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Review
Flexible Perovskite Solar Cells
Hyun Suk Jung,1, * Gill Sang Han,1 Nam-Gyu Park,2, * and Min Jae Ko3, *
Since the first report on solid-state perovskite solar cells (PSCs) with 9.7% effi ciency and Context & Scale
500-h long-term stability in 2012, PSCs have achieved an amazing power-conversion In a short time of 7 years,
efficiency (PCE) of 24.2%, exceeding the PCEs of multi-crys talline Si (22.3%), thin-film perovskite solar cells (PSCs) have
crystalline Si (21.2%), copper indium gallium selenide (22.6%), and CdTe-based thin-film achieved an amazing power
SCs (22.1%), and are suitable for transform ing into flexible solar cells based on plastic conversion efficiency (PCE) of
substrates. The light weight and flex ibility of flexible-PSCs (F-PSCs) allows their use in 24.2%, which exceeds the PCEs of
niche applications such as portable electric chargers, electronic textiles, large-scale multi-crystalline Si (22.3%), thin film
industrial roofing, and power sources for unmanned aerial vehicles (UAVs). However, the F- crystalline Si (21.2%), copper indium
PSCs always exhibit inferior efficiency compared to rigid PSCs, i.e., champion-cell ef gallium selenide (22.6%), and CdTe-
ficiency of F-PSCs is 19.11%, which is apparently lower than that of rigid cells. based thin-film SCs (22.1%).
Also, the world-best module efficiency for rigid perovskite module is 17.18% (30 cm2 )
higher than that for flexible perovskite module efficiency, 15.22% (30 cm2 ). Moreover, the Owing to low process
F-PSCs have not shown better long-term stability in comparison with rigid PSCs. In this temperature, mechanical
review paper, we investigate fundamental challenges of F-PSCs regarding relatively low durability, and the potential for the
efficiency and stability and demonstrate the recent efforts to overcome big hurdles. Also, solution-based roll-to-roll
current attempts for the commercialization of F-PSCs are introduced. (R2R) process, the PSC has a
strong potential of being utilized in
the form of flexible solar cell
challenge to achieving high efficiency. Since the F-PSC is potentially used in bend able or foldable
In this review paper, we
electronic devices, robust bending durability is another important issue. In this regard, there has been
investigate the fundamental
remarkable progress in developing F-PSCs with high efficiency as well as with bending durability.
challenges of F-PSCs such as the optical
transmittance of flexible substrates and
electrical
In 2014, the F-PSC with a meaningful efficiency of 10.2% was exploited by using ZnO nanocolloids
conductivity of flexible
ETL (5 nm).8 The high-density and uniform ZnO layer was successfully prepared without a sintering
transparent conducting oxides, uniform
process. In 2015, Kim et al.6 realized a high PCE of 12.2% flexible cell by fabricating a TiO2 ETL using
coating technology with a large area on
plasma-enhanced atomic layer deposition (PEALD). They performed the bending durability test of F-
flexible substrates, the high moisture
PSC for the first time and characterized the excellent bending durability of perovskite materials. Park
permeability of plastic flexible substrates,
et al.9 also proved the super-flexibility of F-PSCs by demonstrating the complete shape recovery of
and super flexibility. We also introduce
the device under repeated crumpling condition without signifi cant mechanical damage. The PCE was
recent efforts for overcoming the
maintained up to 60% of initial value even after 50 cycles of complete crumpling (Figures 1B and 1C).
aforementioned issues as well as for
Another breakthrough was achieved by exploiting the inverted structured F-PSC, which adopted an
facilitating the commercialization of F-
organic charge transport layer.10 Owing to the use of PEDOT:PSS as an organic hole-trans port layer
PSCs. As a perspective, we suggest the
(HTL), the maximum processing temperature for manufacturing flexible PSS was 90 C. Stretchable
future direction of research and
and ultra-lightweight F-PSC with the inverted structure was successfully fabricated, implying that the F-
development of F-PSCs such as the
PSC could be applied to power avia tion models.7 The photovoltaic performance of ultrathin F-PSC
module technology involving assembling
was displayed as a function of compression condition (Figure 1D).
multiple subcells and the flexible tandem
devices
In this review paper, we investigate the fundamental challenges of F-PSCs regarding relatively low
1School of Advanced Materials Science and
efficiency and stability compared to glass substrate-based PSCs and demonstrate the recent attempts
Engineering, Sungkyunkwan University, Suwon
to overcome big hurdles. Moreover, this paper deals with the efforts that have been made to facilitate 16419, Republic of Korea 2School of Chemical
the commercialization of Engineering, Sungkyunkwan University, Suwon
F-PSC. 16419, Republic of Korea 3Department of Chemical
Engineering, Hanyang University, Seoul 04763,
Republic of Korea *Correspondence:
Fundamental Challenges in Flexible Perovskite Solar Cells Challenge in
hsjung1@skku.edu (H.S.J.), npark@skku.edu (N.-
Substrate Materials for the Flexible Solar Cells First, a general review of G.P.), mjko@hanyang.ac.kr (M.J.K.) https://doi.org/
the substrate materials for flexible solar cells is provided.24 Flexible substrates are among the most 10.1016/j.joule.2019.07.023
important components required to realize
losing their original functions. In addition, dimensional stability, that is, the ability of
materials to maintain its original dimensions while being used or processed, should
be ensured. (6) Thermal and thermomechanical properties: two parameters, i.e.,
the thermal transition temperature and the coefficient of thermal expansion (CTE),
have to be considered. The softening temperature of substrate materials, especially
the so-called glass transition temperature (Tg) for the polymer, must be compatible
with the maximum processing temperature (Tmax) that films can be subjected to.
The substrates would be expanded or contracted during temperature change. Sig
nificant mismatch of thermal properties between the neighboring layers would exert
additional stress on the lattice, resulting in the creation of strain and cracking during
heating and cooling processes. The limit of tolerable thermal mismatch is expressed
by jDCTE,DTj %0:1% 0:3%, where DCTE and DT are the difference in CTE between
the base substrate and the neighboring layers that are subsequently deposited, and
the temperature excursion during processing, respectively. (7) Surface roughness:
rough surface of the substrate could not assure the conformal coating of layers and
avoidance of electrical short circuiting in the device. When the roughness is very
large, additional planarization processes are necessary like polishing and coating
for the steel-based substrates and polymer, respectively, which would in crease the
processing cost.
