KXTGC 210 Lab

ORDER NO.
KM41404824CE
Telephone Equipment
Caller ID Compatible Model No. KX-TGC210LAB
KX-TGC212LAB
KX-TGC213LAB
KX-TGC220LAB
KX-TGC222LAB
KX-TGC223LAB
KX-TGCA20LAB
KX-TGCA20 KX-TGC210 Digital Cordless Phone
(Handset) (Base Unit)
Digital Cordless Answering System
B: Black Version
(for Latin America)
KX-TGC220 (Charger Unit)

(Base Unit)
Configuration for each model

Model No Base Unit Handset Charger Unit
KX-TGC210 1 (TGC210) 1 (TGCA20)
KX-TGC212 1 (TGC210) 2 (TGCA20) 1
KX-TGC213 1 (TGC210) 3 (TGCA20) 2
KX-TGC220 1 (TGC220) 1 (TGCA20)
KX-TGC222 1 (TGC220) 2 (TGCA20) 1
KX-TGC223 1 (TGC220) 3 (TGCA20) 2
KX-TGCA20 1 (TGCA20) 1
© Panasonic System Networks Co., Ltd. 2014

Unauthorized copying and distribution is a violation
of law.
KX-TGC210LAB/KX-TGC212LAB/KX-TGC213LAB/KX-TGC220LAB/KX-TGC222LAB/KX-TGC223LAB/KX-TGCA20LAB
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
2
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 5 11.1.1. Base Unit ---------------------------------------------- 41
1.1. For Service Technicians --------------------------------- 5 11.1.2. Handset ------------------------------------------------ 44
2 Warning -------------------------------------------------------------- 5 11.1.3. Charger Unit ------------------------------------------ 45
2.1. Battery Caution--------------------------------------------- 5 11.2. How to Replace the Handset LCD------------------- 46
2.2. About Lead Free Solder (PbF: Pb free)-------------- 5 12 Measurements and Adjustments -------------------------- 47
2.2.1. Suggested PbF Solder ------------------------------ 6 12.1. Equipment Required ------------------------------------ 47
2.3. Discarding of P. C. Board-------------------------------- 6 12.2. The Setting Method of JIG----------------------------- 47
3 Specifications ----------------------------------------------------- 7 12.2.1. Connections (Base Unit) -------------------------- 47
4 Technical Descriptions ----------------------------------------- 8 12.2.2. Connections (Handset) ---------------------------- 48
4.1. US-DECT Description ------------------------------------ 8 12.2.3. How to install Batch file into P.C. ---------------- 49
4.1.1. TDD Frame Format ---------------------------------- 8 12.2.4. Commands-------------------------------------------- 49
4.1.2. TDMA system------------------------------------------ 8 12.3. Adjustment Standard (Base Unit) -------------------- 50
4.1.3. Signal Flowchart in the Radio Parts-------------- 9 12.3.1. Bottom View ------------------------------------------ 50
4.2. Block Diagram (Base Unit_Main)---------------------10 12.4. Adjustment Standard (Handset) ---------------------- 51
4.3. Block Diagram (Base Unit_RF Part) ----------------- 11 12.4.1. Component View ------------------------------------ 51
4.4. Circuit Operation (Base Unit) --------------------------12 12.5. Things to Do after Replacing IC or X'tal ------------ 52
4.4.1. BBIC (Base Band IC: IC501) ---------------------12 12.5.1. How to download the data ------------------------ 52
4.4.2. Flash Memory (IC601)(for KX-TGC220 12.6. Frequency Table------------------------------------------ 54
only) -----------------------------------------------------12 13 Miscellaneous---------------------------------------------------- 55
4.4.3. EEPROM (IC611) ------------------------------------12 13.1. How to Replace the Flat Package IC --------------- 55
4.4.4. Power Supply Circuit/Reset Circuit--------------13 13.1.1. Preparation-------------------------------------------- 55
4.4.5. Telephone Line Interface---------------------------15 13.1.2. How to Remove the IC ----------------------------- 55
4.4.6. Parallel Connection Detect Circuit/Auto 13.1.3. How to Install the IC -------------------------------- 56
Disconnect Circuit -----------------------------------15 13.1.4. How to Remove a Solder Bridge ---------------- 56
4.4.7. Calling Line Identification (Caller ID)/Call 13.2. Terminal Guide of the ICs, Transistors and
Waiting Caller ID -------------------------------------17 Diodes ------------------------------------------------------ 57
4.5. Block Diagram (Handset)-------------------------------19 13.2.1. Base Unit ---------------------------------------------- 57
4.6. Circuit Operation (Handset)----------------------------20 13.2.2. Handset ------------------------------------------------ 57
4.6.1. Outline --------------------------------------------------20 14 Schematic Diagram -------------------------------------------- 59
4.6.2. Power Supply Circuit/Reset Circuit--------------20 14.1. For Schematic Diagram -------------------------------- 59
4.6.3. Charge Circuit ----------------------------------------20 14.1.1. Base Unit (Base Unit (Main)) --------------------- 59
4.6.4. Battery Low/Power Down Detector--------------20 14.1.2. Handset (Handset (Main)) ------------------------ 59
4.6.5. Speakerphone ----------------------------------------20 14.2. Base Unit (Main) ----------------------------------------- 60
4.7. Signal Route -----------------------------------------------21 14.2.1. KX-TGC210------------------------------------------- 60
5 Location of Controls and Components ------------------23 14.2.2. KX-TGC220------------------------------------------- 62
6 Installation Instructions ---------------------------------------23 14.3. Base Unit (Operation)----------------------------------- 64
7 Operating Instructions-----------------------------------------23 14.4. Handset (Main) ------------------------------------------- 66
8 Test Mode ----------------------------------------------------------24 15 Printed Circuit Board ------------------------------------------ 69
8.1. Engineering Mode ----------------------------------------24 15.1. Base Unit (Main) ----------------------------------------- 69
8.1.1. Base Unit ----------------------------------------------24 15.1.1. Component View ------------------------------------ 69
8.1.2. Handset ------------------------------------------------26 15.1.2. Bottom View ------------------------------------------ 70
9 Service Mode -----------------------------------------------------28 15.2. Base Unit (Operation) (KX-TGC220 only) --------- 71
9.1. How to Clear User Setting (Handset Only)---------28 15.3. Handset----------------------------------------------------- 73
10 Troubleshooting Guide ----------------------------------------29 15.3.1. Component View ------------------------------------ 73
10.1. Troubleshooting Flowchart -----------------------------29 15.3.2. Bottom View ------------------------------------------ 74
10.1.1. Check Power------------------------------------------30 16 Exploded View and Replacement Parts List ----------- 75
10.1.2. Check Record ----------------------------------------31 16.1. Cabinet and Electrical Parts (Base Unit) ----------- 75
10.1.3. Check Playback -------------------------------------32 16.1.1. KX-TGC210------------------------------------------- 75
10.1.4. Check Battery Charge ------------------------------32 16.1.2. KX-TGC220------------------------------------------- 76
10.1.5. Check Link---------------------------------------------33 16.2. Cabinet and Electrical Parts (Handset)------------- 77
10.1.6. Check the RF part -----------------------------------35 16.3. Cabinet and Electrical Parts (Charger Unit) ------- 78
10.1.7. Registering a Handset to the Base Unit--------39 16.4. Accessories and Packing Materials ----------------- 79
10.1.8. Deregistering a Handset ---------------------------39 16.4.1. KX-TGC210LA --------------------------------------- 79
10.1.9. Check Handset Transmission --------------------40 16.4.2. KX-TGC212LA --------------------------------------- 80
10.1.10. Check Handset Reception-------------------------40 16.4.3. KX-TGC213LA --------------------------------------- 81
10.1.11. Check Caller ID --------------------------------------40 16.4.4. KX-TGC220LA --------------------------------------- 82
11 Disassembly and Assembly Instructions ---------------41 16.4.5. KX-TGC222LA --------------------------------------- 83
11.1. Disassembly Instructions -------------------------------41 16.4.6. KX-TGC223LA --------------------------------------- 84
3
16.5. Replacement Parts List --------------------------------- 85

16.5.1. Base Unit ---------------------------------------------- 85
16.5.2. Handset ------------------------------------------------ 87
16.5.3. Charger Unit ------------------------------------------ 88
16.5.4. Accessories and Packing Materials------------- 88
16.5.5. Screws ------------------------------------------------- 89
16.5.6. Fixtures and Tools----------------------------------- 89
4
1 Safety Precautions
1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 F ± 20 F (370 C ± 10 C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component Component
pin
Remove all of the
excess solder
Solder
(Slice View)
5
2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g
2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
6
3 Specifications
Standard: Bit rate:
DECT 6.0 (Digital Enhanced Cordless 1,152 kbit/s
Telecommunications 6.0) Modulation:
Number of channels: GFSK (Gaussian Frequency Shift Keying)
120 Duplex Channels
Frequency range: RF transmission power:
1.91 GHz to 1.93 GHz 115 mW (max.)
Duplex procedure: Voice coding:
TDMA (Time Division Multiple Access) ADPCM 32 kbit/s
Channel spacing:
1,728 kHz
Base Unit Handset Charger
Power source AC Adaptor Rechargeable Ni-MH battery AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz) AAA (R03) size (1.2 V 400 mAh) (PNLV233-AZ, 120 V AC, 60 Hz)
Receiving Method Super Heterodyne Super Heterodyne
Oscillation Method PLL synthesizer PLL synthesizer
Detecting Method Quadrature Discriminator Quadrature Discriminator
Tolerance of OSC Frequency 13.824 MHz ±100 Hz 10.368 MHz ±100 Hz
Modulation Method Frequency Modulation Frequency Modulation
ID Code 40 bit 40 bit
Ringer Equivalence No. (REN) 0.1B
Dialing Mode Tone (DTMF)/Pulse
Redial Up to 48 digits
Speed Dialer Up to 32 digits (Phonebook)
Power Consumption Standby: Approx. 0.6 W (*1) 6 days at Standby, Standby: Approx. 0.1 W,
Maximum: Approx. 3.2 W (*1) 10 hours at Talk Maximum: Approx. 1.8 W
Standby: Approx. 0.7 W (*2)
Maximum: Approx. 3.5 W (*2)
Operating Conditions 0 °C - 40 °C (32 °F – 104 °F) 0 °C - 40 °C (32 °F – 104 °F) 0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity 20 % – 80 % relative air humidity 20 % – 80 % relative air humidity
(dry) (dry) (dry)
Dimensions (W x D x H) Approx. 107 mm x 96 mm x 77 mm Approx. 47 mm x 30 mm x 164 mm Approx. 72 mm x 72 mm x 40 mm
Mass (Weight) Approx. 100 g (*1) Approx. 130 g Approx. 100 g

Approx. 120 g (*2)
Note:
(*1) KX-TGC210/212/213
(*2) KX-TGC220/222/223
Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
7
4 Technical Descriptions
4.1. US-DECT Description
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.54).
4.1.1. TDD Frame Format

5 ms 5 ms
Up Link ( Handset -> Base Unit ) Down Link ( Base Unit -> Handset )
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
DATA rate : 1.152 Mbps

417 µs (available) 417 µs (blind)
4.1.2. TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 s, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer Dummy bearer
Base unit RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
Handset 1
(Stand by)
Handset 2 TX RX
(Link)
Handset 3 TX RX
(Link)
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
8
4.1.3. Signal Flowchart in the Radio Parts

Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.

BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.

BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
9
4.2.
Operational P.C. Board
Q141
RLY
KEYS Q161 R151,R152 R131, R133 D101

L1T
SIDE TONE INUSE INUSE
CIRCUIT DETECT 2 DETECT 1 L1R
ANT 1 TEL JACK

X501
13.824 MHz
Q171
SP
RECEIVE DCP
AMP
DCM
Q111
3
LOUT BELL DC JACK
LIN DETECT
HOOK
SPOUTP
SPOUTN
RF_PART
ANS_LED
DCIN 2
KEY 1
MSG_LED
KEY C, D, E
DCIN 1
BELL
HSMIP
RXp HSMIN
RXn IC302
IC501 VBAT 3.0 V
Block Diagram (Base Unit_Main)
VCCPA
TXp REGULATOR
10
BBIC VBAT_APU
TXn VCC_IF
VCC_FE
VCC_VCO
RSTN RESET
DOUBOUT 3.0V
VCCA
SCL, SDA
WP
STM/CKM
DL,CS
CLK,DO
IC601 IC611 R371

VCC R372
FLASH EEPROM
VBAT MEMORY MEMORY
CHARGE_CONTACT
VDD +
KX-TGC210/212/213/220/222/223 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

ANT1
RXp
RXn
KX-TGC210/212/213/220/222/223 BLOCK DIAGRAM (Base Unit_RF Part)
11
4.4. Circuit Operation (Base Unit)

General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
TDD & TDMA ADPCM

Digital
with FHSS
Speech Analog TEL
Processor ADPCM Processor Front Line
RF part End Interface
&
Host CPU
Caller ID
Modem Multi-
plexer
BBIC (IC501)
Digital TAM System *1
EEPROM IC611 Keys/ LEDs/ Charge *1 Flash Memory IC601 *1
*1 for KX-TGC220 only
4.4.1. BBIC (Base Band IC: IC501)

• Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.4.2. Flash Memory (IC601)(for KX-TGC220 only)

Following information data is stored.
• Voice signal
ex: Pre-recorded Greeting message, Incoming message
4.4.3. EEPROM (IC611)

Following information data is stored.
• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
12
4.4.4. Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
VBAT +3.0V
IC302 VBAT IC501 IC601

5.5V pin 15
pin 10
3.0V FLASH
AC Adaptor RSTN(Reset) DOUBLER OUT
REGULATOR For peripherals
pin 54 BBIC
STM/CKM
IC611
VDDC (1.2V)
pin 57
pin 9 EEPROM
RF Part
Receive
Amp.
ANS LED
MSG LED
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC501_54 pin)
Startmonitor
(IC501 57pin)
(CKM/STM)
BBIC chip initialize
13
4.4.4.1. Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.
R371
+5.5V
R372
F301 DCP
D362
DCM
CHARGE+
D361
C351
( )
CHARGE-
14
4.4.5. Telephone Line Interface

Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T  R111  C111  Q111  BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T  D101  Q141  Q161  R163  D101  P101  R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
+3.0V
R160 *Q141
820
R176
R168
4.7k
*R162
47k
NC
27k
1k
Q161
C161
R141
10u
C
B
10M
C164
R165
E
1000p
C167
100k
C176 1u
C142 K0.01u
R175
3.9k
25V
C163 NC
R142
2.7k
R131
*D143
R172 C173 R177 R164 R161

*D142
680k
NC
0.1u 1k 2.7k 100k

C175 C101 680p
0.022u
C171
560p R151
100k Q142 D101
L1T
0.033u
C
Q171
C178
B
K0.01u
1 2
0.01u
130k
330k
300V
E
39
NC
2.2k
220
*SA102
4 3
C168
R163
R133
R152
C152
*SA101
C132
R145
R171
C102 680p *P101 L1R
NC
NC
*C115
C184
SA103
2
1
*R115
NC
1u
C186
C181
1
NC
10p
2
NC
Pin 28 of IC501
R121 390k C121 680p
R122 390k C122 680p
VDDC
Hook
NC
NC
Pin 6 of IC501
R111
R112
100k
100k
K
K
D153 NC
+3.0V
Pin 16 of IC501
C124
C123
C120
D133
A
1000p
0.047u
0.047u
R114
47k
4
BELL
RA151
Pin 5 of IC501
C111
C112
1k
Q111
1
2
Pin 25 of IC501
Pin 24 of IC501
10k
Pin 18 of IC501
Pin 17 of IC501
K0.68u
D113
C113
R113
A
4.4.6. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
15
detecting the voltage changes.

If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
Q141
Q161
R141
R142
R131
Pin 18 of IC501 C101
DCIN2
D101
RA151 R151 3 2
R163
C132
Q142
R152 4 1
C152
SA101
L1T
R133
R145
L1R
C102 TEL JACK
Pin 17 of IC501
DCIN1
P101
HOOK RA151
Pin 6 of IC501
16
4.4.7. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
Single message format

1st Ring 2nd Ring
2 sec Silent interval 4 sec 2 sec
0.5 s 575 ms min 0.5 s
DATA
STD Ring / 20 Hz
Tip-Ring 0.1 Vrms
70 Vrms
A DATA in
1200 Hz 2200 Hz
=DATA "1" =DATA "0 "
B DATA out
1 bit=833 µs
month day hour minute number

04 15 16 35 2013487000
Plural message format

1st Ring 718 ms
0.5 s 2nd Ring
2 sec
DATA
DATA CODE NAME month day hour minute number

201 John Smith 04 16 16 35 2013487000
17
Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line  P101  C121, C122  R121, R122  IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
R121 C121
BBIC L1T Telephone "FSK"

25 SA101 Line
IC501 C120 R122 C122 L1R data
24
P101
18
4.5.
35
SPEAKER RXn ANT1
37 Speech Burst 1
Decoding Decoding
21 D/A RXp
RECEIVER Speech Burst 2
Encoding ANT1
22 Encoding
17 A/D
MIC ADPCM TXp
18 Codec RF 87
Analog PLL
Front Filter
MOD/DEMOD TXn
End DSP 86
BMC
CHARGE(+) CHARGE_DET 34
CHARGE
CHARGE CIRCUIT
CONTACTS Q2, Q3, Q4, CHARGE_CTRL 33
Q9, R8
GND 7 XTAL
CP 2.8V SCL 66 X1
EEPROM
10.368
IC7
IC3 SDA 67
Block Diagram (Handset)
8 MHz
BATTERY
VBAT 32
BATTERY ON SWITCH
TERMINAL CPU 46
BATT- R45
CP3V 1.8 V
19
1.8 V 24
1.8 V LDO_CTRL 57, 58, 59, 60 ROWS
Q1
CD 65
RESET 76 KEYPAD
CP3V 11, 12, 13, 14, 55 COLUMNS
CS 73
LCD
SID 63 1.8 V
SCL 64 47, 48, 51, 53 QSPI-IO 0-3
Charge QSPI QSPI
CP4V LCD_LED0 77 BBIC 5 QSPI-SCK
Pump Control 4 QSPI-CS FLASH MEMORY
IC1
LCD_LED1 IC4
LCD-BACK LIGHT
61 Reset 44 45
KEY LED
NR LED
Reset
Pin 71
CP4V
CP3V
KX-TGCA20 BLOCK DIAGRAM (Handset)
4.6. Circuit Operation (Handset)

4.6.1. Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.19).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
- Integrated 1.9 GHz PA for DECT
• QSPI FLASH MEMORY: IC4
- Main Program D/L Area
• EEPROM: IC7
- Temporary operating parameters (for RF, etc.)
4.6.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+)  Q1 (1.8 V), IC1-44pin (CP3V)
The Reset signal generates IC1 (71 pin) and 1.8 V.
ANT TXON
DA801
RXON
RF_RXn
RF_RXp
4.6.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
Q2
DC+(5.5 V)  R371  R372  D362  CHARGE+(Base)  CHARGE+(Handset)   Q3  BATTERY+... Battery...
R8
BATTERY-  R45  GND  CHARGE-(Handset) CHARGE-(Base)  GND  DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.20).
4.6.4. Battery Low/Power Down Detector

Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and " " starts flashing.
• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.6.5. Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
20
4.7. Signal Route

SIGNAL ROUTE IN 䊻㻌 ROUTE 䊻㻌 OUT
HANDSET TX MIC (+) - C13 - IC1 (17) IC1(86) C859 - ANT to BASE
MIC (–) - C11 - IC1 (18) IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141
- D101 - P101 - T/R(TEL LINE)
HANDSET RX T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177 - C173 - Q171 - C178
- IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
from BASE UNIT ANT 1 IC1 (1) IC1 (21) - RECEIVER (+)
IC1 (2) IC1 (22) - RECEIVER (–)
HANDSET MIC (+) - C13 - IC1 (17) IC1(86) C859 - ANT to BASE
SP-Phone TX MIC (–) - C11 - IC1 (18) IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141
- D101 - P101 -T/R(TEL LINE)
HANDSET T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 -R178
SP-Phone RX - IC501(16-44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
from BASE UNIT ANT –– IC1 (1) ––– IC1 (35) - SP (–)
– IC1 (2) – – IC1 (37) - SP (+)
GREETING MIC (+) - C13 - IC1 (17) IC1(86) C859 - ANT to BASE
RECORDING MIC (–) - C11 - IC1 (18) IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47- 73/74) - IC601
GREETING PLAY IC601 - IC501(73/74 - 28) - C184 - Q161 - Q141 - D101 - P101
TO TEL LINE
- T/R(TEL LINE)
ICM RECORDING T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 - R178
- IC501(16 - 73/74) - IC601
ICM PLAY TO IC601 - IC501(73/74 - 29/31) - SPEAKER

SPEAKER
DTMF SIGNAL IC501(28) - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)
TO TEL LINE
CALLER ID T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)
BELL DETECTION T/R(TEL LINE) - P101 - R111/R112 - C111/C112 - Q111 - IC501(5)
Note:
: inside of Handset
21
RF part signal route

SIGNAL ROUTE IN 䊻㻌 ROUTE 䊻㻌 OUT
HANDSET RF IC1(86/87) - C859 - ANT

[ TX_ROUTE ]
HANDSET RF ANT - IC(1/2)

[ RX_ROUTE ]
BASE UNIT RF IC501(44/45) - C819 - C872 - ANT

[ TX_ROUTE ]
BASE UNIT RF ANT - C872 - C895 - IC501(46/47)

[ RX_ROUTE ]
Note:
: inside of Handset
22
5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:
23
8 Test Mode
8.1. Engineering Mode
8.1.1. Base Unit
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{ OFF } (Off)
Navigator key/
(Volume) key/
(Phonebook)/
CID (Caller ID) key/
REDIAL (Redial) key/
{ } { TALK:Talk }
Dial keypad
This pictured model is KX-TGC220
{ FLASH}
{ CALL WAIT} (Call wait)
H/S key operation H/S LCD

1). Press { }
2). Select "Initial Setup" using {^} or {V}

then press { OK } .
3). Select "Line Setup" using {^} or {V}

then press { OK } or { > } .
4). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Service Mode
5). Select "Write EEP" using {^} or {V} Read EEP
then press { OK } or { > } . Write EEP
Get S/W Ver.
OK
Set Addr.:
Default Data
6). Enter " ", " ", " ", " " (Address). (*1)
C OK
7). Enter " ", " " (New Data). (*1) Set Addr.:
New Data
8). Press { OK } , a long confirmation beep C OK

will be heard. Set Addr.:
____ __
9). Press (off) to return to standby mode.

After that, turn the base unit power off and then power on.
24
Frequently Used Items (Base Unit)

ex.)
Items Address Default Data New Data Remarks

C-ID (FSK) sensitivity 06 DD/06 DC 00/28 00/1C 00/14 When hex changes from “00/28” to “00/1C” or
(3 dB up) (6 dB up) “00/14”, gain increases by 3 dB or 6 dB.
C-ID (DTMF) sensitivity 06 F8/06F7 00/01 0B/4C 0F/F6 When hex changes from “00/01” to “0B/4C” or
(3 dB up) (6 dB up) “0F/F6”, gain increases by 3 dB or 6 dB.
Frequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to
ID 00 02 ~ 00 06 Given value - - confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Bell length 03 D4 3C (6 sec) (*3) 1E (3 sec) 14 (2 sec) This is time until bell stops ringing.
(Unit: 100 msec)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
(*3)
Bell length 3C (hex) = 60 (dec)  60  100 msec = 6000 msec (6 sec)
25
8.1.2. Handset
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{ OFF } (Off)
Navigator key/
(Volume) key/
(Phonebook)/
CID (Caller ID) key/
REDIAL (Redial) key/
{ } { TALK:Talk }
Dial keypad
{ FLASH}
{ CALL WAIT} (Call wait)
H/S key operation H/S LCD

1). Press { }
2). Select "Initial Setup" u sing {^} or {V}

then press { OK } .
3). Select "Line Setup" using {^} or {V}

then press { OK } or { > } .
4). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Service Mode
5). Select "Write EEP" using {^} or {V} Read EEP
then press { OK } or { > } . Write EEP
Get S/W Ver.
OK
Set Addr.:
Default Data
6). Enter " ", " ", " ", " " (Address). (*1)
C OK
7). Enter " ", " " (New Data). (*1) Set Addr.:
New Data
8). Press { OK } , a long confirmation beep C OK

will be heard. Set Addr.:
____ __
9). Press (off) to return to standby mode.

