TI Designs: TIDA-01613

CISPR 22 Class-B Compliant Display Bias IC Reference

Design

Description Features
This reference design aims to help designers be • Tested for CISPR 22 Radiated Emissions
compliant with EMI regulations of industrial display • Input Voltage Range: 1.8 V to 6 V
applications. Radiated emission compliance according • Output Voltage Range for Source Driver:
to CISPR 22 Class B (also known as EN 55022) can Up to 15 V
be achieved by following important layout rules.
• Positive Output Voltage for Gate Driver: Up to 30 V
The main subject of this design is to classify, optimize,
and measure radiated emission. This reference design • Negative Output Voltage for Gate Driver:
integrates a four-layer board with a 3.3-V power supply Down to –15 V
using the TPS65150 LCD bias device. The device • Space-Optimized Board Layout
offers all three voltages to drive a thin-film transistor
(TFT) LCD supplied from voltages in the area of a Applications
single-cell battery (1.8 V to 6 V). • Industrial Monitors
• Panel PLCs
Resources
• HMI
TIDA-01613 Design Folder • Lab Instrumentations
TPS65150 Product Folder
• Medical Monitors (MRT, CRT, Bedside Patient
Monitors)

ASK Our E2E™ Experts

LCD Bias TPS65150 TCON Board

Boost VS
VS Gamma Buffer

VCOM
VI VCOM Buffer
1.8 V to 6 V
FPC
Charge Pump
VGH, VGL
Source Driver (Left)

VGH, VGL
Gate Driver

Timing FPC
LVDS/RGB Controller TFT LCD Panel
(TCON)

Signal Chain
Power Chain LED Backlight Driver
Optional
Copyright © 2017, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other
important disclaimers and information.

TIDUDP8 – January 2018 CISPR 22 Class-B Compliant Display Bias IC Reference Design 1
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
System Description www.ti.com

1 System Description
This reference design comes with a 66-mm × 55-mm board that integrates the TPS65150 device and its
external circuitry. Jumpers across the board connect the power supply of typically 3.3 V and as well the
loads of the three required output voltages V(VS), V(VGH), and V(VGL). V(VS) is the supply voltage for the source
driver. V(VGH) and V(VGL) are the control voltages of the TFTs integrated in the gate driver. The design is
done with following considerations:
• The input voltage is provided by a linear power supply, simulating the normal operation of a single
lithium-ion battery.
• The output voltages and load conditions are defined such that it represents typical LCD application
requirements.
• The design must be compliant with the CISPR 22 industrial standard for radiated emissions.
• The layout must be optimized to minimize the noise floor as well as to keep the footprint as small as
possible.

1.1 Key System Specifications

Table 1. Key System Specifications

PARAMETER COMMENTS MIN TYP MAX
VI Input voltage; typically one-cell lithium-ion battery voltage range 1.8 V 3.3 V 6V
BOOST CONVERTER: SOURCE DRIVER SUPPLY VOLTAGE
V(S) Boost converter output voltage range 10 V 15 V
IDS Switching current limit 2A 2.5 A 3.4 A
f(SW) Switching frequency 1.02 MHz 1.2 MHz 1.38 MHz
NEGATIVE CHARGE PUMP: GATE DRIVER TURNOFF VOLTAGE
V(VGL) output voltage range of the negative charge pump –5 V –2 V
d(DRVN) Duty cycle for the DRVN pin 50%
POSITIVE CHARGE PUMP: GATE DRIVER TURNON VOLTAGE
V(VGH) Output voltage range of the positive charge pump 23 V 30 V
d(DRVP) Duty cycle for the DRVP pin 50%
BACKPLANE VOLTAGE: V(VCOM)
VISR Single-ended input voltage (IN) 2.25 V V(VS) – 2 V
IOM Maximum output current (V(S) = 10 V) 0.65 A

2 CISPR 22 Class-B Compliant Display Bias IC Reference Design TIDUDP8 – January 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
www.ti.com System Overview

