Quickspecs: HP Z6 G4 Workstation

QuickSpecs HP Z6 G4 Workstation
Overview
HP Z6 G4 Workstation
Front view
1. Integrated Front Handle 3. 2 x 5.25” external bays
2. Front I/O module options 4. 1 Slim ODD bay
• Premium (optional, shown here): power button,
2 USB 3.1 G1 Type-A, 2 USB 3.1 G2 Type-C™
(Left-most Type A port has charging capability),
Headset/Mic, Media Card Reader (optional).
• Standard: power button, 4 USB 3.1 G1 Type-A
(left-most Type A port has charging capability),
Headset/Mic, Media Card Reader (optional).
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Overview
Internal view
5. Power supply: 1000W 90% efficient with 2 graphics power 10. 6 x 6Gb/s SATA ports
adapters
6. 6 DIMM slots: DDR4-2666 Registered RAM 11. 2 PCIe G3 x4 M.2 for SSDs
7. Intel® Xeon® processor Scalable family 12. 2 x 2.5”/3.5” internal drive bays
8. 2nd CPU & memory riser connector: 13. 2 x 5.25” external drive bays
adds 2nd CPU socket and (6) DIMM slots
9. PCIe slots: 2 PCIe G3 x16, 3 PCIe G3 x4, 1 PCIe G3 x8

Overview
Rear view
14. Rear handle 18. HP Dual Port 10GBase-T NIC module slot (optional)
15. Padlock loop 19. Side panel barrel keylock (optional)
16. Rear power button 20. Kensington lock slot
17. Rear I/O (top to bottom):
audio in/out, keyboard/mouse PS/2,
6 USB 3.1 G1 Type-A,
2 x 1GbE LAN ports

Overview
Overview
Form Factor Tower
Operating Systems Preinstalled:
• Windows 11 Pro for Workstations2
• Windows 10 Pro for Workstations1,2
• Ubuntu 20.04 LTS3
• HP Linux-ready (minimal OS ready for customer OS installation)
• Red Hat® Enterprise Linux® Desktop Workstation (Paper license with 1 year support; no
preinstalled OS)
Supported:
• Red Hat Enterprise Linux Workstation 6, 7, 84
• SUSE Linux Enterprise Desktop 12, 154
• Ubuntu 16.04, 18.04, 20.04 LTS3
1Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11.
Upgrade timing may vary by device. Features and app availability may vary by region. Certain features
require specific hardware (see Windows 11 Specifications).
2Not all features are available in all editions or versions of Windows. Systems may require upgraded
and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of
Windows functionality. Windows is automatically updated and enabled. High speed internet and
Microsoft account required. ISP fees may apply and additional requirements may apply over time for
updates. See http://www.windows.com.
3Not all features are available in all editions or versions of Ubuntu. Systems may require upgraded
and/or separately purchased hardware, drivers, software or BIOS to take full advantage of Ubuntu
functionality. Ubuntu may be automatically updated. ISP fees may apply, and additional requirements
may apply over time for updates.
4Notes: For detailed Linux® OS/hardware support information, see:

http://www.hp.com/support/linux_hardware_matrix
NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows® 7 operating
system on products configured with Intel® 7th Generation and forward processors.
Available Processors
Supports
Clock Memory Intel® Turbo
Cache Hyper- Intel® TDP
Name Cores Speed Speed Boost
(MB) Threading DCPMM (W)
(GHz) (MT/s) Technology1
Technology2
Intel® Xeon® W Processors
Intel® Xeon® W-3275
28 2.5 GHz 38.5 2933 Yes 4.4, 4.6 NO 205
processor
24 2.7 GHz 33 2933 Yes 4.4, 4.6 NO 205
processor
16 3.2 GHz 22 2933 YES 4.4, 4.6 NO 205
processor
12 3.3 GHz 19.25 2933 YES 4.4, 4.5 NO 180
processor
8 3.7 GHz 16.5 2666 YES 4.3, 4.4 NO 160
processor

Overview
8 3.5 GHz 16.5 2666 YES 4, 4.2 NO 160
processor
Intel® Xeon® Scalable Processors
Intel® Xeon® Gold 6258R
28 2.7 GHz 38.50 2933 YES 4.0, 3.4 YES 205
processor
24 3.0 GHz 35.75 2933 YES 4.0, 3.9 YES 205
processor
16 3.4 GHz 35.75 2933 YES 4.1, 4.0 YES 205
processor
Intel® Xeon® Gold 6244
8 3.6 GHz 24.75 2933 YES 4.3, 4.4 YES 150
processor
20 3.1 GHz 35.75 2933 YES 4.1, 3.8 YES 205
processor
16 2.6 GHz 22 2933 YES 3.5, 3.9 YES 150
processor
24 2.4 GHz 35.75 2933 YES 4.0, 3.2 YES 165
processor
18 2.6 GHz 24.75 2933 YES 3.3, 3.9 YES 150
processor
28 2.2 GHz 38.5 2933 YES 4.0, 3.0 YES 165
processor
8 3.3 GHz 24.75 2933 YES 4.0, 4.0 YES 130
processor
26 2.1 GHz 35.75 2933 YES 4.0, 3.0 YES 150
processor
16 2.9 GHz 22 2933 YES 3.9, 3.6 YES 150
processor
12 2.7 GHz 19.25 2933 YES 3.5, 3.7 YES 125
processor
12 3.0 GHz 24.75 2666 YES 3.6, 3.7 NO 150
processor
6 3.4 GHz 19.25 2666 YES 3.7, 3.7 NO 115
processor
4 3.8 GHz 16.5 2933 YES 3.9, 3.9 YES 105
processor
24 2.2 GHz 35.75 2666 YES 4.0, 2.9 YES 150
processor
20 2.1GHz 27.5 2666 YES 4.0, 2.9 YES 125
processor
16 2.3 GHz 22 2666 YES 2.8, 3.9 YES 125
processor
10 2.5 GHz 13.75 2666 YES 3.0, 3.4 YES 85
processor
12 2.3 GHz 16.50 2400 YES 2.7, 3.2 NO 105
processor
Intel® Xeon® Silver 4216
16 2.1 GHz 22 2400 YES 2.7, 3.2 NO 100
processor
Intel® Xeon® Silver 4215R
8 3.2 GHz 11 2400 YES 4.0, 3.6 YES 130
processor
12 2.4 GHz 16.5 2400 YES 3.0, 3.5 NO 100
processor
12 2.2 GHz 16.5 2400 YES 2.7, 3.2 NO 85
processor
10 2.4 GHz 13.75 2400 YES 2.9, 3.2 NO 100
processor

Overview
10 2.2 GHz 13.75 2400 YES 2.7, 3.2 NO 85
processor
8 2.1 GHz 11 2400 YES 2.5, 3.2 NO 85
processor
10 2.2 GHz 13.75 2400 YES 2.5, 3.0 NO 85
processor
8 1.8 GHz 11.00 2400 YES 2.1, 3.0 NO 85
processor
Intel® Xeon® Bronze 3206R
8 1.9 GHz 11.00 2133 YES N/A NO 85
processor
Intel® Xeon® Bronze 3204
6 1.9 GHz 8.25 2133 YES N/A NO 85
processor
All Z6G4 Intel® Xeon® CPUs Feature Intel® vPro™ Technology.
1The specifications shown in this column represent the following: (all core maximum turbo frequency,
one core maximum turbo frequency). Processors that do not have turbo functionality are denoted as
N/A.
2Intel® Data Center Persistent Memory Modules availability will be announced at a future date.
Available Processors
Disclaimers When ordering two processors, the second processor must be the same as the first. Intel processor
numbers are not a measurement of higher performance. Processor numbers differentiate features
within each processor family, not across different processor families.
Multicore is designed to improve performance of certain software products. Not all customers or
software applications will necessarily benefit from use of this technology. Performance and clock
frequency will vary depending on application workload and your hardware and software
configurations. Intel’s numbering, branding and/or naming is not a measurement of higher
performance.
Color Black
Convertibility No
Expansion Slots (see Slot 0:

system board section for Mechanical-only, for use with devices that require only rear bulkhead mounting or when 2nd CPU riser
more details) is installed
Slot 1:
PCI Express Gen3 x4 - CPU with open-ended connector*
Slot 2:
PCI Express Gen3 x16 - CPU
Slot 3:
PCI Express Gen3 x4 - PCH with open-ended connector*
Slot 4:
PCI Express Gen3 x8 – CPU with open-ended connector (slot converts to x4 electrical when SSD is
installed in 2nd M.2 slot)*
Slot 5:

Overview
Slot 6:
M.2 Slot 1:
M.2 PCIe Gen 3 x4 - CPU up to 80mm storage devices
M.2 Slot 2:
* Open-ended connector allows a greater bandwidth (e.g. x16) card to be installed physically into a
lower bandwidth connector/slot.
Expansion Bays (see 2 internal 3.5" bays (with acoustic dampening rail assemblies pre-installed)
storage section for more 2 external 5.25" bays
details) • 3rd and 4th 3.5" HDD each occupy one external bay
• 3rd and 4th 2.5" HDD/SSD occupy a single external bay within a 2:1 carrier)
1 dedicated 9.5mm slim optical disk drive bay
Front I/O • Base: Power button, 1 Headset audio port, 4 USB 3.1 G1 Type A (1 charging)
• Premium (optional): Power button, 1 Headset audio port, 2 USB 3.1 G2 Type C™, 2 USB 3.1 G1
Type A (1 charging)
• Optional: SD reader
Internal I/O 1 USB 3.1 G1 (aka USB 3.0) single-port header, 1 USB 2.0 single-port header and 1 USB 2.0 dual-port
header
Rear I/O 6 USB 3.1 G1 (aka USB 3.0) Type A ports, 2 1Gbe LAN ports (1x supporting Intel® AMT), Audio: 1 Line
out, 1 Line in (Line in can be retasked as microphone), 1 PS/2 mouse port, 1 PS/2 keyboard port, 1
Rear power button
Optional: 1 serial port (cable up to rear bulkhead)
Interfaces Supported SD card reader (optional)
6-channel SATA interface (6 @ 6.0 Gb/s)
6 channels are eSATA configurable for use with eSATA CTO/AMO Kit (No hot plug / hot swap
supported)
USB 2.0, USB 3.1 G1 (aka USB 3.0), USB 3.1 G2 (optional)
On-board RAID Support SATA RAID 0 Striped Array

SATA RAID 1 Mirrored Array
SATA RAID 5 Striped/Parity
SATA RAID 10 Striped/Mirrored
Chassis Dimensions (H x H: 17.5" (445mm)
W x D) W: 6.65" (169mm)
D: 18.3" (465mm)
Packaged Dimensions H: 24" (610mm)
W: 12.3" (313mm)
D: 23.3" (593mm)
Palletization Profile 6 units x 3 layers = 18 units per pallet
1200x1000x1836mm (pallet included)
Rack Dimensions 4U
Weight Exact weights depend upon configuration (System weight only).

Overview
Minimum: 13.1 kg (29 lbs.)
Standard: 13.6 kg (30.1 lbs.)
Maximum: 23.9 kg (52.7 lbs.)
Temperature Operating: 5° to 35°C (40° to 95°F)

Non-operating: -40° to 60°C (-40° to 140°F)
NOTE: Above 1524 m (5,000 feet) altitude, maximum operating temperature is reduced by 1° C (1.8° F)
per 305 m (1,000 feet) elevation increase
Humidity Operating: 10% to 85% relative humidity, non-condensing, 35° C maximum wet bulb
Non-operating: 10% to 90% relative humidity, non-condensing, 35° C maximum wet bulb
Maximum Altitude (non- Operating: 3,048m (10,000ft)

pressurized) Non-operating: 9,144m (30,000ft)
NOTE: Above 1524 m (5,000 feet) altitude, maximum operating temperature is reduced by 1° C (1.8° F)
per 305 m (1,000 feet) elevation increase
Power Supply 1000 watts wide-ranging, active Power Factor Correction, 90% Efficient, with 2X 6-pin graphics power
cables (graphics power cables are 6/8-pin convertible)
The Z6 G4 1000W power supply efficiency report can be found at this link:
https://plugloadsolutions.com/psu_reports/HP_D15-1K0P1A_1000W_ECOS%204838_Report.pdf
NOTE: All power cords supplied by HP for Desktop Workstations are between 1.83m and 2.5m
(dependent on country localization and platform).
Workstation ISV See the latest list of certifications at

Certifications http://www8.hp.com/us/en/campaigns/workstations/industries-and-partners.html

Supported Components
Processors Option Kit

Factory Option Part Support
Configured Kit Number1 Notes
Intel® Xeon® W-3200 Series CPU
Intel® Xeon® W-3275 2.5 2933 28C processor Y N
Intel® Xeon® Scalable CPU
Intel® Xeon® Gold 6258R processor Y N
Intel® Xeon® Gold 6244 processor Y Y 5YT05AA 1
Intel® Xeon® Gold 6230R processor Y Y 9VA87AA 1
Intel® Xeon® Gold 6226 processor Y Y 5YS98AA 1
Intel® Xeon® Gold 6136 processor Y Y 1XM39AA 1
Intel® Xeon® Gold 5220R processor Y Y 8BC99AA/AT 1
Intel® Xeon® Silver 4216 processor Y Y 5YS93AA 1
Intel® Xeon® Silver 4215R processor Y Y 9VA81AA 1
Intel® Xeon® Silver 4214R processor Y Y 8BC96AA/AT 1
Intel® Xeon® Silver 4210R processor Y Y 8BC95AA 1
Intel® Xeon® Silver 4114 processor Y Y 1XM49AA 1
Intel® Xeon® Silver 4108 processor Y Y 1XM51AA 1
Intel® Xeon® Bronze 3206R processor Y Y 8BC93AA 1
Intel® Xeon® Bronze 3204 processor Y Y 5YS88AA 1
1 Options kits available for second processor upgrade.

