Hardware Specifications

Motor Driven Card Reader/Writer

V2XF-11**-**** Series

RoHS Compliant

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2

 Exclusion clause

-The performance and life of ACT shutter (*1) unit are not guaranteed for all card fishing fraud (*2).
-The performance and life of ACT shutter unit are not guaranteed when the other media such as non-ISO/IEC 7810
standard card, metal plate and so on are inserted.

*1:See section 0. 7 Shutter unit (page.4) for more information about ACT shutter.
*2:Regarding the applicable module for ACT, see Applicable Card Reader / Writer.

Table of Contents

I. Introduction I
II. Applicable Card Reader / Writer I
III. Reference Standards II
IV. Notice for IC card (ICC) II
1 General Specifications 1
2 Applicable IC card specifications 1
3 Applicable SAM chip 2
4 Applicable magnetic card 3
5 Applicable contactless card 3
6 CIM/MM unit 3
7 Shutter unit 4
8 Recovery process of "Power Shutdown" 4
9 Required power supply 5
10 Environmental conditions 5
11 EMI/EMS 5
12 General performance 6
13 Life and Reliability 6
14 Electronic interface 7
15 Software interface 8
16 Response to Regulated Chemical Substances 8
17 Correct usage for safety 8
18 Hardware Overview 9
19 Circuit block diagram 13
20 Appendix A 15
21 Appendix B 16
22 Appendix C 18

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2

[Specification History of Modification]

Rev Date Page Content

A0 May.30.2002 First edition is created for specification of mass production revision.
A1 June.26.2002 1 1 [6] Notice. The word “type1” is added into a paragraph.
B Jan. 7. 2003 I II. Applicable Card Reader / Writer.
New module “021S” is added into the table
II IV. A series of documents released by HITACHI-OMRON TERMINAL
SOLUTIONS
“Upgrade Parts List” is added into Maintenance Document List.
2 4 CIM/MM unit [2]
Comment for the optional mounting parts for CIM / MM is added.
6, 7 14 Hardware Overview
Position of the CIM/MM Optical Sensor is indicated in the drawing.
B1 Feb.19.2003 6, 7 14 Hardware Overview
The turn of the drawings of Type 1 and 2 is replaced.
Dimensions of Connectors are revised according to the product.
B2 Jan.19.2004 6 Addition of caution label
B3 Jan.19.2004 6 Addition of screw hole
C Feb.27.2004 I II. Applicable Card Reader / Writer.
New module “AP1” is added into the table
II, 1 2 Applicable IC card specifications
EMV4.0 approval information is added.
C1 Mar.9.2004 cover page, Cover page
6 The division name is changed.
14 Hardware Overview
The position of causion label is changed in the drawing.
C2 Nov.2.2004 cover page, The company name is changed.
II, 2
II, 3.[1] Reference Standards
3.[2] Magnetic Coercivity Standards
C3 Feb.3.2005 I II. Applicable Card Reader / Writer.
New module ”002S” is added into the table
I II. Applicable Card Reader / Writer.
The description of SAM is changed from “Y“/“N“ to the number of
sockets
2 “Applicable SAM chip” is added.
10 Outline Dimensions for 5 SAM is added.
11 SAM board is added in the Parts location.
12 5 SAM unit is added in the Circuit block diagram.
16 Appendix B
Table 2 for F and B of SAM is added.
D Mar.15.2005 I II. Applicable Card Reader/Writer
ACT type is added.
Shutter column in added in the table.
II IV. A series of documents released by HITACHI-OMRON TERMINAL
SOLUTIONS
ACT Maintenance Manual is added.
3 6. Shutter unit
The contents of ACT is added.
5 12. Life and Reliability
ACT function life is added.
8 [1] Outline Dimensions for Height 95 mm [Type1]
NOTE 4. is added.
13 16.Circuit block diagram
[2] With ACT Shutter Unit is added.
17 19. Appendix C is added.
D1 May.30.2005 Cover page Document name is revised.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2

 Rev Date Page Content
D2 Aug.30.2005 1 f is clarify in Appendix B
10 SAM locations are added
11 SAM PCB is added
12, 13 The note of “5 SAM model only” is added
D3 Sep.9.2005 I, 1 The note is added “V2XF-11JL-002S should not be installed
up-side-down”
D4 Sep 15.2005 1 The note is moved to [6]
1, 3 Destinations of the link are corrected
7 The life of ACT is removed
7 The document number for each model is added
8, 9, 10 Tolerances are added
10 The note of “Type 1” for 5SAM model is added
12, 13 Power Supply are added
E Dec.18, 2006 7 Add the “Chapter 15: Response to Regulated Chemical Substances”.
“Chapter No.” is changed after “Chapter 15”.
3 Sentence associated with shutter is changed.
F Aug.18, 2008 I II. Applicable Card Reader/Writer
New module “008S” is added into the table
Contactless type is added.
III Reference Standards
References are updated
3 “Applicable contactless card” is added.
5 8.Recovery process of "Power Shutdown".[2].(5)
The behavior of contactless data in power failure is added
5 11.EMI/EMS
[3] R&TTE Directive is added
6 13.[2] Reliability
(3) Error rate (Contactless card) is added
7 14[2].(2)Power supply connector
The note is added
8 15.Software interface[1]
New module “008S” is added
9 “Correct usage for safety” is added.
13 [4] Parts location
Sentence associated with Antenna is changed.
14 19. [1] With Normal Shutter Unit
With Contactless Unit is added
15 19. [2] With ACT Shutter Unit
With Contactless Unit is added
9,10,11 18. [1][2][3] Outline dimensions are changed.
G Nov.26, 2008 18,19,20 “COVER, SHUTTER” is added to avoid miss-operation of shutter
opening by an operator.
Cover page Header, footer, corporate logotype change
G1 Feb 19,2009 5 Addition of Environmental Condition [3][4][5][6]
9,10,11,18 Connector position correction
G2 Mar 29, 2009 2 Supported synchronous IC card is added

