You are on page 1of 28
Bi ae hen ASSIGNMENTS! e888 van unit Pave Tee | pihat 18 vapptel prototype 7 Ctve byte? introduction abet -stiptd prototype: Kl€xplaio the ‘fundamental of vapid prototype. { Wy 4 “ Ss of Differentiate beluven,tradlHona Prototype us BatePly explain need -for time to Ditferentlate. betwwer ‘rapt prototgne andl Chic techs " other technologies with relevant eLamples. \ Clossttey abot wap prototype Give block aliacraing g explaty ne rotolp ‘@ O® “= clearly crop prototype T satitha’h Semel $0; What ave’ the'-sa_ptal Pretotype commonly used terms... biWhat ave the aduaintiiges ‘andl limitation of rapid prototope La Whock fs rapid Prototype? Give brie? introduction about ra picl prototype. aerate deat pe opis 8 mend Raptd prototyping fs the + fabrication ofa physical part; model or:assemb asin g 30 cornparter aided (CAD). Ihe Crecition oF “the part, model ov. assemb| _Beuwali Conmpleted ust additive manufacture, or conamon la known as 30'painting. 6 eni 2 Trtoduction of Ripyel peetotype + dak hatenwcnttlt on pe The ortgin oP the'ided of PP was conmercioully launched onl, | in the 19805. “the ‘devélopment of RP ts closely tied with desta rnpresston fh preduuct clevelopred the development of ‘the , computer and software thdustry, Dn’ parttiuilay, the exfstence af computer-aided destan (cad) plauys a attcal vole Inthe emergente of most, nok alt, of current RP systems. ] Lethe prtmany tuunctton of RP Seystem fs to dabotcarte prototope within a shoxt pertoel of time ty accelerate the product development. ; > However, after three decades of development; the app% of RP extend: fo betyond building prototypes.Tn-fack tt has been, adeypted sto meet the! needs ofa vastely of inolustries, ineluclt design, manudactusing automoltve, aerospace, biomedeal, Jewellery, cofr etc: ‘ > Currently, 20 fs rejuvenating ‘itself tn the defence and’ manufacturing fnduustries, espec tally with the establéhment! of National Additive Manufacturing Sonovatfon Snstittite’ (Namrz) fn the United States and concumentli, the p Mengong Aelditve Menuteckonng Conte (unc) t Singapore: 2 : ; ’ ‘b Explain the fundamental of vapid psctatype, fundamentals of Raspil prototyping sautators Kae eS Wile “these aye currently more than 20 vendors sk RP suction the method ‘ery each vendor can be-aene: cv ; naautted seat “cate cntes.: a an = — photo catting cutting fond gluing! Joining, melting a ) soltditging fusing and Joining binding. ciaulosh L¥€ Photo- curring can be further divided into: categories of Single 1 taser beam, oloutble lasew beams anel masked lamps \yelommmnon to all the ‘different Technfques of RP i the baite | approach they adopt, which can be deserted as fellows > A'model af component fs mocletledl on a Computer Ndecl LeDestqn/ Computer Afded Manufacturing lana) sylern, | y-the solta [surface model to be buflt ts next cenwerte d tak, afomat dubbed the #STL (steveolttrogra phy) tl fosmnad which originates from 3p systems. >A computer program anailiyses & STL Pele thert define; the. mtdel to be falsteated and ‘ slices” the model thy cross sections, ‘The, cross, sections are systematical recreated throughrthe soltdt ication of efther liquitdle on powders and -then, combined sto farm a. 3p model! 2.a-DiPferentiote between traditional prototype Us rapid” | prototype 4 + xt a Rapid prototype Z _. Traditional prototype. 