LG D724 Service Schemati

Internal Use Only
Service Manual
LG-D724
Date: Aug, 2014 / Issue 1.0

Table Of Contents
1. INTRODUCTION�� 3 4. DOWNLOAD�� 120
1.1 Purpose��3
5. BLOCK DIAGRAM�� 137
1.2 Regulatory Information��3
6. CIRCUIT DIAGRAM�� 138
2. PERFORMANCE�� 5
2.1 Product Name ...........................................................................................5 7. BGA PIN MAP�� 152
2.2 Supporting Standard...............................................................................5
8. PCB LAYOUT�� 158
2.3 Main Parts : GSM Solution ....................................................................6
2.4 HW Features ...............................................................................................6 9. CALIBRATION�� 162
2.5 SW Features ................................................................................................9
2.6. HW SPEC................................................................................................... 12 10. HIDDEN MENU�� 181
3. TROUBLE SHOOTING�� 20 11. DISASSEMBLE GUIDE�� 188

3.1 RF Component ....................................................................................... 20 12. EXPLODED VIEW & REPLACEMENT PART LIST �� 194
3.2 SIGNAL PATH ........................................................................................... 22
3.3 Checking TCXO Block .......................................................................... 24
3.4 Checking FEMID (GSM,W B1/B2/B8) Block ................................. 27
3.5 Checking WCDMA Block .................................................................... 30
3.6 Checking GSM Block . .......................................................................... 62
3.7 GPS . ............................................................................................................ 69
3.8 WIFI/BT ...................................................................................................... 73
3.9. Power ON Troubleshooting ............................................................. 77
3.10. Charger Troubleshooting ............................................................... 81
3.11. 8M Camera trouble............................................................................ 84
3.12. Main LCD trouble . ............................................................................. 89
3.13. Audio trouble....................................................................................... 92
3.14. Touch trouble.....................................................................................105
3.15. Sensor trouble ..................................................................................111
3.16. USB.........................................................................................................113
3.17. VIBRATORS . ........................................................................................116
LGE Internal Use Only -2- Copyright © 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1. Introduce
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common carrier telecommunication service of
facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that
result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.
LGE Internal Use Only
1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When
repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are
used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
2. PERFORMANCE
2. PERFORMANCE
2. PERFORMANCE
2.1 Product Name
2.1
LG-Product Name
D618 : WCDMA850/900/1900/2100+EGSM/GSM850/DCS1800/PCS1900
(HSPA + / GPRS Class 12 / EDGE Class 12_Rx only)

LG- D724 : WCDMA850/900/1900/2100+EGSM/GSM850/DCS1800/PCS1900 (HSPA + / GPRS Class 12 / EDGE Class 12_Rx only)
2.2
2.2Supporting Standard
Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,2,5,8)/

EGSM/GSM850/DCS1800/PCS1900
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz

WCDMA(FDD1) RX : 2110 – 2170 MHz
WCDMA(FDD2) TX : 1852.4– 1907.6 MHz
WCDMA(FDD2) RX : 1932.4 – 1987.6 MHz
WCDMA(FDD5) TX : 824 – 849 MHz
WCDMA(FDD8) TX : 880 – 915 MHz
EGSM TX : 880 – 915 MHz
EGSM RX : 925 – 960 MHz
GSM850 TX : 824 – 849 MHz
GSM850 RX : 869 – 894 MHz
DCS1800 TX : 1710 – 1785 MHz
DCS1800 RX : 1805 – 1880 MHz
PCS1900 TX : 1850 – 1910 MHz
PCS1900 RX : 1930 – 1990 MHz
Application Standard WAP 2.0
2. PERFORMANCE
2.3 Main Parts : GSM Solution

Item Part Name Comment
MSM8226 : Qualcomm
Digital Baseband
Analog Baseband MSM8226 : Qualcomm

RF Chip WTR2605 : Qualcomm
2.4 HW Features
Item Part Name Comment
Form Factor DOP type

Battery 1) Capacity
Standard : Li-Ion, 2540mAh
2) Packing Type : Hard Pack
Size Standard : 137.75 x 69.6 x 10.3mm
Weight TBD With Battery
Volume TBD Without Batter
PCB 10 L1F2 , 0.8t
Charging time 4.3hrs @ Power Off /
2540mAh
RX sensitivity WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD2) : -106.7 dBm
WCDMA(FDD5) : -103.7 dBm
EGSM : -105 dBm
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm
TX WCDMA/ WCDMA : 24dBm/3.84MHz,+1/-3dBm Class3(WCDMA)
output GSM/ EGSM : 33 dBm Class4 (EGSM)
power GPRS GSM850 : 33 dBm Class4 (GSM850)
DCS 1800 : 30.5 dBm Class1 (PCS)
PCS 1900 : 30.5 dBm Class1 (DCS)
EDGE Rx only
2. PERFORMANCE
GPRS compatibility GPRS Class 12

EDGE compatibility Rx only
SIM card type Micro SIM(3FF) 3V /1.8V
Display Main LCD : TFT LCD
(5”, HD, 1280X720 pixels, 16M Colors)
Built-in Camera 8M BSI - AF Camera with FHD
Status Indicator N/A
Keypad Full Touch Screen Back Key :
Back-Key :3 Power On
Volume
up/down
ANT Main : Internal Fixed Type
System connector 5 Pin micro USB
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory 8GB eMMC
1Gb LPDDR2
Speech coding FR, EFR, HR, AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
BlueTooth V4.0 + BLE
MIDI(for Buzzer SW Decoded 72Poly
Function)
Music Player MP3/WMA/AAC/MIDI/EAAC+/HEAAC/OGG
Video Player Playback : 30fps 1080p (H.264/263, MPEG4/2, WMV9,
VC1, VP8, DivX, XVID)
Recording : 30fps 1080p (H.264/263, MPEG4/8)
30fps 720p (Wi-Fi display)
Camcorder MPEG4 or H.263
Voice Recording Yes
Speaker Phone Yes
mode
Support
Travel Adapter Yes In-box item
LGE Internal Use Only Only for training and service purposes
2. PERFORMANCE
CDROM No
Stereo Headset Yes
Data Cable Yes In-box item
T-Flash(External Yes (Up to 32GB)
Memory)
Specification
GSM WCDMA
Stand by current
Under 4.5mA @ P.P 5 Under 4.5mA @ DRX 7
(Sleep & Idle Avg.)
Under 600mA
Under 400 mA @ Max Power Avg.
Talk current
@GSM Level 5 Under 400 mA
@ Tx -10dBm Avg.
2. PERFORMANCE
2.5 SW Features
RSSI 0 ~ 5 Levels
Battery Charging 0 ~ 20 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes Support total 41 languages
[English/Spanish/French/Korean/C
hinese(Simplified)/Chinese(Traditi
onal)/…]
Quick Access Mode Phone / Messaging / Browser/ Phone / Contact / Messaging /
Applications Applications
PC Sync Yes
Speed Dial Yes Voice mail center -> 1 key
Profile Yes not same with feature phone
setting
CLIP / CLIR Yes
Phone Book Name / Number / Email / Groups / There is no limitation on the
Postal addresses / Organizations / number of items.
IM / Note / Nickname / Website / It depends on available memory
Event / amount.
Last Dial Number Yes
Last Received Yes

Number
Last Missed Number Yes

Search by Yes
Number/Name
Group Yes There is no limitation on the
number of items.
It depends on available memory
amount.

2. PERFORMANCE
Fixed Dial Number Yes

Service Dial Number No
Own Number Yes My Profile (add/edit/delete are
supported)
Voice Memo Yes Support voice recorder

Call Reminder No
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) No
Call Duration Yes
SMS (EMS) There is no limitation on the EMS does not support.
number of items.
amount.
SMS Over GPRS Yes
EMS Melody / Picture No
Send / Receive / Save
MMS MPEG4 Yes
Send / Receive / Save
Long Message MAX 2000 characters The standard of Open vender
Cell Broadcast Yes
Download Over the Web
Game No
Calendar Yes
Memo Yes There is no limitation on the
number of items.
amount.
World Clock Yes
Unit Convert No
Stop Watch Yes
Wall Paper Yes
LGE Internal Use Only - 10 - Copyright © 2014 LG Electronics. Inc. All right reserved.
2. PERFORMANCE
WAP Browser No Support only web browser based

on webkit. WAP stack and wml
are not supported.
Download Melody / Yes Over web browser
Wallpaper
SIM Lock No
SIM Toolkit No
MMS Yes Google MMS Client
EONS Yes
CPHS Yes V4.2
ENS Yes
Camera Yes 8M AF /
Digital Zoom : x4
JAVA No
Voice Dial No US English only
IrDa Yes
Bluetooth Yes Ver. 4.0 [HSP, HFP, A2DP, AVRCP,
PBAP, FTP(Server only), OPP, MAP,
HID, PAN]
FM radio Yes
GPRS Yes Class 12
EDGE Yes Class 12/Rx only
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad No
TTY No
AMR Yes
SyncML No
IM Yes Google Talk
Email Yes
2. PERFORMANCE
2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Rms : 5°
Phase Error
Peak : 20 °
GSM : 0.1 ppm
Frequency Error
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
GSM/DCS : < -28dBm
Disturbance)
Transmitter Output power and GSM : 5dBm – 33dBm ± 2dB
Burst Timing DCS/PCS : 0dBm – 30dBm ± 2dB
Burst Timing <3.69us
Spectrum due to modulation out 200kHz : -36dBm
to less than 1800kHz offset 600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)
Spectrum due to modulation out 3000kHz-6000kHz : <-65dBc(-46dBm)
to larger than 1800kHz offset to 6000kHz < : < -71dBc(-46dBm)
the edge of the transmit band DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching 400kHz : -19dBm/-22dBm(5/0),
transient 600kHz : -21dBm/-24dBm(5/0),
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – ± 800kHz, ± 1600kHz
Speech channels : -98dBm/-96dBm (2.439%)
AM Suppression
- GSM : -31dBm -98dBm/-96dBm (2.439%)
- DCS : -29dBm
Timing Advance ± 0.5T
2. PERFORMANCE
2) WCDMA transmitter specification

Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz

Band2 : 1852 MHz ~ 1907.6 MHz
Band5 : 824MHz ~ 849MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage > 33 dB @ ±5 MHz,
Power Ratio (ACLR) > 43 dB @ ±10 MHz
Spurious Emissions < -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz
|f-fc| > 12.5 MHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 880 MHz ≤ f ≤ 915 MHz
< -60 dBm / 3.84 MHz RW @ 1920 MHz ≤ f ≤ 1980 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6
MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
Peak Code Domain Error < -15 dB at Pout ≥ -20 dBm

2. PERFORMANCE
3) WCDMA receiver specification
Item Specification
Receive Frequency Band1 : 2110 MHz ~ 2170 MHz
Band2 : 1932.4 MHz ~ 1987.6 MHz
Band5 : 869 MHz ~ 894MHz
Band8 : 925 MHz ~ 960 MHz
Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band2 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity ACS > 33 dB where BER < 0.001 when
(ACS) Îor = -92.7 dBm / 3.84 MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15
MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
Inner Loop Power Control 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
In Uplink -1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24
2. PERFORMANCE
4) HSDPA transmitter specification

Item Specification
Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1852 MHz ~ 1907.6 MHz

Transmit Frequency
Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz

Maximum Output Power
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
Sub- Power
test in Power Power step step Transmitter power
table step slot boundary size, P step tolerance [dB]
C.10.1.4 [dB]
Start of
HS-DPCCH 1 6 +/- 2.3
Ack/Nack
5 2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
4 End of CQI 5 +/- 2.3
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset Measurement

Minimum requirement
from carrier △f Bandwidth
Spectrum Emission Mask 2.5 ~ 3.5 MHz -35-15×(△f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×(△f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×(△f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Leakage > 33 dB @ ±5 MHz
Power Ratio (ACLR) > 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

2. PERFORMANCE
5) HSDPA receiver specification

Item Specification
Receive Frequency Band1 : 2110 MHz ~ 2170 MHz

Band2 : 1932.4 MHz ~ 1987.6 MHz
Band5 : 869 MHz ~ 894MHz
Band8 : 925 MHz ~ 960 MHz
Maximum Input Level Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
(BLER or R), 16QAM Only BLER < 10% or R >= 700kbps
6) WLAN 802.11b transceiver specification

Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under
Frequency Tolerance within ±25 PPM
Chip clock Frequency

within ±25 PPM
Tolerance
≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz

Spectrum Mask
≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy
≤ 35%
(Peak EVM)
< -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz

Spurious Emissions
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -85dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent Channel ≥ 35dB @FER ≤ 8%,
Rejection interference input signal -70dBm@fc±25MHz(11Mbps)
2. PERFORMANCE
7) WLAN 802.11g transceiver specification

Item Specification
Tx Power Level ≤ 20dBm

within ±25 PPM
Tolerance
≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
Spectrum Mask ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error

≤ -5dB
(rms EVM)
< -36 dBm @ 30MHz ~ 1GHz

Spurious Emissions
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps

Rx Min input Sensitivity
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
PER ≤ 10%,
ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps,
ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps,
Rx Adjacent Channel ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps

Rejection
ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
※ACR shall be measured by setting the desired signal's strength 3

dB above the rate-dependent
sensitivity specified in min input sensitivity

2. PERFORMANCE
8) WLAN 802.11n transceiver specification

Item Specification
Tx Power Level ≤ 20dBm

within ±25 PPM
Tolerance
≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
Spectrum Mask ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -45 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error

≤ -5dB
(rms EVM)
< -36 dBm @ 30MHz ~ 1GHz

Spurious Emissions
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
PER ≤ 10%
82dBm@6.5Mbps, -79dBm@13Mbps, -77dBm@19.5Mbps
Rx Min input Sensitivity -74dBm@26Mbps, -70dBm@39Mbps, -66dBm@52Mbps
-65dBm@58.5Mbps, -64dBm@65Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
PER ≤ 10%,
ACR ≥ 16dB@6.5Mbps, ACR ≥ 13dB@13Mbps,
ACR ≥ 11dB@19.5Mbps, ACR ≥ 8dB@26Mbps,
Rx Adjacent Channel ACR ≥ 4dB@39Mbps, ACR ≥ 0dB@52Mbps

Rejection
ACR ≥ -1dB@58.5Mbps, ACR ≥ -2dB@65Mbps
※ACR shall be measured by setting the desired signal's strength 3

dB above the rate-dependent
sensitivity specified in min input sensitivity
2. PERFORMANCE
9) GPS receiver specification

Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time

Minimum Sensitivity
aiding
10) Signal Bar
Cell Power
GSM WCDMA Comment
[dBm]
Bar 54 -91 ± 2dBm -86 ± 2dBm

1. Call
Bar 43 -96 ± 2dBm -93 ± 2dBm Connected &
Bar 32 -99 ± 2dBm -99 ± 2dBm CPIPH Level=-

3.3
Bar 21 -103 ± 2dBm -103 ± 2dBm
Bar 10 -105 ± 2dBm -109 ± 2dBm 2. LTE: RSRP
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
3.1 RF Component
3. TROUBLE SHOOTING
LGE Internal
LGE Use Only
Internal Use Only - 21 - Copyright © 2014 LG Electronics. Inc. All right reserved.
3. TROUBLE SHOOTING
3.2 SIGNAL PATH
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
3.3 Checking XO Block

The output frtquency (19.2MHz) of XO (X4100) is used as the reference one of WTR2605 and PM8226 intemal VCO.
3. TROUBLE SHOOTING
{w[XWW
W
y[XWY
y[XWZ
y[XW] XWWr {vsdWUWX
+1V8_VREG_L12
[XWW
XlWWWY`XWWWX
4 3
Thermistor XTAL2
1 2
X
XTAL1 GND/Therm
XÙYto¡
kup
kup
j[XWW
j[XWX
j[XWY
y[XXW W
iijsrGGG GGGU uGX iijsr
wGGG_WTuj_ZZTX[GGGU
y[XX[ W
zsllwjsr
TP VR
kup
kup
uGYG
nukylmGGG GGGGGG
j[XWZ
j[XW\
{GGGG GGGG
GGGGG
Schematic of the Crystal Part (19.2MHz)
3. TROUBLE SHOOTING

3. TROUBLE SHOOTING
3.4 Checking FEMID (GSM, W B1/B2/B8) Block
3. TROUBLE SHOOTING
SPDT_OUT
RX2
SPDT_IN
RX1
GND14
GND13
ANT
GND12
GND11
GND15 GND10
22 12
GND16 GND9
23 11
{tvk|sl{yX TRX1 GND8
24
25
GND17
TRX2
GND7
GND6
10
9 TP9
{tvk|sl{yY 26 8
GND18 zr^^\^ZTZX GND5
27 7
{tvk|sl{yZ 28
TRX3 |XXWW GND4
6
GND19 VCC2 R}whih{{W
29 5
{tvk|sl{y[ TRX4 VCC1
30 4
GND20 GND3
R}whih{{W 31
VBATT GND2
3
32 2
YY
NC1 GND1
[U^
XW
XWW
XW
XW
33 1
MODE0
MODE1
HB_EN
LB_EN
RF_IN
PGND
SPDT
TP8
jXXW`
jXXXX
jXXXZ
SW1
SW0
jXXXW
NC2
jXXXY
jXXX[
34
35
36
37
38
39
40
41
42
43
yXXWW
G~^GjpGOW]VW^P G~^GjpGOW]VW^P
XU_
zwk{zls whWyX
whWyW
hu{Wz~zlsW hu{Wz~zlsZ
hu{Wz~zlsX hu{Wz~zlsY
yXXWX
yXXWY
kup
kup
TP4 TP7
YY
YY
YY
YY
YY
YY
YY
TP1
TP3
jXXX\
jXXX]
jXXX^
jXXX_
jXXX`
jXXYW
jXXYX
TP2 TP5 TP6
3. TROUBLE SHOOTING
Check TP1~7 High Level
No
1.4V < Voltage < 3.0V Check the TP8,9
Yes
Check the ANT Logic in each mode
3. TROUBLE SHOOTING
3.5 Checking WCDMA Block
START
Check XO Block
Refer to 4.3
Check FEMID Block

Refer to 4.4
Check RF TRX Level
Re- Download SW & Cal
3. TROUBLE SHOOTING
3.5.1 Checking XO (19.2MHz) Block

Refer to 4.3
3.5.2 Checking FEMID Block

Refer to 4.4
3.5.3 Checking RF TX Level
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4
sXWW]Z sXWW][ 3 4 sXXWX WU\

kup kup sXXWZ kup sXXWY
_Y
TP1
GOGkntzGnGP
tjTjWWWWYTX[GaGlzkGwGj
3. TROUBLE SHOOTING

