Microelectronics International

Finite element model updating of board-level electronic packages by factorial analysis and modal
measurements
Mohammad Gharaibeh,
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Mohammad Gharaibeh, (2018) "Finite element model updating of board-level electronic packages by factorial analysis and
modal measurements", Microelectronics International, Vol. 35 Issue: 2, pp.74-84, https://doi.org/10.1108/MI-12-2016-0086
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 Finite element model updating of board-level
electronic packages by factorial analysis and
modal measurements
Mohammad Gharaibeh
Department of Mechanical Engineering, Hashemite University, Zarqa, Jordan

Abstract
Purpose – One difficultly in building an effective finite element (FE) model of a board-level package is because of complex structure of the printed
circuit board (PCB), as it contains copper layers, woven fabrics, plated-through holes and so forth. Therefore, it is often acceptable to obtain
equivalent orthotropic material properties and use them in the simulation. This paper aims to provide a research methodology to produce equivalent
FE models for board-level electronic packages.
Design/methodology/approach – In this methodology, the FE models’ data were correlated with experimental modal analysis results in terms of
natural frequencies and mode shapes. Statistical factorial analysis was used to examine the electronic assembly material properties effect on the
structure’s resonant frequencies. The equivalent material properties of the PCB were adjusted using the optimization tool available in ANSYS
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software for free boundary conditions. The equivalent FE model was then validated for the fixed boundary conditions.
Findings – The resultant FE models were in great match with the measured data in terms of resonant frequencies and mode shapes. The so-
developed models can be further used in the analysis of the dynamic response of the electronic packages and solder interconnects.
Originality/value – The current approach provides a sophisticated research methodology to provide high-accuracy FE models of electronic
assemblies subjected to vibration. The main value of this approach is to first test the effect of each material property on the package dynamic
characteristics before starting the correlation process, then to automate the correlation algorithm using the built-in FE model updating feature
available in ANSYS software.
Keywords Finite element analysis, Electronics packaging, Finite element model updating, Modal analysis
Paper type Research paper

Introduction acceptable to obtain equivalent orthotropic material properties

Vibration loading can be exerted on an electronic assembly
during shipping, handling, manufacturing and end-use.
Therefore, vibration-induced solder joint reliability assessment in
electronic packaging has become a major concern in the industry.
For this reason, researchers developed several methodologies and
techniques to predict the solder joint fatigue life experimentally
and via computer simulations (e.g. finite element [FE] methods).
Although it is a numerical technique with approximate solutions,
the FE method has been shown to be an effective tool to
characterize the dynamic response of printed circuit boards
(PCBs) and for the evaluation of stress induced in the solder
joints (Gharaibeh et al., 2013a, 2013b, 2013c, 2016).
One difficultly in building an effective FE model of a board-
level package is because of complex structure and range of
geometric scale of the various parts. For example, the PCB
contains copper layers, woven fabrics, plated-through holes and
so forth (Su et al., 2014; Gharaibeh, 2015). In addition to the
modeling demands of including such details, the mechanical
behavior will typically be non-isotropic. Therefore, it is often
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and use them in the simulation. Similar complexities arise from
modeling of the package and solder joints. Consequently,
approximations and simplifications of both the geometry and
material properties are often exploited to reduce the complexity
of the resulting FE models in the dynamic response simulations
of electronic assemblies (Yeh and Lai, 2006; Yeh et al., 2007).
The vibration characteristics derived from modal analysis
(natural frequencies and mode shapes) were widely used by
researchers to validate their FE models for electronic assemblies
subjected to harmonic and random vibrations (Pitarresi, 1990;
Pitarresi et al., 1991; Pitarresi and Akanda, 1993). Most of the
old methodologies were based on trial-and-error approach of
changing the material properties of the electronic assemblies,
The author would like to acknowledge the deanship of scientific research at
The Hashemite University for the financial support of this study. Also, the
author thanks Binghamton University for their willingness to use their
research labs to conduct the current wok.
The author wishes to sincerely thank Professor Quang T. Su from the
Department of Mechanical Engineering of State University of New York at
Binghamton for his precious help and superior guidance throughout this
research. Also, special thanks go to the Deanship of Scientific Research at the
Hashemite University for providing necessary tools to complete this work.