Disclaimers: When ordering two processors, the second processor must be the same as the first. Intel
processor numbers are not a measurement of higher performance. Processor numbers differentiate
features within each processor family, not across different processor families.
Note 1: Intel® DCPMM® (Data Center Persistent Memory) Supported.
Monitors / Option Kit

Displays Configured Kit Number Notes
HP Z Display Z22n G2 Y 1JS05AA

HP Z Display Z24i G2 Y 1JS08AA
HP Z Display Z24nf G2 Y 1JS07AA
HP Z Display Z27s (4K display) Y J3G07AA
Supported by all operating systems available from HP
Screen size measured diagonally
Storage / Hard Drives

SAS Hard Drives Option
Factory Option Kit Part Support
SAS Hard Drives for HP Workstations Configured Kit Number Notes
HP 300GB 15k SAS SFF Y Y L5B74AA
NOTE: SAS controller add-in card required
SATA Hard Drives Option

Factory Kit Part Support
Configured Option Kit Number Notes
SATA (Serial ATA) Hard Drives for HP Workstations
500GB SATA 7200RPM 6Gb/s 3.5” HDD Y Y LQ036AA
500GB SATA 7200RPM 6Gb/s OPAL2 SFF 3.5” HDD Y Y D8N29AA
1TB SATA 7200RPM 3.5” HDD Y Y LQ037AA
1TB SATA 7200RPM Ent 3.5” HDD Y Y W0R10AA
2TB SATA 7200RPM HDD Y Y QB576AA
2TB 7200RPM SATA 3.5in Enterprise Y Y 2Z274AA
4TB SATA 7200RPM Ent 3.5” HDD Y Y K4T76AA

6TB SATA 7200RPM Ent 3.5” HDD Y Y 3DH90AA
8TB 7200RPM SATA 3.5in Enterprise Y Y 2Z273AA
NOTES:

Up to (4) 3.5-inch 7200 rpm SATA drives: 500 GB, 1.0, 2.0, 4.0 TB; maximum system HDD storage:
16.0TB

SATA Solid State Drives Option

Configured Kit Number Notes
HP Solid State Drives (SSDs) for Workstations
HP 256GB SATA SSD Y Y A3D26AA
HP 512GB SATA SSD Y Y D8F30AA
HP 1TB SATA SSD Y Y F3C96AA
HP 2TB SATA SSD Y Y Y6P08AA/AT
HP 256GB SATA SED OPAL2 SSD Y Y G7U67AA
HP 512GB SATA SED OPAL2 SSD Y Y N8T26AA
HP 240GB SATA Enterprise SSD Y Y T3U07AA
HP 480GB SATA Enterprise SSD Y Y T3U08AA
HP 960GB 2.5in Enterprise SATA-3 SSD Y Y 1W6P8AA
1920GB 2.5in Enterprise SATA-3 SSD Y Y 1W6P9AA
PCIe Solid State Drives Option

PCIe SSDs for HP Workstations
HP Z Turbo Drive 256GB MLC Z4/Z6 G4 SSD Kit Y Y 1PD56AA 4
HP Z Turbo Drive 512GB MLC Z4/Z6 G4 SSD Kit Y Y 1PD57AA/AT 4
HP Z Turbo Drive 1TB MLC Z4/Z6 G4 SSD Kit Y Y 1PD58AA 4
HP Z Turbo Drive 256GB TLC Z4/Z6 G4 SSD Kit Y Y 1PD59AA/AT
HP Z Turbo Drive 512GB TLC Z4/Z6 G4 SSD Kit Y Y 1PD60AA
HP Z Turbo Drive 1TB TLC Z4/Z6 G4 SSD Kit Y Y 1PD61AA
HP Z Turbo Drive 2TB TLC Z4/Z6 G4 SSD Kit Y Y 3KP39AA
HP Z Turbo Drive 256GB Z4/Z6 G4 SED Kit N N EOL 4
HP Z Turbo Drive 512GB Z4/Z6 G4 SED Kit N N EOL 4
HP Z Turbo Drive 1TB TLC Z4/Z6 G4 SED Kit Y Y 6YT76AA
HP Z Turbo Drive 1TB TLC Z4/Z6 G4 SED Module Y Y 6YT79AA
HP Z Turbo 2TB SED OPAL2 TLC M.2 Z4/Z6 SSD Y Y 2Y7W6AA
HP 256GB M.2 2280 PCIe NVMe TLC SSD Z2/Z4/Z6 Kit Y Y 8PE68AA 3
HP 512GB M.2 2280 PCIe NVMe TLC SSD Z2/Z4/Z6 Kit Y Y 8PE69AA 3
HP 1TB M.2 2280 PCIe NVMe TLC SSD Z2/Z4/Z6 Kit Y Y 8PE70AA 3
HP 256GB M.2 2280 PCIe NVMe TLC SSD Module N Y 8PE62AA 2
HP 512GB M.2 2280 PCIe NVMe TLC SSD Module N Y 8PE63AA 2
HP 1TB M.2 2280 PCIe NVMe TLC SSD Z2 Module N Y 8PE64AA 2
HP 2TB PCIe NVME TLC M.2 Z4/6 G4 SSD Y Y 35F74AA
HP Z Turbo Drive Dual Pro
HP Z Turbo Drive Dual Pro 256GB TLC SSD Y Y 4YF60AA 3
HP Z Turbo Drive Dual Pro 512GB TLC SSD Y Y 4YF61AA 3
HP Z Turbo Drive Dual Pro 1TB TLC SSD Y Y 4YF62AA 3

HP Z Turbo Drive Dual Pro 2TB TLC SSD Y Y 4YF63AA 3
HP 256GB M.2 2280 PCIe NVMe TLC SSD Dual Pro Kit Y Y 8PE74AA 3
HP 512GB M.2 2280 PCIe NVMe TLC SSD Dual Pro Kit Y Y 8PE75AA 3
HP 1TB M.2 2280 PCIe NVMe TLC SSD Dual Pro Kit Y Y 8PE76AA 3
HP Z Turbo Drive Quad Pro
HP Z Turbo Drive Quad Pro 2x256GB PCIe TLC SSD Y Y 4YZ38AA 1
HP Z Turbo Drive Quad Pro 2x512GB PCIe TLC SSD Y Y 4YZ39AA 1
HP Z Turbo Drive Quad Pro 2x1TB PCIe TLC SSD Y Y 4YZ40AA 1
HP Z Turbo Drive Quad Pro 2x2TB PCIe TLC SSD Y Y 3KP42AA
HP Z Turbo Drive Quad Pro 256GB SSD module N Y N2N00AA 2
HP Z Turbo Drive Quad Pro 512GB SSD module N Y N2N01AA 2
HP Z Turbo Drive Quad Pro 1TB SSD module N Y T9J00AA 2
HP Z Turbo Drive Quad Pro 2TB SSD module N Y 3KP43AA
Intel® 905p Series SSD (Optane SSD)
Intel® Optane SSD 905p 280GB AiC** Y Y 2SC47AA
Intel® Optane SSD 905p 480GB AiC** Y Y 2SC48AA
Intel® Optane SSD 905p 380GB M.2 SSD Module Y Y 6LA66AA
Note 1: Dual M.2 SSD modules plus carrier and heat sink
Note 2: M.2 SSD module only, for Quad Pro or Dual Pro carrier
Note 3: Single M.2 SSD module plus dual carrier and heat sink
Note 4: These M.2 SSD kits and module are End of Life and no longer available.
** PCIe card installed in standard PCIe x4 slot
Hard Drive Controllers Option

SAS Controller
MicroSemi SmartHBA2100-4i4e SAS Controller Y Y 1FV90AA
Graphics
Factory Option Option Kit Support Supported
Configured Kit Part Number Notes # of cards
Graphics Cable Adapters
HP DisplayPort to VGA Adapter Y Y AS615AA
HP DisplayPort to HDMI Adapter Y Y K2K92AA
HP DisplayPort to Dual Link DVI Adapter Y Y NR078AA 1
HP DisplayPort to DVI-D Adapter Y Y FH973AA 1
HP DisplayPort to DVI-D Adapter (2-pack) Y N 1
NVIDIA® SLI 3-slot Graphics Connector Y Y 2YY85AA 1

Quadro RTX NVLink High-Bandwidth 3-slotBridge
N Y 6FY13AA 2
(RTX 8000, RTX 6000)
Quadro RTX NVLink 3-slotBridge (RTX 5000) Y Y 6FY14AA 2
NVIDIA NVLink 3 Slot Bridge (RTX A6000, RTX
Y Y 340L3AA 2
A5000)
Entry 3D
NVIDIA® Quadro® P620 2GB Graphics Y Y 3ME25AA 2
NVIDIA® T400 2 GB Graphics Y Y 340K8AA 2
NVIDIA® T400 4 GB 3mDP Graphics Y Y 5Z7E0AA/AT 2
Mid-range 3D
NVIDIA® T1000 4 GB 4mDP Graphics Y Y 20X22AA/AT 2
NVIDIA® T1000 8 GB 4mDP Graphics Y Y 5Z7D8AA 2
NVIDIA® Quadro® P1000 4GB Graphics Y Y 1ME01AA 3
NVIDIA RTX A2000 6 GB 4mDP Graphics Y Y 340L0AA 3
NVIDIA RTX A2000 12 GB 4mDP Graphics Y Y 5Z7D9AA 2
AMD Radeon™ Pro WX 3200 4GB Graphics Y Y 6YT68AA 2
AMD Radeon Pro W6600 8 GB GDDR6 4DP
Y Y 340K5AA 1
Graphics
High End 3D
NVIDIA® RTX A4500 20 GB GDDR6 4DP Graphics Y Y 5S458AA/AT 2
AMD Radeon™ Pro W5500 8GB Graphics Y Y 9GC16AA/AT 2
AMD Radeon™ Pro W5700 8GB Graphics Y Y 9GC15AA/AT 1
Ultra High-End 3D
NVIDIA® RTX A5000 24 GB Graphics Y Y 20X23AA 2
NVIDIA® RTX A6000 48 GB 4DP Graphics Y Y 2S6U3AA 1
AMD Radeon Pro W6800 32 GB Graphics Y Y 340K7AA 1
NVIDIA® Quadro® Sync II Y Y 1WT20AA
Memory SL CL Factory Option Option Kit Support

Processor Processor Configured Kit Part Number Notes
DDR4-2666 ECC Registered DIMMs
8GB (1x8GB) DDR4-2666 ECC Reg Memory Y N Y Y 1XD84AA 1,2
16GB (1x16GB) DDR4-2666 ECC Reg Memory Y N N Y 1XD85AA 1,2
32GB (1x32GB) DDR4-2666 ECC Reg Memory Y N N Y 1XD86AA 1,2
DDR4-2933 ECC Registered DIMMs
8GB (1x8GB) DDR4-2933 ECC Reg Memory Y Y Y Y 5YZ56AA 1,2
16GB (1x16GB) DDR4-2933 ECC Reg Memory N Y N Y 5YZ54AA 1,2
SL Processor: Are processors formerly known as Intel® Skylake that are sold under the model name Intel® Xeon® SP:
Platinum 8100, Gold 6100, Gold 5100, Silver 4100 and Bronze 3100 Family
CL Processor: Are processors formerly known as Intel® Cascade Lake that are sold under the model name Intel® Xeon®
SP: Platinum 8200, Gold 6200, Gold 5200, Silver 4200 and Bronze 3200 Family

NOTES:
1: For details on the supported memory configurations on the HP Z6 G4 Workstation, please refer to the System
Technical Specifications - System Board section of this document.
Each processor supports up to 6 channels of DDR4 memory. To realize full performance at least 1 DIMM must be
inserted into each channel.
With single-processor configurations, 6 DIMM slots are available. 6 additional DIMM slots are available with the 2nd CPU
& Memory Module.
The CPUs determine the speed at which the memory is clocked. If a 2400MT/s capable CPU is used in the system, the
maximum speed the memory will run at is 2400MT/s, regardless of the specified speed of the memory.
The Z6 G4 is designed to work ONLY with DDR4 memory. The system will not work with DDR3 memory.
2: Z6 G4 configurations that include a 2nd CPU require the HP Z6 Memory Cooling Solution, which is available both CTO
(2JA81AV) and AMO (2HW44AA). Z6 G4 configurations that include greater than 32GB total system memory require the
HP Z6 Memory Cooling Solution, which is available both CTO (2JA81AV) and AMO (2HW44AA).
NOTE: Factory-configured CTO (xxxxxAV) and aftermarket AMO (xxxxxAA, xxxxxAT) HP memory part numbers
designated as “2666” may ship with "2933" or "3200" speed memory components. Similarly, HP Memory part numbers
designated as "2933" may ship with "3200" speed memory. This does not affect HP part number availability, nor does it
affect system performance or operation. All hardware configurations currently supporting HP memory part numbers
designated as “2666” or 2933 have been fully qualified to work with fast speed memory and are fully supported by HP
under standard support terms.
NVDIMM Memory Factory Option Option Kit Support
Configured Kit Part Number Notes
Intel® Optane™ DC Persistent Memory (DCPMM)
128GB (1x128GB) DC Persistent Memory Module Y Y 9NH78AA 1
256GB (2x128GB) DC Persistent Memory Configuration Y N 1
512GB (4x128GB) DC Persistent Memory Configuration Y N 1,2
NOTE 1: Supported only with Xeon 82xx, 62xx, 52xx and 4215/4215R processors.
a. Available as factory configured in Memory Mode or Storage Mode.
b. Systems configured with DCPMM memory will operate the memory subsystem at 2666 MT/s.
c. Operating System Support:
i. Windows 11 Pro for Workstations with all updates applied
ii. Windows 10 Pro for Workstations v1903 or later with all updates applied.
iii. Linux OS support may be found in the Linux Hardware Support Matrix.
d. Detailed setup, security and support information may be found in the Intel® Optane™ DC Persistent
Memory: Configuration and Setup on HP Z6 G4 and Z8 G4 Workstation white paper.
e. DCPMM solutions require additional DRAM memory to be included in the solution:
i. Systems configured with DCPMM in Memory Mode will include DRAM memory to be used as cache.
The amount of included DRAM memory is based on an 8:1 DCPMM to DRAM capacity ratio.
ii. Systems configured with DCPMM in Storage Mode will require DRAM System Memory to be
ordered separately.
iii. DCPMM Memory will report approximately 2% less than advertised capacity .
f. Total Memory (DCPMM + DRAM) per processor must be <= 1TB or 2TB per dual processor system.
i. When configured in memory mode, additional DRAM does not count against maximum processor
memory.
g. Maximum number of DCPMM modules in a Z6G4 is 4 per processor.

h. Customer is responsible for additional required DRAM when adding DCPMM modules in Memory
Mode.
i. HP Z6G4 configured with some AMD Graphics are limited to 1TB of total DCPMM and DRAM memory.
See AMD Graphics specifications for details.
NOTE 2: Requires 2nd processor option.