3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
jX]Z_ ZZ
whWvuY iX
whWvuZ i_
whWyW
X
X
X
2
3
4
5
TP2
RFIN
VENHB
VENLB
VMODE
jX][Z
jX][[
jX][\
1 6 TP1
16
VBATT
GND6 |X]WX
GND1
GND2
7 TP3
15 8
CPLIN zr^^^[YTYX CPLOUT ~{ywkl{pu
14 9
RFOUTHB GND3
RFOUTLB
17
PGND
GND5
GND4
VCC
13
12
11
10
+VPA0
XWW
XW
X
jX]ZX
jX]ZW
jX]Y`
3. TROUBLE SHOOTING
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP
3. TROUBLE SHOOTING
R}whih{{W
wGGGG~{y
jX]XY ZZ
~{y{Zv|{
whWvuW iY
whWvuX i\ jX]XZ iYSGi\
XWW
XW
X
whWyW kup
jX]WY
jX]WX
jX]WW
X
X
X
2
3
4
5
wGGGG~{y
RFIN
VENHB
VENLB
VMODE
jX]X]
jX]X^
jX]X_
iY 1 6
jX]W` ZU` VBATT GND1
16 7
~{ywytiYpu {vsdWUWX GND6 |X]WW GND2
jX]XX [UZ yX]W] \X 15 8
jX]XW ]UY CPLIN zr^^^[YTYX CPLOUT 9
14
RFOUTHB GND3
RFOUTLB
17
PGND
GND5
GND4
jX]X\
TP3
sX]WX
VCC
jX]X[ X
kup
kup
13
12
11
10
jX]X`
kup
zGGGcdZZm
GsuhGGG +VPA0
TP2
XWW
XW
X
jX]WZ
jX]W\
jX]W[
wGGGG~{y
jX]YZ
i\SGn_\W
X\
~{ywysiYpu
\U] jX]Y[
sX]W\ sX]WZ sX]W[

kup XU\
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING

3. TROUBLE SHOOTING
jX]Z_ ZZ
whWvuY iX
whWvuZ i_
whWyW
X
X
X
2
3
4
5
TP2
RFIN
VENHB
VENLB
VMODE
jX][Z
jX][[
jX][\
1 6 TP1
16
VBATT
GND6 |X]WX
GND1
GND2
7 TP3
15 8
14 9
RFOUTHB GND3
RFOUTLB
17
PGND
GND5
GND4
VCC
13
12
11
10
+VPA0
XWW
XW
X
jX]ZX
jX]ZW
jX]Y`
3. TROUBLE SHOOTING
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP

3. TROUBLE SHOOTING
R}whih{{W
wGGGG~{y
jX]XY ZZ
~{y{Zv|{
whWvuW iY
XWW
XW
X
whWyW kup
jX]WY
jX]WX
jX]WW
TRX B2
X
X
X
2
3
4
5
wGGGG~{y
RFIN
VENHB
VENLB
VMODE
jX]X]
jX]X^
jX]X_
iY 1 6
jX]W] XU_ jX]W^ XY msX]W[ jX]W_ ZU` jX]W` ZU` VBATT GND1
6 1 16 7
{tvk|sl{yX ANT RX ~{ywytiYpu {vsdWUWX GND6 |X]WW GND2
3 14
TX RFOUTHB GND3
ZU`
RFOUTLB
2 9 17
GND1 GND6 PGND
GND5
GND4
4 8 sX]WX jX]X\
sX]WW
VCC
GND2 GND5 jX]X[
5 7 kup X
GND3 GND4 kup
13
12
11
10
TP3
jX]X`
kup
zGGGcdZZm
GsuhGGG +VPA0
XWW
XW
X
TRX B5/ RX GSM 850
jX]WZ
jX]W\
jX]W[
wGGGG~{y
jX]YW ZU` jX]YX ZZ msX]WX jX]YY XU\ jX]YZ
i\SGn_\W
X\
6 1
{tvk|sl{yY ANT RX ~{ywysiYpu
\U] jX]Y[
3
TX
sX]WY
_UY 2 9
GND1 GND6
4 8 sX]WZ sX]W[
GND2 GND5 sX]W\
5 7 kup XU\
GND3 GND4 kup
lht]Y`\[]WX
jX]Y\
zGGGcdZZm
TP2
kup
GsuhGGG
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING

3. TROUBLE SHOOTING
wGGGG~{y
jX]XY ZZ
~{y{Zv|{
whWvuW iY
whWyW kup
X
X
X
TP2
2
3
4
5
RFIN
VENHB
VENLB
VMODE
TP1
jX]X]
jX]X^
jX]X_
1 6
VBATT GND1
16 7
yX]W] \X
{vsdWUWX GND6
15
CPLIN
|X]WW
zr^^^[YTYX
GND2
CPLOUT
8 TP3
14 9
RFOUTHB GND3
RFOUTLB
17
PGND
GND5
GND4
VCC
13
12
11
10
+VPA0
XWW
XW
X
jX]WZ
jX]W\
jX]W[
3. TROUBLE SHOOTING
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP
3. TROUBLE SHOOTING
wGGGG~{y
jX]Z_ ZZ jX]Z` ZZ
~{y{Yv|{
whWvuY iX
R}whih{{W whWvuZ i_ jX][Y iXSGi_
XWW
whWyW kup
XW
X
X
X
X
2
3
4
5
TRX B1
jX]Y_
jX]Y^
jX]Y]
RFIN
VENHB
VENLB
VMODE
jX][Z
jX][[
jX][\
wGGGG~{y
TP3
msX]WY 1 6
jX]ZY ZZ jX]\^ WU] jX]Z[ XUY jX]Z\ ZU` VBATT GND1
6 1 16 7
{tvk|sl{yZ ANT RX ~{ywytiXpu GND6 |X]WX GND2
15 8
3
jX]Z] X iX jX]Z^ XWW 14
CPLIN zr^^^[YTYX CPLOUT
9
~{ywkl{pu
iX TX RFOUTHB GND3
RFOUTLB
sX```
2 9 17
XU_ GND1 GND6 PGND
GND5
GND4
4 8
GND2 GND5
VCC
jX][W jX][X
5 7
GND3 GND4 [U^ WU\
sX]W^
lht]Y`\[\WX
13
12
11
10
WU^\
whGsvnpjGiXVi_
zGGGcdZZm wv~lyGtvkl whvui_ whvuiXi[ whWyW
jX][]
GsuhGGG +VPA0 zo|{Gkv~u s s s
ZZ
z{hukTi sVo sVo T
XWW
XW
X
i_Gowt o s s
jX]ZX
jX]ZW
jX]Y`
i_Gswt o s o
iXGowt s o s
iXGswt s o o
TRX B8/RX GSM 900 wGGGG~{y

jX][^ ZUZ jX][_ [^
msX]WZ jX][` ZU` jX]\W X\ i_SGn`WW
6 1
{tvk|sl{y[ ANT RX ~{ywysiXpu +1V8_VREG_L12
jX]\X YUY
3
TX ymGspulGhy{~vryGjh|zpvujvttvuGwh{o
sX]W_ 2 9 jX]\Y
GND1 GND6 sX]W` jX]\Z
]U_ 4 8
whtG{olyt
kup
GND2 GND5 kup X\
5 7
GND3 GND4
{vsdWUWX
yX]WY
lht]Y``WZWX
XWWr
jX]\[
kup zGGGcdZZm
GsuhGGG wh{olytW
{vsdWUWX
XWWr
jX]\] kup
w{X]WW
TP2
G~^G
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING

3. TROUBLE SHOOTING
jX]Z_ ZZ
whWvuY iX
whWvuZ i_
whWyW
X
X
X
2
3
4
5
TP2
RFIN
VENHB
VENLB
VMODE
jX][Z
jX][[
jX][\
1 6 TP1
16
VBATT
GND6 |X]WX
GND1
GND2
7 TP3
15 8
14 9
RFOUTHB GND3
RFOUTLB
17
PGND
GND5
GND4
VCC
13
12
11
10
+VPA0
XWW
XW
X
jX]ZX
jX]ZW
jX]Y`
3. TROUBLE SHOOTING
3.5.4 Checking RF RX Level
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP
3. TROUBLE SHOOTING
wGG
msX]WY jX]Z[ XUY jX]Z\ ZU`
6 1
ANT RX ~{ywy
3
jX]Z] X iX
iX TX
2 9 TP2
GND1 GND6
4 8
GND2 GND5 jX][W jX][X
5 7
GND3 GND4 [U^ WU\
sX]W^
lht]Y`\[\WX WU^\
jX][]
zGGGcdZZ
ZZ
GsuhGG

3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP
3. TROUBLE SHOOTING
wGG
i
msX]W[ jX]W_ ZU` jX]W` ZU`
6 1
ANT RX ~{
jX]XW ]UY
3
TX
2 9
GND1 GND6
4 8 sX]WX
GND2 GND5
5
GND3 GND4
7 kup TP2 jX]X[
kup
jX]X`
kup
zGGG
GsuhG
wGG
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP
3. TROUBLE SHOOTING
zGGGcdZZm
GsuhGGG
wGGGG~
jX]YX ZZ msX]WX jX]YY XU\ jX]YZ
i\SGn_\W
X\
6 1
ANT RX ~{ywysiYpu
\U] jX]Y[
3
TX
2 9
GND1 GND6
4 8 sX]WZ sX]W[
GND2 GND5 sX]W\
5 7
TP2
kup XU\
GND3 GND4 kup
lht]Y`\[]WX
jX]Y\
kup zGGGcdZZm
GsuhGGG
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
z~XXWX jXXWX YUY

XWW jXWW]Y 2
ANT COMMON
1
G3 G4

_Y
TP1
GOGkntzGnGP
3. TROUBLE SHOOTING
wGGGG~{y
6 1
ANT RX ~{ywysiXpu
jX]\X YUY
3
TX
2 9 jX]\Y
4 8 kup
GND2 GND5 kup X\
5 7
GND3 GND4
TP2
lht]Y``WZWX
jX]\[
kup zGGGcdZZm
GsuhGGG

3. TROUBLE SHOOTING
LGE Internal
LGE Use Only
Internal Use Only - 61 - Copyright © 2014 LG Electronics. Inc. All right reserved.
3. TROUBLE SHOOTING
3.6 Checking GSM Block
START
Check XO Block
Refer to 4.3
Check FEMID Block

Refer to 4.4
Check RF TRX Level
Re- Download SW & Cal
3. TROUBLE SHOOTING
3.6.1 Checking TCXO Block

Refer to 4.3
3.6.2 Checking Tx module Block

Refer to 4.4
3.6.3 Checking
z~XXWX jXXWX YUY

2
ANT COMMON
1
G3 G4
sXWW][ 3 4 sXXWX WU\

sXXWZ kup sXXWY
_Y
GOGkntzGnGP
TP1 ynX_WW XU\ jXXWY
ynX`WW jXXWZ YUY
kup
kup
21
20
19
18
17
16
15
14
13
sXXW]
SPDT_OUT
RX2
SPDT_IN
RX1
GND14
GND13
ANT
GND12
GND11
sXXW\
GND15 GND10
22 12
GND16 GND9
23 11
24 10
GND17 GND7
25 9
{tvk|sl{yY TRX2 GND6
26 8
27 7
{tvk|sl{yZ 28
TRX3 |XXWW GND4
6
GND19 VCC2
29 5
30 4
GND20 GND3
R}whih{{W 31
VBATT GND2
3
32 2
YY
NC1 GND1
[U^
XW
XWW
XW
XW
33 1
MODE0
MODE1
HB_EN
LB_EN
RF_IN
PGND
SPDT
jXXW`
jXXXX
jXXXZ
SW1
SW0
jXXXW
NC2
jXXXY
jXXX[
34
35
36
37
38
39
40
41
42
43
yXXWW
G~^GjpGOW]VW^P G~^GjpGOW]VW^P
XU_
zwk{zls
~{y{Xv|{
hu{Wz~zlsW
hu{Wz~zlsX
yXXWX
yXXWY
kup
kup
YY
YY
YY
YY
YY
YY
YY
jXXX\
jXXX]
jXXX^
jXXX_
jXXX`
jXXYW
jXXYX
TP2
3. TROUBLE SHOOTING

3. TROUBLE SHOOTING
START
Check XO Block Refer to 4.3
Check TP1 Yes

If GSM over 31 dBm? GSM Tx is OK
If DCS/PCS over 28 dBm? Check the other part
No
Check TP2 Yes

If GSM under 6 dBm? Check the Tx Module
If DCS/PCS under 6 dBm?
No
Check WTR2605
3. TROUBLE SHOOTING
3.6.4 Checking RF Rx Block
TP1
jXWW]X XWW jXWW]Y
1
z~XXWX
ANT
G3
COMMON
G4
2
jXXWX YUY
TP4
sXWW]Z sXWW][ 3 4 sXXWX
sXWW]X WU\
kup kup sXXWZ kup
kup _Y
sXXWY X_[YU\Wto¡VX`]WUWWto¡
5
GND4
GSM1800_OUT GND3
6 4
7
GND5 GND2
3 wGGGG~{y
GOGkntzGnGP msXXWW
GND6 zmyn[YkiWWY GND1
tjTjWWWWYTX[GaGlzkGwGj 8 2 sXXW_ XU_
sXXW^ ZZ
ynX_WW XU\ jXXWY
GSM1900_OUT GSM1800/1900_IN ~{ywytiZpu
9 1
ynX`WW jXXWZ YUY
GND7
nX_WWSGnX`WW
10
kup
kup
21
20
19
18
17
16
15
14
13
sXXW]
SPDT_OUT
RX2
SPDT_IN
RX1
GND14
GND13
ANT
GND12
GND11
sXXW[
sXXW\
ÙX jXXW[
kup
GND15 GND10
22 12
GND16 GND9
23 11
24 10
GND17 GND7
25 9
{tvk|sl{yY TRX2 GND6
26 8
27 7
{tvk|sl{yZ 28
TRX3 |XXWW GND4
6
GND19 VCC2 R}whih{{W
29 5
30 4
GND20 GND3
R}whih{{W 31
VBATT GND2
3
32 2
YY
NC1 GND1
[U^
XW
XWW
XW
XW
33 1
MODE0
MODE1
HB_EN
LB_EN
RF_IN
PGND
SPDT
jXXW`
jXXXX
jXXXZ
SW1
SW0
jXXXW
NC2
jXXXY
jXXX[
34
35
36
37
38
39
40
41
42
43
3. TROUBLE SHOOTING

jX][^ ZUZ jX][_ [^
6 1
{tvk|sl{y[ ANT RX ~{ywysiXpu
jX]\X YUY
3
TX
sX]W_ 2 9 jX]\Y
]U_ 4 8 kup
GND2 GND5 kup X\
5 7
GND3 GND4
lht]Y``WZWX
jX]\[
kup zGGGcdZZm
GsuhGGG
TP2
TRX B5/ RX GSM 850 jX]YW ZU` jX]YX ZZ msX]WX jX]YY XU\
wGGGG~{y
jX]YZ X\
i\SGn_\W
6 1
\U] jX]Y[
3
TX
sX]WY
_UY 2 9
GND1 GND6
4 8 sX]WZ sX]W[
GND2 GND5 sX]W\
5 7 kup XU\
GND3 GND4 kup
lht]Y`\[]WX
jX]Y\
kup zGGGcdZZm
TP3 GsuhGGG
Schematic of GSM(850/900)/DCS/PCS Rx Block
3. TROUBLE SHOOTING
START
No
Check TP1
Signal exist? Check RF Switch (M/S)
Yes
No
Check TP2,3,4
Signal exist? Check the Tx Module
Yes
Check WTR2605
3. TROUBLE SHOOTING
3.7 GPS Trouble Shooting

3.7.1 GPS IC Component
The WTR2605 is integrated GPS solution
3. TROUBLE SHOOTING
3.7.2 GPS Signal Path
3. TROUBLE SHOOTING
3.7.3 Checking GPS
3. TROUBLE SHOOTING
3.7.4 Photo/Circuit
TP1
yXXWW] sX
nuzzlsuhlu
_YW
kup
+2V75_VREG_L14
jXWW]`
jXWW]_
]U_
ZZ
7
1
VCTRL
VDD
sXWW]^ sXWW]\ jXWW]\

2 |XXWZ 5
\U] RFIN zmtnYihkWWX RFOUT
XWW XWW
jXWW]]
GND1
GND2
GND3
GND4
jXWW^W jXWW]^ kup

kup kup
3
6
[
jX\W_ XWW yX\WZ W

~{yWvpu ~{yvpu
kup
TP2
jX\XZ
Schematic of WTR2605
3. TROUBLE SHOOTING
3.8 WIFI/BT Trouble Shooting
3.8.1 WIFI/BT IC Component
3. TROUBLE SHOOTING
3.8.2 WIFI/BT Signal Path
3. TROUBLE SHOOTING
3.8.3 Checking WIFI,BT
3. TROUBLE SHOOTING
OzPRX}Wzsptwvy{pv}jj
VDD_CORE mi\XWW
VDD_LN
XYW
}puskv
+VPWR_WL
VDD_LN
YYW
YYW
rXW
sXW
WUX
WUX
XW
n^
o[
kX
kZ
kY
k]
k_
jX
j]
j_
YUY
r\
r]
r^
mX
mY
m^
qX
Y
~ymi|jr}kkXw\
~ym{jv}kkXw_
~ymwhky}}ih{}kk\wW
~ymzu{o}kkXwY
~ym{hsjhi}kkXwY
i{skvwh}kkYw\
i{}jv}kk
ozpjk}kkXYv|{
i{}kkih{
i{suh}kk
}kkjX
}kkjY
}kkjZ
}kkj[
i{wss}kk
}kkpvym
}kkpvX
}kkpvY
i{pm}kk
j\XWZ
j\XW[
j\XW\
j\XW]
j\XW^
j\XW_
TP2 TP1 jGGo[G
o\
uj
oX
~shu{Yn ~ymymv|{Yn
rX
~ymymv|{\n
nX
~shuyYn ~ymympuYn
sX
~ymympu\n
rY
Ynn{zzp ~ymn{zzppu
oY
~ymnwpvv|{
h^
}kksu }v|{suskv
i_
}kkjvyl }v|{jskv
i^
}v|{ZwZ }v|{ZwZ
+VPWR_WL
i`
zy}kkih{h\}
|\XWW
h`
VIN_LDO s\XW] YUY

h_
iXW
zy}kkih{w\}
skv}kkXw\ ijt[ZZ[sr|in
zy}s
tztG¶§·ôÆÒGÃÍÆë
[U^
X
X
X
XW
y\XW^ YY mXW
~shujsr zkpvjsr
nXW
~shujtk zkpvjtk
j\XY_
j\XY`
j\XZW
j\XZX
n`
~shuzkpvW zkpvkh{hW
j\XY]
m`
~shuzkpvX zkpvkh{hX
n_
~shuzkpvY zkpvkh{hY
l_
~shuzkpvZ zkpvkh{hZ
kXW
ozpjz{yvil
y\XW`
y\XXW
y\XXX
y\XXY
y\XXZ
[^r
[^r
[^r
[^r
[^r
lXW
ozpjkh{h
l`
Schematic of BCM4334
3. TROUBLE SHOOTING
3.9 Power
START
No
Battery voltage higher than 3.4V? Change or charging the Battery
Yes
Press PWR Key No

