TPT HB16 WIREBONDER INFO.

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TPT HB16 ULTRASONIC WIRE BONDER:

- manual x, motorized Y & Z axis
- touch screen control
- wedge, ball, bump and ribbon bonding with same bond head
- storage parameter to work from memory
- auto bond height adjustment
- gold, aluminum, silver, copper wire 17-75 um wire
- single and repeated loop programming

Bond variables - force, ultrasonic, temperature, time

accessories: bond head, touch panel, heather stage,
control puck, microscope, motorized wire spool, fiber optic illuminator

Bonding:
Ball (creates ball end of wire)
- easier, faster|only gold wire, large pad needed, heat
Wedge (cut an angle end of wire)
- gold, Al wire, small pad, no heat|complex, slow

Gold wire: diameter 25um

Gold capillary: 25um
Ball size: 100 um

Aluminum wire: diameter 33um

Aluminum wedge tool: 33um

Wire Type Diameter (um) Diameter (mils) Wire Area (mil^2) Resistivity
(Ohm/inch)
Gold 25 1 0.79 1.16
Aluminum 33 1.25 1.23 0.856

Typical Fusing Current (amps) Recommended Bond Pad Size (mils) Minimal Pad
Size (um) Minimal Pitch (um)
0.6 - 0.7 4 x 4 100
150
0.4 - 0.5 4 x 4 100
150

Height setup
hit the bond button to measure the first surface height
hit the bond button again to measure 2nd surface height
hit the bond button 3rd time to get the EFO setup
for wedge mode, there is not EFO, only height setup

i can click and hold the bond button and adjust the length
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 TPT HB16 WIREBONDER INFO.txt
on the surface, if i release, it will make the first bond.
same for the 2nd bond.

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