JEDEC

STANDARD

Flip Chip Tensile Pull

JESD22-B109B
(Revision of JESD22-B109A, January 2009)

JULY 2014

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

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 JEDEC Standard No. 22-B109B

TEST METHOD B109B

FLIP CHIP TENSILE PULL

Foreword

This test is performed assess the integrity of the solder bump interconnection between the flip
chip die and the substrate. Flip chip tensile pull is a destructive test.

-i- Test Method B109B

(Revision of Test Method B109A)
JEDEC Standard No. 22-B109B

Test Method B109B -ii-

(Revision of Test Method B109A)
 JEDEC Standard No. 22-B109B
Page 1

TEST METHOD B109B

FLIP CHIP TENSILE PULL

(From JEDEC Board Ballot JCB-14-28, formulated under the cognizance of the JC-14.1
Subcommittee on Reliability Test Methods for Packaged Devices.)

1 Scope

This test method is applicable to flip chip die after the die and substrate solder joint is formed,
but prior to application of underfill or other materials that increase the apparent bond strength. It
should be used to assess the consistency and quality of the chip join process and solder joint
integrity across a given flip chip die. This method covers both Pb and Pb-free solder bumps.

NOTE Considering that this is a destructive test, it may be not suitable for qualification or process
development where medium to high volume sampling might be necessary. In manufacturing, this test can
be used to compare to original baseline results.

2 Terms and definitions

2.1 backside of flip chip die: The surface of the device opposite the face to which the solder
bump interconnections are attached.

2.2 crosshead: The pulling jig on the tensile pull tool.

2.3 delamination: A failure found during tensile pull of flip chip solder joints wherein the
solder bump interconnection metallurgy is at least partially removed from either the substrate or
die, with the solder bump remaining continuous.

2.4 die fracture: A failure found during tensile pull of flip chip solder joints wherein the body
of the die is fractured and damaged before all the solder bumps are separated.

2.5 die-pad fracture: A fracture in the die far-back-end-of-line (FBEOL) die structure.

2.6 flip chip die: An unpackaged die whose interconnection to a substrate is formed through
solder joints.

2.7 interconnect: The resulting solder connection between device and substrate after reflow.

2.8 intermetallic fracture: A failure found during tensile pull of flip chip solder joints wherein
any portion of the fracture surface occurs at an intermetallic formed between the solder and the
device or substrate metallurgy.

Test Method B109B

(Revision of Test Method B109A)
JEDEC Standard No. 22-B109B
Page 2

2 Terms and definitions (cont’d)

2.9 nonwet solder bumps: A solder bump that does not make bond to the substrate pad
metallurgy during the solder reflow process.

NOTE A nonwet solder bump is detected as an area on the substrate pad where, after tensile pull, the
substrate pad metallurgy displays the original color and texture with no evidence of solder fusion.
Depopulated areas, where no solder joint formation is expected, are excluded.

2.10 passivation-to-UBM fracture: A fracture between the passivation and the solder under-
bump metallurgy (UBM).

2.11 planar fracture: A fracture within the under-bump metallurgy (UBM) layered structure.

2.12 solder bump: A discrete amount of solder, attached to the die external metallurgy, that is
intended to form an interconnection to a substrate.

2.13 solder pull fracture: A fracture within the bulk of the solder bump column.

2.14 solder void: A cavity within the solder joint that exposes device or the substrate
metallurgy.

2.15 stud: The tool that is attached to the backside of the flip chip die to perform tensile pull
test.

2.16 substrate: The supporting material upon which one or more semiconductor die are
attached.

2.17 substrate fracture: A failure found during tensile pull of flip chip solder joints, where the
substrate is fractured and damaged before all the solder bumps are separated.

2.18 tool failure: A failure of stud, fixture, or other mechanical apparatus that prevents the
execution of a tensile pull on the die.

2.19 under-bump metallurgy (UBM): The metal layers located between the solder bump and
the die.

2.20 underfill: The adhesive material applied between the solder bump side of the flip chip die
and the substrate.

Test Method B109B

(Revision of Test Method B109A)
 JEDEC Standard No. 22-B109B
Page 3

3 Apparatus

3.1 Tool

The apparatus for this test shall be equipment capable for applying the specified stress as needed
to pull the die from the substrate.

3.2 Calibrated measurement

A calibrated measurement and indication of the applied stress in millinewtons (mN) or grams-
force (gf), where 1 gf = 9.80665 mN (exactly), shall be provided by equipment capable of
measuring stresses up to twice the specified minimum-limit value, with an accuracy of ±5%,
±2.45 mN or ±0.25 gf, whichever is the wider tolerance. The use of gf or mN must, of course,
agree with the unit used to express the base dimension. This value is based on the number of
solder bumps on the die.

4 Procedure

4.1 Device under test preparation

This die shall already have been joined to the substrate by way of solder bump reflow operation.
There should be no underfill applied on any die on which the flip chip tensile pull test method is
being performed. Prior to attaching the stud, the die and the bonding face of the stud shall be
prepared and handled, as needed, to obtain sufficient adhesive bond strength between the stud
and the backside of the die so that the tensile pull test can be performed. Appropriate controls
and sampling shall be in place to ensure sufficient number solder bump devices are pulled, in a
range that is statistically valid for the quantity of parts being verified.

