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EoHT®

INDUSTRIAL SOLUTIONS FOR SMART TEXTILE

Additive Flexible Copper tracks for

technology materials High conductivity
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PROCESS
IN 3 STEPS

01 EOPROM® PASTE
DEPOSIT
Printing / Screening
Spraying / R2R

02 DRYING
& CURING

03 PLATING BATHS
Electroless &
Electrochemical copper,
Ni, Sn, Au

EOPROM® : INDUSTRIAL & ON COMPOSITES AND FLEXIBLE AND

THE ADHESION ECOFRIENDLY PROCESS PLASTICS MULTI-APPLICATION
A primary coat using a This material is low cost Deposits are possible EOPROM® paste can be
metal loads based (copper based). The on POLYESTER / applied on flexible or
formulation provides process is fully additive, FIBERGLASS / FLAX / rigid substrates for a
exceptional adhesion with low environmental BASALT / POLYAMID … wide range of
strength on many impact and designed Fiberglass prepregs are applications :
substrates. The metal for mass production functionalized before - Heating circuit
reinforcement permits thermoforming - Sensors, PZE
a wide range of - Antenna
conductivity - Wiring
- Electronic circuit
- Components soldering

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