After that, turn the base unit power off and then power on.
26
Frequently Used Items (Handset)

ex.)
Items Address Default Data New Data Possible Adjusted Possible Adjusted Remarks
Value MAX (hex) Value MIN (hex)
Battery Low 00 09 70 - - -
Frequency 00 07 / 00 08 70/02 - - - (*2)
ID 00 02 ~ 00 06 Given value - - -
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
27
9 Service Mode
9.1. How to Clear User Setting (Handset Only)
Handset
Press 2 , 5 , 8 , 0 simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
28
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
FLOW CHART
Not working
Power ON Base Unit Check Power
OK
Not playback
Playback Pre-Message Check Playback
OK
Not record
Record Check Record
OK
Link
No link
No charge
Battery Charge Check Battery Charge
OK
OK
Check Link
NG
Range Check the RF part
OK
No voice
Handset Voice Transmission Check Handset Transmission
OK
No voice
Handset Voice Reception Check Handset Reception
OK
Caller ID Error
Caller ID Reception Check Caller ID
OK
Not working
TAM Operation *1 Check TAM Operation *1
*1 KX-TGC220 only
Cross Reference:
Check Power (P.30)
Check Playback (P.32)
Check Record (P.31)
Check Battery Charge (P.32)
Check Link (P.33)
Check the RF part (P.35)
Check Handset Transmission (P.40)
Check Handset Reception (P.40)
Check Caller ID (P.40)
29
10.1.1. Check Power

10.1.1.1. Base Unit
Is the AC Adaptor inserted into AC outlet? (*1)
NO
Is output voltage of AC adaptor 5.5 V? Check AC Adaptor.
YES
NO
Check VDDC (1.2 V): Test Point [VDDC] Check Power Supply Circuit.
OK
NO
RSTN: Reset = "High"? Check Reset Circuit.
YES
NO
Check Xtal CLK = 13.824 MHz? Check X501.
YES
Check BBIC.
Cross Reference: Note:

Power Supply Circuit/Reset Circuit (P.13) BBIC is IC501.
(*1) Refer to Specifications (P.7) for part number and
supply voltage of AC adaptor.
(*2) Refer to Base Unit (Main) (P.69).
10.1.1.2. Handset
Is the battery inserted BATT+ and BATT-?
YES
NO
Is the voltage of BATT+ 2.3 V more? Check F1 is not open.
YES
YES
Check the battery and around BATT+ and
BATT- are not shorted.
NO
Is the voltage of +1.8V about 1.8 V? Check Power Supply Circuit/Reset Circuit .
YES
NO
Is the voltage of CP3V about 3.0 V?
YES
Is the voltage of CP4V about 4.0V ? NO
(When LED is On) Check BBIC (IC1).
YES
NO
Does BBIC (IC1: 7) oscillate at 10.368 MHz? Check X1.
YES
Check BBIC (IC1).
Cross Reference:
Power Supply Circuit/Reset Circuit (P.13)
30
10.1.2. Check Record

10.1.2.1. Base Unit
A) Not record Incoming Message
NO
Check Bell signal. Check Telephone Line Interface
[Bell].
OK
NO
Does the unit catch line? Check Telephone Line Interface
[OFF HOOK].
YES
NO
Check Line In: Pin 16 of BBIC. Check ICM Recording in Signal Route.
OK
Check Auto Disconnect Circuit.

OK
Check Parallel Connection Detection

Circuit.
OK
Check BBIC and Flash Memory.

Signal Route (P.21) Flash Memory is IC601.
Telephone Line Interface (P.15) BBIC is IC501.
Parallel Connection Detect Circuit/Auto Disconnect
Circuit (P.15)
31
10.1.3. Check Playback

10.1.3.1. Base Unit
NO
Check VDDC (1.2 V): Test Point [VDDC] Check Power Supply Circuit.
OK
NO
Check output of BBIC (Pin 29, 31). Check BBIC and Flash Memory.
OK
Check Speaker and its surroundings.

Power Supply Circuit/Reset Circuit (P.13) Flash Memory is IC601.
BBIC is IC1.
(*1) Refer to Base Unit (Main) (P.69).
10.1.4. Check Battery Charge

10.1.4.1. Base Unit
Plug in the AC Power source.
Charge Handset on Base Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Base Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at
Base Unit from mechanical point of view.
Cross Reference:
Charge Circuit (P.14)
10.1.4.2. Handset
NO
Is Check Power OK? Check Power of Handset.
YES
NO
Is BBIC (IC1: 34) high at charge state? Check Charge Circuit.
Cross Reference:
Check Power (P.30)
10.1.4.3. Charger Unit

Plug in the AC Power source.
Charge Handset on Charger Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Charger Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at Charger Unit
from mechanical point of view.
Cross Reference:
32
10.1.5. Check Link

10.1.5.1. Base Unit
Does Base Unit make link with normal working YES
Base Unit is OK. Check Handset.
Handset?
NO
NO
Is the voltage of VBAT about 3.0 V? Check around Power Supply Circuit.
YES
Is the voltage of VDDC about 1.2 V? NO
YES
NO
Is the voltage of +3.0V about 3.0 V? Adjust +3.0V voltage to 3.0 V. *1
YES OK
Does the RF clock (CLK) oscillate at 13.824 MHz in NO Check around X501 and RF module and adjust
Base Unit Test Mode? clock frequency.*2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.52) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.
33
10.1.5.2. Handset
Does Handset make link with Base Unit? YES

Handset is OK. Check Base Unit.
(Correct working unit)
NO
NO
Is the voltage of "1.8V" about 1.8 V? Adjust 1.8V voltage to 1.8 V.
YES OK NO
Check around Power Supply Circuit/Reset Circuit .
NO
Is the voltage of CP3V about 3.0 V?
YES
NO
Is the voltage of CP4V about 4.0V? Check BBIC (IC1)
(When LED is ON)
YES
NO
Is the voltage of CP2.8V about 2.8 V? Check D3
YES
NO
Does the RF clock (CLK) oscillate: 10.368 MHz Check around X1 and adjust clock frequency.
in Handset Test Mode?
YES
Check the RF part.
Cross Reference:
Note:
(*1) Refer to Troubleshooting by Handset (P.32)
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-55pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.53) for Handset.
34
10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part
1. Prepare Regular HS(*1) and Regular BU(*2).
2. a. Re-register regular HS (Normal mode) to base unit (to be checked).
If this operation fails in some ways, the base unit is defective.
b. Re-register handset (to be checked) to regular BU (Normal mode).
If this operation fails in some ways, the handset is defective.
After All the Checkings or Repairing

1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
START
No Registration of Registration of No
Base unit is defective Regular HS to handset to Handset is defective
base unit Regular BU
Yes Yes
(other checkings)
Registration of Regular HS to Regular BU
Registration of handset to base unit

(checked ones)
Note:
(*1) HS: Handset
(*2) BU: Base Unit
35
10.1.6.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.37).
Please refer to the each item.
Start
1 2
Link NG Control NG Check BBIC interface parts.
confirmation signal
Normal confirmation (RF Block <->BBIC on BU/HS P.C.B)
OK OK
3
X'tal
NG
Frequency Adjust X'tal Frequency. (*1)
confirmation
OK
4
NG
TX confirmation Check TX Block.
OK
5
NG
RX confirmation Check RX Block.
OK
6
Range NG
confirmation TEST RANGE Check.
Normal
OK
GOOD
Note:
(*1) Refer to Check Link (P.33).
36
10.1.6.3. Check Table for RF part
No. Item BU (Base Unit) Check HS (Handset) Check

1 Link Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link.
2 X'tal Frequency confirmation Check X'tal Frequency. Check X'tal Frequency.
(13.824000 MHz ±100 Hz) (10.368000 MHz ±100 Hz)
HS, BU Mode: [Adjustment]
3 TX confirmation 1. Place Regular HS 15 cm away from a 1. Place Regular BU 15 cm away from a
checked BU. checked HS.
Regular HS (BU) Mode: 2. Confirm "TXDATA" waveform of BU (*1) 2. Confirm "TXDATA" waveform of HS (*2)
[Test RX Mode] and “RXDATA“ waveform of Regular HS by and "RXDATA" waveform of Regular BU by
Digital Oscilloscope. Digital Oscilloscope.
BU (HS) Mode:
[Test TX_Burst Mode]
4 RX confirmation 1. Place Regular HS 15 cm away from a 1. Place Regular BU 15 cm away from a
checked BU. checked HS.
Regular HS (BU) Mode: 2. Confirm "RXDATA" waveform of BU (*1) 2. Confirm "RXDATA" waveform of HS (*2)
[Test TX_Burst Mode] and “TXDATA“ waveform of Regular HS by and "TXDATA" waveform of Regular BU by
Digital Oscilloscope. Digital Oscilloscope.
BU (HS) Mode:
[Test RX Mode]
5 Range Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode: [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link. 3. Compare the range of the HS (being
3. Compare the range of the BU (being checked) with that of the Regular HS.
checked) with that of the Regular BU.
Note:
(*1) Adjustment Standard (Base Unit) (P.50)
(*2) Adjustment Standard (Handset) (P.51)
37
10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item BU (Base Unit) Check HS (Handset) Check

Range Confirmation TX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(TX Power check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the HS and the Regular BU
HS, BU setting according to CHART1. according to CHART1.
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK. Link OK = TX Power of the HS is OK.
No Link = TX Power of the BU is NG. No Link = TX Power of the HS is NG.
Range Confirmation RX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(RX sensitivity check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the Checking HS and the Reg-
HS, BU setting according to CHART1. ular BU according to CHART1.
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK. Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the BU is NG. No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (to be checked) Regular_HS

TX Power TX Power
BU (Base Unit) TX Power Check Low High
BU (Base Unit) RX Sensitivity Check High Low
HS (to be checked) Regular_BU

TX Power TX Power
HS (Handset) TX Power Check Low High
HS (Handset) RX Sensitivity Check High Low
Note:
(*1) Refer to Commands (P.49).
38
10.1.7. Registering a Handset to the Base Unit

1 Handset:
{MENU} # 1 3 0
2 Base unit:
Press and hold {LOCATOR} for about 5 seconds.
L If all registered handsets start ringing, press {LOCATOR} again to stop, then
repeat this step. (KX-TGC212/KX-TGC213/KX-TGC222/KX-TGC223)
L The next step must be completed within 90 seconds.
3 Handset:
Press {OK}, then wait until a long beep sounds.
10.1.8. Deregistering a Handset

1 {MENU} # 1 3 1
L All handsets registered to the base unit are displayed.
^
2 { V } : Select the handset you want to cancel. i {SELEC.}
3 {^V } : “ Sí ” i {SELEC.} i {OFF}
39
10.1.9. Check Handset Transmission
Check MIC of handset.
Check handset Tx in Signal Route.
Cross Reference:
Signal Route (P.21)
10.1.10. Check Handset Reception
Check speaker of handset.
Check handset Rx in Signal Route.
Cross Reference:
Signal Route (P.21)
Note:
When checking the RF part, Refer to Check the RF part
(P.35).
10.1.11. Check Caller ID

BASE UNIT
Did bell ring? NO Check bell signal detection in
(Message indicator Telephone Line Interface.
blinks)
YES
Check Calling Line Identification (Caller ID)/

Call Waiting Caller ID.
Cross Reference:
Telephone Line Interface (P.15)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.17)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really
a subscriber of the service.
40
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1. Base Unit
11.1.1.1. KX-TGC210
ձ Remove the 2 screws to remove
the cabinet cover.
ձ 4 Screws
ղ Remove the solders.
ղ Solders
ճ Remove the main P.C. board.
ճ Main P.C. board
41
11.1.1.2. KX-TGC220
ձ Remove the 2 screws to remove
the cabinet cover.
ձ 4 screws
ղ Remove the solders.
ղ Solders
ճ Remove the main P.C. board.

ճ Main P.C. board
42
մ Remove the 2 screws to remove

the charge case and the operational P.C. board. մ Screw
Chage case
մ Screw
Operational P.C. board
43
11.1.2. Handset
ձ 2 screws
ձ Remove the 2 screws.
ղ Insert a plastic card.

(Ex. Used SIM card etc.)
between the cabinet body Cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
Cabinet cover
ճ Likewise, open the other

side of the cabinet.
մ Remove the cabinet cover Cabinet cover

by pushing it upward.
յ Remove the solders. շ Screw
յ Solders
ն Remove the solders to remove

the 2 charge terminals.
Main P.C. board
ն Solders
շ Remove the screw to remove
the Main P. C. board.
2 charge terminals
44
11.1.3. Charger Unit

ձ Cabinet cover
ձ Remove the cabinet cover.
AC Adaptor
ղ Remove the solders to remove

the AC adaptor.
ղ Solders
ճ Remove the 2 charge terminals.
ճ 2 charge terminals
45
11.2. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
P. C. board
Vertical Interval
Tolerance
Peel off the FFC (Flexible Flat Cable) from

the LCD, in the direction of the arrow. Take 0.2 mm
care to ensure that the foil on the P.C. board
is not damaged.
Horizontal Interval
0.2 mm Tolerance
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
New LCD
OK
Fit the heatseal of a new LCD.
NG
(Inclined)
Tip of Soldering Iron

(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
Heatweld with the tip of the soldering
iron about 5 to 8 seconds NG
(in case of 60W soldering iron).
(Vertical interval tolerance is
more than 0.2 mm.)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)
46
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.29)
12.1. Equipment Required

• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

<Preparation> Note:
• Serial JIG cable: PQZZ1CD300E* *: If you have the JIG Cable for TCD500 series
• PC which runs in DOS mode (PQZZ1CD505E), change the following values of
• Batch file CD-ROM for setting: PNZZTGC220LA resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
Resistor Old value (k) New value (k)

R2 22 3.3
R3 22 3.3
R4 22 4.7
R7 4.7 10
12.2.1. Connections (Base Unit)

1 Connect the AC adaptor.
2 Connect the JIG Cable GND (black).
3 Connect the JIG Cable RX (red) and TX (yellow).
JIG Cable
3 UTX (yellow)
UTX
2 UGND (black) To Serial Port
URX (COM port 1*)
UGND
3 URX (red)
PC
DC JACK
1
AC adaptor
Base unit P. C. board

Note:
*: COM port names may vary depending on what your PC calls it.
47
12.2.2. Connections (Handset)