13» A ThES process fs constderel PE TIES process fs. conitdered aj | asthe adtittve ‘fam parts | “the. subtractive. form or butte ox built tip by adding and | by removing matertal from co. hovigontal lager process. block of unwanted material, fy irvine mostly by the be Move, human foteraction and machfres and softwase _ human hati ~less human tnterdebb. | Models Ove creatke dl faster Tockes move Hime to make. and seduced, the tines | |s the objects. between repectted operating, clean fo the Pisocess..cofth PK Kess cléanita Nhe Proceis. i 2 less dust and waste when) Seay S Compared “to “traditfonal| Prk 9 fe more expersfence. . | | } | we and other ‘Feebroloptes wi RP materials, wanes and paper larinartes, AThfs fo the: adie oom of process compared ‘to CN € Dn RP machines are creating alll pavtts Compared to (Ne. DiPRerentate between miipld Prototy Hh examples. KR rainy uses polymétte Be This fs ‘the. SublaeHve oom creatg amodeb $x reacting (rj making an - Object by removing the materfalt, oS RP process ts opplt ceuble Fibers %s the acturate precess spectaltged materials and thts fs cayetle for hg ran hang Ute Acuray fy ‘ormon srenufacturthg. Some cases, materfals, | HERP process fs automated | Skilled ‘echnfgues, all pasti'(ho alloy pans, no | undercut eaiteided) 9! PE St produces: past, tn * 9 pooduces favl tn mulit, | Single stage, Site : i eFfidency % higher when ie Cefcten fs low wher ; pe ail CN telnoloe = teste er —| NC Neh process fs mainly used for soft matertals [the loey densft ty fioerboards } machincals wares ete. CNC fs robawtomabed aad: | ently Crpe cepted by high *ONe. thachtnes cannot Crea! Cormpa, to we.pt prot Fr; be TE takes Fed hours to mate component + * Lye Operatton speed fs tow when compared to. cries MN takes necls tne wobp | “fo make component, Operatton Speed ts hp 6 "when compared ts pp Cramples.i-.Selective ' Lasoy Examples’ enic lathes and \sinterfng (SL), Rused Deposit fring Machtnes, che \ Modelling (Eom), Stratng| laser machines, cue ol aphy (SLA). Machthes” 004 ‘. What are the advantages an limPkattons of Advantages of rapt prototyping re Le Reduced desta and development -time, x Reclelced overall product development cost % 6limthatton or seduction of risk ty t Vy Sb, "apt poltye “A Allows Funetfonaltty testing at a fabrication wf the cost pkTnpwoved and fneveased user frvoluernent luting design, | stages of NPD eget x pbility to evaluate: humonfackns' ‘and ek yonomtcs ve Mfordabstity ao Part consolidatton Prototyping alccélevaites the development cye le Limitations / Disaduantages of rapid prototyping’ 4 7 Le Some rapid prototyping Processes cure still expensive and | not ecenomfcal: AG Rae es . : A i + Limited materfal Tange: ‘ad hot matt : lye Chd-user confusion, customers mistaking it Br finished | produue t- Dk Resolurtfon fs mot ay fine as Aradttfonat machtning. IF Recluced metertal eee like susface finish and ° Strength: t yh WD Pe Rapie. prototyping requitves skilled labour | Sa) What ave dhe srapfd prototype commonly ised Sadi! ae Some of the commen used Tevmsifs rapfa prototype Ore PRD petting : \ hese OM} oh! % Layeredl Manufacturing : * Layered additive mancfactunira * Addlttive Manelocturing Fpilay He Direct aigttat fabsttaltos > Digital prototgping & Divect digttal. rianlactonig, * Desktop Felsstcatyy * Desktop manufacturing ‘or, personel ltt x Profect Deployment: rk Addfttve Fabsfcotfon Laminated Obert Morutati (i (Lona 3 Electron Bean Melting (ee *® Low Volume Shjectfon Molding , : en # Fused Deposttion Modelling (FM) +) © ts ® Std Freefrom Fabsfcatton (SFR): + bathed « Supe amag = | BeR PAID quuarayy APIO japoy| ” fagaram and: | € Gopuashs | FS Tuy Byenjoeprvoy| ia arm 3 [da aarp] bs S © S| 2 ppos bypns: F evecare SR | aay Pabst] Oe SLwjaaphy anette BS emmy paws) [=~ * Panmpan aohare Pyboboynaseayy Be : : 2 2 be = 60¢ | |s ° © (11d) Ab opasyoay; | 7bs7 byany = Bearman zy) SI pam sade I | Puney PER & = pared, LI Sot : paroq, parng 3 > _A0Pmay “| & 8 party S - . LE y,JClasstly eaplatn clean er db, Explain the need for Hime compression. fin’ procluct olevelopmenty , me tad fox Aime compressfon 4 in product development + ‘ Be Festotynee pleys a very Inpggtent ae fo product develop- Sia useful prototypes: thet ave made with high qpaity product” % Prototypes must be boflt wlth lovee and least