Received 12 December 2016

Microelectronics International
Revised 22 March 2017
35/2 (2018) 74–84 18 April 2017
© Emerald Publishing Limited [ISSN 1356-5362] 30 April 2017
[DOI 10.1108/MI-12-2016-0086] Accepted 3 May 2017

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 Finite element model updating
Mohammad Gharaibeh
mainly PCB and component in-plane elastic and shear moduli
(Pitarresi and Primavera, 1992). For drop test modeling, two
simplified modeling techniques were developed based on the
correlating natural frequencies and mode shapes: global property
smearing and simple block modeling. In the global smeared
property technique, the whole electronic structure was converted
to a bare PCB having the same equivalent stiffness and mass of
the actual assembly. In simple block modeling, the component
and solder interconnects were considered as one block with the
same equivalent stiffness and mass (Pitarresi et al., 2002, 2004).
The same Pitarresi’s procedures were followed in the process of
evaluating the high-cycle fatigue life of electronic assemblies
under random vibrations using FE models (Yu et al., 2011).
Statistical methods, i.e. Taguchi method, were used to obtain the
equivalent orthotropic properties, in-plane elastic and shear
moduli, as well as mass density, of the FE models to provide best
fit between FEA results and the experimental observations based
on reducing the relative error between measured and FE natural
frequencies (Zhang et al., 2008; Zhang et al., 2010).
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Experimental modal analysis was performed to produce
equivalent FE models that characterizes the dynamic response of
board-level electronic packages (Lee et al., 2008). FE models of
thin quad flat pack electronic assemblies were tuned by
minimizing the error between natural frequency data from modal
test and FEA using the eigenvalue sensitivity approach
(Zandipour and Jalali, 2014). In a much simplified approach, FE
models of test vehicle were correlated with measured natural
frequency data in which they modeled the component as a point
mass attached to PCB (Wong et al., 1991; Guoquan et al., 2014).
In summary, most of the correlation methodologies provided in
literature were based on the differences between the measured
and simulated natural frequencies only and were based on the
trial-and-error approach. No previous work includes the
discrepancies between experimental and FE mode shapes which
could lead to erroneous findings.
Therefore, objective of this paper is to provide a research
methodology for developing equivalent FE models of board-level
Figure 1 Test vehicle details
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electronic packages. The primary tool for achieving this result,
unlike the previous approaches in literature, is to correlate the FE
results with measured data in terms of both natural frequencies
and mode shapes (eigenvalues and eigenvectors). In this
methodology, statistical factorial analysis was first used to
examine the material properties with significant effect electronic
structure natural frequencies and mode shapes. A FE model
updating algorithm was then established to automatically
optimize the material properties of the equivalent FE model
based on minimizing the differences between measured and FE
simulated natural frequencies and mode shape data at free and
fixed boundary conditions (BCs). Such equivalent FE models
can be trustfully used in the study of the dynamic response of the
electronic assembly and solder interconnects.
Test vehicle description
The test vehicle used the current paper, as depicted in Figure 1,
is a 76.2
76.2
1 mm3 PCB with a centrally mounted 30