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2

I. Introduction
This specification shows the product specifications about V2XF series Card Reader Writer whose communication
interface is RS232.

II. Applicable Card Reader / Writer

Magnetic write/read *1 IC card Mounting Contact

Comm. Shutter
Controller SAM Bracket less Module Name
I/F *7
Coercivity Tr 1 Tr 2 Tr 3 *3 *5 *11
1 LoCo R/W R/W R/W Y *2 RS232 1 B/L*8 Type 1 N V2XF-11JL-001S
2 LoCo R/W R/W R/W Y RS232 5 B/L Type 1 N V2XF-11JL-002S
*10
3 LoCo R/W R/W R/W Y RS232 1 B/L Type 2 N V2XF-11JL-001
4 LoCo R/W R/W R/W N *6 RS232 0 B/L Type 1 N V2XF-11L-021S
5 LoCo R/W R/W R/W Y RS232 1 B/L Type 2 N V2XF-11JL-AP1
6 LoCo R/W R/W R/W Y RS232 1 ACT*9 Type 2 N V2XF-11JI-031
7 LoCo R/W R/W R/W Y RS232 1 ACT Type 1 N V2XF-11JI-031S
8 LoCo R/W R/W R/W Y RS232 1 B/L Type 1 Y V2XF-11JL-008S

*1 R/W : Magnetic reading and writing function

*2 Y : Provided
*3 PIN position : Eight contacts for C1 to C8 are provided (Middle position). See 20
Appendix A
*4 : Obsolete
*5 Mounting bracket : Type 1 is model whose height is 95mm, Type2 is 90mm.
See.18 Hardware Overview
*6 N : NOT Provided
*7 Shutter : Shutter function.
*8 B/L : Blade Lock shutter (Standard type).
*9 ACT : Blade Lock shutter with ACT (Advanced Card Trap-proof).
*10 V2XF-11JL-002S : This model should not be installed up-side-down.
*11 Contact less The capability to communicate between contactless card and the C/R
depends on applicable contactless card and the environment where the
metal objects such a reject box are set in.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 I

III. Reference Standards
- ISO/IEC 7816-1:1998
Identification cards -- Integrated circuit(s) cards with contacts
-Part 1: Physical characteristics
- ISO/IEC 7816-2:1999
Identification cards -- Integrated circuit(s) cards with contacts
-Part 2: Dimensions and location of contacts
- ISO/IEC 7816-3:2006
Identification cards - Integrated circuit(s) cards with contacts
- Part 3: Electronic signals and transmission protocols
- ISO/IEC 7810: 2003-11-01
Identification cards - Physical characteristics
- ISO/IEC 7811-1: 2002
Identification cards - Recording technique
- Part 1:Embossing
- ISO/IEC 7811-2: 2001
Identification cards - Recording technique
- Part 2:Magnetic stripe - Low coercivity
- ISO/IEC 7811-6: 2001
Identification cards - Recording technique
- Part 6:Magnetic stripe - High coercivity
- ISO/IEC 14443-1: 2000
Identification cards - Contactless integrates circuit(s) cards – Proximity cards -
- Part 1:Physical characteristics
- ISO/IEC 14443-2: 2001
Identification cards - Contactless integrates circuit(s) cards – Proximity cards -
- Part 2:Radio frequency power and signal interface
- ISO/IEC 14443-3: 2001
Identification cards - Contactless integrates circuit(s) cards – Proximity cards -
- Part 3:Initialization and anticollision
- ISO/IEC 14443-4: 2001
Identification cards - Contactless integrates circuit(s) cards – Proximity cards -
- Part 4:Transmission protocol
- ISO/IEC 18092: 2004
Information technology - Telecommunications and information exchange between systems -
Near Field Communication -- Interface and Protocol (NFCIP-1)
- EMV2000 Integrated Circuit Card Specification for Payment Systems Book 1
Application Independent ICC to Terminal Interface Requirements
EMV 4.0: December, 2000
- GIE-CB :
Specification du coupleur Cartes Bancaires <CB> V2.0
- ZKA Version 3.0 02.04,1998
Schnittstellenspezifkation fur die ec-Karte mit Chip