Three types of materials, i.e., ultrathin flexible glass, metal foils, and polymers, are
available for the substrate of flexible photovoltaics. Glass substrates with a thickness
of several hundred mm become flexible. The flexible glass can meet most of the
stan dards for the requirements of the flexible substrate, described above. The
strong temperature tolerance of up to over 600 C, good dimensional stability, low
CTE of 10 6
/ C, andheavy
fragility, perfect gas barrier
weight, properties
and high are very
cost would attractive.
be big concerns, However,
as compared
to other candidate materials. By contrast, thin metal foils such as stainless steel and
Ti retain very good mechanical properties and resistance to process chemicals;
however, the impermeability of light would limit its application to the substrate of
flexible solar cells. Polymer substrate would be ideal in terms of flexibility, light
weight, low cost, and R2R processability. However, there are many drawbacks such
as low heat resistance, high CTE, and poor gas barrier properties for oxygen and
moisture.
In particular, because of the low Tg and high CTE of the polymer substrate,
shrinkage or expansion of polymer substrate would occur with temperature change.
Therefore, the whole fabrication processes should be completely redesigned and
compared to the processes capable of high-temperature heat treatments. In addition,
according to the tolerance thermal mismatch rule explained above, even a small
mismatch would cause cracked or strained TCO or device. Therefore, the process
windows for a polymer-based solar device become very narrow. In addition,
regarding the barrier properties of polymer substrates, most of the polymer
substrates do not satisfactorily meet the demanding requirements for oxygen and
moisture protec tion. As a result, the extra encapsulations are highly necessary for
the long-term stable operation of F-PSCs. Additionally, it is desirable that the
functions that are antireflection (AR) and ultraviolet (UV) proof (AR+UV-proof) are
added to the encap sulating layer for further light absorption and long-term stability, respectively.
Modulus (MPa) 0.1–0.5 3 103 2–4.1 3 103 2.5 3 103 2.0–2.6 3 103
Work temp. ( C)
–
50–150 <400 40–130
stabilization of the films, are widely used as conventional and commercially available
polymer substrates, despite several drawbacks, such as low heat resistance and
dimensional instability during processing. Polycarbonate (PC) and polyethersulfone
(PES) are optically more transparent and have a relatively high Tg compared with PET
and PEN, but they lack process chemical resistance and have poor gas barrier prop
erties. Polyimide (PI) exhibits excellent thermal properties but is not optically clear,
which is critical for a substrate material of light-absorbing devices, although color less
PI has been recently developed. Table 1 compares the properties of flexible
polymer substrates.25
For use as TCEs, TCOs are subsequently deposited on the flexible substrates. As
base materials of TCOs, indium oxide (In2O3), tin oxide (SnO2), and zinc oxide
(ZnO) are typically used. By doping specific metal ions to those, the transparency
and conductivity noticeably increase because of the extrinsic doping effects. Among
the TCOs, indium tin oxide or tin-doped indium oxide (ITO) and fluorine-doped tin
oxide (FTO) are commercially and widely used in optoelectronic devices.
The deposition process of TCO on polymer substrates such as PET and PEN is
limited because of thermal sensitivities of polymers. The flexible TCEs with higher
optical transmittance and conductivity are basic essentials for the high performance
of F-PSC. However, typically, the overall performance of plastic-based F-PSC would
be inferior to that of rigid glass-based PSCs due to the lower optical transmittance
and lower electrical conductivity of polymer-based TCE.
The optical transmittance of substrates is very critical for PCE because photoactive
materials should absorb as much light as possible. Polymeric materials inherently
absorb ultraviolet and even visible light to some extent, due to the electronic tran sition
of the chromophore in polymers, leading to the light-harvesting loss for the
photoactive materials. Zhao et al.26 demonstrate that the flexible ITO/PET sub strates
show relatively lower transmittance in the visible range, compared to ITO/
glass, due to the lower transparency of the polymer (Figure 2A).
The optical properties of F-PSCs are also affected by those of TCOs that are gener ally
transparent in visible and infrared regions due to the large bandgap (Eg) of over
3.0 eV. The transmission window defined by the two imposed boundaries (lg and lp)
is also observed. The lg at the short wavelength of UV regions is related to photon
absorption with energy larger than Eg. The second transmission edge (lp) is referred
to as the plasma wavelength, where the frequency of the light is the same as the
The ITO is the most widely used TCO for polymer substrates, due to the better trans
mittance and lower sheet resistance than others. It is generally known that the elec
trical properties of ITO strongly depend on the film composition and deposition
parameters such as sputtering power, oxygen pressure, film thickness, and substrate
deposition temperature.28 Zardetto et al.29 reported that the sheet resistance of
PET/ITO increases at over 180 C and the sheet resistance of PEN/ITO increases at
235 C. However, this would not be an issue for the polymer substrates in which a
low-temperature process is essential. On the other hand, the conductivity of plas tic-
based TCE employing ITO is typically lower than that of a glass-based one,
due to the relatively lower carrier concentration of ITO films on polymers. The micro
structure of ITO without high-temperature thermal treatments is generally amor phous
or partially crystalline, leading to poor electrical properties.
For the fabrication of ITO-based glass, ITO is dc-magnetron sputtered at glass sub
strates while the substrate is maintained at approximately 300 C–400 C, or sput tered
on the cold substrate, followed by annealing at 200 C. Such a heat treatment
would result in a high degree of the crystalline or partially crystalline microstructure
of ITO. Meanwhile, the conduction electrons are created because oxygen defi ciencies
could donate a maximum of two unbound electrons by removing oxygen
from the cluster, which is beneficial for better electrical conductivity. Besides,
dopant S4+ would replace In3+ by extrinsic doping during sputtering, further produc
ing one more electron in the conduction band of In2O3 x. Both the oxygen vacancies
and tin dopants in substitutional lattice positions would simultaneously contribute to
electrical conductivity. On the other hand, such contributions as doping and crystal
effects would not be expected in the ITO deposited at room-temperature process ing
limited by the polymer substrate. Bellingham et al.30 reported that the higher
resistivity of the amorphous or less crystalline ITO films would be a consequence of the
inability to activate the impurity dopant, i.e., limited diffusion of Sn4+ from inter stitial
locations and grain boundaries into an In3+ site, caused by the low deposition temperature.
