Effective June 2017

Technical Data 4350 Supersedes June 2011

FP1109
High frequency, high current power inductors
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing

Environmental data
SMD Device
• Storage temperature range (component):
-40 °C to +125 °C
Product features
• Operating temperature range: -40 °C to +125 °C
• 11.2 x 11.2 x 9.0mm maximum surface mount (ambient plus self-temperature rise)
package • Solder reflow temperature:
• Ferrite core material J-STD-020 (latest revision) compliant
• High current carrying capacity, low core losses

Pb HF
HALOGEN
• Controlled DCR tolerance for sensing circuits
• Inductance range from 205nH to 950nH FREE
• Current range from 11.5 to 69 amps
• Frequency range up to 2MHz
Technical Data 4350 
Effective June 2017

Product Specifications
Part Number7 OCL1 ± 20% (nH) FLL2 Min. (nH) Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP1109-R20-R 205 122 69 52 233
FP1109-R23-R 247 147 55 41 233
FP1109-R27-R 270 160 51 38 233
FP1109-R33-R 311 185 35 44 33 0.42 ±10% 233
FP1109-R47-R 463 275 27 20 233
FP1109-R58-R 548 325 22.5 17 233
FP1109-1R0-R 950 565 11.5 8.5 233
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 4 Isat1: Peak current for approximately 30% rolloff at +25°C.
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 5 Isat2: Peak current for approximately 30% rolloff at +125°C.
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss),
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
other heat generating components will affect the temperature rise. It is recommended the part 7 Part Number Definition: FP1109-xxx-R
temperature not exceed 125°C under worst case operating conditions verified in the end • FP1109 = Product code and size
application. • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros
• “-R” suffix = RoHS compliant

Dimensions- mm

F ront V iew T op V iew S ide V iew R ecom m ended P ad Layout S chem atic

2
F P 1 1 0 9 -xxx
w w llyy R

2.5 nom . 1
3.0
9.0 11.2 (2x)
11.4 (2X )
m ax m ax

2
4.10 ref
2.03 ref
(2X ) 1 3.0
11.2 m ax (2X )

Part Marking: FP1109 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level

Packaging information - mm

4.00
1.5 dia. +0.1/-0.0 2.00
1.5 dia. min 1.75

Section A-A
1
11.50
FP1109-xxx
wwllyy R

24.0 ±0.3
17.5 11.4

2
9.3 11.4 2.0
User direction of feed
16.4 20.00

Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.

2 www.eaton.com/electronics
FP1109 Technical Data 4350
High frequency, high current power inductor Effective June 2017

Temperature rise vs total loss

50

40
Tem perature R ise (°C )

30

20

10

0
0 0 .2 0 .4 0 .6 0 .8 1 1 .2 1 .4 1 .6
T o tal Lo ss (W )

Core loss vs Bp-p

1MHz
100
500kHz
300kHz
10
200kHz
100kHz
1
Core Loss (W)

0.1

0.01

0.001

0.0001

0.00001
100 1000 10000
Bp-p (Gauss)

Inductance characteristics

% o f O C L v s . % o f Is a t 1
120%

100%

80%
- 4 0 °C
% of OCL

60%

40%

+1 2 5 °C +2 5 °C
20%

0%
0% 20% 40% 60% 80% 100% 120%

% o f Is a t 1

www.eaton.com/electronics 3
Technical Data 4350 FP1109
Effective June 2017 High frequency, high current power inductor

Solder Reflow Profile

TP Table 1 - Standard SnPb Solder (Tc)

TC -5°C
Max. Ramp Up Rate = 3°C/s tP
Volume Volume
Max. Ramp Down Rate = 6°C/s
Package mm3 mm3
TL Thickness <350 _350
>
Preheat t <2.5mm 235°C 220°C
A _2.5mm
> 220°C 220°C
T smax
Temperature

Table 2 - Lead (Pb) Free Solder (T c)

Tsmin Volume Volume Volume
ts Package mm3 mm3 mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C

25°C
Time 25°C to Peak Time

Reference JDEC J-STD-020

Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (TL) 183°C 217°C
Time at liquidous (tL) 60-150 Seconds 60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics

© 2017 Eaton
All Rights Reserved Eaton is a registered trademark.
Printed in USA
Publication No. 4350 BU-SB11642 All other trademarks are property
June 2017 of their respective owners.