Smart A

Firmware File: FILE XXX/V

SMART Attribute ID Field Description Offset Length
1 SMART Atrribute file Start Signature Bytes 4
2 SMART Attribute Version 4
3 Controller 4
4 Memeory Config 4
5 Die-0 Lot ID 4
6 Die-0 Wafer Number with X and Y 4
7 Die Stack 4
8 Die Intereave 4
9 Plane Interleave 4
10 Firmware Version 4
11 Bot file Name 4
12 DLT Test status 4
13 DLT Current Status 4
14 DLT cycles Configured 4
15 DLT Current Cycle 4
16 DLT Failure Mode 4
17 Required SLC FBL Count 4
18 Required TLC FBL Count 4
19 Actual SLC FBL Count 4
20 Actual TLC FBL Count 4
21 SLC Update Block Count 4
22 TLC Update Block Count 4
23 SLC Closed Block Count 4
24 TLC Closed Block Count 4
25 SLC GC Threshold 4
26 TLC GC Threshold 4
27 SLC GC Status 4
28 TLC GC Status 4
29 SLC EPWR Status 4
30 TLC EPWR Status 4
31 Power Cycle Count 4
32 Read Only Mode Flag 4
33 Read Only Pay load 4
34 Init Time Out Flag
35 Init Time Out Duration
36 Write Time Out Flag 4
37 Write Time Out Duration 4
38 Read Time Out Flag 4
39 Read Time Out Duration 4
40 P/E cycles - Avg (SLC) 4
41 P/E cycles - Max (SLC) 4
42 P/E cycles - Min (SLC) 4
43 P/E cycles - Avg (TLC) 4
44 P/E cycles - Max (TLC) 4
45 P/E cycles - Min (TLC) 4
46 Maximum Bad Blocks per Die 4
47 Total Bad Blocks 4
48 Total Grown Bad Blocks 4
49 EPWR Failure Count 4
50 Total Program Fail Count 4
51 Total UECC Count 4
52 Total Erase Fail Count 4
53 Unexpected Power Loss Count 4
54 End-to-End Error Detection 4
55 Command Timeout Count 4
56 ASIC Temperature - Current 4
57 ASIC Temperature - Minimum 4
58 ASIC Temperature - Maximum 4
59 NAND Temperature - Current 4
60 NAND Temperature - Minimum 4
61 NAND Temperature - Maximum 4
62 CRC Errors 4
63 GBB List Start Signature Bytes 4
63 Physical Bad block 1 Address (Third Byte) 4
63 Physical Bad block 1 Address (Second Byte) 4
63 Physical Bad block 1 Failure Reason (First Byte) 4
63 Physical Bad block 2 Address (Third Byte) 4
63 Physical Bad block 2 Address (Second Byte) 4
63 Physical Bad block 2 Failure Reason (First Byte) 4
… 4
4
Physical Bad block N Address (Third Byte) 4
x Physical Bad block N Address (Second Byte) 4
x Physical Bad block N Failure Reason (First Byte) 4
x GBB List END Signature Bytes 4
N-1 SMART Atrribute File END Signature Bytes 4
N 4
Number OF Write Aborts
Product SLC Endurance Support
Product MLC Endurance Support
Read Scrub Count
Total Writes Undergone by Device in LBA/TBW
Total Reads Undergone by Device in LBA/TBR
Threshold Voltage of the Power Glitch detection level
 Firmware Time Stamp During SMART Dump
Reserved For Future Parameter Addition_1
Reserved For Future Parameter Addition_2
Reserved For Future Parameter Addition_3
Reserved For Future Parameter Addition_4
Reserved For Future Parameter Addition_5
Reserved For Future Parameter Addition_6
Reserved For Future Parameter Addition_7
Reserved For Future Parameter Addition_8
Reserved For Future Parameter Addition_9
Reserved For Future Parameter Addition_10
ERROR Log Start Signature Bytes
Error Log Entry 1
Error Log Entry 2
Error Log Entry X
Error Log Entry N
Read only reason
REH debug data
Bad Blocks per plane
Count of interrupt for how many times ASIC temp Min
threhsold crossed