Change CN100
R4105 signal change from high to low?
Yes
Check PM8226’s SMPS voltage level?
No
Is it normal voltage?
Yes
No
Is the X4100 signal normal? Change X4100
Yes
No
Is the signal high at R41046 ?
Yes
No
Phone doesn’t boot yet?
Yes
Change the main board END
3. TROUBLE SHOOTING
4. 10. Power

3. TROUBLE SHOOTING
4. 10. Power
_\
jisw~yu
XWY
wtrwkw~yu rwkw~yu
XW_
vw{Y
XX`
vw{X
q{hnwzovsk
y[XW[ XWr XWW
tztwzovsk wzovsk
y[XW\ W XWX
ylzpupu
^^
tztylzpuu wvuylzl{u
-KPD_PWR_N
Check the signal change from high to low
-KPD_PWR_N
when push the PWR key. (R4105)
Check the signal change from high to low
when push the PWR key. (R4105)
CN100
1
CN100(2,3 pin -> power
yXWX XWW
key)
rlwhkzluzlW
yXWY XWW
2 wtrwkw~yu
3
4 CN100(2,3 pin -> power key) 2
5
yXWZ XWW
6 rlwhkzluzlY
kXW\ kXWZ
kXW[
3
- PS_HOLD check : R4104

It should be high when
- PS_HOLD power
check on
: R4104
It should be high when power on
_\
jisw~yu
XWY
wtrwkw~yu rwkw~yu
XW_
vw{Y
XX`
vw{X
q{hnwzovsk
y[XW[ XWr XWW
tztwzovsk wzovsk
y[XW\ W XWX
ylzpupu
^^
tztylzpuu wvuylzl{u
-3-
3. TROUBLE SHOOTING
y[XW] XWWr {vsdWUWX

+1V8_VREG_L12
[XWW
XlWWWY`XWWWX
4. 10. Power 4
Thermistor XTAL2
3
1 2
X
XTAL1 GND/Therm
XÙYto¡
kup
kup
j[XWW
j[XWX
j[XWY
XO Output check : X4100(19.2MHz)
XO Output check : X4100(19.2MHz)
3. TROUBLE SHOOTING
4. 10. Charger
3.10 Charger
D724 uses PMIC (Power Management IC) for charging control. The PMIC (PM8226) circuit
D724 usesincludes the Management
PMIC (Power charging pass transistor
IC) for detects
charging control. the VDD
The PMIC andcircuit
(PM8226) VBATincludes
voltages, and itspass
the charging control
transistordriver.
detects the VDD and VBAT voltages, and its control driver.
ChargingCharging
Procedure Procedure
- Supply the VCHG use a TA or u-USB cable
- Supply the VCHG use a TA or u-USB cable
- PM8226 control the charging current
- PM8226
- Charging control
current flows the
into the charging
main battery &current
system current
- Charging
Troubleshooting Checkcurrent
Point flows into the main battery & system current
- Connection of the TA or u-USB
Troubleshooting cable Point
Check
- Charging current path
- Connection of the TA or u-USB cable
- Main battery
- Charging current path
During charging operation, Internal detector circuits measure these voltages to
recognize- Main
when an battery
external supply.
And then,During charging
SW-controlled operation,
charging start. Internal detector circuits measure these voltages to
recognize when an external supply.
And then, SW-controlled charging start.
VBUS_USB_IN
X]X
X^Y
|zipuX
|zipuY
j[XZX XW X^X

+5V0_VREG_BHARGER X]Y
v}wjwky}
v}wv|{
j[XZY XWW X]^
}ky}w
X[Z
+5V0_VREG_BHARGER X\\
}jonX
}jonY
s[XZZ X X\[
+VPWR X]]
}z~jonX
}z~jonY
[U^
[U^
X\Y
}wow~yX
j[X[Y
j[X[Z
X][
}wow~yY
X[W
ih{ml{jwky}
XZ`
jonwnuk }ih{X
X\X
VBAT X]Z
}ih{Y
j[X[\ WUX
}ih{Z
X\]
VBAT_SENSE }ih{zuz
}ih{zluzlw j[X[] [^W XZX
+VPWR XW^
itziw
itzjzw
`]
uGY itzjzu
^]
VCOIN }jvpu
}ih{zluzlu uGX XW[
+5V0_VREG_BHARGER [
}kkmshzo
+1V35_VSW_S3 X
}kknyX
}kknyYX
y[XZ` XX
}kknyYY
+2V1_VSW_S4 +2V075_VREG_L25 XX\
W
+2V1_VSW_S4 Y^
}kknyZ
+2V1_VSW_S4 \`
}kkny[
+VPWR }kkny\X
]W
}kkny\Y
^
R}w~y }kkny]
[X
}kkny^
[_
}kksY\
XYX
h}kkiw
X^W
uGZpG GNGG GiSGjGR}w~y }wyliw
`
+VPWR XW
}kkzXX
Test Point :
1. VCHG ( if TA or u-USB connected,
+5.0V)
2. C4142 , C4143
5
5

3. TROUBLE SHOOTING
START
Check the Connection of uUSB and battery.
No
Connection OK? Change I/O connector
Yes
No
Is the uUSB Cable voltage 5.0V Change TA
Yes
Yes
Is it charging properly
No
Change the main board
END
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
3.11 Camera
4.11 Camera
3.11.1 8M Camera Trouble Shooting
4.11.1 8M Camera Trouble Shooting
8M camera control signals are generated by MSM8226
8M camera control signals are generated by MSM8226
LGE Internal Use OnlyUse Only

LGE Internal - 84 - Copyright © 2014 LG Electronics. Inc. All right reserved.
3. TROUBLE SHOOTING
+2V8_EXT_LDO3
TP4
TP5 TP3
TP2
thpujhtWtjsr
y^ZWW W
TP1
}h^[W\
}h^[W[
ju^ZWW
thpujhtWylzl{u
TP5 1 30
kup
2 29
3 28
TP1
}h^ZWZ
j^ZW[
4 27
FL7301 5 26
5
+1V2_VREG_L5
TP2
6 25
7 24
+1V8_CAM_IOVDD
tpwpkh{hXw 8 23
7 6
3 4
tpwpkh{hXu +2V8_EXT_LDO1
TP3
9 22
10 21
tpwpkh{hWw 11 TP4
20
9 8
1 2
7 6
tpwpkh{hWu 12 TP5 19 TP1
13 18
14 17
10
9 8
15 16
YUY
[U^
TP3
YUY
YUY
ms^ZWW
6
G2
j^ZWW
2 4
j^ZWY
j^ZWX
j^ZWZ
Wtpwpjsrw
TP4
D2 D4
1 3
Wtpwpjsru D1 D3
\ nX
TP2
C
N
Bottom
TP5
CN7300
TP2
TP3
TP1
TP4

3. TROUBLE SHOOTING
3.11.2 1.3M Front Camera Trouble Shooting

1.3M camera control signals are generated by MSM8226
4.11.2 1.3M Front Camera Trouble Shooting
1.3M camera control signals are generated by MSM8226
START
Disconnect and reconnect

camera connector (CN7400)
YES
Camera is OK?
NO
TP1 : 2.8V NO
TP2 : 1.2V
TP3 : 1.8V
YES
NO
TP4 : 24MHz
YES
Change the Camera Module
NO
Camera is OK? Change the Main Board
YES
END

3. TROUBLE SHOOTING
ms^[WW
6
G2
2 4
}{jhttpwpkh{hWw 1
D2 D4
3
}{jhttpwpkh{hWu D1 D3
\ nX
TP4
ms^[WX
6
G2
2 4
}{jhttpwpjsrw 1
D2 D4
3
}{jhttpwpjsru D1 D3 ju^[WW
1 20
\ nX
2 19
3 18
4 17
y^[WX W 5 16
}{jhttjsr 6 15
7 14
johunlwhy{ 8 13
9 12
XUzl}WWW\[WYelho]X\ZZZWX 10 11
YUylmkntzjoljrspz{
kup
j^[WZ
}h^[WW
TP2 TP1
TP3
ju^[WW
1 20
2 19
3 18
+2V8_EXT_LDO1
4 17
5 16
+1V2_VREG_L5
6 15
+1V8_CAM_IOVDD
7 14
8 13
jhtWpYjzkh
9 12
jhtWpYjzjs
elho]X\ZZZWX 10 11
}{jhtylzl{u
ljrspz{
kup
YUY
YUY
YUY
j^[WZ
}h^[WW
j^[WW
j^[WX
j^[WY
3. TROUBLE SHOOTING
Bottom
TP1
TP4
TP2
TP3
3. TROUBLE SHOOTING
3.12 Main LCD Trouble Shooting

4.12
Main LCD Main
control LCD
signals TroublebyShooting
are generated MSM8226
Main LCD control signals are generated by MSM8226
3. TROUBLE SHOOTING
s^\WW
TP2
TP2
[U^
(C7501)
(C7501)
A2 B3
+VPWR D2
PVIN1 VOUT_P R\}\kk}ko
AGND2
y^[WY
A1 A3
XWr
AVIN SW_P
j^\WW
XW |^\WW
TP1
C2
FD k~_^\\h
D1
SW_N
B1
(C7502)
kz}lu EN
D3 C1
AGND1
REF -VOUT_N T\}\kk}ks

PGND
s^\WX
C3
B2
[U^
j^\WX j^\WY
XW XW
rev 0.4
TP1
(C7502)
j^\WZ
X
TP2
(C7501)
TP1
(C7502)

3. TROUBLE SHOOTING
TP6
TP4 TP6
RX}_}ylns_
FL7100
10
RZ}W}ylnsX\
TP4 TP3 TP5
2 1
8 9
sjktpwpkh{hWu
TP3 sjktpwpkh{hWw
TP5
4 3
6 7
juX\WWX
sjktpwpkh{hXu
1 30
sjktpwpkh{hXw
2 29
R\}\kk}ko
3 28
5
T\}\kk}ks
4 27
sjk}zuj
5
6
26
25
TP7
w\ \
sjkylzl{u 7 24
jhij~slk 8 23
9 22 1
P1 P4
4
sjktpwpjsru
mi^YWW ]WW
10 21 2
P2 P3
3
sjktpwpjsrw
wtpjslkh
P6
11 20
wtpjslkj
TP7
12 19 msX\WWY
6
13 18
14 17
15 16
sjkthrlypk FL7101
X
X
10
jX\WW[
TP8
XWW
XWW
kup
X
kup
jX\WWZ
jX\WWY
8 9
2 1
sjktpwpkh{hYu
jX\WWW
jX\WW\
jX\WW]
sjktpwpkh{hYw
jX\WWX
}hX\WWY
}hX\WWX
}hX\WWW
}hX\WWZ
6 7
4 3
sjktpwpkh{hZu
sjktpwpkh{hZw
TP8
Bottom
TP5
TP4
TP3
TP6 TP8
(FL7100) (FL7101)
TP7
(FL15002
)

3. TROUBLE SHOOTING
3.13 Audio
3.13.1 Speaker troubleshooting
4.13 Audio
4.13.1
Speaker Speaker
path as below : troubleshooting
Speaker ->
MSM8226 path as below
WCD9302 :
SPKR_DRVP / SPRK_DRVN -> Speaker
MSM8226  WCD9302 SPKR_DRVP / SPRK_DRVN  Speaker
3. TROUBLE SHOOTING
TP1
(L6611) TP2
XWWW ANT10003 EAG63613001

mi]]XW s]]XX _Y
zwrw FEED
mi]]W` XWWW TP1

s]]XY _Y
zwru (L6611)
FEED
TP2
ANT10004 EAG63613001
ZZ
ZZ
kup
kup
jTjspwGwuGjohunlGXU[
j]^WX
j]^WW
TP3
j]^WY
j]^WZ
(L6612)
TP4
TP3 TP4
(L6612)
TP3 TP1 TP2 TP4
(L6612) (L6611)

3. TROUBLE SHOOTING
Z
}kki|jr RY}X}z~z[
i|jr}z~
XZ
tGGGGi|jr}v|{XGGYGGj]XW[U
mi]XWW XWWW
TP5
]
(FB6100)
[U^
i|jr}v|{X
YUY
XY
i|jr}v|{Y
j]XW[
j]XW\
^
nuki|jr
j]XW^ X
XX
Tujw}uln
kGGGGGGVujwGGU
Y
ujwjXw j]XW_
X
TujwjXt X OkntzGnP
tjTjW]X]YTXGaGXUGkNGGwGG{SG{}zGGGuGGG
TP5
[`
YUG~GGtsjjGGGGU
zwryky}w zwrw (FB6100)
\W
zwryky}t zwru
[\
}kkzwrky} R\}Wzwrivvz{
\\
kup
[U^
nukzwrky}X
kup
[W
nukzwrky}Y
TP6
j]XW`
X_
j]XYX
j]XYY
nuk[
(C6109)
TP6
(C6109)
TP6
(C6109)
TP5
(FB6100)

3. TROUBLE SHOOTING
3.13.2 Receiver troubleshooting

4.13.2 Receiver troubleshooting
Receiver
Receiver path
path as below
as below : :
MSM8226 -> WCD9302
MSM8226 EAROP/
 WCD9302 EAROM
EAROP/ -> Receiver
EAROM  Receiver

3. TROUBLE SHOOTING
TP1 TP2
(L6450)
CN6450
s][\W _Y
1
yj}w
j]_XW ZZ
s][\X _Y 2
yj}u
ZZ
ZZ
k]_XW k]_XX
kup kup TP3 TP4
j]_XY
j]_XX
(L6451)
3. TROUBLE SHOOTING
3.13.3 Main MIC troubleshooting

4.13.3 Main MIC troubleshooting
Main Mic. path as below :
Main Mic. path as below :
MSM8926 -> WCD9302 MIC1_INP/ MIC1_INM -> Mic
MSM8926  WCD9302 MIC1_INP/ MIC1_INM  Mic
3. TROUBLE SHOOTING
tpj]`YW
tpjiphzX
WUX
G4
6
G3
TP1 5
j]`YW
VDD
(C6920) 4
G2
3
tpjpuXu G1
2
TP1 OUT
ZZ
1
(C6920)
j]`YX
mi]`YW X_WW
tpjpuXw
kup
y]`YW
k]`Y\
k]`Y[
k]`Y]
TP2
(FB6920)
TP2
nukGjGGtpj
(FB6920)
TP1
(C6920)
TP2
(FB6920)
3. TROUBLE SHOOTING
4.13.4 SUB MIC troubleshooting

3.13.4 SUB
Sub Mic. pathMIC troubleshooting
as below :
MSM8226  WCD9302 MIC3_INP/ MIC3_INM  Mic

Sub Mic. path as below :
MSM8226 -> WCD9302 MIC3_INP/ MIC3_INM -> Mic
3. TROUBLE SHOOTING
tpjiphzX
WUX
G4
TP1 6
G3
TP1 (C6922)
5
VDD
j]`YY
(C6922) 4
3
G2
tpjpuZu G1
2
OUT
ZZ
1
tpj]`YX
j]`YZ
TP2
mi]`YX X_WW
tpjpuZw
(FB6921)
kup
y]`YX
k]`Y`
W
TP2
(FB6921)
k]`Y_
k]`Y^
nukGjGGtpj
TP2
(FB6921)
TP1
(C6922)
3. TROUBLE SHOOTING
3.13.5 Ear-MIC troubleshooting

4.13.5 Ear-MIC troubleshooting
3.13.5.1 Headset Sound trouble
4.12.5.1 Headset Sound trouble
Ear-Mic. path as below :
MSM8226 -> WCD9302 HPH_L / HPH_R ->Headset
MSM8226  WCD9302 HPH_L / HPH_R Headset
3. TROUBLE SHOOTING
TP3 TP2
(FB6612) (FB6611)
lhytpjqhjr
mi]]XX X_WW
owosv|{ mi]]XZ X_WW S/W_Detect q]]WW
lhyzluzlqhjr SPK_L
mi]]XY X_WW SPK_R
owoyv|{ j]]XW X GND
mthu{ mi]]WW X_WW MIC
k\XWW
kup
s]]XZ
XW
XW
j]]XY
y]]XX
y]]XW
XWW
1
TP1
TP2
nukGjGGlq owoylm
y]]X^ W TP3
}h]]WW
}h]]WZ
}h]]WX
(FB6611)
TP4 (FB6612)
(FB6600)
W
(L6613)
2
}h]]WY
y]]X\
j]]XX
y]]XZ XW y][Y\

tpjiphzY R}w~y YU[t
YUYr
ZZ
TP1
j]]XZ
YUYr
|]]WW mzh\X\^s]
y][Y[ 1 6
j]]X[
S B1 (FB6600)
ZZWr 2 5
VCC GND
TP4
tpjpuYu 3
A B0
4
(L6613)
kup
y]]YY
kup
y]]X]
j]]W]
X
TP2
(FB6611)
TP3
(FB6612)
TP1
TP4
(FB6600)
(L6613)
TP5
TP6
(C6107)
(C6108)
3. TROUBLE SHOOTING
3.13.5.2 Headset Mic. trouble

4.13.5.2 Headset Mic. trouble
MSM8226 -> WCD9302 MIC2_INP/ MIC2_INM -> Headset
MSM8226  WCD9302 MIC2_INP/ MIC2_INM  Headset
End
3. TROUBLE SHOOTING
lhytpjqhjr
mi]]XX X_WW
lhyzluzlqhjr SPK_L
mi]]XY X_WW SPK_R
owoyv|{ j]]XW X GND
k\XWW
TP1
kup
s]]XZ
XW
XW
(FB6600)
j]]XY
y]]XX
y]]XW
XWW
TP1
(FB6600)
1
y]]X^ W
nukGjGGlq owoylm
TP2
}h]]WW
}h]]WZ
}h]]WX
W
(R6616)
2
}h]]WY
y]]X\
j]]XX
TP2 y]]XZ XW y][Y\
tpjiphzY R}w~y YU[t
YUYr
(R6616)
ZZ
j]]XZ
YUYr
|]]WW mzh\X\^s]
y][Y[ 1 6
j]]X[
S B1
ZZWr 2 5
VCC GND
3 4
tpjpuYu A B0
kup
y]]YY
kup
y]]X]
j]]W]
X
TP2
(R6616)
TP1
(FB6600)

3. TROUBLE SHOOTING
3.14 Touch
Touch control signals are generated by touch sensor.
Those signal’s path are touch sensor -> MSM8226
START
Reconnect Touch Module CN7200.
Yes
Touch Woks OK ? Change the touch module.
No
Yes
Change the touch module.
Touch Woks OK?
No
Check No
+2V95_VREG_L28 (C7201) TP1 Change PM8226 (U4100)
+1V8_VREG_L6 (C7505) TP2
Yes
Check I2C Line No

(VA7201, VA7202) TP3 Change Main Board.
OK?
Yes
Touch Woks OK ?
Yes
End
3. TROUBLE SHOOTING
TP3
TP2 TP1
4. 14. Touch
ju^YWW
y^YWW y^YWX
RX}_}ylns] 1 10 RX}_}ylns]
[U^r
[U^r 2 9
{v|jopYjzjs 3 8
{v|joylzl{u
TP2
{v|jopYjzkh RX}_}ylns]
4 7
TP1
{v|jopu{ RY}_}ylnsY_
TP3
5 6
{v|jothrlypk
YUY
X
Y
j^YWX
j^YWW
}h^YWW
}h^YWX
}h^YWY
}h^YWZ
}h^YW[
TP1 +2V95_VREG_L28
(C7200)
TP3
(I2C Line & Signal Line)
TP2
(VA7201 & VA7202)
+1V8_VREG_L6
(C7201)
LGE Internal Use Only - 106 - 9 Copyright © 2014 LG Electronics. Inc. All right reserved.

