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3AR10080CJZ DS v02 - 00 en
3AR10080CJZ DS v02 - 00 en
0 , 1 1 Ja n 2 01 2
N e v e r s t o p t h i n k i n g .
CoolSET®-F3R80
ICE3AR10080CJZ
Revision History: 2012-1-11 Datasheet Version 2.0
Previous Version: 0.1
19 Revise typo in tie up resistor at BRL pin to disable brownout feature.
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Edition 2012-1-11
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 1/11/12.
All Rights Reserved.
Attention please!
The information given in this data sheet shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
®
ICE3AR10080CJZ
Snubber Converter
CBulk DC Output
85 ... 270 VAC
-
CVCC
VCC Drain
Startup Cell
Power Management
PWM Controller
Current Mode
CS
Precise Low Tolerance Peak CoolMOS®
Current Limitation
RSense
FBB
RBO1 Control Active Burst Mode CoolSET®-F3R80
Unit (Brownout & CCM)
Rsel
GND
Auto Restart/ Latch
Brownout mode
RBO2 BRL Mode
Type Package Marking VDS FOSC RDSon1) 230VAC ±15%2) 85-265 VAC2)
ICE3AR10080CJZ PG-DIP-7 3AR10080CJZ 800V 100kHz 10.0W 22W 15W
1)
typ @ T=25°C
2)
Calculated maximum input power rating at Ta=50°C, Ti=125°C and without copper area as heat sink.
GND (Ground)
Figure 1 Pin Configuration PG-DIP-7 (top view) The GND pin is the ground of the controller.
2 Representative Blockdiagram
CoolMOS ®
3.1 Introduction
ICE3ARxx80CJZ brownout and CCM 800V version is
an enhanced version of the CoolSET®-F3R80. The Power Management
latch enabled, fixed voltage brownout detect and Latched Off Mode 10.5V
Reset; V VCC < 8V or
voltage detect for the burst selection. It is particular AC fast reset is
good for high voltage margin low power SMPS triggered
Latched Off Mode. This is done usually by re-cycling In case the amplified current sense signal exceeds the
the AC line. FBB signal the on-time ton of the driver is finished by
When Active Burst Mode is entered, the internal Bias is resetting the PWM-Latch (Figure 5).
switched off most of the time but the Voltage Reference The primary current is sensed by the external series
is kept alive in order to reduce the current consumption resistor RSense inserted in the source of the integrated
below 620mA. CoolMOS®. By means of Current Mode regulation, the
secondary output voltage is insensitive to the line
variations. The current waveform slope will change with
3.3 Improved Current Mode the line variation, which controls the duty cycle.
The external RSense allows an individual adjustment of
Soft-Start Comparator the maximum source current of the integrated
CoolMOS®.
To improve the Current Mode during light load
PWM-Latch conditions the amplified current ramp of the PWM-OP
FBB is superimposed on a voltage ramp, which is built by
C8 R Q
the switch T2, the voltage source V1 and a resistor R1
Driver (see Figure 6). Every time the oscillator shuts down for
maximum duty cycle limitation the switch T2 is closed
S Q by VOSC. When the oscillator triggers the Gate Driver,
T2 is opened so that the voltage ramp can start.
0.6V
0.6V
Driver
Voltage Ramp
t
5V
R SoftS
SoftS SoftS
Soft Start
Soft Start finish
Soft Start
Soft-Start
Com parator
G ate Driver
C7 &
Soft Start 32I 8I 4I 2I I
G7 Counter
0.6V
V SoftS
t Soft-Start
V SOFTS32
V S o ftS
t
V S o ftS 2
Gate
V S o ftS 1 Driver
t
Figure 11 Soft Start Phase
When the VVCC exceeds the on-threshold voltage, the Figure 13 Gate drive signal under Soft-Start Phase
IC starts the Soft Start mode (Figure 11).