Multimedia and Audio Devices

Multimedia and Audio Devices
Option
Integrated Realtek HD ALC221 Audio Y N
Optical and Removable Storage

Configured Option Kit Number Notes
HP SlimTray Optical Drives
HP 9.5mm Slim Blu Ray Disc Writer Y Y K3R65AA 1
HP 9.5mm Slim DVD ROM Y Y K3R63AA 1
HP 9.5mm Slim DVD Writer Y Y K3R64AA 1
HP Half Height Optical Drives
HP HH DVD Writer (16X RW DVD-R) N Y 4AR67AA
HP SD Card Reader
HP SD 4 Card Reader Y Y Y0L99AA
HDD Frame/Carriers
HP DX175 Removable HDD Carrier N Y 1ZX72AA
HP DX175 Removable HDD Frame/Carrier N Y 1ZX71AA
NVMe Frame/Carrier
HP QX310 Removable NVMe Frame/Carrier
Y N 8GQ89AA/AT
w/PCIe card
HP QX310 Removable Carrier only N Y 8GQ91AA/AT
NOTE 1: Installing an optical drive into Z6 G4 requires a 5.25” external bay adapter 746536-001 which
is included in the ODD kit.
Actual speeds may vary. No support for DVD-RAM (DVD Writer). Does not permit copying of
commercially available DVD movies or other copyright protected materials. Intended for creation and
storage of your original material and other lawful uses. Double Layer discs can store more data than
single layer discs. However, double-layer discs burned with this drive may not be compatible with
many existing single-layer DVD drives and players.
With Blu-ray, certain disc, digital connection, compatibility and/or performance issues may arise, and
do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order
for some Blu-ray titles to play, they may require a DVI or HDMI digital connection and your display may
require HDCP support. HD-DVD movies cannot be played on this workstation.
Networking and Communications

Factory Option Kit
Configure Option Part Support
d Kit Number Notes
NVIDIA® Mellanox® ConnectX-6 DX Dual Port
Y Y 436M8AA 1
10/25GbE SFP28 NIC
HP i350-T2 PCIe Dual Port Gigabit NIC Y Y V4A91AA
Intel® i350-T4 PCIe 4-Port Gigabit NIC N Y W8X25AA

Intel® Ethernet I210-T1 PCIe x1 Gb NIC Y Y E0X95AA
Aquantia® NBASE-T 5GbE PCIe NIC N Y 1PM63AA
HP Dual Port 10GBase-T NIC Module Y Y 1QL49AA
Intel® 8265 802.11 a/b/g/n/ac + BT PCIe WLAN N Y 1QL48AA
Intel® X550-T2 10GbE Dual Port NIC Y Y 1QL46AA
Intel® X710-DA2 10GbE SFP+ Dual Port NIC Y Y 1QL47AA 2
HP 10GbE SFP+ SR 1 Transceiver
st Y Y C3N53AA
HP 10GbE SFP+ SR 2 Transceiver
nd Y Y C3N53AA
Intel® Wi-Fi 6 AX200 & BT PCIe N Y 7CE01AA 2
Intel AX210 Wi-Fi 6e non-vPro +Bluetooth 5.2 N Y 340L7AA
External Antenna WLAN
Allied Telesis AT-2914SX/LC-901 1GB LC Fiber NIC Y Y 1C7Q2AA
Allied Telesis AT-2911T/2-901 Dual Port 1GbE NIC Y Y 6E3Y9AA/AT
Note 1: 3rd part transceivers sold separately. You must have a transceiver installed in order to connect
this card to a network.
Note 2: Windows 7 is NOT supported
Racking and Physical Security

Racking and Physical Security
Option
HP Z4/Z6 Side Panel Barrel Keylock Y N
HP Solenoid Lock / Hood Sensor Y N
HP Z4/Z6 Depth Adjustable Fixed Rail Rack Kit N Y 2HW42AA
HP Z2 Mini/Z2 TWR/Z4/Z6 Dept Adj Fixed Rail Rack Kit Y 2A8Y5AA
HP Keyed Cable Lock 10mm N Y T1A62AA
Input Devices
Option Kit
HP Wireless Business Slim Keyboard and Mouse Y Y N3R88AA
Business Slim PS/2 Wired Keyboard Y Y N3R86AA
USB Business Slim Wired Keyboard Y Y N3R87AA
USB Premium Wired Keyboard Y Y Z9N40AA
USB Wired SmartCard CCID Keyboard Y Y E6D77AA
HP 320K Wired Keyboard Y Y 9SR37AA
HP Optical USB Mouse Y Y QY777AA
HP PS/2 Mouse Y Y QY775AA
HP USB Hardened Mouse Y Y P1N77AA
HP Creator 935 Black Wireless Mouse N Y 1D0K8AA
HP Wired 320M Mouse Y Y 9VA80AA
Other Hardware
Option Kit
Factory Part
Configured Option Kit Number Support Notes
HP ENERGY STAR® Certified Configuration Y
HP Z Premium Front I/O 2xUSB-A 2xUSB-C Y Y 1XM32AA
HP Z6 G4 Memory Cooling Solution Y Y 2HW44AA Note 1
HP Internal USB Port Kit N Y EM165AA Note 2
HP eSATA 2 port PCI Bulkhead Kit Y Y GM110AA
HP Serial Port Adapter Y Y PA716A
HP Workstation Mouse Pad Y
Note 1: Z6 G4 configurations that include a 2nd CPU require the HP Z6 Memory Cooling Solution, which
is available both CTO (2JA81AV) and AMO (2HW44AA). Z6 G4 configurations that include greater than
32GB total system memory require the HP Z6 Memory Cooling Solution, which is available both CTO
(2JA81AV) and AMO (2HW44AA).
Note 2: The HP Internal USB Port kit has a single USB 2.0 type A connector.

Application Option Kit

Factory Part
Software Configured Option Kit Number Support Notes
Sobey Video Editing SW Y N
HP ZCentral Remote Boost N N
Data Science Stack Y N 1, 2
WSL2/Ubuntu Data Science Stack Y N 1, 3
*Not all Application Software for Z Desktop Workstations is included with purchase.
Note 1: Only available with NVIDIA graphics cards selections.
Note 2: Only available with Ubuntu 20.04 LTS preinstall.
Note 3: Only available with Windows 10 Pro for Workstations or Windows 11 Pro for Workstations.

Operating Systems Support Notes

Windows 11 Pro for Workstations Note 4,1
Windows 10 Pro for Workstations Note 3,4,1
Ubuntu 20.04 LTS Note 2
HP Linux® Installer Kit Note 2
Red Hat® Enterprise Linux® (RHEL) Workstation - Paper License (1yr) Note 2,5
NOTE 1: Available with Windows Subsystem for Linux® (WSL2).
NOTE 2: For detailed Linux® OS/hardware support information, see:
http://www.hp.com/support/linux_hardware_matrix
NOTE 3: Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with
Windows 11. Upgrade timing may vary by device. Features and app availability may vary by region.
Certain features require specific hardware (see Windows 11 Specifications).
NOTE 4: Not all features are available in all editions or versions of Windows. Systems may require
upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full
advantage of Windows functionality. Windows is automatically updated and enabled. High speed
internet and Microsoft account required. ISP fees may apply and additional requirements may apply
over time for updates. See http://www.windows.com.
NOTE 5: This second OS must be ordered with the HP Linux® Installer Kit as the first OS.

System Technical Specifications
System Board
System Board Form Main System Board:
Factor 24 x 31 cm
9.6 x 12.2 inches
2nd CPU/Memory Board (optional):

14.9 x 29.2 cm
5.85 x 11.50 inches
Processor Socket FCLGA3647 (Socket P)

1st CPU on system board
2nd CPU on optional 2nd CPU/Memory Module
CPU Bus Speed UPI: Up to 10.4GT/second, depending on processor
Chipset Intel® C622 Chipset
Super I/O Controller Nuvoton SIO15
Memory Expansion 6 on system board (CPU0) + 6 on optional 2nd CPU/Memory Module (CPU1)
Slots
Memory Type DDR4 R-DIMM (Registered), ECC: 8GB, 16GB, 32GB, and 64GB
Supported
Memory Modes NUMA (Non-Uniform Memory Architecture), Memory Node Interleave
Memory Speed 2133MT/s, 2400MHz, 2666MT/s, and 2933MT/s
Supported
Available Memory Configurations:
Single Processor
CPU 0
Top Slots Bottom Slots
Perf
Capacity DIMM1 DIMM2 DIMM3 DIMM4 DIMM5 DIMM6
Rating
8 GB 8 GB Fair
16 GB 8 GB 8 GB Good
24 GB 8 GB 8 GB 8 GB Better
32 GB
16 GB 16 GB Good
8 GB 8 GB 8 GB 8 GB 8 GB 8 GB Best
48 GB
16 GB 16 GB 16 GB Better
64 GB
32 GB 32 GB Good
96 GB
32 GB 32 GB 32 GB Better
128 GB 32 GB 32 GB 32 GB 32 GB Better
192 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB Best
256 GB 64 GB 64 GB 64 GB 64 GB Better
384 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB Best

Dual Processor
CPU 0 CPU 1
Top Slots Bottom Slots Top Slots Bottom Slots
DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
Capacity Rating
1 2 3 4 5 6 1 2 3 4 5 6
16 GB 8 GB 8 GB Fair
32 GB 8 GB 8 GB 8 GB 8 GB Good
48 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB Better
8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB Better
64 GB
16 GB 16 GB 16 GB 16 GB Good
8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB Best
96 GB
16 GB 16 GB 16 GB 16 GB 16 GB 16 GB Better
128 GB
32 GB 32 GB 32 GB 32 GB Good
16 GB 16 GB 16 GB 16 GB 16 GB 16 GB 16 GB 16 GB 16 GB 16 GB 16 GB 16 GB Best
192 GB
32 GB 32 GB 32 GB 32 GB 32 GB 32 GB Better
256 GB
64 GB 64 GB 64 GB 64 GB Best
32 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB 32 GB Better
384 GB
512 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB Fair
768 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB Good

Memory Loading Order:
Load Order for Single and Dual Processor Configuration
Maximum Memory Supports up to 768 GB DDR4-2933 ECC RAM* (transfer rates up to 2933MT/s) and 384 GB DDR4-2666 ECC
RAM (transfer rates up to 2666MT/s).
Memory Configuration • Only Registered ECC DIMMs are supported.

(Supported) • Do not install memory modules into memory slots if corresponding processor is not installed.
• Dual processor configurations with memory modules installed for only one processor is not
supported.
Notes For systems installed with Microsoft Windows 7 (Ultimate, Enterprise or Pro), the maximum accessible
system memory is 192GB
*768 GB configuration requires 2 CPUs configuration.
NVDIMM Memory Intel® Optane™ DC Persistent Memory is available factory configured in the following capacities:
• 128GB (1x128GB) Single Processor Configuration
• 256GB (2x128GB) Single Processor Configuration
• 512GB (4x128GB) Dual Processor Configuration
NOTES:
a. Supported only with Xeon 82xx, 62xx, 52xx and 4215/4215R processors.
b. Available as factory configured in Memory Mode or Storage Mode.
c. Systems configured with DCPMM memory will operate the memory subsystem at 2666 MT/s.
d. Operating System Support:
i. Windows 11 Pro for Workstations with all updates applied.
ii. Windows 10 Pro for Workstations v1903 or later with all updates applied.
iii. Linux OS support may be found in the Linux Hardware Support Matrix.
e. Detailed setup, security and support information may be found in the Intel® Optane™ DC
Persistent Memory: Configuration and Setup on HP Z6 G4 and Z8 G4 Workstation white paper.
f. DCPMM solutions require additional DRAM memory to be included in the solution:


i. Systems configured with DCPMM in Memory Mode will include DRAM memory to be used as
cache. The amount of included DRAM memory is based on an 8:1 DCPMM to DRAM capacity
ratio.
ii. Systems configured with DCPMM in Storage Mode will require DRAM System Memory to be
ordered separately.
iii. DCPMM Memory will report approximately 2% less than advertised capacity .
g. Total Memory (DCPMM + DRAM) per processor must be <= 1TB or 2TB per dual processor system.
i. When Configured in Memory Mode, additional DRAM does not count against maximum
processor memory.
ii. Maximum number of DCPMM modules in a Z6G4 is 4 per processor.
h. Customer is responsible for additional required DRAM when adding DCPMM modules in Memory
Mode.
i. HP Z6G4 configured with some AMD Graphics are limited to 1TB of total DCPMM and DRAM
memory. See AMD Graphics specifications for details.
PCI Express Connectors Slot 0:

Mechanical-only, for use with devices that require only rear bulkhead mounting or when 2nd CPU riser is
installed
Slot 1:
PCI Express Gen3 x4 - CPU with open-ended connector*
Slot 2:
Slot 3:
Slot 4:
PCI Express Gen3 x8 – CPU with open-ended connector (slot converts to x4 electrical when SSD is
installed in 2nd M.2 slot)*
Slot 5:
Slot 6:
M.2 Slot 1:
M.2 Slot 2:
* Open-ended connector allows a greater bandwidth (e.g. x16) card to be installed physically into a lower
bandwidth connector/slot.
Supported Drive SATA 6 SATA @6Gb/s, supports RAID 0, 1, 5, & 10

Interfaces
Serial Attached SCSI Requires Optional PCIe card
Factory Configured SATA RAID 0 Striped Array

RAID SATA RAID 1 Mirrored Array
SATA RAID 10 Striped/Mirrored


Notes:
Factory integrated Intel® SATA RAID is Microsoft Windows only.
External SATA (eSATA) Supported on all SATA ports configurable with optional eSATA* cable kit
* hot plug / hot swap not supported with eSATA
Network Controller Integrated Intel® Supports the following management functionalities: Intel® AMT11.2, TXT, DASH
I219LM GbE LAN 1.1, WOL, VLAN, and PXE 2.1
Integrated Intel X722 Data rates supported: 1000 Mb/s

for 1GbE Compliance IEEE 802.1as/1588v2, 802.1p, 802.1Q, 802.3, 802.3ab, 802.3az,
802.3x
Up to 16 UDP/TCP programmable filters
Bus architecture: PCIe 3.0
UEFI and PXE Boot ROM support
Intel iWARP Support (RDMA)
Network transfer rates:
1000BASE-T (full-duplex) 2000 Mb/s
Management capabilities: WOL (Excluding Max Power Savings), auto MDI
crossover, PXE, Quad Hash filtering, RSS, Advanced cable
diagnostics
USB Connector(s) Front Front I/O Entry: 4 USB 3.1 Gen1 (Left-most Port has Charging Capability)
Front I/O Premium: 2x USB 3.1 Gen1, 2x USB 3.1 Gen2 Type-C™ (Left-most Port
has Charging Capability)
• Charging Ports provide 1.5 Amps @ 5 Volts
• Standard USB Type A Ports provide 900mA @ 5 Volts
• USB Type C Ports provide 3 Amps @ 5 Volts and adhere to the Power
Delivery 3.0 specification.
Rear 6 USB 3.1 G1 Type A
Internal 1 USB 3.1 G1 single-port header

1 USB 2.0 single-port header
1x USB 2.0 dual-port header
Integrated Graphics No
HD Integrated Audio Realtek ALC221
Flash ROM Yes
CPU Fan Header One for each CPU socket
Rear Chassis Fan Header Yes
Front PCI Fan Header Yes
CMOS Battery Holder - Yes
Lithium
Integrated Trusted Trusted Platform Module (TPM) 2.0 (Infineon SLB 9670)
Platform Module Common Criteria EAL4+ Certified
FIPS 140-2 Certified (firmware v7.85)
TPM Certified products list:
https://trustedcomputinggroup.org/membership/certification/tpm-certifiedproducts/
Power Supply Headers Yes
Power Switch, Power Yes
LED & Hard Drive LED
Header


Clear Password Jumper Yes
Serial Port 1 internal header
Parallel Port No
Keyboard/Mouse USB or PS/2
Hood Lock Header Yes
Hood Sensor Header Yes
Memory Fan 1 Memory Fan Header per CPU
AUX IN (audio) No
Z6 Required Power Supply Info

1000W 90% Efficient, Custom PSU
Power Supply
(Wide Ranging, Active PFC)
Operating Voltage Range 90–269 VAC
100-127 VAC
Rated Voltage Range 118 VAC
200-240 VAC
Rated Line Frequency 50-60 Hz 400 Hz
Operating Line Frequency Range 47-66 Hz 393-407 Hz
12 A @ 100-127 VAC
Rated Input Current 12A @ 118 VAC
6.3 A @ 200-240 VAC
Heat Dissipation Typical = 2467 btu/hr
(Configuration and software dependent) Maximum = 4112 btu/hr
Power Supply Fan 80x25 mm variable speed
ENERGY STAR® Qualified
Yes
(Configuration dependent)
Yes, 90% Efficient
The Z6 G4 1000W power supply efficiency report can be found at this link:
80 PLUS® Compliant
https://plugloadsolutions.com/psu_reports/HP_D15-
1K0P1A_1000W_ECOS%204838_Report.pdf
FEMP Standby Power Compliant @115V
Yes
(<1W in S5 – Power Off)
EuP Compliant @ 230V Yes
(<0.5 W in S5 – Power Off)
CECP Compliant @ 220V Yes; Configuration dependent
(<4W in S3 – Suspend to RAM)
Power Consumption in sleep mode
(as defined by ENERGY STAR®) – Suspend to RAM
<= 20W
(S3)
(Instantly Available PC)
Built-in Self Test LED Yes
Surge Tolerant Full Ranging Power Supply
Yes
(withstands power surges up to 2000V)
Sensor Header Integrated in Front User Interface (Power Switch, Power LED, HDD LED,
Speaker) Cable
Integrated Gigabit Ethernet Integrated Intel® I219LM GbE LAN
Clear CMOS Button Yes