1 Connect the DC Power or Battery to BATT+ and BATT-.
2 Connect the JIG cable GND (black) to GND.
3 Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
3 URX (red)
To Serial Port
3 UTX (yellow)
UTX (com port 1*)
URX
2 GND (black)
BATT+
GND
JIG Cable
1 DC Power
BATT-
or Battery
PC
Handset P. C. board
Note:
*: COM port names may vary depending on what your PC calls it.
48
12.2.3. How to install Batch file into P.C.
1. Insert the Batch file CD-ROM into CD-ROM drive and

copy PNZZTG**** folder to your PC (example: D drive).
<Example for Windows>
2. Open an MS-DOS mode window. On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
3. At the DOS prompt, type "D:" (for example) to select the
drive, then press the Enter key.
<Example>
4. Type "CD 㪳PNZZTG****", then press the Enter key.
5. Type "SET_COM=X", then press the Enter key C: >Documents and Settings>D:
(X: COM port number used for the serial connection on your PC). D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
6. Type "READID", then press the Enter key. 00 52 4F A8 A8
䊶If any error messages appear, change the port number or D: >PNZZTG****>DOSKEY
䇭check the cable connection. D: >PNZZTG****>
䊶If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key. <Example: error happens>
C: >Documents and Settings>D:

D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
‫ޓ‬CreateFile error
ERROR 10: Can't open serial port
D: >PNZZTG ****>
Note:
• “*****” varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name Function Example

rdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readid Read ID (RFPI) Type “readid”, and the registered ID is read out.
writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
hookoff Off-hook mode on Base Type “hookoff”.
hookon On-hook mode on Base Type “hookon”.
getchk Read checksum Type “getchk”.
wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
49
12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View

Frequency Counter (*1)
* Send command "SFR", then

the frequency output on this TP.
Oscilloscope (*2)
* Start Monitor
UTX +5.5V
C171
C167
URX UGND
PNLB2317Z
R168
R164
C173
R172
PCB
C175
C178
Q171
R171
R175
C176
IC611
ANT1_S-GND
R176
ANT1_Short
RA611
Spectrum Analyzer
TMS
TD0
C611
+3.0V
R112
L1R
TDI
TCK
RTCK
C112
BRN
VDDC
R115
R114
R111
SA101
TEL
Q111
STM/CKM/P15
C111 LT1
R113
C515 YLW
IC601 C115
C113
RSTN
D113
GAP1
ANT1
C601
C120 VREF
- GRY
DCM
C513
VCCA
5.5V
DC
DC
F301
DCP
C321
R371 + PUR
IC302
R372
R322
C342
+
C351
R321
CHG
ORG
BLU
-
A +
SP
-
Volt Meter
Oscilloscope
Note:
(*1) is referred to No.2 of Check Table for RF part (P.37)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.13)
50
12.4. Adjustment Standard (Handset)

When connecting the simulator equipment for checking, please refer to below.
12.4.1. Component View
After measure do not forget to remove the wire.

When measure RF, short "ANT-Short" and "ANT-Short-GND" with copper wire which length 5mm.
Oscilloscope
ANT-Short-GND
ANT-Short
AF VOLT METER
GREEN
40
RECEIVER
AN
T1
PNLB2318Z ORANGE
_T
P TGCA20xx
C70 D21
PbF
C71
D22
C92 C94
C62 C64 C96
C79
C61 C63 C65
C95 R76C73
Spectrum Analyzer
D14
C91 C93
R51 R53 R55 R77
R52 R54 C72 D13
C78
CP3V
100
BLUE
SP-PHONE_SPEAKER
RA5
AF VOLT METER
IC7
C69 ORANGE
15 H
4
C52
STM C57 C55 15 H
C56 C53
C29
IC4
100
R60 C30
C44
1.8V
C191 C99 C41
R61
CP+3.0V
C59
JTAG C45 IC1 C98
C46 C190
C860 CP4V
Oscilloscope
DC Volt Meter
C36 R1
C22 1.8V
C859 C862 R20 C47 C13C11
C43
CP3V
C863
R23 C12 Q1
RA7
1.8V
R15 RA1
Q6 X1
RA3
C1
CKM
RA2
C866
* Send command "SFR", then
the frequency output on this TP.
POWER
Frequency Counter
47
MIC Load
1.1 kHz
MIC- +
OSC
MIC+ +
47
MIC+ RCV-
AF VOLT METER
CHG_CTRL
40
MIC- RCV+
Q9
Q4
R6
C19 Q2
R2
R9
R8 C15 R45
Oscilloscope
URX UTX
Q3
GND
DC POWER SUPPLY
C6 F1 VBAT
BATT-
VBAT
BATT+
2.6V
GND
DC VOLT METER
R7
CHG+ C5 CHG-
51
12.5. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.5.1. How to download the data

12.5.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.47).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC611) Adjusted parameter data is stored in memory. 1) Change the address “0001” of EEPROM to “55” to download
(country version batch file, default batch file, the data.
etc.) 2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TGC21US_WW_RevXXX_YYY.bat” (KX-TGC210) or
“TGC22US_WW_RevXXX_YYY.bat” (KX-TGC220)(*1)
4) Clock adjustment
X'tal (X501) System clock Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 5.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 15 Hz.
Note:
(*1) WW: country code, XXX_YYY: revision number
“XXX_YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.47).
52
12.5.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.47).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC7) Adjusted parameter data is 1) Default batch file: Execute the command “default.bat”.
stored in memory. 2) Default batch file (remaining): Execute the command
(country version batch file, “TGCA20US_DEF_RevXXX_YYY.bat”. (*2)
default batch file, etc.) 3) Country version batch file: Execute the command
“TGCA20US_WW_RevXXX_YYY.bat”.(*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
Battery Monitor Check - 1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write “YY“
Execute the command “wreeprom 00 09 01 YY“.
EEPROM = 000A (No Voltage) write “YY - 1D“
Execute the command “xwreeprom 00 0A 01 ZZ“.
Note:
No Voltage writing data limit is “00“.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.
4) Confirm that there is flashing of Battery lcon.
Battery Clock Adjustment CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.
(X1) 2) Input Command “sendchar sfr“, then you can confirm the current value.
3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).
4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK
execute in the command “sendchar sfr xx xx (where xx is the value)“ so that the
reading of the frequency counter is 10.368000 MHz ± 5 Hz.
Note:
(*2) WW: country code, XXX_YYY: revision number
“XXX_YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.47).
53
12.6. Frequency Table
Ch. (hex) TX/RX Frequency (MHz)

Channel 0 00 1928.448
Channel 1 01 1926.720
Channel 2 02 1924.992
Channel 3 03 1923.264
Channel 4 04 1921.536
54
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 F ± 20 F (370 C ± 10 C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity  0.82.
Type  RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.5)
13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
55
13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
56
13.2. Terminal Guide of the ICs, Transistors and Diodes

13.2.1. Base Unit
4
Cathode C
(Reverse View) 5
8
1 89pin B
88 67
2 (GND)
66 4
3 1 1 E
Anode
22 45
23 44
PNWIGC220LAH 2SC6054JSL
C0DBEYY00102 DY2J25000L*1 C2HBCY000139 PNWI2C220LAH *1 B1ABDM000001
DRC9113Z0L *1
C Cathode
E Anode Cathode
E C Anode
C B
B
2SA1776P DSC7003S0L DA2J10100L B0EDER000009 B0ECKM000008
*1 for KX-TGC220 only
13.2.2. Handset
5 1
8 B
(Reverse View) (Reverse View)
E
89 pin Cathode
4 88 67
1 (GND)
B1ADGE000012 1 66 Anode
B1ABGE000011
B1ADCF000040 22 45
23 44
C3FBLY000162 2SC6054JSL
PNWIGDA20LAR UNR9216J0L C1CB00003837 B3ACB0000216
57
Memo
58
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Base Unit (Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Handset (Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
59
14.2. Base Unit (Main)

14.2.1. KX-TGC210
RF Block
ANT- ANT1
2
Pattern
MSL
1
Wm=0.4mm
ANT1_Short GND Lm=10mm
C872
RXn
1.3p C895
2p
C863
C873 C871
C820
1.5p
1.5p
2.7n
L803
SHORT3
ANT1_S-GND 2p 1.5p
SHORT
C874
SHORT6
15p
SHORT
GND SHORT1
SHORT2
GND GND SHORT
RXp
SHORT
GND GND GND GND GND
W 0.2mm W 0.15mm
L 3.8mm L 6.2mm SL SL SL GND
1st layer 1st layer W=0.3mm W=0.3mm W=0.3mm MSL
W=0.25
C819 L=12.45mm L=6.95mm L=6.5mm L=2mm
TXp
10p
Tx-balun
C810
1.5p
SL SPN (1)
W=0.3 MSL
L=40mm W=0.25
L=2mm SPP (2)
SL
NC
NC
NC
NC
open-stub TXn
K
SHORT
W=0.2mm open-stub open-stub SHORT4

SL SL SL
L=20mm
W=2.9mm
A
C478
C477
D473
D472
W=2.0mm W=2.2mm
L=3.8mm L=10.8mm L=5.0mm Pre-matching
SHORT5
VBAT
SHORT
C811
10p
X501
GND (3)
13.824M
10p
TXn
C508
TXp
RXp (4)
RXn
(5)
TO RF BLOCK (6)
2.2u
VBAT
C513
(7)
44
43
42
41
40
39
(8)
TRSW_n
VCC_FE
ANT
TXn
VDD_IF
VCC_IF
45
46 TXp
47 RXp
48 RXn
49 GND_RF (9)
NC TRSW_p
50
GND ANT_n
PARALLEL WIRE 51
52 ATST_n
53 ATST_p
54 TEST
+3.0V RSTN RSTN
C515
55
*IC501
1u
56 NC
VBAT STM/CKM/P15 C516 0.1u 57 VCC_VCO
*R507
GPIO[27]
NC
9 58
KEYIN2 C517 0.1u 59 VDDUSB
KEYIN2 DM_USB/GPI28
KEYS_C 60
KEYS_C DP_USB/GPI29
KEYIN1 C518 0.1u 61
KEYIN1 VDDC1
KEYS_E JTAG_TDO 62
KEYS_E JTAG_TDO
KEYIN3 JTAG_TDI 63
KEYIN3
KEYS_D JTAG_TCK 64 JTAG_TDI (10)
KEYS_D JTAG_TCK
*R651 NC JTAG_TMS 65
GPIO[1]/SDA_IIC
GPIO[0]/SCL_IIC
ANS_LED JTAG_TMS
JTAG_RTCK 66
MSG_LED JTAG_RTCK
ANS_LED
10k
10k
10k
10k
LED_VDD VDDC
GPIO[2]
GPIO[3]
GPIO[4]
GPIO[5]
1 *Q651 +3.0V
*C650 NC
*C651 NC
*C652 NC
R506
R502
R503
R504
NC
NC
(11)
67
68
69
70
71
72
*R652
MSG_LED
(12)
2 1
*SW1
*Q652
NC
SKQNAED010
MSG_LED
EEP_SDA
ANS_LED
EEP_SCL
EEP_WP
(13)
JTAG_RTCK
JTAG_TDO
JTAG_TMS
URX
JTAG_TCK
UTX
JTAG_TDI
*C601 NC
(14)
(15)
NC *IC601
UGND
RTCK
URX
TDO
TMS
UTX
TCK
TDI
1 8
*CS VCC (16)
2 *HOLD/IO3 7
DO/IO1 (17)
3 6
*WP/IO2 CLK (18)
4
GND DI/IO0 5
(19)
U-ART JTAG (20)
(21)
NC: No Components
60
+3.0V Q141
R160 Rx Tx REFERENCE
E
1XX : TEL LINE
820
R176
3XX : POWER, CHARGE
*R162
47k
NC
C167 R168
R165 27k
1k
B
1000p 4.7k
Q161 4XX : MIC, SP
C161
R141
10u
C 5XX : BBIC
B
10M
C164
E 6XX : FLASH, EEPROM, KEY, LCD
100k
C176 1u
C142 K0.01u
2.7k (3216)
7XX : FOR DK/BT
R175
3.9k
25V
NC
R142
8XX : RF
*R131
K
C173 R177 R164
D143
D142
R172 680k
A
0.1u 1k 2.7k
C175 560p C101 680p
R151
0.033u
0.022u
C171
100k Q142 D101
Q171 B
C
1 2
L1T
*C132 K0.01u
0.01u
130k
(1) (YELLOW)
330k
SA101 270V
E
39
2.2k
C178
2
4 3
(2)
R171
R163
220
R152
C152
*R133
R145
1
+5.5V C102 680p L1R
(GREEN)
*C115 P101 22
R331
68k
1
C184
NC
1u
R332
33k
C181
*R115 NC
NC
C331
(3)
R121 390k C121 680p
12p
R122 390k C122 680p