IV. A series of documents released by HITACHI-OMRON TERMINAL SOLUTIONS

- V2X Series Card Reader/Writer Data Transmission Specifications:
- Maintenance Document List : consists of
Maintenance Parts List, Replacement Manual, Adjustment Manual, Periodic Maintenance Manual,
Troubleshooting, Maintenance Tool List and Parts List, Upgrade Parts List, ACT Maintenance Manual

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 II

1 General Specifications
[1] External dimensions
Type1 Type2
Width 108 +/- 1 mm 124 +/- 1 mm
Height 95 +/- 1 mm 90 +/- 1mm
Length 214.2 mm +/- 1 mm 214.2 mm +/- 1 mm
The length of 4.2mm is projection of D-SUB connector from the edge of
PCB. (See 18 Hardware Overview)
In case that it is installed up-side-down, the height of insertion keeps the
same level (except V2XF-11JL-002S).
[2] Weight Approx. 2 kg
[3] Card transport method Motor driven
[4] Card ejection direction Front and rear directions
[5] Card transport speed 200 +/- 10% or about 300 mm/s selectable by command
300 mm/s is set as the default speed.
Approx.50 mm/s in IC Card handling.
[6] Position of installation Upright or downward position can be installed.
V2XF-11JL-002S should not be installed up-side-down.

Notice
In case of fixing a screw on the bottom mounting bracket at the shutter solenoid for installing type1 V2XF
to the ATM plate, please notice that the length of screw striking into V2X from the outer surface does not
exceed 4 mm.

[7] Card position detection Photo sensor at 4 places. The state of all sensors can be retrieved by
a command from the Host.
[8] Retrieval A card can be retrieved by a command from the host when the card is
not pulled out within an interval time.
[9] Reject Box
(1)Installation The reject box can be mounted at the rear of V2X
The reject box is prepared by our customers.
(2)Rejected cards number Can be reported by a command from the Host.

Notice
The positioning sensor might be interfered by the light, which enters through the inlet if V2X is installed
with the inlet faced to the direction of the object, which emits the light. The luminous intensity at which the
light is thrown directly through the inlet should be at the inlet position within 10000 luxes.

2 Applicable IC card specifications

[1] Number and location of contacts on IC card
Number and location of contacts on IC card are specified in ISO 7816-2 figure 2 (see 0 20 Appendix A).
[2] IC card specifications
(1) Asynchronous card
1) Support IC cards In conformity to ISO7816-1/2/3, EMV4.0
2) Protocol T=0 and/or T=1
(Automatic protocol type selection via ATR detection is possible.)
3) Data byte reading/writing Inverse convention (MSB first, negative logic) and
direct convention (LSB first, positive logic) are available.
4) Clock during ATR*1 In conformity to ISO / IEC 7816-3 (3.57MHz)
5) Clock after ATR Ditto
6) Communication speed*2 1etu = (F/D)X1/(fX106) sec
D=1:(Default) / 2, 4:(Changeable by PPS)
F=372:(Default)
The combination of F and D is described in the 21 Appendix B
7) Vcc Both 3V and 5V
(Automatic selection via T=15 of ATR detection is possible.)
8) Vpp Not connected
9) EMV Approval EMV4.0 Level 1 Approved (11622 0303 400 20 FIM)

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(1/20)
 (2) Synchronous card
1) Support IC cards In conformity to ISO7816-1/2/10, SLE4418/4428/4432/4442,
and AT24C01ASC/AT24C02SC/AT24C16SC/AT24C64SC
2) Vcc 5V
3) Vpp Not connected
*1 Answer To Reset
*2 Communication speed can be changed by PPS procedure.
[3] IC card Handling
(1) The contact mechanism is pulled down and IC contacts station is pushed down onto IC card when a
card is transported to the proper position.
(2) The state of the IC contact echo sensor can be checked by a command from the Host.
(3) The resistance between IC contact on card and one on Card Reader / Writer is 500 milliohm or less.

Notice for IC card (ICC)

HITACHI-OMRON TERMINAL SOLUTIONS standard ICC controller and FW (firmware) can’t execute
perfectly all customers ICC(s) because ISO standard and ICC(s) are modified frequently. HITACHI-OMRON
TERMINAL SOLUTIONS will check your customer’s ICC based on IC and its available specification that will
be provided by you to HITACHI-OMRON TERMINAL SOLUTIONS.

3 Applicable SAM chip

[1] Number and location of SAM Sockets
A SAM board is equipped with shipment that has one or five SAM sockets depend on the model.
[2] SAM chip specification
1) Support SAM chips
2) Protocol
3) Data byte reading/writing
4) Clock during ATR
5) Clock after ATR
6) Communication speed*1
7) Vcc
8) Vpp
In conformity to ISO/IEC 7810(ID000), ISO/IEC 7816-1/2/3
T=0 and/or T=1
(Automatic protocol type selection via ATR detection is possible.)
Inverse convention (MSB first, negative logic) and direct convention
(LSB first, positive logic) are available.
In conformity to ISO/IEC 7816-3 (3.57MHz)
In conformity to ISO/IEC 7816-3 (3.57MHz)
1etu = (F/D)X1/(3.57X106) sec
The combination of F and D is described in the 21 Appendix B *2
Both 3V and 5V
(Automatic selection via T=15 of ATR detection is possible.)
Not connected

*1 Communication speed can be changed by PPS procedure.