tine to-markek as posstble. : * Rapfd prototypes can be used to accelerate the deciyn processes and tt leads to defeat the Free products and veduce the visk * This techniques ave proved essentfol to market teaders Such as Mfcrosoft, Tntel ete. * Vietualty many business eS. wwe prototypes ‘for exunple aeroplane manudacture rs to types Productng, to Compuker system “developments. ? = Le Gin the cobtwave incustety O serfes: of drawings awe created by the developers Give used to° obtoth the = Acceptance by dleotsfon eA, unit “2° patho fs: #8 ‘20r1 Barely one “the process or cverifery of 39°? OGtve Some examples of 3D panting: wlth, wlth neat Sketch, 2a White ‘about 3p painters and (3) GD systems.) Js Eaplolh about’ €x-one metal and mouldén. M4 sand printer. ag Batty explath about clivect metal Pafatens totth neatt Sketch. Grovtety explatn about divee core anal aut making machine with ale ie wpa Explain about sign deta ee ising ashe) Bpbrtetly explain abouts voret~ Jet ad Printing Systeme, $Wlhat # optomec masker, mesoscabe material skeet | |(Msb) ? Batty erplaty,. 2 2 What fs SDP? BrteFley explain the Process. ox overuteus oP DP: “BD painting 6 oe Paddtiiye ‘manufocclunin i the a of a three. dimensional object: From a. CAD model ov a.“ | il tal 3D model i can be done in a vette of processes iowhich material f depostted, "pore ov salted tinder | computer control, with metertal being added together | Gutch as plastics, Liggifels ov possder’ gotatns it “tase typteally layer es, ee) Overifers of GP EY > clinoepattilasa% & | | # 3D printing ts: a process “that uses Computer veifded destgn ov CAD ty create obfects Ht by layer, 3D painting ts cormmont used fy manufacturing ¢, autornotfe| fndustates, where tools and ports dye made using 38D) printers. oe atthe C2 he nalan at As the capabilites oP 2D printing eont{nue to rw, the 3D painting ts estimated, to reach a value of SY bUlion dollar by a0a% gut ol pe Many. healthedre Pacil@ttes tusnect 4o 3D potnttha to Supply sthel'y stat? wfth much needecl | protecttve emubran— mont: equipment: oon 2 The 3D printing technologtes are Stexeol*th ography C318) Digital Light’ Processing COLD, Fused: Depost on Vell, | Modellé CrOM); Selective Losey Sintering Css) Clectren | Basin: Melting Cenm) and?meiny ove," “| cma about 3D printers and 2D system’ » tite 12D printers + “att cholera wed LAGe T hodla |e 2D pointers ean lise CAD to create 3p objects Foon » o. vartety ot matertals, like molten. plastic ow powders. ome tna vartety of shapes & Sizes . ment that can, Ft ony ot, clesk to.) els used fh the, malting of 2D-prtokel 4, 3D pointers Can. c ? vranging Feory ecpsip | large constructfon mod. ounse s+ 7 2 . edt sty lyThere) axe three .Maty. types of 3D petnters and.each ” use @ slightty oliPPevent methods al $ wil Spor | x Stereolitho guaphic, ox SLA printers ove ‘equipped euSth: |. qi laser; that forms. lsqntd resto into plastie: / ly Mised depostHfon modelling or FDM painters, aretha | most Common “These punters ledge thermoplastic Filaments that ave’ melted ‘through ‘a hol noxale to | fosm an object teayer by layer, i a | These 3D petaters dlre similar to trac ftfonal ao | | tnkjet potters 21188 ct layering method to create | “the desired Obrect: ‘+ they wovk From ‘the ground. up-and pile on lager. al | after lores until the object looks exactly like tt uf | | | | | Was envisfoneds ” | peolecost Josh? vate ‘ i sketchy” 1 a ‘Direct Metal. Peinking’ (OMP):= a eee) Bar Briefly explcitin about dfrect metal” printer wotth neat | | | | | DMP fs 0. powerful 3D printing ‘techndlogy ‘thst shape | dlestred metal part geometry by meling relat | powder tower by un | Ths technology és applied to bufld up matertal fh | | layers instead of removing it fn different steps. s The. metal, power paatteles pinporntedt by the lasey qpetckly and feully melt ‘50 that ‘the: new materfa property attaches tothe prentous Hai without glue ov binder Uqfdl> ’ A powertul Fiber laser: with, high enesgy taken operates, fo the Prevt avec thstde the machine thts guarantees that Ihe metal ports being buflt. exhPbi- a dense and homogencous moatertal structure: or eThe wp dlestgr of the ‘pants dtrectly « dafues the DAP production machines without the need fee. Pee TES clamping oF ‘tooltng. : sk DMP fs an ideal technology tov aerospace and defense | applications. Tt allows the production of small and.