In this case, the conductivity solely depends on oxygen vacancies.
Furthermore, the electron transports in the amorphous or less crystalline ITO films would
not be as effective as those in the ordered crystalline structure, due to the relatively large
amount of defects and charge traps. Figure 2C exhibits the sheet resistance of PET/ITO
and glass/ITO. The sheet resistances of PEN/ITO and PET/ITO significantly increase after
thermal treatment at 200 C and 240 C, respectively.29
As described previously, the morphological, electrical, and optical properties of ITO films
change depending on the deposition condition and types of substrates. How ever, except
for the ITO crystalline quality and preferred orientation, no significant difference in chemical
composition or chemistry according to the process tempera ture was reported.31–36 Lee
investigated the relationship between microstructure of ITO and electron scattering
mechanisms at the various process conditions.33 For the less crystalline ITO, the grain
boundary scattering was dominant while ITO with a high crystallinity was governed by the
ionized-impurity scattering mechanism due to the higher carrier concentration.
Deposition of thicker TCO on plastic substrates is another strategy to compensate for the
low conductivity. However, because the absorption of TCO films rises strongly with
increasing thickness, there are some limitations to meet both the desired properties
together.
Recently, F-PSCs have been fabricated using various transparent electrodes, such as
metal-based materials (nanowires, grids, and networks), conducting polymers, car bon-
based materials (carbon nanotube and graphene), and oxide–metal–oxide mul
tilayers.37,38 Table 2 summarizes the transmittance and sheet resistance of various
flexible PCEs for the F-PSCs reported.
However, in terms of cost and productivity, flexible solar devices are more promising than
rigid glass ones. For the commercialization of F-PSCs, it is important to develop a process
to make mass production with an R2R process possible. The printing and coating methods
can be divided into contact and noncontact methods depending on whether the coating
materials are in direct contact with the coating plate (Fig ure 3). Screen printing,
flexography, gravure printing, and soft lithography belong to the contact methods that have
been widely used recently in printed electronics.
Recently, Cruz et al.25 reported the relationship between process parameters and printing
quality for the fabrication of printed electronics on polymer substrates.
Table 2. Transmittance and Sheet Resistance of Various Flexible Substrates for the F-PSCs
Substrates Electrodes Transmittance (%) Sheet Structure of PSCs PCE (%) Ref.
Resistance
(U/cm2 )
Ti Foil Ag (8 nm)
– –
You
Ag (1 nm) +ITO> 80 107.14 Ti/TiO2 BL/TiO2+MAPbI3/ Spiro/Ag+ITO 11.01 41
PET PEDOT: PSS + EG> 60 28 PET / PEDOT: PSS (PH1000) + EG / PEDOT: PSS (VPAI 4083) / 4.9 42
MAPbI3/PCBM/TiOx/Al
PET AuCl3 GR >80 75 Al / PCBM / MAPbI3 / PEDOT: PSS / AuCl3-GR / APTES / PET 17.9 37
Glass ITO – –
Glass/ITO/PEDOT: PSS/MAPbI3/PCBM/Al 11.5 46
PET ITO – –
PET/ITO/PEDOT: PSS/MAPbI3/PCBM/Al 9.2 46
They proposed that the coating quality on the substrates mainly depends on the sur face
wettability, spreadability, and adhesion. In particular, when polymer substrates
are used, the low surface energy of polymer substrates gives rise to poor coating or
printing quality, requiring additional surface treatment before processing. Such
additional processes generally increase the cycle time and production costs. The
coating quality generally depends on the surface tension of the bottom layer. There fore, a
deep understanding of the relationship between process parameters and
printing quality is required for the fabrication of high-performance F-PSCs with large
areas. Conformal coating or printing without pinholes on floppy substrates is crucial
to the performance of F-PSCs. In particular, the control of the crystallization kinetics
of the perovskite layer should be uniformly controlled over a large area during sol vent
evaporation. Moreover, the profiles of plastic substrates as supporting layers
generally remain intact, even after multiple coatings of upper layers. Therefore,
the planarization for uniform coating is important. In addition, accumulated internal
stress or strain is generated when the mechanical and thermal shocks are applied to
the films, leading to delamination or debonding. This is more severe for large-area
devices.
Figure 3. Schematic Illustration of Contact (Upper Three Figures) and Noncontact (Lower Three
Figures) Methods for Perovskite Layer Coating on a Flexible Substrate
protection from the intrusion of moisture. By contrast, glass substrates can block the
penetration of moisture through the substrates. However, F-PSCs with polymer sub
strates have severe stability problems because of the much higher water vapor trans
mission rate (WVTR) or oxygen transmission rate (OTR) of polymeric substrates.
The WVTR and OTR of polymer materials are generally approximately 1–10 g/(m2
day) and about 1–10 mL/(m2 day), requiring additional lamination or encapsulation
6
to achieve those values in the range of 10 .
The reasons for the poor barrier stability and higher gas permeability are related to
the morphology of polymers in the films. The microstructure of polymers can be
divided into a crystalline part and an amorphous structure, depending on whether
the arrangements of the polymers are regular or irregular. PET and PEN, which are
widely used as substrates, are semi-crystalline polymers in which crystalline and
amorphous are mixed, thus easing penetration of gas or moisture molecules. How
ever, inorganic materials, such as glass SiO2, are regularly arranged in an atomic
arrangement. As a result, such a dense structure of inorganic materials effectively
suppresses the penetration of the molecules, such as moisture or oxygen. The fac
tors affecting the moisture permeability are (1) film thickness, (2) film density, and
(3) crystallinity.53 Gas molecules diffuse through the nanoscale or micron-scale
pores, called ‘‘free volume,’’ in the polymers. There are three stages of penetration
of gas molecules: (1) polymer adsorption of penetrating molecules, (2) diffusion due
to the difference in concentration of the molecules inside and outside the polymer,
and (3) desorption from the polymer film. These three series of steps are continuous,
especially water molecules penetrating the interior. The thermal motion of polymer
segments facilitates this penetration. Considering these sequential steps, the thicker
the polymer substrate, the longer the diffusion distance of the molecules becomes,
resulting in lower moisture permeability. However, because the gas transmittance
decreases as the thickness increases, it is important to select an appropriate thick
ness of polymer substrate because of the trade-off relationship with optical transmit
tance. Additionally, as the density of the film increases, the size of the free volume
pore becomes smaller, so diffusion becomes difficult, and the moisture permeability
becomes lower. Finally, the free volume occupies the amorphous region rather than
the crystalline portion, so the moisture permeability decreases as the crystalline part
increases. Naturally, as the amorphous area increases, the free volume and moisture
permeability increase.