*2 Some cards will not work perfectly, it is necessary to check in Hitachi-Omron Terminal Solution
Corporation.
[3] SAM chip Handling
(1) The SAM chip is installed and uninstalled to the socket on the SAM PCB on the top of
Card Reader/Writer.
(2) The SAM socket should be locked stably in operation.
(3) The state of the SAM chip can be checked by a command from the Host.
(4) The chip should be set and removed when power is off basically.

When it is hard to attach or detach a chip, it is recommendable the upper plate is detach.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(2/20)
4 Applicable magnetic card
[1] Magnetic card type In conformity to ISO/IEC 7811-1/2/6
[2] Magnetic card coercivity ISO/IEC 7811-2/6
LoCo Read/Write default supported
HiCo Read default supported
[3] Reading function Read specified tracks simultaneously.
[4] Magnetic recording method Two-Frequency Recording Method (F2F)
[5] Magnetic R/W head Structure: Single Gap Head
Material: Permeability alloy + Ceramic Block
Width of Tracks 3 mm (Writing)
1 mm (Reading)
[6] Recording
ISO Track 1 ISO Track 2 ISO Track 3
Density (bpi) 210 75 210
Capacity (char.) *1 Max. of 79 Max. of 40 Max. of 107
Length Variable Variable Variable
Character structure (bits/char.) 7 5 5
*1 Including SS, ES and LRC

5 Applicable contactless card

[1] Contactless card specifications
(1) Support contactless cards
(2) Clock during ATQ*1
(3) Communication speed
*1 Answer To reQuest
[2] Contactless card Handling
The card can be operated when the card is inserted and transported to the proper position.
In conform to Mifare classic, ISO/IEC 14443-1/2/3/4 Type A /
Type B and ISO/IEC18092 (only passive mode)
106kbps (Mifare classic, Type A / Type B) or
212kbps (ISO/IEC 18092)
106kbps (Mifare classic, Type A / Type B) or
212kbps (ISO/IEC 18092)

Notice for contactless

The capability of the communication between the Antenna of V2X and each card which supplied from
customers shall be checked by Hitachi-Omron Terminal Solutions, Corp.
The contactless unit is designed to read and write the contactless card without metal, for example a
reject box, near the C/R. Hitachi-Omron Terminal Solutions, Corp. checked that the sample cards at hand
of Hitachi-Omron Terminal Solutions, Corp could be read and written with the reject box supplied by the
customer attached to V2X.
This C/R with the contactless unit shall be applied as the radio equipment whose system or terminal with
the C/R shall comply with Radio Law (e.g R&TTE Directive) for each country where the system or the
terminal is shipped.
C/R should be installed at least 50mm apart from the closest other C/R to avoid interference when
mounting the contactless unit.
C/R is designed to transport the card with rollers pushing chip on the card. As ISO standard for
contactless card leaves layout of chip and antenna in the card to discretion of contactless card
manufacturer, there are possibility that C/R damages contactless card during transportation.
This type, V2XF-11JL-008S, has cryptographic equipment and the usage shall be limited for banking
use or money transaction. To meet regulations of cryptographic equipment which specified in some
countries, it is recommended to confirm the conformity with user's responsibility before export to those
countries.

6 CIM/MM unit
[1] Card transfer speed
[2] Optional Mounting parts
C/R can be worked at the transfer speed of 200 mm/s +/- 10%
Mounting Bracket and fixing screws for the optical sensor of CIM/MM is
provided as option. These parts can be purchased by customer's order.
See 0. 18 Hardware Overview and Upgrade Parts List.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(3/20)
7 Shutter unit
[1] Card detection function
(1) Card width detection switch (mechanical switch) is installed.
(2) Magnetic stripe detection head detects magnetic data on any track of three ISO tracks.
[2] Outer length of card
The card protrudes from 28mm to 34mm when the card is returned, and maximum 38mm when the card is
moved to rear side.
[3] Measures for antirust
The materials to withstand rust are used in shutter unit.
[4] Advanced Card Trap-proof function (ACT)
This function is supported only with -03* series (refer to the Applicable List of V2X).
Following shows main specifications (See Appendix C for detail). (*1)(*2)
(1) ACT shall work immediately by command from the host regardless of the card location. (*3)
(2) If the card is jammed in the designated zone, ACT shall work automatically without host command. (*4)
(3) Minimum force of card lock is 150N. (*5)
ACT can hold the card against 150N.
(4) Applicable card is the card conformed to ISO/IEC 7810/ID-1. (*6)
(5) ACT lock shall be released by hand (*7).
(6) The lock will not be released automatically even though the power is shutdown while the ACT is
working.