System Configuration
Example Z6 G4 Processor 1x Intel Xeon 3104 (Six-core)
Configuration #1 Memory 1x 8GB DDR4-2666 (Registered DIMM)
Graphics 1x NVIDIA Quadro P400
Disks / Optical 1x 500GB SATA 7200 ; 1x Slim DVD-ROM SATA
Power Supply 1000W 90% custom PSU
Other NA
115 VAC 230 VAC 100 VAC
Energy Consumption LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Enabled
Windows Idle (S0) 54.109 54.586 54.906

Windows Busy Typ(S0) 94.256 94.275 94.043
Windows Busy Max (S0) 95.992 95.268 95.643
Sleep (S3) 6.219 6.205 6.319 6.306 6.334 6.239
Off (S5) 3.354 3.343 3.521 3.341 3.350 3.342
Zero Power Mode (ErP) 0.209 0.388 0.195
115 VAC 230 VAC 100 VAC

Heat Dissipation LAN Enabled LAN Disabled LAN Enabled LAN Enabled LAN Disabled LAN Enabled
(Btu/hr) Windows Idle (S0) 184.619 186.247 187.339
Sleep (S3) 21.219 21.171 21.561 21.516 21.611 21.287
Off (S5) 11.444 11.406 12.014 11.399 11.430 11.403
Example Z6 G4 Processor 1x Intel Xeon 4108 (Eight-core)

Disks / Optical 2x 1TB SATA 7200 ; 1x Slim DVDRW SATA
Other NA
Energy Consumption 115 VAC 230 VAC 100 VAC
(Watts) LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Enabled
Windows Idle (S0) 61.661 61.531 61.354

Sleep (S3) 7.231 7.177 7.229 7.217 7.324 7.248
Off (S5) 3.376 3.366 3.527 3.512 3.354 3.350
115 VAC 230 VAC 100 VAC



Sleep (S3) 24.624
24.672 24.488 24.665 24.989 24.730
Off (S5) 11.519 11.484 12.034 11.983 11.443 11.430

Example Z6 G4 Processor 1x Intel Xeon 6136 (Twelve-core)

ENERGY STAR Graphics 1x NVIDIA QuadroP4000
QUALIFIED Disks/Optical 2x 1TB SATA 7200 ; 1x Slim DVDRW SATA
Other NA
Windows Idle (S0) 79.074 79.109 79.938

Sleep (S3) 7.847 7.756 7.878 7.826 7.931 7.852
Off (S5) 3.353 3.348 3.535 3.489 3.373 3.355
115 VAC 230 VAC 100 VAC

Sleep (S3) 26.774 26.463 26.880 26.702 27.061 26.791
Off (S5) 11.441 11.426 12.061 11.904 11.509 11.447
Example Z6 G4 Processor 2x Intel Xeon 8160 (Dual 24-core)

Disks / Optical 4x 2TB SATA 7200 ; 1x Slim DVDRW SATA
Other NA
Windows Idle (S0) 112.388 115.635 112.102

Sleep (S3) 14.208 13.833 14.698 14.487 15.176 13.886


Off (S5) 3.511 3.418 3.575 3.570 3.509 3.412
115 VAC 230 VAC 100 VAC

Sleep (S3) 48.478 47.198 50.150 49.430 51.781 47.379
Off (S5) 11.980 11.662 12.198 12.181 11.973 11.642
NOTE: Power consumption measurements do not take advantage of the Intel Turbo Boost Technology. As a result, power consumption
measurements may be higher.
DECLARED NOISE EMISSIONS

System Configuration Processor Info Intel® Xeon® Gold 6130 processor 2.1GHz 12C CPU
(Entry level) Memory Info 24GB (3x8GB) DDR4-2666 ECC Memory RDIMMs
Graphics Info 1-NVIDIA® Quadro® P400 2GB
Disks/Optical 1-500GB SATA 7200RPM 3.5” HDD / 1-HP 9.5mm Slim Blu Ray Disc Writer
Power Supply 1000 W
Declared Noise Emissions Sound Power Deskside Sound Pressure

(in accordance with ISO (LWAd, bels) (LpAm, decibels)
7779 and ISO 9296) Idle 3.3 15
Hard drive Operating 3.5 18
(random reads)
System Configuration Processor Info Intel® Xeon® Platinum 8168 processor 2.7GHz 24C CPU
(Mid-range) Memory Info 96GB (6x16GB) DDR4-2666 ECC Memory RDIMMs
Disks/Optical 2-4TB 6Gb/s 7200RPM SATA HDD / 1-HP 9.5mm Slim Blu Ray Disc Writer
Power Supply 1000 W

7779 and ISO 9296) Idle 3.8 23
(random reads)


System Configuration Processor Info 2-Intel® Xeon® Gold 6136 processor 3.0GHz 12C CPU
(High end) Memory Info 192GB (12x16GB) DDR4-2666 ECC Memory RDIMMs
Disks/Optical 2-4TB 6Gb/s 7200RPM SATA HDD / 1-HP 9.5mm Slim Blu Ray Disc Writer
Power Supply 1000 W

7779 and ISO 9296) Idle 3.8 23
(random reads)
ENVIRONMENTAL DATA
Environmental Temperature Operating: 5° to 35° C (40° to 95° F)
Requirements Non-operating: -40° to 60° C (-40° to 140° F)
Humidity Operating: 10% to 85% RH, non-condensing, 35° C maximum wet bulb
Non-operating: 10% to 90% RH, non-condensing, 35° C maximum wet bulb
Maximum Altitude Operating: 3,048 m (10,000 feet)
Above 1524 m (5,000 feet) altitude, the maximum operating temperature is

reduced by 1° C (1.8° F) for every 305 m (1,000 feet) increase in elevation
Non-operating: 9,144 m (30,000 feet)
Shock (non-repetitive) Operating: ½-sine: 40g, 2-3ms (~62 cm/sec)

Non-operating: ½-sine: 160 cm/s, 2-3ms (~105g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025g²/Hz
Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz
Physical Security and Serviceability

Access Panel Tool-less
Includes system board and memory information.
Optical Drive Tool-less, no carrier or rails required
Hard Drives Tool-less
Optional 5.25" external bay carriers
Expansion Cards Tool-less
Processor Socket 1st socket on main system board. 2nd socket on optional 2nd CPU/Memory Module.
Blue User Touch Points Yes, on primary serviceable components.
Color-coordinated Cables Yes
and Connectors


Memory Tool-less
System Board Torx T15 screws
2nd CPU/Memory Module: Tool-less
Front of Computer LEDs Dual Color Power/Failure LED = Yes

HDD Activity LED = Yes
Configuration Record SW Yes

Over-Temp Warning on Yes, at POST screen on reboot
Screen
Restore CD/DVD Set Yes, restores the computer to its original factory shipping image; can be obtained via HP Support.
Dual Function Front Yes, also acts as a reset switch when held for 4 seconds.
Power Switch
Padlock Support Yes
Cable Lock Support Kensington Cable Lock (optional): Prevents entire system theft and system access. 3mm x 7mm slot at
rear of system
Universal Chassis Clamp No
Lock Support
Solenoid Lock and Hood Access Panel Solenoid Lock: Yes (optional). Activated remotely to prevent system entry.
Sensor Access Panel Intrusion Sensor: Yes (optional).
Removable Media Yes, user can prevent the workstation from writing to or booting from removable media.
Write/Boot Control
Power-On Password Yes, prevents an unauthorized person from booting up the workstation
Setup Password Yes, prevents an unauthorized person from changing the workstation configuration
3.3V Aux Power LED on Yes
System PCA
NIC LEDs (integrated) Yes
(Green & Amber)
CPUs and Heatsinks CPU heatsink removal requires a T-30 Torx screwdriver.
Power Supply Diagnostic Yes
LED
Front Power Button Yes
Rear Power Button Yes
Front Power LED Yes, white (normal), red (fault)
Front Hard Drive Activity Yes, white

LED
Front ODD Activity LED Yes on device
Internal Speaker Yes
System/Emergency ROM Recovers corrupted system BIOS.

Flash Recovery
Cooling Solutions Air cooled forced convection
Power Supply Fans 1 - 80 mm x 80 mm x 25 mm (non-serviceable)
CPU Heatsink Fan 1st CPU: 1 - 80mm
Optional 2nd CPU: 1 - 60mm x 25mm
Memory Fan Front memory fan: 1 – 80mm x 25mm
Memory duct blower: 1 – 90mm x 25mm
2nd CPU/Memory Module: 1 - 60mm x 25mm


Chassis Fans Front chassis fan : 1 - 120mm x 25mm
Rear chassis fan: 1 - 120mm x 25mm
HP Vision Diagnostics HP PC Hardware Diagnostics (UEFI) enables hardware level testing outside the operating system on
Offline Edition many components. The diagnostics can be invoked by pressing ESC then F2 upon the PC reboot, and is
available as a download from HP Support.
Access Panel Key Lock Yes, side panel barrel keylock (optional from the factory only)
ACPI-Ready Hardware Advanced Configuration and Power Management Interface (ACPI).
• Allows the system to wake from a low-power mode.

• Controls system power consumption, making it possible to place individual cards and
peripherals in a low-power or powered-off state without affecting other elements of the
system
Trusted Platform Module Integrated Infineon TPM 2.0. TCG and FIPS 140-2 Certified
Chip
Integrated Chassis Yes, Front handle and dedicated rear recess
Handles
Power Supply Requires T15 Torx or flat blade screwdriver
PCIe Card Retention Yes, tool-less
Rear (all)
Middle (full-height cards)
Front (full-length cards with extender)
Flash ROM Yes
Diagnostic Power Switch Yes
LED on board
Clear Password Jumper Yes
Clear CMOS Button Yes
CMOS Battery Holder Yes
DIMM Connectors Yes
BIOS
BIOS 32-bit Services Standard BIOS 32-bit Service Directory Proposal v0.4
PCI 3.0 Support Full BIOS support for PCI Express through industry standard interfaces.
ATAPI ATAPI Removable Media Device BIOS Specification Version 1.0.
BBS BIOS Boot Specification v1.01.
WMI Support WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is
fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM)
and WBEM specifications.
BIOS Boot Spec 1.01+ Provides more control over how and from what devices the workstation will boot.
BIOS Power On Users can define a specific date and time for the system to power on.
ROM Based Computer Review and customize system configuration settings controlled by the BIOS.
Setup Utility (F10)
System/Emergency ROM Recovers system BIOS in corrupted Flash ROM.
Flash Recovery with
Video
Replicated Setup Saves BIOS settings to USB flash device in human readable file (HpSetup.txt).
BiosConfigurationUtility.exe utility can then replicate these settings on machines being deployed
without entering Computer Configuration Utility (F10 Setup).
SMBIOS System Management BIOS 2.8, for system management information.
Boot Control Disables the ability to boot from removable media on supported devices.
Memory Change Alert Alerts management console if memory is removed or changed.


Thermal Alert Monitors the temperature state within the chassis. Three modes:
• NORMAL - normal temperature ranges.
• ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to avoid
shutdown or provide for a smoother system shutdown.
• SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer
without warning before hardware component damage occurs.
Remote ROM Flash Provides secure, fail-safe ROM image management from a central network console.
ACPI (Advanced Allows the system to enter and resume from low power modes (sleep states).
Configuration and Power Enables an operating system to control system power consumption based on the dynamic workload.
Management Interface) Makes it possible to place individual cards and peripherals in a low-power or powered-off state without
affecting other elements of the system.
Supports ACPI 5.0 for full compatibility with 64-bit operating systems.
Ownership Tag A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/Remote System administrators can power on, restart, and power off a client computer from a remote location.
Shutdown
Instantly Available PC Allows for very low power consumption with quick resume time.
(Suspend to RAM - ACPI
sleep state S3)
Remote System Allows a new or existing system to boot over the network and download software, including the
Installation via F12 (PXE operating system.
2.1) (Remote Boot from
Server)
ROM revision levels Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is
available through an industry standard interface (SMBIOS and WMI) so that management SW
applications can use and report this information.
System board revision Allows management SW to read revision level of the system board.
level Revision level is digitally encoded into the HW and cannot be modified.
Start-up Diagnostics Assesses system health at boot time with selectable levels of testing.
(Power-on Self-Test)
Auto Setup when new System automatically detects addition of new hardware.
hardware installed
Keyboard-less Operation The system can be booted without a keyboard.
Localized ROM Setup Common BIOS image supports System Configuration Utility (F10 Setup) menus in 14 languages with
local keyboard mappings.
Asset Tag The user or MIS to set a unique tag string in non-volatile memory.
Per-slot Control Allows I/O slot parameters (option ROM enable/disable, bus latency) to be configured individually.
Adaptive Cooling Control parameters are set according to detected hardware configuration for optimal acoustics.
Pre-boot Diagnostics (Pre-video) critical errors are reported via beeps and blinks on the power LED.
Industry Standard
Specification Support
Industry Standard Revision Supported by the BIOS
UEFI Specification 2.6
Revision
ACPI Advanced Configuration and Power Management Interface, Version 5.0
ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b
CD Boot "El Torito" Bootable CD-ROM Format Specification Version 1.0
EDD - Enhanced Disk Drive Specification Version 1.1
- BIOS Enhanced Disk Drive Specification Version 3.0
EHCI Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI PCI Local Bus Specification, Revision 2.3
PCI Power Management Specification, Revision 1.1
PCI Firmware Specification, Revision 3.0, Draft .7


PCI Express PCI Express Base Specification, Revision 2.0
PCI Express Base Specification, Revision 3.0
PMM POST Memory Manager Specification, Version 1.01
SATA Serial ATA Specification, Revision 1.0a
Serial ATA 3 Gb/s: Serial ATA Specification, Revision 2.5
Serial ATA 6 Gb/s: Serial ATA Specification, Revision 3.0
SPD PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B
TPM Trusted Platform Module (TPM) 2.0 (Infineon SLB 9670)
Common Criteria EAL4+ Certified
FIPS 140-2 Certification
TCG TPM Certified products list:
http://www.trustedcomputinggroup.org/certification/tpm-certified-products/
UHCI Universal Host Controller Interface Design Guide, Revision 1.1
USB Universal Serial Bus Revision 1.1 Specification

Universal Serial Bus Revision 2.0 Specification
Universal Serial Bus Revision 3.1 Specification
SMBIOS System Management BIOS Reference Specification, Version 2.8
External BIOS simulator found at: http://csrsml.itcs.hp.com/
Social and Environmental Responsibility

Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and may be
Declarations labeled with one or more of these marks:
• ENERGY STAR® (energy-saving features available on selected configurations-Windows only)

• US Federal Energy Management Program (FEMP)
• China Energy Conservation Program
• The ECO declaration (TED)
• TCO Certified configurations available*
*TCO Certified configurations available when ENERGY STAR configurations are selected with a USB
Type-C® connector. ENERGY STAR available with a combination of high-performance CPU's, high-
performance GPU's and select memory configurations.
The Z6 G4 is registered EPEAT® Silver in the US and Canada. EPEAT® registration varies by country. See
http://www.epeat.net for registration status by country. Search keyword generator on HP’s 3 rd party
option store for solar generator accessories at http://www.hp.com/go/options
Batteries The battery in this product complies with EU Directive 2006/66/EC
Battery mass: 3g
Battery type: Lithium Metal
The battery in this product does not contain:
• Mercury greater than 5ppm by weight

• Cadmium greater than 10ppm by weight
• Lead greater than 40ppm by weight
Restricted Material Usage This product meets the material restrictions specified in HP's General Specification for the Environment.


