1 – General information

Ultrasound imaging is widely used in medical diagnostics thanks to its low cost, non-invasiveness and
ability to visualize the movement of internal organs of the human body in real time. The recent
development of high-frequency transducers is making ultrasonography competitive for those
applications which require high spatial resolution such as dermatology, ophthalmology and preclinical
investigations. The performance and the limitations of an imaging system are determined by the
ultrasonic transducer, i.e. the device, usually called ultrasound probe that can generate ultrasound
waves and receive the echoes reflected from the tissue under investigation. Currently the market is
dominated by the mature piezoelectric technology that showed the limitations that preclude its use in
various applications of interest. Recently, an alternative technology based on the electrostatic effect has
been shown to overcome the limitations of piezoelectric technology. The transducers based on this
technology are known as Capacitive Micromachined Ultrasonic Transducers (cMUTs) and are
fabricated on a silicon substrate using surface micromachining techniques inherited by the
microelectronics industry. In practice, cMUTs are micro-electro-mechanical systems (MEMS). Besides
the well-known intrinsic advantages of these manufacturing techniques such as reproducibility, low
production costs and compatibility with modern interconnection techniques of the integrated circuits,
cMUTs also show benefits in terms of performance. In particular, the large bandwidth achievable (over
100%), significantly greater than that of piezoelectric transducers, and the possibility of miniaturization
with complex geometries offered by photolithography, permit the construction of cMUT linear arrays
for high resolution imaging, making it possible to improve the diagnostic capabilities in dermatology,
in ophthalmology and in preclinical studies. Such fields of application are currently almost forbidden to
conventional piezoelectric arrays. Today, ultrasound probes based on this new technology are not yet
commercially available but it is well known that some large companies such as Siemens and Hitachi
are developing products close to commercialization. The ACULAB laboratory of the Department of
Electronic Engineering at of the University Roma Tre, during the last twelve years, was engaged in
research and development activity in the field of cMUT transducers (fig. 1). The Lab has been engaged
in an academic spin-off, in collaboration with the company Esaote SpA, a European leader in medical
diagnostic ultrasound, which aimed at the commercialization of cMUT ultrasound probes for medical
imaging. In the framework of the spin-off, an ultrasound mid-high frequency cMUT probe (6-18 MHz
range) was developed using the expertise gained in previous years.
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Fig. 1 Some cMUT die prototypes developed by Aculab

Aculab believes that the cMUT technology will replace, over the next decade and in almost all
ultrasound applications, the existing piezoelectric technology. One of the possible objective of this
research program, therefore, is to design and fabricate a high resolution ultrasound probe prototype
(1D) based on the innovative cMUT technology, operating at high frequencies (15 to 45 MHz range)
for advanced diagnostic applications in the field of dermatology, in ophthalmology, and preclinical
investigations. With our available cMUT technology, we can also propose the realization of an
echographic system capable to focalize in the elevation (1.5D). The optimization of the performance at
high frequency will be carried out using the possibilities offered by this technology. A careful design of
the cMUT microstructure together with the definition of particular geometries for the transducer array
allows to separate the transmitting and the receiving elements making it possible to optimize
independently, depending on the specific function, the frequency response in terms of sensitivity and
bandwidth. The transmission performance will be optimized by electrically driving the cMUT elements
with electrical signals having harmonic content at half of the nominal frequency so that, using the
nonlinear distortion typical of capacitive transducers, the nominal frequency signals are generated by
the transducer itself, without the need for high-frequency electronic circuits. Moreover, the reception
performance optimization will be carried out by integrating in the probe, very close to the cMUT array,
the electronic circuits for high-frequency ultrasound signals amplification and conditioning. These
electronic integrated circuits, particularly optimized for the use with cMUT transducers, have been
developed in recent years by Maxim Integrated Products (USA) in collaboration with ACULAB.

The expected result of the research program is a very high resolution multi-element probe, fabricated
using cMUT technology, ready to be connected to an ultrasound imaging system. The resolution
capability will be evaluated through acoustic characterization of the probe in order to determine if it
meets the necessary requirements to be used in the mentioned application areas, with particular
attention to early detection of skin cancer.
2 - The main activities carried out by Aculab

1) Numerical analysis and design of the CMUT structure and optimization of the array geometry;

The transducer design will be performed by means of finite element analysis (FEA) of the vibrating
structure following the specifications given by the high frequency applications. Specific fluid-structural-
electrostatic modeling proprietary software code based on ANSYS will be used in order to design the
structure following the technological constraints. FEA code is able to analyze multiple physical aspects
of the structure. The vibrating behavior of the CMUT structure will be optimized by choosing the best
geometry in order to maximize the frequency bandwidth. The sensitivity will be improved for both
transmission and reception sections by optimizing the electrode shape and by fixing the maximum bias
voltage. Moreover, the array geometry will be optimized by evaluating the effects of the transmission
and reception elements layout. This activity will be carried out using acoustic field and ultrasound
imaging system simulation tools such as FIELD II and MATLAB.