To relieve concerns about the stability issue, flexible film packaging employing a gas-
barrier encapsulating function should be developed for F-PSCs. The encapsu lating
package includes flexible front/back sheets, flexible encapsulant, edge seal, and
electrical joints. A typical configuration of flexible packaging for F-PSCs is a transparent
front sheet/encapsulant/F-PSC/encapsulant/back sheet.54 In addition to the gas-
barrier property, the materials embedded in barrier films should exhibit a relatively
higher dielectric constant, optical transparency, thermal and UV stabilities, good
adhesion, chemical inertness, processability, and me chanical strength with scratch
resistance. Organic encapsulating materials are a good candidate to meet most of the
requirements above, except gas barrier properties. Recently, organic-inorganic
multilayer films have been commonly used to obtain better barrier properties.55 For
further performance development of barrier film, the encapsulation and packaging
technology developed in organic 6 g/(m2 day) would pro light-emitting diodes (OLEDs)
of 10 6 g/(m2 day) than vide deep insight, because OLEDs require that requires
a higheraWVTR
WVTRof
10 solar cells.
For the evaluation of flexibility, bending tests are widely used for flexible electronics.
During bending, the outer and inner surfaces experience tensile and compression
stress, respectively. The plane inside the device, where no uniaxial stress is applied
by balancing the tensile and compression stress, is defined as a neutral plane. If the
neutral plane is located at the most fragile layer, the mechanical durability is sus
tained. On the other hand, the relationship between the film strain and the radius of
bending curvature is expressed by e = d/2r, where e, d, and r are the strain, device
Although ITO films have the same composition, the photovoltaic performance of F-
PSCs may be different depending on the fabrication method of ITO. Kim et al.58
compared the cell performance containing ITO films prepared by (1) ion-plated pro
cess and (2) sputtering process. The ion-planted ITO film showed better electrical
and optical properties such as sheet resistance and optical transmittance in compar
ison with the ITO films prepared by a sputtering process. The resultant PCE of PSC
based on ion-planted ITO was measured to be 15.4%, which implies that the
Figure 4. The Influence of TCO Materials on the Photovoltaic Performance of F-PSCs (A)
Schematic representation of device architecture for the F-PSCs, where different transparent conducting oxide (TCO), AZO (aluminum-doped zinc oxide),
ITO (tin-doped indium oxide), and amorphous IZO (indium-zinc oxide) were investigated. X-ray diffraction (XRD) patterns and transmittance of AZO, ITO,
and IZO are shown on the left. Current density-voltage (J–V) characteristics (reverse scans) under 100 mW/cm2 AM1.5G for champion
Cs0.04MA0.16FA0.80Pb1.04I2.6Br0.48 perovskite devices with (B) willow glass-AZO, (C) willow glass-ITO, and (D) willow glass-IZO. Reprinted with
permission from Dou et al.43 Copyright 2017 American Chemical Society.
Metal foils have been one of the promising candidates as a flexible electrode owing
to high flexibility, high electrical conductivity, and a wide process temperature win
dow. In particular, Ti metal foils have been abundantly utilized as a flexible substrate
due to easy formation of TiO2 ETL. An attempt to replace Ti with cheap Cu foil has
been made.59 Cu foil is capable of simply forming CuI HTL. Although many efforts
have been made, it is challenging to achieve a high efficiency due to the inherent
op tical reflectivity of metal, however. Many studies have focused on the exploitation
of top electrodes that possess a high conductivity and high optical transmittance.
Ag metal film has been well utilized as a translucent top electrode. Since the
translucent Ag metal itself does not show high electrical conductivity as well as high
optical trans mittance, the modification of Ag film has been proposed.39,41,60 For
example, Ag nanowire electrodes showed the improved PCE of 7.45% compared
to the PCE of bare Ag electrode cells (6.15%). The F-PSCs employing 13 nm thick
Ag layer coated with amorphous ITO (a-ITO) exhibited 11.01%. Another Ni mesh
metal grid was utilized to replace Ag materials.61 In this study, a transparent
conductive adhesive (TCA) was adopted to reduce interfacial resistance between the metal grid and
Instead of metal-foil substrate, flexible CNT or graphene materials that are directly
deposited on plastic substrates may be one of the alternatives to brittle TCO
materials.63 Liu et al.64 adopted a graphene layer instead of TCO and achieved a
su per-light flexible solar cell with a power density of 5.07 W/g. Efficiency of graphene
based F-PSCs has been significantly improved by combining with PEDOT:PSS layer
and incorporating dopants such as AuCl3 and MoO3 into graphene.37,45 The F-PSC
containing AuCl3-doped graphene layer with PEDOT:PSS showed a high PCE of
17.4%.37 CNTs have been also utilized as flexible transparent electrode materials.
Although the photovoltaic performance of CNT-based cells is inferior to that of gra
phene-based cells, the superior mechanical stability and large-scale fabrication pos
sibility make it appropriate for commercialization of F-PSC.65
Silver nanowire (Ag NW) or mesh has been well investigated as transparent elec
trode materials in F-PSCs owing to high figure of merit, relatively good chemical sta
bility, and bending durability. These materials are usually combined together with
PEDOT:PSS to enhance the electrical conductivity of the transparent electrode.
The Ag NWs/PEDOT:PSS electrode-based cell exhibited 11% PCE and the efficiency
was retained after 10,000 cycles of bending test under 5 mm of a radius of curva
ture.66 Moreover, to overcome the difference in work function between Ag and
PEDOT:PSS, polymer or graphene oxide (GO) interlayers were inserted.67,68 The
PCE of Ag-mesh/PH10000/PEDOT:PSS based cell was 14% achieved by Li et al.67
(Figure 5). This cell retained 95.4% of initial PCE after 5,000 bending cycles under
radius curvature of 5 mm.