HP Inc. is committed to compliance with all applicable environmental laws and regulations, including
the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed
compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis
.
Low Halogen Statement This product is low halogen except for power cords, external cables and peripherals. Service parts
obtained after purchase may not be low halogen.
(NOTE: optional low-halogen power cables are available for some countries in Europe)
End-of-Life Management HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a responsible manner. This
product is greater than 90% recyclable by weight when properly disposed of at end of life.
HP Inc. Corporate For more information about HP's commitment to the environment:
Environmental Sustainability Report
Information
Eco-label certifications:
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificate:

http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
Additional Information • This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC. Product Disassembly Instructions
• Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and
ISO1043.
Packaging HP Workstation product packaging meets the HP's General Specification for the Environment
• Does not contain restricted substances listed in HP Standard 011-1 General Specification for
the Environment
• Does not contain ozone-depleting substances (ODS)
• Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of
100 ppm sum total for all heavy metals listed
• Maximizes the use of post-consumer recycled content materials in packaging materials
• All packaging material is recyclable
• All packaging material is designed for ease of disassembly
• Reduced size and weight of packages to improve transportation fuel efficiency
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards
formatting
• A multi-unit eco packaging option is available to institutional customers that uses less
packaging material or has a lower volume footprint than conventional single-unit packaging.
Please contact your sales representative for additional details.
Packaging Materials
Internal Cushions and plastic bags made of low density polyethylene (LDPE).
External Outer carton, accessories carton, and insert made of corrugated paper board.
Manageability
Industry Standard This product meets the following industry standard specifications for manageability functionality:
Specifications
• DASH 1.1 (via Intel® LAN on motherboard)
Intel® Active Management Intel® Active Management Technology (AMT) 11.2x

Technology (AMT)


An advanced set of remote management features and functionality providing IT administrators the
latest and most effective tools to remotely discover, heal, and protect networked client systems
regardless of the system's health or power state. AMT 11.2x includes the following advanced
management functions:
• Power Management (on, off, reset, graceful shutdown, sleep and hibernate)
o Support in Max Power Savings (Shutdown and Hibernate Modes)
• Hardware Inventory (includes BIOS and firmware revisions)
• Hardware Alerting
• Agent Presence
• System Defense Filters
• Serial Over LAN (SOL)
• USB Redirect (Media Redirection)
• ME Wake-on-LAN (WOL), even with Maximum Power Savings Enabled
• DASH 1.1 compliance
• IPv6 Support
• Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS
screen, periodic connections, or alert triggered connection
• Remote Scheduled Maintenance - pre-schedule when the system connects to the IT or service
provider console for maintenance.
• Remote Alerts - automatically alert IT or service provider if issues arise
• Access Monitor - Provides oversight into Intel® AMT actions to support security requirements
• PC Alarm Clock
• Microsoft NAP Support
• Host Base set-up and configuration
• Management Engine (ME) firmware roll back
• Local Time Sync to UTC
• Remote Memory Dump Command – Creates memory dump for debug
Intel® vPro™ Technology The HP Z6 G4 Workstation supports Intel® vPro™ technology when configured as outlined below:
• Intel® Xeon® processor Scalable Family

• Intel® C622 chipset
• Intel® I219LM GbE LAN
Remote Manageability The HP Z6 G4 Workstation is supported on the following remote manageability software consoles:
Software Solutions
• LANDesk Management Suite (HP recommended solution)
• Microsoft System Center Configuration Manager
• HP Client Automation Enterprise
For questions or support for manageability needs, please visit

http://www.hp.com/go/clientmanagement
System Software For questions or support for SSM, please visit: http://www.hp.com/go/ssm
Manager
Service, Support, and On-site Warranty and Service (Note 1): Three-years, limited warranty and service offering delivers on-
Warranty site, next business-day (Note 2) service for parts and labor and includes free telephone support (Note 3)
8am - 5pm. Global coverage (Note 2) ensures that any product purchased in one country and
transferred to another, non-restricted country will remain fully covered under the original warranty and
service offering. 24/7 operation will not void the HP warranty.
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized
HP third-party provider, and is not available in certain countries. Global service response times are
based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party


hardware and software. Toll-free calling and 24x7 support service may not be available in some
countries.
HP Care Pack Services extend service contracts beyond the standard warranties. Service starts from
date of hardware purchase. To choose the right level of service for your HP product, use the HP Care
Pack Services Lookup Tool at: http://www.hp.com/go/lookuptool. Additional HP Care Pack Services
information by product is available at: http://www.hp.com/hps/carepack. Service levels and response
times for HP Care Packs may vary depending on your geographic location.
Product Change • Program to proactively communicate Product Change Notifications (PCNs) and Customer
Notification Advisories by email to customers, based on a user-defined profile.
• PCNs provide advance notification of hardware and software changes to be implemented in the
factory providing time to plan for transition.
• Customer Advisories provide concise, effective problem resolution, greatly reducing the need
to call technical support.

Stable & Consistent Offerings
Global Series SKUs As part of its commitment to hardware, software, and solution innovation, HP is proud to introduce
this breakthrough platform configuration stability to HP Workstation customers. HP Stable &
Consistent Offerings are built on the foundation of a carefully chosen set of hardware and software
designed and tested to work with all HP Z Workstation platforms through their end of life. These
components and their corresponding HP Workstation platform compatibility are outlined in this
section.
Stable & Consistent HP Stable & Consistent Offerings are available worldwide to all HP Workstation customers-no
Offerings special programs, no additional cost-no kidding. Simply select your hardware and software
components when you customize your HP Workstation and be assured that you'll be able to buy that
same configuration throughout the lifecycle of the product.
Processors Product # Offering
2DL32AV Intel® Xeon® Gold 6128 processor
2DL33AV, 1XM44AA Intel® Xeon® Gold 6128 2nd processor
2DL22AV Intel® Xeon® Silver 4114 processor
2DL23AV, 1XM49AA Intel® Xeon® Silver 4114 2nd processor
2DL18AV Intel® Xeon® Silver 4108 processor
2DL19AV, 1XM51AA Intel® Xeon® Silver 4108 2nd processor
Hard Drives Product # Offering

Z5H22AV, LQ037AA 1TB SATA 7200 RPM 3.5” HDD
Z5H23AV 1TB 7200RPM SATA 3.5in 2nd
Z5H25AV 1TB 7200RPM SATA 3.5in 3rd
Z5H24AV 1TB 7200RPM SATA 3.5in 4th
Graphics Product # Offering

N/A N/A
Memory Product # Offering

N/A N/A
Optical and Removable Product # Offering

Storage N/A N/A

Technical Specifications - Processors
Intel® Xeon® W-3200 Series CPU

Intel® Xeon® W-3275 2.5 2933 28C processor
Intel® Xeon® Scalable CPU
Intel® Xeon® Gold 6258R processor
Intel® Xeon® Gold 6244 processor
Intel® Xeon® Silver 4216 processor
Intel® Xeon® Silver 4215R processor
Intel® Xeon® Bronze 3206R processor
Intel® Xeon® Bronze 3204 processor

Technical Specifications - Hard Drives
STORAGE/HARD DRIVES
HP SAS (Serial Attached HP 300GB SAS 15K SFF Capacity 300GB
SCSI) Hard Drives for HP HDD Height 5.9 in; 15 cm
Workstations
Width Media Diameter 3.5 in; 8.9 cm
Interface 12Gb/s SAS
Synchronous Transfer Up to 1200 MB/s (SAS single port)*
Rate (Maximum)
Buffer 128MB
Seek Time (typical reads, Average 2.0ms *
includes controller
overhead, including
settling)
Rotational Speed 15K rpm
Operating Temperature 41° to 131° F (5° to 55° C)
*Actual performance may vary.


SATA (Serial ATA) Hard 500GB SATA 7200 rpm Capacity 500GB
Drives for HP 6Gb/s 3.5" HDD Height 1 in; 2.54 cm
Workstations
Physical Size 4 in; 10.17 cm
Interface Serial ATA (6.0Gb/s), NCQ enabled
Synchronous Transfer Up to 600MB/s*
Rate (Maximum)
Buffer 16MB
Seek Time (typical reads, Single Track 2 ms*
includes controller Average 11 ms*
overhead, including
Full Stroke 21 ms*
settling)
Rotational Speed 7,200 rpm
Logical Blocks 976,773,168
1TB SATA 7200 rpm Capacity 1TB

6Gb/s 3.5" HDD Height 1 in; 2.54 cm
Synchronous Transfer Up to 600 MB/s*
Rate (Maximum)
Buffer 64MB
Cache Adaptive
Seek Time (typical reads, Single Track 2 ms*
overhead, including
Full Stroke 21 ms*
settling)
2.0TB SATA 7200 rpm Capacity 2.0TB

6Gb/s 3.5" HDD CMR Height 1 in; 2.54 cm
Interface Serial ATA (6.0 Gb/s), NCQ Enabled
Rate (Maximum)
Buffer 64MB
Seek Time (typical reads, Single Track 1.0 ms*
overhead, including
Full Stroke 18 ms*
settling)


Logical Blocks 3,907,029,168

6Gb/s 3.5" HDD SMR Height 1 in; 2.54 cm
Interface Serial ATA (6.0 Gb/s), NCQ Enabled
Rate (Maximum)
Buffer 64MB
overhead, including
Full Stroke 21 ms*
settling)
Logical Blocks 3,907,029,168

6Gb/s 3.5" HDD Height 1 in; 2.54 cm
Physical Size 4.0 in; 10.17 cm
Synchronous Transfer Up to 6.0 Gb/s*
Rate (Maximum)
Buffer 64MB
overhead, including
Full Stroke Not Specified*
settling)


6Gb/s 3.5" HDD Protocol SATA
(Enterprise Class)
Form Factor 3.5"
Controller AHCI
Reliability (MTBF) 2.0M hours
Rated Power On Hours 8760/yr
Annualized Failure Rate <0.62%
(based on Rated POH)
Rated for 24/7/365 YES
operation
Physical Size (Height) 1 in; 2.54 cm
Physical Size (Width) 4 in; 10.17 cm
Media Diameter 3.5 in; 8.9 cm
Interface Serial ATA (6Gb/s), NCQ enabled
Rate (Maximum)
Buffer 128MB
Seek Time (typical reads, Single Track 0.32ms*
includes controller Average 7.45ms*
overhead, including
Full Stroke 14.2ms*
settling)
Performance Sequential Read up to 226MB/s*
Sequential Write up to 226MB/s*
Enterprise Class Features High Reliability


6Gb/s 3.5" HDD Height 0.275 in; 0.7 cm
(Enterprise Class)
Interface Serial ATA (6Gb/s), NCQ enabled
Rate (Maximum)
Buffer 128MB
Seek Time (typical reads, Single Track 0.7ms*
overhead, including
Full Stroke 15.7ms*
settling)
500GB SATA 7.2K SED Capacity 500GB

SFF HDD Height 0.275 in; 0.7 cm
Interface Serial ATA (6Gb/s)
Rate (Maximum)
Buffer 32MB
Seek Time (typical reads, Single Track 1ms*
overhead, including
Full Stroke 25ms (typical)*
settling)


SATA SSDs for HP HP 256GB SATA 6Gb/s Capacity 256GB
Workstations SSD Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Endurance 192TBW (TB Written)
Reliability (MTTF) 1.5M hours
Physical Size (Height) 0.28 in; 0.7 cm
Physical Size (Width) 2.5 in; 6.36 cm
Interface SATA 6Gb/s
Rate (Maximum)
Performance Sequential Read 530MB/s (max)*
Sequential Write 500MB/s (max)*
Random Read 95K IOPS (max)*
Random Write 83K IOPS (max)*
HP 256GB SATA 6Gb/s Capacity 256GB
SED Opal 2 SSD Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Interface 6Gb/s SATA
Synchronous Transfer Up to 550MB/s (Sequential Read)*
Rate (Maximum)
Performance Sequential Read 530MB/s*
Sequential Write 500 MB/s*
Random Read 95K IOPS*
Random Write 83K IOPS*
Self-Encrypting Drive OPAL 2
Support
HP 512GB SATA 6Gb/s Capacity 512GB
SSD Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC


Rate (Maximum)
Performance Sequential Read 530 MB/s*
HP 512GB SATA SED SSD Capacity 512GB
Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Rate (Maximum)
Self-Encrypting Drive OPAL 1 and 2
Support
HP 1TB SATA 6Gb/s SSD Capacity 1TB
Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Rate (Maximum)


HP 2TB SATA 6Gb/s SSD Capacity 2TB
Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Rate (Maximum)
Sequential Write 500 MB/s *
HP Enterprise Class Capacity 240GB
240GB SATA SSD Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Endurance 2,200TBW (TB Written)
Rate (Maximum)
Enterprise Class Features High Endurance NAND
Power Loss Protection
End-to-End Data Protection


HP Enterprise Class Capacity 480GB
480GB SATA SSD Protocol SATA
Form Factor 2.5"
Controller AHCI
NAND Type 3D TLC
Endurance 4,400TBW (TB Written)
Rate (Maximum)
Enterprise Class Features High Endurance NAND
Power Loss Protection
End-to-End Data Protection
Performance PCIe SSDs HP Z Turbo Drive 256GB Capacity 256GB

for HP Workstations M.2 2280 TLC SSD Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3D TLC
SED Support Opal 2
Endurance 200TB
Interface PCI Express 3.0 x4 electrical x4 physical
Performance Sequential Read 3500 MB/s *
Random Read 240K IOPS *
Random Write 480K IOPS *
HP ZTurbo Drive 512GB Capacity 512GB

M.2 2280 TLC SSD Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3D TLC
SED Support Opal 2
Endurance 300TB


Random Read 460 K IOPS*
HP ZTurbo Drive 1TB M.2 Capacity 1TB

2280 TLC SSD Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3 D TLC
SED Support Opal 2
Endurance 400TB
HP ZTurbo Drive 2TB M.2 Capacity 2TB

2280 TLC SSD Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3 D TLC
SED Support Opal 2
Endurance 500TB
HP Z Turbo Drive Quad Capacity 512GB

Pro 2x256GB PCIe TLC Protocol PCIe
SSD
Form Factor PCIe Card, Full Height PCIe Slot