C509
(4) Caller ID
+5.5V +5.5V
!
(5) F301
(6) 3.0A DCP
VDDC
10u
HOOK
1u
R111
R112
R371
100k
100k
K +3.0V
D133
C511
C510
C120
1
C507
2.2u
(7) 1000p
R372
0.047u
0.047u
DCM
R114
1
47k
BELL
C111
C112
1SR154
+3.0V Q111
A
+3.0V
D362
VCCA
(8)
VDD_APU 38
VBAT_APU 37
XIN 36
XOUT 35
DCINS 34
PWM0 33
PWM1 32
SPOUTP 31
VCCPA 30
SPOUTN 29
LOUT 28
HSSPOUTP27
MPWR26
HSMIP 25
HSMIN 24
MIP 23
R501 10
K
CHG+
10k
VREF VCCA
K0.68u
D113
C113
C505 10u CHARGE+
R113
A
22
MIN 21 C506
VCCA 20
1u
C351
K
(9) VREF 19
D361
1u
NC
RA151
DCIN3/LIN1 18 1 4 Bell CHARGE-
A
DCIN2 17 3.0V
DCIN1 16 2 3
DCIN0/LIN0 15 1k
DOUBOUT 14
*IC501 DOUBCAPP1 13 VBAT +5.5V
C503
10u
GND DOUBCAPP12 C504

DOUBCAPN11 C521
1u IC302
1u
DOUBCAPN110 L501 2 3
VBAT 9 OUT1 IN
C502 C501 100n 4
COREOUT 8 OUT2
10u 0.1u
R322
330u
0.1u
100
VDDC2 7 ADJ
6.3
1u
GPIO[26] 6 HOOK 1
GPIO[25] 5 BELL
(10)
C342
C341
C321
GPIO[24] 4 KEYS_E
R321
140
GPIO[23] 3 KEYS_D
GPIO[22] 2 KEYS_C
GPIO[21] 1 UTX
GPIO[20] VDDC URX
GPIO[10]
GPIO[11]
GPIO[12]
GPIO[13]
GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
GPIO[18]
GPIO[19]
VDDIO1
VDDIO2
GPIO[6]
GPIO[7]
GPIO[8]
GPIO[9]
VDDC
(11) +3.0V
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
(12) R510
1.2V
C519
10k
0.1u
C520
0.1u
SPI_CLK
SPI_DO
SPI_CS
KEYIN1
KEYIN2
KEYIN3
SPI_DI
(13)
EEP_WP
EEP_SDA
EEP_SCL
SPI_DO
SPI_CS
SPI_CLK
SPI_DI
+3.0V +3.0V
(14) RA611
(15) C611 0.1u 3.3k
*IC611 SHIELD(NC) PCB

8
7
6
5
(16) 64K EEPROM

(17)
1
2
3
4
1 A0 VCC 8 ZA1
(18) 2 7
NC
A1 WP
(19) 3
A2 SCL 6 10 9 8 7
HAK_CL1
(20) 4
GND SDA 5
11 6
PCB
(21) GND 12 5
RE1
1 2 3 4
GND
NC: No Components
KX-TGC210LA SCHEMATIC DIAGRAM (Base Unit_Main)
61
14.2.2. KX-TGC220
RF Block
ANT- ANT1
2
Pattern
MSL
1
Wm=0.4mm
ANT1_Short GND Lm=10mm
C872
RXn
1.3p C895
2p
C863
C873 C871
C820
1.5p
1.5p
2.7n
L803
SHORT3
ANT1_S-GND 2p 1.5p
SHORT
C874
SHORT6
15p
SHORT
GND SHORT1
SHORT2
GND GND SHORT
RXp
SHORT
GND GND GND GND GND
W 0.2mm W 0.15mm
L 3.8mm L 6.2mm SL SL SL GND
1st layer 1st layer W=0.3mm W=0.3mm W=0.3mm MSL
W=0.25
C819 L=12.45mm L=6.95mm L=6.5mm L=2mm
TXp
10p
Tx-balun
C810
1.5p
SL SPN (1)
W=0.3 MSL
W=0.25
L=40mm L=2mm SPP (2)
SL
NC
NC
NC
NC
open-stub TXn
K
SHORT
W=0.2mm open-stub open-stub SHORT4

SL SL SL
L=20mm
W=2.9mm
A
C478
C477
D473
D472
W=2.0mm W=2.2mm
L=3.8mm L=10.8mm L=5.0mm Pre-matching
SHORT5
VBAT
SHORT
C811
10p
X501
GND (3)
13.824M
10p
TXn
C508
TXp
RXp (4)
RXn
(5)
TO RF BLOCK (6)
2.2u
VBAT
C513
(7)
TXn 44
TRSW_n 43
ANT 42
VCC_FE 41
VDD_IF 40
VCC_IF 39
(8)
45
46 TXp
47 RXp
48 RXn
49 GND_RF (9)
50 TRSW_p
GND ANT_n
51
PARALLEL WIRE 52 ATST_n
53 ATST_p
IC501
54 TEST
NC +3.0V RSTN C515 RSTN
55
1u 56 NC
VBAT STM/CKM/P15 C516 0.1u 57 VCC_VCO
R507
GPIO[27]
1k
9 58
KEYIN2 C517 0.1u 59 VDDUSB
KEYIN2 DM_USB/GPI28
KEYS_C 60
KEYS_C DP_USB/GPI29
KEYIN1 C518 0.1u 61
KEYIN1 VDDC1
KEYS_E JTAG_TDO 62
KEYS_E JTAG_TDO
KEYIN3 JTAG_TDI 63
KEYIN3
KEYS_D JTAG_TCK 64 JTAG_TDI (10)
KEYS_D JTAG_TCK
Q651 JTAG_TMS 65
GPIO[1]/SDA_IIC
GPIO[0]/SCL_IIC
ANS_LED JTAG_TMS
DRC9113Z0L JTAG_RTCK 66
MSG_LED 1.2k R651 JTAG_RTCK
ANS_LED
10k
10k
10k
10k
LED_VDD VDDC
GPIO[2]
GPIO[3]
GPIO[4]
GPIO[5]
1
68p
68p
+3.0V
68p
R506
R502
R503
R504
(11)
67
68
69
70
71
72
C650
C651
C652
1.2k R652 MSG_LED

(12)
2 1
Q652
SW1 DRC9113Z0L
NC
MSG_LED
EEP_SDA
ANS_LED
EEP_SCL
EEP_WP
(13)
JTAG_RTCK
JTAG_TDO
JTAG_TMS
URX
JTAG_TCK
UTX
JTAG_TDI
C601 0.1u
(14)
(15)
IC601
UGND
RTCK
URX
TDO
TMS
UTX
TCK
TDI
1
*CS VCC 8 (16)
2 7
DO/IO1*HOLD/IO3 (17)
3 6
*WP/IO2 CLK (18)
4
GND DI/IO0 5
(19)
U-ART JTAG 8M FLASH (20)
(21)
NC: No Components
62
+3.0V
R160 Rx Tx Q141
REFERENCE
E
1XX : TEL LINE
820
R176
3XX : POWER, CHARGE
*R162
47k
NC
C167 R168
R165 27k
1k
B
1000p 4.7k
Q161 4XX : MIC, SP
C161
R141
10u
C 5XX : BBIC
B
10M
C164
E 6XX : FLASH, EEPROM, KEY, LCD
100k
C176 1u
C142 K0.01u
2.7k (3216)
7XX : FOR DK/BT
R175
3.9k
25V
NC
R142
8XX : RF
*R131
K
C173 R177 R164
D143
D142
R172 680k
A
0.1u 1k 2.7k
C175 560p C101 680p
R151
0.033u
0.022u
C171
100k Q142 D101
Q171 B
C
1 2
L1T
*C132 K0.01u
0.01u
130k
(1) (YELLOW)
330k
SA101 270V
E
39
2.2k
C178
2
4 3
(2)
R171
R163
220
R152
C152
*R133
R145
1
+5.5V C102 680p L1R
(GREEN)
C115 P101 22
R331
68k
C184 F1L2E2240004 1
NC
1u
R332
33k
C181
R115 27k
NC
C331
(3)
R121 390k C121 680p
12p
R122 390k C122 680p

C509
(4) Caller ID
+5.5V +5.5V
!
(5) F301
(6) 3.0A DCP
VDDC
10u
HOOK
1u
R111
R112
R371
100k
100k
K
+3.0V
D133
C511
C510
C120
1
C507
2.2u
(7) 1000p
R372
0.047u
0.047u
DCM
R114
1
47k
BELL
C111
C112
1SR154
+3.0V Q111
A
+3.0V
D362
VCCA
(8)
VDD_APU 38
VBAT_APU 37
XIN 36
XOUT 35
DCINS 34
PWM0 33
PWM1 32
SPOUTP 31
VCCPA 30
SPOUTN 29
LOUT 28
HSSPOUTP27
MPWR26
HSMIP 25
HSMIN 24
MIP 23
R501 10
K
CHG+
10k
VREF VCCA
K0.68u
D113
C113
C505 10u CHARGE+
R113
22 A
MIN 21 C506
VCCA 20
1u
C351
K
(9) VREF 19
D361
1u
NC
DCIN3/LIN1 18
RA151
1 4 Bell CHARGE-
A
DCIN2 17 3.0V
DCIN1 16 2 3
DCIN0/LIN0 15 1k
IC501
DOUBOUT 14
DOUBCAPP1 13 VBAT +5.5V
GND
C503
10u
DOUBCAPP12 C504 1u
DOUBCAPN11 C521 1u IC302
DOUBCAPN110 L501 2 3
VBAT 9 OUT1 IN
C502 C501 100n 4
COREOUT 8 OUT2
10u 0.1u
R322
330u
0.1u
100
VDDC2 7 ADJ
6.3
1u
GPIO[26] 6 HOOK 1
GPIO[25] 5 BELL
(10)
C342
C341
C321
GPIO[24] 4 KEYS_E
R321
140
GPIO[23] 3 KEYS_D
GPIO[22] 2 KEYS_C
GPIO[21] 1 UTX
GPIO[20] VDDC URX
GPIO[10]
GPIO[11]
GPIO[12]
GPIO[13]
GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
GPIO[18]
GPIO[19]
VDDIO1
VDDIO2
GPIO[6]
GPIO[7]
GPIO[8]
GPIO[9]
VDDC
(11) +3.0V
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
(12)
1.2V R510
C519
10k
0.1u
C520
0.1u
SPI_CLK
SPI_DO
SPI_CS
KEYIN1
KEYIN2
KEYIN3
SPI_DI
(13)
EEP_WP
EEP_SDA
EEP_SCL
SPI_DO
SPI_CS
SPI_CLK
SPI_DI
+3.0V +3.0V
(14) RA611
(15) C611 0.1u 3.3k
IC611 SHIELD(NC) PCB

8
7
6
5
(16) 64K EEPROM

(17)
1
2
3
4
1 A0 VCC 8 ZA1
(18) 2 7
NC
A1 WP
(19) 3
A2 SCL 6 10 9 8 7
HAK_CL1
(20) 4
GND SDA 5
11 6
PCB
(21) GND 12 5
RE1
1 2 3 4
GND
NC: No Components
KX-TGC220LA SCHEMATIC DIAGRAM (Base Unit_Main)
63
14.3. Base Unit (Operation)
UP
9
KEYIN2
KEYS_C
KEYIN1
KEYS_E DOWN
KEYIN3
KEYS_D
ANS_LED
MSG_LED
LED_VDD
1
ERASE
LOCATOR
LED901 (ANS_LED)
K A
ANSWER SKIP
REPEAT
MSG
A K
LED902
(MSG_LED)
NC: No Components
KX-TGC220 SCHEMATIC DIAGRAM (Base Unit_Operation)
64
Memo
65
14.4. Handset (Main)

Charge Current VBAT
VBAT
To Battery !
F1 2.5A
BATT+
C6
K0.1u
(1)
n BATT-
GND
SOCp
C1
6.3V
220u
(2)
R45 C15 GND

0.1 J39p SOCn
SHORT
OJ4
GND
* When "SFR" command is executed,
13.824MHz frequency will be output.
EEP_WP
LCD_CD
LCD_SCL
KEY_LED
STB_F
LCD_SID
KIN_1
KIN_2
KIN_3
KIN_4
Q2
C19
K1000p
CHG+
R2
R9 30k
30k
CHG+
R8 4.3 Q3 CP3V
C5 R7 (3216)
K0.1u 820
To Charge
Terminal C69
Q4
GND K0.1u CKM
RA5
CHG- 1
A0 VCC 8 3.3k
R6
GND 10k 2 7
A1 WP
Q9 3
A2 SCL 6
C57
4 5 K0.1u
VSS SDA
GND IC7 32k +1.8V GND