Clock
Frequency
V FB t Jitter
4.5V
Soft Start
Block FF1
V OUT t
S Gate Driver
Soft Start 1
Comparator R &
V OUT G8 Q
PWM G9
t S tart-U p Comparator
Current
t Limiting
CoolMOS®
Figure 14 Start Up Phase
Gate
The Start-Up time tStart-Up before the converter output
voltage VOUT is settled, must be shorter than the Soft-
Start Phase tSoft-Start (Figure 14). By means of Soft-Start Figure 15 PWM Section Block
there is an effective minimization of current and voltage
stresses on the integrated CoolMOS®, the clamp circuit 3.5.1 Oscillator
and the output rectifier and it helps to prevent The oscillator generates a fixed frequency of 100KHz
saturation of the transformer during Start-Up. with frequency jittering of ±4% (which is ±4KHz) at a
jittering period of 4ms.
A capacitor, a current source and current sink which
determine the frequency are integrated. The charging
and discharging current of the implemented oscillator
capacitor are internally trimmed in order to achieve a
very accurate switching frequency. The ratio of
controlled charge to discharge current is adjusted to
reach a maximum duty cycle limitation of Dmax=0.75.
Once the Soft Start period is over and when the IC goes
into normal operating mode, the switching frequency of
the clock is varied by the control signal from the Soft
Start block. Then the switching frequency is varied in
range of 100KHz ± 4KHz at period of 4ms.
50 Vcsth
C10 LEB
S4
220ns
Gate PWM-OP
&
LEB
CoolMOS® 180ns
G6 C12
VCSth_burst
Propagation-Delay
Gate Driver Compensation-Burst
Active Burst
Mode
Figure 16 Gate Driver or
The driver-stage is optimized to minimize EMI and to G8
provide high circuit efficiency. This is done by reducing VFB_burst C5 10k 1pF
the switch on slope when exceeding the integrated D1
CoolMOS® threshold. This is achieved by a slope
control of the rising edge at the driver’s output (Figure
17) and adding a 50W gate turn on resistor (Figure 16). CS
FBB
Thus the leading switch on spike is minimized.
Figure 18 Current Limiting Block
There is a cycle by cycle peak current limiting operation
(internal) realized by the Current-Limit comparator C10. The
VGate source current of the integrated CoolMOS® is sensed
via an external sense resistor RSense. By means of
RSense the source current is transformed to a sense
voltage VSense which is fed into the pin CS. If the voltage
typ. t = 160ns VSense exceeds the internal threshold voltage Vcsth, the
comparator C10 immediately turns off the gate drive by
4.6V resetting the PWM Latch FF1.
A Propagation Delay Compensation is added to
support the immediate shut down of the integrated
CoolMOS® with very short propagation delay. Thus the
t influence of the AC input voltage on the maximum
output power can be reduced to minimal. This
Figure 17 Gate Rising Slope compensation applies to both the peak load and burst
Furthermore the driver circuit is designed to eliminate mode.
cross conduction of the output stage. In order to prevent the current limit from distortions
During power up, when VCC is below the undervoltage caused by leading edge spikes, a Leading Edge
lockout threshold VVCCoff, the output of the Gate Driver Blanking (LEB) is integrated in the current sense path
is set to low in order to disable power transfer to the for the comparators C10, C12 and the PWM-OP.
secondary side. The output of comparator C12 is activated by the Gate
G6 if Active Burst Mode is entered. When it is activated,
the current limiting is reduced to Vcsth_burst. This voltage
level determines the maximum power level in Active
Burst Mode.
IOvershoot1
t
Figure 20 Current Limiting
The overshoot of Signal2 is larger than of Signal1 due
to the steeper rising waveform. This change in the Figure 22 Overcurrent Shutdown
During IC first startup, the Refgood signal is logic low 3.7.1.3 Working in Active Burst Mode
when Vcc<8V. The low Refgood signal will reset the After entering the Active Burst Mode, the FBB voltage
Burst Mode level Detection latch. When the Burst Mode rises as VOUT starts to decrease, which is due to the
Level Detection latch is low and IC is in OFF state, the inactive PWM section. The comparator C6a monitors
FBB resistor is isolated from the FBB pin and a current the FBB signal. If the voltage level is larger than 3.5V,
source Isel (3.5mA) is turned on instead. the internal circuit will be activated; the Internal Bias
From Vcc=8V to Vcc on threshold(17V), the FBB pin circuit resumes and starts to provide switching pulse. In
will start to charge to a voltage level associated with Active Burst Mode the gate G6 is released and the
Rsel resistor. When Vcc reaches Vcc on threshold, the current limit is reduced to Vcsth_burst (Figure 2 and
FBB voltage is sensed. The burst mode thresholds are 23). In one hand, it can reduce the conduction loss and
then chosen according to the FBB voltage level. The the other hand, it can reduce the audible noise. If the
Burst Mode Level Detection latch is then set to high. load at VOUT is still kept unchanged, the FBB signal
Once the detection latch is set high, any change of the will drop to 3.2V. At this level the C6b deactivates the
FBB level will not change the threshold level. When internal circuit again by switching off the Internal Bias.