NOTE
*1. There is a possibility that noise of around 90 dB is made in case of activating ACT.
(The C/R with ACT is shipped from factory in condition that ACT is activated.)
*2. Please release the ACT lock at first according to the ACT notice included in the carton box, when
unpack and install the C/R.
*3. Under conditions of Setting 0 as shown in 2) ACT operation type setting in Appendix C, ACT does not
work. Please refer to Appendix C for details.
*4. Under conditions of Setting 2 as shown in 2) ACT operation type setting in Appendix C, ACT does not
work automatically. Please refer to Appendix C for details.
*5. There is a possibility of card being damaged by ACT on the surface of card.
*6. Applicable card shall conform to ISO/IEC 7810/ID-1 and ACT unit must be inspected and maintained
along the ACT maintenance manual (Doc.No. 2749006-3).
*7. Please refer to Appendix C for the way to release the lock.

8 Recovery process of "Power Shutdown"

[1] Power supply port
An external power supplier (capacitor: capacity 150mF) connected to the Card Reader Writer supplies
power automatically to the 24V Line if the supply voltage drops.
[2] Procedure in the event of power shutdown
If a card is inside the Card Reader / Writer during a power failure, the following procedure is performed in
sequence by using power stored in above indicated capacitor:
(1) If it is during reading to magnetic card, this process is completed.
(2) If it is during writing to magnetic card, this process is completed respectively in accordance with the card
position.
- When the card is stayed at the front/rear position to start write operation, the power failure operation
starts instead of starting write operation.
- When the card is executing write operation, after write operation is finished, instead of executing
verify-read, the power failure operation starts.
- When the card is moving from rear to front to set the card to the write position, after the card get to
the front, the power failure operation starts.
(3) If it is during transmission/reception to IC card or SAM, this process is completed.
(4) If it is during activation to IC card or SAM, make it deactivation.
(5) If it is during transmission/reception to a contactless card, this process is aborted. The writing data is not
guaranteed.
(6) Afterwards, return the card to the take out position or rear reject box, or keep it in the Card Reader
Writer.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(4/20)
9 Required power supply
[1] Power supply voltage 24V DC + 10% / – 15%
[2] Ripple of power supply 500mVp-p or less
[3] Power consumption
In operation 1.0A or less when motor starts to revolve
In standby 200mA or less
In peak to start motor/solenoid 1.8A for 150ms/2.0A for 15ms

10 Environmental conditions
[1] Temperature
(1) In operation 5 to 50 degree (Celsius)
(2) In storage -25 to 55 degree (Celsius)
[2] Humidity
(1) In operation 5 to 85% RH, no condensation and absolute air humidity of 23 g/m3 or less
(2) In storage 5 to 90% RH, no condensation and absolute air humidity of 40 g/m3 or less
[3] Dust accumulation Total mass of floating dusts, which sizes are less than 10
micrometers, is less than 0.15 mg/m3.
[4] Corrosive gasses Not allowed
[5] Lighting Lower than 1,000 lx, no direct sunlight
[6] Installation No direct ingress of rain, No leakage of electricity, No intrusion of insects

11 EMI/EMS
[1] EMI EN50081-1, IEC801-3/4/5/6
Confirmed EN55022 Class B
Confirmed FCC part15 Class A
[2] EMS EN50082-1, IEC801-2, EN55024
(1) Electrostatic discharge Confirmed EN61000-4-2
Immunity inlet +/- 6kV contact discharge +/-8kV air discharge
others +/- 4kV contact discharge +/-4kV air discharge
Destruction inlet +/- 8kV contact discharge +/-15kV air discharge
others +/- 6kV contact discharge +/-8kV air discharge
(2) Radio-frequency electromagnetic field Confirmed EN61000-4-3
(3) Electrical transient/burst Confirmed EN61000-4-4
(4) Surge Confirmed EN61000-4-5
(5) Conducted disturbances, induced by radio-frequency fields Confirmed EN61000-4-6
(6) Limits of terminal interference voltage Confirmed EN61000-4-8
[3] R&TTE Directive (Only with Contactless unit)
(1) Radio EN 300 330-1 EN 300 330-2
(2) EMS EN 301 489-1,EN 301 489-3

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(5/20)
12 General performance
[1] Vibration resistance
Test at 10-55 Hz and a single vibration width of 0.05 mm
[2] Shock resistance
Test at a peak acceleration of 200 m/s2 three times in six directions (up & down, right & left and back &
forth) respectively
[3] Dielectric strength
250V DC for 1 minute
[4] Insulation resistance
10 M ohm or more at normal temperature and 250V DC

