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Test ELTECdata
Features Characteristics 446 / 446M11 Unit Conditions Reference
Detector Type POD
• High Sensitivity and Low
Element Size 1.0 x 2.5 mm, each
Noise
Optical Bandwidth 0.1 to 1,000 µm Various Filters 101
• Outstanding Detectivity (typ) 51,900
(D*) Responsivity V/W 8 to 14 µm, 10 Hz
(min) 38,100
• Cancellation of Case Noise (typ) 130 µVrms/√Hz 10 Hz, 1 Hz BW
Thermal Changes 8 to 14 µm,
NEP (typ) 2.87 x 10-9 W/√Hz 100
10 Hz, 1 Hz BW
• Wide Operational 8 to 14 µm,
D* (typ) 5.84 x 107 cm√Hz/W 100
Temperature Range 10 Hz, 1 Hz BW
(min) 5 104
• Immune to RFI-EMI Operating Voltage
(max) 15
VDC V+ to Gnd
(4.1.c)
• Simplified External Operating Current (typ) 1.5 mA 104 (4.1.c)
Circuitry Offset Voltage1 + 500 mV
Referenced 106
to Pin 3 Section B
Reference Voltage2 +2.50 V + .08 V
Thermal Breakpoint fΤ (typ) 0.20 Hz 102
Applications Recommended 0 to +70 oC (446)
Functional
Operating Temperature -40 to +70 oC (446M11)
X1 X2 2 OUTPUT
Voltage
60o 60o Ref.
RB
3 2.5 V REFERENCE
1 x 1011Ω
4 GROUND
90o 90o
100 50 Response (%) 50 100
3 4
PIN DESIGNATIONS
For –3 filter only. For other filters, consider refrac- 1. V+
tive index and thickness. 2. OUTPUT
3. 2.5 V REFERENCE
Symmetrical crystal gives same FOV in vertical and 2 1 4. GND/CASE
horizontal planes. BOTTOM VIEW
For best results, the following precautions and recommendations Noise: As a resolution or lower information limit, noise is established
should be observed. (See ELTECdata #101): not only by the detector. Other noise sources are:
Mounting: Avoid mechanical stresses on case and leads. • Radiated and conducted RF signals
Soldering: Detectors must be hand soldered to minimize the • Subsequent amplification or signal conditioning stages
chance of destroying the internal components. Avoid machine or • Power supply noise
hot air soldering. Leave a minimum lead length of .250 inch
(6.35mm). When soldering to detector leads, use a heat sink be- • Components, such as high value resistors and capacitors (tantalum
and aluminum electrolytic)
tween the case and leads. Beware that the new RoHS compliant
solders require a higher soldering temperature making heat sinking • Mechanical contacts and weak solder joints
the detector extremely important. • Shock and vibration excited microphonics
Static Discharge: Protect detectors from electro-static charges. • Outside thermal influences on the detector other than the desired
infrared input, i.e. drafts
Thermal Shock: Temperature changes and rate of change must be
o All of these noise sources should be considered carefully when the
kept to a minimum (<50C /min.) to prevent damage.
information signal is <10 mV.
40
20