Vcc reaches Vcc on threshold, a timer of 2ms is started. The gate G11 is active again as the burst flag is set
After the 2ms ends, the Isel is turned off while the FBB after entering Active Burst Mode. In Active Burst Mode,
resistor is connected to FBB pin (Figure 24). the FBB voltage is changing like a saw tooth between
3.2V and 3.5V (Figure 25).
Control unit
VOUT t Fault
No detect Startup and detect
detected No detect
VVCC
17V
10.5V
t VCS t
R Q
BRL Vac
C1b FF2
RBO2 C3
Blanking time Latch
1V G21 RBO0
0.4V 210us
Mode
Blanking Time
CBR0
270µs
RBO1 0.4V &
Control Unit Blanking
C2a time 450µs G2
G20
UVLO
TLE BRL
Figure 30 Brownout detection circuit RBO2 C2b Latch
Latch 1V Reset
Once the system enters the brownout mode, there will Enable G3
be no switching pulse and the IC enters into another Vcc
Signal C11
type auto-restart mode which is similar to the protection Control Unit
8V
auto-restart mode but the IC will monitor the BRL signal
in each restart cycle (Figure 31).
Figure 32 Latch and fast AC reset
150µs
VBRL 710µs 560µs
Latched and reset (c)
450µs 300µs
Latched (b)
1V
0.4V
4 Electrical Characteristics
Note: All voltages are measured with respect to ground (Pin 8). The voltage levels are valid if other ratings are
not violated.
4.3 Characteristics
1)
The parameter is not subjected to production test - verified by design/characterization. The thermal shutdown
temperature refers to the junction temperature of the controller.
Note: The trend of all the voltage levels in the Control Unit is the same regarding the deviation except VVCCOVP.
7 Outline Dimension
PG-DIP-7
(Plastic Dual In-Line Outline)
8 Marking
Marking
General guideline for PCB layout design using F3 CoolSET (refer to Figure 42):
1. “Star Ground “at bulk capacitor ground, C11:
“Star Ground “means all primary DC grounds should be connected to the ground of bulk capacitor C11
separately in one point. It can reduce the switching noise going into the sensitive pins of the CoolSET device
effectively. The primary DC grounds include the followings.
a. DC ground of the primary auxiliary winding in power transformer, TR1, and ground of C16 and Z11.
b. DC ground of the current sense resistor, R12
c. DC ground of the CoolSET device, GND pin of IC11; the signal grounds from C13, C14, C15 and collector of
IC12 should be connected to the GND pin of IC11 and then “star “connect to the bulk capacitor ground.
d. DC ground from bridge rectifier, BR1
e. DC ground from the bridging Y-capacitor, C4
2. High voltage traces clearance:
High voltage traces should keep enough spacing to the nearby traces. Otherwise, arcing would incur.
a. 400V traces (positive rail of bulk capacitor C11) to nearby trace: > 2.0mm
b. 600V traces (drain voltage of CoolSET IC11) to nearby trace: > 2.5mm
3. Filter capacitor close to the controller ground:
Filter capacitors, C13, C14 and C15 should be placed as close to the controller ground and the controller pin
as possible so as to reduce the switching noise coupled into the controller.
Guideline for PCB layout design when >3KV lightning surge test applied (refer to Figure 42):
1. Add spark gap
Spark gap is a pair of saw-tooth like copper plate facing each other which can discharge the accumulated
charge during surge test through the sharp point of the saw-tooth plate.
a. Spark Gap 3 and Spark Gap 4, input common mode choke, L1:
Gap separation is around 1.5mm (no safety concern)
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