voltage of the graphics processor, RAM, and other information. Sometimes
sometimes it is possible to change the BIOS although this is usually only done
by video card overclockers and has the potential to irreversibly damage the card.
c. Video memory
The video memory capacity of modern video cards ranges from 128 MB to 8 GB. Because
video memory needs to be accessed by GPU and display circuitry, often uses memory
high speed or special multi-port, such as VRAM, WRAM, SGRAM, etc. Around year
2003, the video memory is usually based on DDR technology. During and after the year
Meanwhile, manufacturers are moving towards DDR2, GDDR3, GDDR4 and GDDR5. Memory clock rate
effective in modern cards is generally between 400 MHz and 3.8 GHz. Video memory can
used to store other data as well as screen images, such as the Z-buffer, which manages
depth coordinates in 3D graphics, textures, vertex buffers, and shader compilation programs.
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d. RAMDAC
RAMDAC, or Random Access Memory Digital-to-Analog Converter, converts the signal
digital to analog signal for use by laptop displays using analog inputs
like CRT displays. RAMDAC is a kind of RAM chip that regulates the function of the card
graphic. Depending on the number of bits used and the RAMDAC-data transfer rate,
the converter will be able to support different laptop screen refresh-rates. With display
CRT, it is best to work over 75 Hz and never below 60 Hz, in
order to minimize flickering but with LCD displays, flicker is not a problem.
Due to the growing popularity of digital laptop displays and the dead integration of RAMDAC into GPUs, so
mostly disappears as discrete components.
All current LCD, plasma TV displays and work in the digital domain and not
requires a RAMDAC. There are some remnants of legacy LCD and plasma displays
that the analog input features (VGA, component, SCART etc.) only. It requires RAMDAC, but
they convert the analog signal back to digital before being displayed, with
the unavoidable loss of quality that comes from digital-to-analog-to conversion
digital.
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2. Reading the Motherboard Diagram 90
Below, please re-examine the motherboard diagram where each chip has been installed
explained up front.
1. CPU Connection
CPU is connected to Northbridge (2), this connection is called Host Bus or system BUS
or process BUS in the picture we see that the CPU FSB is 553/667 MHz.
The connection of these two chips occurs in 3 lines, namely:
a. Data BUS
b. Address BUS
c. Controll Bus
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If you pay close attention to the schematic above, the CPU is almost independent, except
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relationship with Northbridge. This means that the CPU only communicates
with other devices via the Northbridge.
Logically, from the schematic we can conclude that the most recent device
suspected the damage is the CPU. This means that if we have confirmed the device
the device below is good then may assume that the CPU may be
damaged.
Now let's compare it to the physical laptop board;
2. Northbridge Connection
Northbridge handles 2 controllers as in the image above.
a. First is the memory controller
Northbridge has a reciprocal relationship with the main memory slot
marked with a reciprocal arrow. First time information signal
come from Northbridge and then enter main memory, and in time
the signal will be returned to the Northbridge for further processing.
If you look closely, it turns out that there is no direct communication between RAM memory
with the CPU because there is an intermediary, namely in this case it is
Northbridge.
b. Graphic display controller
The northbridge controls the graphics display handled by the VGA card which
in this case communication with the GPU. This signal communication is reciprocal
come back. In the picture we see that this communication takes place
using 16x PCIE BUS. So the signal comes from the Northbridge to
The GPU then proceeds to the next process.
Note : in certain laptops the GPU is integrated directly in the
Northbridge
Look closely then you will know that Northbridge is
the main gateway for data processing communications between CPUs. That's

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that's why if the Northbridge is damaged then the CPU will be completely paralyzed and we can
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fooled by a crash similar to a CPU crash in this regard.
On the other hand, this chip communicates with the southbridge which
known as the Direct Media Interface (DMI) is the link between the northbridge
and the Intel southbridge on the computer motherboard. Multiple CPUs
integrates Northbridge to CPU and uses DMI interface to
southbridge direct.
3. Southbridge
Arguably Southbridge has very much communication. If
Pay attention to the schematic, there are 11 direct communications between the Southbridge and the
another device. This means that in this scheme the Southbridge controls directly
the eleven devices. These tools can be partially
external and in some cases this Southbridge is referred to as I/O
controller or control the input output signal of some devices.
a. The first scenario is that the Southbridge controls the USB functions. Data
coming from the USB port will be communicated with the Southbridge then
proceed to the Northbridge which is then conveyed to the CPU.
b. The second part is that the Southbridge controls the performance of the Hard Disk Drive
(HDD) either SATA or PATA HDD. Data to be retrieved from HDD
will be communicated with Southbridge first and then
enter the next process. This means that in this case the CPU cannot
fetch data directly from HDD.
c. Furthermore, the Southbridge also communicates with the Keyboard Controller
(KBC) via LPC connection. Low Pin bus Count or LPC bus, used on
IBM-compatible personal computer for connecting devices
low bandwidth to the CPU, such as boot ROM and "legacy" I/O devices

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(behind the super I/O chip). "Legacy" I/O devices usually include ports
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serial and parallel, PS/2 keyboard, PS/2 mouse, etc.
d. Mini card communication. Southbridge also controls communication with
mini cards such as WLAN and mini cards 802.11a/b/g and so on. It means
if the WLAN is not working then the first thing to check is the WLAN card
itself and if you're sure it's still good it means there's a possibility of damage
on this Southbridge chip.
e. Furthermore Southbridge also provides and controls the audio card
in laptops. From the audio card then to the speakers which we finally
hear it as a sound. Pay attention to the schematic that if the laptop is not present
sound means there is no direct connection with the main memory, but
the tracking path is from the speaker first and then to the sound way
then finally Southbridge is checked.
f. The next control communication is with the Network Interface Card (NIC).
which will eventually lead to the RJ45 socket. Signal information from RJ45
proceed to the NIC and then head to the Southbridge for processing
next.
g. The last part in this Southbridge scheme is the control of the card
readers. The informational signal that comes from the Sdcard will go to the
Southbridge and will be processed to the next section. So logically if
If you want to copy data from a laptop to an SD card, you have to go through the Southbridge
first.
4. Keyboard controller
The keyboard controller is a fairly important device in a personal computer
notebooks. Usually, it is in this scanning keypad charges, there are
key code encoding, PS/2 keyboard/mouse data input, and data/command
intercommunication with system BIOS. The function is very basic but sufficient
important as a human interface device and a laptop.

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5. Clock generator Chip connection

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How about the Clock generator Chip? No connection with other chips?
A clock generator chip is a chip or circuit that generates a signal
timing (known as clock signal) for use in synchronizing operations
a circuit. Signals can range from a symmetrical square wave
simple to more complex.
Although it is not explained in the picture regarding the relationship with the device
different but according to its function this chip controls the speed of the CPU, FSB, GPU
and RAM.
6. Koneksi Graphics Processing Unit- GPU
In schema we see the connection between the Northbridge and the GPU via the BUS
PCIE. But in fact the GPU is integrated in the Northbridge. Signal out of
The Northbridge then goes into and is then forwarded to the CRT, LCD or TVOUT screen
and vice versa. So, if the laptop doesn't have a display, then
means that the checking process is from the GPU and if you are sure the GPU is good it means we are
have to check the northbridge and last memory and cpu.

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3. Common Symbols On Motherboard Schematics

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1) Component Letter Codes On Motherboard PCB Board
It could happen that you are difficult for those of us who are novice technicians to recognize which resistor,
diodes, capacitors and others found on the laptop motherboard. This matter is caused by
because the physical form of the components are often very similar. To make it easier
then each component on the motherboard is assigned a specific code to distinguish it from
others. Below is the letter code that refers to the electronic components
which are often found on laptop motherboards.
NO KODE NAME
EXAMPLE IN THE PICTURE
LETTER COMPONENT
1 C CAPACITY
2 D DIODE
L INDUCTOR
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POWER
PC
CAPACITY
POWER
PD
DIODES/DIODA
POWER
PQ
TRANSISTOR
R RESISTOR
www.qbonk.org Attention!!! This ebook is only sold online at www.dpcworld.com and www.qbonk.com. www.agussale.com
Selling outside of that is a form of fraud.
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97
PR POWER RESISTOR
IC/INTEGRATED
IN
CIRCUIT
COULD IC POWER
Attention!!! This ebook is only sold online at www.dpcworld.com and www.qbonk.com. Selling
outside of that is a form of fraud.
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98
Q TRANSISTOR
1. C :CAPACASITOR
2. CN : Capacitor network
3. D :DIODE
4. DS : Display
5. F : Fuse or fuse
6. J : Jack connector
7. JP : Jumper
8. K : Relay
9. L :INDUCTOR
10. LS : Speaker
11. PC :POWER Capacitor
12. PD :POWER DIODES/DIODA
13. PL :POWER INDUCTOR
14. PQ :POWER TRANSISTOR
15. PR :POWER RESISTOR
16. PS : Power Supply
17. PU :POWER INTEGRATED CIRCUIT
18. Q :TRANSSTOR
19. R :RESISTOR
20. RN : Resistor network
21. T : Transformers
22. U :INTEGRATED CIRCUIT
23. X : Terminal strips, terminations, joins
24. And : Crystal
2) Terms on Laptop Motherboard Schematic
1. AC :Alternating current
2. ACDRV : AC adapter to system-switch driver output
3. ACGOOD : Valid adapter active-low detect logic open-drain output
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4. ACN : Adapter current sense resistor 5.