3. TROUBLE SHOOTING
3.15 Sensor
3.15. 1. Compass + Motion Sensor
START
Accelerometer function Check.
Yes
Change PM8226. (U4100) Sensor Woks OK ?
No
No Check
+1V8_VREG_LVS1 (C8100) TP1
+2V85_VREG_L19 (C8101) TP2
Yes
Yes
Check I2C Line.
(R2207, R2208) TP3
No
Change Main Board.
Change the sensor (U8100).
Sensor Woks OK ?
Yes
End
3. TROUBLE SHOOTING
4. 15. Sensor
TP1
+1V8_VREG_LVS1
4. 15. 1. Compass + Motion Sensor

zluzvyWpYjzkh
14
13
12
SDI
PS
CSB
1 11
2
SDO SCK
10
zluzvyWpYjzjs
hjjlspu{ 3
INT1 |_XWW VDDIO
9
INT2 itjX\W GND3
4 8
jvtwhzzpu{ DRDY
GND1
VDD +2V85_VREG_L19
GND2
INT3
j_XWW j_XWX
5
6
7
WUX WUX
TP2
TP1
TP3
TP2
Gz +1V8_VREG_LVS1
yYYW^ YUYr
zluzvyWpYjzkh
TP3
yYYW_ YUYr
zluzvyWpYjzjs
TP1
TP3 U8100
TP2

3. TROUBLE SHOOTING
3.15. 2. Proximity
Proximity Sensor is worked as below:

Send Key click -> Phone number click -> Call connected -> Object moved at the sensor
-> Control the screen’s on/off operation automatically
START
Proximity function Check.
Yes
Change PM8226. (U4100) Sensor Woks OK ?
No
Check
No
+2V85_VREG_L19 (C8400) TP1
+1V8_VREG_LVS1 (R8400) TP2
OK?
Yes
Yes Check I2C Line.

(R2207, R2208) TP3
OK?
No
Change Main Board.

Change the proximity sensor
(U8400).
Sensor Woks OK ?
Yes
End
3. TROUBLE SHOOTING
TP2
4. 15. Sensor
y_[WW [U^r |_[WW hwkzT`XZWTYWW
+1V8_VREG_LVS1
1 8 y_[WX
zluzvyWpYjzkh SDA VDD +2V85_VREG_L19
4. 15. 2. Proximity
YY
2 7
wyvptp{pu{ INT SCL zluzvyWpYjzjs
3 6
LDR GND
TP2
4 5
LEDK LEDA
9
NC j_[WX j_[WW
TP1
X X
TP1
TP3
Gz +1V8_VREG_LVS1
yYYW^
yYYW_
YUYr
YUYr
zluzvyWpYjzkh TP3
zluzvyWpYjzjs
U8400
TP2 TP1
TP3
13
3. TROUBLE SHOOTING
3.16 USB
START
No
Cable is inserted? Insert Cable
Yes
No
VCHG is 5V? Check C10001
Yes
No
USB_DP is 3.05V? Check R9202
Yes
Change the Main Board
3. TROUBLE SHOOTING
4. 16. USB
Typical USB Path.
Typical USB Path. kupGG
msXWWWW
X Z
IN OUT VBUS_USB_IN
Y [
GND1 GND2
kup
[^r
YY
X
jXWWWW
jXWWWX
yXWWWW
kXWWW^
kXWWWW
juXWWWX
6
7
msXWWWX
8
6
P6
VBUS1
D- 2 2 4 y`YWX W
P2 P4 |zikt
D+3 1 3 y`YWY W
P1 P3 |zikw
ID 4
\ w\
GND5
2
9
10
11
1
1
k`YWY
k`YWZ
wt|zipk
wt|zipkGaGkGGG|ziGG
kup
kXWWW]
GGpkGGtztGwoGG
j`YWY
VCHG Check : C10001

VCHG Check : C10001
USB_DP : R9202
- 15 -
3. TROUBLE SHOOTING
3.17 Vibrator Trouble Shooting

Vibrator signal’s path is MSM8226 -> SM100 (U8800) -> Vibrator
Q-coin Motor is controlled by SM100 according to immersion library
Start
Change the Motor
Yes
Motor vibrate well?
No
Yes
Rework the U4100
Vibrate is normal?
No
Replace the MAIN PCB
End
3. TROUBLE SHOOTING
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3. TROUBLE SHOOTING
U4100
3. TROUBLE SHOOTING
3.18 FM Trouble Shooting
3.18.1 FM Component
3. TROUBLE SHOOTING
3.18.2 FM Signal Path
3. TROUBLE SHOOTING
3.18.3 FM Signal Path
3. TROUBLE SHOOTING
3.18.4 FM Placement/Circuit
TP3
TP2
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4. DOWNLOAD
4. DOWNLOAD
TOOL INFORMATION
TOOL VERSION DLL NAME USB DRIVER

LGD724_20140520_LGFLASHv160_ LGUnitedMobileDriver_S4981MAN38AP22_ML_WHQL_
LGFLASHv160
Download Ver_3.8.1
Please Check the Version to “B2B”
H/W
Name Part No. Software
D/L Cable Micro 5P (56-open-910K) USB DLC RAD32167835 TOT
4. DOWNLOAD
LGD724
LGD724
4. DOWNLOAD
LGD724
LGD724_20140520_LGFLASHv160_Download
LGD724
4. DOWNLOAD
4. DOWNLOAD
LGD724
LGD724
4. DOWNLOAD
RAD32167835
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
LGD724
LGD724
LGD724AT-00-V10a-SSV-XXX-JUN-03-2013+0.tot
LGD724
4. DOWNLOAD
LGD724 LGD724_20140520_LGFLASHv160_Download
LGD724 LGD724AT-00-V10a-SSV-XXX-JUN-03-2013+0.tot
LGD724
LGD724
4. DOWNLOAD
LGD724
LGD724
4. DOWNLOAD
LGD724
LGD724
LGD724
4. DOWNLOAD
LGD724
LGD724
LGD724
5. BLOCK DIAGRAM
5. BLOCK DIAGRAM
LG-D724 Main Block Diagram
6. CIRCUIT DIAGRAM
6. CIRCUIT DIAGRAM
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6. CIRCUIT DIAGRAM
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6. CIRCUIT DIAGRAM
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TX RFOUTHB GND3
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3
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CPLIN zr^^^[YTYX CPLOUT
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2 9 17
XU_ GND1 GND6 PGND
GND5
GND4
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VCC
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5 7
GND3 GND4 [U^ WU\
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12
11
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6. CIRCUIT DIAGRAM
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6. CIRCUIT DIAGRAM
cGZTYTZTXT[ttj\W_n zGe
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ttjkh{hW DAT0 RFU1
A4 E5
ttjkh{hX DAT1 RFU11
A5 E8
ttjkh{hY DAT2 RFU5
B2 E9
ttjkh{hZ DAT3 RFU10
B3 G3
ttjkh{h[ DAT4 RFU2
B4 P7
ttjkh{h\ DAT5 RFU15
B5 P10
ttjkh{h] DAT6 RFU17
B6 G10
ttjkh{h^ DAT7 RFU6
K6
RFU12
M6 K7
ttjjsr CLK RFU13
K10
RFU14
M5
ttjjtk CMD
C2 D4
VDDI NC
C6 A1
VDD1 NC1
M4 C5
RX}_}ylns] VDD2 NC3
N4 G12
YUY
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jZYWZ
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E6 H1
VDDF1 NC62
F5 H2
VDDF2 NC63
J10 H3
VDDF3 NC64
K9 H12
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H13
NC67
E7 H14
VSS4 NC68
YUY
WUX
G5 J1
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H10 J2
VSS6 NC70
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VSS7 NC71
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N5 K13
VSS9 NC84
P4 K14
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P6 L1
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C4
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L2
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M3
NC94
A2 M7
NC2 NC95
A8 M8
NC5 NC96
A9 M9
NC6 NC97
A10 M10
NC7 NC98
A11 M11
NC8 NC99
A12 M12
NC9 NC100
A13 M13
NC10 NC101
A14 M14
NC11 NC102
B1 N1
NC12 NC103
B7 N3
NC13 NC104
B8 N6
NC14 NC105
B9 N7
NC15 NC106
B10 N8
NC16 NC107
B11 N9
NC17 NC108
B12 N10
NC18 NC109
B13 N11
NC19 NC110
B14 N12
NC20 NC111
C1 N13
NC21 NC112
C3 N14
NC22 NC113
J12 P1
NC73 NC114
C7 P2
NC24 NC115
C8 P8
NC25 NC117
C9 P9
NC26 NC118
C10 P11
NC27 NC120
C11 P12
NC28 NC121
C12 P13
NC29 NC122
C13 P14
NC30 NC123
RFU9
RFU4
NC31
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC74
NC75
NC76
NC45
NC46
NC47
NC48
NC49
NC50
NC52
NC53
NC54
NC55
NC56
NC77
NC78
C14
D1
D2
D3
D12
D13
D14
E1
E2
E3
J13
J14
K1
E12
E13
E14
F1
F2
F3
E10
F12
F13
F14
G1
G2
K2
K3
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6. CIRCUIT DIAGRAM
cG]TXTXTXj~jk`ZWYGe yWU\
cG]T]TXlGe yWU[
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GND1
GND2
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ANT10004 EAG63613001
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6. CIRCUIT DIAGRAM
cG^TXT^TZTXsjk\WGokGe
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kjX 3 2
kshX skvXlu CE GND
XGTGkGGGwGGGGlzkGG DLA_1
X
kshY ksh^
khpzjohpu
X
YTGsjkGjGGGGkupGwGGlzkGG DLA_2 ksh^
kshZ ksh]
5
DLA_3 DLA_6
ksh[ ksh\
j[X`W
j[X`X
DLA_4 DLA_5
cGtjZW_tGe
VT_MAIN_CAM_LDO3
+2V8_EXT_LDO3 +VPWR
TLV70728PDQNR U4193
jhtWpYjzkh
4 1
jhtWpYjzjs VDD VOUT +2V8_EXT_LDO3 X\Wh
PGND
3 2
y^ZWW W
thpujhtW}jtw~ku CE GND
thpujhtWtjsr
X
X
}h^[W\
}h^[W[
ju^ZWW
thpujhtWylzl{u
5
1 30
kup
j[X`_
j[X`^
2 29
3 28
}h^ZWZ
j^ZW[
4 27
FL7301 5 26
5
6 25
+1V2_VREG_L5
7 24
+1V8_CAM_IOVDD
thpujhtWtpwpkh{hXw 8 23 FL7302
7 6
3 4
thpujhtWtpwpkh{hXu 9 22
+2V8_EXT_LDO1
10 21
thpujhtWtpwpkh{hWw 11 20
thpujhtWtpwpkh{hZw
9 8
1 2
7 6
3 4
VT_MAIN_CAM_LDO4
thpujhtWtpwpkh{hWu 12 19
thpujhtWtpwpkh{hZu
13 18
14 17
thpujhtWtpwpkh{hYw
10
9 8
1 2
15 16
thpujhtWtpwpkh{hYu
+VPWR
10
YUY
[U^
YUY
YUY
ms^ZWW
6
TLV70718 U4192
G2
j^ZWW
2 4
j^ZWY
j^ZWX
j^ZWZ
thpujhtWtpwpjsrw D2 D4 4 1
1 3 VDD VOUT +1V8_CAM_IOVDD X\Wh
PGND
thpujhtWtpwpjsru D1 D3 3 2
skvZlu CE GND
\ nX
X
X
5
j[X``
j[X`[
cG^T[TX}{jYW}nhXUY]tXUZtYU[te
c^T\T[kz}k~_^\\e
yWU[ c`T_TZmslke
ms^[WW
6
G2
2 4
}{jhttpwpkh{hWw 1
D2 D4
3
}{jhttpwpkh{hWu D1 D3
\ nX
s^\WW
[U^
ms^[WX
6
mshzoslkv|{w
G2
2 4 A2 B3
}{jhttpwpjsrw D2 D4 +VPWR D2
PVIN1 VOUT_P R\}\kk}ko
1 3 AGND2
}{jhttpwpjsru D1 D3 ju^[WW
y^[WY
A1 A3
XWr
1 20 j^\WW AVIN SW_P

\ nX
2 19 XW
C2 |^\WW
3 18
+2V8_EXT_LDO1 FD k~_^\\h B1
4 17 SW_N
D1
5 16
+1V2_VREG_L5 kz}lu EN LD9830
y^[WX W D3 C1
+1V8_CAM_IOVDD
AGND1
}{jhttjsr 6 15 REF
PGND
-VOUT_N T\}\kk}ks }h^[W]
7 14
jhtWpYjzkh
johunlwhy{
s^\WX
8 13
C3
B2
[U^
j^\WX j^\WY
9 12
jhtWpYjzjs
XW XW
XUzl}WWW\[WYelho]X\ZZZWX 10 11
}{jhtylzl{u rev 0.4
YUylmkntzjoljrspz{
k`_ZWGaGjGXYUZ}GVG]\mGVGX\W~
kup
YUY
YUY
YUY
DGMS Guide
j^[WZ
}h^[WW
j^[WW
j^[WX
j^[WY
}h^[WWT^[WZGaGjGXYU_}GVGX\mGVG\W~ MC-C06162-1 : Don't connect positive of tantal to negative charger pump.

j^\WZ
X
6. CIRCUIT DIAGRAM
c_TXTYTXhjitjX\We
yl}XUW
c_T^TXTXoGpji|\YW]Xu}e
yWUZ
+1V8_VREG_LVS1
zluzvyWpYjzkh
14
13
12
SDI
PS
CSB
1 11
2
SDO SCK
10
zluzvyWpYjzjs
hjjlspu{ 3
INT1 |_XWW VDDIO
9 |_^WW i|\YW]Xu}
INT2 itjX\W GND3
4 8
jvtwhzzpu{ DRDY VDD +2V85_VREG_L19
GND1
GND2
1 4
INT3
ohsspu{
2
OUT VDD
3
+1V8_VREG_L6
GND NC
PGND
j_XWW j_XWX
5
6
7
j_^WX
WUX WUX
WUX
5
WUX
j_^WW
OkntzGnP
tjTjWWW\_TXY
tjTjWWW\_TXY hGGGG GGGGGGG S
GGGGGGG
c_T[TXTXw hwkzT`XZWe
yl}UXUW
yXUW
cG_T`TXTYpyyjVpjGe
y_[WW [U^r |_[WW hwkzT`XZWTYWW
+1V8_VREG_LVS1
1 8 y_[WX pyyjw~t{
zluzvyWpYjzkh SDA VDD +2V85_VREG_L19
y_`\X XWWr {vsdWUWX

YY
2 7 RX}_}ylns}zX
wyvptp{pu{ INT SCL zluzvyWpYjzjs
3 6
LDR GND
[U^
4 5 j_`\X RY}_\}ylnsX`
LEDK LEDA
LD8950
y_`\W
9 |_`\W zu^[h|wX{`^kzmy
NC j_[WX j_[WW
1 6 YUY
B C
3 2 5
Xr {vsdWUWX
X X 3
GND VCC
Xr {vsdWUWX
y_`\Y 2
XWW {vsdWUWX x_`\W ZWW {vsdWUWX 2
3 4 y_`\Z
spulv|{pyyj A Y
x_`\X j_`\W
1 [U^
1
}h_`\W
j_`\Y
y_`\[
y_`\\
WUX
Aplus GPIO 0/1 : DEFALUT PULL UP // ACTIVE LOW

C7600 PLACE CLOSELY AT PIN NO.8(AVDD)
ylkGslk +1V8_CAM_IOVDD
MSM GPIO #109 : LDAF_EN
MSM GPIO #110 : LDAF_INT
y^]WY
y^]WX
[^r
[^r
CN7500
R}w~y
hws|zlu 1
2 hws|zpu{
jhtWpYjzjs 3
4
jhtWpYjzkh 5 y^]WW +2V8_EXT_LDO1
6
y_`\]
XU\r
W
j_`\Z
XWW
LD8951
4
k^]WW
k_`WW
oyslkzpur
6. CIRCUIT DIAGRAM
< 9-2-1_IO_USB2.0 > yWU\ cG`T\TZtzkjGe

kupGG
msXWWWW
X Z
cGwjiGjGe +2V95_VREG_L22 +2V95_VREG_L22+2V95_VREG_L22 RY}`\}ylnsX_ RX}_}ylns] RY}`\}ylnsYX
IN OUT VBUS_USB_IN
Y [
GND1 GND2
kup
ANT1 ti}]Y\]YWWX
[^r
YY
X
1M
FEED
kup
kup
kup
kup
kup
jXWWWW
X\r
jXWWWX
yXWWWW
y`\XX
kXWWW^
kXWWWW
y`\XY
kup
W
R9501
y`\W_
y`\W`
y`\W\
y`\W]
y`\W^
y`\WW
juXWWWX
6
7
8
msXWWWX hu{YGjTjGjGaGXU[GTeGWU`\
6
OoGGwGuGtP
P6
VBUS1
D- 2 2 4 y`YWX W zX T1
P2 P4 |zikt }jj DAT2 zkjhykkh{hY
1 3 zY T2
D+3 P1 P3
y`YWY W
|zikw UIM1_RESET_N yz{ CD/DAT3 zkjhykkh{hZ
ID 4
y`\W[ XW zZ T3
|ptXjsr jsrX CMD zkjhykjtk
\ w\
GND5
z[ T4
ylzly}lkX VDD
z\ T5
2
9
z]
nuk CLK2
T6
zkjhykjsr
10 }ww z`\WW VSS
11
z^ T7
|ptXkh{h z_
pVv DAT0
T8
zkjhykkh{hW
ylzly}lkY DAT1
z~
zkjhykkh{hX
zV~ zkjhykkl{
1
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
k`YWY
k`YWZ
G1
G2
G3
G4
G5
G6
G7
G8
XW
XW
X
X
ZZ
j`\W\
}h`\WXW
wt|zipk
}h`\WX
}h`\WY
}h`\WZ
}h`\W[
j`\WX
j`\W[
}h`\W\
}h`\W]
}h`\W^
}h`\WW
}h`\W_
}h`\W`
j`\WY
j`\WZ
wt|zipkGaGkGGG|ziGG ^VYGj`\WXV`\W\GjpG
kup
kXWWW]
GGpkGGtztGwoGG
j`YWY
zkGkh{hGspulG}hypz{vy
}hs|lGjohunlGX\mGTeG\m
iG}Gr kGzptG cG`T`TXTXtGe