13 Life and Reliability

[1] Life(*1)
(1) Card Reader / Writer life 2,000,000 passes(*2) or 5 years whichever comes earlier
(2) IC contact life 500,000 operations
(3) Down loading cycles 100,000 times min.
(4) ACT function life
-Activation 100 times activation.
-Card Lock 10 times card locking (*3)
If the following conditions are satisfied, it can be used continuously
1) The lock force shall be assured 150N or more by jigs for checking lock-force (*4).
2) All parts, which constitute ACT including Inlet and Inlet plate shall have no scratch,deformation, or
crack as indicated in the ACT maintenance manual. (*5)
[2] Reliability(*1)
(1) Error rate (magnet card) Less than 1/1000 cycle of read/write test
(2) Error rate (IC card) Less than 1/1000 cycle of read/write test
(3) Error rate (Contactless card) Less than 1/1000 cycle of read/write test
(4) Definition of failure
1) When five or more sequential errors are detected.
(e.g. magnetic card read/write errors, card jams)
2) Mechanical problems (e.g. deformation of frame)
3) When C/R does not work even if power is supplied.
4) When transaction is not completed properly, except the following cases.
- Read/write errors and card jams with abnormal cards.
- Read/write errors caused by improper maintenances.
- Error caused by HOST systems.
- Error caused by intentional manipulation.

NOTE
*1. In case of cleaning, cleaning should be done based on Periodic Maintenance Manual.
*2. “1 pass” means 2-way card transport for forward and backward.
*3. This performance is limited in the occasion that the locked card is the one specified in ISO/IEC 7810
and card pulled force is less than 150N.
*4. Refer to ACT maintenance manual (Doc.No.2749006-3) for the way to check lock force and treat if the
lock force is less than 150N.
*5. Refer to ACT maintenance manual (Doc.No.2749006-3) for the way to check scratches, deformation,
and cracks on the component parts.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(6/20)
14 Electronic interface
[1] Electronic interface
(1) RS232
1) Transmission speed 9600,19200,38400 bps (Automatic Recognition)
2) Synchronous method Asynchronous
3) Communication method Half-duplex
[2] Signal explanation and pin layout
(1) RS232 interface connector
9 pin D-Sub socket, DELC-J9SAF-20L9(JAE, Japan) or equivalent is used in PCB.

Pin assignment ( C/R side )

Pin No. Assigned signal IN/OUT Function
1 NC - No assigned
2 RXD IN Receiving data
3 TXD OUT Transmitting data
4 DTR OUT Data Terminal Ready 1 5
5 GND - Ground
6 RFU - Reserved for future use 6 9
7 RFU - Reserved for future use Counter Connector
8 CTS IN Clear to send (connector on the side of cable)
9 RFU IN Reserved for future use

( Cable with connector between Host and C/R isn't attached to C/R )

(2) Power supply connector

4 nodes, 2.54mm pitch in serial 5046-04A(Molex Japan) is used in PCB

Pin assignment of C/R 4 X24V

Pin No. Assigned power rails
1 +24V: Power supply 3 XGND
2 GND: Power ground 2 GRD
3 XGND: Secondary power ground
4 X24V: Secondary power supply 1 1 +24V

Counter Connector
(connector on the side of cable)

Power supply circuit diagram ( e.g. External capacitor )

Power down detect signal
Power source
+24V
Power
GND Ground for logic

XGND
Resister for charge up
120ohm
X24V

ExternalCapacitor
External

NOTE
The length of the cable between the power supply and C/R should be less than 3m.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(7/20)
 (3) I/O connector
Connector type JST S14B-PHDSS is used in PCB.

Pin assignment (CN14) -

Pin No. Assigned signal Function
1 SG(0V) Signal Ground
2 OUT 1 Output port 1 14 13 13

3 OUT 2 Output port 2

4 OUT 3 Output port 3
5 OUT 4 Output port 4
6 OUT 5 Output port 5
7 OUT 6 Output port 6 2 1 1

8 OUT 7 Output port 7

9 OUT 8 Output port 8 (1)Side View (2) Top View
10 IN 1 Input port 1
11 IN 2 Input port 2 Counter Connector
12 IN 3 Input port 3 (connector on the side of cable)
13 IN 4 Input port 4 JST PHDR-14VS
14 VCC(5V) Power(5V)
(Cable with connector between host and C/R isn’t attached to C/R)

NOTE
(1) I/O
Output port Transistor open collectorIOL max 50 mA
VCEO max 24V
Input port TC74HC240AF or equivalent (10k ohm pulled up)
VIL max:0.5V, VIH min:2.4V

15 Software interface
[1] Transmission protocols V2X Series Card Reader / Writer Data Transmission Specification
for RS232
Document No. :
GB-H-01047 : For V2XF-11JL-001S, 002S, 001, 021S, 031, 031S,
V2XF-11JL-008S
MTA-H-04016 : For V2XF-11JL-AP1
[2] Port to host Handling with a magnetic card and an IC card via single port
[3] Format A common APDU format is used for handling various IC cards,
such as memory card
[4] Downloadable All software are supported to be downloaded..
[5] Module Firmware is independently divided into every functional module
(e.g. IC card handling module, SAM handling module, etc.) and every
module can be independently downloaded respectively
(regardless of order of download)

16 Response to Regulated Chemical Substances

[1]Response to RoHS Conformed with RoHS Directive(2002/95/EC)
"The restriction of the use of certain hazardous substances in
electrical and electronic equipment".