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ACOP : Input Over-Power Protection 6. ACOV:
Input Overvoltage Protection 7. ACP : Adapter
current sense resistor, positive input.
8. ALWP :ALWAYS ON POWER
9. B+ :AC OR BAT POWER RAIL FOR POWER CIRCUIT
10. BATT :BATTERY
11. BOM :BILL OF MATERIAL MANAGEMENT
12. BT :BUTTON
13. CHGEN : Charge enable active-low logic input 14.
CIN : Input Capacitor 15. CLK_EN:LKOCK ENABLE
16. WITH :CONNECTOR

17. CRT :Cathode ray tube
18. DC :Direct current
19. DM :DIM/DIM SOCKET/SOKET MEMORY/SOKET DDR
20. DOCK:DOCKING SOCKET
21. EMI :Electromagnetic Interference (ELECTROmagnetic Interference)
22. F :FUSE
23. FSEL : Frequency Select Input.
24. GND :Ground
25. GP :GROUND PIN
26. HDMI:High-Definition Multimedia Interface 27.
ID :Continuous Drain Current
28. IDM :Pulsed Drain Current
29. IIN : Operating Supply Current 30.
IIN(SHDN): Shutdown Supply Current 31.
IIN(STBY): Standby Supply Current 32.
IS :Continuous Source Current (Diode Conduction)
33. IVIN :Battery Supply Current at VIN pin
34. JP :JUMPER POINT
35. LCDV:LCD POWER
36. LGATE: Lower-side MOSFET gate signal 37.
LPC :Low Pin Count
38. LVDS:Low-voltage differential signaling(SYSTEM PENSIGNALAN)
39. MBAT: MAIN BATTERY
40. ODD :OUTPUT DISC DRIVE
41. PCI :Peripheral Component Interconnect 42.
PGOOD : Power good open-drain output 43.
PIR :PRODUCT IMPROVED RECORD
44. PSI#:Current indicator input 45.
PVCC : IC power positive supply
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46. RTC :REAL TIME CLOCK

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47. TD :Death Time
48. THRM:THERMAL SENSOR
49. TMDS:Transition Minimized Differential Signaling(TRANSMISI DATA TEKNOLOGY)

50. TP :TES POINT
51. TPAD :THERMAL PAD
52. UVLO: Input Undervoltage Lock Out 53. V

:RAIL(POWER)
54. V+ :PWR MORE (+3V=OVER 3VOLT)
55. VADJ : Output regulation voltage
56. VALW :ALWAYS ON POWER
57. VALWP: VALW PAD
58. VBAT :BATTERY POWER
59. VCCP :power chip(me,graphic chips)

60. VCORE:POWER PROCESOR (VCPU)
61. VDD: control power supply 62.
VDDR :POWER DDR (VDRAM/VRAM/VMEM)
63. VDS :VOLTAGE DRAIN SOURCE
64. VFB ; feedback inputs Power 65.

VGS :VOLTAGE GATE SOURCES
66. VIN : Input Voltage Range 67.

VIN :ADAPTER POWER SUPLAY(vol_in)
68. VL :Power Lock 69.
VL :voltage across the load/Tegangan beban resistor 70. VLDOIN:Power

supply of the VTT and VTTREF output stage (to powerMOS).
71. VOT: Volt_out
72. VRAM:GROUND
73. VREF:POWER REFERENCES/SCHEMA REFERENCE/PERMINTAN SKEMA

74. VS :SUITCH POWER
75. VS+ :SUPPORT VOLTAGE
76. VSB :POWER SWITCH BUTTON
77. VSS : Signal ground.

78. VSW :POWER SWICT
79. VUSB:POWER USB
80. VVGA:POWER VGA (VGPX/VGPU/VCVOD)
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4. Learn How to Read Motherboard Schematics 101
In the following explanation I will provide a basic guide on how to read a book
schematics motherboard laptop.

Note :
It is important for you to pay attention before starting to read the schematics in the case examples
which I gave this:
3. Read and remember the terms in the motherboard schematics that are on
the front of this chapter.
4. In reading schematics, try to always look for the 6 main chips that I have
explain up front. Observe and study the circuit schematics of the chip and on
It's time for you to draw conclusions.
5. In addition to the 6 main chips that I mentioned above that you should observe next
is the circuit that provides the power supply of the chip so that
when one day suspects one of the chips, then there is already a shadow of the location
voltage measurement.
6. In each of the following pages on each circuit page I provide
NOTE or notes that are useful for understanding a circuit. Point the pointer
you to this logo and the notes will automatically appear. Look
example in the image below:
This page continues with file 5583.pdf
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CHAPTER 4 102
LOOKING FOR A VOLTAGE MEASUREMENT POINT ON

MOTHERBOARD
7. Multimeter and Functions and How to Use
A multimeter or multitester, also known as a vom (Volt-Ohm Meter), is a
an electronic measuring instrument that combines several measurement functions in one
units. A typical multimeter will include basic features such as the ability to
measure voltage, current and resistance. Analog multimeter using a microammeter
the pointer moves for all the different measurements. Digital multimeter (DMM,
DVOM) displays the measured value in numbers, and can also display long bars
proportional to the quantity being measured. Digital multimeters are now much more common
than the analog one, but the analog multimeter is still better in some cases
measurements, for example when monitoring rapidly-varying values.
A multimeter can be used to solve electrical problems in a wide variety of
industrial and household devices such as electronic equipment, motor control,
household appliances, power supplies, and wiring systems.
In connection with the demands for the accuracy of the measurement value and convenience
its use and its increasingly affordable price, Digital Multimeter (DMM) has become a
more popular and widely used by Electronic Technicians.
Some of the many Multimeter measurement capabilities available in the market include
:
• Voltage (Voltage) AC and DC units of measurement Volt
• Current (Electric Current) unit of measurement Ampere
• Resistance (Resistance) unit of measurement Ohm
• Capacitance (Capacitance) unit of measurement Farad
• Frequency (Frequency) unit of measurement Hertz
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• Inductance (Inductance) unit of measurement Henry

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• Measurement of Diodes and Transistors
Multimeter Analog
An analog multimeter implemented with a galvanometer meter movement, or
less often with bargraphs or simulated pointers such as LCD or vacuum fluorescent
displays. Analog multimeters have very limited reading precision and accuracy
described above, and so are not built to provide the same accuracy
as a digital instrument.
Multimeter Digital
Modern multimeters are digital because of their accuracy, durability and features
addition. In a digital multimeter the signal under test is converted to a voltage and
amplifier with electronically controlled gain. A digital multimeter displays
the measuring quantity as a number, which eliminates the parallax error.

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How to Use an Analog Multimeter

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Multimeter is used to measure DC current
To measure DC current from a DC current source, select the scalar selector on the multimeter
rotated to the DCmA position with a measuring limit of 500 mA. The two test leads of the multimeter
connected in series to a DC source network (see Figure 4 below)
Accuracy is the main capital because it can damage the multimeter / multitester if we
not thorough.
The thing that must be considered is the location of the direction of the rotary switch, if measuring AC it must be to
AC direction as well as DC, and the measurement method must be from the higher measuring limit
large if it is not yet at the maximum limit of the measurement limit below it, then the measurement limit may be
lowered to the lower.
Multimeter is used to measure AC Voltans
To measure the AC voltage from an AC power source, the multimeter selector scalar is rotated
at the ACV position with the largest measurement limit e.g. 1000 V. Second
The test leads of the multimeter are connected to both poles of the AC power source regardless of
positive or negative pole. Furthermore, the method is the same as measuring the DC voltage across the
above.
Multimeter is used to measure DC Voltans
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To measure DC Voltans (eg from battery or DC power supply), selector scalar