Controller NVMe
NAND Type 3D TLC
SED Support Opal 2
Endurance 200TB
Interface PCIe Gen3 x4 architecture
HP Z Turbo Drive Quad Capacity 1TB

Pro 2x512GB PCIe TLC Protocol PCIe
SSD
Controller NVMe
NAND Type 3D TLC
SED Support Opal 2
Endurance 300TB
Interface PCIe Gen3 x4 architecture
HP Z Turbo Drive Quad Pro Capacity 2TB
2x1TB PCIe TLC SSD Protocol PCIe
Controller NVMe
NAND Type 3D TLC
SED Support Opal 2
Endurance 400TB


HP Z Turbo Drive Dual Capacity 256GB
Pro 256GB SSD Protocol PCIe
Form Factor M.2 in Half-height, half-length card
Controller NVMe
NAND Type 3D TLC
HP Z Turbo Drive Dual Capacity 512GB

Pro 512GB SSD Protocol PCIe
Controller NVMe
NAND Type 3D TLC
HP Z Turbo Drive Dual Capacity 1TB

Pro 1TB SSD Protocol PCIe
Controller NVMe
NAND Type 3D TLC

HP Z Turbo Drive Dual Capacity 2TB

Pro 2TB SSD Protocol PCIe
Controller NVMe
NAND Type 3D TLC
Mainstream PCIe SSDs HP 256GB M.2 2280 TLC Capacity 256GB
for HP Workstations SSD Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3D TLC
Endurance 200TB
Performance Sequential Read 3100 MB/s *
Random Read 200 K IOPS *
Random Write 320 K IOPS *
HP 512GB M.2 2280 TLC Capacity 512GB
SSD Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3D TLC
Endurance 300TB
Random Write 430 K IOPS*


HP 1TB M.2 2280 TLC SSD Capacity 1TB
Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3D TLC
Endurance 400TB
HP 2TB M.2 2280 TLC SSD Capacity 2TB

Protocol PCIe
Form Factor M.2
Controller NVMe
NAND Type 3 D TLC
Endurance 500TB
Intel® 905p Series AIC Intel® 905p Series AIC Capacity 280GB
PCIe SSD 280GB PCIe SSD Protocol PCIe
Form Factor PCIe Card, Half Height
Controller NVMe
NVM Type 3DXPoint
Endurance 5.11 PBW (PB Written)
Capacity 480GB


Protocol PCIe
Form Factor PCIe Card, Half Height
Controller NVMe
NVM Type 3DXPoint
Endurance 8.76 PBW (PB Written)
Intel® 905p Series AIC
480GB PCIe SSD
Intel® Optane™ DC Intel® Optane™ DC Capacity 128GB

Persistent Memory Persistent Memory Protocol DDR-T
128GB Module
Form Factor DDR4
Controller NVMe
NVM Type 3DXPoint
Endurance 292 PBW (256B Sequential Write)
91 PBW (64B Sequential Write)
Reliability (MTBF) 2M hours

Technical Specifications - Hard Drive Controllers
HARD DRIVE CONTROLLERS

Microsemi PCI Bus 8 lanes, PCI Express 3.0
SmartHBA2100-4i4e SAS RAID Levels Offers Integrated RAID (0, 1, and 10)
Card
PCI Data Burst Transfer Half Duplex x8, PCIe, 8000 MB/s
Rate
SAS Bandwidth Half Duplex 1200 MB/s per lane
PCI Card Type 3.3V Add-in Card
PCI Voltage 12 V ± 10%
PCI Power 9.8W typical, Airflow min 200 LFM
Bracket Full height and low profile
Certification Level PCI Express 3.0 compliant
SAS Processor Microsemi SmartIOC 2100 SAS IO Controller
Internal Connectors One x4 internal mini-SASHD (SFF-8643)
External Connectors One x4 external mini-SASHD (SFF-8644)
Maximum Number of SCSI 256 Non-RAID SAS/SATA devices
Devices
LED Indicators Connector for Drive Activity Light
NOTE: RAID 5 is not supported on MicroSemi 2100-4i4e 8-port SAS 12Gb/s
RAID Card

Technical Specifications - Graphics
GRAPHICS
NVIDIA® Quadro® P620 Form Factor Dimensions: 2.713” H x 5.7” L
2GB Graphics Single Slot, Low Profile
Cooling: Active
Weight: 129 grams
Graphics Controller NVIDIA® Quadro® P620 Graphics Card

GPU: 512 CUDA cores
Max Power: 40 Watts
Bus Type PCI Express 3.0 x16
Memory Size: 2 GB GDDR5, 2000 MHz
Memory Interface: 128-bit
Memory Bandwidth: 64 GB/s
Connectors 4mDP Outputs *
Maximum Resolution DisplayPort™ 1.4:
- up to 4x 5120 x 2880 x 24 bpp @ 60Hz
- supports Multi-Stream Transport (MST)
Image Quality Features 10-bit internal display processing pipeline
10-bit scan-out support
Display Output 4 mDP Connectors
Shading Architecture Full Microsoft DirectX 12 Shader Model 5.1
Supported Graphics APIs OpenGL 4.5

DirectX 12
Vulkan 1.0
API support includes:
CUDA C, CUDA C++, DirectCompute , OpenCL
Available Graphics Windows 11
Drivers Windows10
Windows 7 Professional
Linux®
HP qualified drivers may be preloaded or available from the HP support

Web site:
http://welcome.hp.com/country/us/en/support.html
Notes *P620 only have mini-DisplayPort™ (mDP) video ports.
Factory Configured (Z4 G4/ Z6 G4/ Z8 G4 Workstations): No adapters

included
After market option kit:Two mDP-to-DP Adapters included
Additional mDP-to-DP Adapters are available as Factory Configuration or

Option Kit accessories:
- 2MY05AA - HP miniDP-to-DP Adapter Cables
- 2KW87A6 - HP (Bulk 12) miniDP-to-DP Adapter Cables

NVIDIA® T400 Form Factor Dimensions: 2.713” H x 6.137” L

Weight: 124g
Graphics Controller NVIDIA® T400 Graphics Card

GPU: 384 CUDA cores
Power: 30 Watts
Cooling: Active

Memory Size: 2 GB GDDR6
Connectors 3x mDP
Maximum Resolution 3x 5120 x 2880 x 24 bpp @ 60Hz
DirectX 12
Vulkan 1.0
CUDA, OpenCL 1.x
Drivers Windows 10
Linux

Web site:
NVIDIA® T400 Form Factor Dimensions: 2.713” H x 6.137” L

Weight: 124g

GPU: 384 CUDA cores
Power: 30 Watts
Cooling: Active

Memory Size: 4 GB GDDR6
Connectors 3x mDP
Maximum Resolution 3x 5120 x 2880 x 24 bpp @ 60Hz
DirectX 12
Vulkan 1.0
CUDA, OpenCL 1.x


Drivers Windows 10
Linux

Web site:
NVIDIA® Quadro® P1000 Form Factor Dimensions:2.713” H x 5.7” L

Cooling: Active
Weight: 129 grams
Graphics Controller NVIDIA® Quadro® P1000 Graphics Card
GPU: 640 NVIDIA® CUDA® cores
Max Power: 47 Watts
Memory Size: 4 GB GDDR5, 2500 MHz
Memory Interface: 128-bit memory interface
Memory Bandwidth: 80 GB/s memory bandwidth
Connectors 4mDP Outputs
Maximum Resolution DisplayPort™ 1.4:
- up to 4x 5120 x 2880 x 24 bpp @ 60Hz
- supports Multi-Stream Transport (MST)
Image Quality Features 10-bit internal display processing pipeline
10-bit scan-out support
Display Output 4 mDP Connectors
Shading Architecture Full Microsoft DirectX® 12 Shader Model 5.1
Supported Graphics APIs OpenGL® 4.5
DirectX® 12
Vulkan™ 1.0
CUDA C, CUDA C++, DirectCompute , OpenCL™
Drivers Windows 10
Linux®

Web site:
Notes
AMD Radeon™ Pro WX Form Factor Low-Profile Single Slot (2.75 "H x 6.6” L)
3200 4GB Graphics Graphics Controller Radeon™ Pro WX 3200 Graphics Card
GPU: 640 Stream Processors organized into 8 Compute Units
Power: 56 Watts
Cooling: Active
Memory 4GB GDDR5 memory
Memory Width: 128 bit


Connectors 4x Mini DisplayPort™ 1.4 – HDR ready connectors with HBR3 and MST
support.
Factory Configured: No adapters included

After market option kit: One mDP-to-DP cable adapters included
Additional Mini DisplayPort™-to-DisplayPort™, DisplayPort™-to-VGA or

DisplayPort™-to-DVI adapters are available as Factory Configuration or
Option Kit accessories.
Maximum Resolution 5K support @ 60Hz
• 1x single-cable 5K monitor, or 2x dual-cable 5K monitors
4x 4K support @ 60Hz
Image Quality Features Advanced support for 8-bit and 10-bit per RGB color component. High
bandwidth scaler for high quality up and downscaling
Display Output 4 full physical DP1.3 HBR3 / DP1.4 HDR outputs
FreeSync support
GPU Architecture Polaris

Supported Graphics APIs DirectX®12
OpenGL® 4.6
OpenCL™ 2.0
Vulkan™ 1.0
Drivers Windows 10
Linux® 64-bit (selected Enterprise distributions)

Web site:
Notes 1. HDR content requires that the system be configured with a

fully HDR-ready content chain, including: graphics card,
monitor/TV, graphics driver and application. Video content
must be graded in HDR and viewed with an HDR-ready player.
Windowed mode content requires operating system support.
2. AMD PowerTune and AMD ZeroCore Power are technologies
offered by certain FirePro™ and Radeon™ Pro products, which
are designed to intelligently manage GPU power consumption
in response to certain GPU load conditions.
3. As of September 2016, certified for DisplayPort™ 1.4 HBR3
and ready for DisplayPort™ 1.4 HDR based on independent
verification by DisplayPort™ testing authority. HDR content
requires that the system be configured with a fully HDR-
ready content chain, including: graphics card, monitor/TV,
graphics driver and application. Video content must be graded
in HDR and viewed with an HDR-ready player. Windowed
mode content requires operating system support.
NVIDIA® T1000 4GB Form Factor Dimensions: 2.713” H x 6.137” L

Graphics Single Slot
Weight: 132.6 grams


Power: 50W
Cooling: Active
Memory Size: 4GB GDDR6
Memory Bandwidth: Up to 160 GB/s
Memory Width: 128-bit
Connectors 4x mini DisplayPort™ 1.4a
Maximum Resolution 7680 x 4320 @ 120Hz
Display Output Maximum number of displays: 4 displays
Architecture NVIDIA® Turing™
Supported Graphics APIs xx
Drivers Windows 10
Windows 8.1
Linux® - Full OpenGL® implementation, complete with NVIDIA® Quadro® and
ARB extensions

Web site:
NVIDIA® T1000 8GB Form Factor Dimensions: 2.713” H x 6.137” L

Graphics Single Slot
Weight: 132.6 grams
Power: 50W
Cooling: Active
Connectors 4x mini DisplayPort™ 1.4a
Maximum Resolution 7680 x 4320 @ 120Hz
Display Output Maximum number of displays: 4 displays
Architecture NVIDIA® Turing™
Drivers Windows 10
Windows 8.1
Linux® - Full OpenGL® implementation, complete with NVIDIA® Quadro® and
ARB extensions

Web site:


NVIDIA® RTX A2000 6GB Form Factor Dimensions: 2.713” H x 6.6” L
Graphics Dual slot, half-height
Weight: 295 grams (without extender)
Graphics Controller NVIDIA® RTX A2000 Graphics Card
Power: 70W
Cooling: Active
Connectors 4x mini-DisplayPort™ 1.4a
Maximum Resolution Up to 4x 5120 x 2880 x 24bpp @ 60Hz
Architecture NVIDIA® Ampere™
Supported Graphics APIs CUDA, OpenCL™ 1.x
Drivers Windows 10
Linux® 64-bit (selected Enterprise distributions)
Web site:
Notes 1. RTX A2000 offered as Factory Configured Option does not include
a video cable adapter. Video cable adapters must be ordered
separately as AMO:
a. 2MY05AA - HP Single miniDP-to-DP Adapter Cable
b. 2KW87A6 - HP (Bulk 12) miniDP-to-DP Adapter Cables
2. Two mDP-to-DP adapters are included with the RTX A2000 when it
is ordered as an AMO kit.
NVIDIA® RTX A4000 Form Factor Full-Height Single Slot (4.4” Height x 9.5” Length)
16GB Graphics
Graphics Controller NVIDIA® RTX A4000 Graphics
GPU: 6144 NVIDIA® CUDA® Parallel Processing Cores
Power: 140 Watts
Cooling: Active

Connectors 4x DP
One 6-pin auxiliary power connector
Factory configured option: No video cable adapter included with

card.
After market option Kit: No video cable adaptor included with card.
DVI to VGA, DisplayPort™ to VGA, DisplayPort™ to DVI, and

DisplayPort™ to Dual-Link DVI adapters available as accessories.

Maximum Resolution 7680x4320 @ 60Hz
Display Outputs1 4x DP
Supported Graphics DirectX®12, OpenGL® 4.5, OpenCL™ 1.0, Vulkan™ 1.0

APIs Developer API support includes: CUDA C, CUDA C++, DirectCompute
5.0, OpenCL™, Java, Python, and Fortran
Drivers Windows 10
Linux® 64-bit
HP qualified drivers may be preloaded or available from the HP

support Web site:
NVIDIA® RTX A4500 Form Factor Full-Height Dual Slot (4.4” Height x 10.5” Length)
20GB Graphics
Graphics Controller NVIDIA® RTX A4500 Graphics
Power: 200 Watts
Cooling: Active
Connectors 4x DP
Factory configured option: No video cable adapter included with

card.
After market option Kit: No video cable adaptor included with card.
DVI to VGA, DisplayPort™ to VGA, DisplayPort™ to DVI, and

DisplayPort™ to Dual-Link DVI adapters available as accessories.
Maximum Resolution 7680x4320 @ 60Hz
Display Outputs1 4x DP
Supported Graphics DirectX®12, OpenGL® 4.5, OpenCL™ 1.0, Vulkan™ 1.0



Drivers Windows 10
Linux® 64-bit

support Web site:
NVIDIA® RTX A5000 Form Factor Full-Height Dual Slot (4.4” Height x 10.5” Length)
24GB Graphics Weight: 1049 grams + 80 grams extender
Graphics Controller NVIDIA® RTX A5000
GPU: 8192 CUDA Cores
Power: 230W
Cooling: Active
Memory 24GB GDDR6
Memory Bandwidth: Up to 768GB/s
ECC Memory (disabled by default)
Connectors DP (x4) with HDR support

After market option Kit: no power adapter included with card.
DisplayPort™ to VGA, DisplayPort™ to DVI (single-link and dual-

link), and DisplayPort™ to HDMI adapters available as accessories.
Maximum Resolution DisplayPort™ 1.4a:
7680x4320 @ 120Hz
Display Outputs 4x DP1.4a HDR2 outputs (up to 7680x4320 @ 120Hz)
GPU Architecture NVIDIA® Ampere™
Supported Graphics DirectX®12, OpenGL® 4.5