- | exhemely complex shapes tth:no.needl for tooling and Pp if it peomitt aramartecilly different part desten that: conventfonal processes Utke: machtoings stamping or de!) Casting, wl ollow | Explain abast aoligen direct shell production ah casting | 4a ‘(DSPc)- Direct Shell erage Coating (Ds Pc)r ae d wo flee Aloe toed =F stell ie Cosamte molds vather than 3D models ove mace by Dersc fh a layering Process sinilarto other: RP. methods, Ceramic powder fs spread by wUeY over the Silritace’ of Pani piston that ?: is secessed tothe depth ta | single era qt then a binder fs sprayel ~” the. cevamée pourer urdey computer control: “the next layer ts bonded to the. | First by the bincler. . | ¥ when all of “the layers g are, -oorlels, the? bonded cerami shell f& removed and fired to-formia clurable mold suftable fos Use fr, metal cast : pethe mde con be weelto casa peiatype the PSPS process ts constdexed to be Gn RP ynethod because he. } ‘tan make molds faster and cheaper, 4 ‘than conventfonal | ometheds. °°" . | KDSPC canbe used to produce matt of stacy any “Shapes Dierse” metals, irelucina copper, bronge, cobalt, chaome, aluminfun, Stainless Steel and. tooling steels, have ‘been successfully cast In the ceramfe shells . producecl by thts process, ey ints S What ts optomec maskex, pee omatherfacl depnito ‘|uss9) Brrtety explains if hou shaved j | Mesoscale pee Deposttion (Msp) -. rid Tian reukaals Mesoscale Matterfal Deposttion (MSO) fs anew dPrect | | | technique, whtch *s versatile enough tyclepasit a. ., | large variety of precursors; anel colloidal. suspenstons This maskless deposttfon method operates fn'aris ad elena by * The Feist ‘step fh sand casting ¥8 to mélte an eiaet at soom a yatuve: Jn this, a ne ol beusgel polyenet + precursor was used For epoatthy En) thin Filrms:on surface va glass. substrates: £n0 fsa - ua Mana q mate with opto technologiea! \ applfeations 4 fo the areas of fxd Anspamen tr | conducting electrodes fp scar cells, ancl fh Pert ms ial | asa ‘low vollage phosphor, oy. LEMaskless Mesoscale Mabertel Deptt (wD) te fs an aevosvl based ‘technology, for deposition, of varus abe wlth particle Sips less than’ OS pm. Partum ttanate, metallte contacts like, Au, Ag Cusand Pe and egal materfals” on, vastous substrates have been deposited wig his piocesse & Ty ARs method, patieans of sub-ntfaon hed aerosol sol gel of molecular precursors andl collotdal pense are | deposited with ease. Le The destred patieains ave Y drewnn | ang CAD sothavare, which * can be’ conviertect Tito CAM ‘tool-paths. ¥ This enables aapid prototyping 0 of P components: I thts, ' direct unite technology 1 The precursors or celta dpe ase atomeyect Preumetfeatly or ultrasonically, +l le The: atomf xed particles ave guided and depdstted onto Substrate surfaces Hrough “the use oF a corte qee Cxplatn about €r-one metal anol {oulliag sand printer: Metal-sand cauiting “pattern of the thal part. Typ “thts Ps hale of ea} 1 wood) eat. % claw, | Casting Sand fs then ftcke dl around “the pattems Insfde o heldng boito create a mold: TP the moclet was. made of war, . | ie Left: inthe mold. to be burned out when the molten metal fs_pouned tne . | 7? a wceder or clay pattern fs wsedl to arllow, ‘the,patttern tobe removed | before casting “the metal. : Sand 3D printing tums the, traclffonecl. scund cast? proves | ont head bg erecting a mold altrectly with altoP ths. |. | Complenttey and mul tiple pats fr one. herald wt also has ‘veproducaltlity and fs easily addfusteol F the| \ Finished mold isnt quite aight Tp adudftton, the, large print | “bencl voltume allows bigger molds to be maces. 