30
1.5 mm3 dummy component having 500 m m height and
750 m m diameter SAC305 BGA solder joints. I/O: 256 count
20
20, 4 row perimeter array with a pitch distance of 1.27 cm.
Modal analysis setup
The natural frequencies and mode shapes of the current test
vehicle were measured using modal analysis with hammer
testing experiment shown in Figure 2. This setup consists of
National Instruments data acquisition system (NI-DAQ 4413),
an Integrated Circuit Piezoelectric impact hammer (Model
086E80) and a light-weight accelerometer (PCB Piezotronics
352C23) along with a test specimen and a personal computer.
A grid of equally spaced, 7
7, measurement points was drawn
on the PCB. Then the impact hammer was used to tap the test
specimen at each measurement location while holding the light-
weight accelerometer at a fixed grid location. Afterward, the
transfer function between the output acceleration to the input
 Finite element model updating Microelectronics International
Mohammad Gharaibeh Volume 35 · Number 2 · 2018 · 74–84

Figure 2 Modal analysis with hammer testing experiment
force was acquired using the DAQ device. Finally, Spectral
Dynamics STAR Modal version 7.0 was used to generate the
modal characteristics of the tested configuration.
In this experiment, two BCs schemes were considered: fixed
and free BCs. For fixed configuration, the test vehicle with
facing down component was attached to aluminum fixture
standoffs at four screw holes. For consistency purposes,
mounting screws were carefully tightened using a torque
wrench at a constant target torque of 0.5 N.m. The free BCs
were approximated by hanging the test assembly with a fishing
line. Figure 3 shows both tested BCs.

Finite element modeling

In the present work, ANSYS Release 15.0 was used in
constructing the FE model, which shown in Figure 4, of the
previously described test board. In this model, a 3-D hexahedron
ANSYS element type (SOLID185) was selected to generate the
mesh of the PCB, component and solder joints, as well as copper
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Figure 3 Tested BCs

Figure 4 FE model

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pads. As stated previously, the complicated structure of the PCB
including but not limited to the copper layers, plated-through-
holes and vias was not considered in this equivalent FE model. As
our discussion is limited to vibration, only linear elastic material
system was considered to define the material properties of the test
assembly structure. The ANSYS modal analysis was used to
solve for the natural frequencies and mode shapes.
The mesh density adequacy of the current FE model was
tested by considering five mesh levels from 1 to 5 where 1 is the
coarsest and 5 is the finest, as listed in Table I.
For each mesh level, the first natural frequency is computed
from FE modal analysis, recorded and compared to next finer
mesh first natural frequency value. The results are shown in
Figure 5. Apparently, at mesh level 3 the first resonant
frequency has reached a converged value with an error less than
0.5 per cent compared to the next mesh level value. Therefore,
mesh level 3 (with 194K elements) was selected for further
analysis of the current FE model.
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the component in-plane elastic modulus (ECMP), in-plane shear
modulus (GCMP) and in-plane Poisson’s ratio (
CMP). Two
levels, low and high, for each material parameter were tested in
this study, as summarized in Table II. Here, care was taken to
cover a wide range of each material property.
To focus on the influence of the material parameters and to
eliminate the uncertainty of the BCs, no constraints were
applied to the FE model (free BCs). In the current analysis, 64
ANSYS modal analysis simulations were executed for each
material properties combination. The natural frequencies of
the first six modes were collected and recorded. Using
MINITAB version 16.0, factorial analysis was performed and
the results are shown in Figure 6.
Apparently, only the PCB material properties (EPCB, GPCB
and
PCB) have significant effect on the test assembly’s first six
natural frequencies. Also, the component material properties
(ECMP, GCMP and
CMP) have nearly no influence on the
system resonant frequencies. Therefore, and based on this

discussion, only the board material parameters will be

Statistical factorial analysis considered in the optimization process, as will be shown in the
next section.
To determine the dominant material properties that have a
significant effect on the test assembly natural frequencies and
mode shapes, a factorial analysis experiment was conducted. FE model updating
The material properties examined in this statistical experiment The FE model material properties automatic updating process
are the PCB in-plane elastic modulus (EPCB), in-plane shear was entirely implemented in ANSYS using its built-in
modulus (GPCB) and in-plane Poisson’s ratio (
PCB), as well as
Table II Material parameter levels used in factorial analysis
Table I Mesh density study details
Material parameter Low High
Mesh level Number of elements Natural frequency (Hz)
EPCB(GPa) 20 30
1 61,732 489 GPCB(GPa) 6.0 12
2 122,899 395 mPCB 0.1 0.4
3 194,007 311 ECMP(GPa) 20 30
4 240,731 310 GCMP(GPa) 6.0 12
5 309,546 309 m CMP 0.1 0.4