CN100
5
2
4
yXWX
yXWY
XWW
XWW
wtrwkw~yu
rlwhkzluzlW
+2V95_VREG_L23 R}w~y
yWUZ
yXWZ XWW
6 rlwhkzluzlY ju[
y`\XW s``XW XWW 1

kXW\ kXWZ
X\r 2
kup
kXW[
X
juYWW[
G1 G2
j``XY
jXWWWY
k``XW
1 10
|ptYkh{h 2 9 s``XX XWW
y`\XZ XW 3 8 wtpj}piu
|ptYjsr 4 7
ZZ
ZZ
k__WZ
5 6
|ptYylzl{u
X
G3 G4
j``XW
j``XX
XW
j`\XW
j`\XY
}h`\ZY
XW j`\W]
}h`\ZW
}h`\ZX
jG[GG]GGh
{vwGzoplskGjhuGjspw
zjXWWWX zjXWWWY zjXWWWZ zjXWWW[ zjXWWW\ zjXWWW] zjXWWW^ zjXWWW_ zjXWWW`
1 1 1 1 1 1 1 1 1
iv{{vtGzoplskGjhuGjspw
wpk zjyl~ovsl nuk
zjYWWWX zjYWWWY zjYWWWZ zjYWWW[ zjYWWW\ zjYWWW]

wpkX
vqXZWWW
vqXZWWX
vqXZWWY
1 1 1 1 1 1
7. BGA PIN MAP
7. BGA PIN MAP

8. BGA Pin Map
8.1
U1500 U1500 – WTR2605
– WTR2605
7. BGA PIN MAP
8.2 U2100 MSM8226

U2100 MSM8226
7. BGA PIN MAP
U3200 eMMC
8.3 U3200 eMMC
7. BGA PIN MAP
U4100 PM8226
8.4 U4100 PM8226
7. BGA PIN MAP
U5100 BCM4334
8.5 U5100 BCM4334
7. BGA PIN MAP
CODEC IC – WCD9302
8.6 CODEC IC – WCD9302
8. PCB LAYOUT
8. PCB LAYOUT
U8400 : Proximity Sensor

- No Proximity Funtion LD8950 : IRRC LED
- Q-remote not Operate
U6100 : Audio Codec
- No sound
U1103 : GPS LNA
U1500 : Modem WTR205 - GPS Not operate
- No Network Service
- No Power
U1100 : FEM + GSM PAM

- No Network service
FL1603 : WCDMA Band 8 Duplexer

- No Network service U2100 : Main AP MSM8226
- No Power on / No Charging
U4100: PMIC
FL1601 : WCDMA Band 5 Duplexer - No Power / No Charging

U7500 : DSV
U1600 : WCDMA Band 2/5 PAM - No Display
U1601 : WCDMA Band 1/8

U8700 : Hall Sensor IC

- Quick Cover not operate
LG-D724_MAIN_EAX66044701_1.0_TOP-1
8. PCB LAYOUT
LG-D724_MAIN_EAX66044701_1.0_TOP-2
8. PCB LAYOUT
MIC6921 : Sub MIC

- Sub MIC not Operate
LD9830 : Flash LED

- Camera Flash not operate
U5100 : BT/WIFI Module

- Can not use BT and WIFI
U8100 : Compass/Accel Sensor IC
- No Compass / Accel Funtion
U3200 : eMMC J9500 : SD Card / SIM Socket

- No Power / Reset - No SD Card / No SIM Funtion
SW101: RF Mobile Switch

LG-D724_MAIN_EAX66044701_1.0_BOT-1
8. PCB LAYOUT
MIC6920 : Sub MIC

- Sub MIC not Operate
LG-D724_MAIN_EAX66044701_1.0_BOT-2
9. CALIBRATION
9. CALIBRATION
CAL INFORMATION
S/W VERSION
[TachyonV48] LGD724 20140725 ALL File Calibration
Please Check the Version to “B2B”
H/W
Name Part No.
PIF PIF200(All Type) BJAY0024021
USB Cable USB Cable RAD32247898
Power Cable DC Power Cable RAD32247878
I/O Cable 5P E-SATA_DC_Plug RAD32167861
RF Cable_Main MS-156C MXFJK1WT4000C2
Power Supply_PIF Power Supply 5.3V
Power Supply_Phone Power Supply 5.0V
RF Test Equipment E5515C(8960)
NOTICE Use the Battery
9. CALIBRATION
GDMS
GDMS
9. CALIBRATION
LGD724
MS695
[TachyonV48] LGD724 20140725 ALL File Calibration

[Tachyon36]LGMS695_20120213_Calibration
LGD724
9. CALIBRATION
9. CALIBRATION
LGD724
9. CALIBRATION
LGD724
LGD724
LGD724
LGD724
LGD724
LGD724
LGD724
LGD724
9. CALIBRATION
LGD724
9. CALIBRATION
COM1
A COM3
2A 2B
5.5V
The phone
must be fitted
with the bettery
RAD32167861
RF cable : MS-156C
(P/No : MXFJK1WT4000C2)
This is for example.

You can check “C:\LGE\Tachyon\Model\D724\Setting Guide”
9. CALIBRATION
2A COM1
A
COM3
2B
Shield Box USB Cable
RF Connection Cable
2
4
2 3 4
USB cable (A-B type)
(P/No : BJAY0020060) MS-156C
MXFJK1WT4000C2
GPIB cable (IEEE-488)
(P/No : BJAY0020058)
RAD32167861
2A B
2B
A
This is for example.

You can check “C:\LGE\Tachyon\Model\D724\Setting Guide”
9. CALIBRATION
9. CALIBRATION
9. CALIBRATION
9. CALIBRATION
Tachyon_48
Tachyon 36
Tachyon_36
9. CALIBRATION
5.3V
5.0V
9. CALIBRATION
9. CALIBRATION
9. CALIBRATION
LGD724
MS695
LGD724
LGD724
LGD724
LGD724
LGD724
LGD724
LGD724
9. CALIBRATION
D724
MS695
9. CALIBRATION
D724
MS695
D724
MS695
RF900
10. HIDDEN MENU
10. HIDDEN MENU
Hidden Menu Start

Start shortcut keys: 3845#*724#
Hidden Menu
Start the desired menu: Menu, click
Version Info
Classified Information representation
Hidden Menu
Settings
Version Info
10. HIDDEN MENU
Factory Reset
Factory Reset : Reset as default
Factory Settings
Factory Reset(Power Off) :
Reset as default
Factory Settings and Power Off
Hidden menu
WCDMA-Only
Factory Reset
AAT Device Test

All auto Test - Full :
You can test all functions
automatically
All auto Test - Full (+Power)

You can check Test Results
When you touch the screen with pushing
power key
10. HIDDEN MENU
Auto Detecting Item

Check below Items
USIM Card1 : connecting is PASS
USIM Card2 : connecting is PASS
SD Card : connecting is PASS
Ear Phone : No connecting is PASS
TA wrong : No connecting is PASS
SmartCover : No connecting is PASS
battery ID : Right Battery ID is pass
Key Press Test

Check below Items
Up/Down key : Hard Key
Proximity Sensor : Blind the Proximity sensor
Camera Test – Snapshot

Touch screen to capture
- You must use 20cm Camera
JIG if you calibrate A+
10. HIDDEN MENU
Camcorder Test
Camera is recoding for 5 seconds
VT Camera Test
Show the VT Camera image
Display Check Test

Check Black & White Color
10. HIDDEN MENU
Sound Test
Check the sound
Vibrator Test
Check the vibration
IrRC Test
Touch the ‘Start’ Button and check IrRC function
through JIG
10. HIDDEN MENU
Touch Drawing Test

Draw a guide line
Motion Sensor Test

Check 3 positions & Magnetic sensor
Position horizontally
Position Vertically
Position side
GPS BT Wifi Test

GPS(RF) test : CNO is some value : OK
Bluetooth Scanning is PASS : OK
WiFi Scanning is PASS : OK
10. HIDDEN MENU
FM Radio Test
Connect wired headset
Check the volume of FM radio
Loopback Test
Check the Audio loopback
Check the Speaker loopback
Individual item
You can test only individual item
11. DISASSEMBLE GUIDE

12. Disassemble guide
11 DISASSEMBLE BATTERY
12.1 Disassemble COVER
Battery Cover
TAKE APART THE BATTERY COVER USING NOTCH BELOW

Take apart the battery cover using notch below
Take apart the battery cover using notch below

11.2 DISASSEMBLE BATTERY & SCREW

12.2 Disassemble Battery & Screw
TAKE APART THE BATTERY AND REMOVE SCREW (12 POINT)

Take apart the battery and remove screw
11.3 DISASSEMBLE REAR COVER

12.3 Disassemble Rear Cover
2 1
3 4
Press and Push
Press and Push
11.4 DISASSEMBLE MAIN PCB

12.4 Disassemble Main PCB
1
3
Be Carefully
Board damage
11.5 COMPLETE DISASSEMBLE D724

12.5 Complete Disassemble D724
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW(SBOM)

EAU00
EAB00
EBP00 ABM00 ABM01
MBL02
ACQ00
EBP01 EAC00
MBL00
MCR00
MJN00 ACQ01 EBR00
EAJ00 ACQ02
EBD00
FAB00
MDS00
MBL01 EAB01
MDS01
EAG00
Location Description Location Description

EBD00 Touch Window Assembly MDS01 Gasket
MDS00 Gasket EAG00 Jack, Phone
EAJ00 LCD Module EBR00 PCB Assembly, Main
MJN00 Tape, Window ABM00 Can Assembly, Shield
MCR00 Deco, Receiver ABM01 Can Assembly, Shield
ACQ01 Cover Assembly, Front EBP01 Camera Module
MBL00 Cap ACQ02 Cover Assembly, Rear
MBL01 Cap EAB01 Speaker Module
MBL02 Cap EAC00 Rechargeble Battery, Lithium Ion
EAB00 Receiver FAB00 Screw, Machine
EAU00 Motor, DC ACQ00 Cover Assembly, Battery
EBP00 Camera Module
12.2 Replacement Parts Note: This Chapterisused for reference,Part order is ordered
by SBOM standard on GCSC
<Mechanic component>
Level Location no Description P/N Specification Remark
1 AGQ000000 Phone Assembly AGQ87947501 LGD724.ACISTN TN:TITAN TITAN -
Cover
2 ACQ100400 ACQ87590701 LGD724.ACISTN TN:TITAN TITAN -
Assembly,EMS
Cover
Assembly,Bar
COMPLEX LG-VX6000 ZZ:Without Color PID Label

4 MEZ00 Label MLAZ0038301
4 Array PRINTING,
4 MJN061100 Tape,Protect MJN68931301 COMPLEX LGD725.AATTZY ZZ:Without Color -
4 MJN00 Tape,Window MJN68887201 COMPLEX LGD725.AATTZY ZZ:Without Color -
Cover
4 ACQ01 ACQ87131601 LGD725.AATTTN TN:TITAN TITAN -
Assembly,Front
MOLD SILCON RUBBER LGD725.AATTTN

5 MBL00 Cap MBL65937001
ZZ:Without Color -
5 MJN061100 Tape,Protect MJN69309201 COMPLEX LGD725.AATTTN ZZ:Without Color -

5 MBL01 Cap MBL65917101
ZZ:Without Color -
Cover Assembly,
5 ACQ033200 ACQ87150301 LGD725.AATTTN TN:TITAN TITAN -
Front(Sub)
6 MCK032700 Cover,Front MCK68125901 MOLD PC LGD725.AATTTN TN:TITAN TITAN -
6 MET099500 Insert,Nut MICE0016904 COMPLEX MECH_COMMON ZZ:Without Color -
6 MDQ000000 Frame MDQ63916501 CASTING MG LGD725.AATTZY ZZ:Without Color -
5 MDS000000 Gasket MDS64673601 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MHK000001 Sheet MHK64688101 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MHK000000 Sheet MHK64705401 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MJN000001 Tape MJN68930701 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MJN000000 Tape MJN68931601 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MKC041800 Window,IRDA MKC64919001 MOLD PC LGD725.AATTTN ZZ:Without Color -
5 MDS000005 Gasket MDS64911601 COMPLEX LGF470L.ALGTWH ZZ:Without Color -

5 MBL02 Cap MBL65936901
ZZ:Without Color -
PRESS STS 0.15T LGD725.AATTTN BK:BLACK

4 MCR000000 Decor MCR65486601
BLACK -
4 MDS00 Gasket MDS64673701 COMPLEX LGD725.AATTZY ZZ:Without Color -
3 FAB01 Screw,Tapping FAB32218901 BH + 1 2.7M 3.5M NI PLT NI
Cover
Assembly,Rear
Cover Assembly,
Rear(SVC)
5 MCQ000000 Damper MCQ67747301 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MCQ009400 Damper,Camera MCQ67665001 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MCQ049800 Damper,Motor MCQ67968501 COMPLEX LGD724.ABRATN ZZ:Without Color -
7 MEV000000 Insulator MEV65172201 COMPLEX LGD725.AATTTN ZZ:Without Color -
7 MJN000000 Tape MJN69310201 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 ACW000000 Decor Assembly ACW74417101 LGD725.AATTTN TN:TITAN TITAN -
6 MCR000000 Decor MCR65486701 MOLD PC LGD725.AATTZY BK:BLACK BLACK -
6 MBF000000 Bush MBF63223801 COMPLEX LGF350L.ALGTWH ZZ:Without Color -
Cover Assembly,
Rear(Sub)
6 MBF000000 Bush MBF63223801 COMPLEX LGF350L.ALGTWH ZZ:Without Color -
6 MCK063300 Cover,Rear MCK68367301 MOLD PC LGD724.ACISTN TN:TITAN TITAN -
5 ABH000000 Button Assembly ABH74999701 LGD725.AATTTN TN:TITAN TITAN -
COMPLEX C2000 CGRSV WA:White C2000 USASV

5 MEZ000900 Label,After Service MLAB0001102
DIA 4.0 PRINTING,
CUTTING ACRYL LGD725.AATTTN ZZ:Without

5 MKC009401 Window,Camera MKC65019401
Color -
CUTTING ACRYL LGD725.AATTTN BK:BLACK

5 MKC009400 Window,Camera MKC64919101
BLACK -
5 MJN000000 Tape MJN69208401 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MJN061100 Tape,Protect MJN68931401 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MJN009400 Tape,Camera MJN68827201 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MCQ009401 Damper,Camera MCQ67969301 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MFB029600 Lens,Flash MFB63413201 MOLD PC LGD725.AATTTN ZZ:Without Color -
SC10001
SC10002
SC10003
SC10004
PRESS STS 301 0.15 LGLU6200.ALGTBK BK:Black
6 SC10005 Clip MBV62321701
-
SC10006
SC10007
SC10008
SC10009
COMPLEX LGLS720.ASPRTS ZZ:Without Color PID

6 PID1 Label MEZ65049701
label
7 MJN000000 Tape MJN69270801 COMPLEX LGD724.ACISTN ZZ:Without Color -
Can
5 ABM00 ABM74516101 LGD724.ACISTN ZZ:Without Color -
Assembly,Shield
6 MEV000000 Insulator MEV65054101 COMPLEX LGD724.ACISTN ZZ:Without Color -
PRESS STS 0.15t LGD724.ACISTN ZZ:Without

6 MBK070300 Can,Shield MBK64012901
Color -
6 MDS000000 Gasket MDS64870901 COMPLEX LGD724.ACISTN ZZ:Without Color -
Can
5 MBK00 ABM74616001 LGD724.ACISTN ZZ:Without Color -
Assembly,Shield
6 MCQ000000 Damper MCQ68105401 COMPLEX LGD725.AATTTN ZZ:Without Color -
PRESS STS 0.15t LGD724.ABRATN ZZ:Without

6 MBK070300 Can,Shield MBK64013001
Color -
5 MCQ000000 Damper MCQ68146501 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MDJ000000 Filter MDJ64045101 COMPLEX LGD725.AATTZY ZZ:Without Color -
GMEY0014301 BH + 1.4mM 3.5mM MSWR NI PLT

3 FAB00 Screw,Machine GMEY0014301
N - KUMGANG SCREW CO., LTD
3 MJN107400 Tape,USP Film MJN68931251 COMPLEX LGD724.ACISTN ZZ:Without Color -
2 MEZ002100 Label,Approval MLAA0062305 COMPLEX KB770 DEUBK ZZ:Without Color -
LGD724.ACISTN ZZ:Without Color D724 CIS(S6-

1 AGF000000 Package Assembly AGF77659201
1/Pallet_480ea)
COMPLEX LGE730.ANLDKT ZZ:Without Color

2 MAY047100 Box,Master MBEE0061004
S6T_STD Master Box(10EA)
COMPLEX LGP725.ACISBK WW:SNOW WHITE

2 MEZ084100 Label,Unit Box MEZ64571201
Seal Label_CIS For Only
COMPLEX KU990.AGBRBK ZZ:Without Color

2 MEZ000000 Label MLAZ0050901
Battery Warning Label (Lithium ion Battery Label)
COMPLEX LGP880.ACISBK ZZ:Without Color Unit

2 MEZ084101 Label,Unit Box MEZ64686921
Box Label_CIS Peel Cutting Label_40X20, 4EA
PRINTING HB620 KPNBK ZZ:Without Color GSM

2 MEZ003500 Label,Barcode MLAC0004541
standard_unit box label_90*40
PRINTING CG300 CGR DG ZZ:Without Color

2 MEZ047200 Label,Master Box MLAJ0004402 LABEL MASTER BOX(for CGR TDR 2VER.
mbox_label) GSM standard_master box label
COMPLEX LGD724.ACISTN ZZ:Without Color