Advanced Electron Transport and Hole Transport Layer for Flexible Cells
In n-i-p structure flexible cell, low-temperature formation of an ETL such as ZnO,
TiO2, and SnO2 layer on plastic-based TCO substrate is challenging. To overcome
inferior electron-transport properties of low-temperature-treated ETL, interface
modification method with C60 or graphene and new composition oxide ETL has
been exploited. Also, various carbon-based materials have been used as ETL layers.
ZnO compared with TiO2 is relatively suitable for the low-temperature process.69
Also, ZnO possesses better electrical conductivity and carrier lifetime in comparison
with TiO2, which led to a high PCE of 15.6% in F-PSCs.69
TiO2 ETLs have been well studied in F-PSCs. There have been mostly two ways to
form TiO2 ETL in a flexible plastic substrate. First, low-temperature deposition using
vacuum-based thin-film deposition systems such as the evaporator, sputter, and
atomic layer deposition (ALD); second, deposition of well-crystallized TiO2 colloidal
particles and subsequent treatment such as UV treatment or low-temperature an
nealing treatment.70–72
The RF-sputtering method for deposition of TiO2 layer has been well known. Usually,
amorphous TiO2 layer can be obtained using the low-temperature sputtering method.
Yang et al.73 compared carrier transport, recombination, and lifetime char acteristics
of both amorphous and anatase TiO2 layer. Fermi level of amorphous TiO2 was
4.15 eV, slightly lower than that of anatase TiO2 ( 4.01 eV). This leads to superior
electron-transport property of an amorphous layer, achieving a PCE of 15.07% for F-
PSC.73 The PEALD method is favorable for precise control of thickness and reducing
oxygen vacancies in TiO2 ETL. Kim et al.6 realized F-PSC with a PCE of 12.2% by
fabricating TiO2 ETL with the aid of low-temperature PEALD process, as shown in
Figure 6. The charge transport properties of TiO2 ETL prepared by PEALD are
enhanced by interface modification with PCBM, which yields 17.7% PCE.74
Moreover, Giacomo et al.72 were able to fabricate F-PSC modules by combining
TiO2 ETL prepared by PEALD and mesoscopic TiO2 layer. TiO2 layer can be depos
ited by electron-beam evaporation and the resultant cell efficiency was reported to
be 13.5%.75
Since the stability and hysteresis issues of TiO2 materials, SnO2 has been conceived
as another alternative to ETL materials due to its enhanced charge transport prop
erty.76 Usually, SnO2 layer has been prepared by a solution coating method that
contains precursor solution coating and subsequent heat treatment. However, this
heat-treatment process is not suitable for obtaining SnO2 with good crystal quality in
plastic-based flexible cells due to limited heat-treatment temperature. Plasma
treatment may be a good method to overcome the temperature issue. N2 plasma
treatment broke alkoxy and hydroxy group to form Sn-O bonding at a low temper
ature, as shown in Figure 7. The resultant PCE of F-PSC was 18.1%.77 The employ
ment of highly crystalline SnO2 colloids is another way to achieve high efficiency.
Park et al.78 synthesized highly crystalline and dispersed SnO2 colloids. This SnO2
Figure 6. Amorphous TiO2 ETL for F-PSCs Using PEALD at the Low-Temperature Process (A)
The structure and best performing device of F-PSCs on ITO–PEN, with a TiO2 ETL by using
PEALD. Cross-sectional SEM image of the inorganic-organic halide perovskite planar heterojunction
flexible solar cell and schematic of the flexible device structure. J–V curve measured under the
simulated solar light for the best performing PEN–ITO–TiOx–CH3NH3PbI3-x)Clx–spiro MeOTAD–Ag
flexible device. Reprinted with permission from Kim et al.6 Copyright 2015 Royal Society of Chemistry.
(B) F-PSCs with hybrid double ETL (PCBM and TiO2 prepared by PEALD). A cross-sectional TEM
image of the as-prepared a-TiO2–PCBM ETL.-based PSCs. A schematic representation and J–V
curve of an a-TiO2–PCBM ETL-based PSC on the ITO-PEN substrate. Reprinted with permission
from Kim et al.74 Copyright 2018 John Wiley and Sons.
colloid ETL exhibited excellent charge-transport property, which enabled a PCE of 17.7%.
PEALD-synthesized ETL shows also the excellent photovoltaic performance with a PCE of
18.36%.21 In addition, the low-temperature-processed EDTA (ethylene diamine tetraacetic
acid)-complexed SnO2-based F-PSC achieved a PCE over 18.4%.79 To enhance the
charge-transport property of SnO2 ETL, doping metal ions or mixing graphene oxide have
been attempted.80,81
New composition ETLs have been exploited to enhance charge transport as well as to
reduce the hysteresis phenomenon in F-PSC. Zn2SnO4 (ZSO) is a good example,
82 The PCE of ZSO-based F-PSCs
possessing better optical transmittance than SnO2. has been improved by tailoring particle
size and stacking structure, which leads to yielding 16.5% PCE.83 Also, the combination
of PCBM with ZSO was reported to facilitate electron transport in F-PSC.84 Nb-doped WOx
(W(Nb)Ox) was used as ETL. By controlling the thickness of W(Nb)Ox, PCE and hysteresis
properties were improved.85 Recently, fairly interesting ETL material that is nanocrystalline
titanium metal-organic frameworks (nTi-MOF) was proposed. The addition of PCBM
increased the electrical conductivity and enhanced the charge injection properties of nTi-
MOF. The flexible cell employing nTi-MOF/PCBM demonstrated a PCE of 17.43%.86
Large bandgap materials such as Nb2O5 and Al2O3 were utilized as ETLs. The elec tron
transport from the perovskite layer to TCO was enabled by quantum tunneling effect.87,88
However, the inherent high series resistance is still challenging to achieve high efficiency.