Drivers Windows 10
Windows 7
support Web site:
Factory Configured (Z4/Z6/Z8 G4 Workstation): No adapters

included
After market option kit: No adapters included

NVIDIA® RTX™ A6000 Form Factor Full-Height Dual Slot (4.4” Height x 10.5” Length)
48GB Graphics Weight: 1230 grams / 2.71 lbs (with extender)
Graphics Controller NVIDIA® RTX™ A6000 Graphics

Power: 300 Watts
Cooling: Active
ECC optional
Connectors 4x DP 1.4a
Quadro Sync II connector
Ampere NVLink®
Stereo Sync
Requires 8-pin CPU auxiliary power
Maximum Resolution 5120x2880 @ 60Hz (up to 4 displays)
Display Outputs 4x DP 1.4 (7680x4320 @ 60Hz)
Supported Graphics APIs DirectX®12, OpenGL® 4.6, OpenCL™ 1.0, Vulkan™ 1.0
Developer API support includes: CUDA C, CUDA C++, DirectCompute 5.0,
OpenCL™, Java, Python, and Fortran™
Drivers Windows 10
Linux® 64-bit

Web site:
AMD Radeon™ Pro Form Factor Full-Height Single Slot

W5500 8GB
Graphics Controller Architecture: RDNA
Power: 125W
Cooling: Active

Memory Bandwidth: up to 224 GB/s


Display Output Max Displays: 4
Video Outputs: 4x DisplayPort™ 1.4
Factory Configured: No video cable adapter included

After market option kit: No video cable adapter included
Additional DisplayPort™-to-VGA or DisplayPort™-to-DVI adapters

are available as Factory Configuration or Option Kit accessories.
Maximum Resolution 7690 x 4320 resolution @ 60Hz
Software API Support DirectX®: 12

OpenGL® : 4.6,
OpenCL™ : 2.0
Vulkan™ 1.1
Available Graphics HP qualified drivers may be preloaded or available from the HP

Drivers support Web site:
AMD Radeon™ Pro Form Factor Full-Height Double Slot

W5700 8GB
Power: 205W
Cooling: Active


Video Outputs: 5x Mini-DisplayPort™ 1.4 and 1x USB-C



OpenGL® : 4.6,


OpenCL™ : 2.0
Vulkan™ 1.1

AMD Radeon ™ Pro Form Factor Full height, Single Slot, 241mm length
W6600 8GB Graphics
Graphics Controller AMD Radeon™ PR W6600 XT Graphics
GPU: AMD RDNA 2
Memory: 8GB GDDR6
Power: 130 Watts, 6-pin Power Cable
Cooling: Active, Dual Axial fan
Connectors 4x DisplayPort 1.4 with DSC
Maximum Resolution DisplayPort™ 1.4 with DSC:
- up to 4x @ 3840x2160px (4K)
- up to 4x @ 5120x2880px (5K)
- up to 1x @ 7680x4320px (8K)
Display Outputs 4x DP
Shading Architecture Microsoft DirectX 12 Shader Model 6.1
DirectX 12 Feature Level 12_1
Vulkan 1.1
OpenCL 2.2

Drivers Windows 10
Linux® 64-bit (selected distributions)

Web site:

W6800 32GB
Graphics Controller Architecture: RDNA 2
GPU Cores: 3840
Power: 261W
Cooling: Active fan heatsink

ECC Capable: Yes


Video Output: 6x Mini-DisplayPort™ 1.4 with DSC
Display Configurations:
5K Resolution: 6x @ 5120 x 2880 resolution @ 60Hz
8K Resolution: 2x @ 7680 x 4320 resolution @60Hz
HDR Support: Yes

8K Support: Yes
Notes: W6800 only has mini-DisplayPort™ (mDP) video ports

• Configure-to-order must specify AV options to add any required
mDP-to-DP Adapters
• Two mDP-to-DP Adapters are included in the RTX A2000 AMO kits
• If more mDP-to-DP Adapters are needed, Adapters can be ordered
separately as AMO:
o 2MY05AA - HP Single miniDP-to-DP Adapter Cable
o 2KW87A6 - HP (Bulk 12) miniDP-to-DP Adapter Cables
Bus Type PCI Express x16 Gen4

OpenGL® : 4.6,
OpenCL™ : 2.1
Vulkan: 1.2

Drivers Windows 10

Web site:
AMD Radeon™ Pro Form Factor Full-Height Single Slot

W5500 8GB
Power: 125W
Cooling: Active



Video Outputs: 4x DisplayPort™ 1.4



OpenGL® : 4.6,
OpenCL™ : 2.0
Vulkan™ 1.1


W5700 8GB
Power: 205W
Cooling: Active


Video Outputs: 5x Mini-DisplayPort™ 1.4 and 1x USB-C



OpenGL® : 4.6,
OpenCL™ : 2.0


Vulkan™ 1.1


W6800 32GB
Graphics Controller Architecture: RDNA 2
GPU Cores: 3840
Power: 261W
Cooling: Active fan heatsink

ECC Capable: Yes

Video Output: 6x Mini-DisplayPort™ 1.4 with DSC
Display Configurations:
5K Resolution: 6x @ 5120 x 2880 resolution @ 60Hz
8K Resolution: 2x @ 7680 x 4320 resolution @60Hz
HDR Support: Yes

8K Support: Yes
Notes: W6800 only has mini-DisplayPort™ (mDP) video ports

• Configure-to-order must specify AV options to add any required
mDP-to-DP Adapters
• Two mDP-to-DP Adapters are included in the RTX A2000 AMO kits
• If more mDP-to-DP Adapters are needed, Adapters can be ordered
separately as AMO:
o 2MY05AA - HP Single miniDP-to-DP Adapter Cable
o 2KW87A6 - HP (Bulk 12) miniDP-to-DP Adapter Cables
Bus Type PCI Express x16 Gen4

OpenGL® : 4.6,
OpenCL™ : 2.1
Vulkan: 1.2

Drivers Windows 10

Web site:



Technical Specifications – Optical and Removable Storage
OPTICAL AND REMOVABLE STORAGE

HP 9.5mm Slim DVD Description 9.5mm height, tray-load
Writer Mounting Orientation Either horizontal or vertical
Interface Type SATA/ATAPI
Dimensions (WxHxD) 128 x 9.5 x 127mm
Supported Media Types DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW
Disc Capacity DVD-ROM 8.5 GB DL or 4.7 GB standard

Full Stroke DVD < 200 ms (seek)
Full Stroke CD < 200 ms (seek)
Maximum Data Transfer CD ROM Read CD-ROM, CD-R Up to 24X
Rates CD-RW Up to 24X
DVD ROM Read DVD+RW Up to 8X

DVD-RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-ROM Up to 8X
DVD-ROM DL Up to 8X
DVD+R Up to 8X
DVD-R Up to 8X
Power Source SATA DC power receptacle

DC Power Requirements 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC -< 800 mA typical, <1600 mA
maximum
Operating Environmental Temperature 41° to 122° F (5° to 50° C)
(all conditions non- Relative Humidity 10% to 80%
condensing)
Maximum Wet Bulb Temperature 84° F (29° C)
Operating Systems Windows 11, Windows 10, Windows 7 Professional 64-bit,
Supported Red Hat® Enterprise Linux®(RHEL) WS4**, 5, 6 Desktop/Workstation
SUSE Linux® Enterprise Desktop 10 & 11
* No driver is required for this device. Native support is provided by the

operating system.
Kit Contents HP SATA DVD Writer drive, installation guide.
HP 9.5mm Slim DVD-ROM Description 9.5mm height, tray-load

Drive Mounting Orientation Either horizontal or vertical
Interface Type SATA / ATAPI


Disc Capacity DVD-ROM Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Access Times DVD-ROM Single Layer < 110 ms (typical)

CD-ROM Mode 1 < 110 ms (typical)
Full Stroke DVD < 230 ms (typical)
Full Stroke CD < 220 ms (typical)
DC Current 5 VDC – <800mA typical, < 1600 mA
maximum
condensing)
Operating Systems Windows 11, Windows 10, Windows 7 Professional 64-bit
Supported Red Hat® Enterprise Linux®(RHEL) WS4**, 5, 6 Desktop/Workstation
SUSE Linux® Enterprise Desktop 10 & 11
No driver is required for this device. Native support is provided by the

operating system.
Kit Contents 9.5mm Slim DVD-ROM Drive, 5.25" ODD Bay adapter/carrier, slim SATA
data/power cable, installation guide
HP HH DVD Writer (16X Description HP Half Height DVD Writer

RW DVD-R) Mounting Orientation Either Horizontal or vertical
Interface Type SATA
Dimensions (WxHxD) 146x42x165mm
Supported Media Types DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW
Full Stroke DVD 145ms (seek)
Full Stroke CD 120ms (seek)
DVD-RW Up to 13X
DVD+R DL Up to 12X
DVD-R DL Up to 12X
DVD-ROM Up to 12X
DVD-ROM DL Up to 12X


DVD+R Up to 16X
DVD-R Up to 16X
DC Power Requirements 5 VDC ± 5% -100 mV ripple p-p
12 VDC ± 10% -200 mV ripple p-p
DC Current 5 VDC -<1500mA typical, <2000 mA
maximum.
(all conditions non- Relative Humidity 10% to 90% (Non-Condensing)
condensing)
Operating Systems Windows 11, Windows 10, Windows 7 Professional 64-bit. Red Hat
Supported Enterprise Linux WS4**,5,6 Desktop/Workstation.
No driver is required for this device, Native support is provided by

operating system.
Kit Contents HP SATA DVD Writer drive, Installation guide.
HP 9.5mm Slim BDXL Blu- Description 9.5mm height, tray-load

Ray Writer Mounting Orientation Either horizontal or vertical
Interface Type SATA/ATAPI
Supported Media Types BD-ROM
BD-R
BD-RE
DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW

Blu-ray 25 GB (single-layer)
50 GB (dual-layer)
100/128 GB (BDXL)
Full Stroke DVD < 230 ms (seek)
Full Stroke CD < 220 ms (seek)
Blu-ray < 230 ms (seek) (Full Stroke Blu-ray)
Startup Time (Time to drive ready from tray
loading)
BD-ROM (SL/DL) 25S / 28S
BD-R (SL/DL) 25S / 28S
BD-RE (SL/DL) 25S / 28S
DVD-ROM (SL/DL) 18S / 18S
DVD-R (SL/DL) 25S / 25S
DVD-RW 25S
DVD+R (SL/DL) 25S / 25S
DVD+RW 25S


CD-ROM 15S

DVD-RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-ROM Up to 8X
DVD-ROM DL Up to 8X
DVD+R Up to 8X
DVD-R Up to 8X
Blu-ray BD-ROM Up to 6X
BD-ROM DL Up to 6X
BD-R Up to 6X
BD-R DL Up to 6X
BD-R Up to 6X
BD-RE SL/DL Up to 6X

DC Current 5 VDC -900 mA typical, 2000mA
maximum
condensing)
Operating Systems Windows 11, Windows 10, Windows 7 Professional 64-bit
Supported Red Hat® Enterprise Linux® (RHEL) 6, 7 Desktop/Workstation
SUSE Linux® Enterprise Desktop 12

operating system.
Kit Contents 9.5mm Slim BDXL Blu-Ray Writer, 5.25" ODD Bay adapter/carrier, slim
SATA data/power cable, installation guide
As Blu-ray is a new format containing new technologies, certain disc,
digital connection, compatibility and/or performance issues may arise, and
do not constitute defects in the product. Flawless playback on all systems
is not guaranteed. In order for some Blu-ray titles to play, they may
require a DVI or HDMI digital connection and your display may require
HDCP support. HD-DVD movies cannot be played on this workstation.
HP SD Card Reader Description Supports hardware ECC (Error Correction Code) function
Supports hardware CRC (Cyclic Redundancy Check) function
Supports SD 4-bit parallel transfer mode
Interface Type USB 3.1 GEN 1 High-speed interface
Dimensions (WxHxD) 1.15 x .9 x .15 in (29.00 x 23.6 x 3.15 mm) Fits conveniently in the Front IO
Bay
Supported Media Types Secure Digital Card (SD)
Secure Digital High Capacity (SDHC)
SD Extended Capacity Memory Card (SDXC)


SD Ultra High Speed II(SD UHSII)
These additional media types are supported with a card adapter.

Memory Stick Micro (M2)
miniSD
miniSD High Capacity
Micro SD Memory Card (MicroSD)
Micro SD High Capacity Memory Card (MicroSDHC)
Test Parameters/Conditions - Power applied, unit operating on system

±5%
Operating Systems Windows 11, Windows 10
Supported
operating system.
Kit Contents Media card reader
Approvals USB-IF, WHQL, Compliant with USB Mass Storage Class Bulk only Transport
Specification Rev. 1.0,
Compliant Intel® Front Panel I/O Connectivity Design Guide V. 1.3, FCC, CE,
BSMI, C-Tick, VCCI, MIC, cUL, TUVT
Weight 0.35 lbs. (0.16 kg)

Technical Specifications - Controller Cards
CONTROLLER CARDS
HP Thunderbolt-3 Dual Data Transfer Rate Supports up to 40 Gb/s (40,000 Mb/s)
Port2 PCIe 1-port I/O Devices Supported Thunderbolt™, Thunderbolt™ 2 and Thunderbolt™ 3 certified for Windows
Card devices
Bus Type PCIe card, full height PCIe slots
Ports Two Thunderbolt™ 3 external USB type-C output connectors (Rear)
Two full size DisplayPort input connectors (Rear)
Internal Connectors One 2x5-Pin header connector
System Requirements Windows 11, Windows 10 Professional, available dedicated PCH PCIe slot.
Temperature - Operating 50° to 131° F (10° to 55° C)
Temperature - Storage -22° to 140° F (-30° to 60° C)
Relative Humidity - 20% to 80%
Operating
Compliances FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-1998 STD,
Taiwan BSMI CNS13438, Korea MIC
Operating Systems Windows 11, Windows 10 Professional.
Supported
Kit Contents HP Thunderbolt™ 3 Dual Port PCIe I/O Card, 2- DisplayPort cables, GPIO
(General-Purpose Input/Output) cables, Installation documentation and
warranty card.
*Maximum speed requires DisplayPort™ and PCIe aggregation.