2 MAY084000 Box,Unit MAY66808203
LGD724 CIS UNIT BOX
COMPLEX LGE615.ACISBK ZZ:Without Color

2 MAF086500 Bag,Vinyl MAF63267402
HDPE Phone Bag_add CIS Mark_85X200
LGE510.ACISBK ZZ:Without Color S6T Type_CIS

2 AGJ000000 Pallet Assembly AGJ73458304
Body+Cap+AL(1200x800x800)_480EA
3 MGA000000 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE -
COMPLEX LGE730.ACISBK ZZ:Without Color S6T-

3 MCQ000000 Damper MCQ66486911
CIS Dead Space Sleeve(480EA/1200*800)
COMPLEX LGE730.ANLDKT ZZ:Without Color S6T-

3 MBL007000 Cap,Box MCCL0002604
STD Cap(800EA/1200*800)
COMPLEX LGE730.ACISBK ZZ:Without Color S6T-

3 MAY010800 Box,Carton MBEC0004405
CIS Body(480EA/h:800 under/1200*800)
1 AAD000000 Addition Assembly AAD87006801 LGD724.ACISTN TN:TITAN TITAN -
2 MEZ002101 Label MEZ65889901 COMPLEX LGD855.A6ISKG ZZ:Without Color -
Cover
Assembly,Battery
3 MHK000000 Sheet MHK64688701 COMPLEX LGLS885.ASPRZY BK:BLACK BLACK -
3 MCK004100 Cover,Battery MCK68125821 MOLD PC LGD722V.AVD2TN TN:TITAN TITAN -
12.2 Replacement Parts Note: This Chapterisused for reference, Part order is ordered
by SBOM standard on GCSC
<Main component>
WS061225HS01N 50mW 32OHM 109DB

4 EAB00 Receiver EAB63288401
100HZTO7KHZ PIN - BSE CO., LTD.
04-9809-005-001-868+ 5P 4P ANGLE TR 3.5M

4 EAG00 Jack,Phone EAG63849801 BLACK 5P Side Contact KYOCERA CONNECTOR
KOREA SALES CO.,LTD.
LH500WX9-SD01 HD 5.0INCH 720X1280 450CD

4 EAJ00 LCD Module EAJ62669901 COLOR 70% 16/9 1000:1 60Hz Inverter N LED 2D -
LG Display Co. Ltd.
WHVM-1030QSS 2V 40mA 0A 12KRPM 12KRPM

4 EAU00 Motor,DC EAU62004401 60mSEC 0GF.CM 29OHM WOOSUNG G&T
CO.,LTD
TSMC-G519A CAPACITIVE TOUCH Glass

Window(0.55t)/Touch Sensor(0.325t) Synaptics
Touch Window S7020 5.0 inch Board To Board_1.0T, GB042-10P-
4 EBD00 EBD61885501
Assembly H10-E3000(ENBY0050901), LSMTRON 2
TONE(Black - Titan silver, Spin pattern) LG
INNOTEK.,LTD.
CW1346-APQH5 CW1346-APQH5 1.3M Sony 1/7.8

4 EBP00 Camera Module EBP61641902 HD, 0deg, FPCB 5mm, Con. Top COWELL
ELECTRONICS CO.,LTD
SI-D724-P Nd-Fe-B 700mW 8OHM 88DB 950HZ

4 EAB01 Speaker Module EAB63529801 67.16x36.96x5.2 FPCB BUJEON ELECTRONICS
CO., LTD
LGD725.AATTTN 1.0 POLYI Stack via 2 0.15

5 EAX010700 PCB,Flexible EAX65823601
Flexible
ACA-00319 SINGLE -5DB 5:1 FPCB Type - GPS

5 EAA030102 PIFA Antenna,GPS EAA63704501
Tape ACE TECHNOLOGIES CORPORATION
PCB Assembly,
5 EAX010701 EBR79024201 LGD725.AATTTN 1.0 Flexible
Flexible
PCB Assembly,
6 EBR070100 EBR79669001 LGD722V.AVD2TN 1.0 Flexible
Flexible,Insert
PCB Assembly,
6 EBR070400 EBR79024501 LGD725.AATTTN 1.0 Flexible
Flexible,SMT
PCB Assembly,
7 EBR070300 EBR79024601 LGD725.AATTTN 1.0 Flexible
Flexible,SMT Top
8 EAX010700 PCB,Flexible EAX65829701 LGD725.AATTTN 1.1 POLYI Multi 2 2 Flexible
PCB Assembly,
7 EBR070200 Flexible,SMT EBR79024701 LGD725.AATTTN 1.0 Flexible
Bottom
VL6180 TOF sensor, Proximity,Ambient light,

measurable range : 0~10cm,0.3~100kLux
8 U5000 IC,Proximity EAN63405901
4.8x2.8x1.0mm LGA R/TP 12P - ST
MICROELECTRONICS ASIA PACIFIC PTE LTD.
Capacitor,Ceramic, C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -

8 C5001 ECCH0009101
Chip 55TO+85C 0603 R/TP - TDK CORPORATION
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

Capacitor,Ceramic,
8 C5000 ECCH0017601 55TO+85C 1005 R/TP 0.5MM - SAMSUNG
Chip
ELECTRO-MECHANICS CO., LTD.
ACB-00229 MULTI -5DB 5:1 FPCB Type -

PIFA
5 EAA030101 EAA63405201 WLAN+BT Tape ACE TECHNOLOGIES
Antenna,Multiple
CORPORATION
PCB Assembly,
3 EBR00 EBR79538801 LGD724.ACISTN 1.0 Main
Main
PCB Assembly,
Main,SMT
PCB Assembly,
Main,SMT Bottom
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

C8400 Capacitor,Ceramic,
6 ECCH0004904 1005 R/TP - MURATA MANUFACTURING
C8401 Chip
CO.,LTD.

6 C5001 ECCH0009101
Capacitor,Ceramic, C0603X7R1H221KT 220pF 10% 50V X7R -

6 C8953 ECCH0009102
Chip 55TO+125C 0603 R/TP - - TDK CORPORATION
C10065
C1112
Capacitor,Ceramic, C0603C0G1H101JT00NN 100pF 5% 50V C0G -
6 C1500 ECCH0009103
C1508
L10065
C2304 Capacitor,Ceramic, C0603X7R0J223KT 22nF 10% 6.3V X7R -

6 ECCH0009110
C2387 Chip 55TO+125C 0603 R/TP - - TDK CORPORATION

6 C10068 ECCH0009104
C2306
Capacitor,Ceramic, C0603X7R1C103KT 10nF 10% 10V X7R -
6 C2384 ECCH0009106
C4131
Capacitor,Ceramic, C0603X7R1H331KT00NN 330pF 10% 50V X7R -

6 C5142 ECCH0009109
GRM033R60J473KE19D 47nF 10% 6.3V X5R -

Capacitor,Ceramic,
6 C2302 ECCH0009201 55TO+85C 0603 R/TP - - MURATA
Chip
MANUFACTURING CO.,LTD.
GRM033R60J333KE01D+A01 33nF 10% 6.3V X5R -

6 ECCH0009203 55TO+85C 0603 R/TP - - MURATA
C4130 Chip
GRM0335C1ER50C 0.5pF 0.25PF 25V X7R -

Capacitor,Ceramic,
6 C5233 ECCH0009208 55TO+125C 0603 R/TP - MURATA
Chip
GRM033R61A472K 4700pF 10% 10V X5R -

Capacitor,Ceramic,
Chip
C5105
C5111
C5112
C5113
C5114
C5133 Capacitor,Ceramic, MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
6 ECCH0009514
C5140 Chip 55TO+125C 0603 R/TP - ROHM.
C5146
C5147
C9505
C9506
L5111
C5136 Capacitor,Ceramic, MCH032A150JK 15pF 5% 25V X7R -55TO+125C

6 ECCH0009520
C5137 Chip 0603 R/TP - ROHM.
C1516
C2327
C2351
C2365
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
6 ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTRO-
C2399 Chip
MECHANICS CO., LTD.
C2414
C2415
C2416
C4197
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

Capacitor,Ceramic,
Chip
GRM033R60J224M 0.00000022F 20% 6.3V X5R -

6 ECCH0032801 55TO+85C 0603 R/TP 0.3MM - MURATA
C5109 Chip
C2303 CL03A474MQ3NNNH 0.47uF -20TO20% 6.3V X5R -

Capacitor,Ceramic,
6 C2358 ECCH0034801 55TO+85C 0603 R/TP 0.3+-0.03 - SAMSUNG
Chip
C2389 ELECTRO-MECHANICS CO., LTD.
C1005C0G1H101JT 100pF 5% 50V C0G -

Capacitor,Ceramic,
6 C1637 ECZH0000813 55TO+125C 1005 R/TP - TDK KOREA
Chip
COOPERATION
C1612
C1621
C1632 C1005C0G1H330JT000F 33pF 5% 50V NP0 -
Capacitor,Ceramic,
Chip
C1639 COOPERATION
C1646
L1107
C1005X7R1H681KT000F 680pF 10% 50V X7R -

Capacitor,Ceramic,
Chip
COOPERATION
C1005Y5V1A474ZT000F 470nF -20TO+80% 10V

Capacitor,Ceramic,
6 C4146 ECZH0001210 Y5V -30TO+85C 1005 R/TP - TDK KOREA
Chip
COOPERATION
GRM36X7R104K10PT 100nF 10% 10V X7R -

Capacitor,Ceramic,
6 C1401 ECZH0003103 55TO+125C 1005 R/TP - MURATA
Chip
GRM219R60J226M 0.000022F 20% 6.3V X5R -

Capacitor,Ceramic,
6 C4138 ECZH0025502 55TO+85C 2012 R/TP 0.85MM MURATA
Chip
C6700
C6701
C6810 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C
Capacitor,Ceramic,
6 C6811 ECZH0025916 0603 R/TP - - MURATA MANUFACTURING
Chip
C6812 CO.,LTD.
C9910
C9911
C4100 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
Chip
C6623 CO.,LTD.
LQG15HS1N0S02D 1NH 0.3NH - 300mA - -

Inductor,Multilayer,
6 L10069 ELCH0003831 0.07OHM 10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Chip
R/TP MURATA MANUFACTURING CO.,LTD.
PESD5V0V1BL 5V 5.8V min. 12.5V 4.8A 45W SOD-

6 VA6602 Diode,TVS EDTY0012102
882 R/TP 2P 1 STC CORP.
UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A -

6 VA9532 Diode,TVS EDTY0012501 SLP1006P2T R/TP 2P 1 SEMTECH
CORPORATION
LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM

6 L10068 ELCH0001425 1.15GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
TOKO, INC.
0402AF-101XJEW 100NH 5% - 900mA - - 0.16OHM

6 L6613 ELCH0001444 1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
Chip
R/TP COILCRAFT SINGAPORE PTE LTD.
GB042-20S-H10-E3000 20P 0.4MM STRAIGHT

6 CN7400 Connector,BtoB ENBY0039601
SOCKET SMD R/TP 1M - LS Mtron Ltd.
CN15001 GB042-30S-H10-E3000 30P 0.4MM STRAIGHT

6 Connector,BtoB ENBY0040701
CN7300 FEMALE SMD R/TP 1M - LS Mtron Ltd.
GB042-10S-H10-E3000 10P 0.4MM STRAIGHT

6 CN7200 Connector,BtoB ENBY0051001
FEMALE SMD R/TP 1M - LS Mtron Ltd.
KQ13L2-6R KQ13L2-6R,6,1.0
CN100
6 Terminal Block ENZY0025801 mm,ETC6.6x4x1.35(t),Stroke:-0.65,Touch window
CN7500
Contact CNT HIROSE KOREA CO.,LTD
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -

6 R8400 Resistor,Chip ERHY0000254
ROHM.
R1503
R2105
R2106
R2108
R4105 MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP -
6 Resistor,Chip ERHY0009501
R4110 ROHM.
R4114
R4132
R4141
R6100

R9513 ROHM.

R1502 ROHM.
R2302
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
R4142
R2304 MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -

R2305 ROHM.
MCR006YZPJ221 220OHM 5% 1/20W 0603 R/TP -

ROHM.
R2207
R2208 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
R2211 ROHM.
R2212
R5102 MCR006YZPJ224 220KOHM 5% 1/20W 0603 R/TP

R5103 - ROHM.
R5109
R5110
R5111
ROHM.
R5113
R7601
R7602
MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP

- ROHM.
PMR10EZPFU10L0 0.01OHM 1% 1/2W 2012 R/TP -

ROHM.
R9500 RC0201JR-0715KL 15KOHM 5% 1/20W 0603 R/TP

R9510 - YAGEO CORPORATION

6 R8956 Resistor,Chip ERHZ0000529
ROHM.
R1401
R5307
R6615 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -
6 Resistor,Chip ERHZ0000401
R6617 ROHM.
R9201
R9202
MCR01MZP5J334 330KOHM 5% 1/16W 1005 R/TP

- ROHM.
MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP -

ROHM.
SC10001
SC10002
SC10003
SC10004
PRESS STS 301 0.15 LGLU6200.ALGTBK BK:Black
6 SC10005 Clip MBV62321701
-
SC10006
SC10007
SC10008
SC10009
D8900
VA7303 ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55
6 Varistor SEVY0003601
VA7400 NONE SMD R/TP INNOCHIPS TECHNOLOGY
VA7406
ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD

6 VA8950 Varistor SEVY0005402
R/TP INNOCHIPS TECHNOLOGY
D6924 EVLC5S01033 EVLC5S01033 EVLC5S01033,5.5 V,

D6926 ,SMD ,Vdc 5.5, Vb 10~15.6, Cp 17.9 at 1MHz,
6 D6927 Varistor SEVY0008101 0.6*0.3*0.33 , ,5.5 , ,23.1~42.9 ,0.6*0.3*0.33 ,[empty]
VA6601 ,SMD ,R/TP AMOTECH CO., LTD. AMOTECH CO.,
VA6603 LTD.
VA7404
VA7405
VA9501
EVLC5S01015 5.5V 0% 15pF 0.6*0.3*0.33 NONE
SMD R/TP AMOTECH CO., LTD.
VA9502
VA9503
VA9504
VA15000
IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3
VA15001
6 Varistor SEVY0010501 IEC61000-4-1 (ESD) level #4 SMD R/TP
VA15002
INNOCHIPS TECHNOLOGY
VA15003
BLM15BB750SN1D 75 ohm 1.0X0.5X0.5 25% 0.4

6 FB5101 Filter,Bead SFBH0007103 ohm 0.3A SMD R/TP 2P 0 MURATA
FB6600
FB6611
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
FB6612
6 Filter,Bead SFBH0008102 ohm 0.2A SMD R/TP 2P 0 MURATA
FB6613
FB6920
FB6921
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD

6 FL10000 Filter,EMI/Power SFEY0015301
R/TP - MURATA MANUFACTURING CO.,LTD.
R6101
R6102
6 Wire Pad,Open SAFO0000401 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI
R6103
R6104
R1504
R4102
6 Wire Pad,Short SAFP0000401 AX3100 ATL SV_SHIPBACK,MAIN,A
R4103
R4139
C4164 CL05A475MP5NRNC 4.7uF 20% 10V X5R -

Capacitor,Ceramic,
6 C6105 EAE62506501 55TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
C6109 MECHANICS CO., LTD.
MIC6920 Microphone,Conde MOE-C110R38-K1 -38DB 300OHM OMNI 1.5 TO

6 EAB62670801
MIC6921 nser 3.6V 3.76x2.95x1.1 SMD BSE CO., LTD.
C1600
C1605
C1616
C1617
GRM033R71E102KA01D 0.000000001F 10% 25V
6 EAE62282201 X7R -55TO+125C 0603 R/TP 0.3+/-0.03 MM -
C1626 Chip
MURATA MANUFACTURING CO.,LTD.
C1631
C1643
C1644
C1645
C5143 CL03A104KP3NNNC 0.0000001F 10% 10V X5R -

Capacitor,Ceramic,
6 C5145 EAE62286801 55TO+85C 0603 R/TP 0.3 - SAMSUNG ELECTRO-
Chip
251M1002107MR12A168 100uF 20% 10V 50UA -

Capacitor,TA,Confo
6 C9100 EAE62287901 55TO+125C 0.6OHM 3.2X1.6X1.1MM NONE SMD
rmal
R/TP 1.2T max. MATSUO ELECTRIC CO.,LTD
CL05A106MP5NUNC 10uF 20% 10V X5R -

Capacitor,Ceramic,
6 C7500 EAE62502901 55TO+85C 1005 R/TP 0.55T max. SAMSUNG
Chip
C1005X5R1E104K 0.1uF 10% 25V X5R -55TO+85C

6 EAE62685201 1005 R/TP 0.55T max. TDK KOREA
C8952 Chip
COOPERATION
CL05A105KA5NQNC 1uF 10% 25V X5R -

55TO+85C 1005 R/TP 0.6T max. Samsung(1.0+-0.1
6 EAE62685301 0.5+-0.1 0.5+-0.1) Murata (1.0+-0.05 0.5+-0.05 0.5+-
C7503 Chip
0.05) SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
C2386
C2400
C7300
CL03A225MQ3CRNC 2.2uF -20TO20% 6.3V X5R -
6 EAE62726601 55TO+85C 0603 R/TP 0.3T - SAMSUNG
C7303 Chip
C7400
C7401
C7402
F981A226MMA 22uF 20% 10V 11UA -55TO+125C

Capacitor,TA,Confo
6 C4171 EAE62748301 8OHM 1.6X0.85X0.8MM NONE SMD R/TP 0.9T
rmal
max. UNITEL ELECTRONICS CO. LTD.
C2309
C2335
C4119
C4122
C4124
C4147
C4152
CL03A105MP3NSNC 1uF 20% 10V X5R -
6 EAE62762301 55TO+85C 0603 R/TP 0.33 MM - SAMSUNG
C4154 Chip
C4155
C4158
C4159
C4165
C4198
C6107
C6108
C2110 CL03A224KP3NNNC 220nF 10% 10V X5R -

Capacitor,Ceramic,
6 C2111 EAE62762401 55TO+85C 0603 R/TP 0.33 MM - SAMSUNG
Chip
JDK212BBJ476MD 47uF -20TO20% 6.3V X5R -

6 EAE62767801 55TO+85C 2012 R/TP 0.85T - TAIYO YUDEN
C4182 Chip
CO.,LTD
GRM1555C1H100J_H 10pF 5% 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 C9512 Frequency),Cerami EAE62963601
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
RMTMK063CG100JT-F_H 10pF 5% 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03,
W:0.3+-0.03, T:0.3+-0.03 KOREA TAIYO
c,Chip
YUDEN.CO., LTD.
GRM188R61C475KAAJ 4.7uF -10TO+10% 16V X5R

C4142 Capacitor,Ceramic, -55TO+85C 1608 R/TP Max 0.95T L:1.6+-0.15
6 EAE63067401
C4143 Chip W:0.8+-0.15 T:0.8+-0.15 MURATA
LXES15AAA1-117 15V 25% 0.1pF 1.0X0.5X0.33

6 D5100 Varistor EAF61650701 mm IEC61000-4-2 (ESD) level #4 SMD R/TP
VA9500
VA9505
AVLC10S01005 10V 0% 5pF 0.6X0.3X0.3mm
VA9506
6 Varistor EAF62210001 IEC61000-4-2 (ESD) level #4 SMD R/TP AMOTECH
VA9507
CO., LTD.
VA9508
VA9509
1041681610 Micro-SD, UIMDupliSocket 16P

6 S9500 Card Socket EAG63310801
STRAIGHT DIP T/REEL - MOLEX
BM10NB(0.8)-10DS-0.4V 10P 0.40MM STRAIGHT

6 CN2004 Connector,BtoB EAG63393201 FEMALE SMD R/TP 800mM - HIROSE KOREA
CO.,LTD
2108612-5 1P ANT TERMINAL STRAIGHT SMD

ANT10003
6 C-Clip EAG63613001 T/REEL AU 2.9X1.0X2.05(L X W X H) SERVEONE
ANT10004
CO., LTD.

