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  • Bounding HiTECH - IC - Eng

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    putut margandono
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    Bounding hitteck

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    Bounding HiTECH_IC_Eng

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    Bounding hitteck

    Copyright:

    © All Rights Reserved
    Download as PDF or read online from Scribd
    Flag for inappropriate content
    7 views1 page

    Bounding HiTECH - IC - Eng

    Uploaded by

    putut margandono
    Bounding hitteck

    Copyright:

    © All Rights Reserved
    Download as PDF or read online from Scribd
    Flag for inappropriate content
    of 1
    te Glue For I.C Exclusive Use TN Rn DM MeeVee tear Tate HT-160GSV HT-160GSV and HT-170C series are one eomponent, epoxy glues which cures on exposure 10 heat. Very strong adhesion and high viscosity of uncured glue make it suitable to hold QFP and SOP IC to the PCB board firmly and can replace high temperature soldering lead. These glues can arrange QFP and SOP IC, etc ina line with soldering machine in manual work HA ‘ special automation equipment. VEN i a eae Ye emi HiT Properties HT60G8v rA706 HT-170041 Test method npearance Black Paste Black Paste Black Paste’ HT Viscosity(Poise) | _ 20.000 ~ 25,000 20,000 ~ 30,000 15,000 ~ 20,000 HT-21 Thivotropie Index ‘amore than 55 ~ 65 55> 65 Ha Specific Gravity = 14 o-14 w= 14 Him Copper Plate Corrosion | z : Hee Moisture absorption(Wi36) io Insulation Resistance(0) Bixi0™ Dielectric Constant 40 40 HT=10-2 Tg-Poing 100°C more than | 100° more than | 100°C more than HT ‘Storage Conditions S100, =A0% S-16¢,

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