Figure 5 Mesh convergence study results

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Figure 6 Factorial analysis results for the effect of the material parameters on the natural frequency of (a) 1st mode (b) 2nd mode (c) 3rd mode (d) 4th
mode (e) 5th mode and (f) 6th mode
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optimization tool. In this tool, ANSYS categorizes three types

of variables for design optimization: design variables (DVs),
state variables (SVs) and objective function (OF). DVs are the
independent variables that directly affect the design objective
Table III Initial and updated material properties of the FE model and they are needed to be modified, or updated, throughout the
PCB optimization process. In the current paper, the PCB material
Material PCB initial updated
property SAC305 Component properties properties
Table IV Natural frequencies results for free BC’s
In-plane 51.0 22.0 18.0 27.0
Mode Experiment natural Updated FE model natural (%)
Elastic
number frequency (Hz) frequency (Hz) Error
Modulus
(GPa) 1 509 510 0.20
In-plane – – 6.20 8.40 2 608 615 1.15
Shear 3 743 733 1.35
Modulus 4 1,039 984 5.29
(GPa) 5 1,072 984 8.21
In-plane 0.36 0.28 0.14 0.27 6 1,777 1,687 5.06
Poisson’s 7 1,926 1,791 7.01
ratio 8 2,091 1,937 7.36
Density 7400 2400 3000 3000 9 2,627 2,382 9.62
(kg/m3) 10 2,966 2,884 2.76

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Figure 7 Mode shapes from experiment and FEA for free BCs
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Figure 7
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properties (EPCB, GPCB and
PCB) are the DVs. These variables 20 GPa  EPCB  35 GPa
were constrained within a lower and upper bound values that 6 GPa  GPCB  15 GPa (1)
cover a feasible material properties range, as (Zhang et al.,
0:1 
PCB  0:4
2010; Gharaibeh et al., 2016):

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The SVs are the independent variables that change
because of the DVs change (i.e. natural frequencies).
These SVs are considered as design constrains. Here, the
SVs are defined to be the percentage error between the
experiment and numerical natural frequencies of each
mode (Efi ), as:

i
especially for the first four modes (less than 2.5 kHz) and for the

l exp  l iFEA

Efi ¼



100%

(2)
l iexp
Where l iexp and l iFEA are the ith natural frequency from
experiment and FEA, respectively. The value of (Efi ) was
restrained to be between 0.01 per cent and 15 per cent.
Lastly, OF is the one variable in the updating process that
needed to be minimized. In the current analysis, OF was
selected to be in a form that reflects the discrepancies between
FE and measured resonant frequencies and mode shapes
(Merce et al., 2007):
X m !2 Xm
l iexp  l iFEA
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Free boundary conditions
Natural frequencies and mode shapes from experiment and the
updated FE model were collected and compared. Table IV lists
the first ten natural frequencies (less than 3 kHz) from experiment
and from the updated FE model. The results of this table show
good agreement between the measured and simulated frequencies
higher modes the percentage error is not more than 10 per cent.
To further validate the updated FE model, the first ten
experimental and theoretical mode shapes were compared in
terms of the MAC number, as shown in Figure 7.
Apparently, results show well agreement between mode
shapes from both the solutions especially for the first four modes
and 8th mode with a MAC number higher than 0.9. However,
lower agreement for the other modes with a MAC ranges from
0.4 to 0.9. In summary, the so-updated FE model for the free
BCs problem is faithfully able to predict the dynamic properties
of the actual test assembly especially for first few lower modes
and it can be used for further correlation analysis, i.e. fixed BCs.