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the multimeter is set to the DCV position with a measurement limit greater than the voltage
to be measured. The red test lead on the (+) pole of the multimeter is connected to the positive pole
the DC voltage source to be measured, and the black test lead on the (-) pole of the multimeter
connected to the negative (-) pole of the voltage source to be measured. Connection
This kind of relationship is called a parallel relationship. In order to obtain the highest accuracy,
try to keep the meter pointer in the maximum position, the way is by
reduce its measuring limit gradually from 1000 V to 500 V; 250 V and so on.
In this case, what needs to be considered is when the needle has been positioned
maximum, do not let the size limit be reduced again, because it can damage
multimeter.
Multimeter Used To Measure Resistance
To measure the resistance of a resistor, the multimeter selector scalar position is set at
position with measuring limit x 1. The red test lead and the black test lead are connected to each other
with the left hand, then the right hand adjusts the needle position adjustment knob
at the zero position on the scale. If the meter pointer cannot be set to the zero position,
means the battery is weak and must be replaced with a new battery. Step
further both ends of the test lead are connected to the ends of the resistor that will
the resistance is measured.
How to read the meter needle designation in such a way that our eyes are perpendicular
with the meter needle and the shadow line of the meter needle is not visible. For high accuracy
The position of the meter pointer is in the center of the detention area. If the needle
the meter pointer is on the left (close to the maximum), then the measurement limit is
change it by turning the selector scalar at the x 10 position. Next, the settings are done again
the meter pointer is at zero position, then the measurement is carried out again
the resistor and the result of the measurement is the indication of the meter needle multiplied by 10 .
If with a measurement limit of x 10 the meter indicator needle is still on the left side of the area
resistance, then the measurement limit is changed again to K and the process is carried out
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which is the same as changing the measuring limit x 10. The reading of the result is on the K scale, i.e.
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the number of the meter needle is multiplied by 1 K .
As for how to use a multimeter, first check the meter pointer
is it right at number 0 on the DCmA scale? , DCV or ACV zero hand position at
the left (see figure 3a), and for the ohmmeter scale the zero needle position is on the right
(see figure 3b). If it is not correct, it must be adjusted by turning the adjusting screw
position of the meter needle to the left or right by using a flat screwdriver (-
) small.
From the picture of the multimeter, the parts and functions can be explained:
1) The needle position adjusting screw (Zero Adjust Screw), serves to
adjust the position of the pointer by turning the screw to the right
or to the left using a small flat screwdriver.
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2) The needle adjustment button is in the zero position (Zero Ohm Adjust Knob),
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serves to set the pointer to the zero position. How: selector switch
rotated to the (Ohm) position, test lead + (red is connected to test lead – (black),
then the position control button 0 is rotated to the left or right so that
pointing to position 0.
3) Selector switch (Range Selector Switch), serves to select the measurement position
and size limit. Multimeters usually consist of four measuring positions,
that is :
a. Position (Ohm) means the multimeter functions as an ohmmeter, which consists of
of three measuring limits: x 1; x 10; and K
b. ACV (Volt AC) position means that the multimeter functions as an AC voltmeter that
consists of five measuring limits: 10; 50; 250; 500; and 1000.
c. The DCV (Volt DC) position means that the multimeter functions as a DC voltmeter that
consists of five measuring limits: 10; 50; 250; 500; and 1000.
d. The DCmA (milliampere DC) position means the multimeter functions as milli
DC ammeter which consists of three measuring limits: 0.25; 25; and 500.
But the four measuring limits above are for the one type of multimeter with
others the size limit is not necessarily the same.
4) Pole hole + (VA Terminal), serves as the entry point for the polar test lead
+ which is red.
5) Pole hole – (Common Terminal), serves as the entry point for the test lead
pole -
which
black in color.
6) Polarity Selector Switch, serves to select the polarity
DC or AC.
7) Meter box (Meter Cover), serves as a place for components
multimeter.
8) The meter pointer needle (Knife -edge Pointer), serves as a magnitude indicator
being measured.
9) Scale (Scale), serves as a meter reading scale.
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How to Use a Digital Multimeter
After studying analog multimeters, in this section I will not explain
again how to use a digital multimeter because the two multimeters are almost the same,
fundamental differences in the way information is displayed. Analog using needle
while digital uses numbers as measurement information.
8. Finding the Voltage Measuring Point on the Motherboard

Based on Schematics
It is impossible to take a voltage measurement on the motherboard without reading
schematics first. The problem then that arises is that there is no
motherboards from different laptop brands have the exact same measurement point,

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plus the chip used must be different too except for the components
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certain are the same.
In this case, I give an example of measuring the voltage on the Charger circuit.
Let's look at the following schematic image;

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Sirkuit Charger DELL Vostro 1200
HP Compaq Presario CQ45 Charger Circuit

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Toshiba Satellite 3000 . Charger Circuit

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Acer Aspire 5583 . Charger Circuit

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Analysis:
1) Although the four circuits are not the same, but the working principle
the same and we can still see which points are marked with a blue circle
to be measured.
2) After getting the measuring points like that, please search for components
on the motherboard by looking at the code no of the component in question. As
the example on the acer circuit above, let's look at the following;
From this circuit you can search for PL7 (Power inductor) on the motherboard and determine
on which leg you will measure the tension. Current will flow through power
This inductor is either when the adapter is plugged in or when the laptop is only using it
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Play battery. Do the same for the other measuring points. Let's see
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its physical form;
As part of this sub-chapter, please read the sample measurement points in chapter 6.
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CHAPTER 5 115
Analysis of Resource Distribution on Laptop Motherboards
4. Main Voltage Source Distribution Process
Main Voltage Source in this schematic is denoted by the letter M and at the end
voltage is denoted as as -VCC5M, -VCC3M, -VCC1R8M, -VCC1R2M.
Let us consider the following control circuit;

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Power control circuit pada mode dengan DC adapter plug-IN

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1. When the AC-DC Adapter Is Attached
Analysis:
1) Switching voltage will create a voltage on VCC5M, VCC3M, VCC1R8M and
VCC1R2M. To produce a voltage, switching requires two conditions which are:
must supply VINT16 voltage and command control from IC VCC5M_ON and
VCC1R8M_ON PMH4 will take over control to control resource
or voltage.
2) When there is a power source on VCC3SW, PMH4 then the source driver on the IC will be
operating, the original pin 73 (EXT-PWR) of the IC has a high resistance
against the polarization of R110 and R53 so that the IC temporarily does not command.
3) If we plug in the DC-IN Adapter plug, there should be a 16V adapter voltage
through R870 passes Zener diode D9 (12V) to generate polarization in the transistor
Q73, make the lowest battery voltage on pin 73 (EXT-PWR), then the EXT-PWR . pin
low, the source driver IC PMH4 results in a voltage at VCC5M_ON and
VCC1R8M_ON will control the switching operation of the circuit.
4) When the operating voltage is -5V already switching will produce an operating voltage
VCC5M, the -3V voltage will be switching, then the switching operating voltage is -3V
generate operating voltage on VCC3M and IC PMH4 will check signal
MPWRG voltage on pin 18, if true then the voltage VCC3M and pin 18 will be
high, this is the last leg of the incidental PMH4 controller IC, if this is the voltage
battery, the IC will lose voltage and lock for the next command and not
will have a secondary voltage.
2. When the AC-DC Adapter Is Not Attached
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Analysis:
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1) When the power input-PIN is still present, the TB62501 boot source IC supports VREGIN16
Fuse component F2, resistor R453, diode D10 by pin 57 of IC-TB62501.
2) Voltage IC-TB62501 (VCC3SW) generated by the control IC on pin 59 pin
provide control power to the PMH4 IC via pins 7,31,59,80,98.
3) If we don't plug in the Adapter then the EXT-PWR pin voltage will be high and source
driver IC does not give VCC1R8M_ON and VCC5M_ON commands, only When
You press the PWRSWITCH button on the machine, then pin 32 of the PMH4 ICs
down at the lowest level and this will give the control circuit command
VCC1R8M_ON and VCC5M_ON for switching operation to generate voltage
height.
4) Chan 18 of IC-PMH4 will check the source on VCC3M, is it
the voltage at pin 18 is high and IC-PMH4 will continue to open
secondary resource command.
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Diagram controller pada mode only source PIN
The question now is how do we know whether there is a source?
main voltage on VCC5M, VCC3M, VCC1R8M. for that purpose then
based on the above schematic we have to check these parts;
• Check VINT16 voltage (see also previous schematic section)
• Check whether pin 43 on the IC or VCC5M_ON is providing
command takes the same time on two voltages i.e.

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VCC5M and
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VCC3M
• Check if there is a command to provide voltage VCC1R8M_ON
and VCC1R8M. To check the command line let's have a look
in the following image:
Picture of the physical form of PMH4 is the source driver IC is a lot of the cause
the laptop has no power or is completely dead.
Now let's observe the location of the legs or pins of this PMH4 which is what we pay attention to.
We color the corresponding pin in white in the image below;

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Picture of IC-PMH4 the white pin sign is the one related to the process
resource distribution.
Analysis:
Usually both orders VCC1R8M_ON and VCC5M_ON will run
at the same time and will command a voltage of about 3V,
so the output voltage of this pin must meet the following requirements:
• Power supply pins of IC-PMH4 or VCC3SW (7,31,59,80,98 feet)
require
3V
• Pin 73 or (EXT-PWR) must be low (0V) when we install the Adapter.

