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Datasheet
Datasheet
CoolMOS C6
600V CoolMOS™ C6 Power Transistor
IPx60R125C6
Data Sheet
Rev. 2.1, 2010-02-09
Final
1 Description
CoolMOS™ is a revolutionary technology for high voltage power
MOSFETs, designed according to the superjunction (SJ) principle
and pioneered by Infineon Technologies. CoolMOS™ C6 series
combines the experience of the leading SJ MOSFET supplier with
high class innovation. The offered devices provide all benefits of a
fast switching SJ MOSFET while not sacrificing ease of use.
Extremely low switching and conduction losses make switching
applications even more efficient, more compact, lighter, and cooler.
Features
• Extremely low losses due to very low FOM Rdson*Qg and Eoss
• Very high commutation ruggedness drain
pin 2
• Easy to use/drive
• JEDEC1) qualified, Pb-free plating, Halogen free
gate
pin 1
Applications
PFC stages, hard switching PWM stages and resonant switching source
pin 3
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom, UPS and Solar.
Table of Contents
Table of Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7 Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Maximum ratings
2 Maximum ratings
at Tj = 25 °C, unless otherwise specified.
Thermal characteristics
3 Thermal characteristics
Electrical characteristics
4 Electrical characteristics
Electrical characteristics, at Tj=25 °C, unless otherwise specified.
Electrical characteristics
Table 10
Power dissipation Power dissipation
TO-220, TO-247, TO-263 TO-220 FullPAK
Table 11
Max. transient thermal impedance Max. transient thermal impedance
TO-220, TO-247, TO-263 TO-220 FullPAK
Table 12
Safe operating area TC=25 °C Safe operating area TC=25 °C
TO-220, TO-247, TO-263 TO-220 FullPAK
ID=f(VDS); TC=25 °C; D=0; parameter tp ID=f(VDS); TC=25 °C; D=0; parameter tp
Table 13
Safe operating area TC=80 °C Safe operating area TC=80 °C
TO-220, TO-247, TO-263 TO-220 FullPAK
ID=f(VDS); TC=80 °C; D=0; parameter tp ID=f(VDS); TC=80 °C; D=0; parameter tp
Table 14
Typ. output characteristics Tj=25 °C Typ. output characteristics Tj=125 °C
ID=f(VDS); Tj=25 °C; parameter: VGS ID=f(VDS); Tj=125 °C; parameter: VGS
Table 15
Typ. drain-source on-state resistance Drain-source on-state resistance
Table 16
Typ. transfer characteristics Typ. gate charge
Table 17
Avalanche energy Drain-source breakdown voltage
Table 18
Typ. capacitances Typ. Coss stored energy
Table 19
Forward characteristics of reverse diode
IF=f(VSD); parameter: Tj
Test circuits
6 Test circuits
Table 20 Switching times test circuit and waveform for inductive load
Switching times test circuit for inductive load Switching time waveform
VDS
90%
VDS
VGS
10%
VGS
td(on) tr td(off) tf
ton toff
V(BR)DS
VD
ID VDS
VDS VDS
ID
ID i
v diF /d t
trr = tS + tF
R G1 Q rr = Q S + Q F
trr
ΙF
VDS tS tF
10% Ι RRM t
RG2 Ι RRM
QS QF
d irr /d t
VRRM
90% Ι RRM
Package outlines
7 Package outlines
TO247-3-21/-41/-44
MILLIMETERS INCHES
DIM
MIN MAX MIN MAX
A 4.83 5.21 0.190 0.205
A1 2.27 2.54 0.089 0.100 DOCUMENT NO.
A2 1.85 2.16 0.073 0.085 Z8B00003327
b 1.07 1.33 0.042 0.052
SCALE 0
b1 1.90 2.41 0.075 0.095
b2 1.90 2.16 0.075 0.085
b3 2.87 3.38 0.113 0.133
b4 2.87 3.13 0.113 0.123
0 5 5
c 0.55 0.68 0.022 0.027
D 20.80 21.10 0.819 0.831 7.5mm
D1 16.25 17.65 0.640 0.695
D2 0.95 1.35 0.037 0.053
EUROPEAN PROJECTION
E 15.70 16.13 0.618 0.635
E1 13.10 14.15 0.516 0.557
E2 3.68 5.10 0.145 0.201
E3 1.00 2.60 0.039 0.102
e 5.44 (BSC) 0.214 (BSC)
N 3 3 ISSUE DATE
L 19.80 20.32 0.780 0.800 09-07-2010
L1 4.10 4.47 0.161 0.176
øP 3.50 3.70 0.138 0.146 REVISION
Q 5.49 6.00 0.216 0.236 05
S 6.04 6.30 0.238 0.248
Package outlines
Package outlines
Package outlines
Revision History
8 Revision History
Edition 2010-02-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.