Count of interrupt for how many times ASIC temp Max

threhsold crossed
 Smart Attributes For RPG
Firmware File: FILE XXX/VENDOR Specific Command (SD/USB)
Offset Start Offset End
0 3
4 7
8 11
12 15
16 19
20 23
24 27
28 31
32 35
36 39
40 43
44 47
48 51
52 55
56 59
60 63
64 67
68 71
72 75
76 79
80 83
84 87
88 91
92 95
96 99
100 103
104 107
108 111
112 115
116 119
120 123
124 127
128 131
132 131
132 131
132 135
136 139
140 143
144 147
148 151
152 155
156 159
160 163
164 167
168 171
172 175
176 179
180 183
184 187
188 191
192 195
196 199
200 203
204 207
208 211
212 215
216 219
220 223
224 227
228 231
232 235
236 239
240 243
244 247
248 251
252 255
256 259
260 263
264 267
x x
x x
x x
x x
x x
x x
x x
xx xx+4
mart Attributes For RPG
E XXX/VENDOR Specific Command (SD/USB)
Byte Description
SAFS Start Signature Bytes
SAFS Version Number
Package Controller Information
Memeory Config Of the Die
Package Die-0 Lot ID Information
Die-0 Wafer Details with X and Y position
Number Of Dies In Package
Die Interleave In Firmware
Plane Interleave In Firmware
Firmware Version Downloaded on the Device
Bot File name On The Device
DLT test Triggerd or Idle state
DLT test Status (Running/Completed)
Number of DLT cycles Configured
DLT test Current cycle
DLT Failure Data (Write/Read Failure,Timeout)
Required SLC FBL Count for Firmware Operation
Required TLC FBL Count for Firmware Operation
Current SLC FBL Count(During Dump)
Current TLC FBL Count(During Dump)
Number of SLC Blocks in Update/Open Block State
Number of TLC Blocks in Update/Open Block State
Number of SLC Blocks in Closed Block State
Number of TLC Blocks in Closed Block State
SLC GC Threshold in terms of SLC FBL
TLC GC Threshold in terms of TLC FBL
Current SLC GC Status(Idle/Ongoing with State(in Context preparation,In Compaction ,In Commit,In Block Release))
Current TLC GC Status(Idle/Ongoing with State(in Context preparation,In Compaction ,In Commit,In Block Release))
SLC EPWR Ongoing/Idle with metablock Details
SLC EPWR Ongoing/Idle with metablock Details
Number Of Power cycles Device Undergone
Is Device in Read Only /Write Protected Mode?
Payload Details If Device is in Read Only /Write Protected Mode
Init Time Out Occurrence Flag
Duration Of Init Time Out
Write Time Out Occurrence Flag
Duration Of write Time Out
Read Time Out Occurrence Flag
Duration Of Read Time Out
Average SLC Hot Count
 Maximum SLC Hot Count
Minimum SLC Hot Count
Average TLC Hot Count
Maximum TLC Hot Count
Minimum TLC Hot Count
Maximum Factory Bad Blocks Seen Across All Dies
Total Factory Bad Blocks On the Device
Total Grown Bad Blocks On the Device
Number OF EPWR Fails Seen on the Device
Count of Program Fails Seen
Count of UECC Fails Seen
Count of Erase Fails Seen
Count of Power/Voltage Glitch Seen
Any error from Firmware Perspective To be Logged
Total Time Out seen Including All Commands
ASIC Temperture measured During Dump from power On
Minimum ASIC Temperture measured
Maximum ASIC Temperture measured
NAND Temperture measured During Dump
Minimum NAND Temperture measured
Maximum NAND Temperture measured
Number of CRC Error Encountered from power On
GBB List Start Signature Bytes
Phyical Block Address Higher Byte (Chip,Die,Blk,String,wordline,Plane)
Phyical Block Address Lower Byte (Chip,Die,Blk,String,wordline,Plane)
Physical block retired Reason(Erase fail,Program Fail,EPWR Fail,UECC,other Reason)
Phyical Block Address Higher Byte (Chip,Die,Blk,String,wordline,Plane)
Phyical Block Address Lower Byte (Chip,Die,Blk,String,wordline,Plane)
Physical block retired Reason(Erase fail,Program Fail,EPWR Fail,UECC,other Reason)
xx
xx
xx
xx
xx
xx
GBB List END Signature Bytes
SAFS END Signature Bytes
Track Number of Write Aborts Device Seen
Max SLC Endurnace Supported by Product
Max MLC Endurnace Supported by Product
Track Number of Read Scrub Counts
Total Writes Undergone by Device in LBA/TBW in its usage
Total Read Undergone by Device in LBA/TBR in its usage
Threshold Voltage of the Power Glitch detection level
 Reserved 1
Reserved 2
Reserved 3
Reserved 4
Reserved 5
Reserved 6
Reserved 7
Reserved 8
Reserved 9
Reserved 10
Error Log Start Signature Bytes
xx
xx
xx
Error Log End Signature Bytes
RO mode reason
collect the actual error profile for fallout memory dies and to check the efficiency of the REH flow
Factory Bad Blocks Seen Across All Planes
Count of interrupt for how many times ASIC temp crossed LowTemp Threshold
Interrupt mapping - Irq36, Address 0x90

Count of interrupt for how many times ASIC temp crossed High Temp Threshold
Interrupt mapping - Irq35, Address 0x8C