DATA SHEET NEC BIPOLAR ANALOG INTEGRATED CIRCUIT uPC844 SINGLE SUPPLY VOLTAGE, HIGH SPEED, WIDE BAND, QUAD OPERATIONAL AMPLIFIERS DESCRIPTION ‘The uPC844 Is quad high speed, wide band opera- tional amplifier designed for single supply operation from +3V to +32\V with low supply current drain. By using high spoed PNP transistors for input and output circuits, the excellent AC performance is achieved without degrading ‘capaoitive load drive capability With no crossover distortion and wide output voltage range characteristics, the uPC844 is optimum choice for single supply AC amplifier, and active iter. EQUIVALENT CIRCUIT (1/4 Circuit) FEATURES: + High slow rate: 8.5 V/us TYP. (V* = +5 V, V-= + Wide gain band width product: 3.6 MHz TYP. (Vt=45.V, = GND) + Wide supply vottage range: +3 V to +32 V + Wide output voltage swing + Common mode input voltage range includes V- + Internal frequency compensation + Output shor ciroult protection PIN CONFIGURATION (Top View) PoEsao, 644G2 |— fi our. wEt AN AB he “a ae “al yy. outs 7} [5] ours ORDERING INFORMATION Part Number Package uPCB4AC 14-pin plastic DIP (300 mil) yPCa4AG2 14-pin plastic SOP (225 mil) ‘The information inthis document is subject to change without notice. Document No. 10525E5VODS00 (sth ection) (Previous No 10-1002) Date Published Apri 1997 N Printed in dapan' The mark shows major revised points. © NEC Coreration 1987NEC uPC844 ABSOLUTE MAXIMUM RATINGS (Ta = 25 °C) Parameters ‘Symbol Ratings Unt ‘Voltage between Vand V wotet [vv ~03 70 6 v Dilferential input Votage Ve 36 v Input Votage Note2| Wi V0 to V 636 v Ouiput Voltage Notes | _vo V03t0 v0 v Power Dissipation Package Notes| Pr 30 mw (G2 Package Note 350 7 ‘Ouiput Shor Gul Duration Note 6 Indefinite see Operating Arbiont Temperature Th at +85 *c Storage Temperature Ts 550+ 125 © Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the ‘magnitude of V~. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when the both inputs are within the Common Made Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external ‘without damage or destructive. Even during the transition period of supply voltage, power on/off etc, this specification shouldbe kept. The output voltage of normal operation willbe the Output Voltage Swing of electrical characteristics. 4, Thermal derating factor is -7.6 mW/"C when operating ambient temperature is higher than 50 °C, 5. Thermal derating factor is -5.5 mW/"C when operating ambient temperature is higher than 25 °C. 6. Pay careful attention to the total power dissipation not :o exceed the absolute maximum ratings, Note 4.and Note 5. RECOMMENDED OPERATING CONDITIONS Parameters ‘Symbol MIN, TP. MAX Unit ‘Supply Vattage (Spl) v 15) 6 ‘Supply Voltage (V" = GND) ve 3 382 v Output Current b 10 mA Capacitive Load (Ay = +1, B= 0.2) c 000 °FNEC uPC844 ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V* = +15 V) Parameters ‘Symbol Conditions: MIN, [ TWP. | MAX. [ Unit Input Offeet Voltage Ve. z10 | 260 | mv Input Offset Curent le = [a | ma Input Bias Curent Note? | _la r40 | 500 | nA Large Signal Voltage Gain Av [RLE2KO, Vow Ht0V 25_| 300 inv ‘Supply Current Too __| = 0A All Ampliiors 75 | 1 | ma Common Mode Rejection Ratio | OMA 7 | 86 & ‘Supply Voltage Rejection Ratio | SVR. 70 | 3 ® (Output Voltage Swing Ven | PLE 10KO war | +4 v 43 Output Voltage Swing | Ven | E2ka 4135 v ‘Commen Mode input Vatiage Range | View v v ‘Slew Rate (Fise) SR [Ava t,Rezko 85 Vis Gain Band Width Product, Gew | fo~ 100 kz 35 MH Channel Separation = 20 Hz 10 20 KH 20 eo ELECTRICAL CHARACTERISTICS (Ta = 25 °C, V+ = 5 V, V- = GND) Parametere ‘Symbol Conditions min, | TP. | Max. [unit Input Offset Voltage Ve a0 [35 [mv Input Offset Current to 6 | 275 | a Input Bias Current Note7 | te 60 | 500 | na Large Signal Voltage Gain ay | Rzeko 25 | 300 View ‘Supply Curent kee__| = 0A, All Ampiiiors 60 | 90 | ma Comman Mode Rejection Ratio | CMR 7 | 80 8 ‘Supply Voltage Rejection Ratio | SVR 7 | 9% @ ‘Output Voltage Swing Vor "22 Ka (Gonnect to GND) a7 | 40 v jo ‘Common Mode input Voltage Range | View 0 v ‘Oulput Current (SOURCE) osunce | Vina +1V,Vw=0V) 70 | 30 ma ‘Output Curent (SINK) Towm | Vine OV, Vina at 70 | 30 mA Slew Rate (Rise) SR [A= 1 RE eKO 85 Vass Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.NEC TYPICAL CHARACTERISTICS (Ta = 25 °C, TYP.) Pr -Total Power Dissipation - mW la- Input Bas Gurrent- nk POWER DISSIPATION 1000 200] 600 j-e4sc-t BSE 400 200] oe 8080 Too Ta- Operating Ambient Temperature = + INPUT OFFSET VOLTAGE lee Supply Curent =m uPC844 SUPPLY CURRENT ¥ T y= eager le eoo = Supoly Votage -V ‘COMMON MODE INPUT VOLTAGE RANGE 2 won] > | ” i oe re) 44 i i : | E10 i ba Vor i : oa 0 14 oprtig Ano Tener" "Sippy Vag" = GN) weurens cornet + PUT us CURRENT 2 = : | | i — } 19 | | a | t ei) 60 0 8 a 0 7 0 > Supply Votage -V (V" = GND} ‘Te -Operating Ambiont Temperature -"CNEC uPC844 (OUTPUT SINK CURRENT LMT (OUTPUT SOURCE CURRENT LMT es T 5 a | Ba v z / ve loom Ee eo é ; be iv : pt a, * The ded tne shows a eharactrsioo! R= 1K 4 Capiees oes oneeE I botperruigees ieee ogee m0 loan -Ouput Sink Curent - mA losomce - Output Source Curent- mA (OPEN LOOP FREQUENCY RESPONSE LARGE SIGNAL FREQUENCY RESPONSE 120 || wes Roa 8 100 2 | 8 5 ¥ xo} —_— Z i 3 3 g 5 Re - 5 | : | 5 | | = 20 T o| 0404004 TOK aOR TM TOM ‘oa 70k 100K MOM 1 Frequency - Hz 1 Frequency = Hz VOLTAGE FOLLOWER PULSE RESPONSE > SLEW RATE ro . | I F=2ke i T z3 Venwsv Lit | | Vreno. + | ge | TT E z eee 2 | PF SG : TT eddadiilidil ¢. 1 5 é | i | g 4 Ht ie | & T Bo - A | a | aw TT] 3 ll el eezeee os 250 ° 30 700 Tame -u8 “o- Opeating bient Temperature °CNEC PACKAGE DRAWINGS 44PIN PLASTIC DIP (300 14 8 ee a 6 F 3 ofSLw @] NOTES. 1) Each lead centerline is located within 0.25 mm (0.01 inch) of, ‘ts true postion (T.P.) at maximum material condition. 2) Nem "" to center of leads when formed parallel z| = |e[ale|-lzl0|>) © lolol ce Sa WiLLIMETERS 20.52 MAX, 254 WAX, 254 TP) 0.5020.10 +N, 3510.9 st YMA 5.08 MAX. 782 (TP) 0.259939 uPC844 TNGHES Ta00 WAX, 2.100 WAX, 0:100-(1°) om:5 88 oad Siow sano O09 (TF 2010NEC HPC844 14 PIN PLASTIC SOP (225 mil) BRRBBBA deta of lead end al UE oO HEREEEE| : A EM _ MILLIMETERS 10.46 MAX, "L42 WAX. 0.056 MAX. 127(7-P) 0.080 (77) NOTE Each lead centortine is located within 0.12 mm (0.008 inch) of its true position (T.P.) at maximum material concition 29.40 8 (0.071 Max, 0.058 0.25620012 0.473 0.00623.085 | 200423988NEC uPC844 RECOMMENDED SOLDERING CONDITIONS When soldering this produc, itis highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10595E). Type of Surface Mount Device uPC844G2: 14-pin plastic SOP (225 mil) Process Conditions Symbol Infrared Ray Flow Peak temperature: 230 °C or below (Package surtace temperature), 1R3000-1 Fellow time: 90 seconds ar less (at 210°C or higher), Maximum number a rfiow processes: 1 time. Vapor Phase Soldering Peak temperature: 215 °C or below (Package surface temperature) vP1s.0041 Rellow time: 40 seconds ar les (at 200 °C or higher), Maximum numberof rellow processes: 1 time. Wave Soldering ‘Solder temperature: 260 °C or below, Flow time: 10 seconds ortess, | _WS5000-1 Maximum numberof flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Paral Heating Methoa Pin temperature: 300 °C or below, : Heat ime: $ seconds or less (Per each side ofthe device) Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Type of Through-hole Device uPCB44C: 14-pin plastic DIP (800 mil) Process Conditions| Wave Sodering Solder temperature: 260°C or below, {only to leads) Flow time:_ 10 seconds o less. + | Partial Heating Mathoa Pin temperature: 800 °C or below, Heat ime: 9 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make ‘sure that the package body does not get jet soldered.NEC REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES ‘SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL IC PACKAGE MANUAL GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES: SEMICONDUCTORS SELECTION GUIDE NEC SEMICONDUCTOR DEVICE RELIABILITY/ QUALITY CONTROL SYSTEM - STANDARD LINEAR IC crisst€ c10535e croeasx MEI-1202 X10679E leLt212 uPC844NEC uPC844 [MEMO]NEC HPC844 [MEMO] "NEC uPC844 [MEMO] 'No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsiblity for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability ofits semiconductor devices, the possibilty of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons oF property arising from a detect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-fallure features. NEC devices are classitied into the following three quality grades: "Standard’, "Special, and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic. equipment and industrial robots. Special: Transportation equipment (automobiles, trains, ships, ete.), traffic control systems, anti-disaster systems, enti-crime systems, safety equipment and medical equipment (not specifically designed for life surport) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. ‘The quality grade of NEC devices is "Standard” unless otherwise specified in NEC's Data Sheets or Data Books. Hf customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance, Anti-radioactive design s not implemented in this product. Ma 965