As an alternative, electrically conductive organic materials, including the modified C60 and
PCBM, have been utilized as ETLs. Stearyl dimethyl benzyl ammonium chloride (SDBAC)-
doped [6,6]-phenyl-C61-butyric acid methyl ester (PC61BM) was used as ETL wherein
SDBAC enhanced the conductivity and therefore
In p-i-n structure, HTL has been actively studied because HTL requires high optical
transmittance, bending durability, hole injection, and hole-transport properties in p-i-
n F-PSC. In this regard, PEDOT:PSS have been proposed as suitable HTL mate
rials.47 However, the relatively poor charge transport in the out of plane direction
due to its lamellar structure, the potential energy loss at the interface between
PEDOT:PSS and perovskite layer due to low work function, and corrosion capability
to the adjacent layers due to its acidity are critical issues.91 Therefore, new organic
HTL materials such as 1,4-bis(4-sulfonatobutoxy)benzene and thiophene moieties
(PhNa-1T) and (N-(4-(9H-carbazol-9-yl)phenyl)-7-(4-(bis(4-methoxyphenyl)amino)
phenyl)-N-(7-(4-(bis(4-methoxyphenyl)amino)phenyl)-9,9-dioctyl-9H-fluoren-2-yl)-
9,9-dioctyl-9H-fluoren-2-amine (CzPAF-TPA)) have been exploited.91,92 For
example, the F-PSC using PhNa-1T as HTL showed significantly higher 14.7% PCE in comparison
with the PEDOT:PSS-based one (8.4%), which was ascribed to the decreased potential
energy loss at the interface between perovskite and HTL as well as to efficient hole
injection.91
Since the organic HTLs exhibit relatively low stability compared with inorganic HTLs,
research on developing new HTLs has been shifted to exploit new inorganic HTLs.
In particular, NiOx materials have received a great deal of attention due to the well-
aligned band structure with perovskite layer, good optical transparency, and electron
blocking capability.91 The NiOx HTLs have been deposited by vacuum thin-film
fabrication tools such as ALD, RF-sputtering, and evaporation.93–95 How ever, in F-
PSC for potential roll to roll process, low-temperature solution coating has been under
active research.96–98 Najafi et al.98 achieved 16.6% PCE in F-PSC, which exhibited
fairly good stability. Over 85% of the maximum stabilized output ef ficiency was retained
after 1,000 h aging employing a thin MAPbI3 perovskite.98 Also, NiOx derivatives have
been studied to improve photovoltaic perfor mance.99–101 Cu-doped NiOx (Cu:NiOx)
HTL-based F-PSC demonstrated 17.16% because of the improved charge injection
and the improved surface morphology.100 Noticeably, the hybrid HTL composed of
PEDOT:PSS–NiOx made it possible to achieve 18.0% PCE in F-PSC.101 Cu-based
HTL materials such as CuyCrzO2 and CuSCN have been introduced.102,103 However,
these materials are fairly challenging due to the problem of formation of CuI coming
from inter-diffusion of Cu and In ions.102,103
In p-i-n structure, n-type ETL needs efficient electron extraction, full coverage on the
perovskite layer, no damage on perovskite layer during the coating process, and no
chemical reaction between ETL and perovskite under operating conditions.104 In this
regard, fullerene-based ETL such as PCBM has been the most popular in p-i-n struc
tured PSC. However, the wettability of PCBM on the perovskite layer is not better than
polymer-based ETL, which may induce the deterioration of long-term stability related
to insufficient coverage of PCBM. Therefore, polymeric ETLs, including the naphthalene
diimide (NDI)-based polymer with strong electron withdrawing dicyanothiophene
(P(NDI2DT-TTCN)) and triphenylamine (TPA)-(3-cyano-4,5,5-tri methyl-2(5H)-
furanylidene)malononitrile (3CN), have been developed in F-PSC.
Representatively, the flexible cell employing the P(NDI2DT-TTCN) as ETL achieved
17.0% PCE with good long-term stability owing to the improved charge extraction
ability. Also, the mechanical durability of this material was better than PCBM.104
One of the strategies for high-quality perovskite film is to add the additives in the
perovskite precursor. H2O is critical to controlling the crystallization rate and grain
size, which achieved the 13.11% PCE (Figure 8A).106 Moreover, the dual additives of
DIO and H2O in perovskite precursors can induce gradient evaporation during
the drying and heat process. This leads to high-quality perovskite film with large
grain and uniformity, achieving a PCE of 18.0% for F-PSC.101 A dimethyl sulfide
(DS) additive has been successfully developed as it chelates with Pb2+ to form an
in termediate complex and slows down the crystallization rate of perovskite film.
The resultant PCE of F-PSC was 18.4% with good mechanical tolerance (Figure
8B).107 Recently, a quintuple-cation perovskite film containing Rb+, K+, Cs+, FA+,
and MA+ was proposed to reduce the trap density in the perovskite film, which a
cham pion PCE for F-PSC of 19.11% was achieved with less hysteresis (Figure 8C).17
Efforts have been made to improve the bending reliability of F-PSCs by replacing
or modifying inorganic TCO and substrate materials. Nanostructured ITO demon
strated the improved flexibility of PSCs. The inverted nanocone ITO showed
improved bending durability compared with the planar ITO based cell. The F-PSC
employing inverted cone retained 95% of the initial PCE after 200 cycles of bending
test under a 6 mm radius of curvature, which was ascribed to strain relaxing effect of
nanocone structure.108
Metal nanowires possess excellent flexibility, which enables to replace the relatively
brittle TCO. However, the roughness and adhesion issues remain. These issues have
been resolved by combining an oxide layer or hybrid layer.109,110 The composite of
crystalline ITO metal nanowire-GFRHybrimers is one of the representative examples.
The flexible cell containing this nanocomposite showed excellent bending dura bility.