• Pin 32 (PWR SWITCH) must be low (0V) when we press the switch to
open
source.
5. Forming Process and Voltage Distribution of 3V and 5V

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We can observe the switching voltage of 5V or VCC5M and 3V VCC3M in the circuit
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the following;
Figure 26 - Circuit switching voltage generated VCC5M and VCC3M
Analysis:
From the picture above it can be explained that the SWITCHING of the voltage source
creates a voltage circuit on VCC3M and VCC5M covering the elements
following:

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• IC Oscillator MAX6131.
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• Two transistors (single mosfet reverse) are ignited namely Q16 and Q17 to control
voltage VCC5M (5V)
• Double MOSFET (double contrast) Q18 reacts to control voltage VCC3M (3V)
Operating conditions of the circuit:
• V + supplies voltage to pin 22 of the MAX1631 oscillator IC, the voltage is supplied
of the VINT16 voltage after going through R523 (10ÿ)
• Voltage pin 23 (SHDN) about 3V, if this pin voltage = 0V, the oscillator IC will be
locked, not working.
• Pin 7 (TME/ON5) can command high voltage (3V) to open source

VCC5M
• Pin 28 (RUN/ON3) can command high voltage (3V) to open source VCC5M
After all these conditions occur, the oscillator IC will operate to
generates an oscillating signal at the DH5, DL5 control MOSFET pins Q16 and Q17, and
starting DH3, DL3 control lamp and Q18 dual MOSFET.
Operation principle:
• Voltage VINT16 will turn on the lamp at the foot D on transistors Q16 and Q18
but the light doesn't work if not controlled oscillator pin G.
• VINT16 power voltage through R523 (10ÿ) at pin 22 of the MAX1631 oscillator IC.
• Resistor R903 will be highly polarized to pin 23 (SHDN) to allow IC
ready to operate, if the shutdown command from the IC to boot PWRSHUTDOW
TB62501 SHUTDOW2 signal sent to or from the IC reports CPU overheating,
LM26 brought to pin 23 (SHDN) will be low and the IC will be locked.
• When pin 23 of the IC is raised to high, if pin 7 (TME/ON5) is also high, the IC will
fluctuates in DH5 to control the voltage of DL5 MOSFET Q16 and Q17 a
situation that generates voltage (5V) VCC5M, if pin 28 (RUN/ON) is high, IC
will fluctuate in DH3 to control DL3 MOSFET Q18 reverse dual
voltage membuat VCC3M (3V).
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• Voltage MOSFETs Q16 and Q17 operate on the push-pull principle, section voltage
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front is turned off and vice versa, creating a voltage wave in the middle
coil L3 and filter capacitor voltage will filter will VCC5M be

flat.
• Correspondingly as the coupled voltage Q18 also acts to create
a voltage pulse at the midpoint, coil L4 and the filter capacitor will
filter into DC voltage source VCC3M out to be flat.
6. Circuit diagram types for RAM resources, South Bridge,
North Bridge
As I stated in the previous chapter that no two circuits are
exactly the same on different motherboards although on the same function.
In the following schemas I show several types of source schemas
power on RAM, Chipset etc.
1) Type of RAM resource:

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Type the chipset::
Type 1:
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Type 2:
Type 3:
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Type 4:
Type 5:
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Type 6:
Type 7:
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Type 8:
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CHAPTER 6 129
TROUBLESHOOTING MOTHERBOARD DENGAN SCHEMATICS
AND VOLTAGE MEASUREMENT

In this chapter we will learn to find faults with laptop motherboards by using
using two kinds of guides, namely by reading and tracing diagrams
schematics and with instructions for measuring voltages at specific points on the
motherboards. However, please understand that these two guidelines are related to each other
each other.
Attention !!!:
• The guides here cannot stand alone but you have to combine them
with other analytical guidelines.
• The voltage measurement points in this example are only one, do not
glued to the example, but there are still other measuring points we didn't measure
in the schematic.
Trace the location of the faulty component on the motherboard by reading the diagram
is the simplest and earliest way you should do. But even though
simple but in principle because without understanding the diagram schematics you can
misdiagnosed the location of the damage on the motherboard. It's also good for saving
our working time in learning. In this example I use the Acer Aspire diagram diagram
5583. Let us once again consider the following diagram;
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Information:
1) The black bold line in the image above shows the connections and travel paths
signal information from one component to another
2) This line is a reciprocal connection meaning information can come and go from
both directions.
3) For the 6 chips that I have described in the previous chapters, more connections
stands out in the controlling nature.
10. Laptop No Power Or Totally Dead
Step 1; Check the 3.3V and 5V . voltage regulators
Diagram Analysis:
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Totally dead means when using either the battery or the laptop AC adapter at all
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showing no signs of life. The most basic question is when there is no power
which part of the motherboard circuit is stuck? In general, the main part
power to the laptop is the name of the power supply in which part?
Voltage Measurement:
1) Search is by using AC adapter only
2) Make sure that the adapter is in good working order
3) Measure the output voltage as the AC adapter output eg on the adapter it says
19.V please measure
If the input voltage measurement on the motherboard is sure it is still good (in this example,
above 19.03 volts), means it's not the adapter but a problem with the power supply circuit on the

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Motherboards. Now from the diagram let's compare it with the following schematics
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(see original schematics page 22);
1) The circuit is a power system circuit that we usually know as a 3V . supply
and 5V system or in different laptops also known as 3.3V and 5V.
2) According to the working principle of a laptop power supply, the current and voltage will work
normal here when the adapter is plugged in even though the laptop is off. After
we press the power button then the 3.3V and 5 V voltage currents spread to the
the whole motherboard.
In the scheme I marked blue circles that could be dots
measurement with a multimeter.

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From the snippet above I took one point that was measured;
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In the picture he bag I will measure at the point of the inductor PL5 (5V) and the physical shape of PL5
is;
And the result of the voltage measurement is 5.08Volt exactly as in the schematics. Look
the picture next to it. If the voltage is not suitable for example the measurement result is low,
please follow the schematic of the supply voltage of the previous section.
Next I also measured the voltage on PL2 which according to MB . data
is 3.3V and our measurement result is as below;

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Note: If there is no voltage in the power regulator area,
trace the path from the input jack of the adapter to the motherboard.
Step 2; Check KBC Voltage Regulator
One of the causes of a laptop shutting down is when the keyboard controller chip is not working
function. So, in this case, we have to measure the voltage that enters this area. In accordance
our motherboard schema data this time the KBC chip is U13, namely KBC 87541V. Let us
see the schematic;
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The picture above shows where the power will be channeled when the power button
pressed. The 3.3V voltage should come in here;
My measurement results are as below;
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The voltage of 3.3V when compared to the schematic data of 3.3V still works at the normal threshold.
11. There is power but the laptop does not start when pressing the power button
When only using batteries, the laptop is completely dead, but when using
adapter then the power input indicator from the adapter is on. Our conclusion that there is power
that comes in but only waits for a command from the power switch.
Schematic analysis:
1. Suspicion and the first test is on the power switch on the motherboard.
2. We have to read the schematic of the laptop and look for this power switch. Let's see
picture below;
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Having found in the schematic, let's see that in the schematic above if the button
power is pressed will connect the foot no. 2 and 3 on the switch. This is what ignites
occurrence of power in the system. If you press the button and these two points are not connected
then it means the switch is damaged and must be replaced. Let's see how it looks on the PCB board
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When the button is pressed the resistance between the two pins is 0 ohms because they are both in
connected state. This means that the incoming voltage from pin 2 will be sent to pin 3 of the switch
to ignite the next device so that power is distributed within the motherboard.
From the picture above according to our schematic, the 3.3 volt power ignition voltage comes
from foot 3. We don't need to measure the voltage on switch no 2 because of this button
only pressed once and after the power is ignited then the button is released.
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3. Laptop Starts For A Moment And Shuts Down After A Few Seconds.
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When pressing the power button on the laptop, the green power light comes on and the fan starts running
but only about 5 seconds then the laptop then turns off again, the same pattern repeats
reset every time the laptop is turned on. This case occurs both when using batteries
or adapter only or both together.
Simple Analysis:
Since it is not possible to measure voltage, this is where experience is needed.
Maybe have experienced this before? Some of the following tips can help you
do;
1) Since the laptop turns off in just seconds, it is not possible to
us to measure the voltage in the laptop start state. The laptop is dead.
2) Remove the laptop battery and start the laptop using only the AC adapter
installed
3) Open and re-install the memory module, maybe it works
solve the problem. Do the test again
4) Open and remove hard drive, DVD drive, wireless card. If one of
the device is shorted then this problem can occur. Do the test again.
5) Perform the test using an external monitor. If there is a short or short circuit
on the LCD and the voltage generator circuit this problem can occur.
Advanced Analysis:
Failed the simple way let's move on with some other options.
1) I've had this problem and the cause was CPU not installed
correctly on the socket. After I fix the position then the problem becomes
done.
2) When the laptop just died, please directly touch the cooler, is it hot?
normal or too hot. If it gets too hot in a short time then
most likely the CPU is faulty.
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The experience of a friend of mine, this case can be solved by resetting the ROM
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Laptop BIOS and problem solved (It's casuistic)
4. Laptop Turns On But No Display
Diagram Analysis:
1) The first logic is that there is power, which means the initial power supply checking section
we can make sure it's still good and we can ignore it
2) If you look at the diagram above, that's the path of the component in charge of displaying something
on the screen. This is our search area, don't go anywhere else. According to the diagram above,
the important points that we should explore are LCD, Clock Generator, CPU, GPU/NVIDIA chip,
RAM Memory and Northbridge chip.
3) If you look at the diagram again, there are red, yellow, black lines from the Northbridge Chip to VGA.
In reality it's because the GPU is integrated in the Northbridge chip.
Initial solution:
1) Try to press the power button and after a few seconds when the fan is running and the indicator led
is on (but there is no display) then press the power button again.
2) If after pressing the power button for about 15 seconds and the laptop still turns on (even though
there is no display), it means that the attempt to turn off the laptop by pressing the power button
does not work.
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3) By default every laptop if it is on and we press the power button for a few seconds then
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the laptop will turn off. In our case, if the laptop does not turn off, our suspicion is that
there is damage to the CPU or RAM
4) The two components mentioned in point 4 if damaged then cause the power button
cannot be used to turn off the laptop.
5) The shortcut that most people take is to temporarily replace RAM and CPU memory if
there is a spare because these devices are the easiest to replace temporarily, especially
RAM.
6) If point 5 above does not work then we will continue with measurements on
stress point
Notes :
Because we concentrate on the motherboard, we assume that the laptop screen is in good
condition, but in practice you will have to check the screen first before entering the motherboard
inspection.
1) Due to the large number of related chips, below I will show the voltage measurement
point in this case I will take only one, namely the Clock Generator chip. See the
schematics;