CHARGE_CTRL GND STM
CHARGE_DET
+1.8V
66
65
64
63
62
61
60
59
58
57
56
55
54
P0_3/SCL2/URX2
(3)
VDD1
P2_7/BXTAL
P2_6/WTF_IN
P0_6/SPI_DO
P0_4/SPI_EN
P0_5/SPI_CLK
P1_4/INT4/TDOD
P0_7/SPI_DI/PWM1
P1_2/INT2/SK
P1_1/INT1/LE
P1_5/INT5/RDI/VDDE
P1_3/INT3/SIO
R60 R61
NC 1k 67
P0_2/SDA2/UTX2
68
P0_1/URX/PWM0
69
UTX P0_0/UTX
70
URX C44 VDD2
71
*RSTn
K0.1u RST 72
JTAG JTAG IC1
GND LCD_CS 73
P2_5/PCM_FSC/SF
EEP_WP 74
P2_4/SCL1/PCM_DO/DP3
GND 75
P2_3/SDA1/PCM_DI/DP2
LCD_RESET 76
P2_2/PCM_CLK/CLK100
LCD_LED0 77
WLED_CUR_0
78 GND
WLED_CUR_1
79
P2_1/ECZ2/PWM1/LED4
80
for TGC P2_0/ECZ1/PWM0/LED3
SHARP 0 AST FLASH SP 81
LDORF_CTRL
TX _RF C45
K0.1u
82
VDD3
83
for TGD RFP0n
Not Used Not Used Not Used Not Used Not Used LEFT C46 84
RF_SUPPLY2
P3_5/RINGOUT/RINGING
TO RF BLOCK 10p
85
RF_SUPPLY_PA
KIN_4 86
RF_TXn RF_TXn
for TGC 3 2 1 SOFT_A1 RF_TXp 87
RF_TXp
P3_4/PARADET
88
RF_SUPPLY1
RFP2
P3_6/RINGn
AVD_XTAL
AVS_XTAL
REF_RES
for TGD
RF_RXn
RF_RXp
Not Used Not Used Not Used UP SOFT_A2 RF_RXn 89
XTAL2
XTAL1
VBAT
RFP1
RFP0
KIN_3 RF_RXp
(4)
1
2
3
4
5
6
7
8
9
10
D10p 11
12
13
for TGC TALK1
6 5 4 INT C866
F56k
R20
C47
K0.1u
C43
1u
TALK2 RX _RF
GND
for TGD X1 3 1
Not Used
2
Not Used Not Used Not Used Not Used 10.368M
Not Used GND
KIN_2
for TGC 9 8 7 SOFT_C1 1Vp-p
for TGD DOWN

Not Used Not Used Not Used SOFT_C2 RIGHT 0.85V
KIN_1
0V
STB_C
STB_D
STB_C
STB_D
STB_A
STB_B
STB_E
STB_B
STB_F
(5)
LCD_RESET
LCD_CD
LCD_CS
KEY_LED
LCD_SCL
LCD_LED0
LCD_SID
CP4V CP3V
LCD B/L LED KEY B/L LED
(TGD = White) (TGC = Amber) (TGC/TGD = Amber)
(WP = NC)
3.3k
330
330
10k
10k
@NC
@NC
@NC
@NC
@NC
@NC
+
R54
C92 C94
R51
R52
R53
R55
*LED8
*LED7
*LED9
*WLED 16V K1u 16V K1u

C96
*LED4
*LED1
*LED6
*LED2
*LED5
-
*LED3
K1u
NC
16V K1u
NC
NC
NC
NC
16V K1u
*C77 *C76 C91

C93
16V K1u
C95
NC NC
C61
C62
C63
C64
C65
*RA1 *RA2 *RA3

270 @NC
GND GND @NC
NC: No Components GND
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
LCD
1
10
11
12
13
14
15
*Q6 *R15
1.5k
GND
GND
VDD
VLCD
RES
SCK
SDA
VSS
VSS
CS1
VB0+
VB1+
A0
VB0-
VB1-
GND
66
(1)
(2)
*open-stub $N>l9g
SLx2
RF BLOCK W1=0.2mm
L1=3.3mm
RX-balun W2=0.7mm
MSL L2=5.0mm
ANT-Short 50 ohm line
W=0.170mm MSL
<u?.46EY:GE,2=$N$?$aW=0.25mm
SHORT
OJ5
L=3.6mm
L=2mm
ANT-Short-GND S=0.125mm %A%C%W$KCV$-49$( L=2mm
RF_RXn
GND ANT1_TP
C863
C862
1.8p
GND
1.5p
RX_RF
MSL
W=0.25mm
OJ1 L=2mm
50 ohm line
Total L=4mm
SHORT RF_RXp
SHORT
OJ7
+1.8V
SL
W=0.3mm
SL
W=0.3mm
GND GND MSL
W=0.25mm
C859 L=6.95mm L=6.5mm L=5mm
RF_TXn
IC4 VJ1 8M
10p
TX-balun
C860
1
VCC 8
1.1p
*CS
C41
open-stub
SL
open-stub
SL
open-stub
SL
SL
W=0.3mm TX_RF MSL
2 DO/IO1 7 SL L=39.0mm W=0.25mm
W=0.2mm W=2.9mm W=2.0mm W=2.2mm
*HOLD/IO3 K0.1u
L=20.0mm L=2.8mm L=10.8mm L=5.0mm OJ2 L=5mm
3 6
SHORT RF_TXp
*WP/IO2 CLK
C56 4 5 LPF
K1u GND DI/IO0
GND Pre-matching
%A%C%W2=
* FbB"$N>l9g
C=3.6pF
4layer GND 6/2=$N$?$a 10.5mm2
POWER
for TGC VBAT
GND
OJ3
SHORT
OFF1
CP4V open-stub
CP4V SL
OFF2 W=0.6mm
L=20.0mm
CP3V Not Used
C52 K1u
Not Used
C55 for TGD
53
52
51
50
49
48
47
46
45
D10p GND
(3) CP3V
CP_VOUT2
QSPI_SCK
QSPI_CS
VDDIO_QSPI
P1_6/PON
QSPI_IO0
QSPI_IO3
QSPI_IO1
QSPI_IO2
C53
K2.2u
CP_VOUT1 44 C30
K1u GND
CP_C2y 43 VBAT
CP_VBAT2 42 C191
CP_C1y 41 C29 K1u
CP_C2x 40 K1u VBAT

IC1 CP_C1x 39 C59 Sp-phone RX
K1u C72 D13
CP_VBAT1 38 NC NC
P3_0/DP0/PAOUTn 37 +
VDDPA 36 C73 D14 SP-PHONE_SPEAKER
NC NC
P3_1/DP1/PAOUTp 35 -
CHARGE_DET
P1_7/CHARGE 34 C98 C99 R761 R77
CHARGE_CTRL SL
CHARGE_CTRL 33 D10p D10p 1
W=0.15mm
VBAT 32 C79 C78 L=6.3mm :3.6nH + 0.4nH( %9%k!<%[!<%k
)
K2200p K2200p
DC_CTRL 31 C190
K0.1u
DC_I 30 GND GND GND GND
GND GND
FbB"C
SOCn GNDGND 9mm2 :1.75pF
DC_SENSE 29
SOCn 28 C36
J39p SOCp
SOCp 27
P1_0/INT0/ADC1 26
STB_A
P3_3/ADC0 25
LDO_CTRL 24
R1 10k
(MAX500mA)
CIDOUT/MICn
VDD/AVD 23
CIDINn/MICp
P3_2/CIDINp
P3_7/RINGp
+1.8V
VREFm
VREFp
1.8V
1.8V
LSRp
LSRn
MICh
C22 Q1
K1u
(4) RCV+
14
15
16
17
18
19
20
21
22
C70 D21
GND RECEIVER+ 68p NC
+
C71 D22 RECEIVER
68p NC
C13 -
K0.1u GND RECEIVER-
Handset RX
C11
K0.1u
RCV- SL
W=0.15mm
L=6.3mm :3.6nH + 0.4nH( )
%9%k!<%[!<%k
GND GND FbB"C

R23 GND GND 9mm2 :1.75pF
MIC_POWER 1k
RA7 820
2 3
1 4 C12
K2.2u
MIC+
GND MICp MIC AP1
MICn
Handset TX/Sp-phone TX MIC-
STB_E
(5)
ZA1
10 9 8 7
11 6
Test Pattarn for Pattern Test Pattarn for Carbon
12 5
HAK_CL1 CARBON_CL1
*PCB
1 2 3 4
RE1
GND NC: No Components

KX-TGCA20LA SCHEMATIC DIAGRAM (Handset_Main)
67
Memo
68
15 Printed Circuit Board

15.1. Base Unit (Main)
ANS_LED
MSG_LED
LED_VDD
KEYS_C
KEYS_E
KEYS_D
KEYIN2
KEYIN1
KEYIN3
R163
C161
R652
R651 C152 R151 R160 C164
C652
C650 C651 Q651
Q652
R152
PNLB2317Z
C142
R162
R165 R177
D143
D142
Q161
PCB
Q141
R133
R131 P101
Q142
C184
R142
C132
R145
R141
- +
C102
R502
C519
R504
R503
D101 C520
R510
C101
~ ~ R506
SW1
C502
C518
R507
C501
L501
C517
IC501
C504
C516
L803
C874
C521
C122
C121
C895
D133
C871
C872
C873
C503
C863
C819
RA151
C820
R122
R121
C506
C505
C181
10
C8
R501 R332
C511
C331
C507
R331 C510
C509 C508
X501
C341
C811
+ -
D361
D362
D472 D473
C477 C478
HAK_CL1
KX-TGC210/220 MAIN BOARD (Base Unit (Component View))
69
15.1.2. Bottom View

for JIG
}
UTX
URX
UGND
UTX +5.5V
C171
C167
URX UGND
PNLB2317Z
R168
R164
C173
R172
PCB
C175
C178
Q171
R171
R175
C176
IC611
ANT1_S-GND
R176
ANT1_Short
RA611
TMS
TD0
C611
+3.0V
+3.0V
R112
L1R
TDI
TCK
RTCK
C112
BRN
VDDC VDDC R115
R114
R111
SA101
TEL
STM/CKM/P15 Q111
C111 LT1
STM/CKM
R113
C515 YLW
IC601 C113 C115
RSTN
D113
GAP1
ANT1
C601
C120 VREF
- GRY
DCM
C513
VCCA
DC
F301
DCP
C321
R371 + PUR
IC302
R372
R322
C342
+
C351
R321
CHG
ORG
BLU
-
A +
SP
-
KX-TGC210/220 MAIN BOARD (Base Unit (Bottom View)
70
15.2. Base Unit (Operation) (KX-TGC220 only)

UP
DOWN
PNLB2320Z
KX-TGC2xxH
PbF LOCATOR
LED901
ERASE
ANSWER ANSWER1
SKIP
MSG MSG1
REPEAT
MSG2 MSG3
LED902
KX-TGC220 OPERATION BOARD (Base Unit (Component View))
71
Memo
72
15.3. Handset
ANT-Short-GND
ANT-Short
GREEN
RECEIVER
PNLB2318Z ORANGE
ANT1_TP
TGCA20xx
C70 D21
PbF
C71
D22
C92 C94
C62 C64 C96
C79
C61 C63 C65
C95 R76C73
D14
C91 C93
R51 R53 R55 R77
R52 R54 C72 D13
C78
CP3V
BLUE
SP-PHONE_SPEAKER
RA5
IC7
C69 ORANGE
C52
STM C57 C55
C56 C53
C29
R60 C30 IC4
C44
C191 C99 C41
R61 C59
JTAG C45 IC1 C98
C46 C190
C860 CP4V
C36 R1
C22 1.8V
C859 C862 R20 C47 C13C11
C43
C863
R23 C12 Q1
RA7
R15 RA1
Q6 X1
RA3
C1
CKM
RA2
C866
POWER
MIC+ RCV-
CHG_CTRL
MIC- RCV+
Q9
Q4
R6
C19 Q2
R2
R9
R8 C15 R45
URX
URX UTX
Q3 UTX for JIG
GND
C6 F1 VBAT GND
BATTERY
BATT-
BATT+
BATT+ BATT-
R7
CHG+ C5 CHG-
CHG (+) CHG (-)
KX-TGCA20 HANDSET BOARD (Component View)
73
15.3.2. Bottom View
REF-1
LCD
LED9 LED8 LED7
SOFT_A1 SOFT_A2 SOFT_C1 SOFT_C2
UP
TALK1 OFF2
LEFT RIGHT
TALK2 OFF1
DOWN
LED5
LED3
1 2 3
4 5 6
LED2 LED1
7 8 9
AST 0 SHARP
LED4 LED6
SP INT FLASH
MIC
KX-TGCA20 HANDSET BOARD (Bottom View)
74
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
16.1.1. KX-TGC210
2 6
4
PCB1
A
Ref.No. Figure
A
2.6 x 8mm
75
16.1.2. KX-TGC220
4
9
2
10
A
5
3
PCB2
PCB1
11
12
Ref.No. Figure A
A
2.6 x 8mm
76
16.2. Cabinet and Electrical Parts (Handset)

CUSHION RUBBER
*STICK IT WITHIN THE FRAMEWORK ON P.C.B.
115
107
E108
104 B
103 E104
102
E102
101 E101
E103
E107
105
E106
E105
106
112 113
114 (*3)
110 (*2)
109
116
108
Battery cover
111
Spacer (No.113)
Stick it between
ribs.
Put it in the center.