6 ANT1 C-Clip EAG63652301 T/REEL AU 2.9X1.0X1.4(L X W X H) SERVEONE
CO., LTD.
MM8030-2610RK0 NONE STRAIGHT SOCKET

6 SW1101 Connector,RF EAG63772101 SMD T/REEL AU 50OHM 400mDB MURATA
1201-01A 1P ANT TERMINAL STRAIGHT SMD

ANT5100
6 C-Clip EAG63910001 REEL AU 2.6X1.0X0.9(LXWXH) SERVEONE CO.,
ANT5101
LTD.
BLM03AX601SN1D 600 ohm 0.6X0.3X0.3 25% 0.85

6 FB5102 Filter,Bead EAM62070901 ohm 0.25A SMD R/TP 2P 0 MURATA
ESD5205P6T6G 5V 5.5V min. 10V 2UA 0W SOT-

6 D7600 Diode,TVS EAH61794301
963 R/TP 6P 5 ON SEMICONDUCTOR
PESD12VS1UA 12V 13.3V min. 19V 22.5A 360mW

6 D10000 Diode,TVS EAH61872601
SOD323 R/TP 2P 1 NXP Semiconductors
D103
D104
D105 UCLAMP3311Z 3.3V 3.65V min. 7.5V 4A 30W
6 D6929 Diode,TVS EAH62033201 SLP0603P2X3A R/TP 2P 1 SEMTECH
VA6600 INTERNATIONAL AG
VA9530
VA9531
BLM03AX121SN1 120 ohm 0.6X0.3X0.3 25% 0.23

6 FB5100 Filter,Bead EAM62230101 ohm 0.45A SMD R/TP 2P 0 MURATA
ICMEF112P500MFR COMMON MODE NOISE

6 FL10001 Filter,EMI/Power EAM62272401 FILTER 0HZ 0.0000000000001F 0H SMD R/TP -
INNOCHIPS TECHNOLOGY
ACFE1A2G900E COMMON MODE NOISE FILTER

6 FL15002 Filter,EMI/Power EAM62291101
0HZ 0F 0H SMD R/TP - AMOTECH CO., LTD.
SFHG89DQ102
6 FL1110 Filter,Saw EAM62633001 1575.42@GPS/1601.72@GLONASS 1.4x1.1x0.5t
SMD R/TP 5P WISOL.CO.,LTD
MPZ1608S601AT000 600 1.6X0.8X0.8 25% 0.15 1

6 FB7200 Filter,Bead EAM62633801
SMD R/TP 2P - TDK KOREA COOPERATION
ACPF-7124 BPF 2.44GHZ 1.4x1.1x0.8t SMD R/TP

6 FL5101 Filter,Ceramic EAM62690501 5P AVAGO TECHNOLOGIES INTERNATIONAL
SALES PTE. LIMITED
FL7300 ACFE4A2G750E COMMON MODE NOISE FILTER -

6 FL7400 Filter,EMI/Power EAM63150101 1.7pF 0H SMD R/TP 0.87x0.67x0.47 75ohm
FL7401 AMOTECH CO., LTD.
FL7100
AHFE16Q750CL COMMON MODE NOISE FILTER -
FL7101
6 Filter,EMI/Power EAM63170001 1.7pF 0H SMD R/TP 1.6x0.8x0.5 75ohm AMOTECH
FL7301
CO., LTD.
FL7302
TPS61256A V2.5 to V5.5 V5 800mA 0W WLP

IC,DC,DC T/REEL 9P Small Package(1.2x1.3,0.4mm) TEXAS
6 U4940 EAN62461401
Converter INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
TLV70718 V2 to V5.5 V1.8 0W QFN R/TP 4P

IC,LDO Voltage EUSY0355501 RP103K181D ,Richo Pin to Pin
6 U4192 EAN62496301
Regulator TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
FSA5157L6X 1.65 to 5.5V 60NSEC 20NSEC

6 U6600 IC,Analog Switch EAN62578201 180mW MICROPAK R/TP 6P - FAIRCHILD
SEMICONDUCTOR HONG KONG LTD.
BMC150 Accelerometer with Geomagnetic Sensor

IC,Acceleration
6 U8100 EAN62637201 2.2X2.2X1.0 LGA R/TP 14P Accelerometer with
Sensor
Geomagnetic Sensor BOSCH SENSORTEC GMBH
TLV70728PDQNR V2 to V5.5 V2.8 0W QFN R/TP

IC,LDO Voltage
6 U4193 EAN62669801 4P - TEXAS INSTRUMENTS KOREA LTD,
Regulator
HONGKONG BRANCH.
LM3263 2.7V to 5.5V 0.4V to 3.6V 0W MICRO SMD

R/TP 16P MIPI RFFE, 2G/3G/4G, 2.5A Max.(PWM),
IC,DC,DC
6 U1400 EAN62788501 2.7 MHz (typ.), 16-bump micro SMD TEXAS
Converter
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
KLM8G1WEMB-B031 8Gbyte
2.7VTO3.6V,1.7VTO1.95V 11.5x13.0x0.8 TR 153P
6 U3200 IC,MCP,eMMC EAN62873001 NAND FBGA 8GB eMMC v5.0 (19nm 64Gb TLC x
1/11.5x13.0/91.0%) SAMSUNG ELECTRONIC
CO.,LTD
BCM4334LKUBG WiFi(11a/b/g/n, Dual,

HT40)+BT4.0+FM Rx, 4.08x4.48x0.55, 40nm, B3
6 U5100 IC,WiFi EAN63049901
WLBGA R/TP 109P Broadcom International
Distribution Company
L2100
LG HK0603 82NJ-T 82NH 5% - 70mA - - 3.37OHM
L2101 Inductor,Multilayer,
6 EAP61866701 1GHZ 4 SHIELD 0 0.6X0.3X0.3MM R/TP TAIYO
L2102 Chip
YUDEN CO.,LTD
L2103
LQP03TG2N2C02D 2.2NH 0.2NH - 450mA - -

6 L1 EAP62108001 0.25OHM 6GHZ 13 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
LQP03TG3N9C02D 3.9NH 0.2NH - 350mA - -

6 C10072 EAP62226101 0.35OHM 6GHZ 13 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
MIPSTZ1608D2R2B 2.2UH 30% - 400mA 0.4 0.5

6 L5106 EAP62110401 0.39OHM 0HZ - SHIELD - 1.6X0.8MM R/TP FDK
Chip
CORPORATION.
LQP03TG1N8C02D 1.8NH 0.2NH - 500mA - -

Chip
LQP03TG1N0C02D 1NH 0.2NH - 600mA - -

Chip
LQP03TG6N8J02D 6.8NH 5% - 200mA - - 1.15OHM

6 L5109 EAP62226401 5.4GHZ 12 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
LG HK 0603 1N0S-T 1NH 0.3NH - 470mA - -

C5101 Inductor,Multilayer,
6 EAP62226901 0.11OHM 10GHZ 4 SHIELD - 0.6X0.3X0.3MM R/TP
C5139 Chip
TAIYO YUDEN CO.,LTD
1285AS-H-1R5M 1.5UH 20% - 1.8A 1.8 1.9

Inductor,Wire
6 L1400 EAP62286801 0.144OHM - - SHIELD 2.0X1.6X1.0MM - R/TP
Wound,Chip
TOKO, INC.
MLP1005V2R2T_ 2.2UH 20% - 50mA 0.05 0.350

6 L2300 EAP62447401 1.3OHM 0HZ - SHIELD - 1.0X0.5X0.55MM R/TP
Chip
TDK KOREA COOPERATION
TFM201610GHM-1R0MTAA 1UH 20% - 3A 3.6 3

L4132 Inductor,Wire
6 EAP62526501 0.06OHM - - SHIELD 2.0X1.6X1.0 MM - R/TP TDK
L4133 Wound,Chip
KOREA COOPERATION
AWL9280 30DBM 26DB 30% 85A 160A -20DB

Module, FEM(Front
6 U5103 EAT62373301 20DBM 700mDBM 16P 2.5x2.5x0.4MM 2.4GHz
End Module)
FEM(SP3T+LNA+PA) ANADIGICS,INC.
LXCL-EY17-4000 WHITE 3.9V 1.5 250lm - - 2016

6 LD9830 LED,Flash EAV62056201
R/TP 2P lumileds LUMILEDS LIGHTING U.S.,LLC
Q22FA1280013000 37.4MHZ 10PPM 12F , SMD

6 X5100 Crystal EAW61645401
R/TP EPSON TOYOCOM CORP
RC0201JR-072M4L 2.4MOHM 5% 1/20W 0603

6 R6425 Resistor,Chip EBC61997701
R/TP - YAGEO CORPORATION
C2380 MCH155CN332KK 3.3nF 10% 50V X7R -

Capacitor,Ceramic,
6 C2383 ECCH0000149 55TO+125C 1005 R/TP - ROHM Semiconductor
Chip
C2388 KOREA CORPORATION
CL05B472KB5NNNC 4.7nF 10% 25V X7R -

R6610 Capacitor,Ceramic,
6 ECCH0000151 55TO+125C 1005 R/TP - - SAMSUNG ELECTRO-
R6611 Chip
MECHANICS CO., LTD.
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
6 C1114 ECCH0000155 1005 R/TP - ROHM Semiconductor KOREA
Chip
CORPORATION
C3200
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
6 ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
C5104 Chip
MECHANICS CO., LTD.
C7200
C3201 Capacitor,Ceramic, C1005JB0J104KT000F 0.1uF 10% 6.3V X5R -

6 ECCH0002001
PCB
5 EBR071700 Assembly,Main,SM EBR79750901 LGD724.ACISTN 1.0 Main
T Top
RC0201JR-0722RL 22OHM 5% 1/20W 0603 R/TP -

YAGEO CORPORATION
X1E0002910001 19.2MHZ 10PPM 7F - SMD R/TP

6 X4100 Crystal EAW61883401
EPSON TOYOCOM CORP
RC0603F363CS 36KOHM 1% 1/20W 0603 R/TP -

SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 EAX010000 PCB,Main EAX66044701 LGD724.ABRATN B FR-4 LX-BUMP 10 0.8 Main
RC0603J821C 820OHM 5% 1/20W 0603 R/TP -

SAMSUNG ELECTRO-MECHANICS CO., LTD.
RC0201FR-0762RL 62OHM 1% 1/20W 0603 R/TP -

YAGEO CORPORATION
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C

Capacitor,Ceramic,
Chip
CORPORATION
RC0201FR-07240RL 240OHM 1% 1/20W 0603

6 R2102,R2104 Resistor,Chip EBC61856201
R/TP - YAGEO CORPORATION
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
Chip
CORPORATION
C10065
C1112
6 C1500 ECCH0009103
C1508
L10065
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
C8401 Chip
CO.,LTD.
CL10A475KP8NNNC 4.7uF 10% 10V X5R -

Capacitor,Ceramic,
6 C1110 ECCH0007802 55TO+85C 1608 R/TP - - SAMSUNG ELECTRO-
Chip
MECHANICS CO., LTD.

6 C5001 ECCH0009101

6 C10068 ECCH0009104
C2306
Capacitor,Ceramic, C0603X7R1C103KT 10nF 10% 10V X7R -
6 C2384 ECCH0009106
C4131
GRM033R71C222K 2.2nF 10% 16V X7R -

Capacitor,Ceramic,
6 C2381 ECCH0009107 55TO+125C 0603 R/TP - - KOREA MURATA
Chip
ELECTRONICS CO. LTD.
C2304 Capacitor,Ceramic, C0603X7R0J223KT 22nF 10% 6.3V X7R -

6 ECCH0009110
GRM033R60J473KE19D 47nF 10% 6.3V X5R -

Capacitor,Ceramic,
Chip
GRM033R60J333KE01D+A01 33nF 10% 6.3V X5R -

C4130 Chip
C1600
C1605
C1616
C1617
GRM033R71E102KA01D 0.000000001F 10% 25V
6 EAE62282201 X7R -55TO+125C 0603 R/TP 0.3+/-0.03 MM -
C1626 Chip
C1631
C1643
C1644
C1645
CL05A106MP5NUNC 10uF 20% 10V X5R -

Capacitor,Ceramic,
6 C7500 EAE62502901 55TO+85C 1005 R/TP 0.55T max. SAMSUNG
Chip
F981A226MMA 22uF 20% 10V 11UA -55TO+125C

Capacitor,TA,Confo
6 C4171 EAE62748301 8OHM 1.6X0.85X0.8MM NONE SMD R/TP 0.9T
rmal
C4164 CL05A475MP5NRNC 4.7uF 20% 10V X5R -

Capacitor,Ceramic,
6 C6105 EAE62506501 55TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
C1005X5R1E104K 0.1uF 10% 25V X5R -55TO+85C

6 EAE62685201 1005 R/TP 0.55T max. TDK KOREA
C8952 Chip
COOPERATION
CL05A105KA5NQNC 1uF 10% 25V X5R -

55TO+85C 1005 R/TP 0.6T max. Samsung(1.0+-0.1
6 EAE62685301 0.5+-0.1 0.5+-0.1) Murata (1.0+-0.05 0.5+-0.05 0.5+-
C7503 Chip
0.05) SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
C2309
C2335
C4119
C4122
C4124
C4147
C4152
CL03A105MP3NSNC 1uF 20% 10V X5R -
6 EAE62762301 55TO+85C 0603 R/TP 0.33 MM - SAMSUNG
C4154 Chip
C4155
C4158
C4159
C4165
C4198
C6107
C6108
C1602
C1603
CL10A106MO8NQNC 10uF -20TO20% 16V X5R -
6 EAE62843001 55TO+85C 1608 R/TP 0.8+-0.15 - SAMSUNG
C1629 Chip
C7501
C7502
GRM1555C1HR75C_H 0.75pF 0.25PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 L1607 Frequency),Cerami EAE62882501
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
GRM1555C1HR50B_H 0.5pF 0.1PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
GRM1555C1H1R5C_H 1.5pF 0.25PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
GRM0335C1E6R8B_H 6.8pF 0.1PF 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
c,Chip
C4173
C4174
GRM155R61A225KE95 2.2uF -10TO+10% 10V X5R
6 EAE62962301 -55TO+85C 1005 R/TP 0.5 L:1.0+-0.05 W:0.5+-0.05
C4176 Chip
T:0.5+-0.05 MURATA MANUFACTURING CO.,LTD.
C4177
C6104
CL10A106MP8NNNC_ 10uF -20TO20% 10V X5R -

C1111 Capacitor,Ceramic, 55TO+85C 1608 R/TP 0.8+/-0.1 L:1.6+-0.1 W:0.8+-
6 EAE62969601
C1113 Chip 0.1 T:0.8+-0.1 SAMSUNG ELECTRO-MECHANICS
CO., LTD.
RMUMK105CG010CV-F_H 1pF 0.25PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+-0.05 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 KOREA TAIYO
c,Chip
YUDEN.CO., LTD.
GRM188R61H225K 2.2uF -10TO+10% 50V X5R -

C4163 Capacitor,Ceramic, 55TO+85C 1608 R/TP Max 1.0T L:1.6+-0.2 W:0.8+-
6 EAE63541901
C4183 Chip 0.2 T:0.8+-0.2 MURATA MANUFACTURING
CO.,LTD.
BA891_ 1V 35V - - 0SEC 715mW SOD523 R/TP 2P

6 D9910 Diode,Switching EAH61532901
1 NXP Semiconductors
GU077-5P-NT-E1500 5P 0.65MM ANGLE

6 CN10001 Connector,I/O EAG63231601 RECEPTACLE DIP R/TP Reverse Offset LS Mtron
Ltd.

6 ANT1 C-Clip EAG63652301 T/REEL AU 2.9X1.0X1.4(L X W X H) SERVEONE
CO., LTD.
Connector,Termina HSBC-4P25-39F1 4P 2.50MM STRAIGHT DIP

6 CN9100 EAG63749801
l Block T/REEL - HAN SHIN TERMINAL CO., LTD.
BLM15AX102SN1D_ 1000 1.0x0.5x0.5 25% 0.49

FB6609
6 Filter,Bead EAM62630901 0.35 SMD R/TP 0P - MURATA MANUFACTURING
FB6610
CO.,LTD.
SFXG50PZ702 2140.0MHz 2110.0to2170.0MHz

1950.0MHz 1920.0to1980.0MHz 1.80/2.30dB
6 FL1602 Filter,Duplexer EAM62954501
1.30/1.80dB 2.0x1.6x0.7t DUAL SMD R/TP 9P
WISOL.CO.,LTD
SFRG42DB002 1842.50MHz/1960.00MHz
6 FL1100 Filter,Saw,Dual EAM62792801
1.5x1.1x0.60t SMD R/TP 10P WISOL.CO.,LTD
SAYRF1G88BC0B0A 1960MHz 1930to1990MHz

1880MHz 1851.25to1908.75MHz 3.2typ/4.0max
6 FL1604 Filter,Duplexer EAM62810601
2.3typ/3.0max 2.0x1.6x0.6t DUAL SMD R/TP 9P
MPZ1608S102A 1000 1.6x0.8x0.8 25% 0.3 0.8 SMD