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The physical form of the L37 that I will measure is as below;
2) The picture above is the U3 circuit page 3 pdf file. There are two measurement points
which are roughly 3 V voltage.
3) If there is no voltage at the point to the right of the L36 inductor, please move the
measurement to the point on the right and if there is no voltage or drop then the next
step is to check the voltage section of the power supply circuit before entering this
point.
4) If the voltage is there, please continue to check on other related chips
with the display as I gave in the diagram above.

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5. Motherboard Not Recognizing Hard Disk
What if the motherboard doesn't recognize the hard disk?
Diagram Analysis:
Let's look at the schematic;
From the diagram above, the hard disk is directly related to the chip
Southbridge. This connection uses a SATA connection (for our example).
1) Why does the motherboard not recognize the hard disk? There are 3 possibilities
i.e. damaged hard disk, faulty SATA socket or chip problem
Southbridge.
2) If other equipment related to the Southbridge chip works
well then we may conclude for the time being that the Southbridge chip is still
good.
3) If we try to test the hard disk on another laptop and it's still good then
conclusion the problem now is the connection between the hard disk with the
motherboard or supply voltage to the hard disk from the motherboard
trouble. Let's see the schematic on page 19 of the pdf file;
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Because point 3 in the schema analysis is our conclusion, we will do
voltage measurement. I measured the 5V voltage according to the schematic above. Physical form
of the connector pins that I will measure is like the following picture;
According to schematic data the voltage should be 5V and the measurement results show
5.07V is a voltage that is still within reasonable limits.
6. RAM Memory Not Working
This is one of the most annoying devices for laptop users. Most
often broken. No wonder if on a laptop that has no display then suspicion
first on this stuff. If RAM memory is not working, what do we do?
Diagram Analysis:
1) In the diagram above we see that DDR2 RAM is connecting to the chip
Northbridge at 667/553 MHz
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2) Memory is not working probably because; RAM chip is indeed faulty,

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there is no supply voltage to the RAM, the RAM slot is damaged or the chip is damaged
Northbridge.
As usual let's start by reading the diagram to understand the location
and RAM connection.
The picture above is a schematic of the RAM memory connector or slot and in it I
give two measuring points 1.8V but because of this slot it is difficult to find and
put the multimeter probe for voltage measurement then I switch to
power supply scheme for RAM that supplies this 1.8V voltage. This supply scheme
is on page 24. See the schematic;
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I will measure the 1.8V voltage according to the instructions above and for convenience
I am looking for a pin + power capacitor PC104.
1) If the voltage drops, then please look at which components are
responsible for replacement. We have to check resistors, transistors,
capacitor around the schematic.
2) The measurement results above show a voltage of 1.81V which means that the voltage is normal
according to the scheme.
3) Since the normal input voltage for RAM and memory is still not working,
open RAM and test on another laptop. If it works, it means the RAM chip is good.
4) Since we believe the RAM chip is good then another possibility is this DDR2 slot
broken his leg and it's a tough job.
5) If you are sure that the DDR2 slot is good, then the check is continued on the Northbridge chip
6) Check the power voltage on the Northbridge chip and if all is normal then
means at this point we can reflow or even replace the chip
Northbridge.
7. The Battery Can't Be Charged
The battery cannot be charged. Some of the indications that usually appear for example
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1) The battery is dead (no power source even though it's new) and can't
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charged
2) In windows it shows the percentage charge is there but actually it is not
fill in
3) Dll
Batteries can not be charged can be caused by several things;

1) The battery is really damaged/soak
2) Battery connection jack is faulty
3) No power from charger circuit
Diagram Analysis:
Let's in our example consider the first is the diagram
schematicsnya.

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The picture above is a snippet of the schematic of the charger and from the data we get
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3.3V voltage I will measure the voltage on the Power jack pin 5. Results
our measurements as in the picture below;
Up to this point if the voltage is normal and still can't charge the battery,
Our conclusion is that the battery is faulty. If the battery is new is it possible? May be.
8. Keyboard-Touchpad Not Working
We will see why the keyboard does not work or is broken from the side
electronic. If all the keyboard keys don't work then there are some
possibility;
1) The bus cable on the keyboard is broken
2) No power on keyboard circuit
3) Damage to the KBC chip

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Diagram Analysis:
1) The image above is the schematics governing the keyboard and touchpad
2) Controlling keyboard adalah KBC IC 87541V
3) If other MINICAR equipment connected to the Southbridge chip is working then
means that our search center is only on KBC and below
4) In this test we assume that the keyboard cable ribbon is still good and we center it
Just pay attention to the electronics. See image below;

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The picture above is one of the voltage measurement points on the KBC, namely U13. This
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is the point of entry of the voltage.
1) The result of the voltage measurement based on the above scheme is 3.23V If no
voltage means to be traced from where the voltage source.
2) If there is voltage but the keyboard and other equipment such as the touchpad don't work
then it can be concluded that KBC is damaged
9. USB Port Not Working
When we plug in a flash disk, for example, there is no reaction on the laptop
what.
Diagram Analysis:
Let's look at the diagram;
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1) In the diagram we see that the USB port leads directly to the chip
Southbridge without any other intermediate chips.
2) If all other devices connected to the Southbridge chip are working
ok, then we conclude the damage is not on the southbridge chip.
Because we assume that the Southbridge chip that controls USB is still good then
direct voltage measurement we do on the USB port
The picture above is a leg diagram of the usb port
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The measurement data shows the 5.07V voltage is still normal for the voltage size
USB default 5V
Up here, armed with learning the schematic and how to measure the voltage that I described in the
example, you can continue with other components.
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CHAPTER 7 153
MOTHERBOARD COMPONENT REPLACING TECHNIQUES
1. Reflow Soldering Dengan Heat Gun
1) Introduction
Reflow soldering or commonly abbreviated as Reflow is a process used to
fix the chpset on the mainboard on both laptops and PCs. Reflow is done in
mana pasta solder (a sticky mixture of powdered solder and flux) digunakan secara
temporarily on one or more electrical components in their contact pads and after
The object is heated in a controlled manner at a high temperature so that the solder melts and then
Connect the permanent component legs to the board.
2) Equipment Used
Tools needed in the reflow process;
The picture above is the most standard in carrying out the reflow process, meaning there is
other additions would be better;

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1. Heat Gun.
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Heat Gun is a kind of solder that will later be used for
heat the component to be repaired. You have to buy this tool for example
from Ebay.com the price varies from $29 to $51

2. Aluminium foil.
Aluminum foil is used to protect the motherboard from heat. You can
cut this aluminum foil and fold it several times to make a shield
relatively thick cover.
3. Liquid flux for GPU

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Some vendors suggest that a small amount of flux fluid should be used in
under the chip for better results. There are several videos which
explains how to apply liquid flux under the GPU chip. This video was made
for Xbox 360 motherboards but applies to every laptop motherboard as well.
Visit Amazon to order this tool.
4. Nickel Coin Stack
It is recommended to use a coin stack made of nickel. But by
some vendors are allowed to use other metal coins as long as they are heat resistant
at high temperatures above 250o C. This coin is used as a heat conductor
against the chip from the heat of the heat gun. In reality there are technicians who
using the coin stack and some are not using it. Visit Amazon
to order this tool
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5. Solder Wick
Solder wick is a tool for cleaning the mainboard area where
we open the chipset. It is used with the help of ordinary solder which is pasted on
with a soldering wick on the surface of the chipset socket earlier then rubbed
rub for the process of cleaning the former soldering iron. For details, please
watch the bonus video that I gave. Visit Amazon to order this tool
6. Vacum Tube Suction Chip
This is a special tube that can be used to lift the chip when the lead
the solder is melted and the chip is ready to be removed (see video) Visit Amazon for
order this tool;
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7. Ordinary Soldering.
This ordinary solder is used for soldering certain parts and also for soldering
soldering tin cleaning process as described in point 5 in
on. This soldering iron is very easy to buy at an electronics store.
8. Infrared Temperature Gun
This is a temperature measuring device that uses infrared light.
The goal is to measure the temperature at each reflow process.
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9. Chip Quick SMD Removal Kit.
Basically this tool is a low melting point soldering iron. Used to open
small and simple chips. The trick is to wet all the pins with liquid
in this kit, heat with ordinary solder and then push or
lift chips. This kit comes with about 1m of special solder wire,
flux tissue tube and alcohol to remove flux residue.
10. Solder Removal Ball dan Solder Ball
Solder Removal Ball is a special liquidized spray technology tool. This tool
used to release the solder tin balls on the chipset we already have
open from mainboard. These balls must be removed from the chipset and the chipset must be
we clean including cleaning the surface of the chipset board before the chipset