5 Sand 3D prtnting begins by Leveling the Pirst thih lai yf | of sand onto the butla platform, the prtoter heack oie jis. | shawerses the’ sand layer ahile ft extreectes ‘the binder | in the pecttern needed ‘Pox “thet layer | eal A The Sequence ot Atsperising), leveling ancl bindex entaudi | continues until part completion, The acldttional sence in the build platform Temating asthe suppost material | foster: coming layers, meaning no addlétfonctli tupports’’ However, the mold has tobe. constauetedt fh ports are needed. ry | 2¥ When “the pot fs ‘Finished, any loose sand Ps ccametierllep / | removed: Post- processing mary frelusle farther cleanings | mnpreqna fing the past far fnereased strength ox, ‘ | Sintering and bineler removal for metal ipowden |» | posts, aa Lae UNIT=2 €xplats dd’ patting technology iypes ? ? Cxplatn non-contact patting ? What fsthe process of inkfet pointing. , Discuss briefly with neat sketch of aerosol fet petoling land beiefly with neatisketch of ferogrephiy printing. 8 ae }.alExplath contact pointing 9 What ts The process pete printing. | b.| Desestbe briefly: with neat ‘sketch of oft prtnling, | 3.a/Discuss byte#ly with nedt skerch of screen’ printing. ‘can ‘| Btetly explain about omgante Vapour jet printing, What fs process of ad prtoting and explatin Prexprcce ssi |Piototyping ‘arid post: ‘treat tment: use of block dita and write a'short notes of 3d Printing wed f tp Alero: |Piggee £al Explain ong 2 cuirent a 2d pig making! process and advantages. : Fs ve » Expleth block eegan of Apes edhe process ter ad technalegy. bio wit hae xf ad: patittig Hebholagy hs 1€xplatn roariady ‘pring 9 What PS-the process of mre Pe Types of aD Painters i= ali Laser inter bes coed fo iy iad tra pete Printer” ‘ . Platter: De LED prtater’ ¥ Dye- sublimation printer Non-contaet: prtintin g > R fa modern pifntiig Process hat cloes not re bed sfony contact: betweers a pit thipla and Ms object to be printed: van ve | Some of the technfautes to Hon lati are! | A Tnkfet pointing: ea bus, se Aerosol Jeb prtoting gating) hoi mehlie' Organ Veepouar pet? my ‘aget printing i | Uitiasmte vibsales. | vag ““Bepleiton> | [oes it “igi | | cao es a ave Nap le eee . 1 | Ceaméc oystal a (ngporslt bo A sa fe j ey R Deflection || Pressure “regulates prick, Bele in Electromagnetic valve To return pump bpd : Tne Supply Rump | Suppl Farmp 0 Sub tak bot lle Mak Makeup Ine Process of inkjet printing r * In inkjet printing mechanism, the print head has severel tiny noygles also called fets. Ascthe perpev.moves past “pps | potht head; the noggles rey the tk onto tt, tg the chawectess and fim [ar ink fet pointer ¢ can produce fom loo.ta wveral, hincved| pages, clepending onthe nature of the hare copy: - KAnkjet printers use a. ltqucédl fk poocuced eflher by a coloured dye. a..liqufd that contains aolfel pigments fn suspen, As dhe pafnt head moves horfenta lly fo the machfne, ‘the Paper passes, through perpendfecelarto fist Ye Asthe page passes Thsough, the nog gle fn the pitt head ; fs acttvatedl (usually by heat (electafe ciurrent depereling * on the manutacturey) and a small, olsopof fink fs efected or Sprayed out onto the page annie, 24, A This process performed at Nigh speed wlth thousands of | dvoplets that fam togethey to recrectte the dloftal tent | or fnage that fs betng transfered ento the meclfet- |Discuss briefly with neat sketch of aerosol fer patntingand brfetly with neat sketch of Ptexography printing» Aevosol. fet printing Aevosol delivery tubtry sheadlh gat ¥ Depasttron| } head NY: natceully focussed aang el. streg nn | Ulrasnte aor pan cnn fl | Klorking, of Aewsolfet prtibing + RAT printing wove by epiaifing out an’ acrosils a” ing out an aewosol- a suspensfon of small aputel dvoplets fn ats fh a process | cthact peurallels Spray potattng. BU ats a4 be Unltke spray print, however, thes aevosel fs very prectsely, Aepostted, Supported by a ssertes of steps that ensure a | small focused beam of mateata ls ; This process begtns fnthe aerosol ‘chamber which stores the | hte printing tke This tak Contains partteles of destreel potrttng makertal fn an approprtate lepetd solvents, Tin-Ihs chamber, ‘the atomfzey aerosoltays ‘The. fnk into small afsborne. “dvoplets. |. cotites wat X& From there an theat gas fs pumped hh comuthg thé aeiossL | with 7 Once the stream £5 cut of the chamber;a virtual impactoy removes excess ges to Create ardener aerosol‘ mist Late oai-at dhe anvheee as 5 * Fthally, a sheath gas stream fs fntieduced, susouncling. - she aerosol to help ft focus and prevent, clogging. thes. ie Qerosel Stream extsts the nozzle with a.vartable dfameter “and fs deposted onto the destred substrate. To target; deposttion, a. controllable shutter prectieley bleeks and veleasesthe stream baited on 'frput Cap dcitae” | Flexography. patting = : age SPS (Je) aaadtin mee \ ! — cylinder ksh a o Dosa ~plake cylindew _ 8 7 | aia dg) drei ee oa aril ai pallet a ciamt9a FRC y — 2 Flerography fs a printing process where he Image sunfire fe tn velteF and unite letterpress pothttng ts, Frage sivrface 1s made of -Hlex{ble polymey maotteatal nylon ete aS ATES 0: votatery patoting process which uses iuolntdle lute ‘inks fox prtoting. Plate cytineler> Tt: has, nylon or ye plate « sapterig| Mountect for printing Prono elite fore ‘ Trnpression cylinder.” Tinmresston, ype applies the reqpsbra [pressure + to transfer “the tk -from the plate cejbinder to substrat Tnk fountatn > This f fs where the highly Uquitd ane volatile, ink, whtch artes by eucporeatfon | fs kept tor. printing, a Fountain wller> This fs usecl tar metering, ink to antlor, whler ty transfer to the printing pete “hfs revolves around. the lint fountain? + AY | Anilox roller? Anilox aoller “yecefves the fnt. He feuntets soller and transfers the Same tothe nylon Image area. of the lew graphte printing whch fs mountect onthe plate + cuyltnder. » x The Process &. tised for p Shee en, non shackle os ren= powus uubstrafes tte payet vee, plat metal, tarntnate etc: a 7 Noval eel. oy voll of wibstrate ts Used Hy fr thes * printing process iclueto fis hgh speeds Current printeny speed by tlerography gcc upto Goo meters perimthute. — | Explaty contact printing 1 twlhat Is the process of gravure pratt ? Contact painting + ‘Tt ?s a modern printing process that requires contact between prfnt template and the object Yo be prthted. The following are the. types of contact ee, 7 Flerographte potting ©! A Grane printtrigs 0 site q oa # Offset prthting inves soeogdleg, kita dosh. A Soren printing «5 2 2side4 ato) wy weet abe 20 He fl a dk Creare printing & is a type of Putoting when an engraved! cylinder with painting matter fs portfalley immersed fn the Fnk pon and applied with oes to the eater to be pointed? gs \ cB THIS allows “he s Scene ely for8 Haas ine “uithout defn fons As the cylinder rotates the wate draws excess ihe onto tts. suvface:and thio the’ ceils.; os |peActng asa 6qp004e; the cloctay blalé scrapes the eyler befye fimakes contact withthe paper, xemoving the excess fk from the non- potittn ‘aved’s aie nae ni the ell 5 sthe oot amount-of tk veqpitredt: * |e the position of the blade aela te tothe nip & ‘nivmallly | | yartables: hos ct 2, a 1 Desc oe ssa with reat Sieleh o diel Pe, |OFPFset printt woffset printing, aA collect offset: tography. fsa. method | of mass production pining th ehtch-the: frnages on: metal | plates are transfered to rebber Blane or vollers.and |, then 46, the as medion 4 te | { ac fict) ba offset ( i ) cofindlerr | Depression; med | cglénder ' Ae The print media, usally Paper, does not come thto dfrect | Contact with the. metal pla tess. Thes prolongs the (fe of plates. Th addition, the Jlexfble rutlober- conforms seadil ly Yo the, print media surface, allowrng. the, process to'besused picaciee on rough-sustaced media such.as..canvees, cloth. orevod. be There are two types of otReb. printing machines are Sheet ed offset printing and web, offset printing. Th Th sheet feel offset printing, fndfurdescl a of ce cae el into Yhe machine «=, Lethe pages can be ee to the oe lec shetor trimmed atter prtrting, In web offset patnting , ee high= Speed’ machines are used. | : Offset printing process bp Alyst the: tmge tt [graphics are “layered & fb rapt Successfone of) al + ‘placte’- “hes Shs” tesueulty: sh sheet of metal, 08 papers. wethe plate fs then transferred Yo a twbber voller cylinder, which fs then used or the nicutn event, offset printing. Le There will. be too plates fhvolved inthe process H bath sfdes ofthe paper need to "be" prafrrtedt on: ' n | ae The voller then feece the’ paper filo the presss"The cyltacley Centatning “the tak-for Your artwork design stamps os ‘potas f ii paper to rerectt: high gpecdlty colour culpal and 0+ Disceess briefly with neat | Ketch of Screen printt{eg, * Screen printing - Bones | . ; }- pide diy ‘ We * stilt y AX; j Bees SPENT RUBS ale & Screen printing ts also known as slic sereentng ov silk screen printing. The baste process of screen printing Fovolves creatt a stenctlena mesh screen and ‘then-pushtng the fnk Yo create and fmprint the deson onthe below surface. pe The most common surface used fh screen printing fs popey nel -falsvte but metal, wood and plastfe can alto be used. The first step fh the process of screen printing fs to create. | the dlesfon. Tt ts printed onto a transparent acetate felm, which willthen be used ‘fo crete the sereen or stencil After the mesh screen fs selected, ft és Coated with al&ht- ‘weackive emulsion layer the transparent acetate: film placed on the emulsfon-coated mesh screen carefully uncer . o-lorfght teght: which causes. the emulston, Yerharden gdevelop. Bubs) be Tn thts tichwiguie, bk thert gas fs used 40 ca bk The: gas fs expanclec thicuih the nop pte to produce highly pk The retraining unhaidenect emulston, tc aang, wf fll be vinse cl” cxwvay Yo leave a clear fmpitnt on tbe ‘Seren The screen {5 hen dlfed cncl Rf there are cng eae ee oe be dlene! bby the printer, b droale t f bkThe material to be printed ts placed “flat onthe printi board ancl the screen on topot the matesfal fn the destrect position, vreacly fo be printed... ny a se The screen Ps lowered downto the printing boat mide colour fry Fs ctetded on the ‘top ot the screen: A Sqpseegee will evenly désthfbute the fk along the length ofthe Screen. * A spectal washing Fluid & used to remove the emulsfon to reuse the mesh for creating new Stencils. | * Lastly, the printed products heat—ceredl by passing thou ja awyer, erect ong a. Smooth olestgn. Brtefly explain about ae Vapour fet prtating, Orgonte | Va pour et pean n tng c a Me es cae, Noe wer ‘the molectiliar’ of organic ‘Walpour td ‘the: ‘substrate. _collemated: ’ gas get, which “then fmpacts on Frcexe: substiote! Fos the oxqante vapour condenses while carsfer gers molecules | afsperse after the tmpact. | Fhe acluantage of OVP fs thet ft does not-vequire a. seluent woth the use af vapours, | x The vesolutfon of the deposttedl patterns canbe controllect by |. ‘the pressure ind type of comer gas, nog gle properties ancl ‘the distance between the nogyle ancl the substrcites OVIP ts @ ron-contact, alivect -mutlflower printing, Gt fs free | | From the solvent