Document:

MKR WINDY - User’s Guide 2021/01/06

 

MKR WINDY
User’s Guide

MDX-MKR-STWLU-R01 : MKR Windy uFL

All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change
by Midatronics S.r.l. without notice.

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Outline

1 Introduction 4

1.1 Introduction 4

1.2 Features 4

2 Parameters 5

2.1 Limit Parameters 5

2.2 Operating Parameters 5

3 Dimensions and Pin Definition 7

4 Soldering Guide 10

4.1 Reflow Soldering Temperature 10

4.2 Reflow Soldering Curve 11

5 STM32WL Boards 11

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Revisions

REVISION DATE DESCRIPTION STATUS AUTHOR REVISER

1.0 2020/08/18 First Release Draft info@midatronics.com AC

1.1 2021/01/06 Second Release Draft info@midatronics.com AC

Disclaimer

All rights strictly reserved. Reproduction in any form is not permitted without
written authorization from Midatronics S.r.l.

Midatronics S.r.l. info@midatronics.com

Via Zucchi 1 20900 www.midatronics.com
Monza (Monza Brianza)
Italy

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1 Introduction

1.1 Introduction

MDX-MKR-STWL-01 is a MKR development board based on the MDX-STWL-01 module design. It has USB, Debug
interface, 850～930MHz frequency, TTL level output, 3.3V IO port voltage.

1.2 Features

 The new LoRa spread spectrum modulation technology developed based on STM32WLE5J8I6 brings a longer
communication distance and stronger anti-interference ability;

 Support RSSI signal strength indicator function, used to evaluate signal quality, improve communication network, and
distance measurement;

 Support deep sleep, the power consumption of the whole machine is about 2uA in this mode;

 Support the global license-free ISM 868/915MHz frequency band;

 Support the data transmission rate of 2.4k～62.5kbps;

 Use 3.3V～3.6V power supply, power supply greater than 3.3V can guarantee the best performance;

 Industrial standard design, supporting long-term use at -40～+85℃;

 IPEX and PCB antenna interfaces are optional.

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2 Parameters

2.1 Limit Parameters

Table 2-1

Value
Parameters Notice
Min. Max.

Exceeding the maximum value may

Power supply voltage (V) 0 5.5
permanently damage the module

Blocking power (dBm) - 10 -

Working temperature (℃) -40 +85 Industrial grade

2.2 Operating Parameters

Table 2-2

Value
Parameters Notice
Min. Typical Max.

Working voltage (V) 4.5 5 5.5 ≥5V can guarantee output power

Using 5V TTL is risky to burn, please refer to

Communication level (V) - 3.3 -
the chip manual for details

Working temperature (℃) -40 - +85 Industrial Grade

Working frequency (MHz) 850 - 930 ISM Band

Tx Current（mA） - 120 - Instantaneous power consumption@22dBm

P
Rx Current（mA） - 12 - At 5V power supply

Maximum transmit power

21 21.5 22 See the chip user manual for details
(dBm)

-118 - -148 Sensitivity LoRa, see the chip user manual for
Receiving sensitivity (dBm)
details

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Air rate (bps) 0.018k - 62.5k Bitrate, LoRa, see chip user manual for details

Bitrate, FSK, see the chip user manual for

Air rate (bps) 0.6k - 300k
details

In a line of sight, setting max TX power at

Ideal range 5.5km 2.4kbps air rate, with 5dbi antenna at 2.5
meters

LoRa、(G)FSK、(G)MSK、
Modulation New generation LoRa modulation technology
BPSK

Dimensions 61.5*25mm -

RF interface IPEX Equivalent impedance is about 50Ω

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3 Dimensions and Pin Definition

Image 3-1

Table 3-1 Pin Definition

Pin
Pin No. Directions Functions
Name

1 PC6 I/O Single-chip GPIO, LED driver pin on the test board, low-level light LED;

2 PA4 I/O MCU GPIO, please refer to the chip user manual for details;

3 PA7 I/O MCU GPIO, please refer to the chip user manual for details;

4 PA5 I/O MCU GPIO, please refer to the chip user manual for details;

5 PA6 I/O MCU GPIO, please refer to the chip user manual for details;

Single-chip GPIO, the default pull-up on the test board can be used as
6 PB11 I/O
I2C (SDA);