Ref.No. Figure
B
φ 2× 8 mm
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.46).
(*2) The rechargeable Ni-MH battery HHR-4MY is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 113) to the exact location described above.
77
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
200-5
200-2
200-3
200-4
78
16.4. Accessories and Packing Materials

16.4.1. KX-TGC210LA
A1
A2
P1
79
16.4.2. KX-TGC212LA
A101
A102
P101
80
16.4.3. KX-TGC213LA
A202
A201
P201
81
16.4.4. KX-TGC220LA
A301
A302
P301
82
16.4.5. KX-TGC222LA
A401
A402
P401
83
16.4.6. KX-TGC223LA
A502
A501
P501
84
16.5. Replacement Parts List 16.5.1.1.2. KX-TGC220LA

1. RTL (Retention Time Limited)
Note: Safety Ref. Part No. Part Name & Description Remarks
The “RTL” marking indicates that its Retention Time is No.
1 PNKM1543X3 CABINET BODY PS-HB
Limited.
2 PNBC1558Z1 BUTTON, NAVIGATOR KEY ABS-HB
When production is discontinued, this item will 3 PNJK1225Z KEYBOARD SWITCH
continue to be available only for a specific period of 4 PNKE1274Z1 CASE, CHARGE TERMINAL PS-HB
time. 5 PNJT1189Z TERMINAL, CHARGE
This period of time depends on the type of item, and 6 L0AA02A00087 SPEAKER
7 PQHG10729Z RUBBER PARTS, SPEAKER
the local laws governing parts and product retention.
8 PQHR11313Z GUIDE, SPEAKER ASB-HB
At the end of this period, the item will no longer be 9 K2ECYZ000001 JACK, DC
available. 10 PQJJ1T039H JACK, MODULAR
2. Important safety notice 11 PNKF1325Y2 CABINET COVER PS-HB
12 PNHA1013Z RUBBER PARTS, FOOT
Components identified by the mark indicates special CUSHION
characteristics important for safety. When replacing any
of these components, only use specified manufacture's 16.5.1.2. Main P.C.Board Parts
parts. Note:
3. The S mark means the part is one of some identical parts. (*1) When replacing IC611 or X501, make the adjustment
For that reason, it may be different from the installed part. using PNZZTGC220LA. Refer to How to download the
4. ISO code (Example: ABS-94HB) of the remarks column data (P.52) of Things to Do after Replacing IC or X'tal
shows quality of the material and a flame resisting grade (P.52)
about plastics. (*2) When removing ZA1 use special tools (ex. Hot air
5. RESISTORS & CAPACITORS disordering tool).
Unless otherwise specified; (*3) Backside of this IC has a ground plate. Refer to How to
All resistors are in ohms () k=1000, M=1000k Replace the Flat Package IC (P.55).
All capacitors are in MICRO FARADS (F) p=F (*4) Supplied IC is Flat Package Type.
*Type & Wattage of Resistor
16.5.1.2.1. KX-TGC210LA
Type
ERC:Solid ERX:Metal Film PQ4R:Chip
Safety Ref. Part No. Part Name & Description Remarks
ERDS:Carbon ERG:Metal Oxide ERS:Fusible Resistor No.
ERJ:Chip ER0:Metal Film ERF:Cement Resistor
PCB1 PNWPGC210LAH MAIN P.C.BOARD ASS'Y
Wattage (RTL)
10,16:1/8W 14,25:1/4W 12:1/2W 1:1W 2:2W 3:3W (ICs)
IC302 C0DBEYY00102 IC
*Type & Voltage Of Capacitor
IC501 C2HBCY000139 IC (*3)(*4)
Type
IC611 PNWIGC220LAH IC (EEPROM)(*1)
ECFD:Semi-Conductor ECCD,ECKD,ECBT,F1K,ECUV:Ceramic (TRANSISTORS)
ECQS:Styrol ECQE,ECQV,ECQG:Polyester Q111 2SC6054JSL TRANSISTOR(SI) S
ECUV,PQCUV, ECUE:Chip ECEA,ECST,EEE:Electlytic Q141 2SA1776P TRANSISTOR(SI) S
ECQMS:Mica ECQP:Polypropylene Q142 B1ABDM000001 TRANSISTOR(SI) S
Voltage Q161 DSC7003S0L TRANSISTOR(SI)
ECQ Type ECQG ECSZ Type Others Q171 2SC6054JSL TRANSISTOR(SI) S
ECQV Type D142 DY2J25000L TRANSISTOR(SI)
(DIODES)
1H:50V 05:50V 0F:3.15V 0J :6.3V 1V :35V
D101 B0EDER000009 DIODE(SI) S
2A:100V 1:100V 1A:10V 1A :10V 50,1H:50V
2E:250V 2:200V 1V:35V 1C :16V 1J :16V D113 DA2J10100L DIODE(SI)
2H:500V 0J:6.3V 1E,25:25V 2A :100V D133 DA2J10100L DIODE(SI)
D362 B0ECKM000008 DIODE(SI)
(COILS)
16.5.1. Base Unit L501 G1CR10J00010 COIL
L803 G1C2N7Z00009 COIL
16.5.1.1. Cabinet and Electrical Parts (RESISTOR ARRAYS)
RA151 EXB24V102JX RESISTOR ARRAY
16.5.1.1.1. KX-TGC210LA RA611 EXB28V332JX RESISTOR ARRAY S
(VARISTOR)
SA101 J0LE00000047 VARISTOR
Safety Ref. Part No. Part Name & Description Remarks (RESISTORS)
No.
R111 PQ4R10XJ104 100k S
1 PNKM1544X2 CABINET BODY PS-HB
R112 PQ4R10XJ104 100k S
2 PNBC1557Z1 BUTTON, LOCATOR ABS-HB
R113 ERJ3GEYJ103 10k S
3 PNKE1274Z1 CASE, CHARGE TERMINAL PS-HB
R114 ERJ2GEJ473 47k S
4 PNJT1189Z CHARGE TERMINAL PS-HB
5 K2ECYZ000001 JACK, DC
6 PQJJ1T039H JACK, MODULAR
R131 PQ4R18XJ106 10m S
7 PNKF1325Y2 CABINET COVER PS-HB
8 PNHA1013Z RUBBER PARTS, FOOT
CUSHION
R142 PQ4R18XJ272 2.7k S
R145 ERJ2GEJ222 2.2k S
85
Safety Ref. Part No. Part Name & Description Remarks Safety Ref. Part No. Part Name & Description Remarks
No. No.
R151 D0GA104JA021 100k S C863 F1G1H1R5A765 1.5p
R152 ERJ2GEJ134X 130k S C871 F1G1H1R5A765 1.5p
R160 ERJ3GEYJ821 820 S C872 F1G1H1R3A765 1.3p
R162 ERJ3GEYJ473 47k S C873 F1G1H2R0A765 2p
R163 D0GG390JA007 39 C874 ECUE1H150JCQ 15p
R164 ERJ3GEYJ272 2.7k S C895 F1G1H2R0A765 2p
R165 ERJ3GEYJ273 27k S (OTHERS)
R168 ERJ3GEYJ472 4.7k S F301 K5H302Y00003 FUSE
R171 D0GA221JA021 220 S P101 D4DAY220A022 THERMISTOR
R172 ERJ2GEJ684 680k S SW1 K0H1BA000259 SPECIAL SWITCH
R175 D0GA392JA015 3.9k S X501 H0J138500011 CRYSTAL OSCILLATOR
R176 D0GA102JA021 1k S
R177 D0GA102JA021 1k S 16.5.1.2.2. KX-TGC220LA
R321 ERJ2RKF1400 140 S
R322 ERJ2RKF1000 100 S
R331 ERJ2RKF6802 68k S Safety Ref. Part No. Part Name & Description Remarks
No.
R332 ERJ2RKF3302 33k S
PCB1 PNWP1C220LAH MAIN P.C.BOARD ASS'Y
R371 ERJ8GEYJ1R0 1 S
(RTL)
(ICs)
R501 ERJ3GEYJ100 10 S
IC302 C0DBEYY00102 IC
R502 D0GA103JA021 10k S
IC501 C2HBCY000139 IC (*3)(*4)
R503 D0GA103JA021 10k S
IC601 PNWI2C220LAH IC (FLASH)
R504 D0GA103JA021 10k S
IC611 PNWIGC220LAH IC (EEPROM)(*1)
R506 D0GA103JA021 10k S
(TRANSISTORS)
R510 D0GA103JA021 10k S
Q111 2SC6054JSL TRANSISTOR(SI) S
(CAPACITORS)
Q141 2SA1776P TRANSISTOR(SI) S
C101 F1K2H681A008 680p S
Q142 B1ABDM000001 TRANSISTOR(SI) S
C102 F1K2H681A008 680p S
Q161 DSC7003S0L TRANSISTOR(SI)
C111 F1J2A473A024 0.047
Q171 2SC6054JSL TRANSISTOR(SI) S
C112 F1J2A473A024 0.047
Q651 DRC9113Z0L TRANSISTOR(SI)
C113 PQCUV1A684KB 0.68
Q652 DRC9113Z0L TRANSISTOR(SI)
C120 ECUE1H102KBQ 0.001
D142 DY2J25000L TRANSISTOR(SI)
C121 F1K2H681A008 680p S
(DIODES)
C122 F1K2H681A008 680p S
D101 B0EDER000009 DIODE(SI) S
C132 ECUV1H103KBV 0.01
D113 DA2J10100L DIODE(SI)
C142 ECUV1H103KBV 0.01
D133 DA2J10100L DIODE(SI)
C152 ECUE1C103KBQ 0.01
D362 B0ECKM000008 DIODE(SI)
C161 F1K1E1060001 10
(COILS)
C167 ECUV1H102KBV 0.001
L501 G1CR10J00010 COIL
C171 ECUV1C223KBV 0.022
L803 G1C2N7Z00009 COIL
C173 ECUE1A104KBQ 0.1
(RESISTOR ARRAYS)
C175 ECUE1H561KBQ 560p
RA151 EXB24V102JX RESISTOR ARRAY
C176 ECUE0J105KBQ 1
RA611 EXB28V332JX RESISTOR ARRAY S
C178 ECUV1C333KBV 0.033
(VARISTOR)
C184 ECUV1C105KBV 1
SA101 J0LE00000047 VARISTOR
C321 ECUV1C105KBV 1
(RESISTORS)
C341 F2G0J331A146 330
R111 PQ4R10XJ104 100k S
R112 PQ4R10XJ104 100k S
C351 ECUV1C105KBV 1
C502 ECJ1VB0G106M 10 S
C504 ECUE0J105KBQ 1
R131 PQ4R18XJ106 10m S
C506 ECUE0J105KBQ 1
C507 ECUV0J225KBV 2.2
R142 PQ4R18XJ272 2.7k S
C508 ECUE1H100DCQ 10p
R145 ERJ2GEJ222 2.2k S
C509 ECUE1H120JCQ 12p
R151 D0GA104JA021 100k S
C510 ECUE0J105KBQ 1
R152 ERJ2GEJ134X 130k S
R160 ERJ3GEYJ821 820 S
C515 ECUE0J105KBQ 1
R163 D0GG390JA007 39
R164 ERJ3GEYJ272 2.7k S
R168 ERJ3GEYJ472 4.7k S
R171 D0GA221JA021 220 S
C521 ECUE0J105KBQ 1
R175 D0GA392JA015 3.9k S
R176 D0GA102JA021 1k S
C810 F1G1H1R5A765 1.5p
R177 D0GA102JA021 1k S
R321 ERJ2RKF1400 140 S
R322 ERJ2RKF1000 100 S
C820 F1G1H1R5A765 1.5p
R331 ERJ2RKF6802 68k S
86
No. No.
R332 ERJ2RKF3302 33k S X501 H0J138500011 CRYSTAL OSCILLATOR
R372 ERJ8GEYJ1R0 1 S 16.5.1.3. Operational P.C.Board Parts
R501 ERJ3GEYJ100 10 S (KX-TGC220 only)
R502 D0GA103JA021 10k S
R503 D0GA103JA021 10k S
R504 D0GA103JA021 10k S Safety Ref. Part No. Part Name & Description Remarks
R506 D0GA103JA021 10k S No.
R507 D0GA102JA021 1k S PCB2 PNWP2G6821H OPERATIONAL P.C.BOARD
R510 D0GA103JA021 10k S ASS'Y (RTL)
R651 ERJ2GEJ122 1.2k S (LEDS)
R652 ERJ2GEJ122 1.2k S LED901 B3AAB0000347 DIODE(SI)
(CAPACITORS) LED902 B3AAB0000347 DIODE(SI)
C101 F1K2H681A008 680p S
C102 F1K2H681A008 680p S 16.5.2. Handset
C111 F1J2A473A024 0.047
C112 F1J2A473A024 0.047 16.5.2.1. Cabinet and Electrical Parts
C113 PQCUV1A684KB 0.68
C120 ECUE1H102KBQ 0.001
C121 F1K2H681A008 680p S Safety Ref. Part No. Part Name & Description Remarks
C122 F1K2H681A008 680p S No.
C132 ECUV1H103KBV 0.01 101 PNGP1327Z1 PANEL, LCD PMMA-HB
C142 ECUV1H103KBV 0.01 102 PNYE1128Z TAPE, DOUBLE SIDED
C152 ECUE1C103KBQ 0.01 103 PNKM1545V3 CABINET BODY ABS-HB
C161 F1K1E1060001 10 104 PNYE1126Z TAPE, DOUBLE SIDED
C167 ECUV1H102KBV 0.001 105 PNBC1492Y1 BUTTON, NAVIGATOR KEY ABS-HB
C171 ECUV1C223KBV 0.022 106 PNJK1226X KEYBOARD SWITCH
C173 ECUE1A104KBQ 0.1 107 L0AD01A00028 RECEIVER
C175 ECUE1H561KBQ 560p 108 PNHR1757Z GUIDE, SPEAKER ABS-HB
C176 ECUE0J105KBQ 1 109 L0AD02A00026 SPEAKER
C178 ECUV1C333KBV 0.033 110 PNHS1502Z SPACER, SPEAKER NET
C184 ECUV1C105KBV 1 111 PNJC1018Z BATTERY TERMINAL
C321 ECUV1C105KBV 1 112 PNKF1275Z1 CABINET COVER ABS-HB
C341 F2G0J331A146 330 113 PNKK1077Z1 LID, BATTERY ABS-HB
C342 ECUE1A104KBQ 0.1 114 PNHS1466Z SPACER, BATTERY
C351 ECUV1C105KBV 1 115 PNHR1644Z SPACER
C501 ECUE1A104KBQ 0.1 116 PQHG10729Z RUBBER PARTS
C503 ECJ1VB0G106M 10 S 16.5.2.2. Main P.C.Board Parts
C504 ECUE0J105KBQ 1 Note:
C505 ECJ1VB0G106M 10 S (*1) Reconfirm the model No. written on the handset’s name
C506 ECUE0J105KBQ 1
plate when replacing PCB100. Because the model No. of
C508 ECUE1H100DCQ 10p the optional handset may differ from the included handset.
C509 ECUE1H120JCQ 12p (*2) When replacing IC4, IC3 or X1, make the adjustment
C510 ECUE0J105KBQ 1 using PNZZTGC220LA. Refer to How to download the
C511 ECJ1VB0G106M 10 S data (P.52) of Things to Do after Replacing IC or X'tal
C515 ECUE0J105KBQ 1
(P.52)
C516 ECUE1A104KBQ 0.1 (*4) When replacing the handset LCD, See How to
C517 ECUE1A104KBQ 0.1 Replace the Handset LCD (P.46).
C518 ECUE1A104KBQ 0.1 (*5) Backside of this IC has a ground plate. Refer to How to
Replace the Flat Package IC (P.55).
C521 ECUE0J105KBQ 1 (*6) Supplied IC is Flat Package Type.
C650 ECUE1H680JCQ 68p No.
C651 ECUE1H680JCQ 68p PCB100 PNWPGCA20LAR MAIN P.C.BOARD ASS'Y
C652 ECUE1H680JCQ 68p (RTL) (*1)
C810 F1G1H1R5A765 1.5p (ICs)
C811 ECUE1H100DCQ 10p IC1 C1CB00003837 IC (*5) (*6)
C819 ECUE1H100DCQ 10p IC4 C3FBLY000162 IC (*2)
C820 F1G1H1R5A765 1.5p IC7 PNWIGCA20LAR IC (EEPROM)(*2)
C863 F1G1H1R5A765 1.5p (TRANSISTORS)
C871 F1G1H1R5A765 1.5p Q1 B1ADGE000012 TRANSISTOR(SI)
C872 F1G1H1R3A765 1.3p Q2 B1ADCF000040 TRANSISTOR(SI)
C873 F1G1H2R0A765 2p Q3 B1ABGE000011 TRANSISTOR(SI)
C874 ECUE1H150JCQ 15p Q4 B1ADCF000040 TRANSISTOR(SI)
C895 F1G1H2R0A765 2p Q6 2SC6054JSL TRANSISTOR(SI) S
(OTHERS) Q9 UNR9216J0L TRANSISTOR(SI) S
F301 K5H302Y00003 FUSE (DIODE)
P101 D4DAY220A022 THERMISTOR LED1 B3ACB0000216 DIODE(SI)
87
No. No.
LED2 B3ACB0000216 DIODE(SI) C859 ECUE1H100DCQ 10p
LED3 B3ACB0000216 DIODE(SI) C860 F1G1H1R1A765 1.1p
LED6 B3ACB0000216 DIODE(SI) C866 ECUE1A104KBQ 0.1
LED7 B3ACB0000216 DIODE(SI) (OTHERS)
LED8 B3ACB0000216 DIODE(SI) E101 L5DYBYY00067 LIQUID CRYSTAL DISPLAY
LED9 B3ACB0000216 DIODE(SI) (*4)
(RESISTOR ARRAYS) E102 PNHR1950Z PLATE, LCD
RA1 EXB28V271JX RESISTOR ARRAY E103 PNHX1761Z COVER, LCD
RA2 EXB28V681JX RESISTOR ARRAY E104 PNHR1949Z GUIDE, LCD
RA3 EXB24V681JX RESISTOR ARRAY E105 PNJT1142Z CHARGE TERMINAL (L)
RA5 EXB28V332JX RESISTOR ARRAY S E106 PNJT1143Z CHARGE TERMINAL (R)
RA7 EXB24V821JX RESISTOR ARRAY E107 PNVE1015Z BATTERY TERMINAL
(RESISTORS) E108 PQHG10729Z RUBBER PARTS
R1 D0GA103JA021 10k S F1 K5H252Y00002 FUSE
R2 ERJ2GEJ303 30k S MIC100 L0CBAY000053 BUILTIN-MICROPHONE S
R6 D0GA103JA021 10k S X1 H0J103500038 CRYSTAL OSCILLATOR
R7 ERJ2GEJ821 820 S
R8 ERJ8GEYJ4R3V 4.3 S 16.5.3. Charger Unit
R9 ERJ2GEJ303 30k S
R15 D0GA152JA021 1.5k S 16.5.3.1. Cabinet and Electrical Parts
R20 D0GA563ZA006 56k
R23 D0GA102JA021 1k S
R45 D0GBR10JA113 0.1 Safety Ref. Part No. Part Name & Description Remarks
No.
R51 D0GA103JA021 10k S
200 PNLC1055ZB CHARGER UNIT ASS'Y
R52 D0GA103JA021 10k S without NAME PLATE
R53 D0GA332JA015 3.3k S (RTL)
R54 ERJ2GEJ331 330 S 200-1 PNKM1551Y3 CABINET BODY PS-HB
R55 ERJ2GEJ331 330 S 200-2 PNJT1148Z CHARGE TERMINAL PS-HB
R61 D0GA102JA021 1k S 200-3 PNKF1279Z1 CABINET COVER PS-HB
R76 D0GA1R0JA014 1 S 200-4 PQHA10023Z RUBBER PARTS, FOOT
R77 D0GA1R0JA014 1 S CUSHION
(CAPACITORS) 200-5 PNLV233-AZ AC ADAPTOR
C1 EEE0JA221WP 220
C5 ECUV1C104KBV 0.1 16.5.4. Accessories and Packing Materials
C6 ECUV1C104KBV 0.1
C11 ECUE1A104KBQ 0.1 16.5.4.1. KX-TGC210LAB
C15 ECUE1H390JCQ 39p Safety Ref. Part No. Part Name & Description Remarks
C19 ECUE1H102KBQ 0.001 No.
C22 ECUE0J105KBQ 1 A1 PNLV226Z AC ADAPTOR (for Base
C29 ECUE0J105KBQ 1 Unit)
C30 ECUV1A105KBV 1 A2 PQJA10075Z CORD, TELEPHONE
C36 ECUE1H390JCQ 39p P1 PNPK3787005Z GIFT BOX
C43 ECUE1H100DCQ 10p 16.5.4.2. KX-TGC212LAB
No.
C47 ECUE0J105KBQ 1
A101 PNLV226Z AC ADAPTOR (for Base
C52 ECUE0J105KBQ 1 Unit)
C53 ECUV1A225KBV 2.2 A102 PQJA10075Z CORD, TELEPHONE
C55 ECUE1H100DCQ 10p P101 PNPK3794006Z GIFT BOX
C56 ECUE0J105KBQ 1
16.5.4.3. KX-TGC213LAB
C59 ECUE0J105KBQ 1
C70 ECUE1H680JCQ 68p Safety Ref. Part No. Part Name & Description Remarks
C71 ECUE1H680JCQ 68p No.
C78 ECUE1H222KBQ 0.0022 A201 PNLV226Z AC ADAPTOR (for Base
C79 ECUE1H222KBQ 0.0022 Unit)
C91 ECUV1C105KBV 1 A202 PQJA10075Z CORD, TELEPHONE
C92 ECUV1C105KBV 1 P201 PNPK3804003Z GIFT BOX
C93 ECUV1C105KBV 1
C94 ECUV1C105KBV 1 16.5.4.4. KX-TGC220LAB
C95 ECUV1C105KBV 1
C96 ECUE0J105KBQ 1
C98 ECUE1H100DCQ 10p Safety Ref. Part No. Part Name & Description Remarks
C99 ECUE1H100DCQ 10p No.
C190 ECUE1A104KBQ 0.1 A301 PNLV226Z AC ADAPTOR (for Base
Unit)
C191 ECUE0J105KBQ 1
A302 PQJA10075Z CORD, TELEPHONE
88