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reinstalled. To use this tool, please watch the VIDEO first. Whereas
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Solder Balls are the older balls themselves that will replace the older balls
already opened. Solder ball is not used as a scrap.
11. BGA reball kit
This is a tool used to reassemble grid balls or solder
ball on the surface of the board where the chipset will be reinstalled.
3) Reflow Soldering Procedure

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Heating can be done using a special reflow oven or by using a

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infrared lamp or individual soldering incorporating hot air soldering
pencils. Reflow by putting or mounting components onto a circuit board is
the most common method. The purpose of the reflow process is to melt the solder and
heat the surface from one direction, without damaging other electrical components. In the process
conventional reflow, there are usually four stages, called "zones", each
have different thermal profiles:
1. The process of heating (preheat)
The maximum slope is a temperature/time relationship that measures how much
fast changes in temperature on the circuit board board. Heat increase rate
usually somewhere between 1.0 °C and 3.0 °C per second, and often falls between
° °
2,0 C and 3.0 C (4°F to 5°F) per second. If it exceeds the maximum slop level,
Potential damage to components from thermal shock cracking can occur. Solder paste
can also have a splash effect. The preheat part is the process in which the solvent
in the paste begins to evaporate, and if the rate of temperature rise is too low,
evaporation of flux volatiles is incomplete.
2. Flux Activation
The second part, namely Flux Activation usually lasts 60 to 120 seconds to
removes solder paste volatiles and activation of the flux, wherein the components
flux oxide reduction begins at the component leads and bearings. The temperature is too high
or too low may cause solder spatter or balling and oxidation
pastes, attachment bearings and component terminations. Temperature range at this stage
is 150-183o C. Similarly, the flux may not be fully active if the temperature
too low. At the end of the Flux Activation zone the thermal balance of
all component parts should be perfect before the reflow zone. In Flux
Activation is suggested to reduce any T delta between components of
various sizes or if the PCB board is very large.
3. Reflow
The third section, the reflow zone, is also referred to as "time above reflow" or "time
above liquidus" (TAL), and is the part of the process where the maximum temperature
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achieved. One important consideration is the peak temperature, which is

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maximum temperature of the whole process. A typical peak temperature is
20-40 °C above liquidus. This limit is determined by the components on the board
with the lowest tolerance for high temperatures in components susceptible to
thermal damage. A standard guideline is to subtract 5°C from the temperature
maximum of the components most susceptible to maximum temperature
for the reflow process. It is important to monitor the temperature so as not to exceed this limit.
In addition, high temperatures (above 260°C) can cause damage to
internal components as well as the occurrence of foster intermetallic. On the other hand, the temperature which is not
Adequate heat can prevent the paste from reflowing. Temperature range
normal at this stage is 1830 C to 220o C
4. Cooling.
The last zone is the cooling zone to gradually cool the board
or component board and solidify the soldering results. Precise cooling
inhibits the formation of excess intermetallic or thermal shock on
component. Typical temperatures in the cooling zone range are 3-10°C (86-
212°F). Even this cooling rate should run normally. If it's too fast
then the component can be damaged or the work is not optimal. Cooling rate
4°C/s is generally recommended meaning the temperature is lowered by 4oC every second. This is
parameters to consider when analyzing process results.
To be clear, take a look at the image below;

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4) EXAMPLE OF REFLOW SOLDERING
In this example I demonstrate how to reflow Graphic Processor Unit GPU
or a VGA card chip on a laptop. You should combine this example with
watch the video I have included because by just reading your chances
will not understand exactly how it works.
Note: Things you should pay attention to:
1. Check out the video on how to reflow which you can find on www.youtube.com before
you do reflow if you do reflow for the first time
2. You have to be very careful with reflow soldering because of this
has a high risk, but don’t be afraid to use it.
3. When using the Heat Gun, keep your hands steady
which will cause unstable heating
4. When using the Heat Gun, you must hold it tightly, hold it
keep well to avoid falling errors etc.
5. When using the Heat Gun you must rotate the heat gun in rotation
slowly circling the coin stack that is mounted on top of the chipset.

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Let's get started;

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1. Make sure that the chipset is indeed not working and
requires reflow soldering.
2. Please open the laptop case and remove the mainboard from its place, then
place it in the area that you prepared earlier.
3. Remove all the screws that are around the chipset to be repaired, this
in order to avoid conducting excessive heat to other component parts.
4. Open any cover made of plastic in the area around the chipset
which will be repaired.
5. Open all cables from its socket that has plastic wrap (remember
note the location where you opened the cable)
6. Prepare the aluminum foil and protect the other part of the mainboard around the chipset.
First cover the chipset with aluminum foil and then make a square hole
four as big as the chipset. See image below;
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7. Now put some coin stacks on the chipset that will be
repaired;
8. Start heating with the Heat Gun slowly;

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9. First heat the chipset with a heat gun from a distance of about 4 inches
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If using a coin stack then the heat gun is held at a 45% angle...
The purpose of heating is the edge of the chip, then rotating around the side of the chip
others.
10. After concentrating on the coin stack, then about 30-40 seconds later,
slowly bring the heat gun closer to the chip... The heat of the chip should rise slowly.
Never move the heat gun too close to the top of the stack
coin. At this stage the chip should be hot enough to melt the solder balls in the
the bottom of the Chip to return to the contact pads on the Motherboard .. and
this takes quite a while.
You have to be patient at this stage because overheating... will cause
the chip can break and even crack causing it to fail forever...
This process will take about 3 minutes in total...
Note :
I recommend if you are a beginner that you don't do the things below just yet!
At this stage if you are experienced, when the solder ball is ready
melted, you can lift the chipset out of place with tweezers
special. After lifting Chip use Solder Wick to clean
contact points and both chip and motherboard with the help of heating
ordinary soldering iron (see video). If doing this, I recommend Chip Quick SMD
Removal Kits. Then ReBalling with both the chip and the motherboard. For
to do this, you need to add a new solder ball on each pad
contacts on the chip and motherboard. Please be careful that this is not a process
the same ... You need higher heat, You need
uses the conical tip of the heat gun to direct the heat
better, so that you can open the chip... You need a Tube . chip sucker
Suction Chip and pull upwards at the right temperature. You will also need to
cleaning the epoxy used to secure the chip.
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11. OK I assume that you don't remove the chip and just reflow it without
do reball. Now after the 10 points above have been completed for approximately 3
peak warm-up, it's time to turn off Heat Gun... stay away
pile the coins on the chip and let it rest for about 20 more minutes.
12. After the cooling process is complete, clean the heatsink and then reinstall it.
Don't forget to use thermal grease paste on the chip surface
before installing the heatsink.
13. The process is complete and wish you success in your Practice.

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NOTES :
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Once again….watch the video before you practice. There are some things that are difficult to
explain in words and there may even be confusion in reading
my notes above. By watching the video you will be very stoned.
If you need laptop-computer test kits,

please visit this address; http://www.toolsfix.com/
2. Reball Dengan BGA Rework Station
1) Explanation of Reball
Is the same between reflow with reball? It's a bit confusing, doesn't it? The point is
that we re-solder on an SMD component. This is called reflow.
But in the re-soldering process there are times when we replace the grid (ball) or Ball Grid
Arrays (BGA) on components such as CPUs. That's why it's called a re-ball.
The BGA is part of the pin grid array (PGA), which is a package where a portion of the face
chipset covered (or partially covered) with pins in a grid pattern. This Pin channels
electrical signals from the integrated circuit to the printed circuit board (PCB) where it
placed. In a BGA, the pins are replaced with solder balls stuck to the bottom
chip pack. These solder balls can be placed manually or with equipment
automatic. These devices are placed on a PCB with copper pads in a pattern that is
match the solder ball. The chips are then heated, either in a reflow oven or by
an infrared heater, causing the solder ball to melt. Surface tension
causes the molten solder to adhere the chipset to the circuit board, at a distance of
proper separation when the solder tin has cooled and solidified. Ball Grid Array-BGA

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this is an important part of the REFLOW process, that is, if the chipset we are repairing we
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remove from board.
With the increasing density of components on today's electronic circuit boards,
Connectivity on multiple PCBs or circuit boards creates some problems. And
modifications to the PCB layer can't solve many problems. To help
In solving this problem a package of integrated circuits known as Grid
Ball Array, BGA introduced. BGA components provide a much better solution
for many PCBs, but care is required when soldering BGA components to
ensure that the BGA soldering process is correct and that reliability is at least
maintained or further improved.
Ball Grid Array, or BGA, is a very different package than one that uses pins,
like a quad flat pack. The pins of the BGA package are arranged in a grid or small ball pattern. Choice
this is better than using more traditional wire pins for connection, hence
bearings with solder balls are used instead. On a circuit board or PCB,
BGA components are mounted according to a set of copper pads to provide reliable connectivity
needed.
2) BGA Rework Station Installation Instructions
In this opportunity I take an example of how to use BGA Rework
Station (SP360) that exists you can see as below;

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To ensure safety and prevent possible damage
rework station, accuracy is required in installing the rework station on site
in accordance with the following provisions.
• Out of reach of unauthorized persons.
• Install the rework station in a location free from splashing water or other liquids.
• Install the rework station in a location free from the impact of airflow
directly from the Air conditioner, heater or ventilator.
• Install the rework station in a well-ventilated location.
• Install the rework station in a dry location.
• Install the rework station in a location free from excessive dust.
• Install the rework station in a location free from vibration or shock.