Under 2.5 mm radius of curvature, this cell showed 20% degradation to initial PCE
after 500 cycles of bending test.110
The PEDOT:PSS system has been frequently utilized for realizing ultra-F-PSCs owing
to its flexible nature of the polymer. The F-PSCs employing PEDOT:PSS materials do
not possess any cracks from the fracture of PEDOT:PSS in contrast with ITO materials
under a severe bending condition such as a 4 mm radius of curvature.111 The F-PSCs
Carbon nanomaterials such as CNT and graphene have shown excellent flexibility
with proper electrical conductivity compared with TCO. All-carbon-electrode-based F-
PSC employing graphene as the transparent bottom electrode and CNT as the top
electrode retains 84% of the initial PCE after 2,000 cycles of the bending test under
a 4 mm radius of curvature.63 MoO3-decorated graphene-based F-PSC demonstrates
super flexibility, i.e., only 10% degradation in PCE is observed after 1,000 cycles of
the bending test at a radius of curvature = 2 mm. Moreover, this cell achieved 16.8%
PCE, which exhibits the great potential for the highly efficient foldable photovoltaic cell.45
The flexibility of PSC has been improved by adopting a new type of flexible substrates
with conducting layers such as Ti plate–TiO2 substrate.113 The highly bendable PSC
containing TiO2 nanolayer-coated Ti plates does not show any degra dation in PCE
after 1,000 cycles bending test at 4 mm radius of curvature, which is explained in
terms of high crystallinity with low oxygen vacancy that improves bending durability.113
Toward Commercialization
Owing to abundant cheap precursor materials and low-cost processes, the perov
skite solar module has been believed to be economically viable, which will enable it
to be a leader in the future photovoltaic market. The manufacturing costs for the
perovskite solar module has been expected to be one-third of those based on bulk
silicon PV technologies.12 Moreover, the levelized cost of the electricity (LCOE) for
perovskite solar modules could reach 6 US cents/KWh, comparable to the LCOE for
the fossil fuels once the module efficiency and lifetime exceeded 12% and 15 years,
respectively.
High efficiency and bending durability for F-PSCs provide prolific application
opportunities. These flexible solar cells have the capability of being installed on the
curved surface, which is suitable for building integrated photovoltaics (BIPV).
Moreover, lightweight with high efficiency enables to achieve a high-power density of
2 W/g,67 which makes them possible to be utilized as a power source in high-alti
tude unmanned aerial vehicles (HAUAVs). To commercialize this F-PSC, however,
several issues remain: (1) developing uniformly large-area coating technology (Table
3), (2) ensuring long-term stability by encapsulation technology, and (3) ex ploiting
emerging unique flexible cells for special applications need to be solved.
Table 3. The Uniform and Large-Area Coating Methods for Perovskite Modules, and Comparison of Device Structure, Substrate Type, Active Area,
and Performance of Perovskite Modules
Scalable Coating Substrate Device Structure Active Jsc Voc (V) Fill PCE (%) Ref.
Coating Layer Method Type Area (cm2 ) (mA/cm2 ) Factor (%)
Perovskite doctor-blade rigid glass/FTO/TiO2/perovskite/spiro 10.1 4.29 4.11 58.14 10.26 119
doctor-blade rigid glass / FTO / TiO2 / perovskite / P3HT glass / 100 0.83 9.61 53.79 4.30 119
doctor-blade rigid ITO / PTAA / perovskite / 33 1.19 18.1 71.3 15.3 120
doctor-blade rigid glass / ITO / PTAA / perovskite / 57.2 1.26 17.04 67.5 14.6 120
(double-layered)/P3HT
drop casting rigid glass/FTO/TiO2/ZrO2- perovskite/ 31 4.9 3.72 57.5 10.46 121
carbon
drop casting rigid glass/FTO/TiO2/ZrO2- perovskite/ 70 1.772 9.63 62.9 10.74 121
carbon
soft-cover rigid glass/FTO/TiO2/ perovskite/spiro 36.1 1.97 10.5 75.7 15.7 123
deposition
spray rigid glass/FTO/TiO2/ perovskite/PTAA glass/ITO/ 40 2.10 10.5 70.16 15.5 124
spin rigid glass / ITO / PTAA / PFN / perovskite / 9.06 16.86 3.27 73 14.1 129
PCBM / PFN / Ag
ETL or HTL ALD + screen flexible PET/ITO/ALD-TiO2/TiO2 scaffold/ 7.92 5.2 3.39 71 3.1 72
printing perovskite/spiro-OMeTAD/Au
evaporation OMETAD/Au
PC61BM / BCP / Ag
perovskite/spiro-OMeTAD/Au
and (3) enhance the PCE of the flexible device (Figure 10).114 However, the research
on manufacturing F-PSC using the slot-die method is at an early stage. This research
is still ongoing for achieving the exploitation of commercially viable F-PSCs. Since
slot-die coating of organic materials such as PEDOT:PSS and spiro-OMETAD is rela
tively favorable compared with inorganic ETL and perovskite materials, efforts have
been made to fabricate uniform ETLs or perovskite layers.20,114–116
Bu et al.20 developed a strategy to form high quality SnO2 ETLs using the slot-die
coating method. By modifying the SnO2 surface with KOH, the surface defects at
the interface between SnO2 and perovskite layer were significantly reduced owing
Figure 10. Photographic Images of the R2R-Coated Perovskite Layer and an Example of the
Manufactured Flexible Devices
Reprinted with permission from Galagan et al.114 Copyright 2018 John Wiley and Sons.
to the formation of KBr, which resulted in improving efficiency and reducing hyster
esis on F-PSCs. The efficiency of flexible perovskite module with a size of 5 3 6 cm2
was 15.22%.
PEDOT:PSS as HTL in the p-i-n structure was coated using a slot-die R2R process.
To improve film coverage and morphology of the perovskite layer, 3-aminopropanoic
acid was adopted as a self-assembled monolayer containing a carboxyl group.
This carboxyl group was found to act as nuclei for crystallization of perovskite, which
resulted in a much smoother perovskite surface morphology together with a PCE
enhancement.116
Also, TiO2 ETL and perovskite layers with high uniformity, crystallinity, and surface
coverage were obtained by using an ultrasonic spray-coating (USC) method.118 The
TiO2 ETL deposited by USC was cured by high-density pulsed beam of infrared light,
realizing F-PSCs with a PCE of 8.1% that are robust under mechanical
stress.
The F-PSC is capable of achieving high power-per-weight if the ultra-thin and light
plastic substrate is employed. Kaltenbrunner et al.7 used 1.4 mm PET film as sub
strate and achieved a power-per-weight of 23 W/g, which is a fairly outstanding
result because the power-per-weight of silicon solar cells is 1 W/g (Figure 12A). Po
tential future applications are power sources for UAV for environmental and indus trial
monitoring, rescue and emergency response, and tactical security applica tions.7 On
the other hand, Lucarelli et al.139 reported the F-PSC that exhibits a
PCE of 10.8% and 12.1% at low luminance of 200 lx and 400 lx, respectively. In
typical office and building environments, indoor lighting could supply enough en ergy
to drive low-power sensors equipped with F-PSC, implying another potential
application of F-PSC.