No.
P301 PNPK3787006Z GIFT BOX
16.5.4.5. KX-TGC222LAB

No.
Unit)
16.5.4.6. KX-TGC223LAB

No.
Unit)
16.5.5. Screws

No.
A XTB26+8GFJ TAPPING SCREW
B XTB2+8GFJ TAPPING SCREW
16.5.6. Fixtures and Tools

Note:
(*1) See Equipment Required (P.47), and The Setting
Method of JIG Connections (Handset)(P.48).
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.46).

No.
PQZZ1CD300E JIG CABLE (*1)
PNZZTGC220LA BATCH FILE CD-ROM (*1)
PQZZ430PIR TIP OF SOLDERING IRON
(*2)
PQZZ430PRB RUBBER OF SOLDERING IRON
(*2)
MIN
KXTGC210LAB
KXTGC212LAB
KXTGC213LAB
KXTGC220LAB
KXTGC222LAB
KXTGC223LAB
KXTGCA20LAB
89

KXTGC 210 Lab

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KXTGC 210 Lab

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KX-TGC220 (Charger Unit)

Configuration for each model

© Panasonic System Networks Co., Ltd. 2014

IMPORTANT SAFETY NOTICE

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

16.5. Replacement Parts List --------------------------------- 85

• ICs and LSIs are vulnerable to static electricity.

2.2. About Lead Free Solder (PbF: Pb free)

2.2.1. Suggested PbF Solder

0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

2.3. Discarding of P. C. Board

Mass (Weight) Approx. 100 g (*1) Approx. 130 g Approx. 100 g

4.1.1. TDD Frame Format

DATA rate : 1.152 Mbps

4.1.2. TDMA system

Traffic Bearer Dummy bearer

4.1.3. Signal Flowchart in the Radio Parts

As for a handset RF, RF signal is received in one antenna.

As for a base unit RF, RF signal is received in two antennas.

Operational P.C. Board

KEYS Q161 R151,R152 R131, R133 D101

ANT 1 TEL JACK

IC601 IC611 R371

KX-TGC210/212/213/220/222/223 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

KX-TGC210/212/213/220/222/223 BLOCK DIAGRAM (Base Unit_RF Part)

4.4. Circuit Operation (Base Unit)

TDD & TDMA ADPCM

EEPROM IC611 Keys/ LEDs/ Charge *1 Flash Memory IC601 *1

*1 for KX-TGC220 only

4.4.1. BBIC (Base Band IC: IC501)

4.4.2. Flash Memory (IC601)(for KX-TGC220 only)

4.4.3. EEPROM (IC611)

4.4.4. Power Supply Circuit/Reset Circuit

IC302 VBAT IC501 IC601

BBIC chip initialize

4.4.4.1. Charge Circuit

4.4.5. Telephone Line Interface

R172 C173 R177 R164 R161

0.1u 1k 2.7k 100k

C102 680p *P101 L1R

R121 390k C121 680p

R122 390k C122 680p

4.4.6. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Parallel connection detection when off hook:

detecting the voltage changes.

4.4.7. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Single message format

month day hour minute number

Plural message format

DATA CODE NAME month day hour minute number

Call Waiting Caller ID

BBIC L1T Telephone "FSK"

4.6. Circuit Operation (Handset)

4.6.2. Power Supply Circuit/Reset Circuit

4.6.3. Charge Circuit

4.6.4. Battery Low/Power Down Detector

4.7. Signal Route

ICM PLAY TO IC601 - IC501(73/74 - 29/31) - SPEAKER

CALLER ID T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)

BELL DETECTION T/R(TEL LINE) - P101 - R111/R112 - C111/C112 - Q111 - IC501(5)

RF part signal route

EEPROM IC611 Keys/ LEDs/ Charge 1 Flash Memory IC601 1