(Notice) In case the equipment mounting this card reader will be

shipped to People's Republic of China,please consult our
sales representatives.

17 Correct usage for safety

[1] Card feed Do not locate parts with sharp corners or edges near the card feed
knob to avoid an user's injury.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2(8/20)
18 Hardware Overview
[1] Outline Dimensions for Height 95 mm [Type1]

NOTE1.Screw the C/R through two holes ※１.

NOTE2.In case of fastening a screw through the hole ※2, please notice that the length of screw striking into V2X
B3 from the outer surface does not exceed 4 mm(Refer to caution label).
NOTE3.Longer screw might break into the shutter solenoid at the ※2 point.
D
NOTE4.For overview of ACT Version, refer to the appendix C.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (9/20)
 [2] Outline Dimensions for Height 90 mm [Type 2]

NOTE. For overview of ACT Version, refer to the appendix C.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (10/20)
 [3] Outline Dimensions for Height 95 mm [Type1, 5 SAM Model]

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (11/20)
 [4] Parts location

SAM
SW4 SL2
SW3 S1 S2 S3 S4

M1

SW1
Head
SW2 Antenna
SL1

Abbreviation Notes
S1-S4 Positioning sensor
SW1 Pre-head sensor
SW2 Card width sensor
SW3 Sensor to detect the open/close of shutter blade
SW4 Sensor to detect IC contact completely down
SL1 Solenoid which opens the shutter blade
SL2 Solenoid which pulls IC contact down
M1 Motor
Head Read/write magnetic head
SAM Position to install the PCB for SAM
Antenna Position to install the antenna for contactless card

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (12/20)
19 Circuit block diagram
[1] With Normal Shutter Unit

PCB
Shutter Unit
CPU
RAM 2Mbit Shutter Solenoid
(256kBytes) Circuit For Shutter Open
Shutter Closed
Flash 8Mbit
Detect Switch
(1Mbytes)
Card Insertion
Detect Switch
Host RS232
Terminal Driver/Receiver Mag Stripe
Detect Head

Regulator 1.6V A/D Converter

Mag Read LoCo Mag Head
Regulator 3.3V Stripe Detect ISO1/2/3
Regulator 3V
LoCo Mag Write
DC/DC 5V
Power Power Failure
Supply (24V) Detection
PLL(75bpi)
External Encoder
Motor Drive
Capacitor Motor
Circuit
Photo Power
IC Contact Unit
Changeable Circuit
Position IC Contact
Sensor Move Detection
Switch
Solenoid Driver Solenoid
IC/Memory Card Driver for ICC Contact
& T=0 ErrorDetection IC Contact

SAM Unit

SAM Socket
SAM Control
Circuit

5 SAM Unit will 5 SAM Unit

replace 1 SAM Unit
SAM Socket (5)
SAM Control
Circuit

5 SAM model only

Contactless Unit

Contactless
Control Circuit

Antenna

: This function is supported with the separate model from V2XF-11JL-***.

: This unit is prepared by our customers.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (13/20)
 [2] With ACT Shutter Unit

PCB
ACT Shutter Unit
CPU
RAM 2Mbit Shutter Solenoid
(256kBytes) Circuit For Shutter Open
Shutter Closed
Flash (8Mbit) Detect Switch
(1Mbytes) ACT
Card Insertion Circuit
Host RS232 Detect Switch Solenoid
Terminal Driver/Receiver
For ACT
Mag Stripe
Detect Head ACT Echo
Sensor
Regulator 1.6V A/D Converter
Mag Read LoCo Mag Head
Regulator 3.3V
Stripe Detect ISO1/2/3
Regulator 3V
LoCo Mag Write
DC/DC 5V

Power Power Failure

Supply (24V) Detection

External PLL(75bpi)
Encoder
Capacitor Motor Drive
Motor
Circuit
Photo Power
IC Contact Unit
Changeable Circuit
Position IC Contact
Sensor Move Detection
Switch
Solenoid Driver Solenoid
IC/Memory Card Driver for ICC Contact
& T=0 ErrorDetection IC Contact

SAM Unit

SAM Socket
SAM Control
Circuit

5 SAM Unit will 5 SAM Unit

replace 1 SAM Unit
SAM Socket (5)
SAM Control
Circuit

5 SAM model only

Contactless Unit

Contactless
Control Circuit
Antenna

: This function is supported with the separate model from V2XF-11JL-***.

: This unit is prepared by our customers.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (14/20)
20 Appendix A
Abstract from ISO 7816-2: 1999 (E)

4. Number and locations of the contacts

This part of ISO 7816 defines eight contacts referred to as C1 to C8.
The contacts are located as shown in figures 2.
The contacts may be located on either the front or the back of the card, but in either case the
Dimensions are referenced to the left and upper edges of the corresponding surface of the card.

