Email: powersolutions@dynexsemi.

com
Main switchboard: +44 (0)1522 500 500
Sales & Marketing: +44 (0)1522 502 753

Key Features
(Module Dependant)
IGBT Modules
• High DC stability via advanced edge
Power Cycling with the latest termination design and passivation

generation IGBT die • High short circuit capability wide

SCSOA
• Self-limiting short circuit current
• Trench gate generation 5 IGBT
The Dynex manufacturing plant is a vertically integrated facility with
• Temperature conditions from -40/
device design, wafer fabrication, packaging, qualification and testing
- 50°C to +150°C
available on site.
• Low switching losses
The range of power modules includes half bridge, chopper, dual, • T(vj op) = 150°C
single and bi-directional switch configurations covering voltages • AlSiC Baseplate for increased thermal
from 1200V to 6500V and currents from 250A to 3600A. cycling capability
• Package design with CTI > 600
• Isolated base plate
• High isolation voltage available
Through initial concept to full production, Dynex support customer
requirements to provide enhanced and reliable device outlines to Applications
meet specific demands. • High reliability inverters
Using our in-house design team, Dynex continue to develop • Motor controllers
processes and designs to utilise the latest techniques to improve • Traction drives
cooling, current output, lifetime and reliability. • High power converters
• Renewable energy power conversion
Great emphasis is placed on low inductance power bus bar designs,
• Power charging equipment
enabling the modules to function under fast switching transients
• High reliability inverters
such as, those of next generation Trench Gate IGBT’s and SiC MOSFET.
• Different circuit topologies (half bridge,
Modules are available utilising chips that have been optimised for single switch, chopper)
switching or static losses depending on the application. • Electric vehicles

Copyright © 2019 Dynex Semiconductor Ltd. 1

 Email: powersolutions@dynexsemi.com
Main switchboard: +44 (0)1522 500 500
Sales & Marketing: +44 (0)1522 502 753

Module Outlines and Circuit Configurations

All dimensions shown in mm unless stated otherwise.

Package Type: D Nominal weight: 1000g/1600g Package Type: E Nominal weight: 1700g

5
Dual Switch - DDM/S Single Switch - ESM
1 1(E1) 2(C2) External connection
12(C2)

9
6 3 5(E1)

8
3
3(C) 9(C) 7(C) 5(C)

1
7
6(G1) 11(G2)

2
130

4 2

7
6

190
12 7(C1) 10(E2)
57

11 2(G)
3(C1) 4(E2)
10 1(E) 8(E) 6(E) 4(E)
124 C1 and C2 - Aux Collector External connection
E1 and E2 - Aux Emitter

5
4
G1 and G2 - Gate 3 - Aux Collector
2 - Gate
Chopper switch - DCM/S
38

1 - Aux Emitter
124
5(E1) 1(E1) 2(C2)
140

6(G1)

38
140
7(C1)

3(C1) 4(E2)

Package Type: F Nominal weight: 1000g/1600g Package Type: N Nominal weight: 1000g

Single Switch - FSM/S Single Switch - NSM

3 1 External connection C1 4 External connection

3
7 7(C1) 1(C1) 2(C2) C1 4(C1) 2(C2)
E1
8
130

130

G
4 2
9
1 2
57

57

9(G1) G

8(E1) 3(E1) 4(E2) E1 3(E1) 1(E2)

124 124
External connection External connection

C1 - Aux Collector C1 - Aux Collector

E1 - Aux Emitter E1 - Aux Emitter
38

G1 - Gate G - Gate
38

140 140

Package Type: P Nominal weight: 500/750g Package Type: P Nominal weight: 500g

140
Bi-directional Switch - PBM Chopper High Side - PKM
8 124
3 2 1(E1/K)
1 1(E1/E2)
6
54

2(C1)
73

3(C2)
7 3(A)
57

2(C1)
73

67

5
5(E 1 )
1

4
4(G 1 )
8

124
5(E1) 6(G2) 7(E2) 8(C 1 )
4(G1)

C1 - Aux Collector Chopper Low Side - PLM

E1 and E2 - Aux Emitter
38

26.2
38

G1 and G2 - Gate 1(A/C2)

140 2(K)
Half Bridge - PHM 3(E2)
38

7(E 2)
26.2

1(E1C2)
8(C2 ) 6(G 2)
2(C1) 3(E2)

C1 - Aux Collector
E1 and E2 - Aux Emitter 8(C1) 5(C2/E1) 6(G2)7(E2)
G1 and G2 - Gate 4(G1)

Copyright © 2019 Dynex Semiconductor Ltd. 2

 Email: powersolutions@dynexsemi.com
Main switchboard: +44 (0)1522 500 500
Sales & Marketing: +44 (0)1522 502 753

Package Type: G Nominal weight: 1000g Package Type: X Nominal weight: 1100g

Dual Switch - GDM Single Switch - XSM

5
7 3 1 1(E1) 2(C2) 10(C2) 7 External connection
7(E1) 6
2 1 7(C1) 5(C2) 3(Aux C)
6 6(G1) 9(G2)

130
130

2 5(C1) 8(E2)
10 4
3(C1) 4(E2) 4

57
9 5 2(G)
57

C1 and C2 - Aux Collector 3 1(Aux E) 6(E1) 4(E2)

8 E1 and E2 - Aux Emitter
External connection
124 G1 and G2 - Gate
124

Chopper Switch - GCM Chopper Switch - XCM

38

1 (E1) 2 (K) 7(C1) 5 (A)

7 (E1)

48
3(Aux C)
140
6 (G1)
160
140
5 (C1) 2(G)
3 (C1) 4 (A)
1(Aux. E)
C1 and C2 - Aux Collector
E1 and E2 - Aux Emitter 6 (E1) 4 (K)
G1 and G2 - Gate

Package Type: A Nominal weight: 1700g Package Type: H2 Nominal weight: 900g

Single Switch - ASM

External connection Half Bridge - H2HM
5(C) 7(C) 9(C)
9

3(C)
8

89±0.5

8(E1/ C2)
2(G)
9(C1) 10(E2)
1

1(E)
4(E) 6(E) 8(E)
7

190 ± 0.5
6

External connection 5(C1) 3(E1) 1(G2) 2(E2)

2

4(G1)
37±0.3

Chopper Switch - ACM C1 - Aux Collector

External connection E1 and E2 - Aux Emitter
3

G1 and G2 - Gate
4

171.8±0.5
5

7(C) 9(C) 5(A)

3(C)
2(G)

1(E)
6(E) 8(E) 4(C)
External connection
38 ± 0.5

3 - Aux Collector
140 ± 0.5 2 - Gate
1 - Aux Emitter

Package Type: H1 Nominal weight: 1700g Package Type: M1 Nominal weight: 345g

Half Bridge - H1HM

17±0.3

Half Bridge - M1HM

38 -0.5
+1.0

8(E1/ C2)
250±0.8 10/11
9,11(C1) 10,12(E2)
4 3
62 ±0.2
89±0.5

5(C1) 3(E1) 1(G2)2(E2)

4(G1) 9 8 1 2
7

C1 - Aux Collector
E1 and E2 - Aux Emitter 152±0.5
234 G1 and G2 - Gate

IMPORTANT INFORMATION: The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information
contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application. The user must evaluate the suitability of the product and the
completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements are met. Although we have endeavoured to carefully compile the
information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is
subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in medical or other applications where a
failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. All
products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered
trademarks or trade names of their respective owners. Warning: Counterfeit Products – There are counterfeit products on the marketplace which closely resemble Dynex’s genuine products. Dynex does not support the
sale of products via on-line auction houses. We will be pleased to confirm the authenticity of products if you contact Dynex Customer Service. For further advice, please refer to our Counterfeit Goods notice on our web-site.
Copyright © 2019 Dynex Semiconductor Ltd. 3