OF ¼ ai 1 b i Mi (3)
i¼1
l iexp i¼1 Fixed boundary conditions
where ai and b i are weighting factors for the ith eigenvalues and The recently updated FE model was correlated with
eigenvectors, respectively. They were selected as ai = 0.5 and measurements for the fixed BCs’ case. To simulate the actual
b i = 0.5. The mode shape related function (Mi) is expressed as BCs used in modal analysis experiment, the FE model was
(Moller and Friberg, 1998): constrained at the four screw-hole locations at the top and the
bottom of the PCB in all directions. The fixed area in the FE
 pffiffiffiffiffiffiffiffiffiffiffiffiffi2 models is equal to that fixed by the standoffs, screws and
1  MACi
Mi ¼ (4) washers in the modal testing experiment. The constrained
MACi
structure natural frequencies and mode shapes were then
where MACi is the modal assurance criterion between the obtained from experiment and FEA. The natural frequency’s
experimental and numerical ith mode shapes (Moller and and mode shapes’ (less than 2.5 kHz) results are summarized in
Friberg, 1998): Table V and Figure 8, respectively.
The tables show that the numerical natural frequencies and
  2
h    i jf f gj T f ^ j mode shapes are in well-agreement with the measured ones,
^
MAC f f gj ; f k ¼  k   (5) especially for the first five modes. The overall error in natural
^
f f gj f f gj f k T f
T ^
k frequencies was less than 5 per cent and MAC for the first six
modes is greater than 0.8.
where: Therefore, the presented FE model updating methodology
{ f }j: is the measured mode shape vector from j = 1 to j = no. produced, compared to experimental data, accurate FE models
of 
mode shapes. that faithfully simulate the dynamic properties of the electronic
^ : is the FE mode shape vector from k = 1 to k = no. of
f assembly.
k
mode shapes.
A well-written ANSYS parametric design language (APDL) Conclusions
program was used to implement the previously described
updating process. As stated earlier, and to focus on updating only This paper has presented a research methodology to produce FE
material properties, no constrains were applied on the assembly models for board-level electronic packages based on correlating
FE model (free BCs). ANSYS gradient approximation method the FE models with experiments in terms of natural frequencies
with random design generation were considered. and mode shapes. Statistical factorial analysis was used first to

Table V Natural frequencies results for fixed BC’s

Results and discussions
Mode Experiment natural Updated FE model natural (%)
Material properties number frequency (Hz) frequency (Hz) Error
As mentioned previously, the current work aims to produce
1 540 540 0.00
equivalent FE models with equivalent orthotropic material
2 961 965 0.40
properties. Table III shows the initial and updated PCB material
3 1,011 965 4.55
properties of the test assembly. The PCB density was not included
4 1,321 1,284 2.80
in the updating process, as it was calculated using simple physics
5 1,593 1,626 2.07
equation Density = Mass/Volume. These updated material
6 2,092 2,128 1.72
parameters were used to extract the FE model natural frequencies 8 2,480 2,422 2.34
and mode shapes for free and fixed BCs, as will be shown next.

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Figure 8 Mode shapes from experiment and FEA for fixed BCs
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Mohammad Gharaibeh
Figure 8
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examine the material properties with significant effect on the
assembly dynamic characteristics. Then, the built-in ANSYS
optimization tool was used to perform the automatic updating on
the previously determined material parameters. Results for both
free and fixed BCs cases were in well-agreement with the
experimentally measured data especially for the low frequencies.
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These well-correlated FE models can be further used in the study
of the dynamic response of the electronic assembly and the solder
interconnects. As a recommendation for future work, the mode
shape correlation accuracy could be improved by using more
sophisticated measurement techniques, such as laser vibrometer
measurements.
 Finite element model updating
Mohammad Gharaibeh
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Corresponding author
Mohammad Gharaibeh can be contacted at:
mohammada_fa@hu.edu.jo