4.2 Stud attach to die

Without disrupting the mechanical integrity of the solder bump interconnections, a stud shall be
attached to the backside of the flip chip die with hard setting adhesive glue capable of sufficient
tensile strength to pull the die from the substrate without failing in the adhesive joint. The size
of the stud should be properly chosen to avoid instability during the pulling operation. The stud
should be no larger than twice the die area. Care should be taken to ensure that the adhesive
between the stud and the die does not overflow and make contact with the package substrate. A
thin, even layer of the bonding adhesive should be applied to the bonding face of the stud,
ensuring that the entire bonding face is covered with adhesive. The stud should then be attached
to the backside of the die that is to be tensile pulled. The adhesive should be fully set or cured
prior to the tensile pull test procedure being performed. The adhesive selected should not require
excessive heat or cure duration since this could effect joint intermetallics/ failure modes.

Test Method B109B

(Revision of Test Method B109A)
JEDEC Standard No. 22-B109B
Page 4

4 Procedure (cont’d)

4.3 Tool setup

The substrate with its flip chip joined die shall be held securely in place perpendicular (±5°) to
the direction of the crosshead movement. This is to prevent significant side loading on the solder
bumps. A fixture or method designed to hold the substrate flat and prevent flexure of the
substrate during the tensile pull in this manner is needed.

4.4 Tensile pull

The die shall be pulled from the substrate. The crosshead speed used for the test should be
consistent with the properties of the solder joints and substrate materials under test. It also needs
to be consistent if data comparison is expected. The speed used should be documented. The rate
shall not be so high as to induce spurious failure modes. Pull on the stud until the flip chip die is
separated from the substrate. It should be noted that the load cell must be capable of handling
the load applied during the tensile pull operation. For each flip chip die, record the force at time
of failure, and the failure mode of each solder bump in the sample.

5 Inspection criteria

a) Nonwet solder bumps, intermetallic fractures, solder pull fractures, delamination, solder
voids, die and substrate fracture inspection is performed at 30X magnification and verified at
100X magnification.

b) Depending on inspection requirements, other metrologies such as SEM (Scanning Electron

Microscope) may be utilized for increased accuracy and resolution.

c) If any tool failure is observed, root cause is to be identified and recorded.

Test Method B109B

(Revision of Test Method B109A)
 JEDEC Standard No. 22-B109B
Page 5

6 Failure criteria

6.1 Modes

Failure criteria include, but are not limited to:

 non-wet solder bumps  solder voids

 solder pull fracture  intermetallic fracture mode
• die fracture • delamination
• planar fracture • die pad fracture
• passivation to UBM fracture

NOTE Failure mode occurrence and type may be affected by differences in the design features (size,
pitch, via, etc.) and materials (solder joint, flux, etc.)

6.2 Criteria determination

Upon completion of tensile testing, the solder bumps, on the die and substrate, are inspected and
the results recorded for the failure criteria. The allowable level of each of the failure modes and
the minimum tensile stress (force per bump/area of pad) needs to be determined as part of the
procurement documents for lot acceptance. As such, each solder bump needs to be classified as
to displaying a single discrete failure mode. It should be noted that tool failure, substrate fracture
and die fracture should not be considered as test failures, but must be recorded.

6.3 Cautions

It should be noted that modes, such as, tool failure, substrate fracture, and die fracture probably
affect 100% of the solder bumps on that specific flip chip die. With these modes, the tensile load
will be variable and non-uniform in application. Thus the results are not consistent with the
norm. Though die fracture, substrate fracture, and tool failure are not considered test failures,
they should be recorded in the test result information for record completeness.

6.4 Failure mode recording

Failure modes of the solder bumps are to be recorded as number of occurrences per device basis,
and will include each of: device fracture, substrate fracture, delamination, solder void,
intermetallic fracture, non-wet, and tool failure. In addition, the ultimate total tensile loading and
the calculated average tensile strength which is: [(total tensile loading/number of solder bumps)/
area of pad].

NOTE The smaller of device or substrate pad areas should be used. The ultimate total tensile loading
and calculated average tensile strength and the summary statistics of all failure modes for the devices in
the sample will also be recorded.

Test Method B109B

(Revision of Test Method B109A)
JEDEC Standard No. 22-B109B
Page 6

7 Summary

The following details shall be specified in the applicable procurement documents:

a) Solder bump area at each of die and substrate interconnections

b) Number of solder bumps

c) Sample sizes: Number of flip chip die to be pulled, number of bumps per device.

d) Allowable defect levels for each flip chip solder tensile pull failure mode.

e) Required tensile stress per solder bump.

f) Crosshead speed used for tensile pull.

g) Substrate material

Test Method B109B

(Revision of Test Method B109A)
 JEDEC Standard No. 22-B109B
Page 7

Annex A (informative) Differences between JESD22-B109B and JESD22-B109A

The following list briefly describes most of the changes made to the entries that appear in this
publication, JESD22-B109B, compared to its predecessor, JESD22-B109A (January 2009). If the
change to a concept involves any words added or deleted, it is included. Punctuation changes
may not be included.

Clause Term and description of change

Foreword Clarification

1 Expanding NOTE in Scope for test method application

4.4 Expanding Tensile Pull as it serves both solder joint and substrate evaluation

5 Clarification in Inspection Criteria

6.1 Adding NOTE to Failure Modes

A.1 Differences between JESD22-B109A and JESD22-B109 (June 2002)

Clause Term and description of change

1 Added reference to solder type and a note

2 Added new definitions 2,5, 2.10, 2.11 and 2.19

6.1 Added last three modes

6.3 Changed device to die for document consistency

Test Method B109B

(Revision of Test Method B109A)
JEDEC Standard No. 22-B109B
Page 8

Test Method B109B

(Revision of Test Method B109A)
Standard Improvement Form JEDEC JESD22-B109B

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