2 System Overview

2.1 Block Diagram

LCD Bias TPS65150 TCON Board

Boost VS
VS Gamma Buffer

VCOM
VI VCOM Buffer
1.8 V to 6 V
FPC
Charge Pump
VGH, VGL
Source Driver (Left)

VGH, VGL

Gate Driver
Timing FPC
LVDS/RGB Controller TFT LCD Panel
(TCON)

Signal Chain
Power Chain LED Backlight Driver
Optional
Copyright © 2017, Texas Instruments Incorporated

Figure 1. Block Diagram of LCD Subsystem

Figure 1 shows an overview of an LCD subsystem. The main driving PCB for the display, often called a
timing controller (TCON) board, includes the LCD bias device that provides the power rails for the source
and the gate driver. The TCON processes the picture information and controls the source and the gate
drivers. Dependent on the performance requirements, it is sometimes required to provide a gamma
correction provided by the gamma buffer. This reference design focuses on the LCD bias part and
operates with the typical load condition described in Section 3.2.2.

2.2 Highlighted Products

2.2.1 TPS65150
This reference design uses the TPS65150 device to provide up to a 500-mA output current on the boost
converter. For the CISPR 22 measurements, the load is 250 mA (DC).
The device switches typically at 1.2 MHz during forced pulse-width modulation (PWM) for all load
conditions. For industrial designs, the switching frequency is not as important as for automotive designs;
however, higher switching frequencies allows to reduce the component size of the external components.
The device uses a virtual-synchronous topology that allows the boost converter to operate in continuos
conduction mode (CCM) even at light load conditions. Designs with devices that do not include this feature
enter discontinuous conduction mode (DCM) or PFM, which broadens the frequency spectrum as the
current edges get steeper, resulting in more harmonics.
The device features a soft-start function that limits the input current peaks during start-up. This feature
also positively affects the radiated EMI peaks in applications requiring regular power on and off cycles.
The CISPR 22 measurements of this reference design do not cover the start-up behavior.
The device features a gate voltage shaping functionality, which reduces the gate driver's turnon voltage
(V(VGH)) between the lines. As the turnoff slope of the gate driver voltage (V(VGH)) gets smoother, it also
narrows the frequency spectrum, thereby reducing EMI.
The device integrates a thermal PowerPAD™ that needs to be connected to the ground layer of the PCB.
Reduce the effect of all noise sources by providing a low-impedance path to ground for EMI currents.

TIDUDP8 – January 2018 CISPR 22 Class-B Compliant Display Bias IC Reference Design 3
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
System Overview www.ti.com

SW

SUP
FB ±
Sawtooth Q2
Generator
1.146 V + V(VIN)

COMP Current
Control
Limit
1.2 MHz Logic
&
&
FBP Soft
Gate
V(SUP) Start
Drivers

± Q1
I(DRVP)
Current
Control +
1.214 V
DRVP PGND
&
Soft
Q3 Start 1.2 MHz
CPI

Q5

Control
FBN Logic Q7
VGH
V(SUP)
±
Current Q6
Q4
Control +
V(FBP) power good &
& 200 µA
DRVN UVLO
Soft
Start 1.2 MHz
I(DRVN) ADJ

CTRL

Boost converter soft start completed

&
VIN
GD
V(FB) power good
5 µA
1.213 V delay 1
DLY1
REF
References, 1.213 V
Control Logic,
Oscillator,
5 µA 1.146 V
1.213 V delay 2 Sequencing,
Fault Detection &
DLY2 Thermal Shutdown 1.2 MHz

V(SUP)
Soft Start
GND
Q11
0.69VI fault ±
FDLY VCOM
+
450 k Q12
Disable

IN

Figure 2. Block Diagram of TPS65150

4 CISPR 22 Class-B Compliant Display Bias IC Reference Design TIDUDP8 – January 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
www.ti.com System Overview

2.3 Industrial EMC and EMI Standards

Several committees define standards important for industrial equipments. The main committees widely
used are the CISPR 22 and FCC Part 15. CISPR is part of the international organization IEC and widely
used for electromagnetic compatibility of Information Technology Equipments (ITE). In the European
Region, this standards is defined as EN 55022. In the American Region, a similar standard is used the
FCC Part 15.
CISPR 22 differentiates between Class A and Class B equipment and gives figures for conducted and
radiated disturbances for each class.
This reference design only covers the radiated compliance, so the according limits are used. The
frequency band examined spans from 30 MHz to 1 GHz.