6 FB6100 Filter,Bead EAM62870101
R/TP 2P - TDK CORPORATION
SFX836AZ202 881.5MHz 869.0to894.0MHz

6 FL1601 Filter,Duplexer EAM62954601 836.5MHz 824.0to849.0MHz 1.7/2.2dB 1.5/2.2dB
2.0x1.6x0.55t DUAL SMD R/TP 9P WISOL.CO.,LTD
SFX897AZ202 942.5MHz 927.4to957.6MHz

6 FL1603 Filter,Duplexer EAM62990301 897.5MHz 882.4to912.6MHz 2.1/2.9dB 1.8/2.6dB
2.0x1.6x0.65t DUAL SMD R/TP 9P WISOL.CO.,LTD
SN74AUP1T97DSFR 0~3.6V 0.000004 LEVEL

SHIFTER SON-6 R/TP 6P Configurable Gate Logic
6 U8950 IC,Gate EAN62415501
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
APDS-9130-200 High T Proximity Sensor

3.36X4.94X3.45 COB R/TP 8P - AVAGO
6 U8400 IC,Proximity EAN62646301
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED
TLV70728PDQNR V2 to V5.5 V2.8 0W QFN R/TP

IC,LDO Voltage
6 U4193 EAN62669801 4P - TEXAS INSTRUMENTS KOREA LTD,
Regulator
HONGKONG BRANCH.
MSM8226 784 pNSP, Quad CA7 1.2GHz,28nm

IC,Digital
LP,12x12 PoP,1x533MHz LPDDR2, 21HSPA+,TD-
6 U2100 Baseband EAN62730601
SCDMA,1080p@30fps,Adreno 305 BGA R/TP 784P
Processor,3G
QUALCOMM INCORPORATED.
IC,Hall Effect BU52061NVX Hall IC 1.2X1.6 SSON R/TP 4P -

6 U8700 EAN62682901
Switch ROHM Semiconductor KOREA CORPORATION
WTR2605 2G/3G, WCDMA, GSM, EDGE, CDMA

6 U1500 IC Assembly EAN62686601 and TDSCDMA Multi Mode QUALCOMM
INCORPORATED.
WCD9302 999 999W WLCSP R/TP 55P MSM8226

6 U6100 IC,Audio Codec EAN62691301 Reference QCT CODEC QUALCOMM
INCORPORATED.
PM8226 TBD adj 0W CSP R/TP 172P -

6 U4100 IC,PMIC EAN62731001
QUALCOMM INCORPORATED.
SFMG2BAD001 2.85 0 0 0W 0W 0 0 MOLD R/TP

6 U1103 IC,RF Amplifier EAN62826801
8P - WISOL.CO.,LTD
SKY77742-21 3.2V to 4.35V 0 0 0W 0W 0 2 SMD

U1600 R/TP 16P 3*4size, for WTR2605, single input dual
6 IC,Power Amplifier EAN62885901
U1601 output, Band1/2/5/8, with CPL, GPIO SKYWORKS
SOLUTIONS INC.
H9TKNNN8JDAPLR-NGH 8GBIT LPDDR2

6 U3100 IC,Mobile SDRAM EAN62949701 1.14VTO1.3V 533MHz 5500ns FBGA TR 168P -
HYNIX SEMICONDOCTOR
DW8755A 2.7V to 5.3V Pos. Vout: 4.6V to 6.0 V

IC,DC,DC (0.1V Step) / Neg. Vout: -4.6V to -6.0V (0.1V Step)
6 U7500 EAN63409101
Converter 0W WLCSP R/TP 12P 1.30x1.53x0.45 mm
DONGWOON ANATECH CO.,LTD.
L2100
LG HK0603 82NJ-T 82NH 5% - 70mA - - 3.37OHM
6 EAP61866701 1GHZ 4 SHIELD 0 0.6X0.3X0.3MM R/TP TAIYO
L2102 Chip
YUDEN CO.,LTD
L2103
1239AS-H-100N=P2 10UH 30% 30V 700mA 1 0.7

Inductor,Wire
6 L4136 EAP62106301 0.46OHM - - SHIELD 2.5X2.0X1.2MM NONE R/TP
Wound,Chip
TOKO, INC.
1269AS-H-4R7M=P2 4.7UH 20% - 1A 1.3 1.0

L7500 Inductor,Wire
6 EAP62107801 0.3OHM - - SHIELD 2.5X2.0X1.0 MM - R/TP TOKO,
L7501 Wound,Chip
INC.
LQP03TG2N2C02D 2.2NH 0.2NH - 450mA - -

Chip
LQP03TN0N6B02D 600PH 0.1NH - 850mA - -

Chip
LQP03TG5N6J02D 5.6NH 5% - 250mA - - 0.88OHM

6 L10067 EAP62226301 6GHZ 12 SHIELD - 0.6X0.3X0.3MM R/TP MURATA
Chip
LG HK 0603 1N8S-T 1.8NH 0.3NH - 380mA - -

6 R1100 EAP62227201 0.16OHM 10GHZ 4 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
TAIYO YUDEN CO.,LTD
TFM201610GHM-1R0MTAA 1UH 20% - 3A 3.6 3

L4132 Inductor,Wire
6 EAP62526501 0.06OHM - - SHIELD 2.0X1.6X1.0 MM - R/TP TDK
L4133 Wound,Chip
KOREA COOPERATION
TFM201610GHM-2R2MTAA 2.2UH 20% - 1.9A 2.4

Inductor,Wire
6 L4134 EAP62526601 1.9 0.152OHM - - SHIELD 2.0X1.6X1.0MM - R/TP
Wound,Chip
TDK KOREA COOPERATION
MIPSZ2016DR24FHS 240NH 20% - 4A 4 4

6 EAP62545901 0.022OHM 0HZ - SHIELD - 2.0X1.6X1.0 MM R/TP
L4131 Chip
FDK CORPORATION.
SKY77573-31 0DBM 0DB 0% 0A 0A 0DB 0DBM

6 U1100 Module,Tx Module EAT62073401 0DBM 42P 6.0x6.0x0.9MM WEDGE TxM for
WTR2605, SP10T SKYWORKS SOLUTIONS INC.
16-219ASURC/S1230/TR8(LM) RED 2.35V 25mA

6 LD8951 LED,Chip EAV61915501 45mcd 633.5nm 60mW 1005 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
IR26-71C/L447/S63/TR8 CLEAR 1.15~1.6V 65mA

6 LD8950 LED,Chip EAV62092201 8.5 920~960nm 100mW 3012 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
C1516
C2327
C2351
C2365
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
6 ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTRO-
C2399 Chip
MECHANICS CO., LTD.
C2414
C2415
C2416
C4197
GRM033R71A682K 6.8nF 10% 10V X7R -

C2385 Chip
C1109
C1115
C1116
C1117
C1118
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C
C1120 Chip
CO.,LTD.
C1121
C2104
C2105
C2106
C2107
GRM033R61A472K 4700pF 10% 10V X5R -

Capacitor,Ceramic,
Chip
C4134 CL10A226MQ8NRNE 22uF 20% 6.3V X5R -

Capacitor,Ceramic,
Chip
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

Capacitor,Ceramic,
Chip
CL21A475KACLRNC 4.7uF -10TO+10% 25V X5R -

Capacitor,Ceramic,
6 C4168 ECCH0042302 55TO+85C 2012 R/TP 0.85+-0.1 - SAMSUNG
Chip
F981A106MMA 10uF 20% 10V 1UA -55TO+125C

Capacitor,TA,Confo
6 C4169 ECTH0001902 8OHM 1.6X0.85X0.8MM NONE SMD R/TP 0.9T
rmal
C1005C0G1H101JT 100pF 5% 50V C0G -

Capacitor,Ceramic,
Chip
COOPERATION
C1005C0G1H120JT000F 12pF 5% 50V NP0 -

Capacitor,Ceramic,
Chip
COOPERATION
C1612
C1621
C1632 C1005C0G1H330JT000F 33pF 5% 50V NP0 -
Capacitor,Ceramic,
Chip
C1639 COOPERATION
C1646
L1107
C1005X5R1A105KT000F 1uF 10% 10V X5R -

Capacitor,Ceramic,
Chip
COOPERATION
C1601
C1604 CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -
Capacitor,Ceramic,
6 C1627 ECZH0004402 30TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
C4132
C6700
C6701
C6810 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C
Capacitor,Ceramic,
Chip
C6812 CO.,LTD.
C9910
C9911
C4100 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
Chip
C6623 CO.,LTD.
KDS160ERTK/H 1.2V 85V 300mA 2A 4NSEC

6 ZD4130 Diode,Switching EDSY0019201
150mW ESC R/TP 2P 1 KEC CORPORAITION
D10006 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528

6 Diode,TVS EDTY0009101
ZD8803 R/TP 2P 1 ON SEMICONDUCTOR
HK1005 5N6S-T 5.6NH 0.3NH - 300mA 0.23OHM

6 C1624 ELCH0001036 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
TAIYO YUDEN CO.,LTD
HK1005 3N9S-T 3.9NH 0.3NH - 300mA 0.21OHM

Chip
TAIYO YUDEN CO.,LTD
LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM

Chip
TOKO, INC.
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM

6 ELCH0001430 1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
L9911 Chip
TOKO, INC.
L6450
LQW18AN82NG00D 82NH 2% - 250mA 0.6OHM
L6451 Inductor,Wire
6 ELCH0003806 2KHZ 34 NON SHIELD 1.6X0.8X0.8MM - R/TP
L6611 Wound,Chip
L6612
LQG15HS4N3S02D 4.3NH 0.3NH - 300mA

6 C1611 ELCH0003834 0.18OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Chip
LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM

Chip
C1101 LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - -

Chip
C1651 R/TP MURATA MANUFACTURING CO.,LTD.
LQG15HS3N9S02D 3.9NH 0.3NH - 300mA

6 L1600 ELCH0003833 0.18OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Chip
1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM

Chip
PILKOR ELECTRONICS LTD.
1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM

6 C1647 ELCH0004709 4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
C1623 1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM

Chip
C1653 PILKOR ELECTRONICS LTD.
C1608
6 ELCH0004712 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
C1620 Chip
C1649
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM

6 L1608 ELCH0004713 3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
1005GC2T1N2SLF 1.2NH 0.3NH - 300mA - -

Chip
R/TP PILKOR ELECTRONICS LTD.

Chip
C1606
HK1005 1N8S 1.8NH 0.3NH - 300mA 0.12OHM
6 ELCH0005010 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
L1108 Chip
TAIYO YUDEN CO.,LTD
L1999
0402CS-6N2XJEW 6.2NH 5% - 760mA 0.083OHM

6 C1610 ELCH0009106 4.8GHZ 20 NON SHIELD NONE 1.19X0.64X0.66MM
Chip
R/TP COILCRAFT SINGAPORE PTE LTD.
LQW15AN10NG00D 10NH 2% - 500mA 0.17OHM

6 L1501 ELCH0012502 5.5GHZ 25 NON SHIELD NONE 1.0X0.5X0.5MM
Chip
Q8950 KTC4075E NPN 5V 60V 50V 150mA 100NA 700

6 TR,Bipolar EQBN0020501
Q8951 100mW ESM R/TP 3P KEC CORPORAITION

ROHM.
R2317
MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP -
ROHM.
R8955
MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -

ROHM.
R1503
R2105
R2106
R2108
R4110 ROHM.
R4114
R4132
R4141
R6100

R1502 ROHM.
R2302
ROHM.
R4142
R2313 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP

R2315 - ROHM.
R2304 MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -

R2305 ROHM.
R2207
R2208 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
R2211 ROHM.
R2212
R1602
MCR006YZPF1003 100KOHM 1% 1/20W 0603
R/TP - ROHM.
R4130
MCR006YZPJ121 120OHM 5% 1/20W 0603 R/TP -

ROHM.
MCR006YZPF2003 200KOHM 1% 1/20W 0603

R/TP - ROHM.
MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP

- ROHM.
MCR01MZP5F1003 100KOHM 1% 1/16W 1005

R/TP - ROHM.
MCR01MZP5F1503 150KOHM 1% 1/16W 1005

R/TP - ROHM.
MCR01MZP5F2000 200OHM 1% 1/16W 1005 R/TP

- ROHM.
MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP

- ROHM.
MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP

- ROHM.
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -

ROHM.
MCR01MZP5J220 22OHM 5% 1/16W 1005 R/TP -

ROHM.
MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -

ROHM.
NCP15WF104F03RC NTC,100000
ohm,SMD,4250K+/-1%,100K,1%,0.1mA,4250K+/-
6 PT1600 Thermistor,NTC SETY0007301
1%,SMD,R/TP MURATA MANUFACTURING
CO.,LTD.
ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD

R/TP INNOCHIPS TECHNOLOGY
R6101
R6102
6 Wire Pad,Open SAFO0000401 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI
R6103
R6104
R1504
R4102
6 Wire Pad,Short SAFP0000401 AX3100 ATL SV_SHIPBACK,MAIN,A
R4103
R4139
Android KK Base D72410a - WORLD WIDE QCT

5 SAD010000 Software,Mobile SAD34724101
LGD724.ACISTN
PCB Assembly,
4 EBR071500 EBR79434201 LGD724.ABRATN 1.0 Main
Main,Insert
PCB
5 EBR070500 EBR79210501 LGD724.ABRATN 1.0 Flexible
Assembly,Flexible
PCB Assembly,
6 EBR070100 EBR79812101 LGD724.ACISTN 1.0 Flexible
Flexible,Insert
PCB Assembly,
Flexible,SMT
PCB Assembly,
Flexible,SMT Top
8 EAX010700 PCB,Flexible EAX66084501 LGD724.ABRATN D POLYI Multi 2 2 Flexible
BM10SB(0.8)-10DP-0.4V 10P 0.40MM STRAIGHT

8 CN101 Connector,BtoB EAG63393301 MALE SMD R/TP 800mM - HIROSE KOREA
CO.,LTD
PCB
7 EBR070200 Assembly,Flexible, EBR79250401 LGD724.ABRATN 1.0 Flexible
SMT Bottom
Socket,DIMM/SIM 2108431-5 8P STRAIGHT STANDARD SMD

8 J100 EAG63313801
M T/REEL - TYCO ELECTRONICS AMP KOREA LTD.
C8AA-Y495A C8AA-Y495A 8M AF, Sony(1/4")

5 EBP01 Camera Module EBP62101701 IMX219, 8.5x8.5x4.95t, MIPI4, FPCB, 90 degree,
30pin LG INNOTEK CO., LTD
5 RAA050101 Resin,PC BRAH0001305 HIFILL 3075B . . NONE
: EFC-3A03-20-MH(Sn99%/Ag0.3%/Cu0.7%)) . .
5 RAA050100 Resin,PC BRAH0001304
NONE
Software Assembly,
1 SAF010100 SAF30500901 LGD724.ACISTN KK -
Common
Software,USB
2 SAD010500 SAD34821001 Windows -
Driver
2 SAD010600 Software,OSP SAD34780901 Windows Windows KK - -
Software, Android KK - PCSuiteV - - WORLD WIDE PC SYNC

2 SAD010100 SAD34777701
Application -
12.3 Accessory Note: This Chapterisused for reference,Part order is ordered

by SBOM standard onGCSC
MCS-02ER_EAC 90Vac~264Vac 4.75Vdc~5.25Vdv

2 EAY060000 Adapters EAY62709907 850mA 50/60Hz CE WALL 2P USB - SUNLIN
ELECTRONICS CO.,LTD
PRINTING LGD724.ACISTN ZZ:Without Color

2 MFL053800 Manual,Operation MFL68521502 Russian Federation
ENGLISH+RUSSIAN+KAZAKH+UKRAINIAN -
Manual Assembly,
2 AFN053800 AFN76573903 LGD724.ACISTN ZZ:Without Color -
Operation
3 MBM087200 Card,Warranty MCDF0011303 COMPLEX GD350 CISBK ZZ:Without Color -
Card,Quick
3 MBM062600 MBM64557402 PRINTING LGD724.ACISTN ZZ:Without Color -
Reference
BL-54SH-WW-LGC 3.8V 2.46AH 490mAH 49*65*5.5

Rechargeable
2 EAC00 EAC62018201 49*68*5.8 BLACK Topcap BL-54SH, 554965,
Battery,Lithium Ion
2460mAh, LGC, WW, Bartype LG Chem,LTD.
LG0108 USB USB 1.0M 4 BLACK UL N ningbo

2 EAD010000 Cable,Assembly EAD62377902
broad telecommunication co.,ltd

LG D724 Service Schemati

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LG D724 Service Schemati

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Internal Use Only

Date: Aug, 2014 / Issue 1.0

1.2 Regulatory Information

LGE Internal Use Only

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

Following information is ESD handling:

(HSPA + / GPRS Class 12 / EDGE Class 12_Rx only)

Supporting Standard WCDMA(FDD1,2,5,8)/

Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz

Application Standard WAP 2.0

LGE Internal Use Only

2.3 Main Parts : GSM Solution

Analog Baseband MSM8226 : Qualcomm

Form Factor DOP type

GPRS compatibility GPRS Class 12

Last Received Yes

Last Missed Number Yes

LGE Internal Use Only

Fixed Dial Number Yes

Voice Memo Yes Support voice recorder

WAP Browser No Support only web browser based

2) WCDMA transmitter specification

Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz

LGE Internal Use Only

3) WCDMA receiver specification

4) HSDPA transmitter specification

Band1 : 1920 MHz ~ 1980 MHz

Band2 : 1852 MHz ~ 1907.6 MHz

Band8 : 925MHz ~ 960MHz

1=1/15, 2=12/15 21~25dBm / 3.84 MHz

5=15/7 6=15/0 19~25dBm / 3.84 MHz

5 2 Start of CQI 1 +/- 0.6

3 Middle of CQI 0 +/- 0.6

4 End of CQI 5 +/- 2.3

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Frequency offset Measurement

Spectrum Emission Mask 2.5 ~ 3.5 MHz -35-15×(△f-2.5)dBc 30 kHz

3.5 ~ 7.5 MHz -35-1×(△f-3.5)dBc 1 MHz

7.5 ~ 8.5 MHz -35-10×(△f-7.5)dBc 1 MHz

8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

LGE Internal Use Only

5) HSDPA receiver specification

Receive Frequency Band1 : 2110 MHz ~ 2170 MHz

Band5 : 869 MHz ~ 894MHz

Band8 : 925 MHz ~ 960 MHz

(BLER or R), 16QAM Only BLER < 10% or R >= 700kbps

6) WLAN 802.11b transceiver specification

Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level ≤ 20dBm under

Frequency Tolerance within ±25 PPM

Chip clock Frequency

≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz

Power ramp on/off time ≤ 2us

Carrier Suppression ≤ -15dB

< -36 dBm @ 30MHz ~ 1GHz

< -30 dBm above @ 1GHz ~ 12.75GHz

< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity ≤ -85dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

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