2) Technological silicon fabrication process: process optimization and mask design for microfabrication;

The technological process optimization will be made by means of numerical and finite element software
(ANSYS and MATLAB) regarding the electrical behavior of the transducer. In micro-electro-mechanical
systems the electrode design is critical. In fact, it is necessary to avoid the appearance of parasitic effects
(MIM diodes and capacitors), when a deposition of metal is made over an oxide overlying another metal.
Moreover the electrode patterning must be performed in order to minimize the electrical crosstalk
between channels. The lithography mask design for CMUT micro-fabrication will be made with CAD
design tools such as AutoCAD and LASI.

3) Multi Chip Module (MCM) package design and electronic front-end analog integrated circuit
interconnection;

In this phase we will develop a hybrid methodology for the structural and electrical interconnection
between the silicon chip containing the CMUT sensor and the integrated electronic circuits required for
the conditioning of the ultrasound echo signals. The definition of the interconnection methodology of the
MEMS and the IC devices will be supported by finite element modeling tools that will be used to evaluate
the thermo-mechanical stability during the various stages of the flip-chip bonding process. Moreover,
these tools will allow the tune the process in order to maximize both the acoustic compatibility of the
encapsulating material and the structural reliability of the final MCM hybrid device. Rigid-flexible
printed circuit boards useful for the connection of the hybrid devices to an ultrasound multi-polar cable
will be designed. The design of the assembly tools, consisting of mechanical parts for precision
positioning and alignment and necessary for the interconnection of the hybrid device with the rigid-flex
printed circuit boards, will be carried out with the aid of software tools for technical drawing (AutoCAD).
4) Silicon wafer post-processing;

As already mentioned, the micro-fabrication of CMUT devices will be carried out by specialized
foundries with which ACULAB has already collaborated for many years. Once the CMUT manufacturing
is completed, the silicon wafers together with an adequate number of front-end electronic chips
previously prepared by the supplier for the flip-chip bonding, will be sent to specialized companies for the
execution of the positioning and re-flow soldering of the integrated circuits on MEMS devices. During
technological processing, many devices are built on a single silicon wafer. The devices (dice) must be
separated by dicing the silicon. This will be done in ACULAB by means of a programmable precision
dicing machine. Successively each transducer must be allocated on a mechanical support. The connection
of the die to a standard soldering compatible printed circuit board will be performed with a wire bonding
machine in ACULAB. Successively, a backing material (tungsten and alumina filled epoxy) will be
applied to the rear surface of the device.

5) Electro-acoustic characterization of the silicon die;

A first electrical characterization of the single device is made in order to evaluate the process yield and
the electrical design specifications (capacitance). Electrical impedance and capacitance measurements
will be made using ACULAB's impedance-gain-phase analyzer.

6) High frequency probe engineering;

The transducer is the active element of the probe which has to be reasonably small. The mechanical,
acoustical and electrical design of the probe must be optimized to generate high quality images. As
regards the acoustic performances, the silicon substrate must be etched, and a conveniently shaped
silicone rubber, which acts as an acoustic lens, must be applied onto the transducer surface. Further, the
probe case will have to host the backing-transducer-acoustic lens group, and will have to be sealed to
avoid the possible leaking of liquids inside its body. The probe will also have to contain the components
necessary to connect the ultrasound system multi-polar cable. Finally, the probe will have to be
electromagnetically shielded in order to reject the external radio frequency noise.

7) Acoustic, mechanical and electrical test of the high frequency probe;

To acoustically characterize the probe, in terms of emitted pressure sensitivity and bandwidth, a
measuring set-up made of a motorized tank and a hydrophone (ultrasound pressure meter), currently
available at ACULAB, will be used. Finally, the same measurement set-up will be used for pulse-echo
measurements, useful for the estimation of transmission and reception transfer functions.

8) Final evaluation of the ultrasound probe by connection to commercial imaging system;

The final evaluation of the high frequency probe will be performed by generating some high frequency
images with a commercial ultrasound system available at ACULAB. It should be emphasized that this
ultrasound system is limited, as far as the maximum operation frequency, to 18MHz. However it will be
possible to generate images using the probe to the minimum frequencies in its bandwidth, obtaining
important information on the quality of the packaging and assembly process. Images will be made on
standard phantoms (known structure physical models).

30 µm

Fig. 2 Some particulars of Aculab cMUT

Fig. 3 A 192-elements cMUT 1D array, 12MHz center frequency, 100% bandwidth

Fig. 4 Some cMUT probe heads

ACULAB ESAOTE
cMUT LA435

ACULAB ESAOTE
cMUT LA435

Fig. 5 An in vivo comparison between Aculab cMUT and Esaote LA435 commercial probe