Table 2. CISPR 22 Class B 3-Meter Radiated EMI Limits

FREQUENCY OF EMISSIONS (MHz) FIELD STRENGTH LIMIT (dBmV/M)
30 to 216 40
216 to 960 46.0
Above 960 54.0

Regarding the limits for radiated emissions, both standard CISPR 22 and FCC Part 15 are very close to
each other and for these considerations can be seen as the same.

TIDUDP8 – January 2018 CISPR 22 Class-B Compliant Display Bias IC Reference Design 5
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Hardware, Testing Requirements, and Test Results www.ti.com

3 Hardware, Testing Requirements, and Test Results

3.1 Required Hardware

This section provides considerations on the design of the PCB to make it compliant with CISPR 22 Class
B limits.

3.1.1 Layout Considerations

The main energy transmission is routed on the power signal path of the boost converter. Therefore, it is
the most important topic to minimize the emission generated by the switching of the boost converter.
1. Place the rectifier diode very close to the device (use thick and short traces).
2. Place the input and output (+ small bypass) capacitors close to the device.
3. Keep GND routes from the input to output capacitors short; GND pads from the input to output
capacitors must be connected on the same layer, not through vias.
4. Use a four-layer board stack to fill the second and fourth layer purely with GND.
5. Place charge pump components close to the device (use short and thick traces).
C26
R26
J1
1 VIN L1 5.6
Vin 5V 220pF
2
3
S+ R14
4 C0 3.9uH
5 47µF C1 C4 C27 U1 2. D1 0
6 22µF 22µF 0.1µF 4 5 SW
GND VIN SW
6
SW Q1
CPI 16 1 FB 1. J2
CPI FB R15
GND GND GND GND GND 9 SUP VSSUP 2 3 VS 1
SUP VS
R7 33.0k C6 470pF 22
COMP 0 2
J10 DRVP 17 DRVP 3
VIN R12 C2 C21 C23 R13 C19 S+
1 FBP 12 FBP 4
CTRL

1
2 GND 13 0 22µF 22µF 0.22µF 1.00M 1µF 5
GND CTRL GND
DRVN C14
CPI

3 18 6
D RVN
10 21 FBN 1µF
VCOM FBN
20 REF
REF
14 R5 GND
ADJ
GND 2 15 VGH 1.00M R1 C5 GND R11 GND
DLY1 VGH
3 DLY2 GND 430k 33pF 100k
J5 24 FDLY GD 23 GD FB GD
1 VCOM C9 R4 R6
VCOM C10 C7 C28 C16 150k 56.0k
2 25 0. 22µF
EP
3 68pF 0. 01µF 0.01µF 0.1µF 19 3. R2
GND
4 C25 7 56.0k
GND PGND
1µF VIN 11 8 GND
IN PGND
GND GND GND GND
TPS65150P WP
R3
GND GND R8 R9 620k GND
VSSUP
510k 510k
C15
GND GND
1000pF
GND
C24
VS R10
0
0.33µF
C11
D3 GND

0.33µF
2X C13

0.33µF
C12
SW D4 GND
0.33µF
CPI 5 6 2X C20
3 4 3X
1 2 4X
0.33µF
J11 C18
SW GND
D5
0.33µF

4X

C17
0.33µF

GND

VGL 1
VGL
2
C3 3
C8 0.33µF 4
GND
D2
J3
0.33µF GND

GND

GND
VGH 1
2
VGH
3
4
GND
J4

GND
Copyright © 2017, Texas Instruments Incorporated

Figure 3. Schematic of Correct Routing

6 CISPR 22 Class-B Compliant Display Bias IC Reference Design TIDUDP8 – January 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
www.ti.com Hardware, Testing Requirements, and Test Results