Technical Specifications - Networking and Communications
NETWORKING AND COMMUNICATIONS

Integrated Intel® I219LM Connector RJ-45
Controller Intel® I219LM
Data Rates Supported 10/100/1000 Mbps
Boot ROM Support PXE, UEFI
Connect Speed LED Link/Activity LED
Indicators • Off = No link
• Blinking = Activity
Speed LED
• Off = 10Mbps
• Amber = 100Mbps
• Green = 1000Mbps
Management Capabilities Intel ® Active Management Technology™ 11
Integrated Intel® X722 Connector 1 RJ-45

for 1GbE Controller Intel® X722 for 1GbE
Data Rates Supported 1000 Mbps
Boot ROM Support PXE, UEFI
Speed LED
• Off = No Link
• Green = 1000Mbps
Management Capabilities Wake-On-LAN
HP Z Dual 10GbE Network Networking Interface 2 RJ-45

Module System Interface Cabled from Dedicated Rear I/O Slot
Networking Speeds 1Gbps, 10Gbps
Supported
Cabling (up to 100m) Cat5e (or higher) for 1Gbps
Cat6a (or higher) for 10Gbps
Power Consumption 5.5W at 1Gbps
(active-typical) 11.2W at 10Gbps
Physical Dimensions 0.875 in x 3 in x 2.75 in
Speed LED
• Amber = 1Gbps
• Green = 10Gbps
Operating Temperature 0 °C to 55 °C (32 °F to 131 °F)
Intel® I210-T1 Networking Interface 1 RJ-45


System Interface PCI Express 2.1 x1
Networking Speeds 10Mbps, 100Mbps, 1Gbps
Supported
Cabling (up to 100m) Cat3 (or higher) for 10Mbps
Cat5 (or higher) for 100Mbps
Cat5e (or higher) for 1Gbps
Power Consumption 0.81W
(active-typical)
Physical Dimensions Length: 6.7cm (2.64 inches)
(Bracket) Width: 1.8cm (0.709 inches)
Full-height end bracket: 12.07cm (4.755 inches)
Low-profile end bracket: 8cm (3.15 inches)
Speed LED
• Off = 10Mbps
• Green = 100Mbps
• Amber = 1Gbps
Hardware Certifications USA: FCC B,
EU: UL CE,
Japan: VCCI,
Taiwan: BSMI,
Australia/New Zealand: CTICK,
Korea: KCC,
Canada: ICES-003/NMB-003

Supported
(active-typical)
Width: 6.89 (2.71 inches)
Low-profile end bracket: 7.92cm (3.117 inches)
Speed LED
• Off = 10Mbps
• Green = 100Mbps
• Amber = 1Gbps


EU: UL CE,
Japan: VCCI,
Taiwan: BSMI,
Korea: KCC,

Supported
Power Consumption 5W
(active-typical)
Speed LED
• Off = 10Mbps
• Green = 100Mbps
• Amber = 1Gbps
EU: UL CE,
Japan: VCCI,
Taiwan: BSMI,
Korea: KCC,
Aquantia® AQN-108 Networking Interface RJ-45

System Interface PCI Express 3 x1
Networking Speeds 100Mbps, 1Gbps, 2.5Gbps, 5Gbps
Supported
Cabling (up to 100m) Cat5e (or higher) for all speeds
Power Consumption 3.5W at 5Gbps, 3.0W at 2.5Gbps
(active-typical)
Physical Dimensions 3.72 in x 3.18 in (without bracket)


Speed LED
• Off = No link
• Amber = <5Gbps
• Green = 5Gbps

EU: UL CE,
Japan: VCCI,
Taiwan: BSMI,
Korea: KCC,
Intel® X550-T2 Networking Interface 2 x RJ-45

Networking Speeds 100Mbps, 1Gbps, 2.5Gbps, 5Gbps, 10Gbps
Supported
Cat5e (or higher) for 1Gbps, 2.5Gbps, or 5Gbps
Cat6a (or higher) for 10Gbps
Power Consumption 3.9W at 100Mbps
(active-typical) 5.5W at 1Gbps
11.2W at 10Gbps
Physical Dimensions 5.2 in x 2.7 in (without bracket)
Speed LED
• Off = No link
• Amber = <10Gbps
• Green = 10Gbps

EU: UL CE,
Japan: VCCI,
Taiwan: BSMI,
Korea: KCC,
Allied Telesis Network Interface 1Gb LC Fiber 850 nm

AT-2914SX/LC-901 1GB System Interface PCIeG2 x1, Half Height, Half Length
LC Fiber NIC Networking Speeds 1000Base-X (1Gbps)
Supported


Cabling 50/125 µm (core/cladding) multimode fiber optic cable up to 500m
62.5/125 µm (core/cladding) multimode fiber optic cable up to 220m
Power Consumption 1.5 Watts

(active- typical)
Physical Dimensions 8.8 cm x 6.9 cm (3.5 in x 2.7 in)
Connect Speed LED ON: 1Gbps Link OFF: Link down
Indicators
Operating Temperature -25°C to 70°C (-13°F to 158°F)
Hardware Certifications IEEE 802.1p (Quality of Service), IEEE 802.1Q (VLANs), IEEE 802.2 (LLC),
IEEE 802.3ac (MAC), IEEE 802.3x (Flow control auto-negotiation), IEEE
802.3z (1000 Base-X), IEEE 802.3ad (Link aggregation)
RoHS, UL, FCC/EN55022 Class A, TUV, EN55024, CE, C-TICK, VCCI
Allied Telesis Networking Interface 2 RJ-45

AT-2911T/2-901
Supported
(active-typical)
Blinking = Activity
EU: UL CE, UKCA
Japan: VCCI,
Taiwan: BSMI,
Korea: KCC,
Intel® X710-DA2 Networking Interface 2 SFP+ Ports for LC SFP+ Transceivers

10GBASE-SR Converged System Interface PCI Express 3.0 x8
Network Adapter Networking Speeds 10Gbps (or 1Gbps with 3rd party transceiver)
Supported
Cabling LC fiber optic cabling with LC SFP+ Transceivers
(active-typical)
Physical Dimensions 6.578 in x 2.703 in


Speed LED
• Off = 10Mbps
• Green = 100Mbps
• Amber = 1Gbps

EU: UL CE,
Japan: VCCI,
Taiwan: BSMI,
Korea: KCC,
NOTE: Windows 7 is NOT supported
10GbE SFP+ SR Connector Type LC

Transceiver Cable Type 62.5/125um or 50/125um (core/cladding), graded-index, low metal
content, multimode fiber optic, complying with ITU-T G.651 and ISO/IEC
793-2 Type A1b or A1a, respectively.
Cable Length 2-300m
Wavelength 850nm
Form Factor SFP+
Physical Dimensions 0.47(h) x 0.54(w) x 2.19(d) inches
(1.19 x 1.38 x 5.57 cm)
Operating Temperature 0C to 45C (32F to 113F)
Operating Humidity 0% to 85%, noncondensing
NVIDIA® Mellanox® Connector 2 x SFP28 Transceiver Cage (Dual Port)*

ConnectX-6 DX Dual Port Cabling Depends on transceiver pairing. Typically OM4 or higher MMF LC fiber optic
10/25GbE SFP28 NIC cabling with LC SFP28 Transceivers.
Controller ConnectX6-DX
Memory 256Mbit SPI Quad Flash Device
Data Rates Supported 1/10/25GbE
Compliance – IEEE 802.3by 25 Gigabit Ethernet
– IEEE 802.3ae 10 Gigabit Ethernet
– IEEE 802.3ap based auto-negotiation and KR startup
– IEEE 802.3ad, 802.1AX Link Aggregation
– IEEE 802.1Q, 802.1P VLAN tags and priority
– IEEE 802.1Qau (QCN)
– Congestion Notification
– IEEE 802.1Qaz (ETS)
– IEEE 802.1Qbb (PFC)
– IEEE 802.1Qbg
– IEEE 1588v2
– Jumbo frame support (9.6KB)


– Safety: CB/cTUVus/CE
– EMC: CE/FCC/VCCI/ICES/RCM
– RoHS Compliant
Bus Architecture PCIe Gen 4 x8
Data Transfer Mode PCI Express - stores and accesses Ethernet fabric connection information
and packet data
Power Requirements 11.5 Watts (typical)
Network Transfer Rate 1Gbps, 10Gbps, 25Gbps
NOTE: Network Transfer Rate depends on transceiver model.*
Kit Contents NVIDIA® Mellanox® ConnectX-6 DX Dual Port 10/25GbE SFP28 NIC
*3rd party transceivers sold separately. You must have a transceiver installed in order to connect this card to a network.
Intel® 8265 WLAN Networking Speeds 802.11ac MU-MIMO (up to 867 Mbps)
Bluetooth 4.2
IEEE WLAN Standard IEEE 802.11a/b/g/n/ac, 802.11d, 802.11e, 802.11h, 802.11i, 802.11w;
802.11r, 802.11k, 802.11v pending
Bluetooth 4.2
Antenna 2x2

Summary of Changes
SUMMARY OF CHANGES
Date of change: Version History: Description of change:
November 1, 2017 From v1 to v2 Added HP DisplayPort to HDMI Adapter, HP DisplayPort to VGA Adapter, NVIDIA SLI
3-slot Graphics Connector and NVIDIA Quadro Sync II to Graphics section
and Microsemi 3152-8i SAS ROC RAID Controller
Changed Graphics, Storage / Hard Drives and Memory sections, changed Front and
internal view info on the Overview section, changed Operating Systems
section, changed System Board section, Physical Security and Serviceability
sections
November 29, 2017 From v2 to v3 Added Processors, hard drives and graphics to offerings, added Declared Noise
Emissions information
January 30, 2018 From v3 to v4 Removed NVIDIA SLI Graphics Connectors from Graphics Cable Adapters section
March 27, 2018 From v4 to v5 Added Intel Xeon processors added
April 16, 2018 From v5 to v6 Removed RAID 5
August 13, 2018 From v6 to v7 Added Footnote to Networking and Communications section
Changed Processors section and Operating Systems section
September 4, 2018 From v7 to v8 Removed HP IEEE 1394b FireWire PCIe Card
September 6, 2018 From v8 to v9 Removed Microsemi 3152-8i SAS ROC RAID Controller
September 21, 2018 From v9 to v10 Added Intel Optane SSD 905p AiC 280GB & 480GB
September 26, 2018 From v10 to v11 Changed NVIDIA Quadro P6000 Graphics specs
April 8, 2019 From v11 to v12 Added New Intel Xeon Processors and graphics, added HP DX175 Removable HDD
Carrier into the HDD Frame/Carriers section
Changed Storage / Hard Drives, Memory sections and format changes
May 15, 2019 From v12 to v13 Added NVIDIA Quadro RTX 8000 48GB Graphics
Changed External BIOS simulator link on Physical Security and Serviceability section
Removed Intel 9260 WLAN
June 12, 2019 From v13 to v14 Changed Storage section
July 7, 2019 From v14 to v15 Added Intel Xeon W Processors
July 15, 2019 From v15 to v16 Changed Corrected Intel 905p Series AIC 480GB PCIe SSD
August 1, 2019 From v16 to v17 Changed Processors Matrix
September 1, 2019 From v17 to v18 Added Footnote to Memory section, Added Optane 905P 380GB M.2 SSD Module,
HP Z Turbo Drive 1TB SED TLC Z4/Z6 G4 SSD Kit & module to Storage
section, Added Intel® Wi-Fi 6 AX200 & BT PCIe to Networking section
October 26, 2019 From v18 to v19 Changed Graphics section
November 1, 2019 From v19 to v20 Added NVDIMM Memory sections, Added HP QX310 Removable NVMe
Frame/Carrier w/PCIe card to Optical and Removable Storage section
January 2, 2020 From v20 to v21 Changed Storage section
February 26, 2020 From v21 to v22 Added New Intel Xeon Processors
Changed Overview, PCIe Solid State Drives sections
April 2, 2020 From v22 to v23 Changed Processors and NVDIMM Memory sections
July 18, 2020 From v23 to v24 Changed Processors, Graphics section
January 5, 2021 From v24 to v25 Changed Processors, Memory, Graphics, Racking and Physical Security, Operating
Systems and Hard Drives sections
February 1, 2021 From v25 to v26 Changed NETWORKING AND COMMUNICATIONS section
March 1, 2021 From v26 to v27 Changed Overview section
April 13, 2021 From v27 to v28 Changed Processors, Graphics and Social and Environmental Responsibility sections
May 1, 2021 From v28 to v29 Changed Graphics section
June 1, 2021 From v29 to v30 Changed Memory and Graphics sections
July 1, 2021 From v30 to v31 Changed Graphics section
August 1, 2021 From v31 to v32 Changed Graphics section
September 1, 2021 From v32 to v33 Changed Input Devices and Graphics sections
October 1, 2021 From v33 to v34 Changed Graphics and System Board sections

Summary of Changes
November 1, 2021 From v34 to v35 Changed Processors and Graphics sections
December 1, 2021 From v35 to v36 Changed Operating Systems, Graphics, Networking and Communications and Input
Devices sections
December 15, 2021 From v36 to v37 Changed OPERATING SYSTEM and Social and Environmental Responsibility sections
January 1, 2022 From v37 to v38 Changed Graphics, OPERATING SYSTEM and Application Software sections
February 1, 2022 From v38 to v39 Changed Input Devices section
March 1, 2022 From v39 to v40 Changed Graphics, Social and Environmental Responsibility sections
April 1, 2022 From v40 to v41 Changed Processors, Graphics and Stable & Consistent Offerings sections
May 2, 2022 From v41 to v42 Changed Graphics section
June 1, 2022 From v42 to v43 Changed Graphics, Networking and Communications sections
July 1, 2022 From v43 to v44 Changed Graphics section
August 1, 2022 From v44 to v45 Changed NETWORKING AND COMMUNICATIONS section
September 1, 2022 From v45 to v46 Changed Format page 18
October 1, 2022 From v46 to v47 Changed Graphics section
December 1, 2022 From v47 to v48 Changed Input Devices section
December 9, 2022 From v48 to v49 Changed Optical and Removable Storage section
January 1, 2023 From v49 to v50 Changed Networking and Communications, GRAPHICS sections

© 2023 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties
for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing
herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or
omissions contained herein. Intel, Xeon, and Thunderbolt are trademarks of Intel Corporation in the U.S. and other countries.
Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. Red Hat is a registered trademark of Red Hat, Inc.
in the United States and other countries. Firewire is a trademark of Apple Inc. Linux® is the registered trademark of Linus Torvalds
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Quickspecs: HP Z6 G4 Workstation

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QuickSpecs HP Z6 G4 Workstation

c05527761 — DA – 15955 — Worldwide — Version 50 — January 1, 2023 Page 1

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4Notes: For detailed Linux® OS/hardware support information, see:

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All Z6G4 Intel® Xeon® CPUs Feature Intel® vPro™ Technology.

Expansion Slots (see Slot 0:

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1 dedicated 9.5mm slim optical disk drive bay

On-board RAID Support SATA RAID 0 Striped Array

Weight Exact weights depend upon configuration (System weight only).

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Temperature Operating: 5° to 35°C (40° to 95°F)

Maximum Altitude (non- Operating: 3,048m (10,000ft)

Workstation ISV See the latest list of certifications at

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Processors Option Kit

1 Options kits available for second processor upgrade.

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Note 1: Intel® DCPMM® (Data Center Persistent Memory) Supported.

Monitors / Option Kit

HP Z Display Z22n G2 Y 1JS05AA

Storage / Hard Drives

SATA Hard Drives Option

4TB SATA 7200RPM Ent 3.5” HDD Y Y K4T76AA

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SATA Solid State Drives Option

PCIe Solid State Drives Option

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Hard Drive Controllers Option

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Memory SL CL Factory Option Option Kit Support

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NOTE 2: Requires 2nd processor option.

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Optical and Removable Storage

Networking and Communications

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Racking and Physical Security

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Application Option Kit

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Operating Systems Support Notes

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System Technical Specifications

2nd CPU/Memory Board (optional):

Processor Socket FCLGA3647 (Socket P)

Available Memory Configurations:

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System Technical Specifications

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System Technical Specifications

Memory Loading Order:

Load Order for Single and Dual Processor Configuration

Memory Configuration • Only Registered ECC DIMMs are supported.

*768 GB configuration requires 2 CPUs configuration.

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System Technical Specifications