Dimensions in millimeters

Figure 2 Number and locations of the contacts

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (15/20)
21 Appendix B

Table 1: Combination of F and D for ICC

TA1 PPS1 of PPS Request Transmission speed after PPS success.

Value (BIN) F D Value (BIN) F D f (Frequency MHz) Time of 1 etu
01H 372 1 01H 372 1 3.5712 About 104 usec (9600bps)
02H 372 2 02H 372 2 3.5712 About 52 usec (19200bps)
03H 372 4 03H 372 4 3.5712 About 26 usec (38400bps)
04H 372 8
05H 372 16
06H 372 32
08H 372 12
09H 372 20
11H 372 1 11H 372 1 3.5712 About 104 usec (9600bps)
12H 372 2 12H 372 2 3.5712 About 52 usec (19200bps)
13H 372 4 13H 372 4 3.5712 About 26 usec (38400bps)
14H 372 8
15H 372 16
16H 372 32
18H 372 12
19H 372 20
31H 744 1 31H 744 1 7.1424 About 104 usec (9600bps)
32H 744 2 32H 744 2 7.1424 About 52 usec (19200bps)
33H 744 4 33H 744 4 7.1424 About 26 usec (38400bps)
34H 744 8
35H 744 16
36H 744 32
38H 744 12
39H 744 20
48H 1116 12 48H 1116 12 3.5712 About 26 usec (38400bps)
52H 1488 2 52H 1488 2 7.1424 About 104 usec (9600bps)
53H 1488 4 53H 1488 4 7.1424 About 26 usec (38400bps)
54H 1488 8 54H 1488 8 7.1424
55H 1488 16 55H 1488 16 3.5712
69H 1860 20 69H 1860 20 3.5712

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (16/20)
 Table 2: Combination of F and D for SAM

TA1 PPS1 of PPS Request Transmission speed after PPS success.

Value（BIN） F D Value（BIN） F D Frequency (MHz) Time of 1 etu
01H 372 1 01H 372 1 3.5712 About 104 usec (9600bps)
02H 372 2 02H 372 2 3.5712 About 52 usec (19200bps)
03H 372 4 03H 372 4 3.5712 About 26 usec (38400bps)
04H 372 8
05H 372 16
06H 372 32
08H 372 12
09H 372 20
11H 372 1 11H 372 1 3.5712 About 104 usec (9600bps)
12H 372 2 12H 372 2 3.5712 About 52 usec (19200bps)
13H 372 4 13H 372 4 3.5712 About 26 usec (38400bps)
14H 372 8
15H 372 16
16H 372 32
18H 372 12
19H 372 20
48H 1116 12 48H 1116 12 3.5712
55H 1488 16 55H 1488 16 3.5712
69H 1860 20 69H 1860 20 3.5712

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (17/20)
22 Appendix C
Additional information for ACT version
1) Overview and parts location of ACT version
[1] Overview of ACT version
[Type: V2XF-11JI-031]

[Type: V2XF-11JI-031S]

NO SCALE

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (18/20)
[2] ACT Unit parts location

SLA-1 L1
B2
SA-1

B1

B3

Abbreviation Notes Remarks

SA-1 Detection sensor for ACT operation Detects operation state of ACT.
B1 Blade to lock a card Bites the card to lock it.
B2 Stopper to prevent blade releasing. Prevents the blade from releasing fraudulently.
B3 Stopper to prevent shutter opening Keeps shutter closed until ACT is released.
L1 Lock release Lever Releases the lock.
SLA-1 ACT solenoid Activates ACT operation.

1) ACT operation type setting

We offer 2 types of setting as below for ACT operation.
Refer to V2X Series Card Handling Device Data Transmission Specification (Doc.No. GB-H-01047) for
setting of ACT operation.

[1] Setting 0
It makes ACT operation “invalid” ----- ACT does not work even if the host commands to work.

[2] Setting 1
It makes ACT auto-operation “invalid” ---- ACT works only when the host commands to work.
Concerning how to release the ACT, describe later.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (19/20)
 2) How to release ACT
Following procedures as below unlock the lever. (*1)
[1] Push and rotate the LEVER 1 to the stitch-lined position.(arrow <1>)
[2] Push down the LEVER 2 to the position shown in the drawing .(arrow <2>) (*2)
[3] This shows released ACT. Make sure the positions of LEVER 1 and LEVER 2.
[4] Execute initial reset command of card reader.(*3)

[1] [2]
<1> <2>

[3]

[NOTE]
*1: In case that the lever 2 is hard to be pushed, push the locked card a little into the card reader so that
the lever can be moved easier.
*2: As the LEVER 2 is pushed down, LEVER 1 also moves automatically.
*3: The ACT operation counter is not reset by initial reset and power-off of the card reader.
Refer to V2X Series Card Handling Device Data Transmission Specification (Doc.No. GB-H-01047) to
reset the ACT operation counter.

© Hitachi-Omron Terminal Solutions, Corp. 2002-2009 All Rights Reserved. GB-B-01007 G2 (20/20)