orthogonality problems. | he hat isthe process of ad Painting and explain pre-precesing, [prototyping ancl post treatment with use.of block diegram and write a shovt notes of ad Painting used fn dffferent ‘places: : : ree: . (Process oP 3d printi oe a Migs wart when the medelling @ Slicing ofa 3D object f completed Ts tine’ ar the “30 printer to Helly take oven sxThe printer acts Pnerally Same. asthe traclitonet inkfet printer fnthe atrect ap Printing process, where ox Nogale moves back’ anel “bxth while alispensing a. wor or » plastic ttke pblymer loyer-by-taver, walking foe ‘thot tnuger 40 airy then adldting ‘the nent levele iin ven ATE essentially adds hundreds ox thouscnds of 20 psints | on-topok one another fo mote a three; dimensfonis: Objects : reigt i ipsa cae Py TIM b dfagramr Block ‘attag 4 essin Prototyptn a Generate “the Level | ‘| Process tng- sme omen information| Qest-treatment. ce Tauer oe mn pe processing ¢ boncltng Le e le Cunt F Applécartfons oP 2 painting = or 2 The: mast common axpplicactions of 3D printing are medicine, aachrtecture, custom owt cane deston and. can very. from) fully Rinctforal to purely aesthetic. applications: me AM technologies ‘ound applfccattons Stavting fn the l9¢o5 Tn pooduct development, data viswoligartto n ,rapfel prototypirg and speckalined ranufacturtng, Sataieg D]Not * Industyfal destan, aerospace, military. engincertng, dental and medicinal tndustates, bfotech (human tissue replacement) fashion, footwear, Jewelery eyewear, educatton, food: | many other fields. . me be 20 pointing ‘technology cannow be used to make. exack replfoas of Organs. ‘the prthter uses Fmmages from parttents MRP ox CT Sectn images asa template and loys clown layers of wubber or plastt. pe Tt fs also wsedt Yo Prodtce personal protective eqputpment (PPE) which fneludes Pace masks, face shields, goggles eto ee Sa» Explain any 2 cunent trend fng ad pointing workin process ~ {D Bindew fh ‘. and advantages: gata Binder New 7 L. a pe II 4 bs dd use 7 Binder, fiery t isan addfttve! ian Process f in| which on fndusteial, printiveae! selettively deposits a lequte | binding agent. onto'c: thin Laver of powder” partiites- Focindary- Sand, ceramics, metal ov:composites- to! build high= = Vcilee cand one ~of ackind pasts, and tooling. )* ho adh hae Vsspe Stmilar to printing ery sheet of paper, the process Px! repeated layer by legen, using oi ee ree on dest ile, unttl the object. fs. complete: Advantages ; Gaiise 2 toot padb hs ha 2k Freedom of lesan bo Ssactencas rx Short deadlenes * Green technologtes (energy matertal corm atductinot stocks; reductions’ of aissernbltes, aaurbon ‘foatpntnt of monuta- cturing etc). 1 : + antenstes® K * Homogeneity of etstnactaie 4 on : +i LGh Ke * No putnting support : Good! surface condition _ Sterealtthogreyphyy (SLA) Laser Unit aK Laser Beam —’ 1 Auilel Jeane inioe TN ' | Build Aalto ||; a moves tp X-Y Moves " 2 aris alteecttOO L> pool Resi? re Ulhen the process stots, the laser “cleans” the frst l of the print fntothe, photosensitive restr: Ithewever the laser | hits,-the Ugutel solfd ties. "the loser Fs "altreckeit Yo Pept | Coordinates, by. o .computer'= controlled mixin After the First layer, the platforms ts vaifsed auccoicling tothe Layer thickness andthe addfHonell! vesto’ fs allowed Htoftow | below the abréasly printecl portton. 4 | Lt the laser ‘then golfdtffes the neit cvossveec ton axralthe proces | fs repeated until the whole part: fs complete. & At the enc of the process, the model fs removiedlProm the platform, washed of excess “resin and’ ‘then oe fn a Ou | A oven wiring cuntng Advan \ ne Stereal ograpy provides odinsingaet in speed: cpa ~ effecttvene ss , flextbtle let and prt pe Texturing fs posstble ‘ 7 Multt-Powt Assemblies ave posstbl e * Sustainability > Works with aiPerent matertals

You might also like