• Install the rework station in a stable, level location.

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3) Safety Instructions
• While using the rework station, follow the operation precautions

following:
After turning on the power supply, please turn off the rework station, check
is there any airflow/wind blowing from both i.e. top and
under this air heater. If there is wind blowing, there is no heating, then
the heater will burn out.
• Set different profiles for different BGAs to rework. Temperature

maximum
of each segment of the profile must be less than 300ÿ. See BGA tin reference
for temperature regulation when using lead-free rework.
• Check for perfection of PCB plate soldering-pan PCB and BGA tin one
one by one before BGA installation, check appearance one by one after BGA
soldered, and pause to install the BGA and measure the temperature if it occurs every
abnormal symptoms. Welding/soldering can be continued only after
proper adjustment, otherwise it may damage the BGA or PCB.
• Regularly clean machine surfaces. In particular, keeping and
clean the heating plate surface, and prevent material deposit
contaminated on it. Collection of dirt can affect radiation
proper heat and results in imperfect welding quality
and greatly reduces the heating time.
• Untrained operators cannot change an existing set of parameters.
• Avoid electric fans or other equipment blowing air into the rebuild station
which temporarily works because it can cause a significant increase in temperature
abnormal in the heating zone and thus the partial work will
burnt.
• Maintain a heating zone during startup which could cause a fire or
explosion, place the PCB in the PCB support rack.

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To prevent hands from overheating, please wear gloves

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heat-resistant hands and never touch the high temperature zone when
work.
Do not use flammable liquid or gas sprays, on
each location is close to the rework station while the machine is working.
• Do not remove the front panel or electrical cabinet cover because the electrical cabinet
contains HV (high voltage) components which can cause
electric shock.
In any case if metal or liquid accidentally falls into the rework
station while working, turn off the power immediately and disconnect the power line immediately.
Remove the foreign object after the engine cools down.
NOTES:
Do not clean the IR heater (heating panel) with liquid, stubborn dirt on the
the top can be cleaned off with crocus paper.
4) Know the Parts of BGA Rework Station

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Part Name:
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a) Knob For Micro-Adjusting The Height Of Upper Heater
b) Knob For Locking The Upper Heater In Longitudinal Direction
c) Knob For Locking The Upper Heater From Forward And Backward
d) Knob For Adjusting The Height Of Upper Heater
e) Laser Pointer For Alignment
f) Upper Heater
g) Upper Nozzle
h) Lower Nozzle
i) Lower Heater
j) Option Switch For Bottom IR Heating Panel(Bottom IR Heater)
k) Knob For Adjusting The Height Of Lower Heater
l) Vacuum Pen
m) USB Interface
n) Touch Screen
o) Thermocouple / Wire Sensor
p) PCB Supports Locking Knob
q) PCB Positioning Knob
r) LED Lamp
s) PCB Supporting Bar
t) PCB Clamping Device
u) Bottom Heating Panel(Bottom IR Heater)
v) Cooling Fan
w) Mains Switch
5) Operating Procedure
The operation of the BGA rework PCB must comply with the following procedures:
1. Bakeout:
Between PCB and BGA chip must be heated in a constant temperature oven with

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temperature range 80ÿ~100ÿ for 8 hours~20 hours. The purpose of this burning is
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to dehumidify PCB as well as BGA to eliminate cases of bubble phenomenon
occurs during rework.
Table1 humidity sensibility class:
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2. Clamping Board:
a. Select the upper and lower nozzle suitable for the BGA size
b. The upper nozzle is aimed at the upper head heater, tighten the screw
to tighten the upper nozzle. It can be adjusted position and
BGA angle. Lower nozzle for bottom heating head, tighten
screw to tighten the lower nozzle. Turn the knob for
adjust the nozzle clockwise to lift
or lower the nozzle. This time, tighten the screw to tighten
lower nozzle for its position. See diagram:

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c. Adjust the position of the nozzles, turn the Knob to adjust the heating up and down,
lower the top heater, by turning to adjust the Knob
top heater forward and backward, make sure the upper and lower nozzle core is inside
one line. Then lock the knob for locking the top heater forward &
backwards to make the top heater unable to move forward and
back off again. If necessary turn the top heater, loosen the Knob for
lock the top heater from turning.

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d. Adjust PCB device clamp and PCB support bar, prepare clamp
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from the support bar before placing the PCB on it, then lift the pillar
buffer PCB
(which can be adjusted to the exact position according to the size
PCB) and make it align with the PCB device clamps (which
prevent PCB from
disabled). As shown in the following image:
e. Attach the PCB to the buffer bar, then align the BGA chip with the nozzle
up and down, making the cores in a row. Adjust PCB clamp
until the PCB is clamped properly.
f. Lower the upper heating head, adjust the PCB forward
or backwards, make sure the top nozzle can cover the entire BGA chip,
then lock the position mechanism to clamp. Temporary
adjust PCB clamping device left & right, make sure the whole BGA
The chip is covered by the top nozzle completely, finally lock the mechanism for
clamping position.
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3. Remove/Desolder:
a. Clip the PCB to the stand board, clamp and fix the PCB like what
we are introduced above.
b. Select or set a suitable profile, click "Remove" on the touch screen,
system
will do the soldering process. When the heating is complete, it will
gives an alarm, while a vacuum is available to pick up the chip.
This time, turn the knob to lift the top heating nozzle, immediately
take the chip with a vacuum pen. Release the vacuum pen, the BGA will release
down from the vacuum pen. Heating is complete in 8 seconds (this value is
settable) then the system starts cooling automatically. After
cooling, we can remove the PCB from the stand.
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4. Clean pad: PCB pad and BGA pad should be cleaned in a short time after
desoldering.
0 0
a. Prepare a soldering iron with a temperature of 370 C (for Leadfree chips) and 320 C (for
leaded chip)
b. Apply solder flux with a small even layer to the BGA
c. Clean the solder chip with the special cleaner provided.
d. Clean the pad until it's neat.

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e. Wipe pad: To ensure reliable BGA soldering, clean the pad with
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a number of
as strong a volatile solvent as possible, such as industrial alcohol.
6) BGA Reball
a) Choose the right stencil, reballing kit and solder ball that fits BGA,
place
stencil between the kit frame and the cover, then turn the screw to
lock. (But
do not lock it too tight, so that fine adjustment can be
conducted)
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b) Apply the BGA solder flux evenly, then place the BGA like
picture
below this; adjust location blocks to make BGA diagonals and
diagonal reball kit together, in this case the BGA is located at the center
the reball kit, then lock the block at the indicated point.

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c) Place the cover with the stencil in the kit, then slide the stencil to
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make a hole that fits the BGA pin. In this method is not good for
made stencil holes and BGA pins due to deviation problem.
d) Adjust the distance between the BGA and the stencil. By adjusting Screw
adjustment
the distance between BGA and stencil, we can make the distance between BGA and
the stencil is about 2/3~3/4 of the diameter of the ball. Make sure one hole for
passed one ball arar easier to pick up the stencil.
e) First, test the size of the solder ball whether it is suitable between the chip and the stencil,
second
place on the stencil as shown in the following picture, then
shake whole kit
light enough to let the ball fall onto the BGA chip through the stencil's hole.
Finally
check that each pin has been reballed (make sure no pins are missing).
f) Make changes to other BGA chips with solder ball sizes that are
different, please
repeat step ad.
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7) BGA Reball Soldering
a) Prepare solder station for reball BGA soldering, set solder station
on
Temperatures at 230 ÿ for Leadfree BGA and 250 ÿ for Leadfree BGA
b) After setting the temperature, start the soldering station and wait for the temperature to reach
requested value and at constant temperature.
c) When the temperature is constant, place the reballed BGA into the soldering station
with high temperature paper, then use a heat gun (hot air pump)
as a heating assistant from the top surface.
d) When the balls melt, they become liquid with a bright color and
line up. Also
will emit smoke. Notice this, stop heating and take it

The BGA is from the soldering station.