Single-chip GPIO, the default pull-up on the test board can be used as
7 PB10 I/O
I2C (SCL);

8 PB7 I/O MCU GPIO, please refer to the chip user manual for details;

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9 PB6 I/O MCU GPIO, please refer to the chip user manual for details;

10 NRST I/O Module reset pin, built-in power-on reset circuit;

11 GND S Ground wire, connected to the power reference ground;

12 +3.3V S 3.3V power supply;

13 VIN S External power input pin of the bottom board;

14 +5V S 5.0V power supply;

Analog power supply is positive, voltage range: 1.71～3.6V DC

15 AVDD S
(recommend to add ceramic filter capacitor)

16 PA11 I/O MCU GPIO, please refer to the chip user manual for details;

17 PA12 I/O MCU GPIO, please refer to the chip user manual for details;

18 PB14 I/O MCU GPIO, please refer to the chip user manual for details;

19 PB2 I/O MCU GPIO, please refer to the chip user manual for details;

20 PB13 I/O MCU GPIO, please refer to the chip user manual for details;

21 PB1 I/O MCU GPIO, please refer to the chip user manual for details;

22 PB4 I/O MCU GPIO, please refer to the chip user manual for details;

23 PB3 I/O MCU GPIO, please refer to the chip user manual for details;

24 PB5 I/O MCU GPIO, please refer to the chip user manual for details;

25 PA0 I/O MCU GPIO, please refer to the chip user manual for details;

26 PA9 I/O MCU GPIO, please refer to the chip user manual for details;

27 PA1 I/O MCU GPIO, please refer to the chip user manual for details;

28 PA8 I/O MCU GPIO, please refer to the chip user manual for details;

29 S1 I Single-chip GPIO, connected to the module PH3 on the backplane;

30 S2 I Module reset button;

31 USB I/O USB communication and power interface;

Backup power supply AD acquisition selection pin, the module can

32 J3 S
collect the backup power supply voltage through PA10 after short circuit;

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33 VBAT S Backup power input pin;

34 Debug I/O Module debugging interface, the interface definition is shown in the figure below:

Note:

1.Pin 43 (UART2_RX) and 44 (UART2_TX) of the wireless module are connected to MKR's USB interface

Note: For chipset information, please refer to the official datasheet of STM32WLE5J8I6:

https://www.st.com/resource/en/datasheet/stm32wle5j8.pdf

Table 3-2 Debug interface table Diagram 3-2

Pin
Pin No. Directions Functions
Name

1 +3.3V S 3.3V power supply;

2 PA13 I/O MCU GPIO, debugging interface SWDIO;

3 GND S Ground wire, connected to the power reference ground;

4 PA14 I/O MCU GPIO, debugging interface SWCLK;

5 GND S Ground wire, connected to the power reference ground;

6 NC - -

7 NC - -

8 NC - -

9 NC - -

10 NRST I/O MCU GPIO, module reset pin;

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4 Soldering Guide

4.1 Reflow Soldering Temperature

Table 4-1

Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly

Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin） Min preheating temp. 100℃ 150℃

Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃

Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec

Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max

Liquidous Temperature (TL) Liquid phase temp. 183℃ 217℃

Time（tL）Maintained Above（TL） Time below liquid phase line 60-90 sec 30-90 sec

Peak temperature（Tp） Peak temp. 220-235℃ 230-250℃

Aveage ramp-down rate（Tp to

Aveage ramp-down rate 6℃/second max 6℃/second max
Tsmax）

Time to peak temperature

Time 25℃ to peak temperature for 6 minutes max 8 minutes max

25℃

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4.2 Reflow Soldering Curve

5 STM32WL Boards

Tx Ideal Module Size

Frequency
Models Chipset Power Range Interface
Hz Type mm
dBm km

61.5
MDX-MKR-STWL-01 STM32WLX5JX 868/915M 22 5.5 DIP TTL
*25

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