Once the F-PSC uses biocompatible textiles (Figure 12B),140 wire-shaped sub
strates,141 or cellulose papers38 instead of conventional plastic substrates, this cell
can be used as reliable power sources for wearable electronics. The PSC was simply
stacked onto a textile by using an elastomer with a good adhesive property. The PCE
of textile-based F-PSC was 15% with improved ambient stability and washable
capability owing to the encapsulation effect of the elastomer and demonstrating the
promising potential for the wearable device applications.140 Recently, Castro-Her
mosa et al.38 reported the F-PSC fabricated on a paper substrate that exhibits a
maximum PCE of 2.7% by adopting a top semitransparent electrode. Semitrans parent
F-PSC possesses a wide variety of potential applications such as solar glass for
buildings and solar curtains for upholstery, to wearable electronics and fashion (Figure
12C).112 The semitransparent F-PSC without TCO was realized by utilizing highly
conductive n-PEDOT:PSS as both the bottom and top transparent electrodes.
The n-PEDOT:PSS was stacked onto Spiro-OMeTAD by using a stamp-transfer pro
cess with PDMS. The resultant PCE was measured as 10.3% and maintained more
than 90% of the initial value after 1,000 cycles of bending test at a radius of curvature
of 5 mm.112
Perspectives
For the successful realization of flexible, foldable, and stretchable electronics for
future portable devices, it is essential to develop a power supplying system that in
tegrates all of them including the storage system together. Flexible solar cells are
expected to offer those functions. Among them, F-PSCs have the advantages of
both the high power of inorganic solar cells as well as the flexibility and light weight
of organic solar cells, making them ideal power-generating systems. In this paper,
we have summarized the fundamental challenges and recent efforts for the develop
ment of F-PSCs. As discussed, the reported PCEs of F-PSCs do not exceed those
of the conventional rigid PSCs, mainly due to the limitations in processing and
material selection. Nevertheless, the advantages over rigid PSCs are very clear, such as the
light weight and versatility of applications due to the customized and integrated
devices.
In this part, we emphasize the module technology for the future developments of F-
PSCs. Although several papers have been published on the fabrication of large
sized F-PSCs using printing technology, their direct application to actual operating
devices has not been achieved. For the practical application of F-PSCs as power
sup plying devices for soft and conformal electronics such as those employed for
the internet of things (IoT) devices and sensors, the module technology, which
involves assembling multiple subcells, should be developed for boosting the power
to levels that would meet the minimum input powers of related electronics and
power storage systems. For this purpose, many subcells are generally interconnected
in a mono lithic form or a grid-type structure; the former is generally thought to be
more proper for F-PSCs due to the overall coating process and compatibility of the
layer mate rials.51 Through series interconnection, the parasitic resistive loss
originating from the series and shunt resistances could be reduced when the solar cells are enlarged.
Recently, there have been only a few reports on the F-PSC module.20,51,132,143
Bu et al.20 introduced a facile interface passivation strategy with potassium
treatment for the SnO2 ETL and demonstrated the fabrication of an F-PSC module
with a PCE of 15.22% and large size (5 3 6 cm2 ) using the slot-die printing method.
The po tassium treatments induced hysteresis-free, stable, and high PCE by
facilitating the growth of perovskite grains. Li et al.132 demonstrated a sequential
deposition method for the formation of pinhole-free CH3NH3PbI3 perovskite thin
films for the fabrication of F-PSC modules (active area of 16 cm2 ) with PCE over 8%.
Three scribing processes, referred to as P1, P2, and P3 scribing steps, are essential
for the fabrication of the monolithic interconnected module.51 As depicted in Fig
ure 13, the P1, P2, and P3 processes represent the isolation of the TCO between
cells, selective removal of the ETL/perovskite layer/HTL for the connection from the
top contact of the unit cells to the bottom TCO, and isolation of the top metal
electrode between neighboring cells, respectively. The patterned area for P1, P2,
and P3 belong to the dead area where power cannot be produced in the solar-cell
module. Conventionally, nanosecond lasers or mechanical scribing tools are widely
used for the P1, P2, and P3 processes. Rakocevic et al.144 compared mechanical
and laser patterning technologies for the fabrication of glass-based PSC module.
They found that the mechanical scribing is a reliable and relatively cost-effective
patterning technique, whereas the laser ablation can provide greater variability with
respect to substrates and layer materials. Further study is necessary to compare
the scribing technologies for the plastic-based F-PSC. Recently, Dagar et al.132
reported an F-PSC module with a 12 cm2 active area patterned with a laser that
exhibits a PCE of 8.8%. This F-PSC module was designed using three scribing steps
(P1, P2, and P3 scribing steps) based on an efficient, fully laser scribing procedure.
For the F-PSCs, especially on ITO-polymers, patterned lines are not as thin, sharp,
and clean as those for the glass-based PSCs, implying that the high performance of
unit cells in F-PSCs might not be reproducible in modules with a large area. There
fore, the scribing adaptability, as well as the high performances and large area pro
cessability, should be considered together.
ACKNOWLEDGMENTS
This work was supported by the National Research Foundation of Korea (NRF)
grants funded by the Ministry of Science and ICT: NRF-2012M3A6A7054861, NRF
2014M3A6A7060583, NRF-2012M3A6A7054856, and NRF-2017R1A2B3010927
(Global Frontier R&D Program on Center for Multiscale Energy System);
NRF-2016M3D1A1027663 and NRF-2016M3D1A1027664 (Future Materials
Discovery Program); NRF-2018R1A2B2006708 (Research Program); and NRF
2015M1A2A2053004 and NRF-2015M1A2A2056827 (Climate Change Manage
ment Program).
AUTHOR CONTRIBUTIONS
H.S.J., M.J.K., and N.-G.P. perceived scientific challenges and recent efforts as the
flexible perovskite solar cell topics in this review article and wrote the manuscript.
G.S.H. revised the manuscript, collected permissions, and corrected typos.
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