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8) Apply solder flux:
a) For solder quality assurance, make sure that the PCB pad is free from dust
before
applying solder flux. It is best to wipe the pad before
apply solder flux every time.
b) Apply a layer of solder flux on the PCB solder pad with a brush. Too
many
flux can cause the ball to short circuit, but if it is better to
easily cause solder to be lost. So the solder flux layer should be
with the right amount so that it can remove dust and material
foreign from the BGA ball tin and tighten the welding effect.
9) Relocation:
a) Lay the PCB on the table, place the reballed BGA onto the PCB manually.
b) Align the BGA pad with the PCB pad with reference to the screen frame.
c) Note that the directional markings on the BGA must match those on the PCB.
10) Solder:

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a) Clip PCB with newly placed BGA, test BGA alignment and
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PCB, adjust with buffer.
b) Set or select proper profile according to PCB type, and select "Soldering"
on
touch screen, it will do the soldering process. After finishing, then
this device will give an alarm and cooling will start immediately.
(coolant time can be set in profile). Then lift the top heater and
move it. When cooling is complete, take out the PCB from the machine.
Note: The difference between Solder and Remove process is the way of cooling,
i.e. cooling starts right after soldering is complete, but on remove
cooling starts 8 seconds (settable time) after the remove process is complete.
3. Replacing Electronic Components With Manual Techniques

Actually there are many electronic components on the motherboard that
can be damaged at any time and must be replaced. In this tutorial, I will
provides a way to replace the 3 vital components in the hope of representing
other components. Components will be easy for you to replace after going through this process.
1. Replacing the Capacitor
Arguably the easiest component to replace on the Motherboard
is a capacitor. Why? Because it has a capacitor body handle
which can be withdrawn when it is finished desoldering. Take steps
following steps:
1) Prepare the Motherboard whose capacitors will be replaced.
2) Make sure the capacitor to be replaced has been observed correctly and is
easy to replace.
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3) First clean around the legs of the capacitor to be replaced.
4) Heat the capacitor feet with solder and add soldering tin
to make heating easier.

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5) After the solder melts, suck it with the desolder pump that has been prepared.
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You
6) After the solder is removed, please remove the capacitor from the
the place.
7) Clean the solder container on the PCB
8) Replace the capacitor with a new one and then solder the legs.
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9) Cut off unused capacitor legs for tidying
10) Process completed
2. Replacing the Transistor
If you look at how to install transistors on the motherboard, then there are:
There are two kinds, namely those whose feet are directly soldered to the circuit board on the
the same side as the transistor body and other transistors are the legs
will penetrate the circuit board and be soldered on the other side.
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1) For the first type I mentioned the example is a picture

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under this
2) Please solder the legs and you can lift them directly from the board
after the tin has melted.
3) For large transistors like the picture below, you can open
with the same method on the capacitor and then replace it
with a new one.
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4) Another way to open the used solder on transistors other than
using a desolder pump is to use a solder wick.
The trick is to stick a soldering wick and press it with hot soldering iron
and run a bit of soldering tin to be opened. After melting,

transistor can removed.
4. Replacing Surface Mount Technology (SMT) Components
IC is a component that uses Surface Mount Technology
(SMT) or for its components commonly called Surface Mount Device (SMD).
It can be said that the most difficult to replace is the IC, let alone the internal chip

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large scale. On this occasion we will open IC chips manually

191
traditional and then replace it with a new one.
Method :
The fact that it is more difficult to open IC chips than
install and re-solder. Let's use these various methods:

a. Method 1 Use Small Wire
Use fine iron wire for this method. We assume that the IC which
it's broken, it won't be used anymore, so the legs are not even
no problem. Here's how:
1) Use a strong, smooth wire, then tie it to one
component firmly near the IC leg to be opened.
2) Run the wire under the pin between the IC leg and the body. See
picture below;
3) From the picture above, heat the top pin leg and after
the tin is melted, please pull the top end of the wire with
be careful until the pin detaches from the board
4) Repeat step 3 above until all pins are out of place
on all sides of IC
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192
b. Metode Solder Wick
In this method we use a solder wick built with a soldering iron
to heat the IC legs.
1) Place a piece of solder wick on the lead of the IC legs to be
opened. See image below;
2) Use a hot soldering iron, paste it over the solder wick and
then rub gently around the feet of the IC until the tin
melts and the pin is free of lead;
3) Do step 2 until all the leads are clean, and the IC is ready
lifted.
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Soldering the Integrated Circuit:

193
Although earlier I said disassembling the IC is more difficult than installing
but in soldering the IC chip you still have to be careful. It's a little more difficult
than a two-pin device, but it's not that hard either.
1) With solder and tin, please bond a little solder tin above
the surface of the board where the pins will be soldered. See the image below;
2) Provide flux over all the bearings of the IC to be soldered. But you
may need to be careful and not too much. Just one or two spreads
on the surface to be soldered later. View image;

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3) Place the chip correctly on the PCB, don't forget to pay attention to the location of the
194
number 1 leg, and please solder one of the legs and make sure the chip is in the right
position then soldering continues.
4) Continue soldering until all pins are finished
5) Check the work again and make sure there are no electric shocks
short, short circuit alias shorting.

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CLOSING 195
Finally I have to say no human is perfect, neither is it
This ebook which is man made. If with this ebook you succeed, that's it
not because of my service but because you do serious practice. If you
failed after buying this ebook, it's also not my fault because of the contents of this ebook
I have practiced the tutorial and it works.
So far I've explained to you, I don't know exactly if you
has captured 192 pages of this ebook content but your practice will do it
prove. I'll be with you but it's your hard work that counts
determine.
While maybe I already made this ebook and you followed,
but there are certain things you will encounter in the field that I haven't
get. Questions from you will always add to the contents of this ebook to
to the better.
Send regards for success !!!

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Laptop Motherboard Repair

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Laptop Motherboard Repair

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Machine Translated by Google Qbonk Media Group

Dissecting laptop motherboard

Dissecting Laptop Motherboards. Laptop Motherboard Repair is

terrible thing for a group of people. And it deserves to be acknowledged

disassemble the permanent components on the motherboard. Most beginner tennis

medium when the damage leads to the Motherboard, it is immediately recommended

just replace the motherboard. If so then it is means buy

new computer in terms of price.

If so why don't we try fixing this Motherboard? One of

and requires sophisticated equipment to do it.

Another obstacle is that replacing can be easy once you find

damage, but the problem is how do we know which component on

radio and tv repairman, I try to analyze, learn and practice and

Finally, this ebook was born as an addition to the previous ebook.

Send regards for success

Qbonk Media Group

www.qbonk.org Attention!!! This ebook is only sold online at www.dpcworld.com www.agussale.com

Copyright © 2013 by Qbonk Media Group

copyright so that no part of this ebook may be reproduced or

transmitted in any form, electronic or mechanical, including photocopying,

recording, or transmission by information storage or retrieval systems without representation

written permission signed by the author.

including the content, ideas, and expressions contained in this ebook.

Readers are expressly warned to consider and do

inaccuracies, omissions or inconvenience to anyone resulting from the information

is potentially dangerous when disassembled.

www.qbonk.org Attention!!! This ebook is only sold online at www.dpcworld.com www.agussale.com

CHAPTER 1 INTRODUCTION ABOUT THE LAPTOP MOTHERBOARD

CHAPTER 2 ELECTRONICS COMPONENTS ON MOTHERBOARD

12. Opportunity to Measure Components Directly on the Motherboard

CHAPTER 3 READING MOTHERBOARD DIAGRAM AND SCHEMATICS

1. Explanation of 6 Dominant Chips on Laptop Motherboards 2. Reading

4. How to Read Motherboard Schematics

CHAPTER 4 LOOKING FOR VOLTAGE MEASUREMENT POINTS ON MOTHERBOARD

1. Multimeter and its Functions and How to Use 2. Finding the

CHAPTER 5 Analysis of the Distribution of Resources on Laptop Motherboards

1. Main Voltage Source Distribution Process 2.

CHAPTER 6 LOOKING FOR MOTHERBOARD DAMAGE WITH SCHEMATICS AND

1. Laptop No Power Or Totally Dead

2. There is power but the laptop doesn't start

3. Laptop Starts Then Turns Off In A Few Seconds

4. Laptop Turns On But No Display

5. Motherboard Not Recognizing Hard Disk

6. RAM Memory Not Working

7. The Battery Can't Be Charged

8. Keyboard-Touchpad Not Working

9. USB Port Not Working

CHAPTER 7 LEARN TO REPLACE MOTHERBOARD COMPONENTS

INTRODUCTION ABOUT LAPTOP MOTHERBOARD

1. Laptop Motherboards at a Glance

Laptop systems come to market in thousands of shapes and sizes. Motherboard

www.qbonk.org Attention!!! This ebook is only sold online at www.dpcworld.com www.agussale.com

through the connectors installed on the system board or via cables. In a

cannot be easily replaced without soldering, for example:

1) Hard drive connector (HDD).

2) CD / DVD drive connector.

3) Memory (RAM) slot.

6) Audio (headphone and microphone) jack.

7) Roda Volume Control.

9) Eithernet (RJ45 alias jaringan) port.

10) IEEE 1394 (Fire Wire) port.

11) Video chip and some other components and ports.

every case is different so you have to do some judgment.