Figure 4. Layout of Correct Routing

TIDUDP8 – January 2018 CISPR 22 Class-B Compliant Display Bias IC Reference Design 7
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Hardware, Testing Requirements, and Test Results www.ti.com

3.2 Testing and Results

3.2.1 Test Setup

The method to measure the radiated disturbance is stated in the official CISPR 22 document (CISPR
22:2005). The tabletop equipment addressed in this reference design can be graphically summarized in
Figure 5.
• DUT: Device under test
• PS: Linear power supply provided
• Antenna used for whole frequency range: Log periodic
• Cable to DUT: Four-wire twisted shielded cable
• Connector to DUT: Direct closed-jumper
• Load on DUT: Resistive load PCB

0.1 m

Non-conductive table

DUT placed in the

middle of the table
DUT 3m

Shielded
cable
0.2 m
Antenna
PS (linear)

Mains power provided

without mains filter

Figure 5. Test Arrangement for Tabletop Equipment According to CISPR 22

8 CISPR 22 Class-B Compliant Display Bias IC Reference Design TIDUDP8 – January 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
www.ti.com Hardware, Testing Requirements, and Test Results

Figure 6 and Figure 7 show the setup for radiated emissions. Figure 6 facilitates the setup of the DUT and
the power supply. Figure 7 shows the absorbing chamber with the antenna.

Figure 6. Test Setup: View With Antenna

Figure 7. Test Setup: View of DUT With Power Supply

The theoretical method of measurement slightly differs with the actual setup as the power supply in the
testing has been provided without an artificial mains filter (AMN).

TIDUDP8 – January 2018 CISPR 22 Class-B Compliant Display Bias IC Reference Design 9
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Hardware, Testing Requirements, and Test Results www.ti.com

3.2.2 Test Conditions of DUT

To provide a test setup relevant to the system, the output load conditions are chosen such that it
represents a normal operating mode of a middle-sized industrial display.
• VI = 3.3 V
• V(VS) = 12 V at IO(VS) = 250 mA
• V(VGH) = 27 V at IO(VGH) = 25 mA
• V(VGL) = –8 V at IO(VGL) = 25 mA
• GVS disabled
• V(VCOM) not loaded

3.2.3 Test Results

Figure 8 shows the result of the test.

Figure 8. CISPR 22 Class B of TPS65150 Measurement Result

10 CISPR 22 Class-B Compliant Display Bias IC Reference Design TIDUDP8 – January 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
www.ti.com Design Files

4 Design Files

4.1 Schematics
To download the schematics, see the design files at TIDA-01613.

4.2 Bill of Materials

To download the bill of materials (BOM), see the design files at TIDA-01613.

4.3 PCB Layout Recommendations

For PCB layout recommendations, see Section 3.1.1.

4.3.1 Layout Prints

To download the layer plots, see the design files at TIDA-01613.

4.4 Altium Project

To download the Altium project files, see the design files at TIDA-01613.

4.5 Gerber Files

To download the Gerber files, see the design files at TIDA-01613.

4.6 Assembly Drawings

To download the assembly drawings, see the design files at TIDA-01613.

5 Software Files
To download the software files, see the design files at TIDA-01613.

6 Related Documentation
1. CUI Inc., Electromagnetic Compatibility Considerations for Switching Power Supplies
2. Texas Instruments, Test Report For PMP15013
3. Texas Instruments, Layout Tips for Radiated EMI Reduction in Your Designs

6.1 Trademarks
E2E, PowerPAD are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.

TIDUDP8 – January 2018 CISPR 22 Class-B Compliant Display Bias IC Reference Design 11
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated