Professional Documents
Culture Documents
Irfb 260 N
Irfb 260 N
SMPS MOSFET
IRFB260N
HEXFET® Power MOSFET
Applications VDSS RDS(on) max ID
l High frequency DC-DC converters
200V 0.040Ω 56A
Benefits
l Low Gate-to-Drain Charge to Reduce Switching Losses
l Fully Characterized Capacitance Including Effective COSS to
Simplify Design, (See App. Note AN1001)
l Fully Characterized Avalanche Voltage and Current
TO-220AB
Thermal Resistance
Parameter Typ. Max. Units
RθJC Junction-to-Case ––– 0.40
RθCS Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
RθJA Junction-to-Ambient ––– 62
Avalanche Characteristics
Parameter Typ. Max. Units
EAS Single Pulse Avalanche Energy ––– 450 mJ
IAR Avalanche Current ––– 34 A
EAR Repetitive Avalanche Energy ––– 38 mJ
Diode Characteristics
Parameter Min. Typ. Max. Units Conditions
D
IS Continuous Source Current MOSFET symbol
––– ––– 56
(Body Diode) showing the
A
ISM Pulsed Source Current integral reverse G
VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 34A, VGS = 0V
trr Reverse Recovery Time ––– 240 360 ns TJ = 25°C, IF = 34A
Qrr Reverse RecoveryCharge ––– 2.1 3.2 µC di/dt = 100A/µs
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
2 www.irf.com
IRFB260N
1000 1000
VGS VGS
TOP 15V TOP 15V
10V 10V
8.0V 8.0V
ID , Drain-to-Source Current (A)
4.5V
10 10
4.5V
1 1
1000.00
3.5
I D = 56A
3.0
ID , Drain-to-Source Current (Α )
T J = 175°C
2.5
R DS(on) , Drain-to-Source On Resistance
100.00
(Normalized)
2.0
1.5
TJ = 25°C
10.00
1.0
0.5
VDS = 15V
20µs PULSE WIDTH
V GS = 10V
1.00 0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
3.0 5.0 7.0 9.0 11.0 13.0 15.0
TJ , Junction Temperature ( °C)
VGS, Gate-to-Source Voltage (V)
100000 12
VGS = 0V, f = 1 MHZ
ID = 34A
VDS = 160V
Ciss = Cgs + Cgd , Cds SHORTED VDS = 100V
Crss = Cgd VDS = 40V
10
10000 Coss = Cds + Cgd
C, Capacitance(pF)
Ciss
1000
Coss 5
100 Crss
2
10
0
1 10 100 1000 0 30 60 90 120 150
1000.00 1000
OPERATION IN THIS AREA
LIMITED BY R DS (on)
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
100.00
100
TJ = 175°C
10.00
100µsec
10
T J = 25°C 1msec
1.00
Tc = 25°C
Tj = 175°C
VGS = 0V Single Pulse 10msec
0.10 1
0.0 0.5 1.0 1.5 2.0 1 10 100 1000
VSD , Source-toDrain Voltage (V) VDS , Drain-toSource Voltage (V)
VGS
50 D.U.T.
RG
+
-VDD
40
ID , Drain Current (A)
10V
Pulse Width ≤ 1 µs
30
Duty Factor ≤ 0.1 %
20
Fig 10a. Switching Time Test Circuit
VDS
10
90%
0
25 50 75 100 125 150 175
1
(Z thJC)
D = 0.50
0.1 0.20
0.10
Thermal Response
0.05
0.02
0.01 SINGLE PULSE
(THERMAL RESPONSE) P DM
0.01
t1
t2
0.001
Notes:
1. Duty factor D =
2. Peak T
t1/ t
J = P DM x Z thJC
2
+T C
www.irf.com 5
IRFB260N
1 5V 850
ID
TOP 14A
24A
L D R IV E R 680
VDS BOTTOM 34A
340
Fig 12a. Unclamped Inductive Test Circuit
170
V (B R )D SS
tp
0
25 50 75 100 125 150 175
Starting T , Junction
J Temperature ( °C)
Current Regulator
Same Type as D.U.T.
QG
50KΩ
.2µF
10 V 12V
.3µF
QGS QGD +
V
D.U.T. - DS
VG VGS
3mA
IG ID
Charge Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform Fig 13b. Gate Charge Test Circuit
6 www.irf.com
IRFB260N
Peak Diode Recovery dv/dt Test Circuit
+
- +
-
RG • dv/dt controlled by RG +
• Driver same type as D.U.T. VDD
-
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
VGS=10V *
Reverse
Recovery Body Diode Forward
Current Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
VDD
Re-Applied
Voltage Body Diode Forward Drop
Inductor Curent
Ripple ≤ 5% ISD
www.irf.com 7
IRFB260N
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
10 .5 4 (.4 15 ) 3.7 8 (.14 9) -B -
2 .8 7 (.1 13 ) 10 .2 9 (.4 05 ) 3.5 4 (.13 9) 4 .69 (.1 85 )
2 .6 2 (.1 03 ) 4 .20 (.1 65 )
-A- 1.3 2 (.05 2)
1.2 2 (.04 8)
6.47 (.255 )
6.10 (.240 )
4
15 .2 4 (.6 00 )
14 .8 4 (.5 84 )
1.1 5 (.0 4 5) L E A D A S S IG N M E N T S
M IN 1 - G A TE
1 2 3 2 - D R A IN
3 - SOURCE
4 - D R A IN
14 .0 9 (.5 55 )
13 .4 7 (.5 30 ) 4 .06 (.160 )
3 .55 (.140 )
Notes:
Repetitive rating; pulse width limited by Pulse width ≤ 300µs; duty cycle ≤ 2%.
max. junction temperature.
Coss eff. is a fixed capacitance that gives the same charging
Starting TJ = 25°C, L = 0.78mH time as Coss while VDS is rising from 0 to 80% VDSS
R G = 25Ω, IAS = 34A.
ISD ≤ 34, di/dt ≤ 480A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
Data and specifications subject to change without notice.
This product has been designed and qualified for the Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.08/01
8 www.irf.com